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JP6274079B2 - Pellicle support frame and manufacturing method - Google Patents

Pellicle support frame and manufacturing method Download PDF

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Publication number
JP6274079B2
JP6274079B2 JP2014224521A JP2014224521A JP6274079B2 JP 6274079 B2 JP6274079 B2 JP 6274079B2 JP 2014224521 A JP2014224521 A JP 2014224521A JP 2014224521 A JP2014224521 A JP 2014224521A JP 6274079 B2 JP6274079 B2 JP 6274079B2
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frame
support frame
pellicle
transparent substrate
hollow
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JP2016090784A (en
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伸幸 石戸
伸幸 石戸
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Nippon Light Metal Co Ltd
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Nippon Light Metal Co Ltd
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Priority to JP2014224521A priority Critical patent/JP6274079B2/en
Application filed by Nippon Light Metal Co Ltd filed Critical Nippon Light Metal Co Ltd
Priority to EP15856945.9A priority patent/EP3217221B1/en
Priority to KR1020177011500A priority patent/KR102389124B1/en
Priority to US15/524,234 priority patent/US10642151B2/en
Priority to PCT/JP2015/075550 priority patent/WO2016072149A1/en
Priority to CN201580058273.4A priority patent/CN107077062B/en
Priority to TW104132795A priority patent/TWI658322B/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

本発明は、ペリクル用支持枠および製造方法に関する。   The present invention relates to a pellicle support frame and a manufacturing method.

集積回路の製造工程の中には、フォトマスクやレティクルと呼ばれる透明基板に描かれた回路パターンを、ウエハ上に塗布したレジストに転写するフォトリソグラフィー工程が含まれている。   An integrated circuit manufacturing process includes a photolithography process in which a circuit pattern drawn on a transparent substrate called a photomask or a reticle is transferred to a resist applied on a wafer.

前記したフォトリソグラフィー工程において、透明基板に埃等の異物が付着していると、レジストに転写される回路パターンが不鮮明になることから、透明基板には、ペリクルと呼ばれる防塵カバーが被せられている（例えば、特許文献１または特許文献２参照）。   In the photolithography process described above, if a foreign substance such as dust adheres to the transparent substrate, the circuit pattern transferred to the resist becomes unclear, so the transparent substrate is covered with a dust-proof cover called a pellicle. (For example, refer to Patent Document 1 or Patent Document 2).

ペリクルは、透明基板に描かれた回路パターンの全体を囲う支持枠と、この支持枠の表面に覆設された透光性のペリクル膜と、を備えている。支持枠の裏面は透明基板に接着される。   The pellicle includes a support frame that encloses the entire circuit pattern drawn on the transparent substrate, and a translucent pellicle film that covers the surface of the support frame. The back surface of the support frame is bonded to the transparent substrate.

特開２００９−０２５５６２号公報JP 2009-025562 A 特開平９−０６８７９３号公報Japanese Patent Laid-Open No. 9-068793

前記した支持枠は、単体の状態で表裏方向に歪んでいる場合があるが、平坦な透明基板に接着するときに透明基板に押し付けられるため、支持枠は平坦な状態で透明基板に接着される。しかしながら、支持枠には元の歪んだ形状に戻ろうとする復元力が生じるので、復元力が大きい場合には、支持枠の変形に倣って透明基板にも歪みが生じてしまう。
そして、透明基板に歪みが生じると、透明基板の回路パターンをウエハ上のレジストに転写するときに、回路パターンが正規の位置からずれてしまうという問題がある。 Although the above-described support frame may be distorted in the front and back direction in a single state, it is pressed against the transparent substrate when bonding to a flat transparent substrate, so the support frame is bonded to the transparent substrate in a flat state. . However, since a restoring force is generated in the support frame to return to the original distorted shape, when the restoring force is large, the transparent substrate is also distorted following the deformation of the support frame.
When the transparent substrate is distorted, there is a problem that the circuit pattern is shifted from the normal position when the circuit pattern on the transparent substrate is transferred to the resist on the wafer.

本発明は、前記した問題を解決し、支持枠を透明基板に接着した後に支持枠および透明基板に歪みが生じるのを防ぐことができるペリクル用支持枠およびペリクル用支持枠の製造方法を提供することを課題とする。   The present invention provides a pellicle support frame and a method for manufacturing a pellicle support frame that can solve the problems described above and prevent distortion of the support frame and the transparent substrate after the support frame is bonded to the transparent substrate. This is the issue.

前記課題を解決するため、本発明のペリクル用支持枠は、アルミニウム合金製の枠体を備え、前記枠体の表面にペリクル膜が接着され、前記枠体の裏面に透明基板が接着される。前記枠体の内部には、複数の中空部が前記枠体の周方向に並設されており、隣り合う二つの前記中空部の間に、前記枠体の外周面から内周面に至る貫通孔が形成されている。   In order to solve the above problems, a pellicle support frame of the present invention includes an aluminum alloy frame, a pellicle film is bonded to the surface of the frame, and a transparent substrate is bonded to the back surface of the frame. Inside the frame body, a plurality of hollow portions are arranged in parallel in the circumferential direction of the frame body, and between the two adjacent hollow portions, the penetration from the outer peripheral surface of the frame body to the inner peripheral surface A hole is formed.

支持枠に中空部を形成すると、支持枠の剛性が小さくなる。これにより、支持枠を平坦な透明基板に接着した後に支持枠が元の歪んだ形状に戻ろうとする復元力が小さくなるため、支持枠を透明基板に倣って平坦な形状に保つことができる。   When the hollow portion is formed in the support frame, the support frame becomes less rigid. Accordingly, since the restoring force of the support frame returning to the original distorted shape after the support frame is bonded to the flat transparent substrate is reduced, the support frame can be maintained in a flat shape following the transparent substrate.

また、本発明では、支持枠の中空部が外部空間に通じていないため、中空部に塵や加工時の処理液などの異物が入るのを防ぐことができる。
また、枠体に貫通孔が形成されているため、支持枠にペリクル膜および透明基板に接着した後に、真空中において支持枠の内部空間と外部空間とに圧力差が生じるのを防ぐことができる。 In the present invention, since the hollow portion of the support frame does not communicate with the external space, it is possible to prevent foreign matters such as dust and processing liquid during processing from entering the hollow portion.
In addition, since the through hole is formed in the frame body, it is possible to prevent a pressure difference from being generated between the internal space and the external space of the support frame in a vacuum after being bonded to the pellicle film and the transparent substrate. .

前記したペリクル用支持枠において、二つの枠部材を接合して前記枠体を形成してもよい。この場合には、前記両枠部材の接合面の少なくとも一方に複数の凹溝を周方向に並設させ、前記凹溝によって前記中空部を形成するとよい。このようにすると、中空構造の支持枠を容易に製造することができる。   In the above-described pellicle support frame, the frame body may be formed by joining two frame members. In this case, it is preferable that a plurality of concave grooves are provided in parallel in the circumferential direction on at least one of the joint surfaces of the two frame members, and the hollow portion is formed by the concave grooves. If it does in this way, the support frame of a hollow structure can be manufactured easily.

前記課題を解決するため、本発明は、アルミニウム合金製の二つの枠部材からなるペリクル用支持枠の製造方法である。本発明は、前記両枠部材の接合面の少なくとも一方に凹溝を形成する段階と、前記両枠部材の接合面同士を接合し、前記凹溝によって中空部を形成する段階と、を備えている。   In order to solve the above problems, the present invention is a method for manufacturing a pellicle support frame comprising two frame members made of an aluminum alloy. The present invention includes a step of forming a concave groove on at least one of the joint surfaces of the two frame members, and a step of joining the joint surfaces of the two frame members to form a hollow portion by the concave groove. Yes.

前記したペリクル用支持枠の製造方法において、前記両枠部材を固相接合した場合には、二つの枠部材を精度良く接合するとともに、支持枠の強度低下を防ぐことができる。
なお、固相接合としては、拡散接合、集束イオンビーム（Focused Ion Beam）を用いた蒸着、摩擦攪拌接合（Friction Stir Welding）などの接合方法を用いることができる。 In the method for manufacturing a support frame for a pellicle, when both the frame members are solid-phase bonded, the two frame members can be bonded with high accuracy and the strength of the support frame can be prevented from being lowered.
As solid phase bonding, bonding methods such as diffusion bonding, vapor deposition using a focused ion beam, and friction stir welding can be used.

前記した製造方法によって、支持枠に中空部を形成すると、支持枠の剛性が小さくなる。これにより、支持枠を平坦な透明基板に接着した後に支持枠が元の歪んだ形状に戻ろうとする復元力が小さくなるため、支持枠を透明基板に倣って平坦な形状に保つことができる。
また、本発明の製造方法によって形成された支持枠は、中空部が外部空間に通じていないため、中空部に塵や加工時の処理液などの異物が入るのを防ぐことができる。
また、本発明の製造方法によれば、中空構造の支持枠を容易に製造することができる。 When the hollow portion is formed in the support frame by the manufacturing method described above, the rigidity of the support frame is reduced. Accordingly, since the restoring force of the support frame returning to the original distorted shape after the support frame is bonded to the flat transparent substrate is reduced, the support frame can be maintained in a flat shape following the transparent substrate.
In addition, since the support frame formed by the manufacturing method of the present invention does not communicate with the external space, foreign matter such as dust and processing liquid during processing can be prevented from entering the hollow part.
Moreover, according to the manufacturing method of this invention, the support frame of a hollow structure can be manufactured easily.

本発明のペリクル用支持枠および製造方法によれば、支持枠の剛性を小さくすることができるので、支持枠を平坦な透明基板に接着した後に、支持枠が元の歪んだ形状に戻ろうとする復元力が小さくなる。つまり、本発明によれば、支持枠および透明基板を平坦な状態に保つことできるため、透明基板の回路パターンをウエハ上のレジストに精度良く転写することができる。   According to the support frame for a pellicle and the manufacturing method of the present invention, the rigidity of the support frame can be reduced. Therefore, after the support frame is bonded to a flat transparent substrate, the support frame tries to return to the original distorted shape. The restoring force is reduced. That is, according to the present invention, since the support frame and the transparent substrate can be kept flat, the circuit pattern of the transparent substrate can be accurately transferred to the resist on the wafer.

本発明の実施形態のペリクルおよび透明基板を示した斜視図である。It is the perspective view which showed the pellicle and transparent substrate of embodiment of this invention. 本発明の実施形態のペリクルおよび透明基板を示した側断面図である。It is the sectional side view which showed the pellicle and transparent substrate of embodiment of this invention. 本発明の実施形態の支持枠を示した模式的な平面図である。It is the typical top view which showed the support frame of embodiment of this invention. （ａ）は本発明の実施形態の支持枠を示した模式的な側面図、（ｂ）はＡ−Ａ断面図、（ｃ）はＢ−Ｂ断面図である。(A) is the typical side view which showed the support frame of embodiment of this invention, (b) is AA sectional drawing, (c) is BB sectional drawing. 本発明の実施形態の二つの枠部材を示した図で、（ａ）は二つの枠部材を接合する前の状態の側断面図、（ｂ）は二つの枠部材を接合した状態の側断面図である。It is the figure which showed two frame members of embodiment of this invention, (a) is a sectional side view of the state before joining two frame members, (b) is the side cross section of the state which joined two frame members FIG. 本発明の他の実施形態の製造方法に用いられる平板を示した平面図である。It is the top view which showed the flat plate used for the manufacturing method of other embodiment of this invention. 本発明の他の実施形態の支持枠を示した図で、（ａ）は内外の枠部材を有する構成の側断面図、（ｂ）は裏側の枠部材のみに凹溝を形成した構成の側断面図である。It is the figure which showed the support frame of other embodiment of this invention, (a) is a sectional side view of the structure which has an inner and outer frame member, (b) is the side of the structure which formed the ditch | groove only in the frame member of the back side. It is sectional drawing.

本発明の実施形態について、適宜図面を参照しながら詳細に説明する。
なお、本実施形態の各図面では、支持枠の構成を分かり易く説明するために、支持枠の各部を適宜に模式的に示している。
以下の説明において、前後左右および表裏とは、支持枠を分かり易く説明するために設定したものであり、支持枠の構成を特定するものではない。 Embodiments of the present invention will be described in detail with reference to the drawings as appropriate.
In each drawing of the present embodiment, each part of the support frame is schematically shown as appropriate in order to easily explain the configuration of the support frame.
In the following description, front and rear, right and left, and front and back are set for easy understanding of the support frame, and do not specify the configuration of the support frame.

本実施形態の支持枠１Ａは、図１に示すように、ペリクルＰに用いられるものである。ペリクルＰは、透明基板Ｍ（フォトマスク）の表面Ｍａに塵等が付着するのを防ぐための防塵カバーである。
ペリクルＰは、透明基板Ｍに描かれた回路パターン（図示せず）の全体を囲う支持枠１Ａと、支持枠１Ａの表面に覆設されたペリクル膜２と、を備えている。 The support frame 1A of this embodiment is used for the pellicle P as shown in FIG. The pellicle P is a dustproof cover for preventing dust and the like from adhering to the surface Ma of the transparent substrate M (photomask).
The pellicle P includes a support frame 1A that surrounds the entire circuit pattern (not shown) drawn on the transparent substrate M, and a pellicle film 2 that covers the surface of the support frame 1A.

支持枠１Ａは、平面視で長方形の枠体１０を有している。枠体１０は、前後一対の横枠部１１，１１と、左右一対の縦枠部１２，１２と、によって構成されている。
両横枠部１１，１１は、枠体１０の長辺となる部分であり、両縦枠部１２，１２は、枠体１０の短辺となる部分である。
横枠部１１および縦枠部１２の軸断面は、図２に示すように、幅寸法よりも高さ寸法が大きい長方形に形成されている。 The support frame 1A has a rectangular frame 10 in plan view. The frame 10 includes a pair of front and rear horizontal frame portions 11 and 11 and a pair of left and right vertical frame portions 12 and 12.
Both horizontal frame portions 11 and 11 are portions that are long sides of the frame body 10, and both vertical frame portions 12 and 12 are portions that are short sides of the frame body 10.
As shown in FIG. 2, the axial cross sections of the horizontal frame portion 11 and the vertical frame portion 12 are formed in a rectangle having a height dimension larger than the width dimension.

ペリクル膜２は、図１に示すように、透光性を有する薄い膜であり、例えば、紫外線の透過性に優れたニトロセルロース、酢酸セルロース、プロピオン酸セルロースなどのセルロース系ポリマーや、非晶質フッ素系ポリマーなどを用いて形成されている。   As shown in FIG. 1, the pellicle film 2 is a thin film having translucency, for example, a cellulose polymer such as nitrocellulose, cellulose acetate, and cellulose propionate that is excellent in ultraviolet transmittance, and amorphous It is formed using a fluorine polymer or the like.

ペリクル膜２は、平面視で長方形に形成されており、支持枠１Ａの外形と同じ形状となっている。
ペリクル膜２を枠体１０の表面１０ａに重ねたときには、ペリクル膜２によって枠体１０の表面１０ａ全体が覆われる。 The pellicle film 2 is formed in a rectangular shape in plan view, and has the same shape as the outer shape of the support frame 1A.
When the pellicle film 2 is overlaid on the surface 10 a of the frame body 10, the entire surface 10 a of the frame body 10 is covered with the pellicle film 2.

枠体１０は、表側の枠部材３０と裏側の枠部材４０とを接合した部材である。両枠部材３０，４０は、アルミニウム合金製の押出材を加工して得られたものである。
両枠部材３０，４０は同一形状の部材であり、両枠部材３０，４０は表裏逆向きに配置されている。そして、表側の枠部材３０の裏面３０ａと裏側の枠部材４０の表面４０ａとが接合されている。 The frame 10 is a member obtained by joining the front-side frame member 30 and the back-side frame member 40. Both frame members 30 and 40 are obtained by processing an extruded material made of aluminum alloy.
Both the frame members 30 and 40 are members having the same shape, and the both frame members 30 and 40 are arranged in opposite directions. And the back surface 30a of the frame member 30 of the front side and the surface 40a of the frame member 40 of the back side are joined.

図３に示すように、枠体１０には、貫通孔２０と、複数の中空部５１〜５３と、複数の治具穴６０と、が形成されている。   As shown in FIG. 3, the frame 10 is formed with a through hole 20, a plurality of hollow portions 51 to 53, and a plurality of jig holes 60.

貫通孔２０は、図４（ｃ）に示すように、枠体１０の外周面１０ｃから内周面１０ｄに貫通している円筒状の孔である。貫通孔２０は、枠体１０の高さ方向の中央に配置されている。
なお、本実施形態では、図３に示すように、前側の横枠部１１の左右方向の中央に貫通孔２０が形成されているが、貫通孔２０の配置は限定されるものではなく、例えば、後側の横枠部１１や左右の縦枠部１２，１２に形成してもよい。さらに、貫通孔２０の数も限定されるものではなく、例えば、横枠部１１と縦枠部１２とに貫通孔２０を一つずつ形成してもよく、または、前後の横枠部１１，１１の両方または左右の縦枠部１２，１２の両方に貫通孔２０を形成してもよい。 As shown in FIG. 4C, the through hole 20 is a cylindrical hole that penetrates from the outer peripheral surface 10 c of the frame body 10 to the inner peripheral surface 10 d. The through hole 20 is arranged at the center of the frame body 10 in the height direction.
In the present embodiment, as shown in FIG. 3, the through hole 20 is formed in the center in the left-right direction of the front horizontal frame portion 11, but the arrangement of the through holes 20 is not limited, for example, Alternatively, it may be formed on the rear horizontal frame portion 11 or the left and right vertical frame portions 12 and 12. Further, the number of through holes 20 is not limited, and for example, one through hole 20 may be formed in each of the horizontal frame portion 11 and the vertical frame portion 12, or the front and rear horizontal frame portions 11, 11 or both the left and right vertical frame portions 12 and 12 may be formed with through holes 20.

治具穴６０は、枠体１０の外周面１０ｃに形成された有底円筒状の穴である。治具穴６０は、支持枠１Ａの製造時やペリクル（図１参照）の使用時に治具によって支持枠１Ａを保持するための部位である。治具穴６０には治具のピンが挿入される。
なお、本実施形態では、図４（ａ）に示すように、枠体１０の高さ方向の中央に治具穴６０が配置されているが、治具穴６０の高さは限定されるものではなく、使用する治具に応じて治具穴６０の高さが設定される。
治具穴６０は、図３に示すように、前側の横枠部１１の左右両端部の近くに形成されるとともに、後側の横枠部１１の左右両端部の近くに形成されている。すなわち、枠体１０の前後の横枠部１１，１１には、それぞれ左右二つの治具穴６０が形成されている。 The jig hole 60 is a bottomed cylindrical hole formed in the outer peripheral surface 10 c of the frame body 10. The jig hole 60 is a part for holding the support frame 1A by the jig when the support frame 1A is manufactured or when the pellicle (see FIG. 1) is used. A jig pin is inserted into the jig hole 60.
In this embodiment, as shown in FIG. 4A, the jig hole 60 is arranged at the center in the height direction of the frame body 10, but the height of the jig hole 60 is limited. Instead, the height of the jig hole 60 is set according to the jig to be used.
As shown in FIG. 3, the jig hole 60 is formed near the left and right end portions of the front side horizontal frame portion 11, and is formed near the left and right end portions of the rear side horizontal frame portion 11. That is, left and right jig holes 60 are formed in the front and rear horizontal frame portions 11, 11 of the frame body 10.

枠体１０の内部には、十二個の中空部５１〜５３が枠体１０の周方向に並設されている。各中空部５１〜５３は、軸断面が長方形の密閉空間である（図４（ｂ）参照）。   Inside the frame body 10, twelve hollow portions 51 to 53 are juxtaposed in the circumferential direction of the frame body 10. Each of the hollow portions 51 to 53 is a sealed space having a rectangular axial cross section (see FIG. 4B).

前側の横枠部１１には、左右二つの第一中空部５１，５１と、左右二つの第二中空部５２，５２と、が形成されている。第一中空部５１および第二中空部５２は、いずれも横枠部１１の長手方向（図３の左右方向）に直線状に延びている。   The front horizontal frame portion 11 is formed with two left and right first hollow portions 51 and 51 and two left and right second hollow portions 52 and 52. Both the first hollow portion 51 and the second hollow portion 52 extend linearly in the longitudinal direction of the horizontal frame portion 11 (the left-right direction in FIG. 3).

左右の第一中空部５１，５１は、前側の横枠部１１の長手方向の中央を挟んで配置されている。   The left and right first hollow portions 51, 51 are arranged with the center in the longitudinal direction of the front horizontal frame portion 11 interposed therebetween.

第一中空部５１の軸断面は、図４（ｂ）に示すように、幅寸法よりも高さ寸法が大きい長方形に形成されている。第一中空部５１は、横枠部１１の短手方向（図３の前後方向）の中央かつ表裏方向の中央に配置されている。
なお、横枠部１１において第一中空部５１を囲む部位は、表面部および裏面部の肉厚ｔ１よりも左壁部および右壁部の肉厚ｔ２が大きく形成されている。 As shown in FIG. 4B, the axial cross section of the first hollow portion 51 is formed in a rectangle having a height dimension larger than the width dimension. The first hollow portion 51 is disposed at the center in the lateral direction (front-rear direction in FIG. 3) and the center in the front and back direction of the horizontal frame portion 11.
Note that the portion surrounding the first hollow portion 51 in the horizontal frame portion 11 is formed such that the thickness t2 of the left wall portion and the right wall portion is larger than the thickness t1 of the front surface portion and the back surface portion.

第一中空部５１の表側の半分は、表側の枠部材３０の裏面３０ａに形成された凹溝３１によって形成されている。また、第一中空部５１の裏側の半分は、裏側の枠部材４０の表面４０ａに形成された凹溝４１によって形成されている。このように、両枠部材３０，４０の接合面に形成された凹溝３１，４１を合わせることで、第一中空部５１が形成されている。   A front half of the first hollow portion 51 is formed by a groove 31 formed in the back surface 30 a of the front frame member 30. Further, the back half of the first hollow portion 51 is formed by a concave groove 41 formed on the surface 40 a of the frame member 40 on the back side. Thus, the 1st hollow part 51 is formed by match | combining the concave grooves 31 and 41 formed in the joint surface of both the frame members 30 and 40. As shown in FIG.

左右の第二中空部５２，５２は、図３に示すように、二つの第一中空部５１，５１を挟んで左右両側に配置されている。両第二中空部５２，５２は、横枠部１１の長手方向の両端部に配置されている。第二中空部５２の長手方向の長さは、第一中空部５１の長手方向の長さよりも小さく形成されている。
隣り合う第一中空部５１と第二中空部５２との間には、治具穴６０が配置されている（図４（ａ）参照）。 As shown in FIG. 3, the left and right second hollow portions 52 and 52 are arranged on both the left and right sides with the two first hollow portions 51 and 51 interposed therebetween. Both the second hollow portions 52 and 52 are disposed at both ends in the longitudinal direction of the horizontal frame portion 11. The length of the second hollow portion 52 in the longitudinal direction is formed to be smaller than the length of the first hollow portion 51 in the longitudinal direction.
A jig hole 60 is disposed between the adjacent first hollow portion 51 and second hollow portion 52 (see FIG. 4A).

第二中空部５２の軸断面は、第一中空部５１の軸断面（図４（ｂ）参照）と同一形状である。また、図４（ａ）に示すように、第二中空部５２は、第一中空部５１と同様に、表裏の枠部材３０，４０の接合面に形成された凹溝３１，４１によって形成されている。   The axial cross section of the second hollow portion 52 has the same shape as the axial cross section of the first hollow portion 51 (see FIG. 4B). Further, as shown in FIG. 4A, the second hollow portion 52 is formed by the concave grooves 31 and 41 formed on the joining surfaces of the front and back frame members 30 and 40, similarly to the first hollow portion 51. ing.

後側の横枠部１１には、図３に示すように、前側の横枠部１１と同様に、左右二つの第一中空部５１，５１と、左右二つの第二中空部５２，５２と、が形成されている。
また、後側の横枠部１１には、隣り合う第一中空部５１と第二中空部５２との間に治具穴６０が配置されている。 As shown in FIG. 3, the rear horizontal frame portion 11 has two left and right first hollow portions 51 and 51 and two left and right second hollow portions 52 and 52, as in the front horizontal frame portion 11. , Is formed.
Further, a jig hole 60 is disposed between the first hollow portion 51 and the second hollow portion 52 adjacent to each other in the rear lateral frame portion 11.

左側の縦枠部１２には、前後二つの第三中空部５３，５３が形成されている。第三中空部５３は、縦枠部１２の長手方向（図３の前後方向）に直線状に延びている。
前後の第三中空部５３，５３は、左側の縦枠部１２の長手方向の中央を挟んで配置されている。 The left vertical frame portion 12 is formed with two front and rear third hollow portions 53 and 53. The third hollow portion 53 extends linearly in the longitudinal direction of the vertical frame portion 12 (the front-rear direction in FIG. 3).
The front and rear third hollow portions 53 and 53 are arranged with the center in the longitudinal direction of the left vertical frame portion 12 interposed therebetween.

第三中空部５３の軸断面は、第一中空部５１の軸断面（図４（ｂ）参照）と同一形状である。また、図４（ａ）に示すように、第三中空部５３は、第一中空部５１と同様に、表裏の枠部材３０，４０の接合面に形成された凹溝３１，４１によって形成されている。   The axial cross section of the third hollow portion 53 has the same shape as the axial cross section of the first hollow portion 51 (see FIG. 4B). Further, as shown in FIG. 4A, the third hollow portion 53 is formed by the concave grooves 31 and 41 formed on the joint surfaces of the front and back frame members 30 and 40, similarly to the first hollow portion 51. ing.

右側の縦枠部１２には、図３に示すように、左側の縦枠部１２と同様に、前後二つの第三中空部５３，５３が形成されている。   As shown in FIG. 3, the right vertical frame portion 12 has two front and rear third hollow portions 53, 53 as in the left vertical frame portion 12.

次に、前記した支持枠１Ａの製造方法について説明する。
まず、角筒状のアルミニウム合金製の押出材を軸方向に直交する方向で切断して、図５（ａ）に示すように、二つの枠部材３０，４０を用意する。
続いて、表側の枠部材３０の裏面３０ａに凹溝３１を形成するとともに、裏側の枠部材４０の表面４０ａに凹溝４１を形成する。 Next, a method for manufacturing the above-described support frame 1A will be described.
First, a rectangular tubular aluminum alloy extruded material is cut in a direction orthogonal to the axial direction, and two frame members 30 and 40 are prepared as shown in FIG.
Subsequently, the groove 31 is formed on the back surface 30 a of the front frame member 30, and the groove 41 is formed on the front surface 40 a of the back frame member 40.

図５（ｂ）に示すように、表側の枠部材３０と裏側の枠部材４０とを表裏に重ね合わせる。つまり、表側の枠部材３０の凹溝３１と裏側の枠部材４０の凹溝４１とが向かい合うように両枠部材３０，４０を重ね合わせる。
その後、表側の枠部材３０の裏面３０ａと裏側の枠部材４０の表面４０ａとを接合する。これにより、二つの枠部材３０，４０からなる枠体１０が形成される。 As shown in FIG. 5B, the front-side frame member 30 and the back-side frame member 40 are overlapped on the front and back. That is, the two frame members 30 and 40 are overlapped so that the concave groove 31 of the front frame member 30 and the concave groove 41 of the rear frame member 40 face each other.
Then, the back surface 30a of the front-side frame member 30 and the front surface 40a of the back-side frame member 40 are joined. Thereby, the frame 10 which consists of the two frame members 30 and 40 is formed.

本実施形態では、両枠部材３０，４０の接合面同士を固相接合している。固相接合としては、拡散接合、集束イオンビーム（Focused Ion Beam）を用いた蒸着、摩擦攪拌接合（Friction Stir Welding）などの接合方法を用いることができる。   In this embodiment, the joint surfaces of both frame members 30 and 40 are solid-phase joined. As the solid phase bonding, a bonding method such as diffusion bonding, vapor deposition using a focused ion beam, or friction stir welding can be used.

両枠部材３０，４０を接合することで、両枠部材３０，４０の凹溝３１，４１が重ね合わされ、表裏の凹溝３１，４１によって各中空部５１〜５３（図３参照）が形成される。   By joining both the frame members 30 and 40, the concave grooves 31 and 41 of both the frame members 30 and 40 are overlapped, and the hollow portions 51 to 53 (see FIG. 3) are formed by the concave grooves 31 and 41 on the front and back sides. The

続いて、図３に示すように、前側の横枠部１１において、隣り合う第一中空部５１，５１の間に貫通孔２０を形成する。
また、前後の横枠部１１，１１において、隣り合う第一中空部５１と第二中空部５２との間に治具穴６０を形成する。
これにより、図４（ａ）に示すように、表裏二つの枠部材３０，４０からなる枠体１０を備えた支持枠１Ａが形成される。
なお、両枠部材３０，４０を接合する前に、両枠部材３０，４０の接合面に貫通孔２０および治具穴６０を形成してもよい。 Subsequently, as shown in FIG. 3, the through hole 20 is formed between the adjacent first hollow portions 51, 51 in the front lateral frame portion 11.
Further, a jig hole 60 is formed between the adjacent first hollow portion 51 and the second hollow portion 52 in the front and rear horizontal frame portions 11 and 11.
Thereby, as shown to Fig.4 (a), 1 A of support frames provided with the frame 10 which consists of front and back two frame members 30 and 40 are formed.
Note that the through hole 20 and the jig hole 60 may be formed on the joint surfaces of the both frame members 30 and 40 before the both frame members 30 and 40 are joined.

次に、図２に示すように、支持枠１Ａにペリクル膜２および透明基板Ｍを接着するときには、まず、枠体１０の表面１０ａにアクリル樹脂やエポキシ樹脂などの接着剤を塗布して、枠体１０の表面１０ａ上に接着層４ａを形成する。
そして、表側の接着層４ａにペリクル膜２を重ねることで、ペリクル膜２が接着層４ａを介して枠体１０の表面１０ａに接着される。 Next, as shown in FIG. 2, when the pellicle film 2 and the transparent substrate M are bonded to the support frame 1A, first, an adhesive such as acrylic resin or epoxy resin is applied to the surface 10a of the frame 10, An adhesive layer 4 a is formed on the surface 10 a of the body 10.
Then, by overlapping the pellicle film 2 on the front-side adhesive layer 4a, the pellicle film 2 is bonded to the surface 10a of the frame body 10 via the adhesive layer 4a.

続いて、枠体１０の裏面１０ｂにポリブテン樹脂、ポリ酢酸ビニル樹脂、アクリル樹脂などの粘着層４ｂを形成する。
そして、裏側の粘着層４ｂに透明基板Ｍの表面Ｍａを重ねて、支持枠１Ａを透明基板Ｍに押し付けることで、支持枠１Ａが粘着層４ｂを介して透明基板Ｍの表面Ｍａに接着される。 Subsequently, an adhesive layer 4b made of polybutene resin, polyvinyl acetate resin, acrylic resin, or the like is formed on the back surface 10b of the frame 10.
Then, the surface Ma of the transparent substrate M is overlapped on the adhesive layer 4b on the back side, and the support frame 1A is pressed against the transparent substrate M, whereby the support frame 1A is bonded to the surface Ma of the transparent substrate M via the adhesive layer 4b. .

以上のような支持枠１Ａでは、図３に示すように、枠体１０に複数の中空部５１〜５３を形成されている。このように、支持枠１Ａを中空構造にすると、枠体１０の断面二次モーメントが小さくなり、支持枠１Ａの剛性が小さくなる。
これにより、図２に示すように、支持枠１Ａを平坦な透明基板Ｍに接着した後に、支持枠１Ａが元の歪んだ形状に戻ろうとする復元力が小さくなるため、支持枠１Ａを透明基板Ｍに倣って平坦な形状に保つことができる。
このように、支持枠１Ａおよび透明基板Ｍを平坦な状態に保つことできるため、透明基板Ｍの回路パターンをウエハ上のレジストに精度良く転写することができる。 In the support frame 1A as described above, a plurality of hollow portions 51 to 53 are formed in the frame body 10 as shown in FIG. Thus, when the support frame 1A has a hollow structure, the cross-sectional secondary moment of the frame 10 is reduced, and the rigidity of the support frame 1A is reduced.
Accordingly, as shown in FIG. 2, after the support frame 1A is bonded to the flat transparent substrate M, the restoring force for the support frame 1A to return to the original distorted shape is reduced. A flat shape can be maintained following M.
Thus, since the support frame 1A and the transparent substrate M can be kept flat, the circuit pattern of the transparent substrate M can be accurately transferred to the resist on the wafer.

また、支持枠１Ａでは、図３に示すように、各中空部５１〜５３が外部空間に通じていないため、各中空部５１〜５３に塵や加工時の処理液などの異物が入るのを防ぐことができる。   Further, in the support frame 1A, as shown in FIG. 3, since the hollow portions 51 to 53 do not communicate with the external space, foreign matters such as dust and processing liquid during processing enter the hollow portions 51 to 53. Can be prevented.

また、支持枠１Ａでは、枠体１０に貫通孔２０が形成されているため、支持枠１Ａにペリクル膜２および透明基板Ｍ（図２参照）を接着した後に、真空中において支持枠１Ａの内部空間と外部空間とに圧力差が生じるのを防ぐことができる。   Further, in the support frame 1A, since the through hole 20 is formed in the frame body 10, after the pellicle film 2 and the transparent substrate M (see FIG. 2) are bonded to the support frame 1A, the inside of the support frame 1A is vacuumed. It is possible to prevent a pressure difference between the space and the external space.

本実施形態の製造方法では、図４（ａ）に示すように、二つの枠部材３０，４０の接合面同士を接合することで、前記した中空構造の支持枠１Ａを容易に製造することができる。そして、両枠部材３０，４０を固相接合することで、両枠部材３０，４０を精度良く接合するとともに、支持枠１Ａの強度低下を防ぐことができる。   In the manufacturing method of this embodiment, as shown to Fig.4 (a), the above-mentioned support frame 1A of a hollow structure can be manufactured easily by joining the joining surfaces of the two frame members 30 and 40. FIG. it can. And by joining both the frame members 30 and 40 to a solid phase, both the frame members 30 and 40 can be joined with high accuracy and the strength of the support frame 1A can be prevented from being lowered.

以上、本発明の実施形態について説明したが、本発明は前記実施形態に限定されることなく、その趣旨を逸脱しない範囲で適宜に変更が可能である。
例えば、本実施形態では、角筒状の押出材から枠部材３０，４０（図５（ａ）参照）を切り出しているが、図６に示すように、一枚のアルミニウム合金製の平板５から枠部材３０，４０を形成してもよい。
この構成では、二枚の平板５，５を中抜き加工して二つの枠部材３０，４０を形成し、両枠部材３０，４０に凹溝３１，４１を形成した後に、両枠部材３０，４０を接合する。
図６に示す平板５の対角線上の一対の角部には位置決め孔７０，７０が形成されている。二つの枠部材３０，４０を接合するときには、両枠部材３０，４０の位置決め孔７０を合わせることで、両枠部材３０，４０を精度良く接合することができる。なお、位置決め孔７０は、枠体１０の外周部を切削加工するときに、切削される部位に形成されている。 The embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the spirit of the present invention.
For example, in the present embodiment, the frame members 30 and 40 (see FIG. 5A) are cut out from a rectangular tube-shaped extruded material, but as shown in FIG. The frame members 30 and 40 may be formed.
In this configuration, the two flat plates 5 and 5 are hollowed out to form the two frame members 30 and 40, and the concave grooves 31 and 41 are formed in both the frame members 30 and 40. 40 is joined.
Positioning holes 70 are formed in a pair of corners on the diagonal line of the flat plate 5 shown in FIG. When joining the two frame members 30 and 40, the frame members 30 and 40 can be joined with high accuracy by matching the positioning holes 70 of the both frame members 30 and 40. The positioning hole 70 is formed in a portion to be cut when the outer peripheral portion of the frame body 10 is cut.

本実施形態では、図５（ａ）に示すように、二つの枠部材３０，４０を固相接合しているが、その接合方法は限定されるものではなく、例えば、両枠部材３０，４０をアーク溶接や抵抗溶接などの溶接方法によって接合してもよい。   In the present embodiment, as shown in FIG. 5A, the two frame members 30 and 40 are solid-phase bonded, but the bonding method is not limited. For example, both the frame members 30 and 40 are connected. May be joined by a welding method such as arc welding or resistance welding.

本実施形態では、図４（ａ）に示すように、二つの枠部材３０，４０を接合することで中空構造の支持枠１Ａが形成されているが、積層造形法による物体の造形が可能な３Ｄプリンタなどの装置によって、アルミニウム合金製の支持枠を成形してもよい。この構成では、支持枠の枠体が一つの部材として構成される。   In this embodiment, as shown in FIG. 4A, the support frame 1 </ b> A having a hollow structure is formed by joining two frame members 30 and 40, but an object can be modeled by the layered modeling method. The support frame made of aluminum alloy may be formed by an apparatus such as a 3D printer. In this configuration, the frame body of the support frame is configured as one member.

本実施形態では、表裏の枠部材３０，４０が接合されているが、図７（ａ）に示す支持枠１Ｂのように、外側の枠部材４５の内部に内側の枠部材３５を配置し、内側の枠部材３５の外周面と外側の枠部材４５の内周面とを接合してもよい。この構成では、支持枠１Ｂの内周面および外周面に接合部が露出しない構造となる。
また、支持枠１Ｂでは、内側の枠部材３５の外周面に凹溝３１を形成するとともに、外側の枠部材４５の内周面に凹溝４１を形成されており、内外の枠部材３５，４５の凹溝３１，４１によって中空部５０が形成されている。 In this embodiment, the front and back frame members 30 and 40 are joined, but the inner frame member 35 is arranged inside the outer frame member 45 as in the support frame 1B shown in FIG. The outer peripheral surface of the inner frame member 35 and the inner peripheral surface of the outer frame member 45 may be joined. In this configuration, the joint portion is not exposed on the inner and outer peripheral surfaces of the support frame 1B.
Further, in the support frame 1B, the concave groove 31 is formed on the outer peripheral surface of the inner frame member 35, and the concave groove 41 is formed on the inner peripheral surface of the outer frame member 45, so that the inner and outer frame members 35, 45 are formed. The hollow portion 50 is formed by the concave grooves 31 and 41.

本実施形態では、図２に示すように、二つの枠部材３０，４０の両方に凹溝３１，４１が形成されているが、図７（ｂ）に示す支持枠１Ｃのように、裏側の枠部材４０の表面４０ａのみに凹溝４１を形成してもよい。
この構成では、裏側の枠部材４０の凹溝４１が表側の枠部材３０によって塞がれることで中空部５０が形成されている。
なお、表側の枠部材３０の裏面３０ａのみに凹溝を形成し、表側の枠部材３０の凹溝を裏側の枠部材４０によって塞ぐことで中空部５０を形成してもよい。 In this embodiment, as shown in FIG. 2, the concave grooves 31, 41 are formed in both of the two frame members 30, 40. However, like the support frame 1C shown in FIG. The groove 41 may be formed only on the surface 40 a of the frame member 40.
In this configuration, the hollow portion 50 is formed by closing the concave groove 41 of the frame member 40 on the back side with the frame member 30 on the front side.
The hollow portion 50 may be formed by forming a concave groove only on the back surface 30 a of the front-side frame member 30 and closing the concave groove of the front-side frame member 30 with the rear-side frame member 40.

本実施形態では、図３に示すように、枠体１０に複数の中空部５１〜５３が形成されているが、その数および配置は限定されるものではない。例えば、枠体１０の角部に屈曲した中空部を形成してもよい。
また、本実施形態では、図４（ｂ）に示すように、各中空部５１〜５３（図３参照）の軸断面が長方形に形成されているが、その形状は限定されるものではない。 In this embodiment, as shown in FIG. 3, although the some hollow part 51-53 is formed in the frame 10, the number and arrangement | positioning are not limited. For example, you may form the hollow part bent in the corner | angular part of the frame 10. FIG.
Moreover, in this embodiment, as shown in FIG.4 (b), although the axial cross section of each hollow part 51-53 (refer FIG. 3) is formed in the rectangle, the shape is not limited.

また、本実施形態では、図４（ｂ）に示すように、表側の枠部材３０の軸断面と裏側の枠部材４０の軸断面とが同一形状に形成されているが、両枠部材３０，４０の軸断面の高さが異なっていてもよい。
また、本実施形態の枠体１０の軸断面は長方形に形成されているが、その形状は限定されるものではなく、例えば、枠体１０の軸断面が正方形でもよい。 In the present embodiment, as shown in FIG. 4B, the axial cross section of the front frame member 30 and the axial cross section of the back frame member 40 are formed in the same shape. The height of the 40 axial cross sections may be different.
Moreover, although the axial cross section of the frame 10 of this embodiment is formed in the rectangle, the shape is not limited, For example, the axial cross section of the frame 10 may be square.

１Ａ 支持枠
２ ペリクル膜
４ａ 接着層
４ｂ 粘着層
５ 平板
１０ 枠体
１１ 横枠部
１２ 縦枠部
２０ 貫通孔
３０ 表側の枠部材
３０ａ 裏面
３１ 凹溝
４０ 裏側の枠部材
４０ａ 表面
４１ 凹溝
５１ 第一中空部
５２ 第二中空部
５３ 第三中空部
６０ 治具穴
Ｍ 透明基板
Ｐ ペリクル DESCRIPTION OF SYMBOLS 1A Support frame 2 Pellicle film 4a Adhesive layer 4b Adhesive layer 5 Flat plate 10 Frame body 11 Horizontal frame part 12 Vertical frame part 20 Through-hole 30 Front side frame member 30a Back surface 31 Concave groove 40 Back side frame member 40a Surface 41 Concave groove 51 1st One hollow portion 52 Second hollow portion 53 Third hollow portion 60 Jig hole M Transparent substrate P Pellicle

Claims (4)

アルミニウム合金製の枠体を備え、
前記枠体の表面にペリクル膜が接着され、前記枠体の裏面に透明基板が接着されるペリクル用支持枠であって、
前記枠体の内部には、複数の中空部が前記枠体の周方向に並設されており、
隣り合う二つの前記中空部の間に、前記枠体の外周面から内周面に至る貫通孔が形成されていることを特徴とするペリクル用支持枠。 With a frame made of aluminum alloy,
A pellicle support frame in which a pellicle film is bonded to the front surface of the frame body, and a transparent substrate is bonded to the back surface of the frame body,
Inside the frame, a plurality of hollow portions are arranged in the circumferential direction of the frame,
A support frame for a pellicle, wherein a through-hole extending from the outer peripheral surface of the frame body to the inner peripheral surface is formed between two adjacent hollow portions. 前記枠体は、二つの枠部材を接合して形成されており、
前記両枠部材の接合面の少なくとも一方に複数の凹溝が周方向に並設され、
前記凹溝によって前記中空部が形成されていることを特徴とする請求項１に記載のペリクル用支持枠。 The frame body is formed by joining two frame members,
A plurality of concave grooves are juxtaposed in the circumferential direction on at least one of the joint surfaces of the two frame members,
The pellicle support frame according to claim 1, wherein the hollow portion is formed by the concave groove. アルミニウム合金製の二つの枠部材からなるペリクル用支持枠の製造方法であって、
前記両枠部材の接合面の少なくとも一方に凹溝を形成する段階と、
前記両枠部材の接合面同士を接合し、前記凹溝によって中空部を形成する段階と、
を備えていることを特徴とするペリクル用支持枠の製造方法。 A method for producing a support frame for a pellicle comprising two frame members made of an aluminum alloy,
Forming a groove in at least one of the joint surfaces of the two frame members;
Joining the joining surfaces of the two frame members, and forming a hollow portion by the concave groove;
A method for manufacturing a support frame for a pellicle, comprising: 前記両枠部材を固相接合することを特徴とする請求項３に記載のペリクル用支持枠の製造方法。   The method for producing a support frame for a pellicle according to claim 3, wherein the both frame members are solid-phase bonded.
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