JP6265227B2 - Light distribution member manufacturing method, light emitting device manufacturing method, light distribution member, and light emitting device - Google Patents

Description

  The present invention relates to a method for manufacturing a light distribution member, a method for manufacturing a light emitting device, a light distribution member, and a light emitting device.

  In recent years, a light emitting device including a plurality of light emitting elements such as light emitting diodes is used as a light source used for a vehicle headlight. In such a light emitting device used for a vehicle headlight, a plurality of light emitting elements are arranged on a substrate, and a wavelength conversion member containing a phosphor is disposed on the light emitting elements. However, in such a light-emitting device, when controlling lighting of a plurality of light-emitting elements independently, if there is a non-lighting light-emitting element adjacent to the lighted light-emitting element, the wavelength conversion member provided on the light-emitting element that is lit Light leaks from the light source, and a phenomenon occurs in which the wavelength conversion member provided in the non-light emitting element emits a small amount of light.

  Therefore, in order to prevent such light leakage, a method of coating the outer periphery of one wavelength conversion member with a white ceramic frame (for example, Patent Document 1), titanium dioxide between adjacent wavelength conversion members A method of disposing a reflective resin containing etc. has been proposed (for example, Patent Documents 1 to 4).

JP 2012-134355 A Special table 2012-527742 gazette WO2012 / 66881 JP 2012-119407 A

However, in order to form the reflective resin, a certain amount of space is required between the wavelength conversion members. Such a space causes the boundary between the light emitting elements to darken when adjacent light emitting elements emit light simultaneously.
Further, when a light-shielding film made of a metal film or a dielectric multilayer film is formed on the side surface of the plate-like wavelength conversion member, if the side surface is uneven, a light-shielding or reflecting effect cannot be obtained sufficiently. Furthermore, film formation on the side surface of the metal film or dielectric multilayer film is not easy to control the film thickness, and uniform film formation on the side surface is difficult.
Accordingly, there is a need for a method for manufacturing a light-emitting device that can easily and easily manufacture a light-emitting device to which a function according to the number and arrangement of light-emitting elements and the usage pattern is added.

  Embodiments according to the present invention have been made in view of the above problems, and a light distribution member capable of preventing light leakage between light-transmitting pieces provided in light-emitting and non-light-emitting elements without reducing light emission efficiency, and An object of the present invention is to provide a method for manufacturing the light distribution member and a light emitting device.

This application includes the following disclosure.
[1] preparing a joined body in which a plurality of light-transmitting plates are joined via a light shielding portion;
As seen from one direction, a light-shielding frame is fixed to the joined body so as to surround the outer periphery of the joined body,
A plurality of light distribution members each having a plurality of translucent pieces are obtained by cutting the joined body and the light shielding frame body perpendicularly to a surface of the joined body on which the light shielding frame body is fixed. A method for producing a light distribution member.
[2] A light distribution member is manufactured by the above method,
A method for manufacturing a light-emitting device, including a step of separately providing a plurality of light-emitting elements so that light from one light-emitting element is incident on one or more light-transmitting pieces.
[3] a joined body in which a plurality of light-transmitting pieces are joined together through a light shielding portion;
And a light-shielding frame provided so as to surround the outer periphery of the joined body as viewed from one direction.
[4] The light distribution member,
A plurality of light emitting elements arranged on one side of a pair of main surfaces in which the light shielding frame in the light distribution member is not provided;
The light shielding frame is made of a different material, and includes a reflective member provided so as to be in contact with the light shielding portion between the light emitting elements,
The light distribution device and the light emitting element are arranged such that light from one light emitting element is incident on one or more light transmitting pieces.

  According to the method for manufacturing a light distribution member and a light emitting device according to an embodiment of the present invention, the light distribution member includes a highly reliable light distribution member, and does not decrease the light emission efficiency. Thus, a high-luminance light-emitting device can be manufactured with high accuracy, simply, and easily. Moreover, according to the light distribution member and light-emitting device which concern on one Embodiment of this invention, it can be set as a high-intensity light-emitting device.

1A to 1F are manufacturing process diagrams showing an embodiment of a method for manufacturing a light distribution member of the present invention. 2A and 2B are manufacturing process diagrams showing an embodiment of a manufacturing process of a light emitting device using the light distribution member obtained by the manufacturing method of FIG. 3A to 3G are manufacturing process diagrams showing another embodiment of the method for manufacturing a light distribution member of the present invention. 4A and 4B are manufacturing process diagrams showing an embodiment of a manufacturing process of a light emitting device using the light distribution member obtained by the manufacturing method of FIG. 5A to 5G are manufacturing process diagrams showing still another embodiment of the method for manufacturing a light distribution member of the present invention. It is a manufacturing-process figure which shows one Embodiment of the manufacturing process of the light-emitting device using the light distribution member obtained with the manufacturing method of FIG. It is a top view of the light-emitting device obtained by another embodiment of the manufacturing method of the light-emitting device of this invention. FIG. 7B is a cross-sectional view taken along line A-A ′ of FIG. 7A. It is a manufacturing-process figure which shows one Embodiment which manufactures the light-emitting device using the light distribution member obtained with the manufacturing method of FIG.

  In the present application, the size and positional relationship of members shown in each drawing may be exaggerated for clarity of explanation. In the following description, the same name and reference numeral indicate the same or similar members, and detailed description thereof will be omitted as appropriate. The contents described in one example and one embodiment can be used in other examples and other embodiments.

[Method of manufacturing light distribution member]
The light distribution member manufacturing method according to the present embodiment prepares a joined body in which a plurality of light-transmitting plates are joined via light-shielding portions, and covers the joined body so as to surround the outer periphery of the joined body when viewed from one direction. The light-shielding frame is fixed, and the joined body and the light-shielding frame are cut perpendicularly to the surface of the joined body on which the light-shielding frame is fixed. A step of obtaining a light distribution member. Here, as the joined body, a first joined body is prepared in which a plurality of translucent plates having a pair of opposing principal surfaces are joined so that the principal surfaces face each other. Moreover, as a joined body, for example, a plurality of translucent plates each formed of a rectangular parallelepiped may be joined in a matrix form to prepare a second joined body.
In the present application, “viewed from one direction” means viewed from the normal direction to one surface of the joined body.

1. Preparation of joined body (preparation of member with first light shielding film)
First, a plurality of members with a first light shielding film, in which at least one surface of the light transmitting plate is coated with the first light shielding film, are prepared.
As long as the translucent plate used is a plate-like member having translucency, either a flexible or rigid plate may be used.
Moreover, one surface means the main surface which occupies the largest area of a translucent board, for example, a surface or a back surface.

  Examples of such translucent plates include silicone resins, silicone-modified resins, epoxy resins, phenol resins, polycarbonate resins, acrylic resins, TPX resins, polynorbornene resins, or hybrid resins including one or more of these resins. Or those formed of glass or the like.

  The translucent plate may contain a phosphor and a filler as long as it has translucency. When the light-transmitting plate contains a phosphor, the phosphor may generate heat and deteriorate the characteristics of the phosphor itself. For this reason, when the light-transmitting plate contains a phosphor, the effect of improving heat dissipation by providing the light-shielding frame becomes remarkable.

As the phosphor, those known in the art can be used. For example, yttrium aluminum garnet (YAG) phosphor activated with cerium, lutetium aluminum garnet (LAG) phosphor activated with cerium, nitrogen-containing calcium aluminosilicate activated with europium and / or chromium (CaO—Al ₂ O ₃ —SiO ₂ ) -based phosphor, europium-activated silicate ((Sr, Ba) ₂ SiO ₄ ) -based phosphor, β-sialon phosphor, KSF (K ₂ SiF ₆ : Mn) -based Examples thereof include phosphor particles such as a phosphor. When the phosphors described above are contained, they are preferably contained at about 5 to 50% with respect to the total weight of the light transmitting plate. Further, as the light-transmitting plate, a phosphor itself or a sintered body of a phosphor and a binder made of an inorganic material can be used. Thereby, it can be set as the translucent board excellent in heat resistance.

  Examples of the filler (for example, a diffusing agent, a coloring agent, etc.) include silicon oxide, titanium oxide, zirconium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, titanium. Examples thereof include particles of barium acid, aluminum oxide, iron oxide, chromium oxide, manganese oxide and the like.

As for the shape of the translucent plate, the planar shape is preferably, for example, a quadrangle, for example, a rectangle. In this specification, the term “rectangular” includes a square. At this time, the shape of the translucent plate is a rectangular parallelepiped (including a cube).
The thickness and size of the light transmissive plate can be appropriately adjusted depending on the form of the light distribution member to be obtained. For example, the thickness of the light transmitting plate (the length in the vertical direction in FIG. 1A) corresponds to the size of the light emitting element and / or the interval between the light emitting elements when used as a light distribution member of the light emitting device. It is preferable that it is equal to or slightly larger than the outer periphery of the element. Specific examples include about 100 μm to several mm, preferably about 100 to 1000 μm, and more preferably about 100 to 500 μm. Thereby, when using the obtained light distribution member for a light-emitting device, in addition to the further miniaturization of a light-emitting device being possible, higher brightness is obtained.

  The first light shielding film is preferably formed of a material capable of shielding light from the light emitting element by 80% or more. As the first light-shielding film, a single layer made of metal, a multilayer film made of metal, or a multilayer film made of a dielectric in which a plurality of two or more kinds of dielectrics are stacked (dielectric multilayer film) can be used. For example, a DBR (distributed Bragg reflector) film can be formed using the dielectric multilayer film. Among these, it is preferable to use a film including a dielectric multilayer film. If it is a dielectric multilayer film, light absorption from a translucent piece will be less compared with a metal etc., and light can be reflected efficiently. When both the metal film and the dielectric multilayer film are used as the first light shielding film, the dielectric multilayer film and the metal film are preferably arranged in order from the translucent one side. Thereby, the extraction efficiency of the light from a translucent piece can be improved.

  Examples of the metal include gold, silver, copper, iron, nickel, chromium, aluminum, titanium, tantalum, tungsten, cobalt, ruthenium, tin, zinc, lead, and alloys thereof (for example, Al alloys, And an alloy of Al and platinum group metals such as Cu, Ag, and Pt).

Examples of the dielectric include oxides or nitrides containing at least one element selected from the group consisting of Si, Ti, Zr, Nb, Ta, and Al. In the dielectric multilayer film constituting the DBR film, normally, when the refractive index n1 of one dielectric, the refractive index n2 of the other dielectric, and the wavelength of light emitted from the light emitting layer are λ, The thickness d1 and the thickness d2 of the other dielectric are:
d1 = λ / (4 × n1) (1)
It is preferable that d2 = λ / (4 × n2) (2).
The thickness of the first light shielding film is, for example, 0. Examples include about several μm to several tens of μm, preferably about 0.1 μm to 10 μm, and more preferably about 0.3 μm to 7 μm. By setting the film thickness to the above lower limit value or more, it is easy to form the first light shielding film uniformly in the surface, and light can be reliably reflected on the first light shielding film. By doing so, the interval between the light-transmitting plates can be reduced, so that the uneven light emission by the first light shielding film can be suppressed.

  The first light-shielding film is, for example, a vacuum deposition method, an ion plating method, an ion vapor deposition (IVD) method, a sputtering method, an ECR sputtering method, a plasma deposition method, a chemical vapor deposition (CVD) method, or an ECR. It can be formed by a known method such as a -CVD method, an ECR-plasma CVD method, an electron beam evaporation (EB) method, or an atomic layer deposition (ALD) method. In particular, it is preferable to form the first light shielding film by a sputtering method that can be formed in a relatively short time.

  When the translucent plate is a rectangular parallelepiped and the first joined body is composed of two translucent plates, the first light shielding film may be formed only on one surface of the translucent plate. Further, when the light-transmitting plate is a rectangular parallelepiped and the first joined body is composed of three or more light-transmitting plates, at least one light-transmitting plate positioned between the light-transmitting plates at both ends is opposed to two surfaces (that is, A first light shielding film is formed on the front surface and the back surface. The first light shielding film can also be formed on four surfaces of the light transmitting plate excluding the surface on which light from the light emitting element is incident and the surface on which light from the light emitting element is emitted. As a result, when the first joined body is cut to obtain the light distribution member, the light distribution member having the first light-shielding film formed on the entire side surface of the translucent piece can be obtained, and the light traveling in the lateral direction is reflected. can do. The first light-shielding film is more preferably formed on the entire surface of the light-transmitting plate with a uniform thickness as a whole, but may be partially formed in a lattice shape, a stripe shape, or the like.

When preparing a plurality of members with the first light-shielding film, they may have different planar shapes and thicknesses, or may have the same or substantially the same planar shape and thickness. Here, “substantially” means that a variation of about ± 10% is allowed.
For example, when preparing two types of first light-shielding film-attached members, that is, a thin first light-shielding film-attached member and a thicker first light-shielding film-attached member, one obtained by joining a plurality of thin first light-shielding film-attached members is 1 It is preferable to use one having the same thickness as the two thick members with the first light-shielding film. That is, the thin first light-shielding film-attached member is preferably equivalent to one half or one-third the thickness of the thick first light-shielding film-attached member. Thereby, the light distribution member which has the translucent piece from which a magnitude | size differs in a column or row direction can be formed. Furthermore, in the formation of the second bonded body, by stacking in combination with the second light-shielding film-attached member having translucent pieces having different sizes in the column or row direction, the size in the matrix direction as shown in FIG. Light distribution members having different light transmitting pieces can be formed.

The first light shielding film member may be cut, polished, or the like so as to have a desired shape, size, etc. after the first light shielding film is formed on the light transmitting plate.
In the next step, when the first light shielding film-attached member is bonded by using the atomic diffusion bonding type room temperature bonding, the surface of the light-transmitting plate may be made smooth before forming the first light shielding film. preferable.

(Formation of first joined body)
A plurality of first light shielding film-attached members are joined such that the first light shielding films face each other to form a first joined body.
The bonding here may be performed by using an adhesive or the like, or may be performed by fusion bonding by heating the first light shielding film. Preferably, a film containing metal is used as the first light-shielding film, and the films containing metal are brought into contact with each other and bonded directly. By directly bonding, the distance between the light-transmitting plates can be reduced. Therefore, when used in combination with a light-emitting element, light is not easily blocked by the first light-shielding film, and uneven light emission can be reduced. Among direct bonding, bonding by room temperature bonding is preferable. In the present specification, a member disposed between the light-transmitting plates is referred to as a “light-shielding portion”. For example, when a first light-shielding film provided on one light-transmitting plate and a first light-shielding film provided on another light-transmitting plate adjacent to the light-transmitting plate are directly bonded, two light-shielding films are provided. What the film is joined is called a “light-shielding part”. When the first light-shielding film provided on one light-transmitting plate and the first light-shielding film provided on another light-transmitting plate are bonded using an adhesive, the two light-shielding films and the adhesive A combination of and is referred to as a “shading part”. The same applies to the case where a second light shielding film described later is used.

  As the room temperature bonding, a known method can be used. For example, bonding methods such as surface activated bonding type room temperature bonding and atom diffusion bonding type room temperature bonding may be used. When performing such room-temperature bonding, since bonding can be performed without applying an adhesive or heat, it is not necessary to consider the difference in coefficient of thermal expansion between the two members to be bonded. can do. In addition, since the bonding is performed at the atomic level, it is possible to perform bonding with higher strength and superior durability than bonding with an adhesive or the like. Furthermore, since heating is not performed, it is possible to perform bonding in a short time without requiring temperature increase and decrease.

  In the surface activated bonding type room temperature bonding, the bonding surface is subjected to surface treatment in a vacuum so that a chemical bond is easily formed with respect to surface atoms. Specifically, first, in a vacuum, an oxide film, dirt, and the like adhering to the bonding surface are removed by irradiation with ions such as argon or plasma. The energy, time, and the like in this case can be appropriately adjusted depending on the thickness, material, and the like of the first light shielding film of the first light shielding film-attached member to be used. By such treatment, atoms having bonds are exposed at the bonding surface of the first light shielding film-attached member, and a very active state can be formed in which bonding strength with other atoms is large. Thereby, by bringing the bonding surfaces into contact with each other, the bonding force works instantaneously and the bonding surfaces can be firmly bonded. In such joining, since thermal strain and thermal stress due to heating do not occur, stable joining can be realized for the first light-shielding film having an extremely thin film shape.

  In atomic diffusion bonding type room temperature bonding, a first light-shielding film is formed on the bonding surface in an ultra-high vacuum, and the first light-shielding films are overlapped in a vacuum so that the first light-shielding films face each other. Can be done. When performing atomic diffusion bonding type room temperature bonding, it is preferable to use titanium, gold, chromium, or the like, which is excellent in corrosion resistance, as the first light-shielding film.

  In the joining of the first light shielding film-attached member, the first light shielding film-attached member located at the extreme end may be one in which the first light shielding film is formed on two surfaces, but the first light shielding film is provided on the extreme end face. It is preferable to use the first light-shielding film-attached member formed only on one surface so as not to be disposed. In addition, the first light-shielding film-attached member disposed on the inner side of the first joined body may be one having the first light-shielding film formed on one surface, but in order to facilitate joining on both surfaces, the first light-shielding film is provided. It is preferable to use a member with a first light-shielding film having a film formed on two surfaces.

  When using an adhesive, for example, acrylic, urethane, styrene, epoxy, polyimide, silicone, BT resin, ester, ether, urea, polyamide, phenol, cellulose derivatives An agent can be used. These adhesives can be used in combination of two or more as required.

  In either case, the first joined body can be formed by joining the first light shielding film-attached member so that one or both of the first light shielding films face each other. As for the number of lamination | stacking of the member with the 1st light shielding film in a 1st conjugate | zygote, 2 or more, 3 or more, 4 or more, or 5 or more is mentioned, for example. Moreover, hundreds or less, tens or less, and tens or less are mentioned. Preferably, it can be 2 or more and 10 or less. By setting it as above-mentioned lower limit, the light distribution member provided with a some translucent piece can be formed collectively, and cutting | disconnection of a 1st conjugate | zygote becomes easy by setting it as the above-mentioned upper limit or less.

2. Fixing the light-shielding frame to the first joined body A light-shielding frame is formed on the obtained first joined body. Here, the light-shielding frame may surround a part of the outer periphery of the first joined body, but preferably surrounds the entire outer periphery when viewed from one direction. Thereby, since the light which goes to a horizontal direction from a 1st conjugate | zygote can be light-shielded with a light-shielding frame, it can prevent that light leaks from a light distribution member to a horizontal direction. In addition, it is preferable that the light-shielding frame has reflectivity. Thereby, since the light passing through the light distribution member in the lateral direction can be reflected and extracted, the light extraction efficiency from the light distribution member can be improved. Here, the outer periphery means a side surface of the first bonded body constituted by a pair of side surfaces of the first bonded body parallel to the bonded surface of the first light shielding film-attached member and side surfaces adjacent thereto. That is, it means all surfaces except the two opposing surfaces, and when the first joined body is a rectangular parallelepiped, it means four surfaces excluding the two opposing surfaces. Further, the part of the outer periphery may be, for example, one side surface, a pair of opposing side surfaces, or a part of one or a pair of side surfaces. Since the first joined body is a rectangular column or a shape approximate to this from the shape of the normally used translucent plate, it intersects with the pair of side surfaces parallel to the joint surface and preferably the joint surface (preferably It is preferable to continuously surround a pair of side surfaces that are orthogonal to each other over the entire width and length of the side surfaces of the first joined body.

  The material which comprises a light-shielding frame consists of material which does not contain organic substance substantially. If a member containing an organic substance is provided in a region in contact with the light transmitting plate, the member in contact with the light transmitting plate may be cracked due to high-density light or the like. When cracks occur, light escapes from the cracks, and the luminance of the light emitting device decreases. On the other hand, by providing a light-shielding frame that does not substantially contain organic matter on the outer periphery of the joined body, it is easy to suppress the occurrence of cracks on the outer periphery of the joined body, and a light-emitting device with high brightness can be obtained. it can. The term “substantially free of organic matter” as used herein means not only that which does not contain organic matter completely, but also contains organic matter to the extent that it does not affect the reliability of the light-shielding frame. Including. Examples of such a material include a reflective ceramic, a dielectric multilayer film, a glass containing a reflective substance, a metal, or a composite material thereof. Since these materials do not contain an organic substance, a light-shielding frame body that suppresses cracking due to heat or light can be obtained. In particular, a reflective ceramic excellent in light resistance and heat resistance is preferable. As the ceramic, it is preferable to use aluminum nitride, alumina, or the like with high heat dissipation. Examples of the reflective substance include titanium oxide, silicon oxide, zirconium oxide, potassium titanate, alumina, aluminum nitride, boron nitride, and mullite. The content of the reflective substance or the like can be appropriately adjusted depending on the type of the reflective substance used. For example, it is preferably about 30% or more with respect to the total weight of the material of the light-shielding frame.

  As a method of forming the light-shielding frame body on the first joined body, for example, a method similar to the joining method of the first light-shielding film-attached member may be used, or a ceramic green sheet may be used on the outer periphery of the first joined body. It may be coated and fired, or the fired ceramic may be stuck with an adhesive or the like. Preferably, the fired ceramic is fixed using a method similar to the method for joining the first light-shielding film-attached members. Thereby, the light-shielding frame can be easily formed on the outer periphery of the first joined body. By using these methods, the light-shielding frame can be firmly fixed to the outer periphery of the first joined body.

  The thickness of the light-shielding frame is preferably 50 μm or more and 1000 μm or less, more preferably 100 μm or more and 500 μm or less. By setting the film thickness to be equal to or greater than the aforementioned lower limit value, light leakage from the light distribution member in the lateral direction can be suppressed, and by setting the film thickness to be equal to or less than the aforementioned upper limit value, cutting in a subsequent process can be easily performed. Become. Here, the “thickness of the light-shielding frame” refers to the length from the joint surface between the light-shielding frame and the first joined body to the surface facing the joint surface of the light-shielding frame. That is, it refers to the length L in the horizontal direction or the vertical direction in FIGS. 1D and 1F.

3. Cutting the first joined body and the light shielding frame The obtained first joined body and the light shielding frame are cut. The cutting here is preferably performed perpendicularly to the surface to which the light-shielding frame is fixed and the joint surface of the first light-shielding film-attached member. That is, it is preferable to carry out perpendicularly to all surfaces on which the light-shielding frame is fixed. Hereinafter, this cutting may be referred to as a first cutting. By such a first cutting, a small piece of a light transmitting plate (hereinafter sometimes referred to as “light transmitting piece”) in a state of being fractionated by the first light shielding film, and a light shielding frame body is fixed to the outer periphery thereof. A light distribution member can be obtained.

The first cutting may be any cutting as long as the cutting is performed in a direction perpendicular to the entire surface to which the light-shielding frame is fixed and the joint surface of the first light-shielding film-attached member. It is preferable to use a flat cutting method. As such a cutting method, a method known in the art can be used. For example, blade dicing, laser dicing, wire saw, etc. are mentioned. Especially, since the member with a 1st light shielding film can be cut | disconnected collectively according to a wire saw, it is preferable. In this specification, “vertical” includes an inclination within ± 10%.
When the planar shape of the translucent plate is a quadrangle, the first cut is a cut surface parallel to one side surface (for example, end surfaces F and R in FIG. 1C) adjacent to the surface on which the first light shielding film is formed. Is preferably cut so as to obtain (see, eg, FIG. 1E). By such cutting in one direction, a thin piece of the first bonded body having a uniform film thickness can be formed (see FIGS. 1E and 1F).

  A desired light distribution member can be manufactured only by cutting once in one direction in a direction perpendicular to the surface to which the light-shielding frame is fixed and the joint surface of the first light-shielding film-attached member. A plurality of desired light distribution members can be manufactured by cutting the cut twice or more in parallel with each other (see FIGS. 1E and 1F).

  In addition, as described above, the arrangement obtained by the first cutting performed in parallel with each other one or more times in the direction perpendicular to the surface on which the light-shielding frame is fixed and the joint surface of the first light-shielding film-attached member. A direction perpendicular to the surface on which the light-shielding frame is fixed and the joint surface of the first light-shielding film-attached member with respect to the optical member, and a direction intersecting (preferably orthogonal) with respect to the first cut. In FIG. 3G, you may cut | disconnect. By performing cutting in such two directions, a plurality of light distribution members having a desired shape can be manufactured regardless of the shape of the joined body.

In this cutting, it is preferable to reduce the film thickness to the same level as that of the translucent plate used, for example, about 100 μm to several mm, about 100 to 1000 μm, and further about 100 to 500 μm.
After cutting, polishing or the like may be performed to obtain these thicknesses.

  The cutting in this step may be performed in an inclined manner instead of being perpendicular to the surface to which the light-shielding frame is fixed and the joint surface of the first light-shielding film-attached member. Such cutting can be used when manufacturing a light distribution member intended for light distribution in a specific direction.

4). Preparation of second bonded body (formation of second light-shielding film-attached member)
In the method for manufacturing a light distribution member according to an embodiment of the present invention, as described above, a second light shielding film may be further formed on the cut surface of the light distribution member obtained by performing the first cutting. . That is, the light distribution member obtained by performing the first cutting is regarded as the above-described translucent plate, and the second light shielding film is formed on the surface thereof. Thereby, one or more or a plurality of members with the second light-shielding film can be formed. Therefore, the second light shielding film is formed so as to intersect perpendicularly to the first light shielding film.
In this step, it is preferable that the light-shielding frame is not formed as the light-transmitting plate, but a light-transmitting frame having a light-shielding frame formed on a part thereof may be used. In the former case, after preparing and joining the first light-shielding film-attached member and obtaining the first joined body in the above-described steps, the first joined body is formed without forming the light-shielding frame. What is necessary is just to use what was obtained by cut | disconnecting in the perpendicular | vertical direction with respect to the joint surface of 1 member with a light shielding film.

The second light-shielding film can be formed using the above-described known method by using the material exemplified for the first light-shielding film. In particular, the second light shielding film is preferably formed of the same material as the first light shielding film. Thereby, as will be described later, it is possible to make the light distribution characteristics of each light emitting element uniform when using a plurality of light emitting elements.
The second light-shielding film may not be the same thickness as the first light-shielding film, but is preferably the same from the viewpoint of uniform light distribution characteristics.

(Formation of second joined body)
A method of forming the second bonded body by bonding the second light-shielding film-attached member can be performed in the same manner as the method of forming the first bonded body described above. Thereby, it can be set as the joined body by which the translucent board was joined in matrix form via the light-shielding part. The number of layers of the second light shielding film-attached member here can also be set arbitrarily.

5. Fixing the light-shielding frame to the second joint The light-shielding frame is formed on the second joint obtained. The method for forming the light-shielding frame on the second joined body can be substantially the same method as described in the formation of the light-shielding frame on the first joined body.

6). Cutting the second joined body The obtained second joined body and the light shielding frame are cut. The cutting here can be performed by a method similar to the method described in the cutting of the first bonded body and the light-shielding frame.
In this case, the cutting may be performed perpendicularly to the joint surface of the second light shielding film-attached member, but is preferably performed perpendicularly to all surfaces to which the light shielding frame is fixed. That is, it is preferable to cut perpendicularly to both the joining surface of the first light shielding film-attached member and the joining surface of the second light shielding film-attached member. However, when the light-shielding frame is fixed to the both end faces of the second joined body, which is the outermost surface, at the time of cutting the second joint, it is preferable to remove the light-shielding frames on both end faces. That is, when the light-shielding frame is fixed to the entire surface of the second joined body, it is preferable to remove the light-shielding frames provided on the two opposing surfaces. For example, the light-shielding frame body may be removed by cutting the interface between the light-shielding frame body and the second joined body, or the cut pieces at both ends obtained by cutting the second joined body may be removed.

  The cut light distribution member includes the shape of the light-transmitting plate, the number of the first light shielding film-attached members, the cutting form of the first joined body, the number of the laminated members of the second light shielding film, the cutting form of the second joined body, etc. Thus, it can be further cut into an arbitrary shape and processed into an arbitrary number of translucent plate, first light shielding film and second light shielding film. Thereby, the light distribution member by which the light-shielding frame was fixed to the outer periphery corresponding to the number of light emitting elements to apply can be manufactured. In the obtained light distribution member, it is preferable that an organic substance is not substantially contained in the member and the light shielding part between the light shielding frame and the joined body inside the light shielding frame. When the organic substance is contained, the heat generated in the translucent piece stays in the member containing the organic substance, and there is a possibility that the heat dissipation performance is lowered. On the other hand, by making the inside of the light-shielding frame substantially free of organic matter, it is easy to radiate heat to the light-shielding frame, reducing the heat dissipation of the light distribution member can do.

  After the first cut is performed on the first bonded body, the obtained light distribution member is configured after further cutting in the direction intersecting the first cut or after cutting the second bonded body. The small pieces of the light transmitting plate separated by the light shielding portion (the first light shielding film, or the first light shielding film and the second light shielding film) are hereinafter referred to as “translucent pieces” (10 in FIGS. 1E and 1F). (See 20 in FIG. 3G, 20 in FIG. 5F, and 20 in FIG. 5G).

  In this way, by performing the first cutting of the first bonded body, further cutting in the direction intersecting the first cutting, or cutting the second bonded body, the rectangular parallelepiped or the cube has a uniform thickness. A light-shielding part that includes a light-transmitting piece and can shield light between the light-transmitting pieces adjacent to each other in the row direction and / or the column direction is provided, and a light-shielding frame is provided around the light-transmitting piece and the light-shielding part. The light distribution member can be easily and easily manufactured with high accuracy.

[Method of manufacturing light emitting device]
(Light emitting element arrangement)
In the method for manufacturing a light emitting device according to an embodiment of the present invention, a light distribution member formed by the above-described method is used, and a light emitting element is disposed on the light distribution member. Here, description will be made using an LED (Light Emitting Diode) as a light emitting element. The light distribution member is disposed on the light extraction surface side of the light emitting element, that is, on the light extraction surface side of the light emitting device.
Then, the plurality of light emitting elements are arranged separately from each other so that light from one light emitting element is incident on one or more light transmitting pieces.

For example, in the case of using a light distribution member in which translucent pieces fractionated in the light shielding portion are arranged in a row, a plurality of light emitting elements are arranged so that light from one light emitting element is incident on one or more translucent pieces. Arrange the elements in a row. Further, when using a light distribution member in which translucent pieces fractionated in the light shielding portion are arranged in a matrix, a plurality of light transmissible pieces are incident on one or more translucent pieces. The light emitting elements are arranged in a matrix. At this time, it is preferable to arrange the light distribution member so that light from one light emitting element is incident on one light transmitting piece, but the size of one light transmitting piece is smaller than that of one light emitting element. In this case, the light distribution member may be arranged so that light from one light emitting element is incident on a plurality of light transmitting pieces. Accordingly, it is possible to prevent light from the light transmitting piece provided in the light emitting element in the lighting state from leaking to the light transmitting piece provided in the adjacent light emitting element in the non lighting state. As a result, it is possible to prevent the phenomenon that the light transmitting piece provided in the non-lighting light emitting element emits minute light by the simple manufacturing method described above.
In addition, the light-shielding frame can prevent light leakage in the lateral direction of the translucent piece provided in the light emitting element located at the outermost end, and good light distribution can be obtained. Furthermore, heat dissipation from the translucent piece can be improved by using a material with high heat dissipation such as ceramic.

  The plurality of light emitting elements to be arranged are preferably close to each other between adjacent light emitting elements. In consideration of the use of a vehicle lamp and the luminance distribution, the distance between one light emitting element and the adjacent light emitting element is preferred. Is preferably shorter than the size of the light emitting element itself (for example, the length of one side). For example, about 30% or less of the size of the light emitting element itself is more preferable, and 20% or less is more preferable. Specifically, 5 μm or more and 500 μm or less is preferable, and 50 μm or more and 200 μm or less is more preferable. By setting the reflection member or the like between the light emitting elements by setting the above lower limit value or more, light leakage from the lit light emitting element to the non-lighting light emitting element can be suppressed. Thus, a light emitting device with high light emission quality with little light emission unevenness can be obtained.

  The light emitting element may be disposed with respect to the light distribution member, but the light emitting element may be disposed away from the light distribution member, but the light emitting element is preferably disposed in proximity to or in contact with the light distribution member. As a result, at least light emitted from the light emitting element can be efficiently introduced into the light distribution member. Here, the proximity means that they are disposed only through a member (for example, a translucent adhesive member or a microcrystalline thin film) that is substantially involved in the adhesion between them.

  When the light emitting element is disposed in contact with the light distribution member, it is preferable to use surface activated bonding type room temperature bonding. Thereby, since a light emitting element and a light distribution member can be joined without interposing another member, it can suppress that light is absorbed by another member.

  In the case where the light distribution member and the light-emitting element are bonded by atomic diffusion bonding type room temperature bonding, it is necessary to form a microcrystalline thin film on the light distribution member and the light-emitting element with a film thickness enough to transmit light. For example, the film formation rate is 0.1 nm to 0.8 nm, preferably 0.1 nm to 0.4 nm, and more preferably 0.1 nm to 0.2 nm.

  The “deposition rate conversion” in this specification will be described below. First, a microcrystalline thin film is formed on a base having a flat surface for a predetermined time. Next, based on the relationship between the predetermined time and the actually obtained thickness of the microcrystalline thin film, the time required to obtain the microcrystalline thin film having a desired thickness is determined. When the microcrystalline thin film is formed only for the required time, it is assumed that the film thickness obtained by converting the film formation rate is the one that can obtain the microcrystalline thin film having a desired film thickness corresponding to the required time. That is, the film thickness assumed from the reaction time is set to the film thickness formed in terms of film formation speed. The above range includes a value smaller than one atom. In this case, the microcrystalline thin film is not formed into a film but is formed in an island shape. Therefore, even if the actual film thickness is not included in the above-described film thickness range, it is within the scope of the present invention as long as the film thickness is formed within the above-described film thickness range in terms of film formation speed. Further, when the surface activated bonding method is used, the light emitting element and the light transmitting piece are directly contacted and bonded. According to the surface activated bonding, since there is no member that absorbs light between the light-transmitting piece and the light-emitting element, light from the light-emitting element can be efficiently incident on the light-transmitting piece.

As the light-emitting element used here, any of light-emitting elements generally used in this field can be used. For example, as a blue or green light emitting element, a semiconductor layer such as ZnSe, nitride semiconductor (In _X Al _Y Ga _1-XY N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), or GaP is used. Examples of the red light emitting element include those using a semiconductor layer such as GaAlAs and AlInGaP. Preferably, a GaN based semiconductor is used.
The light emitting element may be one in which electrodes are arranged on different sides of the semiconductor layer, but one in which electrodes are arranged on the same side is preferable. As a result, it can be mounted in a face-down manner to be described later.

  As the light-emitting element, a light-emitting element in which a reflective film is formed on the entire side surface can be used. Thereby, since the light which goes to a horizontal direction from a light emitting element can be reflected and extracted with a reflecting film, light extraction efficiency can be improved. Further, since light from the light emitting elements does not leak, it is not necessary to provide a reflecting member between the light emitting elements. Examples of the reflective film include the same material as the first light-shielding film, for example, a single-layer or multilayer structure of a metal film, or a dielectric multilayer film. These reflective films are preferably formed in contact with the side surface of the light emitting element.

  When the light emitting elements are spaced apart from each other in correspondence with the above-described light distribution member, usually, a plurality of light emitting elements are arranged on the support substrate in a connection form such as series, parallel, series parallel, or parallel series. The The light emitting elements are connected using a joining member such as solder or a wire. The light emitting elements may be connected in a face-down or face-up bonding form, but are preferably connected in a face-down form. With such connection, the light emitting element can be disposed close to or in contact with the light distribution member, and desired light distribution characteristics can be easily obtained.

  Each translucent piece formed on one light distribution member may have the same configuration (shape, thickness, characteristics, etc.), or may have a different configuration for each translucent piece as shown in FIG. . For example, the size of each translucent piece can be changed, a different phosphor can be included for each translucent piece so that light of different wavelengths can be formed, and the translucent piece can be formed in steps.

(Distribution of reflective members)
It is preferable to dispose a reflective member between the light emitting elements. By providing the reflecting member, it is possible to suppress the light from the light-emitting element that is lit from entering the light-transmitting piece provided in the non-light-emitting light-emitting element. The reflective member is not an essential configuration. For example, when a light-emitting element having a reflective film formed on the entire side surface is used as the light-emitting element, the reflective member need not be arranged. The reflecting member is preferably one that reflects 60% or more of light intended for light distribution, for example, light emitted from the light emitting element, and further reflects 70% or more, 80% or more, or 90% or more.

The material of the reflecting member may be selected from, for example, those exemplified for the first light-shielding film, but it is preferable to use a resin in consideration of the accuracy, simplicity, ease, and the like of the arrangement of the reflecting member.
Examples of the resin include the same materials as those exemplified as the material of the light-transmitting plate. In particular, these materials contain the above-described reflective substance so that the light emitted from the light-emitting element does not pass through. Is preferred. The content of the reflective substance or the like can be appropriately adjusted depending on the type of the reflective substance used. For example, it is preferably about 30% or more with respect to the total weight of the reflecting member. Of these, a white resin is preferable.

  Regardless of the presence or absence of an adhesive member that adheres the light distribution member to the light emitting element, the reflecting member preferably fills a space surrounded by the adjacent light emitting elements and the light distribution member. Further, it is preferable that the reflecting member is disposed between the light emitting elements so as to be in contact with the light shielding portion (here, the first light shielding film and / or the second light shielding film) of the light distribution member. In this contact, it is preferable that all of the light shielding portion exposed on the light emitting element side of the light distribution member is in contact with the reflection member. Moreover, it is preferable to arrange | position a reflection member so that it may contact with a light-shielding frame body in the outer periphery of a light emitting element. Accordingly, light emitted from each light emitting element can be separated for each light emitting element, and light leakage between adjacent light emitting elements can be prevented in the light emitting device. As a result, it is possible to avoid the phenomenon that the light transmitting piece provided in the non-lighting light emitting element emits a minute amount of light.

  The reflecting member may not be disposed in contact with the side surface of the light emitting element, but is preferably disposed so as to be in contact with a part or all of the side surface. With such an arrangement, the light emitted in the lateral direction from the side surface of the light emitting element can be reflected by the reflecting member, and the light can be emitted to the light extraction surface. Further, by providing the reflecting member in contact with the side surface of the light emitting element, light only propagates in the light emitting element, so that light absorption by other members can be avoided.

  The reflecting member is preferably disposed on the surface opposite to the light extraction surface side of the light emitting element, that is, between the light emitting element and the above-described support substrate. With this arrangement, light can be extracted to the light extraction surface side.

  Further, the reflecting member has at least a surface not covered with the light-shielding frame when the outer periphery of the first joined body, that is, a part of the end face of the first joined body is not covered with the light-shielding frame. It is preferable to coat. Thereby, the light which goes to a horizontal direction in a translucent piece can be reflected with a light-shielding frame and a reflection member. However, when the light-shielding frame is disposed on the entire outer periphery of the first joined body, the outer periphery of the light-shielding frame may not be covered with the reflecting member. Thereby, since the outer periphery of a light distribution member can be made into the outermost periphery of a light-emitting device, a light-emitting device can be reduced compared with the case where a reflecting member is arrange | positioned on the side surface of a light distribution member. When the end surface of the first joined body is covered with the reflecting member, it is more preferable that the upper surface of the reflecting member and the upper surface of the light distributing member are on the same plane around the light distributing member. Thereby, the light emitted from the side surface of the light distribution member can be reflected and emitted to the light extraction surface.

The reflecting member can be formed by screen printing, potting, transfer molding, compression molding, or the like. In the manufactured light emitting device, the reflecting member does not cover the light extraction surface side surface of the light distribution member, but in the reflection member forming step, the light distribution surface side surface of the light distribution member is once coated and then polished. For example, the light extraction surface of the light distribution member may be exposed from the reflection member.
The thickness of the reflecting member is preferably equal to the distance from the upper surface of the support substrate to the upper surface of the light emitting element and the total thickness of the light distribution member when the light emitting element is connected to the support substrate.

  The reflection member is preferably arranged after the light emitting element is arranged with respect to the light distribution member. However, depending on the arrangement form described above, after the light emitting element is placed on, for example, the support substrate, before the light distribution member is provided. In addition, a reflective member may be disposed.

The light-emitting device obtained by such a manufacturing method has a light distribution member. The light distribution member has, for example, a first main surface and a second main surface that are located on opposite sides of each other and parallel to each other, and each of the light distribution members is in a predetermined direction parallel to the first main surface and the second main surface. The light-shielding frame body includes light-transmitting pieces and light-shielding portions arranged alternately, and a light-shielding frame disposed on the outer periphery of the joined body including the light-transmitting pieces and the light-shielding portions. In addition to the light distribution member, the light-emitting device is disposed on the lower surface side of the light distribution member corresponding to each light-transmitting piece of the light distribution member, and is disposed between the light-emitting elements and a plurality of light-emitting elements spaced apart from each other. Reflection member (see FIGS. 2B and 4B). In other words, the light-emitting elements arranged separately from each other, the light-transmitting pieces provided on the light-emitting surface sides of these light-emitting elements, the light-shielding portion that joins the adjacent light-transmitting pieces, and the space between the adjacent light-emitting elements And a reflecting member disposed on the surface.
With such a configuration, light emitted from each light emitting element can be separated for each light emitting element, and light leakage between adjacent light emitting elements in the light emitting device can be prevented. As a result, it is possible to avoid the phenomenon that the light transmitting piece provided in the non-lighting light emitting element emits a minute amount of light. Further, light leakage from the side of the light transmitting piece provided in the light emitting element located at the outermost end can be prevented, and light distribution can be controlled.

  As shown in FIG. 8, a semiconductor laser element (LD, Laser Diode) can also be used as the light emitting element 13. In FIG. 8, a light distribution member 32 and a semiconductor laser element spaced from the light distribution member 32 are provided. The semiconductor laser element is arranged such that light from the LD is incident on one side of a pair of main surfaces of the light distribution member 32 where the light shielding frame 39 is not provided. Since the LD emits light with a higher density than the LED, when the phosphor is contained in the light-transmitting piece 20, the effect of improving the heat dissipation of the present invention becomes remarkable for the reason described above. When the LD is used, a transmissive light distribution member in which the lower surface of the light distribution member 32 is an incident surface for light from the LD and the upper surface of the light distribution member 32 is an emission surface of the light can be used. In this case, unlike the reflective type in which heat is radiated from the entire lower surface by bonding metal or the like to the lower surface of the bonded body, only the side surface of the bonded body becomes a heat dissipation path. For this reason, when the light distribution member 32 is used as a transmission type, the effect of improving heat dissipation by the light-shielding frame 39 becomes more remarkable.

  Below, the manufacturing method of the light distribution member which concerns on each embodiment of this invention, and the manufacturing method of a light-emitting device are demonstrated in detail based on drawing.

Embodiment 1: Method for Manufacturing Light Distribution Member In the method for manufacturing a light distribution member according to Embodiment 1, first, as shown in FIG. 1A, a light transmitting plate 10a is prepared. The translucent plate 10a is obtained by cutting a large YAG plate obtained by mixing a glass material with about 10% by weight of a YAG phosphor and sintering it to an appropriate size.

  As shown in FIG. 1B, a metal multilayer structure film having a thickness of 100 nm / 200 nm / 500 nm (total thickness: 800 nm) (in order of Ti / Pt / Au from the light transmitting plate side) and only on one surface of the light transmitting plate 10a. The first light shielding film 11a made of is sequentially formed by sputtering to form the first light shielding film member 17. Two members 17 with the first light shielding film are formed. Further, a plurality of first light shielding film-attached members 17 each having the first light shielding film 11a formed on both surfaces of the light transmitting plate 10a are formed. Here, one side refers to the upper or lower surface of the light transmitting plate 10a shown in FIG. 1A, and both surfaces refer to the upper and lower surfaces of the light transmitting plate 10a shown in FIG. 1A.

  Next, as shown in FIG. 1C, the first light-shielding film-attached member 17 is sequentially bonded at room temperature so that the first light-shielding films 11a face each other, thereby forming a first joined body 18. In the present embodiment, the five first light shielding film-attached members 17 are joined. In this case, a surface on which the first light-shielding film 11a is not formed is disposed on the lowermost surface and the uppermost surface of the first bonded body 18. Further, between the first light-shielding film-attached members 17, the light-shielding portions 11 (here, the two first light-shielding films 11a) are arranged. For example, the first bonded body 18 is adjacent to a surface on which the first light shielding film 11a is not formed, and one surface orthogonal to the first light shielding film 11a is an end surface F, and an end surface facing the surface is an end surface R. Here, the end faces F and R have a minimum area among the faces orthogonal to the first light shielding film 11a.

A light-shielding frame 19 is formed on the obtained first joined body 18. Here, the light-shielding frame is arranged so as to surround the entire outer periphery of the first joined body 18. In FIG. 1D, the light-shielding frame 19 is fixed to the surface other than the end faces F and R.
The light-shielding frame 19 is formed by, for example, bonding room temperature ceramics to the lowermost surface and the uppermost surface of the first bonded body 18, and exposing the surfaces other than the end faces F and R of the first bonded body 18 ( Ceramics are formed by bonding at room temperature to the surface having the largest area among the surfaces orthogonal to the first light shielding film 11a.

Thereafter, as shown in FIG. 1E, the first joined body 18 surrounded by the light-shielding frame body 19 is bonded to all surfaces to which the light-shielding frame body 19 is fixed and the joint surface of the first light-shielding film-attached member 17. In contrast, it is cut perpendicularly to a desired thickness. That is, the cutting is performed in parallel to the end surfaces F and R of the first joined body 18. Thereafter, polishing is performed to flatten the surface.
As a result, as shown in FIG. 1F, the first joined body including the light-transmitting pieces 10 and the light-shielding portions 11 (two first light-shielding films 11a in the present embodiment) that join the adjacent light-transmitting pieces 10 in a row. A plurality of light distribution members 12 having a desired thickness in which the light-shielding frame 19 is disposed on the entire outer periphery of the first joined body 18 can be formed.

  As shown in FIGS. 1A and 1B, the thickness of the translucent plate 10a is the maximum width in which the light emitting element can be finally arranged. Therefore, the thickness of the translucent plate 10a is preferably larger than one side (width) of the light emitting element in plan view, and can be, for example, 50 μm or more larger than one side of the light emitting element.

  In this light distribution member 12, since the light-shielding frame 19 made of ceramic is provided on the outer periphery of the first joined body 18, the light distribution member 12 having excellent light resistance and heat resistance can be obtained. Moreover, since the organic substance is not substantially contained inside the light shielding frame 19, it is easy to dissipate heat generated in the light transmitting piece 10 to the light shielding frame 19. Furthermore, according to this embodiment, the light distribution member 12 excellent in light resistance and heat resistance can be easily formed.

Embodiment 2: Method for Manufacturing Light-Emitting Device In the method for manufacturing a light-emitting device according to Embodiment 2, first, as shown in FIG. 2A, the light-emitting element 13 is formed corresponding to the light distribution member 12 obtained in Embodiment 1. Deploy. That is, the five light emitting elements 13 are spaced apart from each other, corresponding to the positions of the light transmitting pieces 10 divided by the light shielding portions 11 of the light distribution member 12.
The light-emitting elements 13 are arranged by arranging the light-emitting elements 13 in a line on a support substrate 15 having a wiring pattern formed on the upper surface and mounting the light-emitting elements 13 face down using solder. And the light distribution member 12 is fixed to the light extraction surface side of the light emitting element 13 arranged in this way by an adhesive member.

  Subsequently, as shown in FIG. 2B, the reflecting member 14 including a silicone resin containing about 50% titanium dioxide is disposed so as to be disposed between the light emitting elements 13 and between the light emitting elements 13 and the support substrate 15. Thus, the light emitting device 16 is formed. The reflecting member 14 is provided between the light emitting elements 13 so as to be in contact with the light shielding unit 11. In addition, the reflecting member 14 is arranged so as to cover all of the side surfaces of the light emitting element 13 and all of the lower surface of the light distribution member 12 except for the region in contact with the light emitting element 13. Further, on the side surface of the light emitting device 16, the side surface of the light shielding frame 19 and the side surface of the reflecting member 14 are flush with each other.

  The light-emitting device obtained by such a manufacturing method includes a joined body (here, the first joined body 18) in which a plurality of light-transmitting pieces 10 are joined via the light-shielding portion 11, and a joined body when viewed from one direction. The light distribution member 12 including the light shielding frame 19 provided so as to surround the outer periphery, and the light distribution member 12 is disposed on one side of a pair of main surfaces where the light shielding frame 19 is not provided. The light-emitting elements 13 and the light-shielding frame 19 are made of different materials and include a reflecting member 14 provided so as to be in contact with the light-shielding portion 11 between the light-emitting elements. At this time, the light distribution member 12 and the light emitting element 13 are arranged so that light from one light emitting element 13 is incident on one or more light transmitting pieces 10.

According to the manufacturing method as described above, it is not necessary to form a reflection or light shielding film on the side surface of the light distribution member, and the light emitting device can be manufactured with high accuracy and simplicity.
Further, in the obtained light emitting device, when the individual light emitting elements are controlled to be lighted independently, light from the lighted light emitting elements leaks to the light transmitting piece provided in the adjacent non-light emitting elements. Can be suppressed. Accordingly, it is possible to prevent the light transmitting piece provided in the non-lighting light emitting element from emitting a minute amount of light. Furthermore, since the thickness of the light-shielding portion located between the light emitting elements can be reduced, uniform brightness can be ensured even at the boundary portion even when adjacent light emitting elements emit light simultaneously. In addition, a brighter light-emitting device in which light-emitting elements are arranged more densely can be manufactured. In addition, light leakage in the lateral direction of the light emitting element disposed at the outermost end of the light emitting device can be prevented, and good light distribution can be obtained.

Embodiment 3: Method for Manufacturing Light Distribution Member In the method for manufacturing a light distribution member according to Embodiment 3, substantially the same as the method for manufacturing a light distribution member according to Embodiment 1 except that the light transmitting plate is cut in two directions. The same as above.

First, as shown in FIG. 3A, a translucent plate 20a is prepared.
Then, as shown in FIG. 3B, a first light shielding film 21a made of a metal multilayer structure film is formed on the surface of the light transmitting plate 20a to form a first light shielding film-attached member 27. For example, the width of the first light shielding film member 27 in this case is about 200 μm. The width here refers to the length W in the horizontal direction of FIG. 3B.

  Next, as shown in FIG. 3C, the first light-shielding film-attached member 27 is sequentially bonded at room temperature so that the first light-shielding films 21a face each other, and, for example, five first light-shielding film-attached members 27 are stacked. The first joined body 28 is formed. For example, the first bonded body 28 is adjacent to a surface where the first light shielding film 21a is not formed, and one surface orthogonal to the first light shielding film 21a is an end surface F, and an end surface opposite to the end surface F is an end surface R. Here, the end faces F and R have a minimum area among the faces orthogonal to the first light shielding film 21a.

  As shown in FIG. 3D, a light-shielding frame 29 is formed on the obtained first joined body 28. Here, the light-shielding frame 29 is arranged so as to surround the entire outer periphery of the first joined body 28. In FIG. 3D, the light-shielding frame 29 is fixed to the surface other than the end faces F and R.

Thereafter, as shown in FIG. 3E, the first bonded body 28 surrounded by the light-shielding frame 29 is bonded to all surfaces to which the light-shielding frame 29 is fixed and the bonding surface of the first light-shielding film-attached member 27. A first cut is made perpendicular to. That is, the cutting is performed in parallel to the end faces F and R of the first bonded body 28. Thereafter, polishing is performed to flatten the surface. Thereby, the light distribution member 22a shown in FIG. 3F is obtained.
Further, as shown in FIG. 3G, the cut light distribution member 22a is again in the direction perpendicular to the bonding surface of the first light shielding film-attached member 27 and the bonding surface of the first light shielding film-attached member 27. In this, cutting is performed in a direction orthogonal to the first cutting described above.

  By performing the cutting | disconnection with respect to such 2 directions, as shown to FIG. 3G, the light-shielding part 21 is arrange | positioned between the translucent pieces 20, and the light distribution member 22 of a desired shape can be manufactured in multiple numbers. However, in the obtained light distribution member 22, the light-shielding frame 29 is not disposed on the entire outer periphery, but is disposed only on the pair of side surfaces or the pair of side surfaces and the other one side surface.

  As described above, when cutting is performed in two directions, it is preferable that the translucent plate 20a has a depth as shown in FIG. 3A.

  Even with such a manufacturing method, as in the first embodiment, a large amount of light distribution members capable of preventing light leakage of adjacent light emitting elements can be manufactured by a highly accurate and simple method.

Embodiment 4 Method for Manufacturing Light-Emitting Device In the method for manufacturing a light-emitting device according to Embodiment 4, as shown in FIG. 4A, the light-emitting element 13 and the light distribution member 22 are arranged in the same manner as in Embodiment 2.
Subsequently, as illustrated in FIG. 4B, the reflecting member 14 is disposed between the light emitting elements 13. The reflecting member 14 is provided between the light emitting elements 13 so as to be in contact with the light shielding portion 21 (here, the two first light shielding films 21a). Further, the reflection member 14 is disposed so as to cover all the side surfaces of the light emitting element 13, all the side surfaces of the light distribution member 12, and the lower surface of the light distribution member 12 that are not in contact with the light emitting element 13. . That is, the reflecting member 14 is disposed so as to cover all of the side surfaces of the light shielding frame 29. Further, on the upper surface of the light emitting device 26, the upper surface of the light shielding frame 29 and the upper surface of the reflecting member 14 are flush with each other.

  By the manufacturing method as described above, it is not necessary to form a reflection or light-shielding film on the side surface of the light distribution member as in the second embodiment, and the light distribution member and the light emitting device can be manufactured with high accuracy and simplicity.

Embodiment 5: Method for Manufacturing Light Distribution Member In the method for manufacturing a light distribution member according to Embodiment 5, the first light-shielding film shown in FIG. Cut perpendicularly to the joint surface of the attachment member 27 to form an intermediate 22b as shown in FIG. 5B. This cutting is performed perpendicular to the end faces F and R.

Next, as shown in FIG. 5C, a second light-shielding film 31a made of a metal multilayer structure film is formed on the surface of the obtained intermediate 22b, similarly to the formation of the first light-shielding film 21a. A film-coated member 37 is formed.
As shown in FIG. 5D, the second light-shielding film-attached member 37 is sequentially joined at room temperature so that the second light-shielding films 31a face each other, for example, two second light-shielding film-attached members 37 are joined. The joined body 38 is formed. For example, the second bonded body 38 is adjacent to a surface on which the second light shielding film 31a is not formed, and one surface orthogonal to the second light shielding film 31a and the first light shielding film 21a is an end surface F, and an end surface opposite to the end surface is an end surface. Let R be. Here, the end faces F and R have a minimum area among the faces orthogonal to the second light shielding film 31a.

  As shown in FIG. 5E, a light-shielding frame 39 is formed on the obtained second joined body 38. Here, the light shielding frame 39 is disposed so as to surround the entire outer periphery of the second bonded body 38. In FIG. 5E, the light-shielding frame 39 is fixed to a surface other than the end faces F and R.

Subsequently, as shown in FIG. 5F, the second joined body 38 surrounded by the light shielding frame 39 is cut perpendicularly to all the surfaces to which the light shielding frame 39 is fixed. That is, the cutting is performed in parallel to the end faces F and R of the second bonded body 38.
Thereafter, the obtained light distribution member 32 is optionally polished and / or cut to produce a desired shape of the light distribution member 32 shown in FIG. 5G, for example. The light distribution member 32 includes a plurality of light transmitting pieces 20 arranged in a matrix. And between each translucent piece 20 adjacent to a row direction, the light-shielding part 21 which consists of two 1st light shielding films 21a from two second light-shielding films 31a between each translucent piece 20 adjacent to a column direction. The light shielding portions 31 are arranged respectively.

  Even with such a manufacturing method, as in the first and third embodiments, a large amount of light distribution members that can prevent light leakage to adjacent light-transmitting pieces can be manufactured in a high-precision and simple manner. it can.

Embodiment 6: Method for Manufacturing Light-Emitting Device In the method for manufacturing a light-emitting device according to Embodiment 6, the light-emitting elements 13 are arranged in a matrix corresponding to the light distribution member 32 obtained in Embodiment 5, as shown in FIG. Place multiple.
The arrangement of the light-emitting elements 13 at this time can be performed in the same manner as in the second embodiment, and further, a light-emitting device can be manufactured by forming a reflective member by the same method as in the second embodiment.

In the light-emitting device obtained by such a manufacturing method, light-emitting elements are arranged in a matrix, light-transmitting pieces are arranged corresponding to the light-emitting elements, and a light-shielding portion (in this embodiment, between adjacent light-transmitting pieces). The first light-shielding film and the second light-shielding film are substantially the same in configuration as the light-emitting device of the second embodiment.
In such a light-emitting device, as in Embodiments 2 and 4, it is not necessary to form a reflection or light-shielding film on the side surface of the light distribution member, and the light-emitting device can be manufactured with high accuracy and simplicity.

Embodiment 7: Manufacturing Method of Light Distribution Member In this manufacturing method of a light distribution member, in order to manufacture the light distribution member 42 in the light emitting device of FIG.
Light-transmitting plate A having the smallest thickness and the highest phosphor concentration,
Light-transmitting plate B having the thinnest thickness and the second highest phosphor concentration,
Secondly, the light-transmitting plate C having the smallest thickness and the highest phosphor concentration,
The light-transmitting plate D having the largest thickness and the second highest phosphor concentration,
A translucent plate E having the largest thickness and the lowest phosphor concentration is prepared.

Then, using the light-transmitting plate A and the light-transmitting plate B, the joined body X in which the light-transmitting pieces 41a and 41b are arranged in the row direction is created in the same manner as in the process up to FIG. 1C of the first embodiment.
Further, using the light-transmitting plate D and the light-transmitting plate E, the joined body Y in which the light-transmitting pieces 41d and 41e are arranged in the row direction is created in the same manner as in the process up to FIG. 1C of the first embodiment.
Furthermore, using the light-transmitting plate B and the light-transmitting plate C, the joined body Z in which the light-transmitting pieces 41b and 41c are arranged in the row direction is created in the same manner as in the steps up to FIG. 1C of the first embodiment.
The joined body X, joined body Y, and joined body Z are regarded as intermediates shown in FIG. 5B, and a light shielding film is formed on the surface in the same manner as in FIG. 5C. Thereafter, as in FIG. 5D, the layers are stacked in a direction orthogonal to the row direction. Subsequently, as in FIG. 5E, a light-shielding frame 49 is formed and cut in the same manner as in FIG. 5F.

  Accordingly, as shown in FIG. 7A, the light transmitting piece 41a having the smallest size and the highest phosphor concentration, the light transmitting piece 41b having the smallest size and the second highest phosphor concentration, The second smallest light transmitting piece 41c with the highest phosphor concentration, the largest light transmitting piece 41d with the second highest phosphor concentration, and the largest size, It is possible to form the light distribution member 42 having the light transmitting piece 41e having the lowest phosphor concentration and having the light shielding frame 49 formed on the outer periphery thereof.

Embodiment 8: Method for Manufacturing Light-Emitting Device In this method for manufacturing a light-emitting device, as shown in FIG. 7B, a light distribution member 42 is used instead of the light distribution member 32, and one light transmitting piece 41a having the smallest size is provided. One light emitting element 13 is disposed in 41b, two light emitting elements 13 are disposed in the second light transmitting piece 41c, and four light emitting elements 13 are disposed in the largest light transmitting pieces 41d and 41e. A light emitting device similar to that in Embodiment 6 can be manufactured.

  Even in such a light emitting device, the same effects as those of Embodiments 2, 4, and 6 can be obtained. Moreover, when using the light distribution member of such a form, it can be set as the light-emitting device of the characteristic corresponding to various applications, such as a vehicle headlight, for example.

  A light distribution member manufacturing method and a light emitting device manufacturing method according to an embodiment of the present invention include a light source for various display devices, a light source for illumination, a light source for indicators, a vehicle lamp, a light source for display, and a liquid crystal backlight. It can be used for the production of various light sources such as light sources, in-vehicle components, and channel letters for signboards.

10, 20, 41a, 41b, 41c, 41d, 41e Translucent piece 10a, 20a Translucent plate 11a, 21a First light shielding film 11, 21, 31 Light shielding part 12, 22, 22a, 22b, 32, 32a, 42 Arrangement Optical member 13 Light emitting element 14 Reflecting member 15 Substrate 16, 26, 46 Light emitting device 17, 27 First light shielding film member 18, 28 First joined body 19, 29, 39, 49 Light shielding frame 31a Second light shielding film 37 2nd light shielding film member 38 2nd conjugate | zygote F, R End surface

Claims (10)

A light-shielding film containing metal is formed on at least one surface of each of a plurality of light-transmitting plates each made of a phosphor itself or a sintered body of a phosphor and an inorganic material, and the light-shielding films are bonded to each other using a room temperature bonding method. By directly joining, preparing a joined body in which the plurality of translucent plates are joined through a light shielding portion ,
A light-shielding frame made of ceramic is fixed to the joined body so as to surround the outer periphery of the joined body as seen from one direction,
A plurality of light distribution members each having a plurality of translucent pieces are obtained by cutting the joined body and the light shielding frame body perpendicularly to a surface of the joined body on which the light shielding frame body is fixed. A method for producing a light distribution member. The method for manufacturing a light distribution member according to claim 1, wherein in the step of preparing the joined body, a joined body in which the light transmitting plate is joined in a matrix through the light shielding portion is prepared. 3. The manufacturing of the light distribution member according to claim 1, wherein in the step of preparing the joined body, a film including a multilayer film made of a dielectric and a metal film is used as the light shielding film in order from the light transmitting plate side. Method. A light distribution member is manufactured by the method according to any one of claims 1 to 3 ,
A method for manufacturing a light-emitting device, including a step of separately providing a plurality of light-emitting elements so that light from one light-emitting element is incident on one or more light-transmitting pieces. After the step of providing the plurality of light emitting elements separately,
The method for manufacturing a light-emitting device according to claim 4 , comprising a step of providing a reflective member made of a material different from that of the light-shielding frame and in contact with the light-shielding portion between the light-emitting elements. A joined body in which a plurality of translucent pieces each made of a phosphor itself or a sintered body of a phosphor and an inorganic material are joined via a light shielding portion,
A light-shielding frame made of ceramic provided to surround the outer periphery of the joined body as seen from one direction ;
A light distribution member containing substantially no organic substance inside the light-shielding frame . The light distribution member according to claim 6 , wherein the translucent pieces are joined in a matrix through the light shielding portion. The light distribution member according to claim 6 or 7 , wherein a width of the light-shielding frame body is in a range of 50 µm or more and 1000 µm when viewed from above. The light distribution member according to any one of claims 6 to 8 ,
A plurality of light emitting elements arranged on one side of a pair of main surfaces in which the light shielding frame in the light distribution member is not provided;
The light shielding frame is made of a different material, and includes a reflective member provided so as to be in contact with the light shielding portion between the light emitting elements,
The light distribution device and the light emitting element are arranged such that light from one light emitting element is incident on one or more light transmitting pieces. The light distribution member according to any one of claims 6 to 8 ,
A semiconductor laser element disposed apart from the light distribution member, and
The light emitting device in which the semiconductor laser element is disposed so that light from the semiconductor laser element is incident on one side of a pair of main surfaces of the light distribution member on which the light shielding frame is not provided. .