JP6130264B2 - Sheet sticking device and sheet sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sheet sticking method for sticking an adhesive sheet to an adherend surface of an adherend.

  2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, a sheet sticking apparatus for sticking a dicing tape (adhesive sheet) to a semiconductor wafer as an adherend (hereinafter sometimes simply referred to as “wafer”) has been proposed (for example, Patent Documents). 1). In the sheet sticking apparatus described in Patent Document 1, the pressure in the pressing means is increased to deform the pressing means convexly toward the wafer, and the adhesive sheet is pressed and stuck to the wafer.

JP 2005-129678 A

  However, in the sheet sticking device described in Patent Document 1, when the pressing force is influenced by a member constituting the pressing unit, and the pressing unit is configured by a member that is easily deformed, the pressure inside the pressing unit is increased. The pressing means located outside the adherend is deformed, and there is a disadvantage that the pressing force cannot be sufficiently applied. On the other hand, when the pressing means is composed of a member that is difficult to deform, if the unevenness is formed on the surface of the adherend or the adhesive sheet, the pressing means becomes difficult to deform following the unevenness. There are disadvantages in that air bubbles are formed between the adhesive sheet and the adhesive sheet, or the adherend is attacked to give stress or damage to the adherend.

  An object of the present invention is to provide a sheet sticking apparatus and a sheet sticking method capable of preventing an air bubble from being formed between an adherend and an adhesive sheet to be securely attached to the adherend. .

  In order to achieve the above-mentioned object, the sheet sticking device of the present invention applies a pressing force in a direction approaching the adherend and the adhesive sheet facing each other in a predetermined sticking space, thereby applying the sticking force of the adherend. A sheet sticking device for sticking an adhesive sheet to a wearing surface, comprising a deformable first deformable member, and a first space located on the opposite side of the paste space with the first deformable member interposed therebetween A contact means for deforming the first deformable member to contact the adhesive sheet with the adherend surface by making the pressure higher than the space, and a deformable second deformable member, The second deformable member is deformed via the first deformable member by setting the second space located on the opposite side of the first space with a higher pressure than the first space and the pasting space. The pressing hand for applying a pressing force to the adherend and the adhesive sheet Characterized in that it comprises and.

  At this time, in the sheet sticking device of the present invention, it is preferable that the first deformation member is configured to be more easily deformable than the second deformation member.

  On the other hand, in the sheet sticking method of the present invention, the adhesive sheet is applied to the adherend surface of the adherend by applying a pressing force in a direction relatively approaching the adherend and the adhesive sheet that are arranged to face each other in a predetermined sticking space. Is a sheet affixing method for affixing a deformable first deformable member between the first space located on the opposite side of the affixing space to a pressure higher than that of the affixing space. A step of deforming a member to bring the adhesive sheet into contact with the adherend surface, and a second space located on the opposite side of the first space with a deformable second deformable member interposed therebetween, A step of deforming the second deformable member by applying a pressure higher than that of the pasting space and applying a pressing force to the adherend and the adhesive sheet via the first deformable member. .

  According to the present invention as described above, after the adhesive sheet is brought into contact with the adherend surface with a small pressing force by the abutting means, the adhesive sheet is pressed and pasted on the adherend surface with a large pressing force by the pressing means. Thus, it is possible to prevent air bubbles from being formed between the adherend and the adhesive sheet to be securely attached to the adherend.

  In addition, if the first deformable member is configured to be more easily deformable than the second deformable member, the first deformable member follows the unevenness even if unevenness is formed on the surface of the adherend or the adhesive sheet. By deforming, the formation of bubbles can be prevented more reliably, and the pressing force by the second pressing means can be increased.

Sectional drawing of the sheet sticking apparatus which concerns on embodiment of this invention. Operation | movement explanatory drawing of the sheet sticking apparatus of FIG. Operation | movement explanatory drawing of the sheet sticking apparatus of FIG. (A), (B) is operation | movement explanatory drawing of the sheet sticking apparatus which concerns on the modification of this invention.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an embodiment of the invention will be described with reference to the drawings.
In this embodiment, for example, when directions such as up, down, left, right, front, back, etc. are shown, all of FIG. When viewed from the appropriate orientation), the top, bottom, left, and right directions are parallel to the page, the front is the front direction perpendicular to the page, and the back is the back direction orthogonal to the page. To do.

  1 to 3, the sheet sticking device 10 applies a pressing force in a direction relatively approaching the wafer WF and the adhesive sheet AS, which are disposed to face each other in a predetermined sticking space SP3, thereby the wafer WF. This is an apparatus for attaching the adhesive sheet AS to the adherend surface WA, which includes a deformable first deformable member 21 and is located on the opposite side of the paste space SP3 with the first deformable member 21 interposed therebetween. By making the space SP1 at a higher pressure than the pasting space SP3, the contact means 20 for deforming the first deformable member 21 to abut the adhesive sheet AS on the adherend surface WA, and the deformable second deformable member 31. The second deformable member is made to have a higher pressure than the first space SP1 and the application space SP3 in the second space SP2 located on the opposite side of the first space SP1 with the second deformable member 31 in between. Deform 31 A pressing means 30 that applies a pressing force to the wafer WF and the adhesive sheet AS via the first deformation member 21, a support means 40 that can support the wafer WF, a first deformation member 21, a second deformation member 31, and a support means. Storage means 50 for storing 40.

  The abutting means 20 is provided so as to be deformable by rubber or resin provided in a substantially circular shape in plan view, and is a so-called electrostatic chuck function capable of holding the adhesive sheet AS on its lower surface by a Coulomb force of a voltage applying means (not shown). , A pressure reducing means 22 such as a pressure reducing pump and a vacuum ejector communicated with the first space SP1, a pressure sensor capable of detecting the pressure in the first space SP1, and a pressure detecting means 23 such as a load cell. And. The first deformable member 21 is configured to be easier to deform than the second deformable member 31. The decompression means 22 is provided in the first space SP1 so as to be able to introduce air.

  The pressing means 30 is provided so as to be deformable by rubber, resin, or the like provided in a substantially circular shape in plan view, and has a second deforming member 31 set to have a smaller radial dimension than the first deforming member 21, and a second space. A pressure reducing means 32 such as a pressure reducing pump and a vacuum ejector communicated with SP2 and a pressure sensor 33 capable of detecting the pressure in the second space SP2 and a pressure detecting means 33 such as a load cell are provided. The second deformable member 31 is a member that can withstand a higher pressure than the first deformable member 21. Further, the decompression means 32 is provided in the second space SP2 so as to be able to introduce the atmosphere.

  The support unit 40 is supported by a linear motion motor 41 as a driving device and an output shaft 41A of the linear motion motor 41, and is a so-called electrostatic that can hold the wafer WF on its upper surface by a Coulomb force of a voltage application unit (not shown). And a table 42 having a chuck function.

The accommodating means 50 supports the lower case 51 and the first and second deformable members 21 and 31 that are open upward and the support means 40 is disposed on the bottom surface, and closes the opening of the lower case 51. By doing so, the upper case 52 capable of forming the hermetically sealed application space SP3, the linear motor 53 as a driving device that supports the upper case 52 with its output shaft 53A, and a vacuum pump or vacuum communicated with the application space SP3 A pressure reducing means 54 such as an ejector and a pressure detecting means 55 such as a pressure sensor capable of detecting the pressure in the pasting space SP3 and a load cell are provided. The decompression means 54 is provided in the pasting space SP3 so as to be able to introduce air.
The upper case 52 is positioned within the first recess 52A and the first recess 52A set to a depth substantially the same as the thickness dimension of the first deformable member 21, and is substantially the same as the thickness dimension of the second deformable member 31. A second recess 52B set to a depth, the outer edge of the first deformable member 21 is supported on the bottom edge of the first recess 52A, and the outer edge of the second deformable member 31 is supported on the bottom edge of the second recess 52B. Has been. Thus, a first space SP1 is formed which is sealed by the upper surface of the first deformation member 21, the bottom surface of the first recess 52A, and the lower surface of the second deformation member 31, and the upper surface of the second deformation member 31 and the second recess 52B. A second space SP2 that is sealed with the bottom surface is formed. In addition, by setting it as the 2nd recessed part 52B set to the depth substantially the same as the thickness dimension of the 2nd deformation member 31, the bottom face of the 1st recessed part 52A and the lower surface of the 2nd deformation member 31 are located in the same plane. As a result, the surface of the first deformation member 21 is kept flat in a state where the first deformation member 21 is in contact with the bottom surface of the first recess 52A, and the first deformation member 21 is prevented from deteriorating. be able to.

In the sheet sticking apparatus 10 described above, a procedure for sticking the adhesive sheet AS to the wafer WF will be described.
First, as shown by a two-dot chain line in FIG. 1, with the upper and lower cases 52 and 51 separated from each other, the adhesive sheet AS is attached to the first deformable member 21 by a manual means or a conveying means (not shown) such as an articulated robot or a belt conveyor. When abutting against the lower surface, the abutting means 20 drives a voltage applying means (not shown) to hold the adhesive sheet AS by Coulomb force. Next, when the wafer WF is placed on the table 42 manually or by a transfer means (not shown), the support means 40 drives a voltage application means (not shown) to hold the wafer WF by a Coulomb force. Next, the accommodating means 50 drives the linear motor 53 to lower the upper case 52 to form a pasting space SP3 as shown by the solid line in FIG. Thereafter, the abutting means 20, the pressing means 30 and the accommodating means 50 drive the decompression means 22, 32 and 54 to decompress the first and second spaces SP1, SP2 and the application space SP3 at the same decompression rate, and detect each pressure. When it is detected by the means 23, 33 and 55 that the predetermined reduced pressure state (first pressure) is reached, the contact means 20, the pressing means 30 and the housing means 50 stop driving the pressure reducing means 22, 32 and 54. To do. Next, after the support means 40 drives the linear motion motor 41 and raises the table 42 to a predetermined position, the contact means 20 drives the decompression means 22 and gradually introduces the atmosphere into the first space SP1. Thus, the first space SP1 is set to a higher pressure than the pasting space SP3. As a result, the first deformable member 21 is deformed and, as shown by the solid line in FIG. 2, the center portion of the adhesive sheet AS is brought into contact with the center portion of the adherend surface WA of the wafer WF, and then the adhesive sheet AS is The surface is gradually brought into contact with the adherend surface WA toward the outside, and the entire adhesive sheet AS is brought into contact with the adherend surface WA as shown by a two-dot chain line in FIG. As a result, the sticking is performed while the air between the adhesive sheet AS and the adherend surface WA is expelled to the outside, thereby preventing air bubbles from being formed between the adhesive sheet AS and the adherend surface WA. can do. When the pressure detection means 23 detects that the pressure in the first space SP1 has reached a predetermined reduced pressure state (second pressure), the contact means 20 stops driving the pressure reduction means 22. At this time, the pressing unit 30 drives the decompression unit 32 and controls the pressure in the second space SP2 to be the second pressure based on the detection result of the pressure detection unit 33, while the accommodating unit 50 controls the decompression unit 54. Based on the detection result of the pressure detection means 55, it controls so that the pressure of sticking space SP3 may be maintained with a 1st pressure.

  Here, even if the pressure in the first space SP1 is made higher than the pressure in the sticking space SP3, the first deforming member 21 located outside the outer edge of the wafer WF only swells, so that it is sufficient for the adhesive sheet AS. It is impossible to apply a pressing force. Therefore, if the first deformable member 21 is made of a member that is difficult to deform (a high-strength member), the adhesive sheet AS can be sufficiently pressed against the wafer WF. In this case, the surface of the wafer WF or the adhesive sheet AS If unevenness is formed on the surface, the first deforming member 21 becomes difficult to deform following the unevenness, so that bubbles are formed between the wafer WF and the adhesive sheet AS, or the wafer WF is attacked. As a result, stress is applied to the wafer WF or the wafer WF is damaged.

  Next, the pressing unit 30 drives the decompression unit 32 to gradually introduce the atmosphere into the second space SP2, thereby making the second space SP2 at a higher pressure than the first space SP1 and the pasting space SP3. As a result, the second deformable member 31 is deformed, and the second deformable member 31 is brought into contact with the central portion of the first deformable member 21 as shown by the solid line in FIG. The member 31 is gradually brought into contact with the first deformation member 21 toward the outside thereof, and the entire adhesive sheet AS is pressed against the adherend surface WA as shown by a two-dot chain line in FIG. When the pressure detection means 33 detects that the pressure in the second space SP2 has reached a predetermined reduced pressure state (third pressure), the pressing means 30 stops driving the pressure reduction means 32. Thus, the adhesive sheet AS can be applied to the wafer WF with a sufficient pressing force, and the second deformable member 31 is made of a high-strength member that can withstand a third pressure higher than the second pressure. Even so, since the pressing is performed via the first deformable member 21 that can be easily deformed, the aggression on the wafer WF can be reduced. At this time, the contact means 20 drives the decompression means 22 and controls the pressure in the first space SP1 to be maintained at the second pressure based on the detection result of the pressure detection means 23, so that the outer edge of the wafer WF can be maintained. Also, the first deformation member 21 portion located outside is prevented from bulging and rupturing. In addition, in order to adjust the bonding surface of the adhesive sheet AS and the adherend surface WA, the pressing unit 30 drives the decompression unit 32 to raise and lower the pressure in the second space SP2 and perform the pressing operation by the second deformation member 31. Multiple times may be performed.

  When the entire adhesive sheet AS is pressed against the wafer WF by the pressing unit 30, after the contact unit 20 stops driving the voltage applying unit (not shown), the pressing unit 30 drives the decompression unit 32, and the second space SP <b> 2 is opened. Reduce pressure until second pressure is reached. Next, the abutting means and the pressing means 20 and 30 drive the decompression means 22 and 32 to decompress the first and second spaces SP1 and SP2 at the same decompression rate until the first pressure is reached. Thereafter, the abutting means 20, the pressing means 30 and the accommodating means 50 drive the decompression means 22, 32 and 54, and pressurize the first and second spaces SP1, SP2 and the pasting space SP3 at the same pressurization rate (the atmosphere is reduced). When the pressure detecting means 23, 33 and 55 detect that the atmospheric pressure is reached, the contact means 20, the pressing means 30 and the housing means 50 stop driving the decompressing means 22, 32 and 54. To do. Then, after the accommodating means 50 drives the linear motion motor 53 and raises the upper case 52, the support means 40 stops driving the voltage applying means (not shown), and the adhesive sheet AS is moved manually or by a conveying means (not shown). The affixed wafer WF is transferred to the next process, and thereafter the same operation as described above is repeated.

According to this embodiment, there are the following effects.
That is, the adhesive sheet AS is brought into contact with the adherend surface WA with a small pressing force by the abutting means 20, and then the adhesive sheet AS is pressed and pasted on the adherend surface WA with a large pressing force by the pressing means 30. In addition, it is possible to prevent the formation of bubbles between the wafer WF and securely adhere the adhesive sheet AS to the wafer WF.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described primarily with respect to particular embodiments, but may be configured for the above-described embodiments without departing from the scope and spirit of the invention. Various modifications can be made by those skilled in the art in terms of materials, quantity, and other detailed configurations. Therefore, the description limiting the shape, material, etc. disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such is included in this invention.

For example, the first deformation member 21 may be configured by a member (high strength member) that is less likely to be deformed than the second deformation member 31 or may be configured by a member having the same strength.
Further, the first and second deformable members 21 and 31 may be elastically deformable members, or members that do not completely or partially return to the original shape.
In addition, the material, shape, thickness, and size of the first and second deformable members 21 and 31 can be appropriately selected.
Further, the first deformable member 21 may be configured to be sandwiched between the upper and lower cases 52 and 51, and the first deformable member 21 may function as a packing for the upper and lower cases 52 and 51.
Further, the first deformation member 21 may be the same size as the second deformation member 31.
Further, the first deformation member 21 and the table 42 may be configured to hold the adhesive sheet AS and the wafer WF by suction, adhesion, mechanical chuck, or the like.

Further, as shown in FIG. 4A, the contact means 20 and the pressing means 30 are formed as a sealed first space SP1 and a second space SP2 sealed at a higher pressure than the first space SP1. In addition, the first space SP1 and the second space SP2 may be configured to have a higher pressure than the pasting space SP3 by decompressing the pasting space SP3 by the decompression unit 54. In this case, the support means 40 raises the table 42, and as shown in FIG. 4B, after the wafer WF and the adhesive sheet AS are brought into contact with each other by the first and second deformation members 21 and 31, What is necessary is just to press and stick. Further, if the first and second spaces SP1, SP2 are higher than the atmospheric pressure, the affixing space SP3 may be atmospheric pressure, the decompression means 54 and the pressure detection means 55 are not necessary, and the upper case 52 and lower case 51 do not need to make sticking space SP3 into sealed space.
Further, the contact means 20 and the pressing means 30 may be configured to control the pressure difference by applying pressure, or may be configured to control the pressure difference by combining pressure reduction and pressurization. If the contact means 20 and the pressing means 30 are provided so as to pressurize the first and second spaces SP1, SP2, the affixing space SP3 may be at atmospheric pressure, and the decompression means 54 or pressure detection means. 55, the lower case 51 may not be provided, and the upper case 52 and the lower case 51 may not form the pasting space SP3 as a sealed space. Further, if the contact means 20 and the pressing means 30 are provided so as to pressurize the first and second spaces SP1, SP2, the pasting space SP3 may be set to a pressure higher than the atmospheric pressure.
Further, the first pressure, the second pressure, and the third pressure can be arbitrarily set as long as the first and second deformable members 21 and 31 are deformed and the adhesive sheet AS can be brought into contact with the wafer WF.
Furthermore, instead of the decompression means 22, 32, 54, a configuration in which the first and second spaces SP1, SP2 and the pasting space SP3 are pressurized and decompressed by a fluid other than air, such as liquid or gel, may be employed.

  Further, the support means 40 may be configured not to be lifted or lowered by a driving device. Furthermore, when the wafer WF is supported by another apparatus, the support means 40 may not be provided in the sheet sticking apparatus of the present application.

  Further, the adhesive sheet AS may be a belt-like sheet that continues to the outside of the upper and lower cases 52 and 51, and is set between the upper and lower cases 52 and 51 by being fed out in the left-right direction. The configuration may be such that the affixed wafer WF is sent to the next step, or an appropriate cutting means for cutting the belt-like sheet affixed to the wafer WF into a predetermined shape may be employed.

Further, the material, type, shape, etc. of the adhesive sheet and adherend in the present invention are not particularly limited. For example, the adhesive sheet is a single layer having only an adhesive layer, one having an intermediate layer between the base sheet and the adhesive layer, and having three or more layers such as having a cover layer on the upper surface of the base sheet, Further, it may be a so-called double-sided adhesive sheet that can peel the base sheet from the adhesive layer, and the double-sided adhesive sheet has a single-layer or multi-layer intermediate layer, It may be a single layer or multiple layers without any. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. It should be noted that the adhesive sheet is replaced with functional and intended readings, for example, any shape such as a label for information description, a decorative label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, a recording layer forming resin sheet, etc. Any sheet, film, tape or the like can be attached to any adherend as described above.
Each means in the present invention is not limited in any way as long as it can perform the operation or function described for those means, and moreover, it is completely limited to the structure of only one embodiment shown in the above embodiment. is not. The abutting means includes a deformable first deformable member, and the first deformation is performed by setting the first space located on the opposite side of the sticking space across the first deformable member to a pressure higher than that of the sticking space. As long as the adhesive sheet can be brought into contact with the adherend surface by deforming the member, there is no limitation as long as it is within that range in light of the technical common sense at the time of filing (about other means) Will be omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 20 Contact means 21 1st deformation member 30 Pressing means 31 2nd deformation member SP1 1st space SP2 2nd space SP3 Pasting space AS Adhesive sheet WF Wafer (to-be-adhered body)
WA surface

Claims (3)

A sheet sticking device for sticking the adhesive sheet to the adherend surface of the adherend by applying a pressing force in a direction relatively approaching the adherend and the adhesive sheet disposed to face each other in a predetermined sticking space,
The first deformable member is provided with a deformable first deformable member, and a first space located on the opposite side of the paste space with the first deformable member interposed therebetween is set to a pressure higher than that of the paste space. Contact means for deforming and bringing the adhesive sheet into contact with the adherend surface;
By including a second deformable member that can be deformed, and making the second space located on the opposite side of the first space across the second deformable member higher than the first space and the pasting space, A sheet sticking apparatus comprising: a pressing unit that deforms the second deforming member to apply a pressing force to the adherend and the adhesive sheet through the first deforming member.   The sheet pasting device according to claim 1, wherein the first deformation member is configured to be easier to deform than the second deformation member. A sheet sticking method for sticking the adhesive sheet to the adherend surface of the adherend by applying a pressing force in a direction relatively approaching the adherend and the adhesive sheet placed opposite to each other in a predetermined sticking space,
The first space located on the opposite side of the sticking space with the deformable first deforming member interposed therebetween is set to a pressure higher than that of the sticking space, so that the first deforming member is deformed to the adherend surface. A step of contacting the adhesive sheet;
The second deformable member is deformed by setting the second space located on the opposite side of the first space with the deformable second deformable member between the first space and the pasting space. And applying a pressing force to the adherend and the adhesive sheet through the first deformable member.

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