JP5660821B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sticking method. More specifically, when sticking an adhesive sheet to an adherend such as a semiconductor wafer, the sticking is performed without interposing a space between the adhesive sheet and the adherend. The present invention relates to a sheet sticking apparatus and a sticking method that can be performed.

  Conventionally, a protective sheet for protecting the circuit surface is affixed to a semiconductor wafer (hereinafter sometimes simply referred to as a “wafer”), or a dicing tape or an adhesive sheet for die bonding is affixed to the back surface. It has been done.

Patent Document 1 discloses a pressing member having a curved surface in which a central portion projects relatively from the outer peripheral side as a member for applying a pressing force to the adhesive sheet so that no space is interposed between the wafer and the adhesive sheet. A configuration using is disclosed. This pressing member is fixed to the tip of the rod of the air cylinder, and when the adhesive sheet is stuck, the rod is extended to give a pressing force by the pressing member, thereby deforming the adhesive sheet into a convex shape and Attached gradually from the outside toward the outside.
In Patent Document 2, an elastic sheet is arranged in a case constituted by an upper case and a lower case to form an upper decompression chamber and a lower decompression chamber, and an adhesive sheet (adhesive sheet) is disposed above the elastic sheet. ) And the wafer, and after depressurizing the upper and lower decompression chambers, the lower decompression chamber is controlled so as to approach the atmospheric pressure, thereby deforming the elastic sheet into a convex shape and moving the adhesive sheet outward from the center of the wafer. The structure stuck toward is disclosed.

Japanese Patent No. 2945089 Japanese Patent Laid-Open No. 10-233430

  However, in the sheet affixing devices disclosed in Patent Documents 1 and 2, the adhesive sheet is deformed into a convex shape using a pressing member or an elastic sheet so that the adhesive sheet is directed outward from the center of the wafer. Therefore, there are inconveniences that the number of parts is increased and the apparatus is increased in size.

[Object of the invention]
An object of the present invention is to reduce the number of parts of the device itself, to reduce the size of the device, and to reliably adhere the adhesive sheet without interposing a space between the adhesive sheet and the adherend. It is in providing the sheet sticking apparatus and sticking method which can be performed.

To achieve the above object, the present invention provides a table for supporting an adherend having an annular convex portion on the outer peripheral side;
The apparatus has support means for disposing an adhesive sheet affixed so as to close the opening of the ring frame at a position facing the adherend, and is hermetically sealed so that the adherend can be accommodated with the adhesive sheet. A first case forming one space;
First pressure control means capable of controlling the pressure in the first space;
A second space sealed with the adhesive sheet is formed on the opposite side of the first space with the adhesive sheet interposed therebetween, and the adhesive sheet is sandwiched between the convex portions and the second space is placed in the second space. A second case capable of forming a sealed third space and forming a sealed fourth space in the first space;
Second pressure control means capable of controlling the pressure in the second space;
A pressing means for pressing and adhering the adhesive sheet to an adherend,
The support means includes a sheet support portion that supports the adhesive sheet inside the ring frame,
The first pressure control means and the second pressure control means mutually control the pressures of the first space and the second space, and relatively control the pressure of the second space compared to the pressure of the first space. with high pressure, the central portion of the adhesive sheet, the and is rotatable in the formation as the initial adhesive portion closest to the adherend, the fourth space by introducing air into the third space The configuration is such that it is extinguished by the atmospheric pressure in the third space .

  In the present invention, it is preferable that a contact means for bringing a central portion of the adherend into contact with the initial bonding portion is included.

  The first case may include a pressing unit that presses the adhesive sheet against the second case at a position outside the adherend.

The present invention also includes a step of supporting an adherend having an annular convex portion on the outer peripheral side;
An adhesive sheet affixed so as to close the opening of the ring frame is disposed at a position facing the adherend, and a sealed first space that can accommodate the adherend is formed with the adhesive sheet. And a process of
Forming a second space sealed with the adhesive sheet on the opposite side of the first space with the adhesive sheet sandwiched inside the ring frame;
Forming the third space sealed in the second space by sandwiching the adhesive sheet between the convex portions and forming the fourth space sealed in the first space;
By controlling the pressures of the first space and the second space mutually and making the pressure of the second space relatively higher than the pressure of the first space, the central portion of the adhesive sheet A step of forming an initial adhesive portion closest to the adherend,
And introducing the atmosphere into the third space to push the fourth space with the atmospheric pressure of the third space and extinguish it .

According to the present invention, the first and second pressure control means mutually control the pressures of the first and second spaces, so that the center part of the adhesive sheet forms the initial adhesive part closest to the adherend. Since it is provided, there is no need to provide a pressing member in the case as in Patent Document 1 or an elastic sheet for forming a convex portion as in Patent Document 2, and the apparatus can be reduced in the number of parts. Can be miniaturized. And since an adhesive sheet is affixed on a to-be-adhered body toward the outer side from a center part, an adhesive sheet can be reliably affixed without interposing a space between an adherend and an adhesive sheet.
In addition, in the case of a configuration including contact means, it is possible to reduce the amount of deformation when forming the initial adhesive portion on the adhesive sheet, and it can be applied without applying excessive tension to the adhesive sheet. Residual stress after sheet sticking can be reduced and warpage deformation of the adherend can be prevented.
Furthermore, by providing the pressing means, it is possible to ensure the sealing performance when the case is closed with the adhesive sheet interposed.
In addition, since the second case is provided so as to be able to form the third and fourth spaces corresponding to the adherend having the convex portion, the adhesive sheet can be reliably adhered to the inner peripheral surface of the convex portion. .
Note that in this specification, reduced pressure includes a vacuum.

The schematic sectional drawing of the sheet sticking apparatus which concerns on this embodiment. The schematic sectional drawing which shows the state which formed the initial stage adhesive part in the adhesive sheet. The schematic sectional drawing which shows the state by which the adhesive sheet was affixed on the to-be-adhered body under pressure reduction. The schematic sectional drawing which shows the state by which the adhesive sheet was affixed on the to-be-adhered body under atmospheric pressure.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  In FIG. 1, a sheet sticking apparatus 10 can accommodate a wafer W with a table 11 that supports a wafer W as an adherend and an adhesive sheet S at a position facing the wafer W, and the adhesive sheet S. A lower case (first case) 13 that forms a sealed first space C1, and a pressure in the first space C1 can be controlled, and is configured by a decompression pump, an air regulator, a solenoid valve, and the like (not shown). An upper case (second case) 12 that forms a second space C2 (see FIG. 2) sealed with the pressure control means P1 and the adhesive sheet S on the opposite side of the first space C1 with the adhesive sheet S interposed therebetween. The pressure of the second space C2 can be controlled, and the wafer W is brought into contact with the adhesive sheet S and the second pressure control means P2 constituted by a decompression pump, an air regulator, an electromagnetic valve, etc. (not shown). Is constituted by a contact means 16. The second pressure control means P2 also functions as a pressing means. Here, as the wafer W in the present embodiment, a wafer having an annular convex portion W1 formed on the outer periphery by back surface grinding is employed.

  The table 11 is formed so as to be able to hold the wafer W on the upper surface side through holding means (not shown). The table 11 is fixed to the upper end of the output shaft 21 of the linear motion motor 20 as a driving device which is a contact means 16 supported in the lower case 13, and can be moved up and down by the advancement and retraction of the output shaft 21. . The direct acting motor 20 also functions as a pressing unit.

  The upper case 12 is formed of a flat plate having a circular shape in plan view, and is provided so as to be movable up and down via a driving device (not shown). A pipe 23 penetrating in the thickness direction is provided at the center of the upper case 12, and a pipe 25 connected to the pipe 23 is connected to the second pressure control means P2. An annular outer elastic member 26 made of an elastic body is disposed on the outer peripheral edge of the lower surface of the upper case 12, and can be disposed on a concentric circle inside thereof at a position facing the convex portion W <b> 1 of the wafer W. An inner elastic member 27 made of an elastic body is disposed. The lower surfaces of the outer elastic member 26, the inner elastic member 27, and the upper case 12 are provided so as to be flush with each other, but the lower surface position of each elastic member 26, 27 is relative to the lower surface position of the upper case 12. You may comprise so that it may project in the up-down direction relatively.

  The lower case 13 is provided in an open top cylindrical shape with a bottom, and has support means 15. The bottom wall 13A of the lower case 13 is provided with a pipe 31 penetrating in the thickness direction, and a pipe 33 connected to the pipe 31 is connected to the first pressure control means P1.

  The support means 15 supports a frame support portion 35 for supporting the ring frame RF whose opening is closed by the adhesive sheet S, and an adhesive sheet S portion outside the outer periphery of the wafer W and inside the ring frame RF. It is comprised by the sheet | seat support part 36. FIG. In the present embodiment, the frame support part 35 is constituted by a peripheral wall 13B constituting the lower case 13, and is provided with a holding means (not shown) that positions and holds the ring frame placed on the upper surface thereof. The sheet support portion 36 is a pressing body made of a cylindrical body 38 disposed on the inner peripheral side of the frame support portion 35 and an elastic body disposed on the upper end surface of the cylindrical body 38 and having the same shape as the outer elastic member 26. It is comprised with the receiving side elastic member 40 as a means. The receiving-side elastic member 40 is set such that when the ring frame RF is placed on the upper surface of the frame support portion 35, the upper surface thereof is at the same height as the upper surface of the ring frame RF. The upper surface of the receiving side elastic member 40 is formed as a non-adhesion treated surface coated with a fluororesin or the like so that the adhesive of the adhesive sheet S does not adhere. Moreover, rubber | gum, resin, etc. can be illustrated as an elastic body which comprises the outer side, inner side elastic members 26 and 27, and the receiving side elastic member 40. FIG. Furthermore, a driving device that relatively raises and lowers the frame support portion 35 and the seat support portion 36 according to the thickness of the ring frame RF may be provided.

  Next, the sheet sticking method in this embodiment is demonstrated, referring also to FIG. 2 thru | or FIG.

  As shown in FIG. 1, in an open state in which the upper case 12 is separated from the lower case 13, the wafer W is placed on the table 11 via a transfer means (not shown), and the wafer is held by a holding means (not shown). Hold W. Thereafter, the ring frame RF whose opening is closed by the adhesive sheet S is placed on the frame support 35 by a conveying means (not shown).

  Next, when the upper case 12 is lowered so that the outer elastic member 26 sandwiches the adhesive sheet S from above and below with the receiving elastic member 40, the upper open portion of the lower case 13 is closed and sealed by the adhesive sheet S. A first space C1 is formed, and a second space C2 sealed by the upper case 12 and the adhesive sheet S is formed. Thereafter, the first and second spaces C1 and C2 are depressurized at the same pressure reduction rate via the first and second pressure control means P1 and P2, and the first and second spaces C1 and C2 are finally the same. A predetermined internal pressure state is set. Then, the atmosphere is introduced only into the second space C2 via the second pressure control means P2, and the pressure in the second space C2 is set to be relatively higher than the pressure in the first space C1. As shown in FIG. 2, the adhesive sheet S swells downward, and the central part thereof is formed as the initial adhesive part S <b> 1 closest to the wafer W. Note that only the first space C1 is further depressurized via the first pressure control means P1, or the atmosphere is introduced only into the second space C2 via the second pressure control means P2 and the first pressure control means P1. In addition, by further reducing only the pressure in the first space C1, the pressure in the second space C2 is set to be relatively higher than the pressure in the first space C1, thereby forming the initial bonding portion S1. Also good.

  After the initial bonding portion S1 is formed, when the table 11 is moved up by driving the linear motor 20 as shown by a two-dot chain line in FIG. When S1 comes into contact and then the table 11 is raised, as shown in FIG. 3, the adhesive sheet S is sandwiched between the convex portion W1 of the wafer W and the inner elastic member 27, and the rise of the table 11 is stopped. Let At this time, a third space C3 is formed in the second space C2 and sealed between the adhesive sheet S and the inner side of the inner elastic member 27, and in the first space C1, A sealed fourth space C4 is formed between the adhesive sheet S and the convex portion W1 of the wafer W. After that, when the atmosphere is introduced into the third space C3 so that the third space C3 gradually becomes atmospheric pressure via the second pressure control means P2, as shown in FIG. The space C4 disappears when pushed by the atmospheric pressure of the third space C3. At this time, the linear motion motor 20 and the second pressure control means P2 function as pressing means.

  Thereafter, when the atmosphere is introduced into the first space C1 so that the first space C1 gradually becomes atmospheric pressure via the first pressure control means P1, and the first space C1 becomes atmospheric pressure. Then, the upper case 12 is raised. Thereafter, the wafer W attached to the adhesive sheet S is taken out by a transfer means (not shown) and transferred to another process, and thereafter the same operation as described above is repeated.

  Therefore, according to such an embodiment, since the initial adhesive portion S1 is formed on the adhesive sheet S and the adhesive sheet S is attached to the wafer W, a conventionally used pressing member, elastic sheet, or the like is used. This eliminates the need to reduce the number of parts of the device itself and to reduce the size of the device. In addition, since the adhesive sheet S can be stuck outward from the central portion of the wafer W by the initial adhesive portion S1, the adhesive sheet S can be securely attached without interposing a space between the adhesive sheet S and the wafer W. Can be affixed.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

For example, in the embodiment described above, the wafer W is a shape with a convex portion W1 in the outer periphery, it may be directed to a wafer having a bump as electrodes.

  Further, the upper case 12 and the lower case 13 may be arranged upside down or may be arranged to open and close in the horizontal direction. Further, in the above embodiment, the upper case 12 can be moved up and down, but the lower case 13 can be moved up and down, and the upper and lower cases 12 and 13 can be moved respectively. In addition, the outer elastic member 26 and the inner elastic member 27 may be configured as an integral member, or an elastic body may be provided on the entire lower surface side of the upper case 12.

Furthermore, the adherend in the present invention is not limited to the semiconductor wafer W, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. It may be a wafer or a compound semiconductor wafer.
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

10 Sheet pasting device 11 Table 12 Upper case (second case)
13 Lower case (first case)
16 Contacting means 20 Linear motion motor (pressing means)
40 Receiving side elastic member (pressing means)
C1 1st space C2 2nd space C3 3rd space C4 4th space P1 1st pressure control means P2 2nd pressure control means (pressing means)
S Adhesive Sheet S1 Initial Adhesion W Semiconductor Wafer (Substrate)
W1 Convex

Claims (2)

A table for supporting an adherend having an annular protrusion on the outer peripheral side;
The apparatus has support means for disposing an adhesive sheet affixed so as to close the opening of the ring frame at a position facing the adherend, and is hermetically sealed so that the adherend can be accommodated with the adhesive sheet. A first case forming one space;
First pressure control means capable of controlling the pressure in the first space;
A second space sealed with the adhesive sheet is formed on the opposite side of the first space with the adhesive sheet interposed therebetween, and the adhesive sheet is sandwiched between the convex portions and the second space is placed in the second space. A second case capable of forming a sealed third space and forming a sealed fourth space in the first space;
Second pressure control means capable of controlling the pressure in the second space;
A pressing means for pressing and adhering the adhesive sheet to an adherend,
The support means includes a sheet support portion that supports the adhesive sheet inside the ring frame,
The first pressure control means and the second pressure control means mutually control the pressures of the first space and the second space, and relatively control the pressure of the second space compared to the pressure of the first space. with high pressure, the central portion of the adhesive sheet, the conjunction is provided to be formed as an initial adhesive portion closest to the adherend, the fourth space by introducing air into the third space A sheet sticking device, wherein the sheet sticking device is pushed and extinguished at atmospheric pressure in the third space . A step of supporting an adherend having an annular convex portion on the outer peripheral side;
An adhesive sheet affixed so as to close the opening of the ring frame is disposed at a position facing the adherend, and a sealed first space that can accommodate the adherend is formed with the adhesive sheet. And a process of
Forming a second space sealed with the adhesive sheet on the opposite side of the first space with the adhesive sheet sandwiched inside the ring frame;
Forming the third space sealed in the second space by sandwiching the adhesive sheet between the convex portions and forming the fourth space sealed in the first space;
By controlling the pressures of the first space and the second space mutually and making the pressure of the second space relatively higher than the pressure of the first space, the central portion of the adhesive sheet A step of forming an initial adhesive portion closest to the adherend,
Introducing the atmosphere into the third space to push and extinguish the fourth space with the atmospheric pressure of the third space .

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