JP6167619B2 - Package molded body for light emitting device and light emitting device using the same - Google Patents

Description

  The present invention relates to a package molded body for a light emitting device and a light emitting device using the same.

  In a light-emitting device using a frame insert type resin package, heat generated from the light-emitting element is easily stored in the resin package, and thus it is necessary to improve heat dissipation. Further, in the frame insert type resin package in which the leads are exposed from the back surface of the package, the leads are easily peeled from the resin molded body. Therefore, it is required to improve the adhesion between the resin molded body and the lead.

As a resin package with improved heat dissipation, by exposing the leads to the back side of the molded resin, heat generated by the light-emitting elements placed in the recesses of the package can be efficiently released to the mounting substrate via the leads. Is known (for example, Patent Document 1).
As a configuration for improving the adhesion between the resin molded body and the lead, the metal plate is provided with a depression along the vertical side (notch on the side) and a depression along the horizontal bottom surface (bottom depression). It is known that a resin molded body is held on a lead by covering the dents with a resin molded body (for example, Patent Document 2).
Light emitting devices using these resin packages are mounted on a mounting substrate using a solder paste.

JP 2008-251937 A JP 2003-110145 A JP 2006-222454 A JP 2010-199253 A International Publication No. 2008/081794

  When mounting the light emitting device, the solder and solder flux contained in the solder paste are melted by reflow. The solder flux is a flux component that is generally mixed with solder in order to improve the wettability of the solder. This solder flux has a property of easily spreading in a narrow gap. For this reason, if the boundary between the lead and the resin molded body is exposed on the mounting surface of the package, the flux may enter from the boundary and spread along the boundary surface between the lead and the resin molded body. If the solder flux reaches the inside of the recess of the resin package, the solder flux absorbs light from the light emitting element, which may reduce the light emission intensity of the light emitting device.

The package of Patent Document 1 has a short “interface between the lead and the resin molded body (intrusion path of solder flux)” between the mounting surface (back surface) of the resin package and the recess of the resin molded body. . Therefore, there is a high possibility that the solder flux reaches the recess when the light emitting device is mounted.
In the package of Patent Document 2, in the first form in which the leads are exposed from the package (for example, FIG. 3 and FIG. 6 of Patent Document 2), the boundary between the resin molded body and the side cutout is the package mounting surface ( Exposed on the back). The length of the solder flux intrusion path from the back surface of the resin package to the lead surface is short. Therefore, similarly to the cited document 1, there is a high possibility that the solder flux reaches the recess when the light emitting device is mounted.
Further, in the package of Patent Document 2, in the second form in which the leads are covered with the package (for example, FIG. 5 of Patent Document 2), the heat dissipation is low.

  Therefore, an object of the present invention is to provide a package molded body that can effectively suppress the penetration of solder flux into the recess of the package molded body and has excellent heat dissipation, and a light emitting device using the package molded body.

The molded package of the present invention is
In a package molded body comprising a resin molded body having a recess for housing a light emitting element, and a lead disposed at the lower part of the resin molded body,
A part of one surface of the lead is exposed from the bottom surface of the concave portion of the resin molded body, the other surface is exposed from the back surface of the resin molded body, and the entire inner surface is filled with resin filled inside. And a lead recess that is covered,
A notch or a through hole is formed from the one surface to the other surface,
The notch or the first end of the through hole on the center side of the recess in the other surface is located in the lead recess and covered with the resin.

  The package molded body of the present invention has a notch on the other surface or a first end on the light emitting element side of a through-hole (notch, etc.) located in the lead recess and covered with a resin so that the notch etc. Intrusion of solder flux from the first end can be suppressed. In the package molded body of the present invention, since the other surface of the lead is exposed from the back surface of the resin molded body, the heat from the light emitting element mounted on one surface of the lead is efficiently radiated to the outside. be able to.

Moreover, the light emitting device of the present invention includes a package molded body according to the present invention,
A light emitting element that is housed in a recess provided in the resin molded body of the package molded body and is placed on one surface of the lead exposed from the bottom surface of the recess;
A sealing resin for sealing the concave portion of the light emitting element and the resin molded body;
Is included.

  Since the light emitting device of the present invention uses a package molded body that is excellent in heat dissipation and in which solder flux does not easily enter, a light emitting device that has excellent heat resistance and high light emission intensity can be obtained.

  According to the package molded body and the light emitting device of the present invention, the penetration of the solder flux into the recess can be effectively suppressed, and the heat from the light emitting element can be efficiently radiated.

1 is a light-emitting device according to Embodiment 1, in which FIG. 1A is a top view and FIG. 1B is a cross-sectional view taken along a line II in FIG. FIG. 2A is a top view, and FIGS. 2B and 2C are bottom views, illustrating a package molded body according to Embodiment 1. FIG. 3A is a cross-sectional view taken along line AA in FIG. 2, and FIG. 3B is a cross-sectional view taken along line BB in FIG. 4A is a cross-sectional view taken along line CC in FIG. 2A, and FIG. 4B is a cross-sectional view taken along line DD in FIG. 2A. 5A and 5B are partially enlarged top views of the package molded body according to Embodiment 1. FIG. 4 is a partially enlarged top view of the package molded body according to Embodiment 1. FIG. 3 is a top view of the package molded body according to Embodiment 1. FIG. FIGS. 8A and 8B are schematic bottom views of leads used in the package molded body according to Embodiment 1. FIG. FIGS. 9A and 9B are schematic cross-sectional views for explaining the method for manufacturing the light emitting device according to the first embodiment.

<Embodiment 1>
As shown in FIG. 1, a light emitting device 50 according to the present embodiment includes a package molded body 10 including at least one lead (two leads 20 and 30 in FIG. 1) and a resin molded body 11, a light emitting element 40, and the like. The sealing resin 52 is included.
The light emitting element 40 is housed in the recess 12 provided in the resin molded body 11 of the package molded body 10, and is placed on the surface 21 of the lead (first lead 20 in FIG. 1) exposed from the bottom surface 121 of the recess 12. . The light emitting element 40 includes a pair of electrodes, and one electrode and the first lead 20 and the other electrode and the second lead 30 are electrically connected by a bonding wire BW.
The sealing resin 52 seals the concave portion 12 of the resin molded body 11 in which the light emitting element 40 is accommodated, and protects the light emitting element 40 from the external environment.

As shown in FIGS. 2 to 4, the package molded body 10 of the present embodiment has an elongated shape in one direction (Ld direction), and is disposed at the resin molded body 11 and the lower part of the resin molded body 11. In addition, at least one lead (in this embodiment, two leads 20 and 30) is included.
The resin molded body 11 has a concave portion 12 for housing the light emitting element on the upper surface, and the concave portion 12 is surrounded by a side wall 13.

In the present embodiment, the lead is composed of the first lead 20 and the second lead 30.
A part of one surface (surface 21) of the first lead 20 is exposed from the bottom surface 121 of the recess 12 of the resin molded body 11. Further, the other surface (back surface 22) of the first lead 20 has an exposed portion 221 exposed from the back surface 14 of the resin molded body 11 and a lead recess 24. The lead recess 24 is filled with a resin 27, and the entire inner surface of the lead recess 24 is covered with the resin 27.
Since the back surface 22 of the first lead 20 is exposed from the back surface 14 of the resin molded body 11, the heat generated in the light emitting element 40 is transmitted from the front surface 21 of the first lead 20 to the back surface 22, and from the back surface 22 to the outside ( For example, heat can be efficiently radiated to a mounting substrate on which the light emitting device is mounted.

Similar to the first lead 20, one surface (front surface 31) of the second lead 30 is partially exposed from the bottom surface 121 of the recess 12 of the resin molded body 11, and the other surface (back surface 32) is the lead. And a recess 34. The inner surface of the lead recess 34 is covered with a resin 37.
The first and second leads 20 and 30 are spaced from each other, and the space between them is filled with the resin molded body 11.

  As shown in FIGS. 1 and 3 and the like, in the present embodiment, the first and second leads 20 and 30 have a flat plate shape. The first and second leads 20 and 30 are not substantially bent. That is, one surface (surfaces 21 and 31) of the first and second leads 20 and 30 is substantially flat unless a groove (for example, a surface groove described later) that is intentionally formed is not taken into consideration. Further, the other surfaces (back surfaces 22 and 32) of the first and second leads 20 and 30 are substantially flat unless the intentionally formed recesses (for example, the lead recesses 24 and 34) are taken into consideration. For example, the portion on the surface 21 of the first lead 20 where the light emitting element 40 is placed is substantially flush with the portion of the surface 21 of the first lead 20 that is located immediately above the lead recess 24. With this configuration, the package molded body 10 can be formed thin. In addition, the heat dissipation path from the light emitting element 40 via the first and second leads 20 and 30 can be easily shortened, and the heat generated in the light emitting element 40 can be efficiently dissipated.

  In the present embodiment, the first lead 20 is formed with a notch 25a extending from the front surface 21 to the back surface 22 along two opposing sides extending in the Ld direction. As shown in FIG. 2, in the present embodiment, the notches 25a have a substantially rectangular shape and are formed on both two sides in the Ld direction. Such a notch 25a can be advantageous when the resin molded body 11 is molded. For example, the molten resin for the resin molded body 11 can be injected from the position of the lead recess 24 (described later). At this time, the molten resin flows from the lead recess 24 toward the notch 25a of the first lead 20. It flows laterally along the back surface 22. Further, a part of the molten resin that has flowed into the surface 21 side of the first lead 20 through the notch 25 a flows in the lateral direction along the surface 21. Thus, in the notch 25a, the molten resin tends to flow along the front surface 21 and the back surface 22 of the first lead 20, so that there is no or little defect (gap) between the first lead 20 and the resin molded body 11. The package molded body 10 can be obtained.

The notch 25a is formed so that at least a part thereof is located below the side wall 13 of the resin molded body 11. Thereby, the notch 25 a can be filled with a part of the resin molded body 11.
The notch 25a is effective for increasing the bonding force between the first lead 20 and the resin molded body 11 by the notch 25a. When the notch 25a is provided in the first lead 20, the length of the outer periphery of the first lead 20 can be increased. And the contact area of the side surface 28 (FIG. 4) of the 1st lead | read | reed 20 and the resin molding 11 can be increased by filling the notch 25a with a part of resin molding 11. FIG. Thereby, the coupling force between the first lead 20 and the resin molded body 11 is increased by the notch 25a.

  Of the end portions of the notch 25a on the back surface 22, the end portion located on the center side (the light emitting element 40 side) of the recess 12, in other words, the end portion closest to the light emitting element 40 in the longitudinal direction Ld ( The first end 251 b) is located in the lead recess 24 and is covered with the resin 27. Accordingly, the first end 251b (on the back surface 22 side) of the notch 25a is not exposed from the back surface 14 of the resin molded body 11, so that when the light emitting device is reflowed, the first end 251b and the resin molded body 11 are not exposed. It is possible to suppress the solder flux from entering from the boundary.

  In addition, there is a possibility that the solder flux enters from the boundary 241 between the lead recess 24 and the resin 27 on the back surface 22 of the first lead 20. However, in order for the solder flux to penetrate from the boundary 241 to the recess 12, the boundary 241 between the lead recess 24 and the resin 27 passes through the boundary surface between the lead recess 24 and the resin 27, and further, the notch 25a and the resin molded body. 11, it is necessary to pass through a “solder flux penetration path” to the boundary 251 a between the notch 25 a and the resin molded body 11 on the surface 21 side of the first lead 20 through the boundary surface with the first lead 20 (FIG. 3B. )). That is, the first end portion 251b on the back surface 22 side of the notch 25a is positioned in the lead recess 24 and covered with the resin 27, so that the solder flux intrusion path can be made longer than the conventional one. Thereby, it is possible to prevent or suppress the solder flux from entering the recess 12.

  The resin 27 filled in the lead recesses 24 is preferably continuous from the back surface 14 of the resin molded body 11. As an example, the resin 27 filled in the lead recess 24 may be formed integrally with the resin molded body 11. For example, the resin 27 may be formed as a part of the resin molded body 11 and the resin 27 may be connected to the resin molded body 11. That is, the resin molded body 11 is bonded to the front surface 21, the side surface 28, and the back surface 22 of the first lead 20. Thereby, the coupling | bonding force of the 1st lead | read | reed 20 and the resin molding 11 can be raised.

As another example, the resin 27 can be extended in the width direction (Wd direction) of the first lead 20 (FIG. 4B). Specifically, the lead recess 24 is provided over the entire Wd direction of the first lead 20, and the inner surface of the lead recess 24 is covered with the resin 27. As is clear from FIG. 4B, the first lead 20 is surrounded by the resin 27 and the resin molded body 11 except for a portion exposed from the bottom surface 121 of the recess 12. Therefore, the bonding force between the first lead 20 and the resin molded body 11 can be further increased.
The light emitting element 40 is positioned between the notch 25a and the first edge 26 of the first lead 20 (the edge facing the second lead 30), so that the light emitting element 40 is directly below the mounting position of the light emitting element 40. It is possible to design so that the resin 27 is not disposed on the surface. In other words, since the back surface 22 of the first lead 20 can be exposed from the back surface 14 of the resin molded body 11 immediately below the mounting position of the light emitting element 40, the heat generated in the light emitting element 40 is generated by the first lead 20. It is possible to efficiently dissipate heat from the back surface 22.

Similar to the first lead 20, the second lead 30 is also formed with a notch 35a extending from the front surface 31 to the back surface 32 along two opposing sides extending in the Ld direction. The notch 35 a is formed so that at least a part thereof is positioned below the side wall 13 of the resin molded body 11, and the notch 35 a is filled with a part of the resin molded body 11 without a gap. Thereby, the binding force between the second lead 30 and the resin molded body 11 is increased.
Similarly to the first lead 20, the end portion (first end portion 351 b) located on the center side (light emitting element 40 side) of the recess 12 in the notch 35 a on the back surface 22 is inside the lead recess 34. And may be covered with the resin 37. As a result, the first end portion 351b of the notch 35a is not exposed from the back surface 14 of the resin molded body 11. Therefore, when the light emitting device is reflowed, the solder flux from the boundary between the first end portion 351b and the resin molded body 11 is obtained. Can be prevented from entering.

In addition, since the light emitting element 40 is not mounted on the second lead 30, it is considered that there is little adverse effect due to the solder flux entering the recess 12 of the resin molded body 11. Therefore, for the second lead 30, the first end portion 351 b (on the back surface 32 side) of the notch 35 a may be exposed from the back surface 14 of the resin molded body 11 without providing the lead recess 34 and the resin 37.
Moreover, when providing the lead recessed part 34 and the resin 37 in the back surface 32 of the 2nd lead 30, it can provide in the whole directly under the recessed part 12 of the resin molding 11 (FIG.2 (b), FIG.3 (b)). . That is, the back surface 32 of the second lead 30 may not be exposed from the back surface 14 of the resin molded body 11 immediately below the concave portion 12 of the resin molded body 11. This is because the light emitting element 40 is not placed on the second lead 30, and it is not necessary to radiate heat from the back surface 32 of the second lead 30 to the outside. Note that the back surface 32 of the second lead 30 may be exposed for energization with the external terminal.

Similarly to the first lead 20, the resin 37 filled in the lead recess 34 may be formed integrally with the resin molded body 11. For example, the resin 37 may be formed as a part of the resin molded body 11 and the resin 37 may be connected to the resin molded body 11. Thereby, the coupling | bonding force of the 2nd lead | read | reed 30 and the resin molding 11 can be raised.
Further, the resin 37 can be extended in the width direction (Wd direction) of the second lead 30. Specifically, the lead recess 24 is provided over the entire Wd direction of the second lead 30, and the resin 27 is filled therein. Similar to the first lead 20 shown in FIG. 4B, the second lead 30 is surrounded by the resin 37 and the resin molded body 11 except for a portion exposed from the bottom surface 121 of the recess 12. Therefore, the bonding force between the second lead 30 and the resin molded body 11 can be further increased.

  As shown in FIG. 3B and FIG. 5A, on the surface 21 side of the first lead 20, the first end 251a of the notch 25a is exposed at the bottom surface 121 of the recess 12 of the resin molded body 11, The second end 252a (the end facing the first end 251a) of the notch 25a may be covered with the side wall 13. That is, as shown in FIG. 5A, a part (part 25e) of the resin molded body 11 filled in the notch 25a is exposed from the bottom surface 121 of the recess 12. The portion 25e is bonded to a sealing resin 52 (FIG. 7B) described later when the light emitting device 50 is manufactured. Here, the sealing resin 52 has a higher adhesive force to the resin molded body 11 than the first lead 20. Therefore, the bonding force between the sealing resin 52 and the package molded body 10 can be increased by bonding the sealing resin 52 and the portion 25e.

When it is difficult for the solder flux to reach the first end 251a (on the surface 21 side) of the notch 25a, or when the distance between the first end 251a and the light emitting element 40 is large (if the adverse effect of the solder flux is low) When it is estimated, it is preferable to expose a part of the notch 25a from the recess 12 of the resin molded body 11 as shown in FIG.
Since the first lead 20 is narrow at the position where the notch 25a is formed, the strength locally decreases. Therefore, it is preferable to reinforce the narrow width portion of the first lead 20 by covering the second end 252a of the notch 25a with the side wall 13 of the resin molded body 11.

On the other hand, as shown in FIG. 5B, the entire notch 25 a may be covered with the side wall 13 of the resin molded body 11. On the surface 21 side of the first lead 20, the first end 251 a (on the surface 21 side) of the notch 25 a is covered with the resin molded body 11, so that from the first end 251 a to the recess 12 of the resin molded body 11. The solder flux penetration path can be lengthened by the length. Therefore, it is possible to suppress the solder flux from entering the recess 12 of the resin molded body 11. Further, the entire narrow portion of the first lead 20 has an effect of being reinforced by the side wall 13 of the resin molded body 11.
When the solder flux easily reaches the first end 251a on the surface 21 side of the notch 25a, or when the distance between the first end 251a on the surface 21 side and the light emitting element 40 is short (if the adverse effect of the solder flux is high) When estimated, it is preferable to cover the entire notch 25a with the side wall 13 of the resin molded body 11 as shown in FIG.

For the notch 35a of the second lead 30, the first end 351a (on the front surface 31 side) of the notch 35a should be exposed or not exposed for the same reason as the first lead 20. There is.
For example, when the solder flux hardly reaches the first end 351a of the notch 35a, or when the distance between the first end 351a and the light emitting element 40 is large (when it is estimated that the adverse effect of the solder flux is low). For this, it is preferable to expose a part of the notch 35 a from the recess 12 of the resin molded body 11.
On the other hand, when the solder flux easily reaches the first end portion 351a of the notch 35a or when the distance between the first end portion 351a and the light emitting element 40 is short (when the adverse effect due to the solder flux is estimated to be high). The entire notch 35 a is preferably covered with the side wall 13 of the resin molded body 11.

  In the present embodiment, the shapes of the notches 25a and 35a are substantially rectangular, but can be any shape such as a polygonal shape or a partial circular shape (for example, a semicircle). Further, in the present embodiment, the notches 25a and 35a are formed on both of the two sides extending in the Ld direction, but may be formed on only one of the sides.

  As a modification, a through hole 25b can be provided as shown in FIG. 6 instead of the notch 25a of the first lead 20 of FIGS. The first lead 20 in which the through hole 25b is formed is suitable for the case where it is desired to maintain the strength of the first lead 20 because the local strength is less likely to decrease compared to the notch 25a. On the other hand, when there is a reason why it is difficult to form the through hole 25b, such as when it is difficult to form the through hole 25b in a proper position because the width (the dimension in the Wd direction) of the first lead 20 is narrow, the notch 25a Is more preferable.

Similarly to the notch 25a, of the end portions of the through holes 25 on the back surface of the first lead 20, the end portion (first end portion 251b) located on the center side (light emitting element 40 side) of the recess 12 is It is located in the lead recess 24 and is covered with resin. Accordingly, the first end 251b (on the back surface 22 side) of the through-hole 25 is not exposed from the back surface 14 of the resin molded body 11, so that when the light emitting device is reflowed, the first end 251b and the resin molded body 11 are exposed. It is possible to suppress the solder flux from entering from the boundary.
Further, since the first end portion 251b on the back surface 22 side of the through hole 25 is positioned in the lead recess 24 and covered with resin, the solder flux intrusion path can be made longer than in the conventional case. Can be prevented from entering into the recess 12.

Further, for the same reason as the notches 25a and 35a, there are cases where it is better to expose the first end 251b on the back surface 22 side of the through hole 25 and cases where it is better not to expose it.
For example, when the solder flux is difficult to reach the first end 251a on the surface 21 side of the through-hole 25, or when the distance between the first end 251a on the surface 21 side and the light emitting element 40 is large (depending on the solder flux). When the adverse effect is estimated to be low), it is preferable to expose a part of the through hole 25 from the recess 12 of the resin molded body 11.
On the other hand, when the solder flux easily reaches the first end 251a on the surface 21 side of the through hole 25, or when the distance between the first end 251a and the light emitting element 40 is short (it is estimated that the adverse effect of the solder flux is high. In the case), it is preferable to cover the entire through hole 25 with the side wall 13 of the resin molded body 11.

  In the present embodiment, the shape of the through hole 25 is an ellipse, but may be an arbitrary shape such as a true circle or a polygon (such as a triangle or a rectangle).

  Although not shown, the second lead 30 can also be provided with a through hole similar to the through hole 25b instead of the notch 35a.

From the viewpoint of heat dissipation of the first lead 20, it is preferable that the exposed area where the back surface 22 of the first lead 20 is exposed from the back surface 22 of the resin molded body 11 is wide. On the other hand, from the viewpoint of preventing the solder flux from entering from the notch 25a, it is preferable that at least the first end 251b (on the back surface 22 side) of the notch 25a is not exposed from the back surface 22 of the resin molded body 11.
Therefore, as shown in FIG. 7, the distance y from the first edge 26 of the first lead 20 to the edge 241 on the center side (light emitting element 40 side) of the recess 12 of the lead recess 24 is It is preferably 50% to 80% with respect to the distance z from the first edge portion 26 to the first end portion 251b of the notch 25a. When this ratio is less than 50%, the lead recess 24 and the resin 27 are provided immediately below the light emitting element 40, and thus heat dissipation may be reduced. Further, when this ratio exceeds 80%, only the very vicinity of the first end 251b of the notch 25a is covered with the resin 27, and therefore the effect of preventing the solder flux from entering from the first end 251b. May be reduced.

Further, from the viewpoint of heat dissipation and solder flux prevention, the dimensions of the respective parts shown in FIG. 7 can be set to the following ranges.
From the edge 241 of the lead recess 24, the length _{x 1} to the first end portion 251b of the notch 25a is preferably a 0.1Mm～1.4Mm. When the length x _{1 is} smaller than 0.1 mm, the solder flux intrusion path cannot be made sufficiently long, and the solder flux easily enters from the first end portion 251b. If the length x ₁ > 1.4 mm, the heat dissipation is reduced.
Longitudinal Ld length _{x 2} of the lead recess 24 is preferably a 0.4～1.6Mm. If the length x ₂ <0.4 mm, the adhesion between the first lead 20 and the resin molded body 11 may be weakened. If the length x ₂ > 1.6 mm, the heat dissipation is reduced.

Furthermore, from the viewpoint of the strength of the first lead 20, the dimensions of the portions shown in FIGS. 4 and 7 can be set in the following ranges.
The plate thickness 24t of the first lead 20 at the position where the lead recess 24 is formed is preferably 25% to 60% with respect to the plate thickness 20t of the first lead 20 (FIG. 4). When this ratio is less than 25%, the strength of the first lead 20 at the position where the lead recess 24 is formed becomes weak, which causes warpage of the first lead 20. When the package molded body 10 is formed using the warped first lead 20, cracks are likely to occur in the resin molded body 11. If this ratio exceeds 60%, the thickness of the resin 27 that can be filled in the lead recess 24 becomes thin, and the resin 27 tends to crack.
The dimension in the longitudinal direction Ld of the notch 25a (the width 25w of the notch 25a) is preferably 0.3 to 0.9 mm. If the width is 25w <0.3 mm, the adhesion between the first lead 20 and the resin molded body 11 may be weakened. When the width 25w> 0.9 mm, the strength of the first lead 20 is locally weakened in the narrow width portion where the notch 25a is formed, causing the first lead 20 to warp. When the package molded body 10 is formed using the warped first lead 20, cracks are likely to occur in the resin molded body 11 (FIG. 7).

The positional relationship between the notch 25a and the lead recess 24 is determined by the relationship between the lengths x ₁ and x ₂ and the width 25w of the notch 25a shown in FIG.
For example, if the width 25w ≧ (length x ₂ −length x ₁ ), the second end 252b of the notch 25a is located outside the lead recess 24 (FIG. 8A).
If each dimension is determined so as to satisfy this condition, a part of the narrow width portion by the notch 25a can be kept at the plate thickness 20t. That is, it is possible to mitigate further reduction in strength of the narrow width portion having low strength due to the lead recess 24. Therefore, it is suitable when it is desired to maintain the strength of the first lead 20.

On the other hand, if the width 25w <(length x ₂ -length x ₁ ), the second end 252b of the notch 25a is positioned in the lead recess 24 and covered with the resin (FIG. 8B). )).
When each dimension is determined so as to satisfy this condition, the second end 252b of the notch 25a can be covered with the resin 27. Therefore, intrusion of the solder flux from the second end portion 252b can be suppressed.

  The above dimensions are described for the notch 25a of the first lead 20, but the dimensions of the notch 35a of the first lead 20 and the positional relationship between the notch 35a and the lead recess 24 are determined in the same manner. be able to. Further, when each lead is provided with a through hole 25a instead of the notches 25a and 35a of the first and second leads 20 and 30, the dimensions of the through hole 25b and the positional relationship between the through hole 25b and the lead recess 24 are also provided. The same can be determined for.

  2C and 3 again, on the back surface 22 side of the first lead 20, the resin 27 covering the first end portion 251b of the notch 25a becomes a lead recess on the back surface 14 side of the package molded body 10. Corresponding recesses 141 can be provided. As will be described below, this dent 141 is considered to be effective in eliminating mounting defects of the light emitting device.

When the light emitting device using the package molded body 10 is mounted on the mounting substrate by solder reflow, the molten solder has low wettability with respect to the resin molded body 11, so that the molten solder naturally gathers on the exposed surface 21 of the first lead 20. . However, sometimes the molten solder stays on the resin molded body 11 to form solder balls. If the light emitting device is mounted on the mounting substrate while being lifted by the solder balls, the light emitting device is mounted poorly.
Such a solder ball SB tends to be formed at a position where the periphery of the resin molded body 11 is uneven, and tends to occur in the vicinity of the notch 25a in the package molded body 10 of the present embodiment (FIG. 2 ( c)). Therefore, by providing the recess 141 with the resin 27 covering the first end 251b of the notch 25a, the solder ball SB is attracted to the recess 141 during reflow, and the solder ball SB spreads in the recess, whereby the light emitting device is It is possible to suppress the floating from the mounting substrate.

  For the same reason as the first lead 20, also for the second lead 30, the resin 37 covering the first end portion 351 b of the notch 35 a is provided with a recess 142 corresponding to the lead recess on the back surface 14 side of the package molded body 10. be able to.

  At the time of manufacture, a molten resin gate can be disposed in the lead recess 24 and molten resin for forming the resin molded body 11 and the resin 27 can be injected. In such a gate, a burr 141a may occur after the resin is cured. Since the burr 141a causes a mounting failure of the light emitting device, it is necessary to remove the burr 141a. However, when the burr 141a has a height lower than the depth of the dimple 141 by providing the resin 27 with a recess 141, the burr 141a Removal can be omitted.

  Surface grooves 211 and 212 may be provided on the surfaces 21 and 31 of the first and second leads 20 and 30. The surface grooves 211 and 212 are covered with the side wall 13 of the resin molded body 11. The surface groove 211 extending in the width direction Wd is formed between the first end 251a and the second end 252a of the notch 25a. The surface grooves 211 and 212 accumulate the solder flux transmitted through the surfaces 21 and 31 of the first and second leads 20 and 30, and suppress the diffusion of the solder flux, and the surface grooves 21 and 31 and the resin molded body 11 The effect of increasing the contact area and increasing the bonding strength between the first and second leads 20 and 30 and the resin molded body 11 is expected.

Below, the manufacturing method of the light-emitting device 50 is demonstrated.
<1. Production of package molded body 10>
A metal plate is punched to form a lead frame having a plurality of pairs of the first lead 20 and the second lead 30 arranged to face each other. The notches 25a and 25b can be formed simultaneously with punching. The first lead 20 and the second lead 30 are connected to the lead frame by tie bars. Thereafter, lead recesses 24 and 34 are formed at predetermined positions on the back surfaces 22 and 32 of the first and second leads 20 and 30 by wet etching or punching. The lead frame LF is clamped by a mold 90 having a gap for the resin molded body 11 at a position corresponding to each lead pair (FIG. 9A). Then, the resin material for the resin molded body 11 is injected into the gap of the mold 90 from the molten resin gate disposed in the lead recess 24. When the mold 90 is removed after the resin material is cured, the package molded body 10 in a state of being fixed to the lead frame is obtained.

<2. Mounting of Light-Emitting Element 40>
The light emitting element 40 shown in FIG. 1 has a pair of electrodes provided on the upper surface. In such a light emitting element 40, the light emitting element 40 is mounted on the first lead 20 of the package molded body 10 by die bonding. One electrode of the light emitting element 40 and the first lead 20 are electrically connected to the other electrode and the second lead 30 by bonding wires BW.
Note that a light-emitting element in which the first electrode is provided on the upper surface and the second electrode is provided on the lower surface can be used. In this case, the lower surface is fixed to the first lead 20 using a conductive paste, whereby the second electrode and the first lead 20 can be electrically connected. The first electrode provided on the upper surface is electrically connected to the second lead 30 using the bonding wire BW.

<3. Filling with sealing resin 52>
A sealing resin in a liquid state is potted in the recess 12 of the package molded body 10 and then cured. When two layers of the sealing resin 52 are used, first, the first sealing resin (underfill) is potted in the recess 12 and then cured, and then the second sealing resin (overfill) is potted in the recess 12. And then harden.

<4. Individualization of the light emitting device 50>
The lead frame tie bars are cut by dicing and separated into individual light emitting devices 50.

Below, the material suitable for each structural member of the light-emitting device 50 is demonstrated.
(First lead 20, second lead electrode 30)
From the viewpoint of workability and strength, the first lead 20 and the second lead electrode 30 can be made of a conductive material made of any one or more of aluminum, iron, nickel, copper, and the like. The first lead 20 and the second lead 30 are preferably plated with gold, silver, or an alloy thereof.

(Resin molding 11)
As a molding material of the resin molding 11, for example, a thermoplastic resin such as a liquid crystal polymer, a polyphthalamide resin, and polybutylene terephthalate (PBT) can be used in addition to a thermosetting resin such as an epoxy resin and a silicone resin. . In addition, a white pigment such as titanium oxide may be mixed in the molding material to increase the reflectance of light in the recess 12 of the resin molded body 11.

(Bonding wire BW)
As the bonding wire BW, for example, a metal wire made of a metal such as gold, silver, copper, platinum, aluminum, or an alloy thereof can be used.

(Sealing resin 52)
As a material of the sealing resin, a silicone resin, an epoxy resin, an acrylic resin, or a resin including one or more of these can be used. The sealing resin 52 can be formed from a single layer, but can also be formed from a plurality of layers (for example, two layers of underfill and overcoat).
Further, light scattering particles such as titanium oxide, silicon dioxide, titanium dioxide, zirconium dioxide, alumina, and aluminum nitride may be dispersed in the sealing resin 52.
Furthermore, particles of a material (phosphor or the like) that converts the wavelength of light emitted from the light emitting element 40 may be dispersed in the sealing resin 52. For example, in the light emitting device 50 that emits white light, a light emitting element 40 that emits blue light and phosphor particles (for example, YAG particles) that absorb blue light and emit yellow light can be combined.

(solder)
As the solder in this embodiment, Sn—Ag—Cu, Sn—Zi—Bi, Sn—Cu, Pb—Sn, Au—Sn, Au—Ag, or the like can be used.

The package molded body 11 of the present invention is formed by covering the first end portion 251b of the light emitting element 40 of the notch 25a on the back surface 22 of the first lead 20 with the resin 27 while being positioned in the lead recessed portion 24. When the light emitting device 50 is manufactured and mounted using 11, the solder flux can be prevented from entering from the first end portion 251 b of the notch 25 a.
In addition, since the back surface 22 of the first lead 20 is exposed from the back surface 14 of the resin molded body 11 of the package molded body 11 of the present invention, when the light emitting device 50 is manufactured using the package molded body 11, The heat from the light emitting element 40 placed on the surface 21 of the one lead 20 can be efficiently radiated to the outside.

DESCRIPTION OF SYMBOLS 10 Package molded object 11 Resin molded object 12 Recessed part 121 Bottom surface 13 Side wall 14 Back surface of resin molded object 20 First lead 21 First lead surface (one surface)
22 Back side of the first lead (the other side)
221 Exposed portions 211, 212 on the back surface of the first lead Surface groove (V-shaped groove)
24 Lead recessed part 25a Notch part 25b Through-hole 251a 1st edge part (surface side)
251b First end (back side)
252a Second end (front side)
252b Second end (back side)
27 Resin 30 Second lead 31 Surface of second lead (one surface)
32 Back side of second lead (the other side)
321 Exposed portion on the back surface of the second lead 34 Lead concave portion 35a Notch portion 351a First end portion (surface side)
351b First end (back side)
352a Second end (surface side)
352b Second end (back side)
37 Resin 40 Light-Emitting Element 50 Light-Emitting Device 52 Sealing Resin

Claims (11)

A resin molded body having a recess for housing the light emitting element;
In the molded package having a lead disposed at a lower portion of the resin molded body,
A part of one surface of the lead is exposed from the bottom surface of the recess of the resin molded body,
The other surface of the lead has an exposed portion exposed from the back surface of the resin molded body and a lead concave portion provided on the other surface , and the lead concave portion is entirely filled with resin filled therein. Covered,
The lead has a notch or a through hole extending from the one surface to the other surface,
A first end portion on the center side of the recess of the notch or the through hole in the other surface is located in the lead recess, and is covered with the resin ,
The resin is a package molded body having a dent at a position corresponding to the lead recess on the back side of the package molded body.   2. The package molded body according to claim 1, wherein the resin filled in the lead recess is continuously formed from a back surface of the resin molded body.   3. The second end portion of the other surface of the lead facing the first end portion of the notch or the through hole is located outside the lead recessed portion. The package molding as described in 1.   A second end portion of the other surface of the lead facing the first end portion of the notch or the through hole is located in the lead recess and covered with the resin. The package molded body according to claim 1 or 2.   On the one surface of the lead, the first end of the notch or the through hole is exposed at the bottom surface of the recess, and the second end of the notch or the through hole facing the first end is The package molded body according to any one of claims 1 to 4, wherein the package molded body is covered with a side wall forming the concave portion of the resin molded body.   The said notch or through-hole is covered with the side wall which comprises the said recessed part of the said resin molding in the said one surface of the said lead | read | reed, The any one of Claims 1-4 characterized by the above-mentioned. Package molded body. The lead includes a first lead and a second lead that are exposed to be separated from each other on the bottom surface of the concave portion of the resin molded body,
The notch or the through hole is formed in at least the first lead, and the first edge of the first lead facing the second lead and the first of the notch or the through hole are formed on one surface of the first lead. There is a region for placing the light emitting element between one end portion, and the entire inner surface is covered on the other surface with an exposed portion exposed from the back surface of the resin molded body and a resin filled inside. A lead recess,
On the other surface of the lead, the distance y from the first edge of the first lead to the edge of the lead recess on the light emitting element side is the cutting distance from the first edge of the first lead. The package molded body according to any one of claims 1 to 6, wherein the package molded body is 50% to 80% with respect to a distance z to the first end of the notch or the through hole. The package molded body has a shape extending in one direction,
The package formed body according to any one of claims 1 to 7, wherein the notch or the through hole is a notch formed along a side extending in the one direction.   The one surface of the lead has a surface groove, and the surface groove is formed between a first end portion of the notch or the through hole and a second end portion facing the first end portion, The package molded body according to any one of claims 1 to 8, wherein the package molded body is covered with a side wall forming the concave portion of the resin molded body. The resin filled in the lead recess includes a burr in the recess of the resin, and the height of the burr is lower than the depth of the recess. The package molding as described in 1. The package molded body according to any one of claims 1 to 10,
A light emitting element that is housed in a recess provided in the resin molded body of the package molded body and is placed on one surface of the lead exposed from the bottom surface of the recess;
A sealing resin for sealing the concave portion of the light emitting element and the resin molded body;
A light emitting device comprising:

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