JP2014203887A - Package for semiconductor device and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package capable of preventing generation of burr and a resin filling defect in a resin part between lead electrodes, and a semiconductor device using the same.SOLUTION: A package 2 comprises lead electrodes 10 and 20, and a resin molding 3 which resin-molds the lead electrodes 10 and 20. The resin molding 3 is annular, and a cup part 3a for arranging a light-emitting element is provided inside the resin molding 3. A semiconductor device includes a light-emitting element 4 mounted on this package. A long plate part 12 of the lead electrode 10 is provided with a notch 12k. A relay plate part 22 of the lead electrode 20 is provided with an opening 22k.

Description

  The present invention relates to a package for a semiconductor device on which a semiconductor element such as an LED light emitting element is mounted, and a semiconductor device using the package.

  An example of a resin-sealed light emitting device equipped with an LED light emitting element is shown in FIGS. 12 is a perspective view of the light emitting device 100, and FIGS. 13A and 13B are cross-sectional views taken along lines XIIIa-XIIIa and XIIIb-XIIIb of FIG. FIG. 14 is a bottom view of the package 110. FIG. 15 is a cross-sectional view of the mold for manufacturing the package, and FIG. 16 is an explanatory view of the resin flow at the time of injection.

  A package 110 of the light emitting device 100 includes a first lead electrode 101, a second lead electrode 102, and a resin molded body 103 configured to be integrated with the lead electrodes 101 and 102. The resin molded body 103 has an annular shape having a hole-shaped cup portion 103a, and a part of each of the lead electrodes 101 and 102 is exposed at the bottom of the cup portion 103a. The outer ends of the lead electrodes 101 and 102 extend outward from the outer peripheral edge of the resin molded body 103.

  In the cup portion 103a, a light emitting element 104 such as an LED is fixed on the lead electrode. The light emitting element 104 is connected to the lead electrodes 101 and 102 by metal thin wires 105 and 106. Although illustration is omitted, a translucent sealing resin is molded in the cup portion 103a.

  Between the facing edges of the lead electrodes 101 and 102, a bridge portion 103b made of resin is filled. The bridge portion 103 b extends in a substantially U shape at the bottom of the cup portion 103 a and is integrated with the resin molded body 103. However, the bridge portion 103b may be provided so as to cross the bottom portion of the cup portion 103 in a straight line.

  In order to dissipate heat from the light emitting element 104, the lead electrodes 101 and 102 are exposed on the bottom surface of the light emitting device 100. In order to prevent the lead electrodes 101 and 102 from peeling off or floating from the bottom surface of the resin molded body 103, a step is formed at the side end portions of the lead electrodes 101 and 102 as shown in FIGS. Is provided. Since the edge of the stepped portion is embedded in the resin molded body 103, the lead electrodes 101 and 102 are prevented from being peeled off or lifted up. In FIG. 14 (bottom view of the package 110), dots are attached to the lead electrodes 101 and 102 in order to make the distinction from the resin molded body 103 clear.

  When the resin molded body 103 of the package 110 is molded, as shown in FIGS. 15A and 15B, the lead electrodes 101 and 102 are sandwiched between the upper mold 120 and the lower mold 121, and the resin is injected. The cavities 122 and 123 are filled with resin. The resin filled in the cavity 122 forms the resin molded body 103. The resin filled in the cavity 123 forms the bridge portion 103b. 15A and 15B are cross-sectional views of a mold for forming the package 110, FIG. 15A shows a cross-section of a portion along the line XVa-XVa in FIG. 14, and FIG. The cross section of the part which follows the XVb-XVb line | wire of FIG. 14 is shown.

FIG. 16 is a perspective plan view of the package 110 for explaining the flow of resin in the cavity. The resin injected from the gate G into the mold cavity flows through the cavity 122 as indicated by arrows a ₁ and a ₂ , and a part of the resin is separated as indicated by arrows a ₃ , a ₄ , a ₅ , and a _6. Flow into the cavity 123.

  12 to 14, the entire lead electrodes 101 and 102 are exposed on the bottom surface of the package 110. However, as in the package 110 ′ of the semiconductor device 100 ′ of FIG. , 102t other than the lead electrodes 101, 102, the resin molding 103 may be present on the back surface of the main plate portion. Other reference numerals in FIG. 18 indicate the same parts as those in FIG.

JP 2008-140944 A JP 2006-222271 A

(I) As shown in FIG. 15A, when both edge portions of the lead electrodes 101 and 102 facing the cavity 122 are sandwiched between the upper mold 120 and the lower mold 121, the resin is in contact with the lead electrodes 101 and 102. There is no wrap around behind. However, as shown in FIG. 15B, when the edge portion of the lead electrode 101 is in a free state where it is not sandwiched between the upper mold 120 and the lower mold 121 in the cavity 122, the cavity 122 is filled. As shown by the arrow r, the incoming resin enters the back side of the lead electrode 101 (between the lead electrode 101 and the lower mold 121), and burrs are likely to occur. In particular, when the resin is a resin having high fluidity such as a silicon resin, burrs are easily generated. B ₁ and B _{2 in} FIG. 17 (bottom view of the package 110) indicate portions where burrs are likely to occur on the back surfaces of the lead electrodes 101 and 102 in this way. For some parts of _{B 3} in FIG. 17, likely the resin flowing in the cavity 122 causes a burr enters the back side of the lead electrodes 101 and 102.
An object of the present invention is to provide a package for a semiconductor device that can prevent (including suppression; hereinafter the same) the occurrence of such burrs.

(Ii) As shown in FIG. 16, the resin branched from the resin flows a ₁ and a ₂ flowing in the cavity 122 and entering the cavity 123 as indicated by arrows a ₃ and a ₅ is indicated by arrows a ₄ and a ₆ . It flows toward the back of the passage cavity 123. In this case, the cavity 123 is filled with the resin flows a ₃ and a ₄ flowing in the clockwise direction in FIG. 16 and the resin flows a ₅ and a ₆ flowing in the counterclockwise direction in FIG. The resin flows a ₄ and a ₆ meet in the vicinity of the space S shown in FIG. 16. However, since air remains in the cavity 123, the resin flow a ₄ and the resin flow a ₆ from the opposite side are present. Air may remain between and become air pockets, causing short shot defects.
An object of the present invention, in one aspect thereof, is to provide a package for a semiconductor device that can prevent such a short shot.

(Iii) When the package 110 ′ in which the resin molded body 103 is also present on the back surface of the main plate portion of the lead electrodes 101 and 102 as shown in FIG. 18 is formed, between the main plate portion of the lead electrodes 101 and 102 and the lower mold Because of the small thickness of the cavity, it is difficult to sufficiently fill the resin, which may cause a short shot.
An object of the present invention, in one aspect thereof, is to provide a package for a semiconductor device that can prevent such a short shot.

(Iv) When there is an unfilled resin defect such as a short shot or a weld in the gap between the lead electrodes 101 and 102 as in the S portion of FIG. 16, leakage of reflow solder from the back of the device during board mounting reflow solder connection. May occur, and solder may flow out to the front surface of the device. In one aspect, the present invention aims to prevent such solder outflow.

  A package for a semiconductor device according to the present invention includes first and second lead electrodes arranged so that one side faces each other, and a resin molded body molded so as to be integrated with the lead electrode. The molded body is a package for a semiconductor device in which a cup portion for arranging a light emitting element is recessed from one surface to the other surface. The first lead electrode includes a long plate portion and the long plate portion. A first end plate portion extending to the outside of the resin molded body, and at least the first end plate portion side of the long plate portion is embedded in the resin molded body. The second lead electrode includes a main plate portion facing the long plate portion, a relay plate portion connected to the opposite side of the main plate portion to the long plate portion, and the main plate portion of the relay plate portion opposite to the main plate portion. And a second end plate portion extending outward from the resin molded body, the main plate portion having one plate surface It is exposed to the cup portion, the other plate surface is exposed to the other surface of the package, the relay plate portion is embedded in the resin molded body, and an opening is provided in the relay plate portion A bridge portion is provided by filling resin between the long plate portion of the first lead electrode and the main plate portion of the second lead electrode, and the bridge portion has both ends in the longitudinal direction. The side is continuous with the resin molded body, and a midway portion in the longitudinal direction of the bridge portion is continuous with the resin molded body via a resin filled in a notch provided in the long plate portion. To do.

  In one aspect of the present invention, the entire long plate portion of the first lead electrode is embedded in the resin molded body.

  In one aspect of the present invention, the first end plate portion side of the first lead electrode is a high step long plate portion, and the main plate portion side is a low step long plate portion. The portion is embedded in the resin molded body, and the low-stage long plate portion is exposed on the other surface of the package. In this case, an opening may be provided in the high step long plate portion of the first lead electrode, and the notch portion may be provided in the low step long plate portion. The cutout portion of the first lead electrode may reach the high step long plate portion across the low step long plate portion.

  The semiconductor device of the present invention includes the package for a semiconductor device of the present invention and a semiconductor element mounted on the package.

  In the package for a semiconductor device of the present invention, at least the first end plate portion side of the long plate portion of the first lead electrode and the relay plate portion of the second lead electrode are embedded in the resin molded body. Occurrence of burrs on the back side of the plate is prevented.

  Further, in the present invention, the resin filling in the longitudinal direction of the bridge portion and the resin molded body are connected by the resin filled in the notch portion of the long plate portion, thereby preventing the resin filling failure and the short shot in the bridge portion. Can do.

It is a top view of the light-emitting device concerning an embodiment. (A) The figure is the IIa-IIa sectional view taken on the line of FIG. 1, (b) The figure is the IIb-IIb sectional view. It is the III-III arrow directional view of FIG. (A) The figure is the IV-IV sectional view taken on the line of FIG. 1, (b) The figure is a partial enlarged view of (a) figure. It is a bottom view of the light-emitting device of FIG. It is a top view of the package which comprises the light-emitting device of FIG. It is a top view of the lead electrode of a package. It is the VIII-VIII line | wire cutting part end view of FIG. (A) is an end view taken along line IXa-IXa of FIG. 7, and (b) is an end view taken along line IXb-IXb of FIG. 6A is a sectional view taken along line Xa-Xa in FIG. 6, FIG. 5B is a sectional view taken along line Xb-Xb, and FIG. 5C is a sectional view taken along line Xc-Xc. (A) The figure is a package top view which shows the resin flow at the time of package shaping | molding, (b) The figure and (c) figure are the XIb-XIb and XIc-XIc sectional views taken on the line (a). It is a perspective view of the conventional light-emitting device. (A) is a sectional view taken along line XIIIa-XIIIa in FIG. 12, and (b) is a sectional view taken along line XIIIb-XIIIb. It is a bottom view of the package of the light-emitting device of FIG. It is sectional drawing which shows a part of metal mold | die for shape | molding the package of FIG. It is a package top view which shows the resin flow in the metal mold | die of FIG. It is a package bottom view which shows the burr | flash generation | occurrence | production site | part in the conventional package. It is a longitudinal cross-sectional view which shows another conventional package. It is a block diagram of the package which concerns on another embodiment. It is a block diagram of the package which concerns on another embodiment.

  Hereinafter, a first embodiment will be described with reference to FIGS. In the following embodiments, the semiconductor device is a light emitting device, but the present invention is not limited to this.

  The light emitting device 1 includes a package 2 and a light emitting element 4 mounted on the package 2. The package 2 includes a first lead electrode 10, a second lead electrode 20, and a resin molded body 3 molded so as to be integrated with the lead electrodes 10 and 20. The resin molded body 3 has an annular shape having a concave hole-shaped cup portion 3a, and the outer peripheral shape thereof is substantially square. After mounting the light emitting element 4, the cup portion 3 a is filled with a colored (transparent) thermosetting sealing resin (not shown) that is colorless and transparent or contains a coloring material such as a phosphor. This sealing resin is formed by filling an uncured material into the cup portion 3a and then curing it.

  A substantially square through hole 3e is provided at the bottom of the cup part 3a, and most of the upper surface of the main plate part 21 of the lead electrode 20 is exposed to the through hole 3e. The end plate portions 11 and 23 outside the lead electrodes 10 and 20 extend outward (in opposite directions) from the outer peripheral edge of the resin molded body 3.

  A light emitting element 4 such as an LED is fixed on the lead electrode 20 in the through hole 3e. The light emitting element 4 is connected to the lead electrodes 10 and 20 by fine metal wires 5 and 6 by wire bonding. Between the opposing edges of the lead electrodes 10 and 20, bridge portions 3b and 3c made of resin are filled. The bridge portions 3 b and 3 c are integrated with the resin molded body 3. In addition, the light emitting element 4 on the lead electrode 20 may be single or plural. FIG. 1 shows a plurality of examples.

  The configuration of the lead electrodes 10 and 20 will be described in detail with reference to FIGS. 6 is a plan view of the light emitting device package 2 before the light emitting element 4 is mounted, FIG. 7 is a plan view of the lead electrodes 10 and 20, and the arrangement of the lead electrodes 10 and 20 in FIG. 6 is the same as the arrangement of the lead electrodes 10 and 20 in the package 2. 8 shows an end surface of the section taken along line VIII-VIII in FIG. 7, and FIGS. 9A and 9B show end faces of the section taken along line IXa-IXa, IXb-IXb in FIG.

  As shown in FIG. 7, the lead electrode 10 includes a first end plate portion 11 extending from one side of the resin molded body 3 and a rectangular long plate portion connected to the end plate portion 11 via a rising step portion 11 a. 12, a pair of elongated rectangular side plate portions 13 and 13 that are connected to both end portions of the long plate portion 12 in the longitudinal direction via rising step portions 12a, and lead electrode main plate portions of the side plate portions 13 respectively. 21, a projecting portion 14 that projects from the long side opposite to the side 21, and a restraining portion 15 that extends from the end plate portion 11 side of each side plate portion 13. The end plate portion 11 is exposed on the bottom surface of the resin molded body 3 and is flush with the bottom surface of the resin molded body 3. The long plate portion 12 is higher than the end plate portion 11 by the rising height of the stepped portion 11a, and is embedded in the resin molded body 3 as a whole. The side plate portion 13, the overhang portion 14, and the restraint portion 15 are higher than the long plate portion 12 by the rising height of the stepped portion 12 a and are embedded in the resin molded body 3.

  A notch portion 12k is provided in the long side portion facing the main plate portion 21 of the long plate portion 12. The notch 12k is preferably provided over a range of 5 to 75%, particularly 30 to 50% of the entire length of the long plate portion 12. Moreover, it is preferable that the space | interval of the notch part 12k and the main plate part 21 is 0.5 to 3 times the space | interval of the long plate parts 12 other than the notch part 12k, and the main plate part 21, especially 1.5 to 2 times.

  Since the overhanging portion 14 is provided in the side plate portion 13, the side plate portion 13 and the resin molded body 3 are firmly integrated. The overhanging portion 14 may be provided with a plurality of small overhanging portions on the side plate portion 13. The restraint portion 15 extends toward the corner portion 3C (FIG. 6) of the resin molded body 3, and the resin molded body 3 at the corner portion 3C is reinforced.

  As shown in FIGS. 1 and 6, a part of the side plate portion 13 along the long side is located on the main plate portion 21 side, and the upper surface thereof is exposed in the cup portion 3a. One end of the fine metal wire 5 is connected to the exposed side plate portion 13.

  4 and 5, a part of the back surface of the side plate portion 13 faces the opening 3h of the resin molded body 3, and is exposed below the resin molded body 3 through the opening 3h. The opening 3h has a rectangular shape extending in the longitudinal direction of the side plate portion 13. In this embodiment, two openings are provided for each side plate portion 13, and a total of four packages 2 are provided. Not.

  As shown in FIG. 7, the lead electrode 20 includes a substantially square main plate portion 21, a rectangular relay plate portion 22 connected to the main plate portion 21 through a rising step portion 21 a, and a long side of the relay plate portion 22. The second end plate portion 23 connected to the portion via the falling step portion 22a and the both ends of the relay plate portion 22 in the longitudinal direction are connected via the rising step portion 22b to the corner portion 3D of the package 2. It has a pair of extended plate portions 24, 24 that extend and restraint portions 25, 25 that extend from each extended plate portion 24.

  The main plate portion 21 is disposed in a U-shaped portion including the side plate portions 13 and 13 and the long plate portion 12 of the lead electrode 10. A predetermined gap is provided between the main plate portion 21 and the side plate portions 13 and 13 and the long plate portion 12. The gap portions 3b and 3c are formed by filling the gap with the resin of the resin molded body 3. As shown in FIG. 5, the resin molded body 3 between the main plate portion 21 and the long plate portion 12 is the bridge portion 3b, and the resin molded body 3 between the main plate portion 21 and the side plate portion 13 is the bridge portion 3c. .

  The main plate portion 21 has three side edges facing the first lead electrode 10 embedded in the bridge portions 3b and 3c as shown in FIGS. In these three sides, as shown in FIG. 4 (b), the bottom surface side is notched and the upper surface side is a protruding piece portion 21t, and this protruding piece portion 21t is embedded in the bridge portions 3b and 3c. ing. This prevents the main plate portion 21 from floating from the bridge portions 3b and 3c.

  The bottom surfaces of the main plate portion 21 and the end plate portion 23 are flush with the bottom surfaces of the bridge portions 3b and 3c and the resin molded body 3, and are exposed on the bottom surface of the package 2, respectively. The relay plate portion 22 is higher than the main plate portion 21 and the end plate portion 23 by the height of the step portions 21a and 22a, and is embedded in the resin molded body 3 as a whole. As described above, the main plate portion 21 has the protruding piece portion 21t embedded in the bridge portions 3b and 3c, and the relay plate portion 22 is embedded in the resin molded body 3 as a whole. Is held firmly.

  The relay plate portion 22 is provided with a long hole-shaped opening 22k extending in the longitudinal direction (direction connecting the extended plate portions 24, 24). The length in the longitudinal direction of the opening 22k is preferably about 5 to 75%, particularly about 30 to 50% of the entire length of the relay plate portion 22. The width in the short direction of the opening 22k is preferably about 10 to 120%, particularly about 50 to 80% of the width in the short direction of the relay plate portion 22.

  The extension plate portions 24, 24 are higher than the relay plate portion 22 by the stepped portion 22 b and are embedded in the resin molded body 3 as a whole. A restraint portion 25 extends from the extension plate portions 24, 24 toward the corner portion 3D of the package 2, and the resin molded body 3 of the corner portion 3D is reinforced by the extension plate portion 24 and the restraint portion 25. Yes.

  In the package 2 and the light emitting device 1 configured as described above, the long plate portion 12, the side portion 13, the extending portion 14, the relay plate portion 22, the extending plate portion 24, and the restraining portion 25 are included in the resin molded body 3. Since it is buried, the occurrence of burrs on these back surfaces is prevented.

  Further, since the notch portion 12k is provided in the long plate portion 12 and the opening 22k is provided in the relay plate portion 22, the resin flowing in the cavity when the resin molded body 3 is molded is not cut into the notch portion 12k and the notch portion 12k. The back side of the long plate portion 12 and the relay plate portion 22 is sufficiently filled through the opening 22k, and resin flow failure and short shot are prevented. Further, peeling of the lead electrode 10 and the relay plate portion 22 from the resin molded body 3 is also prevented.

  The side portion 13 is higher than the long plate portion 12 by the step portion 12a, and the extension plate portion 24 and the restraint portion 25 are higher than the relay plate portion 22 by the step portion 22b. The back side of the resin is sufficiently filled with resin to prevent poor resin flow and short shots.

  Moreover, since the resin cover thickness in these back sides is large, peeling from a resin molding is prevented. And the penetration | invasion of the external air from a peeling gap | interval and sealing material leakage are prevented.

In this embodiment, as shown in FIG. 6, the side plate portion 13 extends in a direction orthogonal to the bridge portion 3b on both ends in the longitudinal direction of the bridge portion 3b. Therefore, with respect to the package 2, when a force for bending the axis A ₁ around along the bridge portion 3b is applied, this force is opposed by the side plate portions 13, deformation of the package 2 can be prevented.

Further, in the direction orthogonal to the bridge portion 3 c on both ends of the bridge portion 3 c between the main plate portion 21 and the side plate portion 13, the vicinity of the step portion 12 a of the long plate portion 12 of the lead electrode 10 and the relay of the lead electrode 20. The step part 22b vicinity part of the board part 22 is extended. Therefore, with respect to the package 2, when a force for bending the axis A ₂ around along the bridge portion 3c is applied, this force is opposed by the long plate portion 12 and the relay plate 22, deformation of the package 2 Is prevented.

  Since the base end side of the side plate portion 13 having the restricting portion 15 and the extending plate portion 24 having the restricting portion 25 are present in the corner portions 3C and 3D of the resin molded body 3, the corner portions 3C and 3D are provided. The strength and rigidity of the resin molded body 3 in the vicinity are increased, and chipping and breakage at the corner portions 3C and 3D of the resin molded body 3 can be prevented.

  As shown in FIG. 6, the restraining portions 15 and 25 project in a hook shape in the left-right direction in the figure. Therefore, even when a deformation force in the pulling direction that increases the width of the bridge portion 3c is applied, the resin molded body 3 is restrained by the restraining portions 15 and 25, and a gap opening that widens the width of the bridge portion 3c is prevented. It is possible to prevent the ingress of outside air and leakage of the sealing material. The constraining portions 15 and 25 may be cut recesses, protruding protrusions, or rising protrusions.

As described above, the side plate portion 13 faces the opening 3 h on the bottom surface side of the resin molded body 3. The opening 3h is formed by a mold convex portion for supporting the side plate portion 13 when the package 2 is molded. When the opening 3h exists, when the uncured sealing resin is filled in the cup portion 3a, the uncured resin reaches the opening 3h along the interface between the side plate portion 13 and the resin molded body 3. There is a risk of spillage. If the opening 3h is made small,
Since the range in which the side plate portion 13 is supported is reduced, resin burrs are generated in the portion where the side plate portion 13 cannot be supported when the package 2 is molded, and the exposed width in the cup portion 3a of the side plate portion 13 is reduced. Get smaller.

  As a countermeasure for this, in this embodiment, as shown in FIG. 4 (b), of the side portions of the side plate portion 13 on the main plate portion 21 side, a cutout shape portion is formed on the corner edge of the upper portion (cup portion 3a side). 13k is provided to increase the path length for preventing resin leakage.

  Packages 2A and 2B according to another embodiment will be described with reference to FIGS. 19A and 19B are plan views of the package, FIG. 19B is a plan view showing the arrangement of lead electrodes in the package, FIG. 19C is a bottom view of the package, and FIG. FIG. 4E is a package plan view for explaining the resin flow during molding of the resin molded body 3, and FIG. 5F is a sectional view taken along the line FF of FIG.

  The package 2A of FIG. 19 includes a first lead electrode 50 and a second lead electrode 60. As clearly shown in FIG. 19 (b), the lead electrode 50 has a first end plate portion 51 extending from one side of the resin molded body 3, and a substantially continuous connection with the end plate portion 51 via a rising step portion 52. A rectangular high-stage long plate portion 53 and a low-stage long plate portion 55 connected to the high-stage long plate portion 53 via a rising step portion 54 are provided. The end plate portion 51 and the low-stage long plate portion 55 are exposed on the bottom surface of the resin molded body 3 and are flush with the bottom surface of the resin molded body 3. The high step long plate portion 53 is higher than the end plate portion 51 and the low step long plate portion 55 by the height of the step portions 52 and 54 and is embedded in the resin molded body 3 as a whole.

  An opening 56 is provided in the high-stage long plate portion 53, and the lower surface side of the high-stage long plate portion 53 is sufficiently filled with the resin molded body 3. A cutout 57 is provided on the side of the low step plate 55 that faces the second lead electrode 60. One end side of the resin filled in the cutout portion 57 is connected to the bridge portion 3 b, and the other end side is connected to the resin molded body 3.

  The lead electrode 60 has a substantially square main plate portion 61, a rectangular relay plate portion 63 connected to the main plate portion 61 via a rising step portion 62, and a long side portion of the relay plate portion 63 falling. And a second end plate portion 65 that continues through the step portion 64.

  The front edge of the main plate portion 61 is opposed to the edge portion of the low-stage long plate portion 55 of the lead electrode 50, and a predetermined gap is provided between them. The gap 3b is formed integrally with the resin molded body 3 by filling the gap with resin as shown in FIGS. 19E and 19F when the resin molded body 3 is molded. The bridge portion 3b extends so as to cross the annular resin molded body 3 in the string direction.

  Both side portions of the main plate portion 61 and the relay plate portion 63 are embedded in the resin molded body 3, thereby preventing the main plate portion 61 from floating from the resin molded body 3.

  The bottom surfaces of the main plate portion 61 and the end plate portion 65 are flush with the bottom surfaces of the resin molded body 3 and the bridge portion 3b, and are exposed on the bottom surface of the package 2A. The relay plate portion 63 is higher than the main plate portion 61 and the end plate portion 65 by the height of the step portions 62 and 64, and is embedded in the resin molded body 3 as a whole.

  The relay plate 63 is provided with a long hole-like opening 66 extending in the longitudinal direction thereof.

  In the package 2A configured as described above, the high-stage long plate portion 53 and the relay plate portion 63 are embedded in the resin molded body 3, and the occurrence of burrs on the back surface thereof is prevented.

  Moreover, since the opening 56 is provided in the high step long plate part 53, the notch part 57 is provided in the low step long plate part 55, and the opening 66 is provided in the relay plate part 63, FIG. As shown in f), when the resin molded body 3 is molded, the resin injected from the gate G and flowing in the cavity as shown by the arrow j passes through the opening 56, the cutout 57 and the opening 66, and the long plate portion 53. The back side, the bridge portion 3b, and the back side of the relay plate portion 63 are sufficiently filled, respectively, to prevent resin flow failure and short shot.

  The package 2B in FIG. 20 has a shape similar to the package 2A. In this package 2B, lead electrodes 50 'and 60' are used. The lead electrode 50 ′ is different from the lead electrode 50 in that a tongue piece portion 53 a that connects the first end plate portion 51 and the high-stage long plate portion 53 is provided, and the tongue piece portion 53 a and the first end plate portion 51 are provided. And a notch portion 57 ′ having a shape connecting the opening 56 and the notch portion 57. The tongue piece portion 53 a is flush with the high-stage long plate portion 53, and the tip side protrudes from the resin molded body 3.

  In the lead electrode 60 ′, a tongue piece portion 63 a is provided on the relay plate portion 63, and one end side of the tongue piece portion 63 a is connected to the second end plate portion 65 via a falling stepped portion 64. The tongue piece portion 63 a is flush with the relay plate portion 63, and one end side thereof extends from the resin molded body 3.

  Other configurations of the lead electrodes 50 ′ and 60 ′ are the same as those of the lead electrodes 50 and 60, and the same reference numerals indicate the same parts.

  Also in this package 2B, as shown in FIGS. 20 (e) and 20 (f), the resin from the gate G passes through the notch 57 ′ and the opening 66 as shown by the arrow j at the time of injection molding. Is prevented. Further, as with the package 2A, since the long plate portion 53 and the relay plate portion 63 are embedded in the resin molded body 3, the occurrence of burrs on the back surface thereof is prevented.

  The above-described embodiment is an example of the present invention, and the present invention may be configured other than illustrated. The resin of the resin molded body is preferably a silicone resin, but is not limited thereto. The lead electrode material is exemplified by a copper alloy, but is not limited thereto.

1,100,100 'Light emitting device 2,2A, 2B, 110,110' Package 3,103 Resin molded body 3a Cup part 3b, 3c, 103b Bridge part 3e Through-hole 4,104 Light emitting element 5,6,105,106 Metal thin wire 10, 20, 50, 60, 101, 102 Lead electrode 11, 51 First end plate portion 12, 52 Long plate portion 11a, 12a, 21a, 22a, 22b, 101a, 102a Step portion 13 Side plate portion 14 Tension Protruding portion 15, 25 Restraining portion 21, 61 Main plate portion 22, 63 Relay plate portion 23, 66 Second end plate portion 24 Extending plate portion 56, 66 Opening 57, 57 ′ Notch portion

Claims (6)

The first and second lead electrodes arranged with the sides facing each other, and a resin molded body molded so as to be integrated with the lead electrodes,
The resin molded body is a package for a semiconductor device in which a cup portion for arranging a light emitting element is recessed from one surface to the other surface.
The first lead electrode includes a long plate portion, and a first end plate portion that extends to the outside of the resin molded body and extends to one long side of the long plate portion,
At least the first end plate portion side of the long plate portion is embedded in the resin molded body,
The second lead electrode is connected to the main plate portion facing the long plate portion, the relay plate portion connected to the main plate portion on the opposite side to the long plate portion, and the relay plate portion on the opposite side to the main plate portion. And a second end plate portion extending outward of the resin molded body,
The main plate portion has one plate surface exposed to the cup portion, and the other plate surface exposed to the other surface of the package,
The relay plate is embedded in the resin molded body;
An opening is provided in the relay plate part,
Between the long plate portion of the first lead electrode and the main plate portion of the second lead electrode, resin is filled and a bridge portion is provided,
The bridge portion has both ends in the longitudinal direction continuous to the resin molded body,
A package for a semiconductor device, characterized in that a midway portion in the longitudinal direction of the bridge portion is connected to the resin molded body through a resin filled in a notch portion provided in the long plate portion.   2. The package for a semiconductor device according to claim 1, wherein the entire long plate portion of the first lead electrode is embedded in the resin molded body. In Claim 1 or 2, the first end plate portion side of the first lead electrode is a high step long plate portion, the main plate portion side is a low step long plate portion,
A package for a semiconductor device, wherein the high step long plate portion is embedded in a resin molded body, and the low step long plate portion is exposed on the other surface of the package.   4. The package for a semiconductor device according to claim 3, wherein an opening is provided in the high step long plate portion of the first lead electrode, and the cutout portion is provided in the low step long plate portion.   4. The package for a semiconductor device according to claim 3, wherein the notch portion of the first lead electrode crosses the low step long plate portion and reaches the high step long plate portion.   6. A semiconductor device comprising the package for a semiconductor device according to claim 1, and a semiconductor element mounted on the package.

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