JP6149518B2 - WIRING MEMBER FOR WINDOW, VEHICLE WINDOW HAVING THE SAME, AND METHOD FOR PRODUCING WINDOW WIRING MEMBER - Google Patents

Description

  The present invention relates to a window wiring member, a vehicle window including the same, and a method for manufacturing the window wiring member, and more particularly to a window including a conductor such as an antenna or a defogger.

  A window of a vehicle (for example, a rear window) is generally provided with a conductor such as an antenna for wireless communication and a defogger for preventing fogging. The conductive wire is formed on the surface of the window by printing and baking a wiring pattern on the surface of the window with silver paste or the like. Solder is used for bonding between the conductive wire and a metallic terminal for electrical exchange with the conductive wire (see, for example, Patent Document 1).

JP 2008-246516 A

  However, the use of solder for bonding between the conductive wire provided in the window and the terminal causes an increase in material cost and thermal damage to the substrate. Moreover, interposing a separate member between the conducting wire and the terminal can also hinder the electrical conductivity between the conducting wire and the terminal.

  Therefore, an object of the present invention is to provide a window wiring member capable of fixing a terminal on a substrate without using solder.

  Another object of the present invention is to provide a vehicle window including a window wiring member capable of fixing a terminal on a substrate without using solder, and a method for manufacturing the window wiring member.

  According to this invention, the wiring member for windows is provided with a conducting wire part, a conductive film, and a metallic terminal. The conducting wire part is provided on a transparent substrate constituting the window. The conductive film is provided on the substrate and is electrically connected to the conductor portion. The terminal is fixed on the substrate by being at least partially embedded in the conductive film. The composition of the conductive film is the same as the composition of the conductor portion.

  Preferably, the terminal includes a plate-like joint extending along the surface of the substrate. And the upper surface of the electrically conductive film in the circumference | surroundings of a junction part is located above the lower surface of a junction part.

More preferably, at least one hole is formed in the joint.
Preferably, the window wiring member further includes a film-like adhesive. The film-like adhesive is provided on the upper part of the terminal and at least the upper part of the conductive film around the terminal.

More preferably, the adhesive is a non-conductive adhesive.
According to the invention, the vehicle window includes any of the above-described window wiring members.

  According to the present invention, there is provided a manufacturing method of any of the above-described window wiring members, the step of forming a conductive film on a substrate by coating, and a terminal before the conductive film is cured. Embedding in the conductive film and curing the conductive film after the terminals are embedded in the conductive film.

  Preferably, the manufacturing method further includes a step of forming a film-like adhesive on the upper part of the terminal and at least the upper part of the conductive film around the terminal.

  In the present invention, the terminal is fixed on the substrate by being at least partially embedded in a conductive film having the same composition as that of the conductor portion. That is, the conductive film functions as an adhesive that fixes the terminal on the substrate. Therefore, according to this invention, the wiring member for windows which can fix a terminal on a board | substrate can be provided, without using the solder as an adhesion member separately.

1 is an overall configuration diagram of a vehicle window in which a window wiring member according to Embodiment 1 of the present invention is used. It is a top view of the terminal part shown in FIG. It is sectional drawing along the III-III line in FIG. It is a flowchart which shows the manufacturing method of the window shown in FIG. It is a 1st sectional view of a portion of a terminal part in a manufacture stage of a window. It is a 2nd sectional view of a portion of a terminal part in a manufacture stage of a window. It is a 3rd sectional view of the portion of a terminal part in the manufacture stage of a window. It is a 4th sectional view of a portion of a terminal part in a manufacture stage of a window. 6 is a cross-sectional view of a terminal portion in a first modification of the first embodiment. FIG. FIG. 10 is a cross-sectional view of a terminal portion in a second modification of the first embodiment. FIG. 10 is a plan view of a terminal portion in the second embodiment. It is sectional drawing along the XII-XII line | wire in FIG. FIG. 10 is a cross-sectional view of a terminal portion in the third embodiment. FIG. 10 is a cross-sectional view of a terminal portion in a first modification of the third embodiment. FIG. 10 is a cross-sectional view of a terminal portion in a second modification of the third embodiment. FIG. 10 is a cross-sectional view of a terminal portion in the fourth embodiment. 10 is a flowchart showing a window manufacturing method according to the fourth embodiment. FIG. 10 is a cross-sectional view of a terminal portion in a modification of the fourth embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, although several embodiment is described below, combining the structure demonstrated by each embodiment suitably is planned from the beginning of an application. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated.

[Embodiment 1]
FIG. 1 is an overall configuration diagram of a vehicle window using a window wiring member according to Embodiment 1 of the present invention. Referring to FIG. 1, window 10 includes a substrate 20, a conductive wire 30, a conductive band 40, a terminal portion 50, and a terminal 52. The window 10 is for a vehicle and is typically a rear window, but can be applied to other windows.

  The board | substrate 20 is a transparent plate-shaped member, for example, is comprised by the resin panel etc., such as a glass plate and a polycarbonate or an acryl. Although not explicitly shown in FIG. 1, in the first embodiment, the surface of the substrate 20 is subjected to organic, inorganic, or organic / inorganic composite type hard coat treatment.

  The conducting wire 30 is made of a metallic member and is formed on the substrate 20. The conducting wire 30 is formed by applying a wiring pattern with a silver paste or the like with a dispenser and baking it, and typically constitutes a heat wire of a defogger or a defroster, an antenna for broadcast reception, or the like. A plurality of conductive wires 30 are generally wired, but the number and arrangement thereof are not limited to those illustrated. Note that the wiring pattern may be formed by using a printing method such as screen printing instead of application by a dispenser.

  The conductive band 40 is also composed of a metallic member having the same composition as the conductive wire 30 and is applied onto the substrate 20 simultaneously with the formation of the conductive wire 30. For example, the conductive band 40 is provided at both ends of the conductive wire 30 and is configured continuously with the conductive wire 30. Hereinafter, the conductive wire 30 and the conductive band 40 are also collectively referred to as a “conductive wire portion”.

  The terminal portion 50 is electrically connected to the conductive band 40 and is formed on the substrate 20. As an example, the terminal portion 50 is provided at the end of the conductive band 40, but may be provided at another location. The terminal portion 50 includes a conductive film (described later) having the same composition as the conductive band 40 and a metallic terminal 52 fixed to the conductive film. The terminal 52 is configured to be connectable to a power supply line for supplying a current to the conducting wire 30, a feeder line connected to the antenna receiving circuit, or the like (both not shown).

  FIG. 2 is a plan view of the terminal portion 50 shown in FIG. FIG. 3 is a cross-sectional view taken along line III-III in FIG. Referring to FIGS. 2 and 3, the conductive film 58 is provided on the substrate 20 at and around the location where the terminal 52 is disposed when the terminal portion 50 is viewed in plan. It is provided on the hard coat 22 formed on the surface. The composition of the conductive film 58 is the same as the composition of the conductive wire portion (conductive band 40 and conductive wire 30). Further, the conductive film 58 is formed so that the film thickness thereof is larger than the film thickness of the conductive wire portion. As an example, the film thickness of the conductive wire portion is about 10 μm, whereas the conductive film 58 can have a film thickness of 100 μm or more.

  The terminal 52 includes a joint portion 54 and a lead portion 56. The joining portion 54 is formed in a plate shape, and the drawing portion 56 is configured to be drawn from the wide surface of the joining portion 54. The bonding portion 54 is disposed so as to extend along the surface of the substrate 20 and is fixed by being embedded in the conductive film 58.

  Note that the bonding portion 54 (terminal 52) is embedded in the conductive film 58 means that the upper surface of the conductive film 58 around the bonding portion 54 (the region surrounded by the one-dot chain line in FIG. Is also located above. In the first embodiment, as shown in FIG. 3, the upper surface of the conductive film 58 around the bonding portion 54 is located above the upper surface of the bonding portion 54, that is, the bonding portion 54 is conductive. It is buried in the film 58.

  As shown in FIG. 2, when the terminal portion 50 is viewed in plan, the region of the conductive film 58 is larger than the region of the joint portion 54 of the terminal 52 and may be the entire terminal portion 50. The composition of the conductive film 58 is the same as the composition of the conductive band 40 (FIG. 1) as described above, and the connection portion between the conductive film 58 and the conductive wire portion (conductive band 40) is continuous in composition.

  In the first embodiment, a conductive film 58 having the same composition as that of the conductive wire portion is continuously formed on the conductive band 40 using a coating device such as a dispenser, and the terminal 52 is embedded in the thick conductive film 58. As a result, the terminal 52 is fixed. Accordingly, the terminal 52 can be fixed on the substrate 20 without using solder or conductive adhesive for bonding the terminal on the thin-film conductive wire print.

  FIG. 4 is a flowchart showing a method for manufacturing the window 10 shown in FIG. 5 to 8 are cross-sectional views of the portion of the terminal portion 50 in the manufacturing stage of the window 10. Referring to FIGS. 5 to 8 together with FIG. 4, first, a hard coat process for forming hard coat 22 on the surface of substrate 20 is performed (step S10, FIG. 5). Next, a conductive wire portion (conductive wire 30 and conductive band 40) is formed on the substrate 20 that has been subjected to the hard coat process (step S20).

  Subsequently, in the terminal portion 50, a conductive film 58 is formed on the substrate 20 that has been subjected to the hard coat process (step S30, FIG. 6). The conductive film 58 is formed to be a thick film (for example, a film thickness of 100 μm or more).

  Next, before the conductive film 58 is cured, the terminal 52 is embedded in the conductive film 58 in the terminal portion 50 (step S40, FIG. 7). In the first embodiment, the thickness of the bonding portion 54 of the terminal 52 is smaller than the thickness of the conductive film 58, and the bonding portion 54 is buried in the conductive film 58. Then, after the process of embedding the terminals 52 in the conductive film 58, a curing process is performed in which the conductive film 58 is baked and cured (step S50, FIG. 8). This curing process is performed, for example, by irradiating with ultraviolet rays (UV) or laser, or by blowing warm air.

  The hardening process of the conductive wire portion (the conductive wire 30 and the conductive band 40) is performed together with the hardening process of the conductive film 58.

  In the above description, the conductive film 58 is formed after the conductive wire portion is formed. However, the conductive wire portion and the conductive film 58 may be formed at the same time, or the conductive wire portion is formed after the conductive film 58 is formed. May be.

  As described above, in the first embodiment, the terminal 52 is fixed on the substrate 20 by being embedded in the conductive film 58 having the same composition as the conductive wire portion (conductive wire 30 and conductive band 40). That is, the conductive film 58 functions as an adhesive that fixes the terminal 52 on the substrate 20. Therefore, according to the first embodiment, the terminal 52 can be fixed on the substrate 20 without separately using a member such as solder or a conductive adhesive.

[Variation 1 of Embodiment 1]
FIG. 9 is a cross-sectional view of terminal portion 50 in Modification 1 of Embodiment 1. In FIG. This figure corresponds to FIG. 3 described above. Referring to FIG. 9, the terminal 52 is fixed on the substrate 20 by partially burying the bonding portion 54 in the conductive film 58. That is, in Embodiment 1 described above, the joint portion 54 of the terminal 52 is buried in the conductive film 58 (FIG. 3), but in Modification 1, the upper surface of the conductive film 58 around the joint portion 54 is Although located above the lower surface of the joint portion 54, it is located below the upper surface of the joint portion 54.

  As described above, the terminal 52 can be fixed on the substrate 20 also by embedding a part of the terminal 52 (joining portion 54) in the conductive film 58.

[Modification 2 of Embodiment 1]
FIG. 10 is a cross-sectional view of terminal portion 50 in the second modification of the first embodiment. Referring to FIG. 10, terminal 52 is embedded in conductive film 58 and is disposed such that the lower surface of bonding portion 54 is in contact with hard coat 22. In the second modification, the thickness of the bonding portion 54 is thinner than the thickness of the conductive film 58 and the bonding portion 54 is buried in the conductive film 58, but the thickness of the bonding portion 54 is the thickness of the conductive film 58. It may be thicker.

  As for the manufacturing method, in the first embodiment, the terminal 52 is embedded after the conductive film 58 is formed (before curing). However, in the second modification, the terminal 52 is disposed on the hard coat 22. Then, since the conductive film 58 can be formed using a coating apparatus such as a dispenser, the manufacturing can be simplified as compared with the first embodiment.

[Embodiment 2]
FIG. 11 is a plan view of terminal portion 50 in the second embodiment. FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. Referring to FIGS. 11 and 12, terminal portion 50 in the second embodiment includes a conductive film 58 and a terminal 52A.

  Terminal 52A is different from the configuration of terminal 52 in the first embodiment shown in FIG. 2 in that hole 60 is provided. The hole 60 is provided so as to penetrate the joint portion 54 of the terminal 52A. The number of holes 60 is preferably plural, but may be one and is not particularly limited. Further, the shape of the hole 60 is not limited to a round shape, and may be other shapes.

  When the terminal 52 </ b> A is embedded in the conductive film 58, the paint (before curing) of the conductive film 58 enters the hole 60. Preferably, the paint of the conductive film 58 overflows from the hole 60 onto the joint 54. By curing the conductive film 58 in this state, the terminal 52A can be firmly fixed by the conductive film 58 (anchor effect).

  According to the second embodiment, since the hole 60 into which the paint for the conductive film 58 enters is provided in the joint portion 54 of the terminal 52A, the terminal 52A can be firmly fixed to the conductive film 58 by the anchor effect.

[Embodiment 3]
In the first embodiment, the hard coat 22 is provided on the surface of the substrate 20, but in the present invention, the hard coat 22 is not an essential configuration. In the third embodiment, a configuration in which the hard coat 22 is not provided on the surface of the substrate 20 is shown.

  FIG. 13 is a cross-sectional view of terminal portion 50 in the third embodiment. This figure also corresponds to FIG. 3 described above. Referring to FIG. 13, conductive film 58 is provided on the surface of substrate 20. That is, the hard coat is not formed on the surface of the substrate 20, and the conductive film 58 is directly provided on the surface of the substrate 20. Other configurations are the same as those of the terminal portion 50 shown in FIG.

According to the third embodiment, the same effect as in the first embodiment can be obtained.
Although not particularly illustrated, the terminal 52A in the second embodiment may be provided instead of the terminal 52. Thereby, the terminal 52A can be firmly fixed to the conductive film 58.

[Modification 1 of Embodiment 3]
FIG. 14 is a cross-sectional view of terminal portion 50 in Modification 1 of Embodiment 3. Referring to FIG. 14, the terminal 52 is fixed on the substrate 20 by partially burying the bonding portion 54 in the conductive film 58. That is, the bonding portion 54 is not buried in the conductive film 58, and the upper surface of the conductive film 58 around the bonding portion 54 is located above the lower surface of the bonding portion 54, but below the upper surface of the bonding portion 54. positioned.

[Modification 2 of Embodiment 3]
FIG. 15 is a cross-sectional view of terminal portion 50 in the second modification of the third embodiment. Referring to FIG. 15, terminal 52 is embedded in conductive film 58 and is disposed such that the lower surface of bonding portion 54 is in contact with substrate 20. Note that the thickness of the bonding portion 54 may be larger than the thickness of the conductive film 58.

  As for the manufacturing method, the terminal 52 may be embedded after the conductive film 58 is formed (before curing), or the terminal 52 is disposed on the substrate 20 and then the conductive film 58 is formed using a coating device such as a dispenser. It may be formed.

[Embodiment 4]
FIG. 16 is a cross-sectional view of terminal portion 50A in the fourth embodiment. Referring to FIG. 16, terminal portion 50 </ b> A further includes an adhesive 70 in the configuration of terminal portion 50 shown as the first modification of the first embodiment (FIG. 9).

  The adhesive 70 is provided in a film shape on the upper part of the terminal 52 (joining part 54) and on the conductive film 58 at least around the terminal 52 (joining part 54), and increases the holding strength of the terminal 52. The adhesive 70 is typically a non-conductive (insulating) adhesive. This is because the terminal 52 is in direct contact with the conductive film 58 at the joint portion 54, and thus the electrical conductivity between the terminal 52 and the conductive film 58 is high, and it is not necessary to use a conductive adhesive. And by using a non-conductive adhesive, the material cost can be reduced compared to the conductive adhesive, the manufacturing cost can be reduced by curing at room temperature, the cost can be reduced due to the need for no conductivity evaluation, etc. Can also be expected.

  Although not particularly illustrated, the adhesive 70 may be provided on the conductive film 58 even when the joint portion 54 of the terminal 52 is buried in the conductive film 58. Further, in the configuration of the second embodiment in which the hole 60 is provided in the joint portion 54, an adhesive 70 may be further provided. Even in these cases, the holding strength of the terminal 52 is increased by providing the adhesive 70 on the upper portion of the joint portion 54 of the terminal 52.

  FIG. 17 is a flowchart showing a method for manufacturing window 10 in the fourth embodiment. Referring to FIG. 17, this flowchart further includes step S60 in the flowchart shown in FIG. That is, when the terminal 52 is embedded in the conductive film 58 in step S40 and the conductive film 58 is cured in step S50, the conductive film 58 on the bonding portion 54 of the terminal 52 and at least around the bonding portion 54 is formed. An adhesive coating process for forming a film-like adhesive 70 is performed on the upper portion (step S60). For the forming process of the adhesive 70, for example, a coating device such as a dispenser can be used.

  In the above flowchart, the conductive film 58 is formed after the conductive wire portion is formed. However, the conductive wire portion and the conductive film 58 may be formed simultaneously, or the conductive wire portion is formed after the conductive film 58 is formed. May be.

  As described above, according to the fourth embodiment, since the adhesive 70 is further provided, the holding strength of the terminal 52 is increased. Moreover, since a non-conductive adhesive can be used for the adhesive 70, this can reduce material costs compared with a conductive adhesive, and also can reduce the manufacturing cost by room temperature curing. In addition, cost reduction due to the need for conductivity evaluation can be realized.

[Modification of Embodiment 4]
FIG. 18 is a cross-sectional view of terminal portion 50A in a modification of the fourth embodiment. This figure corresponds to FIG. Referring to FIG. 18, conductive film 58 is provided on the surface of substrate 20. That is, the hard coat is not formed on the surface of the substrate 20, and the conductive film 58 is directly provided on the surface of the substrate 20. The other configuration is the same as that of the terminal portion 50A shown in FIG.

Also by the modification of the fourth embodiment, the same effect as that of the fourth embodiment can be obtained.
In each of the embodiments described above, the window 10 is a vehicle window. However, the scope of application of the present invention is not necessarily limited to a vehicle window, and a window for other purposes. Can also be included.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and is intended to include meanings equivalent to the scope of claims for patent and all modifications within the scope.

  10 window, 20 substrate, 22 hard coat, 30 conductor, 40 conductive band, 50, 50A terminal, 52, 52A terminal, 54 joint, 56 lead-out, 58 conductive film, 60 holes, 70 adhesive.

Claims (6)

A conductor portion provided on a transparent substrate constituting the window;
A conductive film provided on the substrate and electrically connected to the conductor portion;
A metallic terminal fixed on the substrate by being at least partially embedded in the conductive film,
The composition of the conductive film is the same as the composition of the conductor portion,
A wiring member for a window, further comprising a film-like adhesive provided on an upper portion of the terminal and at least an upper portion of the conductive film around the terminal. The terminal includes a plate-like joint extending along the surface of the substrate,
The window wiring member according to claim 1, wherein an upper surface of the conductive film around the joint is positioned above a lower surface of the joint.   The window wiring member according to claim 2, wherein at least one hole is formed in the joint portion.   The window wiring member according to claim 1, wherein the adhesive is a non-conductive adhesive.   A vehicle window comprising the window wiring member according to claim 1. A method for manufacturing a wiring member for a window,
The wiring member for window is
A conductor portion provided on a transparent substrate constituting the window;
A conductive film provided on the substrate and electrically connected to the conductor portion;
A metallic terminal fixed on the substrate by being at least partially embedded in the conductive film,
The composition of the conductive film is the same as the composition of the conductor portion,
The manufacturing method includes:
Forming the conductive film on the substrate by coating;
Embedding the terminal in the conductive film before the conductive film is cured;
Curing the conductive film after the terminal is embedded in the conductive film;
The top of the terminal, and at least including a step of forming a film-like adhesive on top of the conductive layer at the periphery of the terminal, method of manufacturing window interconnection member.

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