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JP6140012B2 - 貼り合わせ基板のブレイク方法 - Google Patents

貼り合わせ基板のブレイク方法 Download PDF

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Publication number
JP6140012B2
JP6140012B2 JP2013142720A JP2013142720A JP6140012B2 JP 6140012 B2 JP6140012 B2 JP 6140012B2 JP 2013142720 A JP2013142720 A JP 2013142720A JP 2013142720 A JP2013142720 A JP 2013142720A JP 6140012 B2 JP6140012 B2 JP 6140012B2
Authority
JP
Japan
Prior art keywords
substrate
scribe line
breaking
forming
terminal region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013142720A
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English (en)
Japanese (ja)
Other versions
JP2015013782A (ja
Inventor
圭介 富永
圭介 富永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2013142720A priority Critical patent/JP6140012B2/ja
Priority to TW103112366A priority patent/TWI610893B/zh
Priority to TW106129587A priority patent/TWI694975B/zh
Priority to KR1020140041424A priority patent/KR102205577B1/ko
Priority to CN201410166455.0A priority patent/CN104276750B/zh
Publication of JP2015013782A publication Critical patent/JP2015013782A/ja
Application granted granted Critical
Publication of JP6140012B2 publication Critical patent/JP6140012B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/07Cutting armoured, multi-layered, coated or laminated, glass products
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Liquid Crystal (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2013142720A 2013-07-08 2013-07-08 貼り合わせ基板のブレイク方法 Expired - Fee Related JP6140012B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013142720A JP6140012B2 (ja) 2013-07-08 2013-07-08 貼り合わせ基板のブレイク方法
TW103112366A TWI610893B (zh) 2013-07-08 2014-04-02 貼合基板之分斷裝置
TW106129587A TWI694975B (zh) 2013-07-08 2014-04-02 貼合基板之分斷裝置
KR1020140041424A KR102205577B1 (ko) 2013-07-08 2014-04-07 접합 기판의 브레이크 방법
CN201410166455.0A CN104276750B (zh) 2013-07-08 2014-04-23 贴合基板的裂断装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013142720A JP6140012B2 (ja) 2013-07-08 2013-07-08 貼り合わせ基板のブレイク方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017086482A Division JP6297192B2 (ja) 2017-04-25 2017-04-25 貼り合わせ基板のブレイク装置

Publications (2)

Publication Number Publication Date
JP2015013782A JP2015013782A (ja) 2015-01-22
JP6140012B2 true JP6140012B2 (ja) 2017-05-31

Family

ID=52252165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013142720A Expired - Fee Related JP6140012B2 (ja) 2013-07-08 2013-07-08 貼り合わせ基板のブレイク方法

Country Status (4)

Country Link
JP (1) JP6140012B2 (zh)
KR (1) KR102205577B1 (zh)
CN (1) CN104276750B (zh)
TW (2) TWI694975B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102486357B1 (ko) * 2022-08-02 2023-01-09 최호림 유리 절단 장치

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9685579B2 (en) 2014-12-05 2017-06-20 Solarcity Corporation Photovoltaic structure cleaving system
US9899546B2 (en) 2014-12-05 2018-02-20 Tesla, Inc. Photovoltaic cells with electrodes adapted to house conductive paste
JP6540272B2 (ja) * 2015-06-26 2019-07-10 三星ダイヤモンド工業株式会社 ブレイク装置及びブレイク方法
JP2017095294A (ja) * 2015-11-20 2017-06-01 三星ダイヤモンド工業株式会社 基板分断装置
JP6716900B2 (ja) * 2015-12-04 2020-07-01 三星ダイヤモンド工業株式会社 分断装置
JP6763239B2 (ja) * 2016-08-29 2020-09-30 セイコーエプソン株式会社 電気光学装置の製造方法、電気光学装置および電子機器
JP2018069614A (ja) * 2016-10-31 2018-05-10 三星ダイヤモンド工業株式会社 基板分断装置
JP6891561B2 (ja) * 2017-03-16 2021-06-18 日本電気硝子株式会社 ガラス板の製造方法および製造装置
KR102267730B1 (ko) * 2019-05-14 2021-06-23 주식회사 탑 엔지니어링 스크라이브 장치의 제어 방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54137358A (en) * 1978-04-18 1979-10-25 Seikosha Kk Method of cutting glass
JPH0725633A (ja) * 1993-07-09 1995-01-27 Kanegafuchi Chem Ind Co Ltd ガラス基板の折割り方法及びその装置
JP4058542B2 (ja) * 1997-05-30 2008-03-12 三星ダイヤモンド工業株式会社 基板ブレイク装置、基板ブレイク方法、基板分断装置および基板分断システム
JP3787489B2 (ja) 2000-10-02 2006-06-21 三星ダイヤモンド工業株式会社 脆性基板のブレイク方法及び装置
WO2003002471A1 (fr) * 2001-06-28 2003-01-09 Mitsuboshi Diamond Industrial Co., Ltd Dispositif et procede permettant de decouper un substrat realise dans une matiere fragile
TWI226877B (en) * 2001-07-12 2005-01-21 Mitsuboshi Diamond Ind Co Ltd Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates
JP2003131185A (ja) 2001-10-23 2003-05-08 Matsushita Electric Ind Co Ltd 液晶表示装置の製造方法
KR100817129B1 (ko) * 2002-02-07 2008-03-27 엘지.필립스 엘시디 주식회사 액정 패널의 절단 장치 및 그 방법
KR101164491B1 (ko) * 2003-04-28 2012-07-18 미쓰보시 다이야몬도 고교 가부시키가이샤 취성기판 절단 시스템 및 취성기판 절단방법
JP4742649B2 (ja) * 2005-04-05 2011-08-10 ソニー株式会社 貼り合わせ基板の基板ブレイク装置及びその基板ブレイク方法
KR101211426B1 (ko) * 2005-07-06 2012-12-12 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료용 스크라이빙 휠, 및 이를 이용한 스크라이브 방법, 스크라이브 장치 및 스크라이브 공구
JP4251203B2 (ja) * 2006-08-29 2009-04-08 セイコーエプソン株式会社 貼合せマザー基板のスクライブ方法および貼合せマザー基板の分割方法
JP2009083079A (ja) * 2007-10-03 2009-04-23 Seiko Epson Corp 貼合せ基板の分断装置および貼合せ基板の分断方法
JP2009262520A (ja) * 2008-04-28 2009-11-12 Mitsuboshi Diamond Industrial Co Ltd 脆性材料ブレーク装置及び脆性材料ブレーク方法
JP5330845B2 (ja) * 2009-01-30 2013-10-30 三星ダイヤモンド工業株式会社 基板ブレーク装置
JP2011141144A (ja) * 2010-01-06 2011-07-21 Sony Corp 電子機器、測位デバイス、情報処理方法およびプログラム
JP5216040B2 (ja) * 2010-03-31 2013-06-19 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法
JP5831119B2 (ja) * 2011-10-17 2015-12-09 日本電気硝子株式会社 ガラス基板割断装置、ガラス基板割断方法及びガラス基板作製方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102486357B1 (ko) * 2022-08-02 2023-01-09 최호림 유리 절단 장치

Also Published As

Publication number Publication date
TW201502095A (zh) 2015-01-16
TW201805253A (zh) 2018-02-16
CN104276750B (zh) 2018-11-02
JP2015013782A (ja) 2015-01-22
KR20150006337A (ko) 2015-01-16
CN104276750A (zh) 2015-01-14
TWI694975B (zh) 2020-06-01
TWI610893B (zh) 2018-01-11
KR102205577B1 (ko) 2021-01-20

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