JP6081258B2 - Mounting board - Google Patents

Description

  The present invention relates to a mounting substrate in which elements are mounted on a substrate.

  In a sensor device or the like, a mounting substrate in which a sensor element is mounted on a substrate is used, and the mounting substrate is fixed to various devices with screws. At that time, as a result of stress being applied to the mounting board from the fixed portion by the screw, deformation as shown in the simulation result in FIG. 7 occurs in the mounting board. FIG. 7A is an explanatory diagram showing the distribution of the deformation amount in the plane of the mounting substrate 500 when the screws 88a and 88b are used for fixing, and FIGS. It is explanatory drawing which shows the deformation amount of the mounting substrate when it sees from the arrow Fa of a), and explanatory drawing which shows the deformation amount of the mounting substrate when it sees from the arrow Fb of Fig.7 (a). As can be seen from FIG. 7, when the mounting board is fixed by screws 88a and 88b, stress is applied to the mounting board, and as a result, a portion located in a direction perpendicular to the imaginary line connecting the positions where the screws 88a and 88b are stopped is lifted Deformation that tries to rise occurs. As a result, there is a problem that the output from the sensor element or the like mounted on the mounting board varies.

  For example, the magnetic sensor device employs a mounting substrate structure in which a magnetosensitive element is mounted on a substrate. In such a magnetosensitive element, a plurality of magnetosensitive films made of a magnetoresistive film are formed on one surface of the element substrate, and output from a two-phase (A phase and B phase) bridge circuit constituted by the plurality of magnetosensitive films. Based on the output, the angular velocity and angular position of the rotating body are detected. At that time, when a stress is applied to the magnetosensitive element along with the deformation of the mounting substrate, the stress is applied to the magnetosensitive film. Here, when the bridge circuit is configured by the magnetosensitive film, even if stress is applied to each magnetosensitive film and a resistance change occurs, the change should be canceled out. However, in a magnetic sensor device using a magnetosensitive film, even when a bridge circuit is constituted by the magnetosensitive film, the output varies if the stress applied to the plurality of magnetosensitive films is different.

  On the other hand, a configuration has been proposed in which the periphery of the element mounting region is surrounded by a slit in the mounting substrate (see Patent Document 1). In addition, a configuration in which a slit is provided between a mounting position and a position where a screw is stopped on a mounting board has been proposed (see Patent Documents 2 and 3).

JP-A-9-148687 JP 2002-158407 A JP 2007-305921 A

  However, as in Patent Documents 1 to 3, in the case of a configuration in which the transmission of stress from the outside to the mounting region is relaxed by the slit, the mounting region is narrowed, so that electrical components such as capacitors and resistors are located in the vicinity of the sensor element. Will be placed. As a result, when the environmental temperature changes, stress is generated in the inner mounting area due to the difference in the thermal expansion coefficient between the solder used for mounting the electrical component and the board, and this stress is applied to the sensor element to output. A new problem of fluctuating occurs.

  In view of the above problems, an object of the present invention is to prevent stress from being applied to an element even when a board on which a plurality of electrical components are mounted around the element for signal generation is fixed with screws. An object of the present invention is to provide a mounting board that can be used.

  In order to solve the above problems, a mounting board according to the present invention is mounted around a board, an element for signal generation mounted in an inner mounting area of the board, and the element in the inner mounting area. And a plurality of holes for fixing the substrate with screws, and the inner mounting region and the hole are connected between the inner mounting region and the hole. Slits extending in a direction intersecting the imaginary line are formed, and in plan view, part or all of the plurality of electric components sandwich both sides of the element in the first direction in the in-plane direction of the substrate. It is implemented in.

  In the present invention, since a slit is formed between the inner mounting area where the element and the electrical component are mounted and the hole for fixing the board with the screw, the board is fixed with the screw using the hole. The stress is absorbed by the slit. Therefore, the stress at the time of fixing with the screw is not easily transmitted to the inner mounting region. Also, in the inner mounting region, some or all of the plurality of electrical components are mounted on both sides sandwiching the element in the first direction, so that when the environmental temperature changes, the solder and substrate used for mounting the electrical components Even if stress is generated in the inner mounting region due to the difference in thermal expansion coefficient, the stress is applied isotropically to the element in the first direction. Therefore, fluctuations in the output from the element due to stress can be suppressed.

  In the present invention, in the plan view, a part of the plurality of electrical components is mounted on both sides of the element in the first direction, and the other part is orthogonal to the first direction in the in-plane direction of the substrate. It is preferable to be mounted on both sides of the element in the second direction. According to this configuration, when the environmental temperature changes, even if stress is generated in the inner mounting region due to the difference in thermal expansion coefficient between the solder used for mounting the electrical component and the substrate, the element can be used in the second direction. Stress is applied isotropically. Therefore, fluctuations in the output from the element due to stress can be suppressed.

  In the present invention, when n is an integer greater than or equal to 2, it is preferable that the mounting positions of the plurality of electrical components have a relationship of n-fold rotational symmetry about the element. According to such a configuration, when the environmental temperature changes, even if stress is generated in the inner mounting region due to the difference in thermal expansion coefficient between the solder used for mounting the electrical component and the substrate, the stress is applied to the element. It will be added isotropically. Therefore, fluctuations in the output from the element due to stress can be suppressed.

  In the present invention, it is preferable that the mounting positions of the same type of electrical component among the plurality of electrical components have a relationship of n-fold rotational symmetry about the element. According to such a configuration, when the environmental temperature changes, even if stress is generated in the inner mounting region due to the difference in thermal expansion coefficient between the solder used for mounting the electrical component and the substrate, the stress is applied to the element. It will be added isotropically. Therefore, fluctuations in the output from the element due to stress can be suppressed. “The same type” in the present invention means that the functions are the same and the sizes are the same, such as resistance to each other or capacitors to each other. It corresponds to the same kind.

  In the present invention, the slit extends so as to surround the inner mounting region, leaving a band-shaped connecting portion in a part of the circumferential direction surrounding the inner mounting region, and the plurality of holes are formed between the holes. It is preferable that the imaginary line which connects is formed in the position which cross | intersects the extension direction of the said connection part diagonally. According to such a configuration, the stress when the board is fixed with screws using the holes is not easily transmitted to the inner mounting region via the connecting portion.

  In this invention, it is preferable that the imaginary line which connects the said holes cross | intersects at the angle of 45 degrees +/- 15 degrees with respect to the extension direction of the said connection part. According to such a configuration, the stress when the board is fixed with screws using the holes is not easily transmitted to the inner mounting region via the connecting portion.

  In the present invention, the plurality of holes are preferably two holes arranged on both sides sandwiching the inner mounting region. According to such a configuration, since the fixing portion by the screw can be stopped to the minimum necessary, the stress when the substrate is fixed by the screw using the hole is small.

  In the present invention, the element and the electrical component may be configured to be mounted on one surface of the substrate.

  In the present invention, a configuration in which another electric component is mounted on the other surface of the substrate at a position overlapping the element can be employed. According to such a configuration, stress can be canceled on both sides of the inner mounting region, so that stress is hardly applied to the element.

  In this invention, it is preferable that the said board | substrate is provided with the outer side mounting area | region in which another electric component was mounted in the opposite side to the said inner side mounting area | region with respect to the said slit. According to such a configuration, it is possible to mount an electrical component that is likely to apply stress to the element when placed in the vicinity of the element on the outside (outer mounting region) of the slit.

  In the present invention, the element may be a sensor element.

  In the present invention, the sensor element may employ a configuration that is a magnetosensitive element including a magnetosensitive film that forms a bridge circuit.

  In the present invention, since a slit is formed between the inner mounting area where the element and the electrical component are mounted and the hole for fixing the board with the screw, the board is fixed with the screw using the hole. The stress is absorbed by the slit. Therefore, the stress at the time of fixing with the screw is not easily transmitted to the inner mounting region. Also, in the inner mounting region, some or all of the plurality of electrical components are mounted on both sides sandwiching the element in the first direction, so that when the environmental temperature changes, the solder and substrate used for mounting the electrical components Even if stress is generated in the inner mounting region due to the difference in thermal expansion coefficient, the stress is applied isotropically to the element in the first direction. Therefore, fluctuations in the output from the element due to stress can be suppressed.

It is explanatory drawing which shows the structure of the magnetic sensor apparatus provided with the mounting substrate which concerns on Embodiment 1 of this invention, and a rotary encoder. It is explanatory drawing which shows the detection principle of the magnetic sensor apparatus provided with the mounting substrate which concerns on Embodiment 1 of this invention. It is a top view of the mounting substrate concerning Embodiment 1 of the present invention. It is a top view of the mounting substrate which concerns on Embodiment 2 of this invention. It is sectional drawing of the mounting substrate which concerns on Embodiment 3 of this invention. It is a top view of the mounting substrate which concerns on Embodiment 4 of this invention. It is explanatory drawing which shows the simulation result of the deformation | transformation accompanying the stress added to a board | substrate.

  Hereinafter, a mounting substrate to which the present invention is applied will be described with reference to the drawings. In the following description, a mounting substrate for a magnetic sensor device will be described as a mounting substrate. In the following description, one of the X direction and the Y direction intersecting in the in-plane direction of the substrate 50 corresponds to the “first direction”, and the other corresponds to the “second direction”.

[Embodiment 1]
FIG. 1 is an explanatory diagram showing the configuration of a magnetic sensor device 10 including a mounting substrate and a rotary encoder 1 according to Embodiment 1 of the present invention. FIGS. 1 (a) and 1 (b) are magnetic sensing elements. 4 is an explanatory diagram of a signal processing system for 4 and the like, and an explanatory diagram of a holder for fixing a mounting board on which a magnetosensitive element 4 and the like are mounted to a fixed body side. FIG. 2 is an explanatory diagram showing the detection principle of the magnetic sensor device 10 including the mounting substrate according to the first embodiment of the present invention. FIGS. 2 (a), (b), (c), and (d) , An explanatory diagram showing an electrical connection structure of the A-phase magnetosensitive film, an explanatory diagram showing an electrical connection structure of the B-phase magnetosensitive film, an explanatory diagram of a signal output from the magnetosensitive element 4, It is explanatory drawing which shows the relationship between this signal and the angular position (electrical angle) of the rotary body 2. FIG.

  A rotary encoder 1 shown in FIG. 1A is a device that magnetically detects rotation around an axis (rotation axis) of a rotating body 2 with respect to a fixed body (not shown) by a magnetic sensor device 10. Is fixed to a frame or the like of the motor device via a holder 8 or the like shown in FIG. 1B, and the rotating body 2 is used in a state of being connected to a rotation output shaft or the like of the motor device. On the side of the rotating body 2, a magnet 20 is held that directs the magnetized surface 21 in which the N pole and the S pole are magnetized one by one in the circumferential direction to one side in the rotation axis direction L. It rotates around the rotation axis integrally with the rotating body 2.

  On the fixed body side, there is a magnetic sensor device 10 including a magnetosensitive element 4 that faces the magnetized surface 21 of the magnet 20 on one side in the rotation axis direction L, a control unit 90 that performs processing to be described later, and the like. Is provided. In addition, the magnetic sensor device 10 includes a first hall element 61 and a second hall element 62 located at a position that is shifted by 90 ° in the circumferential direction with respect to the first hall element 61 at a position facing the magnet 20. And.

  The magnetosensitive element 4 includes a two-phase magnetosensitive film (A-phase (SIN) magnetosensitive film and B-phase (COS)) having a phase difference of 90 ° with respect to the phase of the element substrate 40 and the magnet 20. Magnetoresistive element). In the magnetosensitive element 4, the A phase magnetosensitive film includes a + A phase (SIN +) magnetosensitive film 43 that detects movement of the rotating body 2 with a phase difference of 180 °, and a −A phase (SIN−) sensitivity. The B-phase magnetosensitive film includes a + B-phase (COS +) magnetosensitive film 44 that detects movement of the rotating body 2 with a phase difference of 180 °, and a -B-phase (COS-) magnetosensitive film 41. A magnetosensitive film 42 is provided.

  The + A phase magnetosensitive film 43 and the -A phase magnetosensitive film 41 constitute the bridge circuit shown in FIG. 2A, one end of which is connected to the A phase power supply terminal VccA and the other end is It is connected to the A phase ground terminal GNDA. An output terminal + A from which the + A phase is output is provided at the midpoint position of the + A phase magnetosensitive film 43, and an output from which the −A phase is output at the midpoint position of the −A phase magnetosensitive film 41. Terminal -A is provided. Similarly to the + A-phase sensitive film 44 and the -A-phase sensitive film 41, the + B-phase sensitive film 44 and the -B-phase sensitive film 42 also constitute the bridge circuit shown in FIG. One end is connected to the B-phase power supply terminal VccB, and the other end is connected to the B-phase ground terminal GNDB. An output terminal + B from which a + B phase is output is provided at the midpoint position of the + B phase magnetosensitive film 44, and an output from which the −B phase is output at the midpoint position of the −B phase magnetosensitive film 42. Terminal -B is provided. In FIG. 2, for convenience, the A-phase power supply terminal VccA and the B-phase power supply terminal VccB are shown, but the A-phase power supply terminal VccA and the B-phase power supply terminal VccB are common. May be. For convenience, FIG. 2 shows the A-phase ground terminal GNDA and the B-phase ground terminal GNDB, but the A-phase ground terminal GNDA and the B-phase ground terminal GNDB are common. May be.

As shown in FIG. 1A, the magnetic sensing element 4 having such a configuration is disposed at a position where the magnet 20 overlaps the magnetization boundary portion in the rotation axis direction L. For this reason, the magnetic sensitive films 41 to 44 of the magnetic sensitive element 4 are rotated so that the direction of the magnetic sensitive films 41 to 44 changes in the in-plane direction of the magnetized surface 21 with a magnetic field strength equal to or higher than the saturation sensitivity region of the resistance value of each of the magnetic sensitive films 41 to 44. A magnetic field can be detected. That is, a rotating magnetic field whose direction in the in-plane direction changes with a magnetic field strength equal to or higher than the saturation sensitivity region of the resistance value of each of the magnetic sensitive films 41 to 44 is generated at the magnetization boundary line portion. Here, the saturation sensitivity region generally refers to a region other than the region in which the resistance value change amount k can be approximately expressed by the magnetic field strength H and the expression “k∝H ² ”. The principle of detecting the direction of the rotating magnetic field (rotation of the magnetic vector) with a magnetic field strength equal to or higher than the saturation sensitivity region is that a magnetic field strength that saturates the resistance value is applied while the magnetic sensitive films 41 to 44 are energized. When the angle θ formed by the magnetic field and the current direction and the resistance value R of the magnetosensitive films 41 to 44 are expressed by the following formula: R = R0−k × sin2θ
R0: resistance value in a non-magnetic field k: resistance value change (a constant when the saturation sensitivity region is exceeded)
The fact that there is a relationship indicated by is used. If the rotating magnetic field is detected based on such a principle, the resistance value R changes along the sine wave when the angle θ changes, so that an A-phase output and a B-phase output with high waveform quality can be obtained.

  In the magnetic sensor device 10 and the rotary encoder 1 of the present embodiment, the magnetosensitive element 4, the first Hall element 61, and the second Hall element 62 include amplification circuits 91, 92, 95, and 96, and amplification circuits 91, A control unit 90 including a CPU (arithmetic circuit) that performs interpolation processing and various arithmetic processings on the sine wave signals sin and cos output from 92, 95, and 96 is configured. Based on the outputs from the element 61 and the second Hall element 62, the rotational angle position of the rotating body 2 with respect to the fixed body is obtained.

More specifically, in the rotary encoder 1, when the rotating body 2 makes one rotation, the sine wave signals sin and cos shown in FIG. 2C are output from the magnetosensitive element 4 (magnetoresistance element) for two cycles. Is done. Accordingly, after the sine wave signals sin and cos are amplified by the amplifier circuits 91 and 92, the control unit 90 obtains the Lissajous diagram shown in FIG. 2D, and θ = tan ⁻¹ (sin from the sine wave signals sin and cos. / Cos), the angular position θ of the rotation output shaft can be obtained. In the present embodiment, the first Hall element 61 and the second Hall element 62 are arranged at a position shifted by 90 ° from the center of the magnet 20. For this reason, it can be understood from the combination of the outputs of the first Hall element 61 and the second Hall element 62 which section of the sine wave signal sin or cos the current position is located. Accordingly, the rotary encoder 1 generates absolute angular position information of the rotating body 2 based on the detection result of the magnetic sensitive element 4, the detection result of the first Hall element 61, and the detection result of the second Hall element 62. The absolute operation can be performed.

(Fixed structure of mounting substrate 5)
In fixing the magnetosensitive element 4 shown in FIG. 1A to a fixed body, for example, a holder 8 shown in FIG. 1B is used. The holder 8 has an annular flange portion 81 and a cylindrical portion 82 protruding from the inner peripheral edge of the flange portion 81. The flange portion 81 is formed with cylindrical seat portions 84a, 84b, 84c for fixing the holder 8 to a fixed body. Two screw holes 85 a and 85 b are formed in the end plate portion 820 of the cylindrical portion 82.

  The magnetosensitive element 4 is fixed to the end plate portion 820 of the cylindrical portion 82 of the holder 8 by two screws 88a and 88b in a state of the mounting substrate 5 mounted on the substrate 50 together with electric components to be described later. For this reason, in the mounting substrate 5, the substrate 50 is formed with two holes 59a and 59b for stopping the screws 88a and 88b.

(Detailed configuration of mounting substrate 5)
FIG. 3 is a plan view of the mounting substrate 5 according to the first embodiment of the present invention. As shown in FIG. 3, the mounting substrate 5 includes a substrate 50, a magnetosensitive element 4 (element for signal generation) mounted in the inner mounting area 51 of the substrate 50, and the magnetosensitive element 4 in the inner mounting area 51. It has a plurality of electrical components 71, 72, 73 mounted around. As the electrical component 71, four components of the same type are mounted, as the electrical component 72, four components of the same type are mounted, and as the electrical component 73, two components of the same type are mounted. In such electrical parts 71, 72, 73, “the same type” means that they have the same function and the same size, such as resistance to each other or capacitors, and the capacitance, etc. Even if the ratings are different, they fall under the same category. In this embodiment, the magnetosensitive element 4 and the electrical components 71, 72, 73 are mounted on one surface 501 of the substrate 50.

  The substrate 50 is a printed wiring board in which wiring is formed on a phenol substrate, a glass-epoxy substrate, or the like. In this embodiment, the substrate 50 is in the X direction and the Y direction that intersect each other at right angles in the in-plane direction of the substrate 50. It has a quadrangular planar shape with four extending sides 50a, 50b, 50c, and 50d. The substrate 50 is formed with two holes 59a and 59b for fixing the substrate 50 with screws 88a and 88b. In this embodiment, the holes 59a and 59b are formed in the vicinity of the corners of the substrate 50 (the corners between the sides 50a and 50b and the corners between the sides 50c and 50d).

  In the substrate 50, a slit 52 is formed around the inner mounting area 51. The slit 52 connects the inner mounting area 51 and the holes 59a, 59b between the inner mounting area 51 and the holes 59a, 59b. It extends in the direction that intersects the imaginary line. More specifically, the slit 52 includes two side portions 52a and 52e that extend opposite to each other in the X direction, and two side portions 52c and 52g that extend opposite to each other and extend in the Y direction. It is an octagon with four side portions 52b, 52d, 52f, 52h extending. Therefore, the side portion 52b of the slit 52 extends in a direction intersecting with a virtual line connecting the inner mounting region 51 and the hole 59a between the inner mounting region 51 and the hole 59a, and the side portion 52f of the slit 52 is formed. Extends between the inner mounting region 51 and the hole 59b in a direction intersecting with a virtual line connecting the inner mounting region 51 and the hole 59b.

  In addition, the slit 52 extends so as to surround the inner mounting region 51 while leaving a band-shaped connecting portion 53 in a part of the circumferential direction surrounding the inner mounting region 51, and the connecting portion 53 extends from the inner mounting region 51. The wiring extends through the slit 52 to the outside.

  In this embodiment, the slit 52 leaves a band-shaped connecting portion 53 extending in the Y direction on the side portion 52a extending in the X direction. For this reason, the two holes 59a and 59b are arranged at positions where an imaginary line connecting the holes 59a and 59b obliquely intersects with the extending direction (Y direction) of the connecting portion 53. In this embodiment, the imaginary line connecting the holes 59a and 59b intersects with the extending direction of the connecting portion 53 at an angle of 45 ° ± 15 °.

(Mounting position of electrical components 71, 72, 73)
In the present embodiment, some of the plurality of electrical components 71, 72, 73 are mounted on both sides of the magnetosensitive element 4 in the X direction, and the other portion (electrical component 73) is Y. It is mounted on both sides of the magnetosensitive element 4 in the direction.

  Further, when n is an integer of 2 or more, the plurality of electrical components 71, 72, 73 are in a relationship having n-fold rotational symmetry about the magnetosensitive element 4. That is, the plurality of electrical components 71, 72, 73 are arranged at positions that overlap when rotated by (360 / n) °. In this embodiment, the plurality of electrical components 71, 72, 73 are symmetrical with respect to an axis extending in the X direction through the magnetic sensing element 4 and an axis extending in the Y direction through the magnetic sensing element 4. Since they are arranged, they have a two-fold rotational symmetry.

  In addition, among the plurality of electrical components 71, 72, and 73, the mounting positions of the same type of electrical components are in a relationship having n-fold rotational symmetry about the magnetosensitive element 4. More specifically, electrical components 71 of the same type are symmetrical with respect to an axis extending in the X direction through the magnetosensitive element 4 and an axis extending in the Y direction through the magnetosensitive element 4. Since they are arranged, they have a two-fold rotational symmetry. The same type of electrical components 72 are arranged symmetrically with respect to an axis extending in the X direction through the magnetosensitive element 4 and an axis extending through the magnetosensitive element 4 in the Y direction. For this reason, there is a relationship of two-fold rotational symmetry. Furthermore, the same kind of electrical components 73 are arranged symmetrically with respect to an axis extending in the X direction through the magnetosensitive element 4 and an axis extending through the magnetosensitive element 4 in the Y direction. For this reason, there is a relationship of two-fold rotational symmetry.

(Main effects of this form)
As described above, in the mounting substrate 5 of this embodiment, the inner mounting region 51 on which the magnetosensitive element 4 and the electrical components 71, 72, 73 are mounted, and the holes 59a, 59b for fixing the mounting substrate 5 with screws. Since the slit 52 is formed between them, stress such as tension when the mounting substrate 5 is fixed with the screws 88 a and 88 b using the holes 59 a and 59 b is absorbed by the slit 52. Further, the holes 59a and 59b are two holes arranged on both sides sandwiching the inner mounting area 51, and the fixing points by the screws 88a and 88b are the minimum necessary. For this reason, the stress when the mounting substrate 5 is fixed with the screws 88a and 88b using the holes 59a and 59b is small. Therefore, the stress when fixed by the screws 88 a and 88 b is not easily transmitted to the inner mounting region 51.

  Further, in the inner mounting region 51, a plurality of electric components 71, 72, 73 are mounted on both sides of the magnetosensitive element 4 in the X direction and the other part (electric components). 73) is mounted on both sides of the magnetosensitive element 4 in the Y direction. Therefore, when the environmental temperature changes, even if stress is generated in the inner mounting region 51 due to the difference in thermal expansion coefficient between the solder used for mounting the electrical components 71 and 72 and the substrate 50, the stress is not increased. In the X and Y directions, stress is applied to the magnetosensitive element 4 isotropically. Therefore, fluctuations in the output from the magnetosensitive element 4 due to stress can be suppressed.

  In addition, the plurality of electrical components 71, 72, 73 have a two-fold rotational symmetry about the magnetosensitive element 4. In addition, among the plurality of electrical components 71, 72, 73, the mounting positions of the same type of electrical component have a two-fold rotational symmetry. For this reason, even if stress is generated in the inner mounting region 51 due to the difference in thermal expansion coefficient between the solder used for mounting the electrical components 71, 72, and 73 and the substrate 50, the stress is applied to the magnetosensitive element 4. It will be added isotropically. Therefore, in the magnetosensitive element 4, it is possible to suppress the output from fluctuating due to stress.

  Further, in the present embodiment, the slit 52 extends so as to surround the inner mounting region 51 while leaving a band-shaped connecting portion 53 in a part of the circumferential direction surrounding the inner mounting region 51, and the two holes 59a and 59b are A virtual line connecting the holes 59a and 59b is formed at a position that obliquely intersects the extending direction of the connecting portion 53. The imaginary line connecting the holes 59a and 59b intersects the extending direction of the connecting portion 53 at an angle of 45 ° ± 15 °. For this reason, the stress when the mounting substrate 5 is fixed with the screws 88 a and 88 b using the holes 59 a and 59 b is not easily transmitted to the inner mounting region 51 via the connecting portion 53.

  That is, in the configuration in which the connecting portion 53 extends in the Y direction, when the two holes 59a and 59b are arranged in the X direction, the mounting substrate 5 is fixed by the screws 88a and 88b using the holes 59a and 59b. The stresses from the screws 88 a and 88 b are combined and transmitted to the inner mounting region 51 via the connecting portion 53. As a result, the inner mounting area 51 is bent to both sides in the X direction. Further, in the configuration in which the connecting portion 53 extends in the Y direction, when the two holes 59a and 59b are arranged in the Y direction, the mounting substrate 5 is fixed by the screws 88a and 88b using the holes 59a and 59b. The stress from one of the screws 88 a and 88 b is directly transmitted to the inner mounting region 51 through the connecting portion 53. However, if the imaginary line connecting the holes 59a and 59b obliquely intersects the extending direction of the connecting portion 53 as in this embodiment, the stress from the screw 88b side is not transmitted to the connecting portion 53. Further, since the stress from the screw 88a side is propagated obliquely toward the connecting portion 53, the stress transmitted to the inner mounting region 51 via the connecting portion 53 is small.

  For example, before and after applying a temperature stress of 0 ° C. to 90 ° C. to the mounting substrate 5 of this embodiment, the voltage change of the signal output from the element substrate 40 was 0.1 mV to 0.2 mV. In contrast, in the reference example in which the two holes 59a and 59b are arranged in the X direction and in the reference example in which the two holes 59a and 59b are arranged in the Y direction, before and after applying a temperature stress of 0 ° C. to 90 ° C. The voltage change of the signal output from the element substrate 40 is 8.0 mV to 9.0 mV. Therefore, according to this embodiment, the change of the output signal can be reduced from 1/40 times to 1/90 times.

[Embodiment 2]
FIG. 4 is a plan view of the mounting substrate 5 according to Embodiment 2 of the present invention. Since the basic configuration of this embodiment is the same as that of Embodiment 1, common portions are denoted by the same reference numerals and description thereof is omitted.

  In the first embodiment, the number of connecting portions 53 is one, but in this embodiment, the number of connecting portions 53 is two as shown in FIG. Specifically, the substrate 50 is formed with slits 52 around the inner mounting region 51, and the slits 52 leave strip-shaped connecting portions 53 a and 53 b at two circumferential positions surrounding the inner mounting region 51. Extending so as to surround the inner mounting area 51. In this embodiment, connecting portions 53a and 53b are formed on two side portions 52b and 52f extending obliquely in the X direction and the Y direction, and the connecting portions 53a and 53b extend obliquely in the X direction and the Y direction. Exist.

  Corresponding to this configuration, the holes 59a and 59b are formed at both side positions sandwiching the slit 52 and the inner mounting region 51 in the X direction. For this reason, the holes 59a and 59b are arranged at positions where an imaginary line connecting the holes 59a and 59b obliquely intersects with the extending direction of the connecting portions 53a and 53b. In this embodiment, the imaginary line connecting the holes 59a and 59b intersects with the extending direction of the connecting portions 53a and 53b at an angle of 45 ° ± 15 °.

  Even in such a configuration, as in the first embodiment, the stress when the mounting substrate 5 is fixed by the screws 88a and 88b using the holes 59a and 59b is not easily transmitted to the inner mounting region 51 through the connecting portion 53. The same effects as in the first embodiment are obtained.

[Embodiment 3]
FIG. 5 is a cross-sectional view of the mounting substrate 5 according to Embodiment 3 of the present invention. Since the basic configuration of this embodiment is the same as that of Embodiment 1, common portions are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 5, in the mounting substrate 5 of the present embodiment, another electric component 76 such as an operational amplifier is mounted on the other surface 502 of the substrate 50 at a position overlapping the magnetosensitive element 4. For this reason, the stress can be canceled on both surfaces of the inner mounting region 51, so that the stress is hardly applied to the magnetosensitive element 4. Other configurations are the same as those in the first and second embodiments.

[Embodiment 4]
FIG. 6 is a plan view of the mounting substrate 5 according to Embodiment 4 of the present invention. Since the basic configuration of this embodiment is the same as that of Embodiment 1, common portions are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 6, in the mounting substrate 5 of this embodiment, an outer mounting region 57 in which another electrical component 77 is mounted is provided on the side opposite to the inner mounting region 51 with respect to the slit 52 of the substrate 50. Therefore, another electrical component 77 that is likely to apply stress to the magnetosensitive element 4 when placed in the vicinity of the magnetosensitive element 4 can be mounted outside the slit 52 (outer mounting area 57). Therefore, stress is hardly applied to the magnetosensitive element 4. Other configurations are the same as those in the first and second embodiments.

[Other embodiments]
In the above embodiment, the magnetosensitive element 4 made of a magnetoresistive element is exemplified as the signal generating element. However, the present invention can be applied to the case where the magnetosensitive element 4 made of the Hall element is mounted on the substrate 50. Good. Further, the signal generating element is not limited to a magnetic sensor element such as a magnetosensitive element, and the present invention may be applied when other sensor elements such as an optical sensor element and a piezoelectric element are mounted on the substrate 50. . Further, the present invention may be applied to a case where an element other than the sensor element is mounted on the substrate 50 as long as the element for generating a signal is an element whose output changes due to stress.

1 ・ ・ Rotary encoder 2 ・ ・ Rotating body 4 ・ ・ Magnetic element (sensor element / element)
5, mounting substrate 40, element substrates 41 to 44, magnetic sensitive film 50, substrate 51, inner mounting area 52, slits 53, 53a, 53b, connecting portion 57, outer mounting areas 59a, 59b ..Hole 71, 72, 73..Electrical parts 76, 77..Other electrical parts 88a, 88b..Screw

Claims (12)

A substrate,
An element for signal generation mounted on the inner mounting region of the substrate;
A plurality of electrical components mounted around the element in the inner mounting region;
Have
The substrate extends in a direction intersecting with a plurality of holes for fixing the substrate with screws and an imaginary line connecting the inner mounting region and the hole between the inner mounting region and the hole. A slit is formed,
A mounting substrate, wherein a part or all of the plurality of electrical components are mounted on both sides of the device in a first direction in an in-plane direction of the substrate in plan view.   In plan view, a part of the plurality of electrical components is mounted on both sides of the element in the first direction, and the other part is a second direction orthogonal to the first direction in the in-plane direction of the substrate. The mounting board according to claim 1, wherein the mounting board is mounted on both sides of the element. When n is an integer of 2 or more,
3. The mounting board according to claim 1, wherein each mounting position of the plurality of electrical components has a relationship of n-fold rotational symmetry about the element.   4. The mounting board according to claim 3, wherein among the plurality of electrical components, each mounting position of the same type of electrical component has a relationship of n-fold rotational symmetry about the element. 5. . The slit extends so as to surround the inner mounting region, leaving a band-like connecting portion in a part of the circumferential direction surrounding the inner mounting region,
5. The plurality of holes are formed at positions where an imaginary line connecting the holes obliquely intersects with an extending direction of the connecting portion. Mounting board.   The mounting board according to claim 5, wherein an imaginary line connecting the holes intersects at an angle of 45 ° ± 15 ° with respect to an extending direction of the connecting portion.   The mounting board according to claim 1, wherein the plurality of holes are two holes arranged on both sides sandwiching the inner mounting region.   The mounting board according to claim 1, wherein the element and the electrical component are mounted on one surface of the board.   The mounting board according to claim 8, wherein another electrical component is mounted on the other surface of the board at a position overlapping the element.   The said board | substrate is provided with the outer side mounting area | region in which another electric component was mounted in the opposite side to the said inner side mounting area | region with respect to the said slit. The mounting board described.   The mounting board according to claim 1, wherein the element is a sensor element.   The mounting substrate according to claim 11, wherein the sensor element is a magnetosensitive element provided with a magnetosensitive film constituting a bridge circuit.