JP5914839B2 - LIGHT EMITTING DEVICE AND LIGHTING APPARATUS HAVING THE SAME - Google Patents

Description

  The present invention relates to a light-emitting device using a solid-state light-emitting element as a light source and a lighting fixture including the same.

  Conventionally, in a light emitting device using a solid light emitting element such as a light emitting diode (hereinafter referred to as LED) as a light source, a flexible circuit board (hereinafter referred to as FPC board) having flexibility is used as a substrate for mounting a package including the LED. What was there is known. As this type, for example, there is a lighting device in which a plurality of LEDs are mounted on one surface of an FPC board, and the other surface on which the LEDs are not mounted faces the inner surface of the main body having a full-surface opening. (For example, refer to Patent Document 1).

JP 2002-184209 A

  However, the illumination device described in Patent Document 1 is provided along the inner surface of the curved main body portion of the FPC board, and a part of the plurality of LEDs mounted on the FPC board faces each other. A part of the incident light was not emitted to the entire opening side, and a loss of utilization light occurred. Moreover, in the curved part of a main-body part, the heat from LED became difficult to be transmitted to a main-body part via an FPC board, and there existed a possibility that heat dissipation might fall.

  An object of the present invention is to solve the above-described problems, and to provide a light-emitting device capable of efficiently dissipating heat from a solid light-emitting element and a lighting fixture including the same. And

In order to solve the above problems, a light-emitting device of the present invention includes a solid-state light-emitting element, a flexible circuit board on which the solid-state light-emitting element is mounted, and a base member on which the flexible circuit board is disposed, The member has a recess formed so that an opening area is increased in accordance with a direction in which light is emitted from the solid state light emitting device, and the flexible circuit board is formed in a shape closely contacting the shape of the base member, The solid light emitting element is disposed so as to be positioned at the bottom of the recess, and the mounting surface of the solid light emitting element has a light reflecting function.

  In the light emitting device, it is preferable that the concave portion has an oblique light angle with respect to the solid light emitting element.

  In the above light emitting device, it is preferable that the base member has a plurality of recesses, and a plurality of solid state light emitting elements are mounted on the flexible circuit board.

  The light emitting device is preferably provided in a lighting fixture.

  According to the present invention, the light from the solid state light emitting device is reflected by the mounting surface of the flexible circuit board, so that the light is efficiently derived and the light utilization efficiency is improved. In addition, since the flexible circuit board on which the solid mounting element is mounted is located at the bottom of the recess of the base member, the heat generated in the solid light emitting element can be efficiently transmitted to the base member via the flexible circuit board. Sexuality is improved.

The disassembled perspective view of the lighting fixture (baselight) using the light-emitting device which concerns on one Embodiment of this invention. The sectional side view of the base light. (A) is a disassembled perspective view of the light emitting device, and (b) is a sectional side view of the same. The side sectional view which expanded the part enclosed with the dashed-dotted line of FIG.3 (b). The sectional side view of the LED package used for the light-emitting device. The sectional side view explaining operation | movement of the same base light.

  A light emitting device according to an embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, the light emitting device 1 of this embodiment is incorporated in an embedded lighting fixture (base light) 10 embedded in a ceiling, a wall surface, or the like. The base light 10 includes a power supply unit 11 that turns on the light emitting device 1 and a main body portion 12 that is fitted in an opening C2 formed in the ceiling C1 and accommodates the light emitting device 1. The power supply unit 11 is connected to a power supply line 13 for receiving power supply from a commercial power supply.

  The main body portion 12 is a housing having a bottom surface 14 to which the light emitting device 1 is fixed and an opening portion 15 having an opening facing the bottom surface 14. The main body portion 12 is engaged with the ceiling C <b> 1 at the periphery of the opening portion 15. A portion 16 is formed. The main body 12 is obtained by, for example, pressing a steel plate into the shape described above, and the surface thereof is coated with a white paint or the like. An embedded suspension bolt 17 is arranged on the back side of the ceiling of the opening C2, and the embedded suspension bolt 17 is screwed into a fixing hole 18 provided in the bottom surface 14 of the main body 12 so that the base light 10 is It is embedded and fixed in the ceiling. Note that an appropriate attachment spring (not shown) or the like for fixing the base light 10 to the ceiling or the like may be used. The opening 15 may be provided with a protective cover (not shown) or the like that is appropriately formed from acrylic resin or the like.

  The power supply unit 11 is disposed on the surface of the bottom surface 14 of the main body 12 opposite to the surface on which the light emitting device 1 is fixed so that the base light 10 is not visible from the indoor side when the base light 10 is installed on the ceiling. The In addition, the bottom surface 14 is provided with insertion holes (not shown) through which wiring (drawers to be described later) is inserted, and the power supply unit 11 and the positive power supply line and the negative power supply line of the light emitting device 1 are electrically connected to each other. Connected.

  A light emitting device 1 includes an LED package (hereinafter referred to as an LED package) 2 including a solid light emitting element, a flexible circuit board (hereinafter referred to as an FPC board) 3 on which the LED package 2 is mounted, and a base member on which the FPC board 3 is disposed. 4. The base member 4 has a recess 41 formed so that the opening area increases in accordance with the direction in which light from the LED package 2 is led out, and the FPC board 3 is positioned so that the LED package 2 is positioned at the bottom 42 of the recess 41. Closely arranged. As shown in FIGS. 3A and 3B, the portion of the recess 41 having the largest opening area is the opening 43, and the position thereof is indicated by a broken line in the figure. Of the surface of the FPC board 3, the surface on which the LED package 2 is mounted (hereinafter referred to as a mounting surface) has a light reflecting function on the entire surface or at a predetermined location. Further, the surface of the recess 41 that is located closer to the opening 43 than the bottom 42 is preferably formed to be an oblique surface 44 having an oblique angle with respect to the LED package 2.

  The base member 4 is made of a thin plate excellent in heat dissipation, such as an aluminum substrate, and a bottom portion 42 and a pair of oblique light surfaces 44 folded in a triangular shape are continuously in one direction, and they are spaced at regular intervals. It is bent so as to be provided. The illustrated example shows a configuration in which four rows of bottom portions 42 and three pairs of oblique light surfaces 44 sandwiched between them are formed. These are the size and use of the base light 10 to which the light emitting device 1 is applied. And is not particularly limited. The interval between the folds between the bottom portion 42 and the oblique surface 44, that is, the width of the bottom portion 42 is not particularly limited as long as the LED package 2 can be mounted, but preferably slightly between the LED package 2 and the fold. Is set so as to provide a gap. In addition, the illustrated example shows a configuration in which the bottom portions 42 are disposed on both ends of the base member 4, but one side of the oblique light surface 44 may be disposed on the outer side of the bottom 42 on both ends.

  The FPC board 3 is formed in a shape that is in close contact with the shape of the base member 4 by pressing or the like. Accordingly, the mounting surface of the FPC board 3 has substantially the same shape as the shape of the base member 4 in which the bottom portion 42 and the oblique light surface 44 are continuously formed. As shown in the figure, the LED package 2 is preferably mounted on the bottom portion 42 of the mounting surface of the FPC board 3 at a constant interval, but the bottom portion 42 side of the opening portion 43 of the recess 41 is preferable. And may be provided on the oblique surface 44. The entire mounting surface of the FPC board 3 may have a light reflecting function, but at least a surface positioned on the opening 43 side of the bottom portion 42 of the concave portion 41 only needs to have a light reflecting function.

  As shown in FIG. 4, the FPC board 3 includes a conductor layer 30, an insulating layer 31, and an adhesive layer 32. The conductor layer 30 is formed of, for example, copper foil or the like, and is covered with an insulating layer 31 formed of a resin material having flexibility and insulation properties, such as polyimide resin, via an adhesive layer 32. In the example shown in the figure, the adhesive layer 32 is provided only on the mounting surface side of the conductor layer 30. However, if the conductor layer 30 and the insulating layer 31 can be securely bonded, the adhesive layer 32 may be formed on any surface. May be provided on both sides of the conductor layer 30. Lead portions 30a and 30b are branched from the conductor layer 30, and these lead portions 30a and 30b are connected to external connection electrodes of the LED package 2 through, for example, solder (not shown). The LED package 2 may be appropriately provided with a lens member 5 for controlling the light distribution of the emitted light.

  The conductor layer 30 includes at least a pair of power supply lines including a positive power supply line and a negative power supply line. In the side cross-sectional view of the illustrated example, the conductive layer 30 is schematically illustrated without being limited to which power supply line. Is shown. The lead portions 30a and 30b are connected to different power supply lines, respectively. At one end portion of the FPC board 3, a lead-out portion (not shown) for connecting the conductor layer 30 to the power supply unit 11 (see FIGS. 1A and 1B) is extended, and this lead-out portion is a base. It arrange | positions so that the side edge part of the member 4 may be wrapped. In addition, a through hole may be provided in the base member 4 and the lead-out portion may be inserted from the back surface of the FPC board 3.

  In addition, the mounting surface of the FPC board 3, specifically, the insulating layer 31 on the front side has a light reflecting function. A highly reflective whitening agent containing a metal powder material that is excellent and has an insulating property is contained. It should be noted that a sheet having a light reflecting function may be affixed to a portion of the mounting surface of the FPC board 3 located on the oblique surface 44, and aluminum deposition may be appropriately performed on the portion. The configuration for realizing the light reflection function is desirably an insulating material, but when a conductive material is used, this configuration is provided so as to avoid the vicinity of the mounting location of the LED package 2. Or the LED package 2 is mounted via a separate insulating material. The FPC board 3 configured in this manner is bonded and fixed to the base member 4 by an adhesive member 33 having high thermal conductivity.

  As shown in FIG. 5, the LED package 2 includes a package substrate 20 having a rectangular cross section, an LED chip 21 mounted on the package substrate 20, a frame body 22 having a recess surrounding the LED chip 21, and a frame And a filler 23 filled in the body 22. The filler 23 is made of silicon or the like, and contains a phosphor 24 that converts the wavelength of light emitted from the LED chip 21. A cathode electrode 25 is provided on one side surface of the package substrate 20, and an anode electrode 26 is provided on the other side surface, which are connected to external connection electrodes 27 and 28 formed at both ends of the lower surface of the package substrate 20. Further, the cathode electrode 25 and the anode electrode 26 are connected to respective electrode terminals (not shown) of the LED chip 21 by wires 29. The inner peripheral surface of the frame 22 is formed as a conical surface that opens in the light-derived direction, and the surface of the conical surface has a light reflecting function. The LED chip 21 is preferably a blue LED element that emits blue light, and the phosphor 24 is a yellow phosphor that emits yellow light when excited by the blue light. In this case, when a voltage is applied between the external connection electrodes 27 and 28, the LED package 2 emits white light.

  Next, an assembly procedure of the base light 10 incorporating the light emitting device 1 will be described with reference to FIGS. 1 and 2 described above. First, the FPC board 3 is bonded and fixed to the base member 4 without a gap so that the FPC board 3 on which the LED package 2 is mounted is positioned on the bottom 42 (see also FIG. 3) of the base member 4. In this way, the light emitting device 1 is manufactured. Since the light emitting device 1 uses the FPC board 3 in which the wiring circuit (conductor layer 30, see FIG. 4) is housed as the LED mounting board, each LED is mounted even when a plurality of LED packages 2 are mounted on the board. Connection and wiring between the packages 2 are not necessary. In addition, since the conductor layer 30 is covered with the insulating layer 31, the FPC board 3 can be processed without exposing the end face of the circuit portion, and it is easy to ensure the insulation of the device. Further, since the FPC board 3 on which the LED package 2 is mounted is located at the bottom 42 of the base member 4, the contact area between the LED package 2 and the FPC board 3 is large, and the heat of the LED package 2 is efficiently generated. It is transmitted to 3. Moreover, since the FPC board 3 is easy to shape, the entire surface on which the LED package 2 is not mounted can be brought into close contact with the base member 4, and the thermal conductivity between the FPC board 3 and the base member 4 is improved. . Furthermore, since the base member 4 is bent, the surface area is larger than that of a general flat substrate, and heat can be efficiently radiated to the atmosphere. As a result, the heat generated in the LED package 2 can be efficiently transmitted to the base member 4 via the FPC board 3, and the heat dissipation of the device is improved.

  Subsequently, in the light emitting device 1, the back surface side of the bottom portion 42 of the base member 4 is fixed to the bottom surface 14 of the main body portion 12 by a known method such as thermal bonding. At this time, the conductor layer 30 (see FIG. 4) of the FPC board 3 is electrically connected to the power supply unit 11 through the above-described lead portion. In this way, the base light 10 is assembled. The power supply unit 11 is preferably connected to the power supply line 13 via a connector. After the connection of the power line 13, the base light 10 is embedded and fixed in the ceiling by the embedded suspension bolt 17.

  Next, the operation of the base light 10 incorporating the light emitting device 1 will be described with reference to FIG. When a predetermined direct current is supplied to each LED package 2 from the power supply unit 11 through the conductor layer 30 of the FPC board 3, each LED package 2 emits light. At this time, the light R <b> 1 emitted in a direction substantially orthogonal to the mounting surface of the LED package 2 goes directly to the opening 43 and is emitted from the base light 10. The light R2 emitted from the LED package 2 at a wide angle is reflected by a surface having a light reflecting function located on the opening 43 side of the bottom surface 42 of the recess 41 in the mounting surface of the FPC board 3. As a result, the light emitted from the LED package 2 is efficiently led to the opening 43 side. Further, since the oblique surface 44 is formed, an angle at which the LED package 2 can be directly viewed from the indoor side is limited, so that the glare cut function is provided.

  When a reflective member or the like is attached to a general flat substrate, light incident on the gap between the substrate and the reflective member may be lost. Further, in the manufacturing process, installing clearances, packings, and the like so that the substrate surface is not damaged by the reflecting member has a large work load and productivity is poor. On the other hand, in the light emitting device 1, since the mounting surface of the FPC board 3 is continuously present and no gap is formed, the light use efficiency can be improved without causing the above-described loss. . Moreover, since it is not necessary to provide a separate reflecting member, the work load is small and the productivity is good.

  Moreover, since the recessed part 41 has the oblique surface 44 which has an oblique light angle with respect to the LED package 2, the light from the LED package 2 can be more efficiently led out to the opening part 43 side. In addition, as described above, the light emitting device 1 can efficiently transmit the heat generated in the LED package 2 to the base member 4 via the FPC board 3, so that the LED package 2 is difficult to store heat and can be used for a long time. It is possible to emit light with high output.

  In addition, this invention is not restricted to the structure of the said embodiment, A various deformation | transformation is possible in the range which does not change the summary of invention. In the embodiment described above, the base member 4 has a configuration in which the bottom portion 42 and the pair of oblique light surfaces 44 are continuously formed in one direction. However, the shape of the base member 4 is an opening in the light extraction direction. What is necessary is just to have the recessed part 41 formed so that an area might become large, and they do not necessarily need to be continuing in one direction. Further, since the FPC board 3 can be arbitrarily wired, the LED package 2 can be mounted on any part of the FPC board 3, and is not limited to the bottom part 42, for example, a part located on the oblique surface 44. May also be implemented. Further, for example, a plurality of LED packages 2 having different emission colors may be mounted on the FPC board 3.

1 Light emitting device 10 Base light (lighting fixture)
2 LED package (solid state light emitting device)
3 FPC board (flexible circuit board)
4 base member 41 recess 42 bottom 43 opening

Claims (4)

A solid light emitting element, a flexible circuit board on which the solid light emitting element is mounted, and a base member on which the flexible circuit board is disposed,
The base member has a recess formed so that an opening area is increased in accordance with a direction in which light is emitted from the solid state light emitting device,
The flexible circuit board is formed in a shape that is in close contact with the shape of the base member, and is disposed so that the solid light emitting element is located at the bottom of the recess, and the mounting surface of the solid light emitting element is light. A light emitting device having a reflection function.   The light emitting device according to claim 1, wherein the concave portion has an oblique light angle with respect to the solid state light emitting device. The base member has a plurality of recesses,
The light emitting device according to claim 1, wherein a plurality of solid state light emitting elements are mounted on the flexible circuit board.   The lighting fixture provided with the light-emitting device as described in any one of Claims 1 thru | or 3.

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