JP5907388B2 - 発光装置および照明装置 - Google Patents
発光装置および照明装置 Download PDFInfo
- Publication number
- JP5907388B2 JP5907388B2 JP2012209847A JP2012209847A JP5907388B2 JP 5907388 B2 JP5907388 B2 JP 5907388B2 JP 2012209847 A JP2012209847 A JP 2012209847A JP 2012209847 A JP2012209847 A JP 2012209847A JP 5907388 B2 JP5907388 B2 JP 5907388B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- wiring
- emitting element
- terminal
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
- F21S8/026—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Description
図1は、第1の実施形態に係る発光装置1を表す模式図である。図1(a)は、発光装置1の発光面10aを表す平面図である。図1(b)は、図1(a)に示すIB−IB線に沿った断面図である。
図5は、第2の実施形態に係る照明装置100の発光ユニット110を表す模式図である。図5(a)は、発光ユニット110の側面および一部の断面を表す模式図であり、図5(b)は、下面図である。図6は、第2の実施形態に係る照明装置100の構成を表すブロック図である。
Claims (3)
- 基板と;
前記基板上に実装された複数の第1発光素子を含む第1発光素子群と;
前記基板上において、前記第1発光素子群に並んで実装され、複数の第2発光素子を含む第2発光素子群と;
前記第1発光素子群および前記第2発光素子群と電気的に接続された複数の端子を含む端子群であって、前記第1発光素子群と前記第2発光素子群とが並設された前記基板上の第1方向において、前記第1発光素子群の前記第2発光素子群とは反対側に並設された端子群であって、
前記第1発光素子のアノードと電気的に接続された第1端子と、
前記第1発光素子のカソードと電気的に接続された第2端子と、
前記第2発光素子のアノードと電気的に接続された第3端子と、
前記第2発光素子のカソードと電気的に接続された第4端子と、
を含む端子群と;
前記第1発光素子群と、前記第1端子と、の間を電気的に接続する第1配線と;
前記第1発光素子群と、前記第2端子と、の間を電気的に接続する第2配線と;
前記第2発光素子群と、前記第3端子と、の間を電気的に接続する第3配線と;
前記第2発光素子群と、前記第4端子と、の間を電気的に接続する第4配線と;
前記基板上に設けられ、前記第1発光素子群と前記第2発光素子群とを囲む外周枠と;
を備え、
前記端子群は、前記第1端子および前記第3端子を含む第1の端子グループと、前記第2端子および前記第4端子を含む第2の端子グループと、を含み、
前記第1の端子グループと前記第2の端子グループとは、前記基板上において前記第1方向に直交する第2方向に並んで設けられ、
前記第1配線は、前記第3配線と前記第1発光素子群との間に設けられ、
前記第2配線は、前記第4配線と前記第1発光素子群との間に設けられ、
前記第1配線、前記第2配線、前記第3配線および前記第4配線のそれぞれに前記外周枠が重なる部分において、前記第1配線、前記第2配線、前記第3配線および前記第4配線は、それぞれガラスコートを有することを特徴とする発光装置。 - 前記基板における前記端子群が設けられた領域の前記第1方向に直交する第2方向の幅は、前記第1発光素子群が実装された領域の前記第2の方向の幅、および、前記第2発光素子群が実装された領域の前記第2方向の幅のいずれか広い方よりも狭い請求項1記載の発光装置。
- 請求項1または2に記載の発光装置を有する発光ユニットと;
前記複数の端子のうちの前記第1発光素子のアノードに電気的に接続された第1端子および前記第1発光素子のカソードに電気的に接続された第2端子を介して前記第1発光素子群を駆動する第1点灯回路と、
前記複数の端子のうちの前記第2発光素子のアノードに電気的に接続された第3端子および前記第2発光素子のカソードに電気的に接続された第4端子を介して前記第2発光素子群を駆動する第2点灯回路と、
を有する点灯ユニットと;
を備えることを特徴とする照明装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012209847A JP5907388B2 (ja) | 2012-09-24 | 2012-09-24 | 発光装置および照明装置 |
EP12197008.1A EP2711602A2 (en) | 2012-09-24 | 2012-12-13 | Light-emitting device and luminaire |
US13/720,684 US8888324B2 (en) | 2012-09-24 | 2012-12-19 | Light-emitting device, method for assembling same and luminaire |
CN201320053030XU CN203103301U (zh) | 2012-09-24 | 2013-01-30 | 发光装置及照明装置 |
TW102103543A TW201413154A (zh) | 2012-09-24 | 2013-01-30 | 發光裝置及照明裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012209847A JP5907388B2 (ja) | 2012-09-24 | 2012-09-24 | 発光装置および照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014067747A JP2014067747A (ja) | 2014-04-17 |
JP5907388B2 true JP5907388B2 (ja) | 2016-04-26 |
Family
ID=47678485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012209847A Expired - Fee Related JP5907388B2 (ja) | 2012-09-24 | 2012-09-24 | 発光装置および照明装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8888324B2 (ja) |
EP (1) | EP2711602A2 (ja) |
JP (1) | JP5907388B2 (ja) |
CN (1) | CN203103301U (ja) |
TW (1) | TW201413154A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6583764B2 (ja) * | 2014-09-12 | 2019-10-02 | パナソニックIpマネジメント株式会社 | 発光装置、及び照明装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006228557A (ja) * | 2005-02-17 | 2006-08-31 | Koizumi Sangyo Corp | El光源装置 |
US8272757B1 (en) * | 2005-06-03 | 2012-09-25 | Ac Led Lighting, L.L.C. | Light emitting diode lamp capable of high AC/DC voltage operation |
JP2009080966A (ja) * | 2007-09-25 | 2009-04-16 | Toshiba Lighting & Technology Corp | 照明装置 |
JP5106049B2 (ja) * | 2007-11-02 | 2012-12-26 | シャープ株式会社 | 照明装置及び照明システム |
KR101519331B1 (ko) * | 2008-02-18 | 2015-05-13 | 삼성디스플레이 주식회사 | 백라이트 어셈블리 및 이를 갖는 표시장치 |
JP5266075B2 (ja) * | 2009-01-26 | 2013-08-21 | パナソニック株式会社 | 電球形照明装置 |
JP4960981B2 (ja) * | 2009-03-03 | 2012-06-27 | シャープ株式会社 | Led基板、led光源装置 |
JP4910023B2 (ja) * | 2009-08-27 | 2012-04-04 | シャープ株式会社 | 光源装置 |
JP5376404B2 (ja) | 2009-09-09 | 2013-12-25 | 東芝ライテック株式会社 | 発光装置 |
EP2546899B1 (en) * | 2010-03-11 | 2015-06-24 | Panasonic Intellectual Property Management Co., Ltd. | Light emitting module, light source device, liquid crystal display device |
CN102201524A (zh) * | 2010-03-24 | 2011-09-28 | 旭硝子株式会社 | 发光元件用基板及发光装置 |
JP2012019104A (ja) * | 2010-07-08 | 2012-01-26 | Mitsubishi Chemicals Corp | 発光装置 |
-
2012
- 2012-09-24 JP JP2012209847A patent/JP5907388B2/ja not_active Expired - Fee Related
- 2012-12-13 EP EP12197008.1A patent/EP2711602A2/en not_active Withdrawn
- 2012-12-19 US US13/720,684 patent/US8888324B2/en not_active Expired - Fee Related
-
2013
- 2013-01-30 CN CN201320053030XU patent/CN203103301U/zh not_active Expired - Fee Related
- 2013-01-30 TW TW102103543A patent/TW201413154A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2014067747A (ja) | 2014-04-17 |
TW201413154A (zh) | 2014-04-01 |
EP2711602A2 (en) | 2014-03-26 |
US8888324B2 (en) | 2014-11-18 |
CN203103301U (zh) | 2013-07-31 |
US20140085890A1 (en) | 2014-03-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5547520B2 (ja) | Led照明装置 | |
JP5291268B1 (ja) | 発光モジュールおよびこれを用いた照明用光源、照明装置 | |
US9416924B2 (en) | Light emission module | |
WO2013136389A1 (ja) | 基板、発光装置及び照明装置 | |
JP6080053B2 (ja) | 発光モジュール | |
JP2007281468A (ja) | アノダイジング絶縁層を有するledパッケージおよびその製造方法 | |
JP2005158957A (ja) | 発光装置 | |
JP4866975B2 (ja) | Ledランプおよび照明器具 | |
WO2013153938A1 (ja) | 光半導体光源及び車両用照明装置 | |
JP2013235649A (ja) | 光半導体光源及び車両用照明装置 | |
JP2018206886A (ja) | 発光装置、及び、照明装置 | |
JP5907388B2 (ja) | 発光装置および照明装置 | |
JP6024957B2 (ja) | 発光装置および照明装置 | |
JP5656051B2 (ja) | 発光装置及び照明装置 | |
JP5999341B2 (ja) | 発光装置および照明装置 | |
KR20110097212A (ko) | Led 모듈 및 조립케이스로 구성된 led 램프 | |
JP5216948B1 (ja) | 基板、発光装置及び照明装置 | |
KR101469058B1 (ko) | 발광소자 패키지 및 그 제조 방법 | |
JP6132233B2 (ja) | 発光ユニット | |
JP2015060972A (ja) | 発光モジュール、照明装置および照明器具 | |
JP7491251B2 (ja) | 車両用灯具の光源ユニット、車両用灯具 | |
JP5453580B1 (ja) | 発光モジュール | |
JP6861383B2 (ja) | 照明器具 | |
JP2019021698A (ja) | 発光装置、及び、照明装置 | |
KR20160134042A (ko) | 발광소자 라이트 엔진 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150305 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20151130 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20151208 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160125 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160225 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160309 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 5907388 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
LAPS | Cancellation because of no payment of annual fees |