JP5903495B2 - Manufacturing method of patterning roll for continuous plating - Google Patents

Description

  The present invention relates to a patterning roll for continuous plating in which an insulating layer is patterned by DLC (diamond-like carbon) and a method for manufacturing the same.

  The roll for continuous plating is used for a continuous plating apparatus. For example, the roll is continuously plated by passing a strip-shaped workpiece such as a steel sheet wound around a reel through a plating bath while continuously winding it. is there. As an example of the roll for continuous plating, there exist rolls, such as a sink roll disclosed by patent document 1 or patent document 2, for example.

  When the patterning roll as described above is manufactured, there is a problem in that over-etching called so-called side etching occurs when a photosensitive material is applied to a base material and exposed, developed, burned, and etched. As the patterning becomes finer, the problem of side etching becomes more obvious. Furthermore, the finer the patterning, the more problems arise with the adhesion of the insulating layer.

JP 2006-283044 A JP 2001-89836 A JP 2009-093170 A

  The present invention has been made in view of the above-described problems of the prior art, and has an object to provide a patterning roll for continuous plating and a method for manufacturing the same, which solves the problem of side etching and has excellent adhesion of an insulating layer. To do.

To solve the above problems, patterned roll the continuous plating, a photoresist is applied to the surface of the plating can be cylindrically-shaped metallic substrate, the resist pattern portion and the non-resist pattern portion formed allowed exposure and development, the The cylindrical metal substrate of the non-resist pattern portion is etched to form an etching recess, a DLC coating film is formed on the surface of the etching recess and the resist pattern portion, and the DLC coating formed on the resist pattern portion is formed. The covering film is peeled off together with the resist pattern portion, and the DLC coating film remains in the etching recess.

  Thus, since the DLC coating film formed on the resist pattern portion is peeled off together with the resist pattern portion, there is an advantage that the problem of side etching is solved. Further, by leaving the DLC coating film in the etching recesses of the cylindrical metal substrate, the remaining DLC coating film becomes an insulating film. And since a DLC coating film remains in an etching recessed part, there exists an advantage that it is excellent in adhesiveness.

  The metal substrate to which the photoresist is applied is made of at least one material selected from the group consisting of nickel, tungsten, chromium, titanium, gold, silver, platinum, stainless steel, iron, copper, and aluminum. Is preferred.

  It is preferable that the etching depth of the etching recess is 1 μm to 10 μm.

  The thickness of the coated DLC coating film is preferably 1 μm to 10 μm.

  Moreover, you may make it the said cylindrical metal base material equip with the cushion layer which consists of resin which has rubber | gum or cushioning properties. As the cushion layer, a synthetic rubber such as silicone rubber, or a synthetic resin having elasticity such as polyurethane or polystyrene can be used. The thickness of the cushion layer is not particularly limited as long as it can provide cushioning properties, that is, elasticity. For example, a thickness of about 1 cm to 5 cm is sufficient. As an example of a cylindrical metal substrate provided with a cushion layer made of rubber or a resin having cushioning properties, a cushion layer made of a resin having rubber or cushioning properties is provided, for example, a gravure plate described in Patent Document 3. Rolls can be employed.

  As the photoresist, either a positive photoresist or a negative photoresist can be applied, but a negative photoresist is preferable.

The continuous plating transfer product is manufactured by a patterning roll for continuous plating.

As the metal plated by the patterning roll for continuous plating, any known metal that can be plated can be applied. Examples thereof include at least one material selected from the group consisting of nickel, tungsten, chromium, titanium, gold, silver, platinum, iron, copper, and zinc.

  The method for producing a patterning roll for continuous plating according to the present invention comprises a step of applying a photoresist to the surface of a cylindrical metal substrate that can be plated, exposing and developing to form a resist pattern portion and a non-resist pattern portion, Etching the cylindrical metal substrate of the non-resist pattern portion to form an etching recess, forming a DLC coating film on the etching recess and the surface of the resist pattern portion, and forming on the resist pattern portion Peeling the entire DLC coating film together with the resist pattern portion to leave the DLC coating film in the etching recess.

  The metal substrate to which the photoresist is applied is made of at least one material selected from the group consisting of nickel, tungsten, chromium, titanium, gold, silver, platinum, stainless steel, iron, copper, and aluminum. Is preferred.

  It is preferable that the etching depth of the etching recess is 1 μm to 10 μm.

  The thickness of the DLC coating film is preferably 1 μm to 10 μm.

  It is preferable that the metal base material to which the photoresist is applied includes a cushion layer made of rubber or a resin having cushioning properties.

  As the photoresist, either a positive photoresist or a negative photoresist can be applied, but a negative photoresist is preferable.

  ADVANTAGE OF THE INVENTION According to this invention, it has the remarkable effect that the problem of side etching can be eliminated and the patterning roll for continuous plating excellent in the adhesiveness of the insulating layer and its manufacturing method can be provided.

It is explanatory drawing which shows typically an example of the aspect in each process of the manufacturing method of the patterning roll for continuous plating of this invention, (a) is principal part cross section of the state which apply | coated the photoresist on the surface of the cylindrical metal base material (B) is a cross-sectional view of the main part in a state where a resist pattern portion and a non-resist pattern portion are formed by exposure and development, and (c) is an etching recess by etching a cylindrical metal substrate of the non-resist pattern portion. FIG. 4D is a cross-sectional view of the main part in the formed state, FIG. 4D is a cross-sectional view of the main part in a state where the DLC coating film is formed on the surfaces of the etching concave portion and the resist pattern portion, and FIG. It is principal part sectional drawing of the state which peeled off the coating film with the resist pattern part, and left the DLC coating film in the etching recessed part. It is a flowchart which shows the process order of the manufacturing method of the patterning roll for continuous plating shown in FIG. It is typical explanatory drawing which shows the manufacture procedure of a continuous plating transcription | transfer material, (a) is the state which transcribe | transfers the pattern plating layer formed on the patterning roll for continuous plating on the base material for printing, (b) is for printing The state which transferred the pattern plating layer on the base material and manufactured the continuous plating transcription | transfer material is each shown.

  Embodiments of the present invention will be described below, but these embodiments are exemplarily shown, and it goes without saying that various modifications can be made without departing from the technical idea of the present invention.

  In FIG. 1, the code | symbol 10 shows the patterning roll for continuous plating. Reference numeral 12 denotes a cylindrical metal base material that can be plated, and is made of at least one material selected from the group consisting of nickel, tungsten, chromium, titanium, gold, silver, platinum, stainless steel, iron, copper, and aluminum. Things can be used. Moreover, you may make it provide the cushion layer which consists of resin which has rubber | gum or cushioning properties. The cushion layer is made of rubber or a resin having a cushioning property, and a cylindrical metal base material having a uniform thickness of about 1 mm to 10 cm and having a high surface smoothness so that a gap is not opened at the seam. What is necessary is just to make it adhere | attach to the back surface of 12 firmly.

  First, a photoresist 14 is applied to the surface of the cylindrical metal substrate 12 (step 100 in FIG. 1A and FIG. 2). The resist pattern portion 16 and the non-resist pattern portion 18 are formed by exposure and development (step 102 in FIG. 1B and FIG. 2). The photoresist can be either a negative type or a positive type, but it is preferable to use a negative type photoresist.

  Next, the cylindrical metal substrate 12 of the non-resist pattern portion 18 is etched to form an etching recess 20 (FIG. 1C and step 104 in FIG. 2).

  Then, a DLC coating film 22 is formed on the surfaces of the etching recess 20 and the resist pattern portion 16 (step 106 in FIG. 1D and FIG. 2). The DLC coating film may be formed by a CVD (Chemical Vapor Deposition) method or a sputtering method.

  Next, the DLC coating film 22 formed on the resist pattern portion 16 is peeled off together with the resist pattern portion 16 to leave the DLC coating film 22 in the etching recess 20 (FIG. 1E and FIG. Step 108 of 2). In this way, the continuous plating patterning roll 10 is completed. In the patterning roll 10 for continuous plating, the DLC coating film 22 remaining in the etching recess 20 is an insulating layer.

  Next, FIG. 3 shows a procedure for producing a continuous plating transfer product using the patterning roll 10 for continuous plating.

  In FIG. 3A, the continuous plating patterning roll 10 has a plating layer 24 continuously formed on a cylindrical metal substrate 12 where the DLC coating film 22 does not remain through a plating tank (not shown). Is formed.

  Then, as well shown in FIG. 3A, the plating layer 24 is continuously transferred to the printing substrate 28 that is hung on the pressure transfer roller 26, and the continuous plating transfer shown in FIG. It becomes the thing 30. In addition, as a base material for printing, films, such as a synthetic resin, are mentioned. Thus, the patterning roll for continuous plating of the present invention can transfer a finely patterned plating layer to a film such as a synthetic resin, and therefore can be suitably used for manufacturing a printed circuit board or the like.

  The present invention will be described more specifically with reference to the following examples. However, it is needless to say that these examples are shown by way of illustration and should not be construed in a limited manner.

(Example 1)
Prepare a plate base material (aluminum hollow roll) with a circumference of 600 mm and a surface length of 1100 mm, and use the boomerang line (a fully automatic laser gravure plate making apparatus manufactured by Sink Laboratories, Inc.) to form the copper plating layer described below. went. First, a plate base material (aluminum hollow roll) was mounted on a copper plating tank, and the hollow roll was completely immersed in a plating solution to form a copper plating layer of 80 μm at 20 A / dm ² and 6.0 V. The plating surface was free of bumps and pits, and a uniform copper plating layer was obtained. The surface of the copper plating layer was polished using a 4-head type polishing machine (Sink Laboratory Co., Ltd. polishing machine) to make the surface of the copper plating layer a uniform polishing surface. Using the formed copper plating layer as a base material, a photoresist (thermal resist: TSER-NS (manufactured by Sink Laboratories)) was applied to the surface (fountain coater) and dried. The film thickness of the obtained photoresist was 7 μm as measured by a film thickness meter (F20 manufactured by FILLMETRICS, sold by Matsushita Techno Trading). The image was then developed with laser exposure. In the laser exposure, a laser stream FX was used and a predetermined pattern exposure was performed under an exposure condition of 300 mJ / cm ² . The above development is performed using a TLD developer (Developer manufactured by Sink Laboratories, Inc.) at a developer dilution ratio (stock solution 1: water 7) at 24 ° C. for 90 seconds, and a predetermined resist pattern portion and a non-resist pattern. Part was formed.

  Next, a cupric chloride corrosive solution was spray-etched for 60 seconds on the copper plating layer of the non-resist pattern portion to form an etching recess having an etching depth of 5 μm.

  A DLC coating film was formed on the surfaces of the copper plating layer and the resist pattern portion by a CVD method. An intermediate layer having a film thickness of 0.1 μm was formed in an argon / hydrogen gas atmosphere, hexamethyldisiloxane as a source gas, a film formation temperature of 80 to 120 ° C., and a film formation time of 60 minutes. Next, a DLC coating film having a film thickness of 5 μm was formed on the source gas using toluene, a film formation temperature of 80 to 120 ° C., and a film formation time of 180 minutes.

  Next, the hollow roll was sonicated in an aqueous sodium hydroxide solution for 30 minutes. Then, the DLC coating film formed on the resist pattern portion was peeled off together with the resist pattern portion, and the DLC coating film was left in the etching recess. In this way, a patterning roll for continuous plating was obtained.

  When the surface of this continuous plating patterning roll was observed with an optical microscope, a high-definition continuous plating patterning roll was observed.

(Example 2)
A patterning roll for continuous plating was obtained in the same manner as in Example 1 except that the base material on the resist pattern formation surface was stainless steel and the corrosive liquid was nitric acid / hydrogen peroxide solution. When the obtained patterning roll for continuous plating was observed with an electron microscope, a high-definition DLC pattern was observed as an insulating layer.

(Example 3)
A patterning roll for continuous plating was obtained in the same manner as in Example 1 except that the substrate on the surface of resist pattern formation was titanium and the corrosive solution was an aqueous hydrofluoric acid solution. When the obtained patterning roll for continuous plating was observed with an electron microscope, a high-definition DLC pattern was observed as an insulating layer.

Example 4
Continuous plating was carried out in the same manner as in Examples 1 to 3 except that a roll in which a nickel sleeve having a thickness of 0.4 mm was fitted on silicon rubber was used as a base material, and the corrosive liquid was nitric acid / hydrogen peroxide. A patterning roll was prepared. When the obtained patterning roll for continuous plating was observed with an electron microscope, a high-definition DLC pattern was observed as an insulating layer.

10: patterning roll for continuous plating, 12: cylindrical metal substrate, 14: photoresist, 16: resist pattern portion, 18: non-resist pattern portion, 20: etching recess, 22: DLC coating film, 24: plating layer , 26: pressure transfer roller, 28: printing substrate, 30: continuous plating transfer.

Claims (6)

  Applying a photoresist to the surface of a cylindrical metal substrate that can be plated, exposing and developing to form a resist pattern portion and a non-resist pattern portion, and etching the cylindrical metal substrate in the non-resist pattern portion A step of forming an etching recess, a step of forming a DLC coating film on the surface of the etching recess and the resist pattern portion, and a peeling of the DLC coating film formed on the resist pattern portion together with the resist pattern portion. And a step of allowing the DLC coating film to remain in the etching recess, and a method for producing a patterning roll for continuous plating. The metal substrate to which the photoresist is applied is composed of at least one material selected from the group consisting of nickel, tungsten, chromium, titanium, gold, silver, platinum, stainless steel, iron, copper, and aluminum. method for producing a continuous plating patterning roll according to claim 1, wherein. The method for producing a patterning roll for continuous plating according to claim 1 or 2, wherein the etching depth of the etching recess is 1 µm to 10 µm. The thickness of the said DLC coating film is 1 micrometer-10 micrometers, The manufacturing method of the patterning roll for continuous plating of any one of Claims 1-3 characterized by the above-mentioned. The method for producing a patterning roll for continuous plating according to any one of claims 1 to 4, wherein the metal substrate to which the photoresist is applied includes a cushion layer made of rubber or a resin having cushioning properties. The method for producing a patterning roll for continuous plating according to any one of claims 1 to 5 , wherein the photoresist is a negative photoresist.

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