JP5828068B2 - LED unit - Google Patents

Description

  The present invention relates to an LED unit including a heat dissipation plate having thermal conductivity.

  Conventionally, an LED unit that irradiates white light makes light emitted from a light emitting diode element (hereinafter referred to as an LED chip) incident on a wavelength conversion member including a phosphor, and the wavelength converted by the wavelength converted by the phosphor. The white light is generated by mixing the light that has not been generated. In this type of LED unit, the probability of the wavelength conversion of the light emitted from the LED chip differs depending on the light path length in the wavelength conversion member with respect to the light emission direction from the LED chip, and light of a predetermined color There is a possibility that the amount of components increases or decreases and color variation occurs in the irradiated light.

  Thus, a light emitting device in which a wavelength conversion member is formed in a dome shape in order to reduce color variation is known (for example, see Patent Document 1). This light-emitting device is shown in FIG. In the light emitting device 101, a dome-shaped wavelength conversion member 104 is formed so as to cover the LED chip 102 on the mounting substrate 103 on which the LED chip 102 is mounted, and the optical path length is relative to the light emission direction from the LED chip 102. It is configured to be uniform. However, in the light emitting device as disclosed in Patent Document 1, when the wavelength of the emitted light from the LED chip 102 is converted in the wavelength conversion member 104, heat is generated due to energy loss, and this heat is generated in the wavelength conversion member 104. And the temperature of the wavelength conversion member 104 rises. This temperature rise causes degradation of the wavelength conversion member 104, such as a decrease in the wavelength conversion efficiency of the phosphor, and the light component of the irradiation light changes, so that the chromaticity of the irradiation light from the light emitting device 101 is a desired color. There is a risk of change from the degree.

  The speed of deterioration of such a wavelength conversion member varies depending on the type of the wavelength conversion member, and this difference becomes more prominent as the temperature of the wavelength conversion member increases. For example, in a color temperature variable LED unit using light sources of three different light colors with different types of wavelength conversion members, the degradation of the wavelength conversion member is greatly increased between different types of light sources due to the temperature rise of the wavelength conversion member. In contrast, the color variation of each light source greatly affects the color variation of irradiation light.

  In order to suppress the temperature rise of the wavelength conversion member, a light emitting device in which the wavelength conversion member is brought into contact with a high heat dissipation member is known (for example, see Patent Document 2). This light-emitting device is shown in FIG. In the light emitting device 101, the LED chip 102 is mounted on the mounting surface 106 of the wavelength conversion member 104 having the emission surface 105, and the wavelength conversion member 104 is brought into contact with the high heat dissipation member 108 through the mounting surface 107. According to this configuration, the heat in the wavelength conversion member 104 is efficiently transferred to the high heat dissipation member 108, and the temperature increase of the wavelength conversion member 104 can be suppressed.

JP 2010-27514 A JP 2010-98118 A

  However, in the light emitting device as disclosed in Patent Document 2, the mounting surface 106 is inclined with respect to the mounting surface 107, and the emission surface 105 is located on one end side of the mounting surface 106 and the mounting surface 107. The light distribution range of the emission surface 105 is narrow. Therefore, for example, it is difficult to cope with a case where light emitted from the LED chip 102 is desired to be distributed over a wide range.

  The present invention has been made to solve the above-described problems, and provides an LED unit that can suppress the temperature increase of the wavelength conversion member and can control the light distribution of emitted light to a wide angle. With the goal.

The LED unit of the present invention is provided on the mounting substrate so as to cover the light source, a mounting substrate on which the light source is mounted, and wavelength conversion for converting the wavelength of the emitted light from the light source into a different wavelength And a heat radiating plate that radiates heat of the wavelength converting member to the mounting substrate, the wavelength converting member is configured in a dome shape, and the heat radiating plate is in contact with a lower outer peripheral surface of the wavelength converting member. The wavelength conversion member has a flange portion extending outward at a lower portion thereof, and the flange portion is pressed by the heat radiating plate .

  In this LED unit, it is preferable that a lower end surface of the wavelength conversion member is in contact with the mounting substrate.

  In this LED unit, it is preferable that a reflection plate that reflects emitted light from the light source in a direction along the mounting substrate to the wavelength conversion member is provided inside the lower portion of the wavelength conversion member.

  According to the LED unit of the present invention, the heat of the wavelength conversion member can be moved from the lower outer peripheral surface of the wavelength conversion member to the mounting substrate through the heat radiating plate. be able to. Moreover, since light is emitted from the wavelength conversion member configured in a dome shape, the light distribution of the emitted light can be controlled to a wide angle.

The side sectional view of the LED unit concerning a 1st embodiment of the present invention. The sectional side view of the LED unit which concerns on the 2nd Embodiment of this invention. The sectional side view of the LED unit which concerns on the 3rd Embodiment of this invention. The sectional side view of the LED unit which concerns on the modification of this invention. The sectional side view of the conventional LED unit. The sectional side view of the conventional LED unit.

  Hereinafter, an LED unit according to a first embodiment of the present invention will be described with reference to FIG. The LED unit 1 is provided on the mounting substrate 3 so as to cover the light source 2, the mounting substrate 3 on which the light source 2 is mounted, and wavelength conversion for converting the wavelength of the emitted light from the light source 2 to a different wavelength. A member 4 and a heat radiating plate 5 that radiates heat of the wavelength conversion member 4 to the mounting substrate 3 are provided. The heat of the wavelength conversion member 4 is generated when the emitted light from the light source 2 is wavelength-converted in the wavelength conversion member 4. Between the light source 2 and the wavelength conversion member 4, air or the same material as the transparent material constituting the wavelength conversion member 4 is filled. In the drawing, a thick black arrow indicates the heat transfer of the wavelength conversion member 4.

  As the light source 2, a light emitting diode (hereinafter referred to as LED) is used. In this embodiment, for example, a blue LED that emits blue light (emission wavelength is 460 nm) is used, a red LED that emits red light (emission wavelength is 660 nm), or a green LED that emits green light (emission wavelength). 520 nm) may be used. Note that a plurality of light sources 2 may be used in the LED unit, and as the plurality of light sources 2, the above-described blue LED, red LED, or green LED is used in an appropriate combination, and these are mixed. White light is obtained. The number of LEDs or the emission wavelength is not particularly limited and may be selected as appropriate.

  In the LED, a light emitting diode element (hereinafter referred to as an LED chip) 21 is mounted on a mounting substrate 3 via a submount 22 such as aluminum nitride (AlN), and a power supply portion provided on the submount 22 by wire bonding. Electrically connected. The submount 22 has high thermal conductivity, can efficiently radiate the heat of the LED chip 21 to the mounting substrate 3, and the LED caused by the difference in linear expansion coefficient between the mounting substrate 3 and the LED chip 21. The stress acting on the chip 21 can be relaxed.

  In addition, the LED chip 21 is sealed by a sealing portion 23 made of a translucent material, and the light extraction efficiency from the LED chip 21 can be improved by appropriately setting the refractive index of the sealing portion 23. In addition, the wire bonded wire can be protected from an external impact or the like. As the translucent material of the sealing part 23, for example, a silicone resin, an epoxy resin, an acrylic resin, or the like can be used.

  The mounting substrate 3 is composed of a metal substrate whose main material is a high heat dissipation metal in order to efficiently dissipate heat from the LED, and has a wiring pattern including, for example, gold (Au) on the surface. In addition, an insulating layer for ensuring insulation is provided between the wiring pattern and the metal substrate. The wiring pattern and the power feeding portion of the submount 22 are electrically connected, and the LED chip 21 and the wiring pattern are electrically connected, thereby ensuring power feeding to the LED. When the light output from the LED is small and heat generation is small as the mounting substrate 3, a glass epoxy substrate or a paper phenol substrate may be used instead of the metal substrate.

  The wavelength conversion member 4 is a translucent member including a granular phosphor and a transparent resin that holds the phosphor. The phosphor substantially converts the wavelength of light emitted from the light source 2 into a different wavelength. At the time of wavelength conversion by the phosphor, heat is emitted from the phosphor, and the heat is accumulated in the wavelength conversion member 4, whereby the temperature of the wavelength conversion member 4 rises. In the present embodiment, the wavelength conversion member 4 is configured in a dome shape, and a lower end surface thereof is in contact with the mounting substrate 3. By carrying out like this, since the heat in the wavelength conversion member 4 can be directly moved to the mounting substrate 3, the temperature rise of the wavelength conversion member 4 can be suppressed efficiently. For example, a yellow phosphor or a red phosphor can be used as the phosphor, but the present invention is not limited to this, and a plurality of types of phosphors may be mixed and used in order to improve color adjustment and color rendering. For example, white light with high color rendering can be obtained by using a mixture of a red phosphor and a green phosphor.

  The transparent resin is a main component of the wavelength conversion member 4 and transmits light emitted from the light source 2. In the present embodiment, the wavelength conversion member 4 is configured in a dome shape as described above, and light is emitted from the surface of the dome-shaped wavelength conversion member 4, so that, for example, a component member such as a reflecting mirror is separately installed. A wide light distribution range can be ensured without doing so. Further, since the optical path length in the wavelength conversion member 4 is uniform with respect to the light emission direction, and the probability that the emitted light from the light source 2 is wavelength-converted is equal, the variation in the predetermined light component is suppressed, Color variation of irradiation light can be suppressed.

  The transparent resin may be mixed with a diffusion material as necessary. In this way, since the light emitted from the light source 2 can be effectively diffused in the transparent resin, the color of the light emitted from the LED unit 1 can be made more uniform in any light irradiation direction. As the diffusing material, for example, an inorganic material such as aluminum oxide or silica, or a material having an average particle diameter of 1 μm formed from an organic material such as a fluorine resin can be used. As the material of the transparent resin, for example, a silicone resin, an acrylic resin, glass, or an organic / inorganic hybrid material in which an organic component and an inorganic component are mixed and bonded at the nm level or the molecular level can be used. As a method of installing the wavelength conversion member 4 on the mounting substrate 3, a method of fixing the lower end surface of the wavelength conversion member 4 through an adhesive containing, for example, a silicone resin or an epoxy resin can be used.

  The heat sink 5 is made of a material having high thermal conductivity or high heat dissipation, and is provided so as to extend on the mounting substrate 3. Generally, the LED unit 1 may be used by a user for a long time. In such a case, heat due to energy loss of wavelength conversion is accumulated, and the temperature rise of the wavelength conversion member 4 becomes remarkable. Therefore, in the present embodiment, the heat radiating plate 5 is in contact with the lower outer peripheral surface of the wavelength conversion member 4, thereby not only the heat transfer directly from the lower end surface of the wavelength conversion member 4 but also the wavelength conversion. Heat can be transferred from the lower outer peripheral surface of the member 4 to the mounting substrate 3 through the heat sink 5. Therefore, the heat in the wavelength conversion member 4 can be efficiently dispersed, and the temperature increase of the wavelength conversion member 4 can be suppressed.

  The contact area between the mounting substrate 3 and the heat sink 5 is preferably set as large as possible. By so doing, more heat can be transferred to the mounting substrate 3 via the heat radiating plate 5, so that the temperature increase of the wavelength conversion member 4 can be further suppressed. As a material for the heat sink 5, it is preferable to use a metal or resin having high thermal conductivity or high heat dissipation. As such a metal, for example, aluminum, iron, copper or the like can be used, and as such a resin, for example, a thermosetting resin obtained by diffusing a filler having high thermal conductivity can be used. . As a method of installing the heat sink 5, for example, a method of providing a hole in the heat sink 5 and fitting the wavelength conversion member 4 fixed on the mounting substrate 3 into this hole (shrink fit) can be used.

  In the LED unit 1 of the present embodiment, light emitted from the light source 2 is emitted radially around the light source 2, passes through air or a transparent material between the light source 2 and the wavelength conversion member 4, and passes through the wavelength conversion member 4. Is incident on. The incident light passes through the wavelength conversion member 4 without being irradiated to the phosphor and being converted into a different wavelength within the wavelength conversion member 4 or being converted into a different wavelength. For example, white light is generated by mixing light that has been wavelength-converted by the phosphor and light that has not been wavelength-converted, and this light is emitted from the LED unit 1.

  According to the LED unit 1 of the present embodiment, not only the direct heat transfer from the lower end surface of the wavelength conversion member 4 but also the heat radiation plate 5 from the lower outer peripheral surface of the wavelength conversion member 4 to the mounting substrate 3. Since heat can be dispersed, temperature rise of the wavelength conversion member 4 can be suppressed. Therefore, for example, the wavelength conversion member 4 is hardly deteriorated such as a decrease in wavelength conversion efficiency of the phosphor, and the conversion efficiency of the LED unit 1 can be maintained.

  Moreover, since light is emitted from the wavelength conversion member 4 configured in a dome shape, the light distribution of the emitted light can be controlled to a wide angle without separately installing the component members.

  In addition, since the optical path length in the wavelength conversion member 4 is uniform with respect to the light emission direction, the probability that the emitted light from the light source 2 is wavelength-converted becomes equal, and variation in predetermined light components is suppressed. The color variation of the irradiation light of the LED unit 1 can be suppressed. In this way, even when the LED unit 1 is observed from any angle, the chromaticity distribution is generated in the same manner, and the LED unit 1 in which the color of the irradiation light is uniform in any light irradiation direction is obtained.

  Next, an LED unit according to a second embodiment of the present invention will be described with reference to FIG. The LED unit 1 according to the present embodiment is provided with a reflector 6 that reflects light emitted from the light source 2 in the direction along the mounting substrate 3 to the wavelength conversion member 4 on the lower inner side of the wavelength conversion member 4. It has the same kind of LED. The reflection plate 6 is formed in an annular shape along the lower inner peripheral surface of the wavelength conversion member 4, and its inner diameter gradually decreases toward the mounting substrate 3. By doing so, it is possible to prevent the outgoing light in the direction along the mounting substrate 3 from passing through the lower part of the wavelength conversion member 4 and being shielded by the heat sink 5. It can be reflected to the wavelength conversion member 4. As the reflection plate 6, a highly reflective member such as an aluminum reflection plate or a silver reflection plate can be used. Other configurations are the same as those in the first embodiment.

  In the LED unit 1 of the present embodiment, the emitted light from the light source 2 in the direction along the mounting substrate 3 is applied to the reflecting plate 6, and this irradiated light is reflected by the reflecting plate 6 and is indicated by a light beam L in the drawing. As shown, the wavelength conversion member 4 is irradiated. In addition, the outgoing light from the light source 2 excluding the outgoing light is directly applied to the wavelength conversion member 4 and mixed with the light reflected by the reflecting plate 6. The mixed light passes through the wavelength conversion member 4, light that has been wavelength-converted by the phosphor and light that has not been wavelength-converted are mixed, and are emitted from the LED unit 1 as mixed-color light.

  According to the LED unit 1 of the present embodiment, the emitted light from the light source 2 in the direction along the mounting substrate 3 is reflected by the reflection plate 6 without being absorbed by the heat radiating plate 5, and is reflected on the wavelength conversion member 4. Since it is irradiated, the conversion efficiency of the LED unit 1 can be improved.

  Next, an LED unit according to a third embodiment of the present invention will be described with reference to FIG. The LED unit 1 according to the present embodiment has a flange portion 4a that extends outward at the lower portion of the wavelength conversion member 4, and the flange portion 4a is pressed by the heat radiating plate 5 and has the same type of LED. is there. The flange 4 a and the heat sink 5 on the flange 4 a are fixed on the mounting substrate 3 with screws 7. Instead of the screws 7, for example, an adhesive may be used to fix the flange 4 a and the heat sink 5 on the mounting substrate 3. The contact area between the mounting substrate 3 and the flange 4a is preferably set as large as possible. If it carries out like this, since more heat can be directly moved from the wavelength conversion member 4 to the mounting substrate 3, the heat dissipation of the LED unit 1 can be improved, and the wavelength conversion member 4 can be more stably formed. It can be installed on the mounting substrate 3. Other configurations are the same as those in the first embodiment.

  In the LED unit 1 of the present embodiment, the light emitted from the light source 2 is incident on the wavelength conversion member 4 and is transmitted through the wavelength conversion member 4 without being subjected to wavelength conversion by the phosphor or wavelength conversion. These wavelength-converted light and light that has not been wavelength-converted are mixed and emitted from the LED unit 1 as mixed-color light.

  According to the LED unit 1 of this embodiment, the wavelength conversion member 4 can be easily installed on the mounting substrate 3 by sandwiching the wavelength conversion member 4 between the heat sink 5 and the mounting substrate 3. Further, since the flange portion 4a is provided, the contact area between the wavelength conversion member 4 and the mounting substrate 3 is increased, and heat can be directly transferred from the wavelength conversion member 4 to the mounting substrate 3 more efficiently. The heat dissipation of the LED unit 1 can be improved.

  Next, an LED unit according to a modification of the present invention will be described with reference to FIG. The LED unit 1 according to this modification has a reflection plate 6 at the lower inner side of the wavelength conversion member 4, and has a flange 4 a that extends outward at the lower part of the wavelength conversion member 4. 4a is held down by the heat sink 5 and has the same kind of LED. That is, the LED unit 1 of this modification is a combination of the LED unit 1 according to the second embodiment and the LED unit 1 according to the third embodiment. Other configurations are the same as those in the first embodiment.

  In the LED unit 1 of the present modification, the emitted light from the light source 2 in the direction along the mounting substrate 3 is reflected on the reflecting plate 6 and then reflected and reflected by the wavelength conversion member 4 as indicated by the light beam L. Is irradiated. In addition, the outgoing light from the light source 2 excluding the outgoing light is directly applied to the wavelength conversion member 4 and mixed with the light reflected by the reflecting plate 6. The mixed light passes through the wavelength conversion member 4, light that has been wavelength-converted by the phosphor and light that has not been wavelength-converted are mixed, and are emitted from the LED unit 1 as mixed-color light.

  According to the LED unit 1 of this modification, as described above, the emitted light in the direction along the mounting substrate 3 is reflected by the reflecting plate 6 and passes through the wavelength conversion member 4 to the outside of the LED unit 1. Since it is irradiated, the conversion efficiency of the LED unit 1 can be improved. Further, the wavelength conversion member 4 is sandwiched between the heat radiating plate 5 and the mounting substrate 3 to simplify the installation of the wavelength conversion member 4, and further, the contact area between the wavelength conversion member 4 and the mounting substrate 3 is increased by the flange 4a. The heat dissipation of the LED unit 1 can be improved.

  The present invention is not limited to the configuration of the above embodiment or modification, and various modifications can be made without departing from the spirit of the invention. For example, in the above description, the LED chip 21 is mounted on the mounting substrate 3 via the submount 22. However, the LED chip 21 is mounted on the mounting substrate 3 by solder die bonding without using the submount 22. May be implemented. Further, between the light source 2 and the wavelength conversion member 4, for example, a transparent resin material made of the same material as the sealing portion 23 of the light source 2 may be filled.

DESCRIPTION OF SYMBOLS 1 LED unit 2 Light source 3 Mounting board 4 Wavelength conversion member 4a Eave part 5 Heat sink 6 Reflector

Claims (3)

A light source;
A mounting substrate on which the light source is mounted;
A wavelength conversion member that is provided on the mounting substrate so as to cover the light source, and converts the wavelength of light emitted from the light source into a different wavelength;
A heat radiating plate for radiating heat of the wavelength conversion member to the mounting substrate,
The wavelength conversion member is configured in a dome shape,
The heat sink is in contact with the lower outer peripheral surface of the wavelength conversion member ,
The wavelength conversion member has a collar portion extending outward at a lower portion thereof,
The LED unit , wherein the collar is pressed by the heat radiating plate .   The LED unit according to claim 1, wherein a lower end surface of the wavelength conversion member is in contact with the mounting substrate.   2. A reflector for reflecting outgoing light from the light source in a direction along the mounting substrate to the wavelength conversion member is provided inside the lower portion of the wavelength conversion member. 2. The LED unit according to 2.

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