JP5711404B2 - Wireless communication improving sheet body, wireless tag with wireless communication improving sheet body, and wireless tag communication system - Google Patents

Description

  The present invention relates to a wireless communication improvement sheet for preventing deterioration of communication characteristics due to material characteristics such as conductivity, dielectric constant, and magnetic permeability of a member to which the wireless tag is attached when using a wireless tag that performs wireless communication. The present invention relates to a body, a wireless tag with a wireless communication improvement sheet body, and a wireless tag communication system. The wireless tag includes an integrated circuit (Integrated Circuit: abbreviated as “IC”) in which information on an article is recorded in logistics management, and the information on the article is identified by RFID (Radio Frequency Identification) via non-contact wireless communication. ) Respond to read / write commands from the reader.

  As a conventional technique for improving the communication characteristics of an IC chip, a wireless IC tag having an IC chip, a first antenna, a first spacer, a second antenna, and a second spacer is known. . In this wireless IC tag, the first antenna is provided connected to the IC chip, and the first spacer is disposed between the IC chip and a member to which the IC chip is attached. The second antenna resonates with radio waves used for communication, and the second spacer is disposed between the first antenna and the second antenna to maintain a distance between the first and second antennas. (For example, refer to Patent Document 1).

  Since the second antenna is disposed via the second spacer with respect to the IC chip and the first antenna, the second antenna is not electrically connected to the IC chip and improves the communication characteristics of the IC chip. Therefore, the second spacer and the second antenna can be considered as a wireless communication improving sheet that improves the communication characteristics of the IC chip. The second spacer and the second antenna are arranged on an article to which the wireless IC tag is attached together with a plate-like base material made of, for example, a polyimide resin material.

Japanese Patent Laying-Open No. 2005-210676

  Since the second spacer and the second antenna according to the prior art are arranged together with a base material having high rigidity and thickness with respect to an article to which the wireless IC tag is attached, the second spacer and the second antenna are arranged. Multiple layers containing can not be bent easily. Therefore, the conventional wireless IC tag has a problem that it cannot be deformed along the curved shape of the curved article when it is attached to the curved article.

  An object of the present invention is to provide a wireless communication improvement sheet body, a wireless tag with a wireless communication improvement sheet body, and a wireless tag that can be easily attached onto a curved surface of a curved article and can improve the communication characteristics of the wireless tag. It is to provide a communication system.

The present invention is a wireless communication that functions as an auxiliary antenna by resonating with a radio wave of the same frequency as that used for radio communication of a radio tag, can be attached to an article, and is formed by laminating a plurality of sheet-like layers In the improved sheet body,
As the plurality of layers,
An auxiliary antenna layer having a conductive conductor layer;
An insulating dielectric layer;
A shielding layer disposed opposite to the auxiliary antenna layer via a dielectric layer and disposed closer to the article than the auxiliary antenna layer,
The plurality of layers are prevented from being separated from each other, and at least some of the plurality of layers are formed with a slidable region that is slidable with respect to another layer adjacent in the thickness direction. The wireless communication improving sheet body is characterized in that

  The present invention is further characterized by further comprising holding means for preventing the plurality of layers from separating from each other.

  In the present invention, the holding means includes a coating film that surrounds part or all of the plurality of layers.

In the present invention, a plurality of the dielectric layers are provided.
In the present invention, a plurality of dielectric layers are provided, and the dielectric constant of each dielectric layer is set to any one of a plurality of different dielectric constants.

  In the present invention, the auxiliary antenna layer has at least one hole or notch in the conductor layer.

  In the present invention, the wireless tag is disposed on the side opposite to the article with respect to the auxiliary antenna layer.

Further, the present invention is a wireless tag comprising the integrated circuit for storing information, and an antenna element for transmitting and receiving the information by wireless communication,
A wireless tag with a wireless communication improvement sheet body comprising the wireless communication improvement sheet body.

  In addition, the present invention is a wireless tag communication system including the wireless communication improving sheet body or the wireless tag with the wireless communication improving sheet body.

  The wireless communication improving sheet body of the present invention can be attached to an article and is formed by laminating a plurality of sheet-like layers. The wireless communication improving sheet body includes an auxiliary antenna layer, a dielectric layer, and a shielding layer as the plurality of layers. The auxiliary antenna layer has a conductive conductor layer. The dielectric layer has an insulating property. The shielding layer is disposed to face the auxiliary antenna layer via the dielectric layer. The shielding layer is disposed closer to the article than the auxiliary antenna layer.

  A microstrip antenna that can operate on a metal surface is configured by the auxiliary antenna layer, the dielectric layer, and the shielding layer of the wireless communication improvement sheet. The antenna of a wireless tag is often an antenna based on a dipole antenna, and the dipole antenna is easily affected by an article to be attached. Therefore, when the antenna is attached to an article having a high conductivity or dielectric constant, the radiation characteristics are deteriorated. On the other hand, the microstrip antenna of the wireless communication improvement sheet is characterized by being hardly affected by the article to be attached. The microstrip antenna of the wireless communication improvement sheet body is adjusted so as to resonate with radio waves of the communication frequency of the wireless tag in a state where the wireless tag is arranged, and the wireless strip antenna and the microstrip antenna of the wireless communication improvement sheet are respectively Resonates at the communication frequency of the wireless tag. When the wireless tag is arranged on the wireless communication improvement sheet body, the antenna of the wireless tag and the microstrip antenna of the wireless communication improvement sheet are electromagnetically coupled, and transmission / reception of radio waves from the wireless tag is performed by the microstrip of the wireless communication improvement sheet. This is done via the antenna. Therefore, the wireless communication improving sheet body of the present invention is not easily affected by the article to be attached, and functions as an auxiliary antenna for the wireless tag. By using the present invention, communication when a wireless tag is attached to an article having high conductivity or dielectric constant can be improved.

  Further, the plurality of layers of the present invention are prevented from separating from each other. At least a part of the plurality of layers is formed with a slidable region that is slidable with respect to another layer adjacent in the thickness direction.

  In a state where the wireless communication improvement sheet body is attached to the surface of the article having a curved surface, the wireless communication improvement sheet body is deformed into a shape along the curved surface of the article. At this time, one side of the wireless communication improving sheet is compressed and the other side is expanded. If the wireless communication improving sheet member is elastically deformed, an elastic restoring force is generated in the wireless communication improving sheet member, and the elastic restoring force increases as the bending rigidity of the wireless communication improving sheet member increases. When the elastic restoring force is increased, it is difficult to bend the wireless communication improving sheet body, and it is difficult to stick the sheet to a curved article surface. Even if it can be pasted on the article surface, a long-term elastic restoring force is generated in the wireless communication improving sheet body, and the wireless communication improving sheet body may be peeled off from the pasted article. In particular, when the wireless communication improving sheet body and the article are attached with an adhesive, a creep phenomenon may occur due to the generation of a long-term elastic restoring force, and the adhesive itself may be separated.

  On the other hand, in the wireless communication improvement sheet body in which a slidable area is formed in a part of the plurality of layers, the strain is released in the slidable area. Can reduce the strain generated. Therefore, the elastic restoring force generated when the wireless communication improving sheet body is bent can be made as small as possible. Further, since the plurality of layers are prevented from being separated from each other, it is possible to prevent the layers of the wireless communication improving sheet body from being separated from each other in the slidable region where the layers can slide.

  A bending moment is applied to the wireless communication improving sheet body in a bent state. When the bending moment is large, the elastic restoring force generated when the wireless communication improving sheet body is bent increases, and the bending moment becomes larger when the bending rigidity of the wireless communication improving sheet body is large or when the radius of curvature is small. The bending rigidity of the wireless communication improving sheet body can be expressed by the product of the longitudinal elastic modulus and the cross-sectional second moment of the wireless communication improving sheet body. Hereinafter, the “longitudinal elastic modulus” is also referred to as “Young's modulus”. In the wireless communication improving sheet body in a bent state, a strain due to a compressive force is generated inside the bend, and a strain due to a tensile force is generated outside. In the wireless communication improving sheet body in a bent state, a compressive stress is applied to the inside of the bend and a tensile stress is applied to the outside, and a neutral axis between which the compressive stress and the tensile stress are not applied exists. . The cross-sectional second moment takes a value obtained by integrating the square value of the thickness direction component of the distance from the neutral axis with respect to the cross section of the wireless communication improving sheet body.

  The wireless communication improving sheet body targeted by the present invention includes a configuration in which one or more dielectric layers made of an insulator are positioned between an auxiliary antenna layer including a layer made of a conductive material and a shielding layer. Yes. The antenna part of the wireless tag, the auxiliary antenna layer and the shielding layer of the wireless communication improvement sheet body are made of a conductive material, and in order to prevent the antenna pattern wiring from being deformed or disconnected due to an excessive load, the chip joint part is destroyed. These conductor layers are usually arranged together with a base material having a large longitudinal elastic modulus.

  Even if the base material arranged together with the conductor layer has a large longitudinal elastic modulus, the thickness is very thin. Therefore, when the conductor layer is bent alone, the second moment of section is small and the bending rigidity is not increased. However, if the entire surface of the conductor layer such as the auxiliary antenna layer and the shielding layer is joined to the thick dielectric layer, a neutral axis of bending stress is formed in the dielectric layer, so that the cross section of the conductor layer Is positioned away from the neutral axis, the second moment of section and bending rigidity of the conductor layer are increased, and the bending rigidity of the entire wireless communication improving sheet body is also increased. When a conductor layer is attached to only one side of the dielectric layer, a neutral axis of bending stress can be formed in the dielectric layer at a position close to the conductor layer, but when applied to both sides, the neutral axis of bending stress is Since it is located in the vicinity of the center of the dielectric, the sectional moment of inertia and the bending rigidity of the conductor layer are further increased.

  On the other hand, in the wireless communication improvement sheet body, since each slidable area, which is an area where each layer is slidable with respect to the other layers, is formed, when the wireless communication improvement sheet body is bent, it slides. By sliding the layers in the possible region, the layers can bend independently, and a central axis of bending is created inside the cross section of each layer. Compared to the case where the center axis of bending is located outside the cross section, the moment of inertia of the section is reduced when the center axis of bending is located inside the cross section. Since the conductor layer is disposed together with the base material having a large longitudinal elastic modulus, the bending rigidity can be remarkably reduced by reducing the second moment of section. Therefore, it is possible to reduce the bending rigidity of the wireless communication improving sheet body when a bending moment whose curvature radius is determined in the thickness direction of each layer is applied to the wireless communication improving sheet body.

  Further, when a bending moment is applied to the wireless communication improving sheet body, each layer is bent while sliding on each other in the slidable region. Accordingly, the wireless communication improving sheet body can be easily deformed as compared with the case where the layers cannot slide with respect to each other. The maximum value of the tensile stress and the compressive stress applied to each layer when the wireless communication improving sheet body is pasted so as to follow the curved surface can be reduced. Therefore, damage to the wireless communication improvement sheet body can be prevented and the bending rigidity is small, so that the wireless communication improvement sheet body can be easily attached to the curved surface portion of the article.

  The wireless communication improvement sheet body in which the wireless tag is arranged is easy to bend because the bending rigidity of the wireless communication improvement sheet body is small, and it is easy to follow the surface of the curved article. Can be easily attached to the curved surface. Therefore, the wireless communication improving sheet body on which the wireless tag is arranged can be attached to a surface having various shapes to manage various articles, and the application of the wireless tag can be expanded.

  Further, the strain that occurs when the temperature changes due to the difference in thermal expansion coefficient of each of the plurality of layers can be reduced by the slidable region. The plurality of layers are made of a resin material and a metal material. Generally, the resin material has a larger linear expansion coefficient than the metal material. For example, when the sheet temperature is raised, the metal material is stretched by the resin material having a large linear expansion coefficient, and when the sheet temperature is lowered, the sheet is compressed. If the temperature change is repeated, warpage, wrinkles, cracks and the like may occur in the sheet. In the present invention, there is a slidable region between different layers of material, and strain due to heat can be reduced. Therefore, a metal-compatible sheet that is resistant to temperature changes can be provided.

  According to the invention, the wireless communication improving sheet body further includes holding means for preventing the plurality of layers from separating from each other. Therefore, the holding means can prevent the layers from separating when the wireless communication improving sheet body is affixed to the curved surface portion of the article, and can easily handle the wireless communication improving sheet body.

  Further, the holding means can prevent the bending rigidity of each layer from increasing by securing the slidable region of each layer while preventing the layers from separating. Thereby, since the bending rigidity does not become large, the wireless communication improving sheet body can be easily attached to the curved surface portion of the article.

  According to the invention, the holding means includes a coating film that surrounds part or all of the plurality of layers. Therefore, the coating film can surround and hold the plurality of layers integrally. Thereby, since the dimensional change in the thickness direction when the wireless communication improvement sheet body is bent is small, the performance change of the auxiliary antenna when the wireless communication improvement sheet body is bent is small. Therefore, according to this invention, the radio | wireless communication improvement sheet | seat body which can be used regardless of the material and location of the articles | goods to paste can be provided.

  In addition, since the coating film surrounds and holds each layer to prevent separation from each other, it is possible to prevent the layers of the wireless communication improvement sheet body from separating from each other in the slidable region. Further, the wireless communication improving sheet body can protect each layer with a coating film, and can improve durability, weather resistance, impact resistance, and the like of each layer.

  According to the present invention, a plurality of dielectric layers are provided. Therefore, when a dielectric layer having the same thickness is provided between the auxiliary antenna layer and the shielding layer, a plurality of dielectric layers are provided and bonded to each other by the joint portion, compared to a case where a single dielectric layer is provided. An unexposed region can be formed in the dielectric layer. When the dielectric layer is provided as a single layer, the thickness of the entire dielectric layer contributes to the moment of inertia of the cross section of the dielectric layer. On the other hand, by making the dielectric layers into a plurality of layers, the sectional second moment of the whole dielectric layer is not a value determined by the total dimension in the thickness direction of the dielectric layer, but the cross section of each dielectric layer. It can be the sum of the second moments. Since the cross-sectional secondary moment when the cross-sectional shape is rectangular is proportional to the cube of the dimension in the thickness direction, the sum of the cross-sectional secondary moments of each dielectric layer is such that the dielectric layer is formed as a single layer. Smaller than the case.

  Therefore, it is possible to reduce the bending rigidity of the dielectric layer when a bending moment whose curvature radius is determined in the thickness direction of each dielectric layer is applied to the dielectric layer. Further, when a bending moment is applied to the dielectric layer, the plurality of dielectric layers can slide with each other. As a result, the maximum values of the tensile stress and the compressive stress applied to each dielectric layer can be made smaller than when the dielectric layers cannot slide with respect to each other. Therefore, damage to the dielectric layer can be prevented. Moreover, since the bending rigidity of a dielectric material layer can be made small, the bending rigidity of the whole radio | wireless communication improvement sheet | seat body can be made small.

  According to the invention, a plurality of dielectric layers are provided, and the dielectric constant of each dielectric layer is set to any one of a plurality of different dielectric constants. Therefore, the plurality of dielectric layers can finely adjust the effective dielectric constant of the entire dielectric layer as compared with the case where the dielectric layer is formed of a single insulating material. Thus, the wireless communication improving sheet body can reliably prevent the communication characteristics of the wireless tag from deteriorating and the communication distance from being shortened when the wireless tag is disposed.

  According to the invention, the auxiliary antenna layer has at least one hole or notch in the conductor layer. Therefore, the wireless communication improving sheet body can be electromagnetically coupled to the wireless tag through the hole or notch of the conductor layer. In addition, the electromagnetic coupling strength can be adjusted by adjusting the dimension of the hole or notch in the conductor layer and the positional relationship with the wireless tag, and the antenna impedance of the wireless tag and the wireless communication improving sheet body can be controlled. is there. As a result, the wireless communication improving sheet body can function as an auxiliary antenna of a more efficient wireless tag.

  According to the invention, the wireless tag is disposed on the side opposite to the article with respect to the auxiliary antenna layer. Therefore, when the wireless tag is arranged, the wireless communication improving sheet body can shield the electromagnetic influence from the article to the wireless tag by the shielding layer, and can function as an auxiliary antenna of the wireless tag. In addition, the wireless tag can be easily disposed on the wireless communication improving sheet body.

  According to the invention, the wireless tag with a wireless communication improving sheet body is the wireless tag, the wireless tag including an integrated circuit for storing information, and an antenna element for transmitting and receiving the information by wireless communication; The wireless communication improving sheet body is included. Therefore, since the wireless communication improving sheet body can prevent the layers from separating from each other, the wireless tag with the wireless communication improving sheet body can be easily handled.

  In addition, in a state where the wireless tag with the wireless communication improvement sheet body is attached to the surface of the article having a curved surface, the wireless tag with the wireless communication improvement sheet body is deformed into a shape along the curved surface of the article. At this time, if the wireless tag with the wireless communication improving sheet body is elastically deformed, an elastic restoring force is generated in the wireless tag with the wireless communication improving sheet body. If a long-term elastic restoring force continues to be generated in the wireless tag with the wireless communication improvement sheet body, this may cause the wireless tag with the wireless communication improvement sheet body to peel from the attached article. In particular, when the RFID tag with a wireless communication improvement sheet body and an article are attached with an adhesive, when the polymer that forms the adhesive causes a creep phenomenon, the adhesive itself is caused by the generation of a long-term elastic restoring force. There is a possibility of separation. In contrast, in the wireless tag with a wireless communication improvement sheet body in which the layers are slidably integrated with each other, the layers slide with each other, so that the wireless tag with the wireless communication improvement sheet body can be flexibly deformed. Therefore, the elastic restoring force generated in the wireless tag with the wireless communication improving sheet body can be made as small as possible. In addition, since the coating film surrounds and holds each layer to prevent separation, each layer of the wireless tag with the wireless communication improvement sheet body can be prevented from separating from each other in the slidable region.

  In addition, if the entire surface of each layer is joined, if a bending moment whose radius of curvature is determined in the thickness direction of each layer is applied to the wireless tag with the wireless communication improving sheet body, the thickness dimension of each layer becomes the cross section 2 Contributes to the next moment. On the other hand, the wireless tag with the wireless communication improving sheet body is adjacent to the slidable region, that is, in the thickness direction by forming the area of the joint portion smaller than the area of the surface perpendicular to the thickness direction of each layer. A region where the layers are not bonded can be formed.

  As a result, the cross-sectional secondary moment of the entire wireless tag with the wireless communication improving sheet body is not a value determined by the entire thickness dimension of the wireless tag with the wireless communication improving sheet body, but the sum of the cross-sectional secondary moments of the respective layers. Can do. Since the cross-sectional secondary moment is proportional to the cube of the dimension in the thickness direction, the total cross-sectional secondary moment of each layer is smaller than when the entire surface of each layer is joined. Therefore, the bending rigidity of the wireless tag with the wireless communication improving sheet body can be reduced when a bending moment whose curvature radius is determined in the thickness direction of each layer is applied to the wireless tag with the wireless communication improving sheet body.

  Further, when a bending moment is applied to the wireless tag with the wireless communication improving sheet body, each layer is bent while sliding on each other in a slidable region, that is, a region not joined by the joint. Thereby, the maximum values of the tensile stress and the compressive stress applied to each layer can be reduced as compared with the case where the layers cannot slide with respect to each other. Therefore, damage to the wireless tag with the wireless communication improving sheet body can be prevented. Further, since the bending rigidity can be reduced, the wireless tag with the wireless communication improving sheet body can be easily attached to the curved surface portion of the article.

  Since the wireless tag with the wireless communication improving sheet body has low bending rigidity, it can be easily attached to the curved surface portion of the article. Therefore, the wireless tag with the wireless communication improvement sheet body can be attached to a surface of various shapes to manage various articles, and the application of the wireless tag can be expanded.

It is sectional drawing of the radio | wireless communication improvement sheet | seat body 1 which is 1st Embodiment of this invention. It is a top view of the radio | wireless communication improvement sheet | seat body 1 which is 1st Embodiment of this invention. It is sectional drawing of the radio | wireless communication improvement sheet | seat body 1 of a comparative example. It is sectional drawing of the radio | wireless communication improvement sheet | seat body 1 and the radio | wireless IC tag 22 of a comparative example. It is sectional drawing of the state which bent the radio | wireless communication improvement sheet | seat body 1 of the comparative example. It is sectional drawing of the auxiliary antenna layer 11, the dielectric material layer 12, and the shielding layer 13 which are 1st Embodiment of this invention. It is sectional drawing of the state which bent the auxiliary antenna layer 11, the dielectric material layer 12, and the shielding layer 13 which are 1st Embodiment of this invention. It is sectional drawing of the radio | wireless IC tag 6 with a radio | wireless communication improvement sheet | seat body which is 2nd Embodiment of this invention. It is sectional drawing of the radio | wireless IC tag 6 with a radio | wireless communication improvement sheet | seat body of Example 1 of this invention. It is the top view which decomposed | disassembled the radio | wireless IC tag 6 with a radio | wireless communication improvement sheet | seat body of Example 1 of this invention. It is sectional drawing of the radio | wireless IC tag 6 with a radio | wireless communication improvement sheet | seat body which is 3rd Embodiment of this invention. It is sectional drawing of the radio | wireless IC tag 6 with a radio | wireless communication improvement sheet | seat body of Example 2 of this invention. It is the top view which decomposed | disassembled the radio | wireless IC tag 6 with a radio | wireless communication improvement sheet | seat body of Example 2 of this invention. It is sectional drawing of the radio | wireless IC tag 6 with a radio | wireless communication improvement sheet | seat body which is 4th Embodiment of this invention. It is sectional drawing of the radio | wireless IC tag 6 with a radio | wireless communication improvement sheet | seat body which is 5th Embodiment of this invention. It is sectional drawing of the radio | wireless IC tag 6 with a radio | wireless communication improvement sheet | seat body which is 6th Embodiment of this invention. It is sectional drawing of the radio | wireless IC tag 6 with a radio | wireless communication improvement sheet | seat body which is 7th Embodiment of this invention. It is sectional drawing of the radio | wireless IC tag 6 with a radio | wireless communication improvement sheet | seat body which is 8th Embodiment of this invention. It is sectional drawing of the radio | wireless IC tag 6 with a radio | wireless communication improvement sheet | seat body which is 9th Embodiment of this invention. It is sectional drawing of the radio | wireless IC tag 6 with a radio | wireless communication improvement sheet | seat body which is 10th Embodiment of this invention.

It is sectional drawing which shows the state in which the external force is provided to the radio | wireless IC tag 6 with a radio | wireless communication improvement sheet | seat body which is 10th Embodiment of this invention. It is sectional drawing of the radio | wireless IC tag 6 with a radio | wireless communication improvement sheet | seat body which is 11th Embodiment of this invention. It is sectional drawing for demonstrating the bending rigidity of the radio | wireless IC tag 6 with a radio | wireless communication improvement sheet | seat body which is 11th Embodiment of this invention. It is sectional drawing of the radio | wireless IC tag 6 with a radio | wireless communication improvement sheet | seat body which is 12th Embodiment of this invention. FIG. 25 is a partial cross-sectional view of the dielectric layer 12 shown in FIG. 24 cut along a cutting plane line BB. It is a block diagram which shows the structure of the radio | wireless tag communication system 8 which is 13th Embodiment of this invention.

  Hereinafter, a plurality of embodiments for carrying out the present invention will be described with reference to the drawings. In the following description, parts corresponding to items already described in the forms preceding each form may be denoted by the same reference numerals, and overlapping descriptions may be omitted. When only a part of the configuration is described, the other parts of the configuration are the same as those described in the preceding section. Not only the combination of the parts specifically described in each embodiment, but also the embodiments can be partially combined as long as the combination does not hinder. Each embodiment is illustrated in order to embody the technology in the present invention, and does not limit the technical scope of the present invention. The technical contents of the present invention can be variously modified within the technical scope described in the claims.

(First embodiment)
FIG. 1 is a cross-sectional view of a wireless communication improving sheet body 1 according to the first embodiment of the present invention. FIG. 2 is a plan view of the wireless communication improving sheet body 1 according to the first embodiment of the present invention. The wireless communication improvement sheet body 1 has a rectangular surface perpendicular to the thickness direction. FIG. 1 is a cross-sectional view of the wireless communication improving sheet body 1 taken along a cutting plane line AA shown in FIG. The wireless communication improving sheet body 1 shown in FIG. 1 does not show “holes” or “notches” 19 described later, and the notches 19 are not shown in other sectional views shown later.

  The wireless tag includes an integrated circuit that stores identification information and an antenna element for transmitting and receiving the identification information by wireless communication. Hereinafter, the wireless tag is referred to as a “wireless IC tag”, and the integrated circuit is referred to as an “IC chip”. Wireless IC tags are affixed to various articles and used for logistics management and the like. Identification information is information for identifying a product. The wireless IC tag performs communication using radio waves having a predetermined frequency. The wireless communication improving sheet body 1 is interposed between the wireless IC tag and the article to improve the communication characteristics of the wireless IC tag. In the present embodiment, the wireless IC tag performs wireless communication using radio waves having a frequency in the UHF (Ultra High Frequency) band.

  By arranging the wireless IC tag, the wireless communication improving sheet body 1 functions as an auxiliary antenna by resonating with a radio wave having the same frequency as the radio wave used for communication of the wireless IC tag. The wireless communication improving sheet body 1 can be attached to an article and is formed by laminating a plurality of sheet-like layers. The wireless communication improving sheet body 1 includes an auxiliary antenna layer 11, a dielectric layer 12, and a shielding layer 13 as the plurality of layers.

  The auxiliary antenna layer 11 has at least one conductive conductor layer 17. The dielectric layer 12 is composed of at least one layer and has an insulating property. The shielding layer 13 is disposed to face the auxiliary antenna layer 11 with at least one dielectric layer 12 interposed therebetween. The shielding layer 13 is disposed closer to the article than the auxiliary antenna layer 11. The plurality of layers 11, 12, and 13 are prevented from being completely separated from each other. At least a part of the plurality of layers 11, 12, and 13 is formed with a region slidable with respect to another layer adjacent in the thickness direction.

  The wireless communication improving sheet body 1 is formed in a plate shape. The wireless communication improvement sheet body 1 has a rectangular surface perpendicular to the thickness direction. The thickness direction of the wireless communication improving sheet body 1 is referred to as “thickness direction” Z. Of the thickness direction Z, a direction from the shielding layer 13 toward the auxiliary antenna layer 11 is referred to as “thickness direction one” Z1, and a direction from the auxiliary antenna layer 11 toward the shielding layer 13 is referred to as “thickness direction other” Z2. The long side direction of the wireless communication improving sheet body 1 is referred to as “long side direction” X, and the short side direction is referred to as “short side direction” Y.

  The wireless communication improving sheet body 1 further includes holding means 16 that prevents the plurality of layers 11, 12, 13 from being separated from each other. The holding means 16 includes a coating film 15 that surrounds part or all of the plurality of layers 11, 12, and 13. The holding unit 16 includes a joint portion that joins at least two of the plurality of layers 11, 12, and 13 adjacent to each other. The bonding portion is a bonding layer 14 that bonds at least two of the plurality of layers 11, 12, and 13 adjacent to each other.

  At least a part of the joint is formed such that the area of one surface perpendicular to the thickness direction is smaller than the area of any surface perpendicular to the thickness direction Z of the plurality of layers 11, 12, 13. A slidable region is formed in the other region. The bonding layer 14 is made of a material having adhesiveness or tackiness. The bonding layer 14 is formed such that the area of one surface perpendicular to the thickness direction Z is smaller than the area of any surface perpendicular to the thickness direction Z of the plurality of layers 11, 12, 13. The wireless IC tag is arranged on the side opposite to the article with respect to the auxiliary antenna layer 11.

  The dielectric layer 12 is disposed in parallel to the auxiliary antenna layer 11 on the article side of the auxiliary antenna layer 11. The dielectric layer 12 is made of an insulating material. The shielding layer 13 is disposed on the opposite side of the dielectric layer 12 from the auxiliary antenna layer 11 and parallel to the auxiliary antenna layer 11 and the dielectric layer 12. The shielding layer 13 is made of a conductive material and performs electromagnetic shielding.

  The bonding layer 14 is an adhesive layer formed of, for example, an adhesive, or an adhesive layer formed of an adhesive. The bonding layer 14 bonds at least two adjacent layers among the plurality of layers 11, 12, and 13 including the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 to each other. Further, the bonding layer 14 bonds the shielding layer 13 and the coating film 15 to each other. The bonding layer 14 is formed such that the area of one surface perpendicular to the thickness direction Z is smaller than the area of any surface of the auxiliary antenna layer 11, the dielectric layer 12 and the shielding layer 13 perpendicular to the thickness direction Z. In the present embodiment, the coating film 15 surrounds and holds the auxiliary antenna layer 11, the dielectric layer 12, the shielding layer 13, and the bonding layer 14 together.

  The auxiliary antenna layer 11 includes a conductor layer 17 and an insulator layer 18. The conductor layer 17 is formed on the other thickness direction Z2 of the auxiliary antenna layer 11, and the insulator layer 18 is formed on the other thickness direction Z1 of the auxiliary antenna layer 11. The conductor layer 17 is formed of a conductor such as metal and is formed in a plate shape. The conductor layer 17 has a rectangular surface perpendicular to the thickness direction Z.

  The insulator layer 18 is formed in a rectangle whose surface is perpendicular to the thickness direction Z and has the same dimensions as the auxiliary antenna layer 11. A wireless IC tag is disposed on the surface of the insulator layer 18 facing one side Z1 in the thickness direction. The insulator layer 18 is formed of an insulating material and insulates between the wireless IC tag and the auxiliary antenna layer 11. The conductor layer 17 and the insulator layer 18 are joined by either an adhesive or a pressure-sensitive adhesive. The wireless IC tag is disposed through the coating film 15 at a position substantially in the center of the surface facing the one Z1 in the thickness direction of the auxiliary antenna layer 11.

  The auxiliary antenna layer 11 has at least one hole or notch in the conductor layer 17. The auxiliary antenna layer 11 has a hole or notch 19 formed in the center. The hole or notch 19 is formed in a rectangular shape. The longitudinal direction of the hole or notch 19 and the short side direction Y of the wireless communication improving sheet body 1 coincide with each other. The hole or notch 19 is formed from the center end of one of the long sides of the auxiliary antenna layer 11 toward the center of the other long side. The hole or notch 19 is an IC chip and an antenna element as viewed in the thickness direction Z of the wireless communication improvement sheet body 1 in a state where the wireless IC tag 22 is disposed on the wireless communication improvement sheet body 1 in the auxiliary antenna layer 11. Is formed at a position where the is disposed.

  The thickness dimension in the thickness direction Z of the wireless communication improving sheet body 1 is, for example, 1 to 10 millimeters (millimeters: abbreviation “mm”). The auxiliary antenna layer 11 has the long side direction X and the short side direction Y having the same or smaller dimensions as the long side direction X and the short side direction Y of the wireless communication improving sheet body 1. For example, the dimensions of the auxiliary antenna layer 11 are 40 to 200 mm in the long side direction X and 10 to 100 mm in the short side direction Y. The thickness dimension in the thickness direction Z of the notch 19 is the same as the thickness dimension of the auxiliary antenna layer 11 and is, for example, 01 to 2 mm. The dimension of the long side of the notch 19 is formed to be 30 to 95% of the dimension in the short side direction Y of the wireless communication improving sheet body 1 and is, for example, 10 to 80 mm. The dimension in the longitudinal direction of the notch 19 is, for example, 2 to 80 mm, although it varies depending on the wireless IC tag to be arranged.

  In another embodiment, instead of forming the notch 19 in the auxiliary antenna layer 11, holes may be formed in the auxiliary antenna layer 11. The hole or notch 19 is not limited to the hole or notch 19, as long as there is a portion where no conductor portion exists inside the conductor plate of the auxiliary antenna layer 11. Further, the shape of the hole or notch 19 is not limited, and may be any shape as long as at least the IC chip and the wireless communication improving sheet body 1 can be electromagnetically coupled. The hole or notch 19 may be, for example, a polygonal shape, a curved shape, a straight or curved shape, an indefinite shape, or the like.

  The hole or notch 19 may be a gap portion or mesh portion of a plurality of auxiliary antennas, a stamped portion of characters or symbols, and the like, depending on the size of the hole or notch 19 and the positional relationship with the wireless IC tag. The coupling strength with the microstrip antenna composed of the layer 11, the dielectric layer 12 and the shielding layer 13 can be adjusted, and the positional relationship between the shape and size of the hole or notch 19 itself and the IC tag is also an electrical characteristic. It contributes to. Therefore, by properly adjusting these dimensions, it is possible to control the impedance at the position where the IC chip and the antenna element are arranged when the wireless IC tag and the wireless communication improving sheet body 1 are combined, and the communication characteristics of the antenna. Can be improved.

  The dielectric layer 12 is disposed in parallel with the auxiliary antenna layer 11 on the article side with respect to the auxiliary antenna layer 11. The dielectric layer 12 is formed of an insulating material and insulates between the auxiliary antenna layer 11 and the shielding layer 13. The dielectric layer 12 has a plane perpendicular to the thickness direction Z and has a rectangular shape with the same dimensions as the auxiliary antenna layer 11.

  The shielding layer 13 is formed of a conductor such as metal. The shielding layer 13 is formed in a rectangular shape having a surface perpendicular to the thickness direction Z and having the same dimensions as the auxiliary antenna layer 11 and the dielectric layer 12. The shielding layer 13 functions as a ground and blocks electromagnetic influences from the communication blocking member to the wireless IC tag and the wireless communication improving sheet body 1.

  The bonding layer 14 is disposed between the auxiliary antenna layer 11 and the dielectric layer 12 and between the dielectric layer 12 and the shielding layer 13. The bonding layer 14 is formed of a material having a bonding force due to adhesiveness or adhesiveness. The material of the bonding layer 14 is preferably a material having flexibility.

  The bonding layer 14 is formed in a belt shape whose longitudinal direction is any direction perpendicular to the thickness direction of the plurality of layers 11, 12, and 13. The bonding layer 14 is formed in a belt shape having a longitudinal direction in any direction perpendicular to the thickness direction Z of each of the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13. The bonding layer 14 is formed in a long shape in a predetermined direction parallel to the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13. The longitudinal direction of the bonding layer 14 is set perpendicular to a predetermined direction. The band-shaped bonding layer 14 is formed at substantially the center of each layer, and is formed long in the short side direction Y of the wireless communication improvement sheet body 1.

  The bonding layer 14 is provided at one location between two adjacent layers among the plurality of layers 11, 12, and 13. The bonding layer 14 is provided at one position between two adjacent layers among the plurality of layers 11, 12, and 13 including the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13. The bonding layer 14 is provided at one place between the auxiliary antenna layer 11 and the dielectric layer 12, and is provided at one place between the dielectric layer 12 and the shielding layer 13.

  The covering film 15 is formed of a resin such as polyvinyl chloride. The material of the coating film 15 preferably has flexibility and stretchability. Furthermore, the material of the coating film 15 is preferably a material that prevents deterioration of the communication characteristics of the wireless IC tag, such as a high dielectric constant material. The covering film 15 surrounds the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 bonded together by the bonding layer 14 from all directions. The covering film 15 is slidably formed on any surface of the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 without being bonded or adhered.

  For example, the covering film 15 sandwiches a plurality of layers with two resin sheets having a larger area than any of the plurality of layers 11, 12, and 13, and surrounds the peripheral portion protruding from the plurality of layers 11, 12, and 13. It is formed by high-frequency welder processing in which a high-frequency current is passed between the molds by causing a high-frequency current to flow between the molds to generate heat and weld the resin sheet interface as the coating film 15.

  The dimensions of the radio communication improving sheet body 1 in the long side direction X and the short side direction Y are substantially the same as the dimensions of the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13. Only slightly bigger. The thickness dimension of the wireless communication improving sheet body 1 is about 0.5 to 10 mm. In the present embodiment, the wireless communication improvement sheet body 1 has a shape that is symmetrical with respect to a virtual plane that divides the long side into two equal parts.

  The wireless IC tag is disposed via a coating film 15 on the surface facing the one Z1 in the thickness direction of the wireless communication improving sheet body 1. The wireless IC tag is fixed to the coating film 15 with either an adhesive or an adhesive. As for the wireless communication improvement sheet body 1, the surface which faces one side Z1 in the thickness direction is stuck on an article. The wireless communication improving sheet body 1 is fixed to the article with either an adhesive or a pressure-sensitive adhesive.

  The dielectric layer 12 made of an insulator operates as a microstrip antenna in combination with the auxiliary antenna layer 11 and the shielding layer 13. When a material having a large dielectric constant is used for the insulator of the dielectric layer 12, the dielectric has an effect of shortening the wavelength, and the auxiliary antenna layer 11 can be downsized. If the insulating layer 18 and the dielectric layer 12 can maintain the positional relationship between the wireless IC tag and the auxiliary antenna layer 11 and the positional relationship between the auxiliary antenna layer 11 and the shielding layer 13, the loss of electromagnetic energy is low. That is, it is preferable to use a material having a low dielectric loss tangent or magnetic tangent in the communication frequency band. The insulator layer 18 and the dielectric layer 12 use organic materials as exemplified below.

  Examples of the organic material include porous bodies such as high molecular organic materials such as rubber, thermoplastic elastomer, various plastics, wood, and paper materials. Examples of the rubber include natural rubber, isoprene rubber, butadiene rubber, styrene-butadiene rubber, ethylene-propylene rubber, ethylene-propylene-diene rubber (EPDM rubber), ethylene-vinyl acetate rubber, butyl rubber, halogenated butyl rubber, chloroprene. Synthetic rubbers such as rubber, nitrile rubber, acrylic rubber, ethylene acrylic rubber, epichlorohydrin rubber, fluoro rubber, urethane rubber, silicone rubber, chlorinated polyethylene rubber, hydrogenated nitrile rubber (HNBR), their derivatives, or These may be modified by various modification treatments. These rubbers can be used alone or in combination.

  Examples of thermoplastic elastomers include chlorinated polyethylenes such as chlorinated polyethylene, ethylene copolymers, acrylics, ethylene acrylic copolymers, urethanes, esters, silicones, styrenes, amides, olefins, etc. Various thermoplastic elastomers and their derivatives are mentioned.

  In addition, various plastics include, for example, chlorinated resins such as polyethylene, polypropylene, AS resin, ABS resin, polystyrene, polyvinyl chloride, and polyvinylidene chloride; polyvinyl acetate, ethylene-vinyl acetate copolymer, fluororesin, and silicone resin. , Thermoplastic resins such as acrylic resin, nylon, polycarbonate, polyethylene terephthalate, alkyd resin, unsaturated polyester, polysulfone, polyimide resin, urethane resin, phenol resin, urea resin, epoxy resin, etc., and their derivatives Furthermore, a copolymer, a recycled resin, etc. are mentioned.

  The insulator layer 18 and the dielectric layer 12 can be used as they are, or can be combined and modified as described above, and are preferably foamed. A typical low density dielectric material is a foamed resin such as a styrofoam resin. The dielectric material forming the insulator layer 18 and the dielectric layer 12 preferably has a density of less than 1.0 g / cm 3, for example.

  As such a low-density dielectric material, one or more materials selected from a porous organic material and a porous inorganic material are used. A material that does not foam may be used, or a material that does not foam may be combined with a foam material.

  Any means can be used as the foaming method, but the foaming method is classified into the addition of a foaming agent or the addition of thermally expandable fine particles. There are organic foaming agents and inorganic foaming agents. Examples of organic foaming agents include dinitrosopentamethylenetetramine (DPT), azodicarbonamide (ADCA), p, p′-oxybisbenzenesulfonylhydrazide (OBSH), hydrazide dicarbonamide (HDCA), and the like. It is not limited to it.

  As the inorganic foaming agent, sodium hydrogen carbonate or the like is added, but is not limited thereto, and may be appropriately selected depending on the material. As the thermally expandable fine particles, microencapsulated thermally expandable fine particle globules and the like are added.

  The expansion ratio is not particularly limited, but it is necessary to have a form in which the thickness change of the absorber is small, the strength is maintained, and the weight can be reduced. From these, the expansion ratio is preferably about 2 to 30 times. The foam structure is not particularly limited, but a configuration that is strong in the compression direction, for example, a foam form that is flatly foamed in the thickness direction Z is preferable.

  Since the insulator layer 18 and the dielectric layer 12 need to change the received radio wave energy to transmission energy without loss, it is necessary to select a material with less energy loss due to the material. For this purpose, the dielectric loss tangent is preferably 0.2 or less, more preferably 0.05 or less, at the frequency of the electromagnetic wave used by the wireless IC tag for wireless communication.

  The dielectric forming the insulator layer 18 and the dielectric layer 12 may be a low density and low dielectric loss tangent, but more importantly, it exhibits a low dielectric loss tangent in a communication frequency band such as the UHF band. is there.

  The auxiliary antenna layer 11 and the shielding layer 13 are made of a conductive material having conductivity. The conductive material may be a metal such as aluminum, copper, gold, platinum, silver, nickel, chromium, zinc, lead, tungsten, iron, etc., and a resin in which the above metal powder or conductive carbon black is mixed. It may be a mixture or a film of conductive resin. The metal or the like may be processed into a foil shape, a plate shape, a sheet shape, a film shape, or the like. Alternatively, a thin metal layer having a film thickness of, for example, 600 angstrom (abbreviation “Å”) may be formed on a synthetic resin film. What transferred metal foil to base materials, such as a film or cloth, may be used.

  The bonding layer 14 is mainly made of an organic adhesive, for example, an acrylic pressure-sensitive adhesive tape. Examples of organic adhesives include thermoplastic resins, thermosetting resins, and elastomers. Examples of thermoplastic resins include vinyl acetate, polyvinyl alcohol, polyvinyl acetal, ethylene / vinyl acetate, and chloride. Vinyl-based, acrylic-based, polyamide-based, cellulose-based, α-olefin-based, etc. Thermosetting resin-based urea resin-based, melamine-based resin, phenolic-resin-based resin, resorcinol-resin-based resin, epoxy resin-based material There are acrylic, polyester, polyurethane, polyaromatic, etc .. Elastomers are chlorobrene rubber, nitrile rubber, styrene butadiene rubber, polysalcide, butyl rubber, silicone rubber, acrylic rubber , Modified silicone rubber type, urethane rubber type and the like.

  The covering film 15 is made of the same material as that of the dielectric layer 12. Examples of the material of the coating film 15 include porous materials such as high molecular organic materials such as rubber, thermoplastic elastomer, various plastics, wood, and paper. In the present embodiment, the coating film 15 is made of a vinyl chloride resin.

  In general, a wireless IC tag is composed of an IC chip that records data such as an identification number and an antenna element for transmitting and receiving radio waves. Wireless IC tags are widely known as products that play a part in RFID technology, and are also applied to fields such as logistics management. The wireless IC tag is an inexpensive information storage medium and has a variety of uses such as physical distribution management. Therefore, the wireless IC tag is placed in various usage environments.

  The wireless IC tag has a great advantage that it can be realized thinly and lightly. In order to make full use of such advantages, it is preferable that the tag attachment position is not limited, and the tag can be communicated wherever and how it is attached. However, when the wireless IC tag is disposed in the vicinity of the communication disturbing member, there is a problem that communication characteristics deteriorate and a communicable distance is shortened. Examples of the communication hindering member that hinders communication of the wireless IC tag include a conductive member such as metal, a dielectric such as glass, and a magnetic member. Examples of the dielectric member of the communication disturbing member include paper and liquid other than glass.

  The wireless communication improving sheet body 1 is configured such that when the wireless IC tag is disposed, the auxiliary antenna layer 11 resonates with radio waves having a frequency at which the wireless IC tag performs wireless communication. The auxiliary antenna layer 11 is formed to have a resonance dimension in which at least one side length falls within a range of λ / 8 to 3λ / 4, where λ is a wavelength of a radio wave with which the wireless IC tag communicates.

  Here, “arrangement” when the wireless IC tag referred to in the present invention is disposed on the wireless communication improvement sheet body 1 is an electrical contact between the antenna element of the wireless IC tag and the wireless communication improvement sheet body 1 by connection or the like. Without making it, it means that the antenna element of the wireless IC tag and the wireless communication improving sheet body 1 are in a state where they can be electromagnetically coupled to each other via the electromagnetic field around the conductor.

  The conductor layer 17, the dielectric layer 12, and the shielding layer 13 of the auxiliary antenna layer 11 in a state where the wireless IC tag is disposed on the wireless communication improvement sheet body 1, that is, in a state where the wireless IC tag and the wireless communication improvement sheet body 1 are combined. A microstrip antenna that resonates at a frequency of a radio wave used for communication by a wireless IC tag is configured, and functions as an auxiliary antenna that assists communication of the wireless IC tag. In the microstrip antenna, the dielectric layer 12 between the auxiliary antenna layer 11 and the shielding layer 13 resonates, and the electromagnetic field in the dielectric layer 12 is strengthened at the resonance frequency. The shielding layer 13 electromagnetically shields the communication disturbing member and the wireless communication improving sheet body 1 when the wireless IC tag is affixed to the communication disturbing member via the wireless communication improving sheet body 1 so as to interfere with communication. The influence given to the wireless communication improving sheet body 1 from the member is reduced.

  The antenna element of the wireless IC tag and the auxiliary antenna perform electromagnetic coupling through a hole or notch 19 at a position where the IC chip or the antenna element of the wireless IC tag faces each other. Moreover, the impedance of the antenna seen from the position of the IC chip when the wireless IC tag and the wireless communication improving sheet body 1 are combined can be adjusted by this hole or notch 19, and can be conjugate-matched with the impedance of the IC chip. The power transfer between the chip and the antenna can be made efficient. Therefore, the wireless IC tag can perform wireless communication by the auxiliary antenna layer 11. Thereby, the wireless communication improving sheet body 1 can improve the communication characteristics of the wireless IC tag and extend the communicable distance.

(Comparative example)
FIG. 3 is a cross-sectional view of the wireless communication improving sheet body 1 of the comparative example. The wireless communication improving sheet body 1 shown in FIG. 3 has a configuration in which the bonding layer 14 and the coating film 15 are different from the wireless communication improving sheet body 1 shown in FIGS.

  In the wireless communication improving sheet body 1, the bonding layer 14 is formed between the auxiliary antenna layer 11 and the dielectric layer 12 and between the dielectric layer 12 and the shielding layer 13. In the wireless communication improving sheet body 1, the entire surfaces perpendicular to the thickness direction Z of the layers 11, 12, and 13 are bonded to each other by the bonding layer 14. The wireless communication improvement sheet body 1 does not have the coating film 15, and the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 are exposed as the outer surface of the wireless communication improvement sheet body 1.

  FIG. 4 is a cross-sectional view of the wireless communication improving sheet body 1 and the wireless IC tag 22 of the comparative example. The wireless IC tag 22 has a rectangular surface perpendicular to the thickness direction Z. The wireless IC tag 22 is disposed on the surface facing the one Z1 in the thickness direction of the wireless communication improving sheet body 1. The entire surface of the wireless IC tag 22 perpendicular to the thickness direction Z is bonded to the wireless communication improving sheet body 1 by the bonding layer 14. The longitudinal direction of the wireless IC tag 22 coincides with the long side direction X of the wireless communication improving sheet body 1.

  FIG. 5 is a cross-sectional view of the comparative wireless communication improving sheet body 1 in a bent state. The wireless communication improving sheet body 1 shown in FIG. 5 shows a state in which a bending moment whose curvature radius is determined in the thickness direction Z of each layer is applied.

  Since the auxiliary antenna layer 11 and the shielding layer 13 are formed together with a base material having a high longitudinal elastic modulus such as polyethylene-terephthalate (hereinafter referred to as “PET”), the auxiliary antenna layer 11 and the shielding layer 13 are formed of a material such as rubber or thermoplastic elastomer. The rigidity is higher than that of the dielectric layer 12 to be formed. The wireless communication improving sheet body 1 is given the largest tensile stress in the auxiliary antenna layer 11 located on the outermost side of the radius of curvature, and gives the largest compressive stress in the auxiliary antenna layer 11 located on the innermost side of the radius of curvature. It is done. In FIG. 5, the tensile stress is indicated by an arrow 31 and the compressive stress is indicated by an arrow 32. The alternate long and short dash line indicates a neutral surface 34 to which no tensile stress or compressive stress is applied.

  Since each layer of the wireless communication improving sheet body 1 is bonded on the entire surface, the thickness dimensions of the entire wireless communication improving sheet body 1 are the thicknesses of the auxiliary antenna layer 11, the dielectric layer 12, the shielding layer 13, and the bonding layer 14. It is the sum of dimensions. Further, the auxiliary antenna layer 11 and the shielding layer 13 having a high longitudinal elastic modulus are located at a position away from the neutral surface 34. Accordingly, the wireless communication improving sheet body 1 has a problem that it is difficult to stick to the curved surface because the bending rigidity is increased and the flexibility is insufficient.

  Further, when the thickness dimension of the wireless communication improving sheet body 1 is increased, the communication characteristics of the wireless IC tag 22 can be improved. Further, when a material having a high dielectric constant is used for the dielectric layer 12, the wireless communication improving sheet body 1 can be reduced in size, but many materials having a high dielectric constant have high rigidity. All have the problem that the bending rigidity of the wireless communication improvement sheet | seat body 1 becomes large.

  FIG. 6 is a cross-sectional view of the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 according to the first embodiment of the present invention. FIG. 7 is a cross-sectional view showing a state where the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 according to the first embodiment of the present invention are bent. The auxiliary antenna layer 11, the dielectric layer 12 and the shielding layer 13 shown in FIGS. 6 and 7 are obtained by removing the coating film 15 from the wireless communication improving sheet body 1 shown in FIG. 1 in order to explain the bending rigidity. Yes.

  The auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 shown in FIG. 6 show a state where no bending moment is applied. Therefore, the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 have a planar surface perpendicular to the thickness direction Z.

  The auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 shown in FIG. 7 show a state in which a bending moment whose radius of curvature is determined in the thickness direction Z of each layer is applied. Each of the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 is given a bending moment with the center of the virtual circle having the radius of curvature as the axis. The bending rigidity of the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 can be calculated as follows, assuming that the bending rigidity of the both-end support beam, which is a “beam” supported at both ends, is approximated.

  The auxiliary antenna layer 11 is given the largest tensile stress on the surface outside the radius of curvature among the surfaces perpendicular to the thickness direction Z, that is, the surface facing the thickness direction one Z1. The auxiliary antenna layer 11 is given the greatest compressive stress on the surface inside the radius of curvature among the surfaces perpendicular to the thickness direction Z, that is, the surface facing the other Z2 in the thickness direction. In FIG. 7, the tensile stress is indicated by an arrow 31 and the compressive stress is indicated by an arrow 32. The auxiliary antenna layer 11 has a neutral surface 34 that is a surface to which neither tensile stress nor compressive stress is applied in a region where the bonding layer 14 is not formed. Of the layers of the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13, a region that is not joined by the joining layer 14 is hereinafter referred to as a “slidable region”.

  Similar to the auxiliary antenna layer 11, the dielectric layer 12 is given a tensile pressure and a compressive stress, and a neutral surface 34 is formed in the slidable region. The shielding layer 13 is applied with a tensile pressure and a compressive stress, and a neutral surface 34 is formed in the slidable region. In FIG. 7, the neutral surface 34 formed in the slidable region of each layer of the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 simultaneously indicates the neutral axis 35 of each layer. Each neutral axis 35 represents a virtual circular arc whose radius is the radius of curvature. The tensile stress applied to each surface perpendicular to the thickness direction Z of the dielectric layer 12 and the shielding layer 13 is indicated by an arrow 31, and the compressive stress is indicated by an arrow 32.

  The auxiliary antenna layer 11, the dielectric layer 12, the shielding layer 13 and the bonding layer 14 are integrated in a region where the auxiliary antenna layer 11, the dielectric layer 12 and the shielding layer 13 are bonded to each other by the bonding layer 14. A neutral surface 34 and a neutral shaft 35 are formed in the whole.

  The bending stiffness is expressed by Equation (1) where “D” is the bending stiffness, “E” is the Young's modulus, and “I” is the second moment of section.

  Further, the secondary moment I of the cross section with respect to the neutral axis of the bending of the auxiliary antenna layer 11, the dielectric layer 12 and the shielding layer 13 having a rectangular cross section is the YZ direction orthogonal to the X axis which is the axial direction of the beam. For the cross-section “A”, a value obtained by integrating the product of the square of the distance “z” from the neutral axis on the cross-section and the area “dA” from the neutral axis over the entire cross-section is expressed by Expression (2). .

  When the cross section of each layer of the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 is formed in a rectangular shape and the neutral axis is located at the center of the rectangular shape, the sectional second moment I is equal to the thickness direction Z, that is, the radius of curvature. The dimension of the cross section in the direction is “h”, and the dimension of the cross section in the short side direction Y is “b”, which is expressed by equations (3) and (4).

  From Equations (1) to (4), the secondary moment of section increases in proportion to the cube of the thickness dimension of the cross section of each layer, and the bending rigidity also increases in proportion to the cube of the thickness dimension of the cross section of each layer. . Since each of the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 has a rectangular cross section, the second moment of the cross section of each layer can be obtained using Equation (2).

  When the bending moment whose radius of curvature is determined in the thickness direction Z of each layer is applied, the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 bend while sliding with respect to each other in a region where the layers are not bonded. It is possible. Therefore, each layer can calculate the second moment of section according to the thickness dimension of each layer for each layer. The cross-sectional secondary moment of the entire wireless communication improving sheet body 1 in the region where the adhesive layer is not arranged is the sum of the cross-sectional secondary moments of the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13.

  In the wireless communication improving sheet body 1, each of the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 is bonded and bonded to each other, and the entire surface of each layer is bonded and the layers are integrated. As compared with the configuration formed in the above, the value of the moment of inertia of the cross section is small, and the bending rigidity is small.

  A microstrip antenna operable on a metal surface is constituted by the auxiliary antenna layer, the dielectric layer, and the shielding layer of the wireless communication improving sheet body 1. In many cases, the antenna of a wireless IC tag is an antenna based on a dipole antenna, and the dipole antenna is easily affected by an article to be attached. Therefore, if the antenna is attached to an article having a high conductivity or dielectric constant, the radiation characteristics are deteriorated. On the other hand, the microstrip antenna of the wireless communication improvement sheet is characterized by being hardly affected by the article to be attached. The microstrip antenna of the wireless communication improvement sheet body is adjusted so as to resonate with the radio wave of the communication frequency of the wireless IC tag when the wireless IC tag is arranged. Respectively resonate at the communication frequency of the wireless IC tag. When the wireless IC tag is arranged on the wireless communication improving sheet body, the antenna of the wireless IC tag and the microstrip antenna of the wireless communication improving sheet are electromagnetically coupled, and transmission / reception of radio waves from the wireless IC tag is performed by the wireless communication improving sheet. This is done via a microstrip antenna. Therefore, the wireless communication improving sheet body of the present invention is hardly affected by the article to be attached, and functions as an auxiliary antenna for the wireless IC tag. By using the present invention, communication when a wireless IC tag is attached to an article having high conductivity or dielectric constant can be improved.

  Thus, the wireless communication improvement sheet body 1 is prevented from separating the plurality of layers 11, 12, and 13 from each other. Further, at least some of the plurality of layers 11, 12, and 13 can slide relative to other layers adjacent to the thickness direction Z on a part of each surface perpendicular to the thickness direction Z. Areas are formed.

  In a state where the wireless communication improving sheet body 1 is attached to the surface of an article having a curved surface, the wireless communication improving sheet body 1 is deformed into a shape along the curved surface of the article. At this time, one side of the wireless communication improving sheet body 1 is compressed and the other side is expanded. If the wireless communication improving sheet body 1 is elastically deformed, an elastic restoring force is generated in the wireless communication improving sheet body 1, and the elastic restoring force increases as the bending rigidity of the wireless communication improving sheet body 1 increases. When the elastic restoring force is increased, it is difficult to bend the wireless communication improving sheet body 1 and it is difficult to apply the curved sheet to the curved article surface. Even if it can be pasted on the article surface, a long-term elastic restoring force is generated in the wireless communication improvement sheet body 1, and the wireless communication improvement sheet body 1 may be peeled off from the attached article. In particular, when the wireless communication improving sheet body 1 and an article are attached with an adhesive, a creep phenomenon may occur due to generation of a long-term elastic restoring force, and the adhesive itself may be separated.

  On the other hand, in the wireless communication improving sheet body 1 in which a slidable region is formed in a part of the plurality of layers 11, 12, and 13, since the strain is released in the slidable region, wireless The distortion generated when the communication improving sheet is bent can be reduced. Therefore, the elastic restoring force produced when the radio | wireless communication improvement sheet | seat body 1 is bent can be made as small as possible. Further, since the plurality of layers 11, 12, and 13 are prevented from being separated from each other, it is possible to prevent the layers of the wireless communication improving sheet body 1 from being separated from each other in the slidable region.

  Moreover, the bending moment is provided to the wireless communication improvement sheet | seat body 1 of the bent state. When the bending moment is large, the elastic restoring force generated when the wireless communication improving sheet body 1 is bent increases, and the bending moment becomes larger when the bending rigidity of the wireless communication improving sheet body 1 is large or when the curvature radius is small. . In the wireless communication improving sheet body in a bent state, a strain due to a compressive force is generated inside the bend, and a strain due to a tensile force is generated outside. In the wireless communication improving sheet body in a bent state, a compressive stress is applied to the inside of the bend and a tensile stress is applied to the outside, and a neutral axis between which the compressive stress and the tensile stress are not applied exists. .

  In the wireless communication improving sheet body 1 targeted by the present invention, one or more dielectric layers 12 made of an insulator are positioned between the auxiliary antenna layer 11 including a layer made of a conductive material and the shielding layer 13. Configuration is included. The antenna portion of the wireless IC tag 22, the auxiliary antenna layer 11 and the shielding layer 13 of the wireless communication improving sheet body 1 are made of a conductive material, and the antenna pattern wiring is deformed or disconnected due to an excessive load, and the chip joint is destroyed. In order to prevent this, these conductor layers 17 are usually disposed together with a base material having a large longitudinal elastic modulus. If the entire surface of the conductor layer 17 such as the auxiliary antenna layer 11 and the shielding layer 13 is bonded to the thick dielectric layer 12, a neutral axis of bending stress is formed in the dielectric layer 12, so that the conductor The cross section of the layer 17 is located at a location away from the neutral axis, the cross sectional secondary moment and the bending rigidity of the conductor layer 17 are increased, and the bending rigidity of the entire wireless communication improving sheet body 1 is also increased. When the conductor layer 17 is attached to only one side of the dielectric layer 12, a neutral axis of bending stress is formed in the dielectric layer 12 at a position close to the conductor layer 17, but when it is attached to both sides, the bending stress is Since the neutral axis is located near the center of the dielectric, the sectional moment of inertia and the bending rigidity of the conductor layer 17 are further increased.

  On the other hand, in the wireless communication improvement sheet body 1, since the slidable areas where the layers 11, 12 and 13 are slidable with respect to the other layers are formed, the wireless communication improvement sheet body 1. When the layers are bent, the layers slide on each other in the slidable region, so that each layer bends independently, and a central axis of bending is created inside the cross section of each layer. Compared to the case where the center axis of bending is located outside the cross section, the moment of inertia of the section is reduced when the center axis of bending is located inside the cross section. The bending rigidity of the conductor layer 17 portion can be reduced by reducing the second moment of section of the conductor layer 17 arranged together with the base material having a large longitudinal elastic modulus. Therefore, it is possible to reduce the bending rigidity of the wireless communication improvement sheet body 1 when a bending moment whose curvature radius is determined in the thickness direction Z of each layer is applied to the wireless communication improvement sheet body 1.

  Further, when a bending moment is applied to the wireless communication improving sheet body 1, the layers 11, 12, and 13 are bent while sliding on each other in the slidable region. Thereby, compared with the case where each layer cannot slide mutually, it becomes easy to deform | transform the radio | wireless communication improvement sheet | seat body 1. FIG. The maximum values of the tensile stress and the compressive stress applied to each layer when the wireless communication improving sheet body 1 is attached so as to follow the curved surface can be reduced. Therefore, damage to the wireless communication improvement sheet body 1 can be prevented and the bending rigidity is small, so that the wireless communication improvement sheet body 1 can be easily attached to the curved surface portion of the article.

  Since the wireless communication improving sheet body 1 on which the wireless IC tag is arranged has a low bending rigidity, the wireless communication improving sheet body 1 is easy to bend, easily follows the surface of a curved article, and does not easily peel off after being applied. It can be easily attached to the curved surface portion of the article. Therefore, the wireless communication improving sheet body 1 on which the wireless IC tag is arranged can be attached to a surface of various shapes to manage various articles, and the application of the wireless IC tag can be expanded. .

  Further, the strain that occurs when the temperature changes due to the difference in the thermal expansion coefficients of the plurality of layers can also be reduced by the slidable region. The plurality of layers are made of a resin material and a metal material. Generally, the resin material has a larger linear expansion coefficient than the metal material. For example, when the sheet temperature is raised, the metal material is stretched by the resin material having a large linear expansion coefficient, and when the sheet temperature is lowered, the sheet is compressed. If the temperature change is repeated, warpage, wrinkles, cracks and the like may occur in the sheet. In the present invention, there is a slidable region between different layers of material, and strain due to heat can be reduced. Therefore, a metal-compatible sheet that is resistant to temperature changes can be provided.

  According to the invention, the wireless communication improving sheet body 1 further includes holding means 16 for preventing the plurality of layers 11, 12, 13 from being separated from each other. Therefore, the holding means 16 prevents the layers 11, 12, and 13 from separating when the wireless communication improvement sheet body 1 is attached to the curved surface portion of the article, so that the wireless communication improvement sheet body 1 can be easily handled. Can be.

  Further, the holding means 16 can prevent the bending rigidity of each layer from increasing by securing the slidable area of each layer while preventing the layers 11, 12, and 13 from separating. Thereby, since the bending rigidity does not become large, the wireless communication improving sheet body 1 can be easily attached to the curved surface portion of the article.

  According to the invention, the holding means 16 includes the coating film 15 that surrounds a part or all of the plurality of layers 11, 12, 13, and 14. Therefore, the coating film 15 can surround and hold the plurality of layers 11, 12, 13, 14 integrally. Thereby, since the dimensional change in the thickness direction Z when the wireless communication improvement sheet body 1 is bent is small, the performance change of the auxiliary antenna when the wireless communication improvement sheet body 1 is bent is small. Therefore, according to this invention, the radio | wireless communication improvement sheet | seat body 1 which can be used without choosing the material and place of the articles | goods to paste can be provided.

  Further, since the coating film 15 surrounds and holds the layers 11, 12, 13, and 14 to prevent separation from each other, the layers of the wireless communication improving sheet body 1 are separated from each other in the slidable region. Can be prevented. In addition, the wireless communication improving sheet body 1 can protect the layers 11, 12, 13, and 14 by the coating film 15, and can improve durability, weather resistance, impact resistance, and the like of each layer.

  According to the invention, the holding means 16 includes the bonding layer 14 that bonds at least two of the plurality of layers 11, 12, and 13 adjacent to each other. The bonding layer 14 is formed such that the area of one surface perpendicular to the thickness direction Z is smaller than the area of any surface perpendicular to the thickness direction Z of the plurality of layers 11, 12, 13.

  Therefore, in this wireless communication improvement sheet body 1, the area | region where the interlayer adjacent to the thickness direction Z is not joined can be formed. Thereby, the area which restrains each layer 11,12,13 decreases, and the deformation | transformation freedom degree of each layer increases. When the wireless communication improvement sheet body 1 is bent, each layer bends independently, so that the bending rigidity of the wireless communication improvement sheet body can be reduced as compared with the case where the entire surfaces of the layers are joined.

  The bonding layer 14 is formed in a belt shape having a longitudinal direction in any direction perpendicular to the thickness direction Z of the plurality of layers 11, 12, and 13. Therefore, the area of the region where the bonding layer 14 is disposed can be increased as compared with the case where the bonding layer 14 is formed as a point as small as possible. When a bending moment is applied in which the neutral axis is set in a plane perpendicular to the longitudinal direction of the bonding layer 14, each layer can be allowed to slide relative to each other in a region where the bonding layer 14 is not disposed. Accordingly, the wireless communication improving sheet body 1 can be allowed to be easily bent around the axis extending in the longitudinal direction of the bonding layer 14.

  The bonding layer 14 is provided at one location between two adjacent layers among the plurality of layers 11, 12, and 13. Therefore, it is possible to facilitate the sliding of the two adjacent layers in the remaining region excluding the region bonded by the bonding layer 14.

  The auxiliary antenna layer 11 has at least one hole or notch 19 in the conductor layer 17. Therefore, the wireless communication improving sheet body 1 can be electromagnetically coupled to the wireless IC tag through the holes or notches 19 of the conductor layer 17. Further, by adjusting the dimension of the hole or notch in the conductor layer and the positional relationship with the wireless IC tag, the electromagnetic coupling strength can be adjusted, and the antenna impedance of the wireless IC tag and the wireless communication improving sheet body can be controlled. Is possible. Thereby, the wireless communication improving sheet body 1 can function as an auxiliary antenna of a more efficient wireless IC tag.

  The wireless IC tag is arranged on the side opposite to the article with respect to the auxiliary antenna layer 11. Therefore, when the wireless IC tag is disposed, the wireless communication improving sheet body 1 can shield the electromagnetic influence from the article to the wireless IC tag by the shielding layer 13, and can function as an auxiliary antenna of the wireless IC tag. . Further, the wireless IC tag can be easily arranged on the wireless communication improving sheet body 1.

  According to the invention, the holding means 16 includes a joint that joins at least two of the plurality of layers 11, 12, and 13 adjacent to each other. Accordingly, the plurality of adjacent two layers are bonded to each other, and the wireless communication improving sheet body 1 can be prevented from being separated from each other.

  According to the invention, the bonding portion is a bonding layer 14 that bonds at least two of the plurality of layers 11, 12, and 13 adjacent to each other. Therefore, even if the two adjacent layers are materials that cannot be directly bonded together, they can be bonded via the bonding layer 14, and the wireless communication improving sheet body 1 is prevented from being separated from each other. Can do.

  According to the invention, the bonding layer 14 is made of a material having adhesiveness or tackiness. Therefore, the plurality of adjacent two layers can be bonded via the adhesive or tacky material, and the wireless communication improving sheet body 1 can be prevented from being separated from each other.

(Second Embodiment)
FIG. 8 is a cross-sectional view of the wireless IC tag 6 with a wireless communication improving sheet body according to the second embodiment of the present invention. The wireless IC tag 6 with a wireless communication improvement sheet body includes the wireless IC tag 22 and the wireless communication improvement sheet body 1. The wireless IC tag 22 is disposed on the surface facing the one Z1 in the thickness direction of the auxiliary antenna layer 11. The covering film 15 surrounds and holds the wireless IC tag 22, the auxiliary antenna layer 11, the dielectric layer 12, the shielding layer 13, and the bonding layer 14 together.

  The wireless IC tag 22 includes an IC chip 23 and an antenna element 24. Each bonding layer 14 includes an IC chip 23 as viewed in the thickness direction Z of each layer when the wireless IC tag 22 is disposed between two adjacent layers among the plurality of layers 11, 12, and 13. It is formed at the same position as the position where it is arranged.

  The IC chip 23 records data such as an identification number. The antenna element 24 is electrically connected to the IC chip 23, receives a radio wave from the reader, and transmits a radio wave to the reader. The IC chip 23 transmits / receives data to / from the reader via the antenna element 24. The reader emits radio waves in a predetermined frequency, for example, UHF band, with the wireless IC tag 22, communicates with the wireless IC tag 22, and transmits / receives data to / from the wireless IC tag 22.

  The wireless IC tag 22 is, for example, a Short Dipole tag or a belt tag manufactured by UPM Raflatac. The dimensions of the Short Dipole tag are 92 mm × 11 mm, and the belt tag is 702 mm × 15 mm. The IC chip 23 is, for example, UCODE G2XM manufactured by NXP.

  The wireless IC tag 22 is formed in a rectangular shape when viewed in the thickness direction Z. The wireless IC tag 22 is disposed substantially at the center of the surface facing the one Z1 in the thickness direction of the insulator layer 18. The wireless IC tag 22 is fixed to the insulator layer 18 by the bonding layer 14. The wireless IC tag 22 and the coating film 15 are slidable without being bonded by a bonding agent or an adhesive. The IC chip 23 is formed in a rectangular shape. The IC chip 23 is disposed at the substantially center of the surface facing the one Z1 in the thickness direction of the wireless communication improving sheet body 1, that is, the position where the bonding layer 14 is formed when viewed in the thickness direction Z.

  The bonding layer 14 is formed in a rectangular shape when viewed in the thickness direction Z. The bonding layer 14 is formed so that the dimension of each side is larger than that of the IC chip 23 when viewed in the thickness direction Z. Further, in another embodiment, the bonding layer 14 is not limited to a rectangular shape when viewed in the thickness direction Z, and may be formed of, for example, a circle or an ellipse. The circle is set as a size in which a square that is inscribed in the circle and similar to the outer shape of the IC chip 23 is larger than the IC chip 23.

  As described above, the wireless IC tag 22 includes the IC chip 23 and the antenna element 24. Each bonding layer 14 includes an IC chip 23 as viewed in the thickness direction Z of each layer when the wireless IC tag 22 is disposed between two adjacent layers among the plurality of layers 11, 12, and 13. It is formed at the same position as the position where it is arranged. The portion where the wireless IC tag 6 with the wireless communication improving sheet body is integrally bonded by the bonding layer 14 has a high bending rigidity, whereas the portion not bonded has a low bending rigidity. Therefore, the wireless IC tag 6 with the wireless communication improvement sheet body has the lowest bending rigidity of the overall wireless IC tag 6 with the wireless communication improvement sheet body and the highest bending rigidity in the region where the IC chip 23 is disposed. . Thereby, when the wireless IC tag 6 with the wireless communication improvement sheet body is bent, the bending moment is not applied to the IC chip 23 portion. Therefore, the wireless IC tag 6 with the wireless communication improving sheet body can prevent the wireless IC tag 22 from malfunctioning.

  The wireless IC tag 6 with the wireless communication improvement sheet body includes the wireless IC tag 22 and the wireless communication improvement sheet body 1. Therefore, since the wireless communication improving sheet body 1 can prevent the layers 11, 12, and 13 from being separated from each other, the wireless IC tag 6 with the wireless communication improving sheet body can be easily handled.

  In addition, in a state where the wireless IC tag 6 with the wireless communication improvement sheet body is attached to the surface of the article having a curved surface, the wireless IC tag 6 with the wireless communication improvement sheet body is deformed into a shape along the curved surface of the article. At this time, if the wireless IC tag 6 with the wireless communication improvement sheet member is elastically deformed, an elastic restoring force is generated in the wireless IC tag 6 with the wireless communication improvement sheet member. In the wireless IC tag 6 with the wireless communication improvement sheet body in which the layers are slidably integrated with each other, since the layers slide with each other, the wireless IC tag 6 with the wireless communication improvement sheet body can be flexibly deformed. Therefore, the elastic restoring force generated in the wireless IC tag 6 with the wireless communication improving sheet body can be made as small as possible. Further, since the covering film 15 surrounds and holds each layer to prevent separation, each layer of the wireless IC tag 6 with the wireless communication improvement sheet body is prevented from separating from each other in the slidable region. Can do.

  In addition, if the entire surface of each layer is joined, if a bending moment whose radius of curvature is determined in the thickness direction Z of each layer is applied to the wireless IC tag 6 with the wireless communication improving sheet body, the thickness dimension of each layer is , Which contributes to the moment of inertia of the cross section. On the other hand, by forming the area of the bonding layer 14 smaller than the area of the surface perpendicular to the thickness direction Z of each layer 11, 12, 13, the wireless IC tag 6 with the wireless communication improving sheet body has a thickness direction. A region where the layers adjacent to Z are not joined can be formed.

  Thereby, the cross-sectional secondary moment of the entire wireless IC tag 6 with the wireless communication improvement sheet body is not a value determined by the entire thickness dimension of the wireless IC tag 6 with the wireless communication improvement sheet body, but the respective layers 11, 12, 13. It can be the sum of the moments of section. Since the cross-sectional secondary moment is proportional to the cube of the dimension in the thickness direction Z, the total cross-sectional secondary moment of each layer is smaller than when the entire surface of each layer is joined. Therefore, the bending rigidity of the wireless IC tag 6 with the wireless communication improvement sheet body is reduced when the bending moment whose curvature radius is determined in the thickness direction Z of each layer is applied to the wireless IC tag 6 with the wireless communication improvement sheet body. Can do.

  In addition, when a bending moment is applied to the wireless IC tag 6 with the wireless communication improvement sheet body, the layers 11, 12, and 13 are bent while sliding on each other in a region not joined by the joining layer 14. Thereby, the maximum values of the tensile stress and the compressive stress applied to each layer can be reduced as compared with the case where the layers cannot slide with respect to each other. Therefore, damage to the wireless IC tag 6 with the wireless communication improving sheet body can be prevented. Further, since the bending rigidity can be reduced, the wireless IC tag 6 with the wireless communication improving sheet body can be easily attached to the curved surface portion of the article.

  Since the wireless IC tag 6 with the wireless communication improvement sheet body has low bending rigidity, it can be easily attached to the curved surface portion of the article. Therefore, the wireless IC tag 6 with the wireless communication improving sheet body can be attached to a surface of various shapes to manage various articles, and the application of the wireless IC tag can be expanded.

(Example 1)
FIG. 9 is a cross-sectional view of the wireless IC tag 6 with a wireless communication improving sheet body according to the first embodiment of the present invention. FIG. 10 is an exploded plan view of the wireless IC tag 6 with the wireless communication improvement sheet body according to the first embodiment of the present invention.

  FIG. 10F shows a state in which the shielding layer 13 is viewed from the thickness direction one side Z1. FIG. 10E shows a state in which the bonding layer 14 is arranged on one side Z1 in the thickness direction of the shielding layer 13 in FIG. FIG. 10D shows a state in which the dielectric layer 12 is arranged on one side Z1 in the thickness direction of the shielding layer 13 and the bonding layer 14 in FIG. FIG. 10C shows a state in which the bonding layer 14 is arranged on one side Z1 in the thickness direction of the dielectric layer 12 of FIG. FIG. 10B shows a state in which the auxiliary antenna layer 11 is disposed on one side Z1 in the thickness direction of the dielectric layer 12 and the bonding layer 14 in FIG. FIG. 10A shows a state in which the wireless IC tag 22 is arranged on one side Z1 in the thickness direction of the auxiliary antenna layer 11 and the bonding layer 14 of FIG.

  In Example 1, the wireless IC tag 6 with the wireless communication improvement sheet body was formed by combining the wireless IC tag 22 and the wireless communication improvement sheet body 1 with the configuration of the second embodiment. From the article side when attaching the wireless IC tag 6 with the wireless communication improvement sheet body to the article, the bonding layer 14 made of an acrylic adhesive tape having a thickness dimension of 120 micrometers (abbreviated as “μm”), a thickness dimension of 420 μm A coating film 15 made of polyethylene containing ethylene-vinyl acetate copolymer resin (Ethylene-Vinyl Acetate: abbreviation “EVA”), a bonding layer 14 made of an acrylic adhesive tape having a thickness of 30 μm, an aluminum foil having a thickness of 50 μm, A shielding layer 13 comprising: a joining layer 14 comprising an acrylic adhesive tape having a thickness of 120 μm; a dielectric layer 12 comprising a foamed polyethylene having a thickness of 2 mm; a joining layer 14 comprising an acrylic adhesive tape having a thickness of 120 μm; Conductor layer 17 of auxiliary antenna layer 11 made of aluminum foil tape, PET having a thickness of 100 μm The insulating layer 18 of the auxiliary antenna layer 11, the bonding layer 14 made of an acrylic adhesive tape having a thickness of 120 μm, the wireless IC tag 22 made of a short dipole tag manufactured by Raflatac, and the covered material made of polyethylene containing EVA having a thickness of 420 μm A covering film 15 was laminated. The outer peripheral portions of the coating film 15 on the front side and the back side were fused with a high frequency welder.

  The auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 have the same length in the long side direction X and the short side direction Y, the long side direction X is 100 mm, and the short side direction Y is 28 mm. did. The auxiliary antenna layer 11 is provided with a hole 19 having a dimension in the long side direction X of 42 mm and a dimension in the short side direction Y of 22 mm in the center portion.

  The bonding layer 14 between the shielding layer 13 and the dielectric layer 12 is a belt-like shape having a dimension in the long side direction X of 10 mm and a dimension in the short side direction Y of 28 mm at the center of the wireless IC tag 6 with the wireless communication improving sheet body. Provided. The bonding layer 14 between the dielectric layer 12 and the conductor layer 17 of the auxiliary antenna layer 11 has a dimension in the long side direction X of 10 mm and a short side direction Y of the central portion of the wireless IC tag 6 with the wireless communication improving sheet body. It provided in parts other than the void | hole 19 among the strip | belt-shaped area | regions whose dimension is 28 mm. The bonding layer 14 between the insulator layer 18 of the auxiliary antenna layer 11 and the wireless IC tag 22 is a region having a dimension in the long side direction X of 10 mm and a dimension in the short side direction Y of 11 mm at the center of the wireless IC tag 22. And the central portion of the dielectric layer 12 through the hole 19 portion of the auxiliary antenna layer 11.

  The fused portion of the coating film 15 has a dimension in the long side direction X of 2 mm. The overall dimensions of the wireless IC tag 6 with the wireless communication improvement sheet body were 107 mm in the long side direction X, 35 mm in the short side direction Y, and 352 mm in the thickness direction Z. The bonding layer 14 on the back surface of the wireless IC tag 6 with the wireless communication improvement sheet body, that is, the bonding layer 14 for bonding the coating film 15 and the article was provided on the entire surface.

  Using an RFID reader (OMRON V750-BA50C04-JP, circularly polarized antenna V750-HS01CA-JP) with an output of 225 dBm EIRP effective radiation power of about 1 W, this tag was attached to a metal plate and the communication distance was measured. Met. “DBm” is a logarithmic representation where 1 mW is 0 dBm.

(Third embodiment)
FIG. 11 is a cross-sectional view of the wireless IC tag 6 with a wireless communication improving sheet body according to the third embodiment of the present invention. The wireless IC tag 6 with the wireless communication improvement sheet body of the present embodiment has a configuration in which the dielectric layer 12 is different from the wireless IC tag 6 with the wireless communication improvement sheet body shown in FIG.

  A plurality of dielectric layers 12 are provided. The dielectric layers 12 may all have the same dielectric constant, or may be set to any one of a plurality of different dielectric constants. The dielectric layer 12 includes a first dielectric layer 27 and a second dielectric layer 28. The first dielectric layer 27 and the second dielectric layer 28 are formed of the same or different materials. The thickness dimension of the first dielectric layer 27 and the thickness dimension of the second dielectric layer 28 are optimal to enhance the communication characteristics of the wireless IC tag 22 in accordance with the dielectric constant of the material of each dielectric layer 27, 28. Set to the correct dimensions. Hereinafter, the first dielectric layer 27 and the second dielectric layer 28 are also simply referred to as “dielectric layer” 12.

  The bonding layer 14 is formed in a circular shape when viewed in the thickness direction Z of the plurality of layers 11, 12, 13. The bonding layer 14 is formed in a circular shape when viewed in the thickness direction Z of each of the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13. The bonding layer 14 is provided between the wireless IC tag 22 and the auxiliary antenna layer 11, between the auxiliary antenna layer 11 and the first dielectric layer 27, and between the first dielectric layer 27 and the second dielectric layer 28. , Between the second dielectric layer 28 and the shielding layer 13, and between the shielding layer 13 and the coating film 15.

  As described above, the bonding layer 14 is formed in a circular shape when viewed in the thickness direction Z of the plurality of layers 11, 12, and 13. Therefore, the wireless IC tag 6 with the wireless communication improvement sheet body is bent in any direction. Even when arranged in a state where a moment is applied, sliding between the layers 11, 12, and 13 can be allowed. As a result, the wireless IC tag 6 with the wireless communication improving sheet body can ensure isotropy and reduce the bending rigidity.

  A plurality of dielectric layers 12 are provided. Therefore, when the dielectric layer 12 having the same thickness is provided between the auxiliary antenna layer 11 and the shielding layer 13, a plurality of dielectric layers 12 are provided and bonded as compared with the case where the single dielectric layer 12 is provided. Regions that are not joined together by the layer 14 can be formed in the dielectric layer 12. When the dielectric layer 12 is provided as a single layer, the thickness of the entire dielectric layer 12 contributes to the moment of inertia of the cross section of the dielectric layer 12. On the other hand, by making the dielectric layer 12 into a plurality of layers, the sectional second moment of the entire dielectric layer 12 is not a value determined by the total dimension in the thickness direction Z of the dielectric layer 12 but each dielectric layer 12. The total moment of inertia of the cross section of the body layer 12 can be taken as the sum. The cross-sectional secondary moment when the cross-sectional shape is rectangular is proportional to the cube of the dimension in the thickness direction Z. Therefore, the sum of the cross-sectional secondary moments of each dielectric layer 12 is such that the dielectric layer 12 is a single layer. Compared to the case where it is formed, it becomes smaller.

  Therefore, the bending rigidity of the dielectric layer 12 when a bending moment whose curvature radius is determined in the thickness direction Z of each dielectric layer 12 is applied to the dielectric layer 12 can be reduced. Further, when a bending moment is applied to the dielectric layer 12, the plurality of dielectric layers 12 can slide and displace with each other. As a result, the maximum values of the tensile stress and the compressive stress applied to each dielectric layer 12 can be made smaller than when the dielectric layers 12 cannot slide with respect to each other. Therefore, damage to the dielectric layer 12 can be prevented. In addition, since the bending rigidity of the dielectric layer 12 can be reduced, the bending rigidity of the entire wireless IC tag 6 with the wireless communication improving sheet body can be reduced.

  A plurality of dielectric layers 12 are provided, and the dielectric constant of each dielectric layer 12 is set to any one of a plurality of different dielectric constants. Therefore, the plurality of dielectric layers 12 can finely adjust the dielectric constant of the entire dielectric layer 12 as compared with the case where the dielectric layer 12 is formed of a single insulating material. Thereby, the wireless IC tag 6 with the wireless communication improving sheet body can surely prevent the communication characteristics of the wireless IC tag 22 from deteriorating and the communication distance from being shortened.

  The bonding layer 14 formed in a circular shape is formed as small as possible. Therefore, when the wireless IC tag 6 with the wireless communication improving sheet body is bent, the circular bonding layer 14 is not formed as small as possible when the wireless IC tag 6 with the wireless communication improvement sheet is bent. As compared with the above, the bonding layer 14 can slide greatly in the short direction. As a result, the wireless IC tag 6 with the wireless communication improving sheet body can be bent more easily with the longitudinal direction of the bonding layer 14 as the axis.

(Example 2)
FIG. 12 is a cross-sectional view of the wireless IC tag 6 with a wireless communication improvement sheet body according to the second embodiment of the present invention. FIG. 13 is an exploded plan view of the wireless IC tag 6 with the wireless communication improving sheet body according to the second embodiment of the present invention.

  FIG.13 (g) shows the state which looked at the shielding layer 13 from thickness direction one side Z1. FIG. 13 (f) shows a state in which the bonding layer 14 is arranged on one side Z <b> 1 in the thickness direction of the shielding layer 13 in FIG. 13 (g). FIG. 13E shows a state in which the dielectric layer 12 is arranged on one side Z1 in the thickness direction of the shielding layer 13 and the bonding layer 14 in FIG. FIG. 13D shows a state in which the bonding layer 14 is disposed on one side Z1 in the thickness direction of the dielectric layer 12 in FIG. FIG. 13C shows a state in which the auxiliary antenna layer 11 is arranged on one side Z1 in the thickness direction of the dielectric layer 12 and the bonding layer 14 in FIG. FIG. 13B shows a state in which the bonding layer 14 is arranged on one side Z1 in the thickness direction of the auxiliary antenna layer 11 and the bonding layer 14 in FIG. FIG. 13A shows a state where the wireless IC tag 22 is arranged on one side Z1 in the thickness direction of the auxiliary antenna layer 11 and the bonding layer 14 of FIG. 13B.

  In Example 2, the wireless IC tag 6 with the wireless communication improvement sheet body was formed by combining the wireless IC tag 22 and the wireless communication improvement sheet body 1 with the configuration of the third embodiment. From the article side when the wireless IC tag 6 with the wireless communication improvement sheet body is attached to the article, the bonding layer 14 made of an acrylic adhesive tape having a thickness of 120 μm, the coating film 15 made of a vinyl chloride sheet having a thickness of 200 μm, the thickness Bonding layer 14 made of an acrylic adhesive tape having a dimension of 30 μm, shielding layer 13 made of an aluminum foil having a thickness of 50 μm, bonding layer 14 made of an acrylic adhesive tape having a thickness of 120 μm, and soft polyethylene having a thickness of 1 mm A dielectric layer 12 made of an acrylic adhesive tape having a thickness of 120 μm, a dielectric layer 12 made of soft polyethylene having a thickness of 1 mm, a bonding layer 14 made of an acrylic adhesive tape having a thickness of 120 μm, Conductor layer 17 of auxiliary antenna layer 11 made of aluminum foil tape, thickness dimension is 100 μm Insulator layer 18 of auxiliary antenna layer 11 made of PET, bonding layer 14 made of acrylic adhesive tape having a thickness of 120 μm, wireless IC tag 22 made of a belt tag made by Raflatac, thickness thickness of 200 μm from a vinyl chloride sheet The coating film 15 to be formed was laminated. The coating film 15 on the front side and the back side was fused by a high frequency welder.

  The auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 have the same length in the long side direction X and the short side direction Y, the long side direction X is 80 mm, and the short side direction Y is 20 mm. did. The auxiliary antenna layer 11 was provided with a notch 19 having a dimension in the long side direction X of 16 mm and a dimension in the short side direction Y of 4 mm in the central portion.

  The bonding layer 14 between the shielding layer 13 and the dielectric layer 12 is a belt-like shape having a dimension in the long side direction X of 10 mm and a dimension in the short side direction Y of 20 mm at the center of the wireless IC tag 6 with the wireless communication improving sheet body. Provided. The bonding layer 14 between the two dielectric layers 12 was provided in a band shape with a long side direction X of 10 mm and a short side direction Y of 20 mm at the center of the wireless IC tag 6 with a wireless communication improving sheet body. The bonding layer 14 between the dielectric layer 12 and the conductor layer 17 of the auxiliary antenna layer 11 is 10 mm in the long side direction X and 10 mm in the short side direction Y at the center of the wireless IC tag 6 with the wireless communication improving sheet body. It provided in parts other than the notch 19 among 20 mm strip | belt-shaped area | regions.

  The bonding layer 14 between the insulator layer 18 of the auxiliary antenna layer 11 and the wireless IC tag 22 is provided in a central portion of the wireless IC tag 22 in a region where the long side direction X is 10 mm and the short side direction Y is 15 mm. It was. The bonding layer 14 between the insulator layer 18 and the wireless IC tag 22 is provided in the central portion of the auxiliary antenna layer 11, and the notch 19 is provided in a form to be attached to the dielectric layer 12 through the notch 19. .

  The fused portion of the coating film 15 has a dimension in the long side direction X of 1 mm. The overall dimensions of the wireless IC tag 6 with the wireless communication improvement sheet body were 85 mm in the long side direction X, 25 mm in the short side direction Y, and 352 mm in the thickness direction Z. The bonding layer 14 on the back surface of the wireless IC tag 6 with the wireless communication improvement sheet body, that is, the bonding layer 14 for bonding the coating film 15 and the article was provided on the entire surface.

  Using the RFID reader described above, the tag was attached to a metal plate at an output of 225 dBmEIRP effective radiation power of about 1 W, and the communication distance was measured to be 15 m.

(Fourth embodiment)
FIG. 14 is a cross-sectional view of the wireless IC tag 6 with a wireless communication improving sheet body according to the fourth embodiment of the present invention. The wireless IC tag 6 with the wireless communication improvement sheet body of the present embodiment has a configuration in which the position of the bonding layer 14 and the shape of the bonding layer 14 are different from those of the wireless IC tag 6 with the wireless communication improvement sheet body shown in FIG.

  The bonding layer 14 is provided between the auxiliary antenna layer 11 and the first dielectric layer 27 and between the second dielectric layer 28 and the shielding layer 13. It is formed at the end of one side X1 in the side direction. The bonding layer 14 is formed between the first dielectric layer 27 and the second dielectric layer 28 at the end of the other side X2 in the long side direction of the wireless IC tag 6 with a wireless communication improvement sheet body.

  The bonding layer 14 is formed in a band shape, similarly to the wireless communication improving sheet body 1 shown in FIG. The bonding layer 14 is formed as thin as possible. Therefore, when the wireless IC tag 6 with the wireless communication improvement sheet body is bent, the unbonded portions of the layers 11, 12, and 13 are formed when the bonding layer 14 is not formed as thin as possible. In comparison, the bonding layer 14 can slide greatly in the short direction. As a result, the wireless IC tag 6 with the wireless communication improving sheet body can be bent more easily with the longitudinal direction of the bonding layer 14 as the axis.

(Fifth embodiment)
FIG. 15 is a cross-sectional view of the wireless IC tag 6 with a wireless communication improving sheet body according to the fifth embodiment of the present invention. The wireless IC tag 6 with the wireless communication improvement sheet body of the present embodiment has a configuration in which the position of the bonding layer 14 is different from the wireless IC tag 6 with the wireless communication improvement sheet body shown in FIG.

  The bonding layer 14 is provided between the auxiliary antenna layer 11 and the first dielectric layer 27, between the first dielectric layer 27 and the second dielectric layer 28, and between the second dielectric layer 28 and the shielding layer. 13 is formed at the end of one long side direction X1.

  Of the wireless IC tag 6 with the wireless communication improvement sheet body, the end of one side X1 in the long side direction where the bonding layer 14 is formed is defined as a part that is first brought into contact with an article, and the notation clearly indicating this part is defined as the wireless communication improvement sheet It is attached to the wireless IC tag 6 with a body. When the wireless IC tag 6 with the wireless communication improvement sheet body is attached to the article, the portion specified by the above notation is first brought into contact, and the wireless communication improvement sheet body is sequentially attached from one long side direction X1 to the other long side direction X2. By applying the wireless IC tag 6 to the article, it is possible to prevent external force from being applied to the bonding layer 14. Accordingly, the layers 11, 12, and 13 joined to each other by the joining layer 14 are not applied with an external force in a direction deviating from each other with respect to the surface direction. Is called. As a result, it is possible to prevent the wireless IC tag 6 with the wireless communication improvement sheet body that has been pasted from being subjected to stress that tends to be peeled off from the article.

  Accordingly, since the bonding layer 14 is formed only in the long side direction X1 of the wireless IC tag 6 with the wireless communication improvement sheet body, when the wireless IC tag 6 with the wireless communication improvement sheet body is attached to the curved surface portion of the article, the bonding layer 14 is bonded. It can be easily attached from one end X1 of the long side direction in which the layer 14 is formed.

(Sixth embodiment)
FIG. 16 is a cross-sectional view of the wireless IC tag 6 with a wireless communication improving sheet body according to the sixth embodiment of the present invention. The wireless IC tag 6 with the wireless communication improvement sheet body of the present embodiment has a configuration in which the shape of the coating film 15 is different from the wireless IC tag 6 with the wireless communication improvement sheet body shown in FIG.

  The holding means 16 includes a coating film 15 that surrounds part or all of the plurality of layers 11, 12, 13, and 14. The covering film 15 includes a wireless IC tag 22, an auxiliary antenna layer 11, a dielectric layer 12, a bonding layer 14 between the wireless IC tag 22 and the auxiliary antenna layer 11, and between the auxiliary antenna layer 11 and the dielectric layer 12. The bonding layer 14 and the bonding layer 14 between the dielectric layer 12 and the coating film 15 are surrounded and held together. The shielding layer 13 is disposed closer to the article than the coating film 15 and is bonded to the coating film 15 by the bonding layer 14. Bonding layer 14 between wireless IC tag 22 and auxiliary antenna layer 11, bonding layer 14 between auxiliary antenna layer 11 and dielectric layer 12, and bonding layer between dielectric layer 12 and coating film 15 14, the area of the bonding layer 14 is formed smaller than the area of the surface perpendicular to the thickness direction Z of each of the layers 11, 12, 13. Therefore, in the wireless IC tag 22, the auxiliary antenna layer 11, and the dielectric layer 12. A slidable region is formed. The whole of the shielding layer 13 and the coating film 15 is joined by the joining layer 14, but since the thickness is thin, it is considered that the influence on the bending rigidity is small.

  In another embodiment, in the wireless IC tag 6 with the wireless communication improving sheet body, the coating film 15 surrounds at least one of the wireless IC tag 22, the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13. You may make it the structure to carry out.

(Seventh embodiment)
FIG. 17 is a cross-sectional view of the wireless IC tag 6 with a wireless communication improving sheet body according to the seventh embodiment of the present invention. Compared with the wireless IC tag 6 with the wireless communication improvement sheet body shown in FIG. 11, the wireless IC tag 6 with the wireless communication improvement sheet body of the present embodiment has a first dielectric layer 27 and a second dielectric layer 28. The method of joining is different.

  The joining portion is joined to each other by welding or fusing at least any two of the plurality of layers adjacent to each other. At least any two of the plurality of dielectric layers 12 that are adjacent to each other are fused to each other in a partial region as viewed in the thickness direction Z. A region where the dielectric layer 12 is fused is referred to as a “fused region” 36. Therefore, the plurality of dielectric layers 12 can prevent the dielectric layers 12 from separating from each other in the fusion region 36. In addition, each dielectric layer 12 can slide in a region where the dielectric layer 12 is not fused.

(Eighth embodiment)
FIG. 18 is a cross-sectional view of the wireless IC tag 6 with a wireless communication improving sheet body according to the eighth embodiment of the present invention. The wireless IC tag 6 with the wireless communication improvement sheet body of the present embodiment has a configuration similar to the wireless IC tag 6 with the wireless communication improvement sheet body of FIG.

  The dielectric layer 12 is provided with a cut 37 so that a part of the dielectric layer 12 when viewed perpendicular to the thickness direction Z is separable in the thickness direction Z. The notch 37 is formed perpendicular to the thickness direction Z in a partial region when the dielectric layer 12 is viewed in the thickness direction Z. Therefore, the dielectric layer 12 can slide in the region where the cut 37 of the dielectric layer 12 is formed. As a result, the dielectric layer 12 in which the notch 37 is formed can have a lower bending rigidity than when the notch 37 is not formed in the dielectric layer 12.

(Ninth embodiment)
FIG. 19 is a cross-sectional view of the wireless IC tag 6 with a wireless communication improving sheet body according to the ninth embodiment of the present invention. The wireless IC tag 6 with the wireless communication improvement sheet body of the present embodiment has a configuration in which the position where the wireless IC tag 6 is disposed is different from the wireless IC tag 6 with the wireless communication improvement sheet body shown in FIG.

  The wireless IC tag 22 is disposed between the auxiliary antenna layer 11 and the shielding layer 13. Therefore, the wireless IC tag 6 with the wireless communication improving sheet body can shield the electromagnetic influence from the article to the wireless IC tag 22 by the shielding layer 13 and function as an auxiliary antenna of the wireless IC tag 22. Further, since the wireless IC tag 6 with the wireless communication improving sheet body is disposed with the wireless IC tag 22 sandwiched between the auxiliary antenna layer 11 and the shielding layer 13, the wireless IC tag 22 can be protected from impact or the like.

(10th Embodiment)
FIG. 20 is a cross-sectional view of the wireless IC tag 6 with a wireless communication improving sheet body according to the tenth embodiment of the present invention. The wireless IC tag 6 with the wireless communication improvement sheet body of the present embodiment has a configuration in which the shape of the dielectric layer 12 is different from that of the wireless IC tag 6 with the wireless communication improvement sheet body shown in FIG.

  In the dielectric layer 12, when the wireless IC tag 22 is disposed, a recess 41 or a hole is formed at the same position as the position where the IC chip 23 is disposed when viewed in the thickness direction Z. The recess 41 and the hole are formed larger than the respective dimensions in the long side direction X and the short side direction Y of the IC chip 23.

  The recess 41 is a hole with a bottom formed on the surface of the dielectric layer 12 facing one side Z1 in the thickness direction. The recess 41 is formed in a columnar shape such as a columnar shape or a prismatic shape, a cone shape such as a cone or a quadrangular pyramid, or a hemisphere. For example, the recess 41 is formed in a quadrangular prism shape having an axis in the thickness direction Z, the dimension in the long side direction X is 8 mm, the dimension in the short side direction Y is 8 mm, and the dimension in the thickness direction Z is 3 mm. Formed.

  Further, the dielectric layer 12 may have a structure in which holes are formed. The holes are holes that penetrate the dielectric layer 12 in the thickness direction Z. The holes are formed in a shape such as a cylindrical shape and a prism shape.

  FIG. 21 is a cross-sectional view illustrating a state where an external force is applied to the wireless IC tag 6 with the wireless communication improvement sheet body according to the tenth embodiment of the present invention. When an external force toward the other thickness direction Z2 is applied to the IC chip 23 via the coating film 15, the antenna element 24, the auxiliary antenna layer 11, and the bonding layer 14 located on the other thickness direction Z2 side of the IC chip 23. Is elastically deformed and protrudes into the recess 41.

  In the wireless IC tag 6 with the wireless communication improvement sheet body of the present embodiment, an external force is applied to the IC chip 23 as compared with the wireless IC tag 6 with the wireless communication improvement sheet body in which the recess 41 shown in FIG. 8 is not formed. In this case, the external force can be distributed to portions other than the recess 41 by the IC chip 23 being accommodated in the recess 41. As a result, the external force applied to the IC chip 23 can be reduced, and the reaction force against the external force can be reduced. Therefore, the wireless IC tag 6 with the wireless communication improving sheet body can reduce the reaction force toward the one direction Z1 applied to the IC chip 23 in the thickness direction.

  As described above, when the wireless IC tag 22 is disposed, the dielectric layer 12 has a recess 41 or a hole formed at the same position as the position where the IC chip 23 is disposed when viewed in the thickness direction Z. . Therefore, in the state where the wireless IC tag 22 is arranged on the wireless communication improving sheet body 1, when an external force is applied to the IC chip 23 from the outside in the thickness direction Z of each layer, the reaction applied to the IC chip 23. The power can be reduced. Thereby, the wireless communication improving sheet body 1 can prevent the IC chip 23 from being damaged. Therefore, the wireless communication improving sheet body 1 can improve the impact resistance of the wireless IC tag 22.

(Eleventh embodiment)
FIG. 22 is a cross-sectional view of the wireless IC tag 6 with a wireless communication improving sheet body according to the eleventh embodiment of the present invention. The wireless IC tag 6 with the wireless communication improvement sheet body of the present embodiment has a configuration in which the shape of the dielectric layer 12 is different from that of the wireless IC tag 6 with the wireless communication improvement sheet body shown in FIG.

In the dielectric layer 12, cuts 37a and 37b are formed in a direction perpendicular to the long side direction X. The cut 37a may be planar or V-shaped, and is formed from the surface facing the thickness direction one Z1 of the dielectric layer 12 toward the other thickness direction Z2, and the cut 37b is formed in the other thickness direction Z2 of the dielectric layer 12. It is formed from the facing surface toward the thickness direction one Z1. The notches 37a and 37b are formed such that the dimension in the short side direction Y coincides with the dimension in the short side direction Y of the dielectric layer 12, and the dimension in the thickness direction Z is, for example, 7.5 mm.

  One of the two end surface portions perpendicular to the thickness direction Z of the dielectric layer 12 includes a plurality of regions that can be separated in one or more directions intersecting the thickness direction Z. An end surface part means the surface which faces the thickness direction Z. The plurality of regions are separably formed by cuts 37a and 37b formed in parallel to the thickness direction Z from one end surface portion. The plurality of regions are formed continuously by a portion of the dielectric layer 12 excluding one end surface portion. The plurality of regions are formed continuously by the other end surface portion opposite to the one end surface portion.

  In the present embodiment, the plurality of separable regions include a first separable region 38a, 38b and a second separable region 39a, 39b. The first separable region 38a and the second separable region 39a are separated by a notch 37a. The first separable region 38b and the second separable region 39b are separated by a notch 37b. The first separable regions 38a and 38b and the second separable regions 39a and 39b are formed in the slidable region.

  In the dielectric layer 12, the first separable regions 38a and 38b are one side in the long side direction X from the notches 37a and 37b, that is, the regions on the left side of the notches 37a and 37b shown in FIG. The regions 39a and 39b are regions on the other side in the long side direction X from the cuts 37a and 37b, that is, the right side of the cuts 37a and 37b shown in FIG.

  The dielectric layer 12 is integrally formed including the first separable regions 38a and 38b and the second separable regions 39a and 39b. The first separable region 38a and the second separable region 39a are connected by a region including the end surface portion on the other side Z2 in the thickness direction. The first separable region 38b and the second separable region 39b are connected by a region including the end surface portion on the Z1 side in the thickness direction.

  FIG. 23 is a cross-sectional view for explaining the bending rigidity of the wireless IC tag 6 with a wireless communication improving sheet body according to the eleventh embodiment of the present invention. In FIG. 23, the wireless IC tag 22 and the coating film 15 are removed from the wireless IC tag 6 with the wireless communication improving sheet body of the present embodiment, and the auxiliary antenna layer 11, the dielectric layer 12, the shielding layer 13, and the bonding layer 14 are shown. ing. The auxiliary antenna layer 11, the dielectric layer 12, the shielding layer 13, and the bonding layer 14 shown in FIG. 23 are more dielectric than the auxiliary antenna layer 11, the dielectric layer 12, the shielding layer 13, and the bonding layer 14 shown in FIG. The shape of the body layer 12 is different.

  The auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 show a state in which a bending moment whose curvature radius is determined in the thickness direction Z of each layer is applied. Each of the auxiliary antenna layer 11, the dielectric layer 12, and the shielding layer 13 is given a bending moment with the center of the virtual circle having the radius of curvature as the axis.

  FIG. 23A shows the auxiliary antenna layer 11, the dielectric layer 12, the shielding layer 13, and the bonding layer 14 when the center of the virtual circle is located on the other Z2 side in the thickness direction than the dielectric layer 12. The dielectric layer 12 is given the largest tensile stress 31 on the surface outside the radius of curvature among the surfaces perpendicular to the thickness direction Z, that is, the surface facing the thickness direction one Z1. By applying the tensile stress 31, the first separable region 38a and the second separable region 39a are separated in the circumferential direction of the virtual circle in a direction away from each other on the surface facing the thickness direction one Z1.

  Since the first separable region 38a and the second separable region 39a are formed in the slidable region, when one Z1 side in the thickness direction of the first separable region 38a and the second separable region 39a is separated from each other, The auxiliary antenna layer 11 and the dielectric layer 12 can slide. Thereby, the separation between the first separable region 38a and the second separable region 39a is facilitated, and the bending rigidity of the dielectric layer 12 can be reduced.

  Dielectric layer 12 is given the greatest compressive stress 32 on the surface inside the radius of curvature among the surfaces perpendicular to thickness direction Z, that is, the surface facing the other Z2 in the thickness direction. Since the compressive stress 32 is applied to the surface facing the other Z2 in the thickness direction, the first separable region 38b and the second separable region 39b are not separated.

  FIG. 23B shows the auxiliary antenna layer 11, the dielectric layer 12, the shielding layer 13, and the bonding layer 14 when the center of the virtual circle is located on the Z1 side in the thickness direction from the dielectric layer 12. The dielectric layer 12 is given the largest tensile stress 31 on the surface outside the radius of curvature among the surfaces perpendicular to the thickness direction Z, that is, the surface facing the other Z2 in the thickness direction. By applying the tensile stress 31, the first separable region 38b and the second separable region 39b are separated from each other in the circumferential direction of the virtual circle on the surface facing the other thickness direction Z2.

  Since the first separable region 38b and the second separable region 39b are formed in the slidable region, when the other Z2 side in the thickness direction of the first separable region 38b and the second separable region 39b is separated from each other, The dielectric layer 12 and the shielding layer 13 can slide. Thereby, the separation between the first separable region 38b and the second separable region 39b is facilitated, and the bending rigidity of the dielectric layer 12 can be reduced.

  Dielectric layer 12 is given the largest compressive stress 32 on the surface inside the radius of curvature among the surfaces perpendicular to thickness direction Z, that is, the surface facing one side in thickness direction Z1. Since the compressive stress 32 is applied to the surface facing one side Z1 in the thickness direction, the first separable region 38a and the second separable region 39a are not separated.

  As described above, in the wireless IC tag 6 with the wireless communication improving sheet body, the first separable regions 38a and 38b and the second separable regions 39a and 39b are formed, so that the radius of curvature is determined in the thickness direction Z of each layer. When a bending moment is applied to the wireless communication improving sheet body 1, a tensile stress 31 is applied to the outer end surface portion of the bending to separate the plurality of regions. Thereby, since the wireless communication improving sheet body 1 can reduce the tensile stress 31 applied to the outer end surface portion of the bending, the bending rigidity is drastically reduced and the bending can be easily performed.

  Further, in the wireless IC tag 6 with the wireless communication improving sheet body, the plurality of regions are formed so as to be separable by cuts 37a and 37b formed in parallel to the thickness direction Z from one end surface portion. Therefore, a plurality of separable regions can be formed by simple processing such as forming the cuts 37a and 37b. Accordingly, the wireless communication improving sheet body 1 determines the number of the cuts 37a and 37b, the ratio of the dimension in the thickness direction Z of the cuts 37a and 37b to the thickness dimension of the dielectric layer 12, the position where the cuts 37a and 37b are formed, and the like. By changing the bending rigidity, the bending rigidity can be set freely.

(Twelfth embodiment)
FIG. 24 is a cross-sectional view of the wireless IC tag 6 with a wireless communication improving sheet body according to the twelfth embodiment of the present invention. FIG. 25 is a partial cross-sectional view of the dielectric layer 12 shown in FIG. 24 cut along a cutting plane line BB. The wireless IC tag 6 with the wireless communication improvement sheet body of the present embodiment has a configuration in which the shape of the dielectric layer 12 is different from that of the wireless IC tag 6 with the wireless communication improvement sheet body shown in FIG.

  The dielectric layer 12 includes a composite 46. The composite 46 is configured by a composite structure of a hollow structure 47 and a plate-like body 48. The composite 46 includes a hollow structure 47 and two plate-like bodies 48. The hollow structure 47 is a plate-like wall having a surface direction different from that of the plate-like body 48, and when the wall surface of the hollow structure 47 is formed parallel to the thickness direction Z, the compressive strength of the dielectric layer 12 is stronger. Become. The hollow structure 47 may be made of any material as long as it is an insulator, but is, for example, a thermoplastic resin material polypropylene.

  In the present embodiment, the dielectric layer 12 is configured by a honeycomb structure, and the space portion of the hollow structure 47 is formed in a regular hexagonal column shape. In the space portion of the hollow structure 47, the axis line coincides with the thickness direction Z. The two plate-like bodies 48 are arranged with the hollow structure 47 sandwiched in the thickness direction Z. The hollow structure 47 and each plate-like body 48 are integrally formed. For example, the plate-like body 48 has a thickness dimension of 0.4 mm, and the hollow structure 47 has a thickness dimension of 0.3 mm and a height dimension of 6.7 mm.

  As described above, the wireless IC tag 6 with the wireless communication improving sheet body has a composite structure in which the dielectric layer 12 includes two or more plate-like bodies and a hollow structure body provided between the plate-like bodies. . Accordingly, the wireless communication improving sheet body 1 can reduce the amount of members constituting the dielectric layer 12 and reduce the weight of the dielectric layer 12 as compared with the case where the dielectric layer 12 is formed in a uniform sheet shape. Can do. The dielectric layer 12 changes the communication characteristics of the wireless IC tag 22 when an external force is applied to change the thickness dimension. In the wireless communication improving sheet body 1, the compressive strength can be set by changing the shape and thickness dimension of the hollow structure 47 included in the dielectric layer 12. As a result, the wireless communication improving sheet body 1 has a compression strength that does not change the communication characteristics of the wireless IC tag 22 and can be reduced in weight.

  In this embodiment, the space portion 47 of the hollow structure 47 is formed in a regular hexagonal column shape. However, in other embodiments, the space portion 47 of the hollow structure 47 is other than a regular hexagonal column such as a regular triangular prism or a regular quadrangular prism. It may be formed into a prismatic shape or a cylindrical shape.

  In another embodiment, the hollow structure 47 may include a plurality of cylindrical bodies arranged in one or more directions perpendicular to the thickness direction Z and having the thickness direction Z as an axis. Each cylindrical body is formed in a hollow regular hexagonal column shape, and may be formed in a prismatic shape other than a regular hexagonal column such as a regular triangular prism and a regular quadrangular prism, and a cylindrical shape. Thereby, the compression strength of the wireless IC tag 6 with the wireless communication improving sheet body can be further increased, and the performance change due to the compression load can be reduced.

  In another embodiment, the composite 46 may be configured such that a cut is formed from at least one of the thickness direction one Z1 and the thickness direction other Z2. Thus, as in the above-described eleventh embodiment, when a bending moment whose radius of curvature is determined in the thickness direction Z of each layer is applied to the dielectric layer 12, a tensile stress 31 is applied to the end surface portion outside the bending. The plurality of regions can be separated. Therefore, the wireless communication improving sheet body 1 has a low bending rigidity and can be easily bent.

(13th Embodiment)
FIG. 26 is a block diagram showing a configuration of the wireless tag communication system 8 according to the thirteenth embodiment of the present invention. The wireless tag communication system 8 includes a wireless tag device 51, a reading unit 52, a control unit 53, and a database 54.

  The wireless tag device 51 includes a tag configured by combining the wireless IC tag 22 and the wireless communication improvement sheet body 1 or a wireless IC tag 6 with a wireless communication improvement sheet body. By using the wireless communication improving sheet body 1 and the wireless IC tag 6 with the wireless communication improving sheet body, the wireless IC tag 22 can be easily attached even if the surface of the adherend to be managed is a curved conductor. be able to.

  The reading unit 52 is a reading device that reads information stored in the IC chip 23 of the wireless IC tag 22 and is realized by, for example, a wireless tag reader. The reading unit 52 reads identification information from the wireless IC tag 22 and the wireless IC tag 6 with the wireless communication improvement sheet body, and transmits the read identification information to the control unit 53. In another embodiment, the reading unit 52 may be realized by a reader / writer having a reading function and a writing function.

  The control unit 53 and the database 54 are realized by a computer. The computer includes a central processing unit (abbreviated as “CPU”) and a storage device (not shown). The control unit 53 and the reading unit 52 are configured to be communicable wirelessly or by wire. The control unit 53 receives the identification information transmitted from the reading unit 52, collates the received identification method with the management information in the database 54, calls necessary data, displays the screen, updates the management information, etc. Perform the process. The management information is not limited in content, and may be any information such as information management, position management, status grasp, inventory management, and electronic payment of the adherent.

  The present invention can be further implemented in the following aspects. In an embodiment of the present invention, the holding means includes a joint portion that joins at least any two adjacent layers among the plurality of layers forming the wireless communication improvement sheet body. Accordingly, the two adjacent layers are bonded to each other, and the wireless communication improvement sheets are prevented from being separated from each other.

  In an embodiment of the present invention, the bonding portion is a bonding layer that bonds at least any two adjacent layers among the plurality of layers. Therefore, even if the two adjacent layers are materials that cannot be directly bonded together, they can be bonded via the bonding layer, and the wireless communication improvement sheets are prevented from being separated from each other.

  In the embodiment of the present invention, the bonding layer is made of a material having adhesiveness or tackiness. Therefore, the two adjacent layers can be joined via the adhesive or tacky material, and the wireless communication improvement sheets are prevented from being separated from each other.

  In the embodiment of the present invention, the joining portion is joined to each other by welding or fusing at least any two of the plurality of layers adjacent to each other. Accordingly, the two adjacent layers are bonded to each other, and the wireless communication improvement sheets are prevented from being separated from each other.

  In an embodiment of the present invention, at least a part of the joint is formed such that the area of one surface perpendicular to the thickness direction is smaller than the area of any surface perpendicular to the thickness direction of the plurality of layers, The slidable region is formed in a region other than the joint portion.

  Therefore, in the wireless communication improving sheet body, it is possible to form a region where the adjacent layers in the thickness direction are not joined. Thereby, the area which restrains each layer decreases, and the deformation | transformation freedom degree of each layer increases. Since each layer bends independently when the wireless communication improvement sheet is bent, the bending rigidity of the wireless communication improvement sheet can be reduced as compared with the case where the entire surfaces of the layers are joined.

  In the embodiment of the present invention, the joining portion is formed in a belt shape having a longitudinal direction in any direction perpendicular to the thickness direction of the plurality of layers. Therefore, it is possible to increase the area of the region where the joint portion is arranged, as compared with the case where the joint portion is formed as a point as small as possible. When a bending moment is applied in which the neutral axis is set in a plane perpendicular to the longitudinal direction of the joint, it is possible to allow the layers to slide relative to each other in a region where the joint is not disposed. Thereby, it is possible to allow the wireless communication improving sheet body to be easily bent around the axis extending in the longitudinal direction of the joint portion.

  In the embodiment of the present invention, the joint is formed in a circular shape when viewed in the thickness direction of the plurality of layers. Therefore, even when the wireless communication improving sheet body is arranged in a state where a bending moment is applied in any direction, sliding between the respective layers can be allowed. As a result, the wireless communication improving sheet body can ensure isotropy and reduce bending rigidity.

  In the embodiment of the present invention, the joint is provided at one place between two adjacent layers among the plurality of layers. Therefore, it is possible to facilitate the sliding of the two adjacent layers in the remaining region excluding the region joined by the joint portion.

  Further, according to an embodiment of the present invention, when the wireless tag is disposed between two adjacent layers among the plurality of layers, the integrated circuit is disposed in the thickness direction of each layer. It is formed at the same position as the position. The portion where the layers are joined together by the joint portion has a high bending rigidity, whereas the portion that is not joined has a low bending stiffness. Therefore, the wireless communication improving sheet body has the lowest bending rigidity of the overall wireless communication improving sheet body and the highest bending rigidity in the region where the integrated circuit is disposed. As a result, the wireless communication improving sheet body on which the wireless tag is arranged can suppress the bending moment from being applied to the integrated circuit portion when it is bent. Therefore, the wireless communication improving sheet body in which the wireless tag is arranged can prevent the wireless tag from causing a malfunction.

  According to the embodiment of the present invention, when the wireless tag is arranged, a hole or a recess is formed at the same position as the position where the integrated circuit is arranged when viewed in the thickness direction.

  Therefore, when an external force is applied to the integrated circuit from the outside in the thickness direction of each layer in a state where the wireless tag is arranged on the wireless communication improvement sheet body, the reaction force applied to the integrated circuit can be reduced. it can. Thus, the wireless communication improving sheet body can prevent the integrated circuit from being damaged. Therefore, the wireless communication improving sheet body can improve the impact resistance of the wireless IC tag.

  In the embodiment of the present invention, the dielectric layer is formed with a cut so that a part of the dielectric layer can be separated in the thickness direction when the dielectric layer is viewed perpendicularly to the thickness direction. Therefore, the dielectric layer can slide in the region where the cut of the dielectric layer is formed. As a result, the dielectric layer in which the cut is formed can have a lower bending rigidity than when the cut is not formed in the dielectric layer.

  The embodiment of the present invention includes a plurality of regions in which one end surface portion of two end surface portions perpendicular to the thickness direction of the dielectric layer can be separated in one or more directions intersecting the thickness direction. The plurality of regions are formed continuously by a portion of the dielectric layer excluding one end surface portion.

  Therefore, when a bending moment in which the radius of curvature is determined in the thickness direction of each layer is applied to the wireless communication improving sheet body, tensile stress is applied to the outer end surface portion of the bending so that the plurality of regions can be separated. . As a result, the wireless communication improving sheet body can reduce the tensile stress applied to the outer end surface portion of the bending, so that the bending rigidity is drastically reduced and can be easily bent.

  Moreover, the embodiment of the present invention takes a composite structure in which the dielectric layer is composed of two or more plate-like bodies and a hollow structure provided between the plate-like bodies.

  Therefore, the wireless communication improving sheet body can reduce the amount of members constituting the dielectric layer and reduce the weight of the dielectric layer, compared with the case where the dielectric layer is formed in a uniform sheet shape. In addition, when an external force is applied to the dielectric layer and the thickness dimension changes, the communication characteristics of the wireless tag change. In the wireless communication improving sheet body, the compressive strength can be set by changing the shape and thickness dimension of the hollow structure body included in the dielectric layer. As a result, the wireless communication improving sheet body has a compression strength that does not change the communication characteristics of the wireless tag and can be reduced in weight.

  In an embodiment of the present invention, the hollow structure includes a plurality of cylindrical bodies arranged in one or more directions perpendicular to the thickness direction and having the thickness direction as an axis.

  Therefore, the compression strength of the wireless communication improving sheet body can be further increased, and the performance change due to the compression load can be reduced.

  In the embodiment of the present invention, the wireless tag is disposed between the auxiliary antenna layer and the shielding layer. Therefore, when the wireless tag is arranged, the wireless communication improving sheet body can shield the electromagnetic influence from the article to the wireless tag by the shielding layer, and can function as an auxiliary antenna of the wireless tag. In addition, since the wireless communication improving sheet body is disposed with the wireless tag sandwiched between the auxiliary antenna layer and the shielding layer, the wireless tag can be protected from an impact or the like.

DESCRIPTION OF SYMBOLS 1 Radio | wireless communication improvement sheet | seat body 6 Radio | wireless IC tag with radio | wireless communication improvement sheet | seat body 8 Radio | wireless tag communication system 11 Auxiliary antenna layer 12 Dielectric layer 13 Shielding layer 14 Joining layer 15 Cover film 16 Holding means 17 Conductive layer 18 Insulator layer 19 Notch 22 Wireless IC tag 23 IC chip 24 Antenna element 27 First dielectric layer 28 Second dielectric layer 31 Tensile stress 32 Compressive stress 34 Neutral surface 35 Neutral shaft 36 Fusion region 37 Notch 38 First separable Area 39 second separable area 41 recess 46 complex 47 hollow structure 48 plate-like body 51 RFID tag device 52 reading unit 53 control unit 54 database

Claims (9)

In a wireless communication improving sheet body that functions as an auxiliary antenna by resonating with radio waves of the same frequency as radio waves used for radio communication of a radio tag, can be attached to an article, and is formed by laminating a plurality of sheet-like layers ,
As the plurality of layers,
An auxiliary antenna layer having a conductive conductor layer;
An insulating dielectric layer;
A shielding layer disposed opposite to the auxiliary antenna layer via a dielectric layer and disposed closer to the article than the auxiliary antenna layer,
The plurality of layers are prevented from being separated from each other, and at least some of the plurality of layers are formed with a slidable region that is slidable with respect to another layer adjacent in the thickness direction. A wireless communication improving sheet body, wherein:   The wireless communication improvement sheet body according to claim 1, further comprising holding means for preventing the plurality of layers from separating from each other.   The wireless communication improving sheet body according to claim 2, wherein the holding means includes a coating film that surrounds a part or all of the plurality of layers.   The radio communication improvement sheet according to claim 1, wherein a plurality of the dielectric layers are provided.   5. The dielectric layer according to claim 1, wherein a plurality of dielectric layers are provided, and a dielectric constant of each dielectric layer is set to any one of a plurality of different dielectric constants. The wireless communication improvement sheet body described in 1.   The wireless communication improvement sheet according to any one of claims 1 to 5, wherein the auxiliary antenna layer has at least one hole or notch in the conductor layer.   The wireless communication improving sheet body according to any one of claims 1 to 6, wherein the wireless tag is disposed on a side opposite to the article with respect to the auxiliary antenna layer. A wireless tag comprising an integrated circuit for storing information and an antenna element for transmitting and receiving the information by wireless communication;
A wireless tag with a wireless communication improvement sheet comprising the wireless communication improvement sheet according to claim 1.   A wireless tag communication system comprising the wireless communication improving sheet body according to claim 1 or the wireless tag with the wireless communication improving sheet body according to claim 8.

Images