JP2012221421A - Ic tag - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve adhesiveness (difficulty to be peeled off) of an IC tag TG without decreasing durability of an IC chip 22 even if a thickness is thickened.SOLUTION: An IC tag TG of the present invention includes multiple plate-shaped soft members 1 stacked in a state where interlayer slide is permitted. An inlet 2 having an IC chip 22 and an antenna 23 is arranged between the stacked soft members 1 or on an upper side of the stacked soft members 1. The IC tag also includes an outer packaging material 3 for housing the stacked soft members 1 and the inlet 2 at the inside.

Description

  The present invention is an IC tag that is used by being attached to a curved or uneven article such as a gas cylinder or a flexible container bag, a soft article, etc., for example, process management at a manufacturing site, logistics management in the distribution industry, etc. Further, the present invention relates to an IC tag used for inventory management at a store and clothes management at a cleaning store.

As an IC tag attached to a flexible attachment object such as clothes, there is an IC tag described in Patent Document 1, for example.
In this IC tag, an IC chip and an antenna are disposed on a base substrate made of a resin film or the like to form an inlet. Then, a protective structure is attached and fixed on the base substrate of the inlet (on the side opposite to the IC chip). At this time, a surface layer may be provided between the base substrate and the protective structure.

Furthermore, the waterproof effect is acquired by wrapping the circumference | surroundings of the said inlet, a protection structure, etc. with an exterior material. In the technique of Patent Document 1, the inlet is bonded to the entire inner surface of the exterior material, and the protective structure is bonded to the entire inner surface of the exterior material so that no slip occurs between them. In Patent Document 1, the material of the protective structure is formed of the same material as the exterior material or a material having lower rigidity than the exterior material.
With the above configuration, in Patent Document 1, even if the IC tag is bent, the periphery of the IC chip is not bent by the protective structure, and an excessive force is not applied to the periphery of the IC chip.

JP 2010-67116 A

  In the IC tag described in Patent Document 1, the bending rigidity of the portion where the protective structure is attached is so high that it is difficult to bend and deform. For this reason, for example, when an IC tag is attached to a curved surface (tag mounting surface) such as a circular arc surface having a large curvature, not only the central portion and both the left and right side portions are adhered, but also partial adhesion occurs. Since the bending rigidity at the position where the protective structure is provided is high, the force in the direction in which the IC tag is restored to the original shape is increased, and the part is more easily peeled off. The same applies to the case where it is attached to a flexible article such as a vinyl material.

Further, when the portion to which the tag is attached is made of metal, it is necessary to provide a dielectric with a predetermined thickness on the attachment surface side of the inlet in order to prevent the communication performance of the IC tag from being lowered. From the relationship of ensuring the flexibility of the IC tag, the dielectric is considered to be a rubber material. However, if a rubber material having a thickness sufficient for the inlet to obtain the desired communication performance is attached in the same manner as the protective structure, the bending rigidity of the IC tag becomes high. As described above, this causes a strong force in the direction in which the IC tag returns to its original shape, and there is a possibility that bending stress around the IC chip will increase when it is bent. This causes the problems as described above.
The present invention has been made paying attention to the above points, and it is possible to improve the adhesion (hardness to peel off) of the IC tag without degrading the durability of the IC chip even if the thickness is increased. Objective.

  In order to solve the above-mentioned problem, the invention described in claim 1 of the present invention includes a plurality of laminated plate-like soft members in a state in which interlayer slip is allowed, and an inlet having an IC chip and an antenna. Provided is an IC tag comprising an exterior material that is disposed between laminated soft members or above the laminated soft members, and further contains the laminated soft members and inlets therein. .

Next, in the invention described in claim 2, in the configuration described in claim 1, at least one or two or more soft members are interposed between the attachment surface side of the IC tag and the inlet, and the interposition is performed. The soft member is made of a dielectric material having flexibility.
Next, the invention described in claim 3 is characterized in that the structure described in claim 1 or claim 2 is provided with a displacement restricting means for restricting the displacement of the laminated soft members.

Next, the invention described in claim 4 is characterized in that, with respect to the configuration described in claim 3, the displacement restricting means fixes a part of the overlapping soft members.
Next, the invention described in claim 5 is characterized in that, with respect to the configuration described in claim 4, the fixing is performed only at a position overlapping with the position of the IC chip in the width direction in the longitudinal direction.

Next, in the invention described in claim 6, with respect to the configuration described in claim 4 or claim 5, the fixing is fixing by fixing one of an adhesive, a pressure-sensitive adhesive, and heat fitting. It is characterized by.
Next, the invention described in claim 7 is characterized in that, with respect to the configuration described in any one of claims 4 to 6, the fixing includes a fitting structure formed in a portion to be fixed. To do.

Next, the invention described in claim 8 is the structure described in any one of claims 4 to 7, wherein the fixing is a fixing portion, and the entire laminated soft member is sealed with a sealing material. It is realized by pressing.
Next, in the invention described in claim 9, in the configuration described in any one of claims 1 to 8, at least one of the uppermost layer and the lowermost layer of the laminated soft member includes at least one soft member. The above-described exterior material is configured.

Next, the invention described in claim 10 is provided with a pair of exterior members having a larger area than that of the soft member, with respect to the configuration described in any one of claims 1 to 9. It is formed by joining the outer periphery of the pair of exterior members, and the inlet and the soft member having the above-described configuration are accommodated in the formed bag-shaped exterior material.
Next, in the invention described in claim 11, in contrast to the structure described in any one of claims 1 to 10, the exterior material is made of a material having an elastic modulus equal to or lower than that of the material constituting the soft member. It is characterized by being.
Next, in the invention described in claim 12, an adhesive layer for attachment is formed on a part of the outer surface of the exterior material with respect to the configuration described in any one of claims 1 to 11. It is characterized by being.

  According to the present invention, the soft members arranged together with the inlet are arranged in a plurality of layers, and the plate-like soft members forming the respective layers are laminated in a state in which interlayer slip is allowed. For this reason, even if the thickness of the IC tag is increased, the bending rigidity of the entire IC tag can be reduced. As a result, even if the tag mounting surface is a curved mounting surface or a flexible mounting surface, the IC tag is difficult to peel off.

Further, according to the present invention, since the bending rigidity is reduced, for example, even when the IC tag is bent, the bending stress generated at the IC chip position can be reduced. As a result, the IC chip is less likely to be damaged, and the durability of the IC tag is improved.
According to the invention of claim 2, even if the mounting surface is made of metal, even if the thickness of the soft member as the dielectric is as thick as possible to ensure the desired communication performance, it is bent as described above. Since the rigidity can be lowered, the IC tag is hardly peeled off from the tag mounting surface. Durability is also improved.

It is a typical lineblock diagram explaining the section structure of the IC tag concerning the embodiment based on the present invention. It is a top view which shows the fixed position of the soft member which concerns on embodiment based on this invention. It is a perspective view explaining the example of fixation of the soft member which concerns on embodiment based on this invention. It is a perspective view explaining the fixed example using the sealing material of the soft member which concerns on embodiment based on this invention. It is a top view which shows another example of the fixing position of the soft member which concerns on embodiment based on this invention. It is a top view which shows the case where a soft member is circular shape. It is a top view which shows the structure of the inlet which concerns on embodiment based on this invention. It is a side view explaining the example of fixation by the fitting structure of the soft member which concerns on embodiment based on this invention. It is a side view which shows the example of fixation of the soft member which concerns on embodiment based on this invention. FIG. 10 is a plan view for explaining a rising portion of the lowermost soft member in FIG. 9. FIG. 10 is a plan view illustrating another example of the rising portion of the lowermost soft member in FIG. 9. It is a figure which shows a state when the soft member which concerns on embodiment based on this invention is bent. It is a figure which shows the state when bent in the case where a soft member is made into an integral structure.

Next, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic cross-sectional view showing the IC tag TG of the present embodiment.
(Constitution)
As shown in FIG. 1, the IC tag TG of the present embodiment includes a plurality of layers (three layers in FIG. 1) of soft members 1, an inlet 2 disposed on the plurality of layers of soft members 1, and a plurality of layers thereof. The exterior material 3 which accommodates the soft member 1 and inlet 2 of this inside is provided. Reference numeral 5 denotes a film for protecting the IC chip 22 against a load from above. This film 5 may be omitted.

  As shown in FIG. 2, each of the soft members 1 has a flat plate shape that is rectangular in plan view. As a material of the soft member 1, a flexible dielectric is adopted. For example, a rubber material such as ethylene propylene diene rubber (EPDM) is used. In this embodiment, EPDM having a hardness of 80 is used, and the thickness of each soft member 1 is set to 1 mm. In this embodiment, since the soft member 1 is laminated in three layers, the total thickness of the dielectric layers is 3 mm. However, depending on the material (dielectric constant) of the soft member 1, the metal of the mounting surface is used. The total thickness of the laminated soft members 1 is set so as to ensure a thickness that can suppress the influence of the above. Here, although the case of three layers is illustrated in the present embodiment, the soft member 1 may be composed of two layers or four layers or more. If the thickness is the same, the bending rigidity of the entire IC tag TG can be set smaller as the number of layers is increased.

  Between the soft members 1 adjacent to each other in the thickness direction of the laminated soft members 1, the longitudinal center portion is fixed with an adhesive (the portion X in FIG. 2 is a fixed position). The fixed position may be only on both sides in the width direction as indicated by reference numeral X1 in FIG. Further, as shown in FIG. 3, the fixing with the adhesive may be performed by adhering the adhesive in the thickness direction at the position of the end in the width direction at the center in the longitudinal direction as shown in FIG. Symbol X is a fixed position). As an adhesive used at this time, for example, an instantaneous adhesive such as a cyanoacrylate adhesive is used. The fixed position is one place in the longitudinal direction.

  The method of fixing the laminated soft members 1 is not limited to the fixing. For example, between the soft members 1, the longitudinal center position may be fixed with an adhesive (the X portion in FIG. 2 is the fixed position). The fixed position may be only on both sides in the width direction as indicated by reference numeral X1 in FIG. As an adhesive used at this time, for example, a double-sided tape having double-sided adhesion on a film substrate or a nonwoven fabric substrate is used. The fixing position at this time is also one place in the longitudinal direction as in the case of the adhesive.

  Here, as another example of the method of fixing the soft members 1 to be laminated, every time the soft members 1 are laminated, or after all the soft members 1 are laminated, heat is applied from the upper side by heat welding. It may be fixed by joining only the central part in the longitudinal direction. The welding position is not limited to one point. Thermal welding or the like may be performed at two or more locations (X1 portion in FIG. 2) with respect to the longitudinal center.

  Further, as a method of fixing the laminated soft members 1 to each other, as shown in FIG. 4, the central portion in the longitudinal direction may be fixed by sealing with a band stop. That is, a strip-shaped member (sealing material) 30 made of paper, vinyl, or the like is wrapped around the laminated soft member 1 so as to surround the entire circumference in the width direction, and the central portion in the longitudinal direction is fixed. Here, when fixing with a band stopper, it is preferable to make the roughness of the surface of the central portion in the longitudinal direction of the upper and lower surfaces of each soft member 1 rougher than other positions so that they are not easily displaced. In FIG. 4, the case where the inlet 2 is sealed together with the sealing material 30 is illustrated.

In this way, when the laminated soft member 1 is fixed only at the central portion in the longitudinal direction, when it is bent so as to bend along the longitudinal direction, no interlayer slip occurs at the fixed central portion, but interlayer slip occurs at the other left and right sides. It will bend as it occurs. Note that the IC tag is easier to bend in the longitudinal direction than in the lateral direction.
Here, the fixing position of the laminated soft members 1 is not limited to the central portion in the longitudinal direction, and a position (position X in FIG. 5) that is eccentric in the longitudinal direction from the central portion in the longitudinal direction may be fixed. Even in this case, when bent, the interlayer slip does not occur in the fixed portion (position X in FIG. 5), but the other portions bend while sliding between the layers.

  Further, the shape of the soft member 1 does not have to be a rectangular shape, and may be an elliptical shape, a rectangular shape, a circular shape, or the like. In a circular shape or the like, there is no concept of the longitudinal direction. In this case, as shown in FIG. 6, the above fixing method is used at the center position (X2 position) of the circle or one place in the circumferential direction (X3 position). Fix it. Even in this case, it is preferable to fix at the IC chip position and its vicinity.

  Further, as shown in FIG. 7, the inlet 2 is configured by providing an IC chip 22 and an antenna 23 electrically connected to the IC chip 22 on a base substrate 21. The base substrate 21 is made of PET, for example. The pace base material of this embodiment has a thickness of 50 μm. Thus, the inlet 2 is a member that is significantly thinner than the thickness of the soft member 1. The antenna 23 is formed by etching or the like. Then, it is mounted on the base substrate 21 by, for example, ACP (Anisotropic Conductive Paste). The mounting method is not limited to ACP. A known mounting method may be adopted as appropriate.

And the inlet 2 of the said structure is being fixed on the soft member 1 of the uppermost layer in this embodiment. The inlet 2 is fixed with an adhesive 4 such as a film-based double-sided tape (see FIG. 1).
Here, since the IC chip 22 is usually located at the center in the longitudinal direction, the fixing position of the soft member member is a position where at least a part thereof overlaps with the arrangement position of the IC chip 22 in the width direction when viewed from above.
The area of the soft member 1 is set to be equal to or larger than the size of the inlet 2.
The exterior material 3 includes two exterior members 3 a and 3 b having a larger area than the soft member 1. The material of each of the exterior members 3a and 3b is preferably a material having a lower elastic modulus (softer) than the material of the soft member 1. In the present embodiment, the exterior members 3a and 3b are formed of a urethane elastomer having a thickness of 1 mm.

In addition, the exterior material 3 of the present embodiment has a rectangular shape, and only one of the short sides is opened, and the outer circumferences of the two exterior members 3a and 3b (two long sides and one short side). Side) is bonded with adhesive or heat welding. Then, after inserting the set of the laminated soft member 1 and the inlet 2 from the open short side, the open short side is joined to be in a sealed state so as to be sealed in the exterior members 3a and 3b. Sealed soft member 1 and inlet 2 are sealed.
Alternatively, after laminating the soft member 1 on the single exterior member 3a and installing the inlet 2, the other exterior member 3b is placed from the upper side, and the entire outer periphery of the two exterior members 3a and 3b Is sealed by bonding with an adhesive or heat welding. In this case, the lower surface of the lower exterior member 3a becomes flat.

Moreover, the double-sided tape 6 for attaching articles | goods is attached with respect to the outer surface (lower surface) of the lower exterior member 3a (refer FIG. 1).
Here, in the said embodiment, although the case where the laminated soft members 1 were fixed by the sealing method by an adhesive agent, heat welding, and a band stop was illustrated, the way of fixation (displacement of the laminated soft members 1 is shown. The displacement regulating means for regulating is not limited to this.

For example, when fixing at the central portion in the longitudinal direction, as shown in FIG. 8, a plurality of convex portions 7 a are formed at the central portion in the longitudinal direction of one of the upper surface and the lower surface of each soft member 1, and each soft member 1. A plurality of concave portions 7b into which the convex portions 7a can be fitted are formed in the center portion in the longitudinal direction of the other surface of the upper surface and the lower surface. And the soft member 1 is laminated | stacked, inserting the convex part 7a and the recessed part 7b. A fitting structure is constituted by the convex portion 7a and the concave portion 7b. As a result, the interlayer slip is prevented (displacement is restricted) at the central portion in the longitudinal direction, but the interlayer slip is allowed on both the left and right sides. The method of stopping is not limited to this, and a through-hole that penetrates the entire layer coaxially with respect to the fixed position is formed, and an adhesive is poured into the through-hole, or a welding needle is inserted and melted. A through member penetrating a plurality of coaxial through holes may be fitted and fixed.
Further, the displacement regulating means for regulating the displacement between the laminated soft members 1 is not limited to the above configuration.

  For example, as shown in FIGS. 9 and 10, the soft member 1 </ b> A in the lowermost layer (for example, the attachment surface side) is shaped to have a larger area than the soft member 1 </ b> B laminated thereon. And the rising part 8 which stands | starts up is provided in the outer periphery whole periphery of 1 A of lowermost soft members. Thus, the rising portion 8 is formed in a rectangular frame shape along the outer periphery of the soft member 1 in the lowermost layer. The rectangular frame-shaped rising portion 8 allows the soft member 1B laminated on the lowermost soft member 1A to be loosely inserted with a preset clearance on the upper surface of the lowermost soft member 1A. A space is formed. This loosely-insertable space is set to have a gap at least in the longitudinal direction from the longitudinal end (short side) of the laminated soft member 1B. Moreover, the height of the rising portion 8 is formed to a height corresponding to the total thickness of the soft member 1B to be stacked, and all the soft members 1B to be stacked in the rectangular space defined by the rising portion 8 are all formed. It can be accommodated.

In this case, even if slip occurs between the laminated soft members 1 by bending the IC tag TG in a state in which interlayer slip is allowed between the laminated soft members 1 including the lowermost soft member 1, The displacement in the direction is restricted by the rising portion 8, and the amount of displacement due to the slip can be reduced.
In this case, as shown in FIG. 9, the lowermost soft member 1 </ b> A including the rising portion 8 can be used as a part of the exterior material 3. When the lowermost soft member 1A is used as a part of the exterior material 3 in this way, after the inlet 2 is disposed on the laminated soft member 1B, the upper exterior member 3b is overlapped, What is necessary is just to join the outer periphery of this exterior member 3b to the upper end surface of the said rising part 8, the upper outer peripheral part of the rising part 8, etc. by adhesion | attachment etc., and to seal an inside.

Here, if the rising portion 8 does not need to form a part of the exterior material 3, it does not necessarily have to be formed on the entire outer periphery. As shown in FIG. 11, the rising portions 8 may be formed at least on both the left and right sides in the longitudinal direction (left and right short side positions) in the outer peripheral portion. In this case, the rising portion 8 does not need to be formed by one or two or more wall structures extending along the short side, and may be configured by a plurality of columnar shapes arranged along the short side, for example.
In addition, when the rising portion 8 regulates the displacement at the time of sliding, it is not necessary to carry out a part of the fixing as described above, but the fixing means as described above is used in combination with the rising portion 8. Also good.
Further, when a part of the laminated soft member 1 is fixed by the above-described fixing method, not only one type of fixing method but also a plurality of fixing methods may be combined and fixed.

(Action and others)
When the mounting surface of the IC tag TG is a curved surface, or when the cleaned clothes are formed of a flexible material such as a vinyl sheet material, the IC tag TG should follow the shape of the tag mounting surface. It will be bent and pasted. In addition, when pasted on a flexible material, there is a possibility that repeated bending force may be input after the pasting due to deformation of the flexible material even if it is flat when pasted. .

  At this time, in the IC tag TG of the present embodiment, the plurality of soft members 1 are laminated in a state in which interlayer slip is allowed to ensure a target thickness. For this reason, when the IC tag TG is bent, as shown in FIG. 12, each soft member 1 is caused to slip between layers except for the central portion. There is little or no transmission of shear force due to the expansion and contraction of the soft member 1. In other words, each layer is bent with a degree of freedom in sliding. For this reason, even if the total thickness of the plurality of soft members 1 is increased, the bending force for bending the IC tag TG is reduced, and the IC tag TG is likely to have a shape that follows the shape of the mounting surface. Even if the surface changes, it easily follows. For this reason, the IC tag TG of the present embodiment is hardly peeled off.

  Here, between the soft members 1 of the plurality of layers, as in the past, the whole surface is bonded and integrated so that there is no interlayer slip, or the thickness of the plurality of layers is configured by one soft member 50. In this case, if the soft member 50 is bent as described above, the force required for bending becomes larger than that of the IC tag TG of the present embodiment. In this case, when bent, as shown in FIG. 13, the line length of the inner surface (lowermost surface) 50a and the line length of the outer surface (uppermost surface) 50b are such that the soft member 50 is thicker. As a result of the expansion and contraction of the soft member 50 so as to be significantly different from each other, a corresponding tensile force is input to the uppermost surface to which the inlet 2 is attached. ) On the other hand, in this embodiment, the interlayer sliding between the respective layers is allowed and the thickness of the soft member 1 to which the inlet 2 is attached is small, so that the tensile force (or the input to the inlet 2 by the bending) (or (Compressive force) can be made smaller than in the case of the integrated object 50. As a result, the disconnection of the IC chip 22 is reduced correspondingly, and the durability of the IC tag TG is improved.

  In addition, since the IC tag TG of the present embodiment is fixed at the center in the longitudinal direction, there is no interlayer slip (displacement) at the center, but the interlayer slip is allowed on both the left and right sides as described above. The above-mentioned effects are not hindered. Further, by fixing a part in this way, even if the laminated soft members 1 cause the interlayer slip as described above, the multiple layers of the soft members 1 are surely arranged below the inlet 2. become. For this reason, even if the mounting surface is made of metal, a state in which the soft member 1 that is a dielectric and has a total thickness of the target thickness is interposed between the inlet 2 and the metal of the mounting surface is maintained. As a result, the target performance can be ensured as the communication performance of the inlet 2. Moreover, it becomes difficult to peel off as described above.

  The exterior material 3 that accommodates the inlet 2 and the laminated soft member 1 is preferably made of the same material as the soft member 1 or a softer material (a material having a lower elastic modulus) than the soft member 1. If the exterior members 3a and 3b can secure the role of protecting the inlet 2, it is possible to prevent the softer from inhibiting the bending. The soft member 1 and the inner surface of the exterior material 3 may not be fixed, or only a part may be fixed.

Here, in the present embodiment, it is assumed that the IC tag TG has a rectangular shape. For this reason, the bending of the IC tag TG is predominantly the bending along the longitudinal direction (bending around the short direction). For this reason, the explanation is based on bending in the longitudinal direction. However, the present invention is not limited to a shape that can specify the longitudinal direction, such as a rectangular shape or an elliptical shape. The IC tag TG has a circular shape in plan view and can be applied. In this case, as described above (see FIG. 6), for example, the fixed position may be set at the center of the circle or part of the circumferential direction.
Moreover, in the said embodiment, the case where the inlet 2 is provided in the uppermost surface of the laminated soft member 1 is demonstrated. The inlet 2 may be disposed between the laminated soft members 1. Note that the IC tag TG of the present invention is applicable even when the mounting surface is not made of metal.

Moreover, in this embodiment, the case where the inlet 2 was fixed to the surface of the soft member 1 by whole surface adhesion was illustrated. Instead of this, the inlet 2 may be fixed to the soft member 1 partially, for example, only in the vicinity of the IC chip 22. In consideration of protection of the IC chip 22, it is preferable that the difference in line length between the upper and lower surfaces of the soft member 1 to which the IC chip 22 is attached as described above is as small as possible. It is preferable to make the thickness of the soft member 1 for fixing 2 the smallest.
Moreover, the soft member 1 to be laminated may be made of the same material, or may be made of other materials. Further, a reinforcing member may be arranged around the IC chip 22 for the purpose of reducing the physical load from the top of the inlet 2.

(Effect of this embodiment)
(1) The IC tag TG stacks a plurality of plate-like soft members 1 in a state where interlayer slip is permitted, and an inlet 2 having an IC chip 22 and an antenna 23 between the stacked soft members 1 or It arrange | positions above the laminated | stacked soft member 1. FIG. Furthermore, the outer packaging material 3 which accommodates the laminated | stacked soft member 1 and the inlet 2 inside is provided.
By laminating a plurality of soft members 1 in a state in which interlayer slip is allowed, followability to the tag mounting surface is improved and peeling becomes difficult, and bending stress to the IC chip 22 can be reduced. . Moreover, by accommodating in the exterior material 3, even if it laminates | stacks in the state which permitted the interlayer slip, relative displacement can be made small.

(2) One or two or more soft members 1 interposed between the mounting surface side of the IC tag TG and the inlet 2 are made of a flexible dielectric.
Thereby, even if the tag mounting surface is made of metal, the influence of the communication performance due to the metal can be suppressed. The thickness of the soft member 1 made of an intervening dielectric is set in consideration of the dielectric constant of the material. And what is necessary is just to determine the number of layers of the soft member 1 interposed according to required thickness. In this configuration, even if the soft member under the inlet 2 becomes thick, the bending rigidity can be lowered, so that it is difficult to peel off.

(3) Displacement restricting means for restricting displacement between the laminated soft members 1 is provided.
By providing the displacement regulating means, even when the IC tag TG is bent, it is possible to maintain the state facing the soft member 1 in which the IC tag TG of the inlet 2 and the antenna 23 are laminated in the thickness direction.
(4) The displacement restricting means fixes a part of the overlapping soft members 1.
As a result, the soft members 1 can be fixed (displacement restriction) in a state in which interlayer slip is allowed.

(5) The fixing is performed only at a position overlapping with the position of the IC chip 22 in the longitudinal direction in the longitudinal direction.
The fixed position has a relatively high bending rigidity. By arranging the IC chip 22 at the high position, it becomes possible to achieve both the ease of bending as described above and the protection of the IC chip 22. In general, the IC chip 22 tends to be arranged at the center in the longitudinal direction.
(6) The above-described fixing is fixing by fixing one of an adhesive, a pressure-sensitive adhesive, and heat fitting.
As a result, it can be easily fixed, and it is easy to deal with mass production.

(7) The fixing is composed of a fitting structure formed in a portion to be fixed.
By fixing between the soft members 1 with a fitting structure composed of a set such as an unevenness, an adhesive or heat load is not necessarily required for fixing.
(8) The fixing is realized by pressing the entire laminated soft member 1 with a sealing material at a fixing portion.
By laminating with a sealing material, the laminated soft members 1 can be fixed at a time.
(9) At least one of the uppermost layer and the lowermost layer of the laminated soft member 1 constitutes the exterior material 3.
As a result, the thickness of the exterior material 3 minutes can be reduced.

(10) The exterior material 3 includes a pair of exterior members 3a and 3b having a larger area than the soft member 1, and is formed by joining the outer peripheral portions of the pair of exterior members 3a and 3b. The inlet 2 and the soft member 1 having the above-described configuration are accommodated in a bag-shaped exterior material 3.
As a result, the exterior members 3a and 3b can be accommodated.
(11) The exterior material 3 is made of a material having an elastic modulus equal to or lower than that of the material constituting the soft member 1.
As a result, an increase in bending force due to the exterior material 3 can be reduced.
(12) An adhesive layer for attachment is formed on a part of the outer surface of the exterior material 3.
As a result, the IC tag TG can be attached to the tag mounting surface.

DESCRIPTION OF SYMBOLS 1 Soft member 2 Inlet 21 Base base material 22 IC chip 23 Antenna 3 Exterior material 3a Exterior member 3b Exterior member 4 Adhesive 5 Film 6 Double-sided tape 7a Convex part 7b Concave part 8 Rising part TG Tag X, X1, X2, X3 Fixed position

Claims (12)

  A plurality of plate-like soft members are laminated in a state where interlayer slip is allowed, and an inlet having an IC chip and an antenna is disposed between the laminated soft members or above the laminated soft members, and An IC tag comprising: an exterior material that accommodates the laminated soft member and inlet.   2. The at least one soft member is interposed between a mounting surface side of the IC tag and the inlet, and the interposed soft member is made of a flexible dielectric. IC tag described in 1.   The IC tag according to claim 1, further comprising a displacement restricting unit that restricts displacement between the laminated soft members.   4. The IC tag according to claim 3, wherein the displacement restricting means fixes a part of the overlapping soft members.   5. The IC tag according to claim 4, wherein the fixing is performed only at a position overlapping with the position of the IC chip in the longitudinal direction in the longitudinal direction.   6. The IC tag according to claim 4 or 5, wherein the fixing is a fixing part by any one of an adhesive, a pressure-sensitive adhesive, and heat fitting.   The IC tag according to any one of claims 4 to 6, wherein the fixing includes a fitting structure formed in a portion to be fixed.   The IC tag according to any one of claims 4 to 7, wherein the fixing is realized by pressing a whole laminated soft member with a sealing material at a fixing portion.   9. The IC tag according to claim 1, wherein at least one of the uppermost layer and the lowermost layer of the laminated soft members constitutes the exterior material.   The exterior material includes a pair of exterior members having a larger area than that of the soft member, and is formed by joining outer peripheral portions of the pair of exterior members, and the inlet having the above-described configuration is formed in the formed bag-shaped exterior material. The IC tag according to any one of claims 1 to 9, wherein a soft member is accommodated.   The IC tag according to any one of claims 1 to 10, wherein the exterior material is made of a material having a modulus of elasticity equal to or less than that of a material constituting the soft member. The IC tag according to any one of claims 1 to 11, wherein an adhesive layer for attachment is formed on a part of the outer surface of the exterior material.

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