JP5675487B2 - Component mounting system, component mounting method, program, recording medium - Google Patents

Description

  The present invention relates to a component mounting technique for mounting a component on a board, and more particularly to a technique for controlling a mounting position of a component on a board.

  In Patent Document 1, a component mounting system is known in which a plurality of component mounting machines are arranged along a board conveyance path. In this component mounting system, each component mounter mounts components on a single board that moves in sequence between a plurality of component mounters. In other words, in this component mounting system, a plurality of mounting processing positions where component mounting can be performed on a board are provided, and each mounting processing position is arranged on one board that sequentially moves these mounting processing positions. Component mounting is performed in a shared manner.

JP 2004-319719 A

  At this time, the mounting position accuracy with respect to the mounting target position required when mounting each component is determined, and it is necessary to mount the component within a range that satisfies the mounting position accuracy at each mounting processing position. However, the mounting position error with respect to the mounting target position when actually mounting a component differs at each mounting processing position. For example, mount a component that requires strict mounting position accuracy at a mounting processing position with a large mounting position error. That is not appropriate. Therefore, it is conceivable to optimize the distribution of the mounting components to each mounting processing position by determining the mounting components shared by each mounting processing position according to the mounting position error of the mounting processing position.

  However, the mounting position error at the mounting processing position may change over time due to a temperature change or the like. In this case, as a result of such a change in the mounting position error with time, there is a problem in that a defective board that does not satisfy the mounting position accuracy required for each component at each mounting target position may occur.

The present invention has been made in view of the above-described problems, and maintains the distribution of the mounting components to each mounting processing position in an appropriate state regardless of a change in the mounting position error of the mounting processing position over time. An object of the present invention is to provide a technology that enables mounting that satisfies the mounting position accuracy required for each component at a target position.

A component mounting system according to the present invention includes a mounting processing unit capable of mounting a component on a substrate at each mounting processing position while moving the substrate between a plurality of mounting processing positions. A component mounting system for mounting a plurality of components on a substrate of the same, in order to achieve the above object, a measurement unit for measuring the position of the component mounted on the substrate by the mounting processing unit, and a measurement result of the measurement unit A mounting error acquisition unit that obtains a mounting position error with respect to the mounting target position of the component mounted at the mounting processing position in association with each mounting processing position for each mounting target position of the component, and is required when mounting the component. that the mounting position accuracy with respect to the mounting target position, a storage unit for storing each mounting target position of the component, based on the result of comparison with the mounting position accuracy and mounting position error for each mounting target position of the component, a plurality of mounting processing position The implementation process position for mounting from among further comprising a mounting position determining section for performing a mounting position determining process of determining for each mounting target position of the part, each of the plurality of parts, mounting target position of the mounting position determination unit components The mounting processing position is determined at each mounting processing position, and the mounting processing unit mounts the corresponding mounting target position on the board .

In addition, the component mounting method according to the present invention includes a plurality of mounting processes on a single board using a mounting processing unit that can mount a component on the board at each mounting processing position while moving the board between a plurality of mounting processing positions. In order to achieve the above object, the mounting processing unit measures the position of the component mounted on the board by the mounting processing unit, and the mounting based on the measurement result in the measuring process. A mounting error acquisition step for obtaining a mounting position error with respect to a mounting target position of a component mounted at a processing position in association with each mounting processing position for each mounting target position of the component, and a mounting target required when mounting the component based on the result of comparison mounting position accuracy for the position and the mounting position error for each mounting target position of the component, the real to determine the mounting process position for mounting from the plurality of mounting processing position for each mounting target position of the component A position determination step, each of the plurality of parts, at has been implemented processing position determined by the mounting position determining step, as characterized by comprising a component mounting step of mounting the mounting unit to a corresponding mounting target position on the substrate Yes.

In addition, the program according to the present invention uses a computer to mount one component on a mounting processing unit capable of mounting a component on the substrate at each mounting processing position while moving the substrate between a plurality of mounting processing positions. A program for executing mounting of a plurality of components, in order to achieve the above object, a measurement process for measuring the position of a component mounted on a substrate by a mounting processing unit, and a measurement result in the measurement process Based on the mounting error acquisition step for obtaining the mounting position error relative to the mounting target position of the component mounted at the mounting processing position with each mounting processing position for each mounting target position of the component, and when mounting the component based on the mounting position accuracy and the mounting position error and the result of comparison for each mounting target position of the component a with respect to the required mounting target position, mounting process for mounting from the plurality of mounting processing position Implementation and mounting position determining step of determining a location for each mounting target position of the component, each of the plurality of parts, at the mounting position determining step is determined by the mounting processing position, the operation of mounting to the mounting target positions corresponding in the substrate A component mounting process to be executed by the processing unit is executed by a computer.

  A recording medium according to the present invention is characterized by recording the above program.

  In the invention configured as above (component mounting system, component mounting method, program, recording medium), the position of the component actually mounted on the board is measured by the mounting processing unit, and the mounting processing is performed based on the measurement result. The mounting position error of the component mounted at the position is obtained in association with each mounting processing position for each component. Then, based on the result of comparing the mounting position error and the mounting position accuracy for each component, a mounting processing position for mounting from among a plurality of mounting processing positions is determined for each component (mounting position determination processing). In other words, the result of obtaining the mounting position error by measuring the position of the component actually mounted at each mounting processing position is fed back to the mounting position determination process. Therefore, even if the mounting position error at each mounting processing position changes with time, the mounting position error after the change can be reflected in the mounting position determination process. Therefore, the mounting position accuracy required for each component at each mounting target position is maintained by maintaining the distribution of the mounting parts to each mounting processing position in an appropriate state, regardless of the time-dependent change in the mounting position error at the mounting processing position. Implementation that satisfies the requirements is possible.

At this time, the mounting position determination process is performed by comparing the mounting position accuracy and the mounting position error for each mounting target position of the component , and as a result, the mounting processing position determined to have been mounted with the mounting position error equal to or lower than the mounting position accuracy. In this case, the component mounting system may be configured so that the process determines to mount the component at the corresponding mounting target position . Accordingly, in the component mounting after the mounting position determination process is executed, it is possible to mount the component within the range of the mounting position accuracy, which is preferable.

Further, the mounting position determining unit, the components mounted on the substrate, the mounting position error exceeds a predetermined percentage of the mounting position accuracy or the mounting position accuracy, and if it is found from the measurement result of the measuring unit, the mounting position The component mounting system may be configured to perform the determination process. As a result, even if a defective mounting component whose mounting position error exceeds the mounting position accuracy appears, it is possible to mount the component within the range of the mounting position accuracy in the subsequent component mounting, which is preferable.

  Regardless of the time-dependent change in the mounting position error of the mounting processing position, the mounting position accuracy required for each component at each mounting target position is maintained by maintaining the appropriate distribution of the mounting parts to each mounting processing position. Satisfactory implementation is possible.

It is a block diagram which shows an example of a structure of the component mounting system concerning this invention. It is a layout figure which shows an example of the surface mounting machine with which the component mounting system of FIG. 1 is provided. It is a figure which shows an example of the mounting precision data memorize | stored in memory as a table | surface. It is a flowchart which shows an example of operation | movement of a surface mounter. It is a flowchart which shows an example of operation | movement of an inspection machine. It is a flowchart which shows an example of operation | movement of a server. The figure which shows an example of the mounting error data accumulate | stored in the memory of the server as a table | surface. It is a figure which shows an example of the mounting data after redistribution. It is a flowchart which shows the modification of operation | movement of a server.

  FIG. 1 is a block diagram showing an example of the configuration of a component mounting system according to the present invention. FIG. 2 is a layout diagram illustrating an example of a surface mounter provided in the component mounting system of FIG. This component mounting system MS is disposed on the downstream side of the surface mounter 1 and the surface mounter 1 capable of mounting components on the substrate B at a plurality (three locations) of mounting processing positions MPa to MPc (FIG. 2). An inspection machine 91 that inspects the board B on which component mounting on the mounting machine 1 has been completed, and a server 93 that comprehensively controls the operations of the surface mounting machine 1 and the inspection machine 91 are configured. In this component mounting system MS, in addition to the surface mounting machine 1 and the inspection machine 91, a printing machine and a board carry-in device are arranged on the upstream side of the surface mounting machine 1, and a reflow furnace and the like are arranged on the downstream side of the inspection machine 91. Hereinafter, the configuration / operation of the surface mounter 1 will be described with reference to FIGS. 1 and 2, and then the configuration / operation according to the present invention of the component mounting system MS including the inspection machine 91 and the server 93 will be described.

  The surface mounting machine 1 has a configuration in which components can be mounted on the substrate B at each mounting processing position MPa to MPc while moving the substrate B between three mounting processing positions MPa to MPc. The mounting of a plurality of components on the substrate B is performed at three mounting processing positions MPa to MPc. Further, the surface mounter 1 is equipped with a mounter controller 3, and this mounter controller 3 controls the operation of the entire surface mounter 1. The mounting machine controller 3 includes a calculation processing unit 31 including a CPU (Central Processing Unit) and the like. The calculation processing unit 31 manages the entire mounting machine controller 3 and, as necessary, The communication between the surface mounter 1 and the outside via the communication unit CP is controlled. Further, the mounting machine controller 3 includes a mounting program storage unit 32 that stores a mounting program for controlling component mounting executed by the surface mounting machine 1, a board transport unit 21 that is each drive system provided in the surface mounting machine 1, and And a drive control unit 33 that controls the component conveying unit 22.

  In the surface mounter 1, as shown in FIG. 2, the substrate B is transported in the (+ X) direction from the upstream side (right hand side in FIG. 2) of the substrate transport path TP by the main transport mechanism of the substrate transport unit 21 (FIG. 1). Is done. In this embodiment, it is possible to temporarily stop the substrate B at a stop position on the substrate transfer path TP, and the main transfer mechanism from the drive control unit 33 of the mounter controller 3 that controls the entire mounter 1. It operates according to the operation command and stops the substrate B at each stop position or transports the substrate B in the downstream direction (+ X) from the stop position. In this embodiment, as will be described later, five stop positions corresponding to the provision of the carry-in stage 5a, the three mounting tables 4a to 4c, and the carry-out stage 5b, that is, the carry-in position SPin and the first to third standby positions SP1. ~ SP3 and unloading position SPout are set. In addition, the white arrow in FIG.

  Among these stop positions, the carry-in position SPin is set on the most upstream side of the substrate transport path TP. The unprocessed board B before being subjected to the component mounting process by the component mounting system MS is carried into the carry-in position SPin from an upstream machine (not shown). In this embodiment, a carry-in stage 5a for receiving the carry-in substrate B into the surface mounter 1 is provided corresponding to the carry-in position SPin. This carry-in stage 5a has a pair of conveyor rails 51, 51, and the conveyor width of the rails 51, 51 is set to the size of the board B by the rail drive mechanism for the carry-in stage 5a that constitutes a part of the board transfer section 21. It can be changed accordingly. The carry-in stage 5a is reciprocally movable between a carry-in position SPin and a retreat position away from the carry-in position SPin in the (+ Y) direction side (lower side in the figure) by the stage driving mechanism of the substrate carrying unit 21. ing. Then, the carry-in stage 5a is moved to the carry-in position SPin when the substrate is transported by the stage drive mechanism, and the substrate B can be received and sent out by the main transport mechanism. On the other hand, the carry-in stage 5a is moved to the retracted position when the substrate transfer is completed.

  A first standby position SP1 is set downstream of the carry-in position SPin. A first mounting table 4a is provided on the (+ Y) direction side (the lower side in the figure) of the first standby position SP1. On the first mounting table 4a, a mounting stage 6a having the same configuration as the carry-in stage 5a is arranged. That is, the mounting stage 6 a is provided with a pair of conveyor rails 61, 61, and the conveyor width of the rails 61, 61 is set to the substrate B by the rail driving mechanism for the mounting stage 6 a that constitutes a part of the substrate transport unit 21. It can be changed according to the size. Further, the mounting stage 6a is moved from the first standby position SP1 and the first standby position SP1 to the (+ Y) direction side (the lower side in the figure) by the stage driving mechanism for the mounting stage 6a that constitutes a part of the substrate transport unit 21. It can freely reciprocate between a distant mounting position (solid line position in FIG. 2). When the mounting stage 6a receives the substrate B at the first standby position SP1, the mounting stage 6a moves to the (+ Y) direction side while holding the substrate B at an appropriate timing, and moves the substrate B to the mounting processing position MPa. Fix it.

  In the first mounting table 4a, a plurality of electronic component supply devices (for example, a tape feeder) 7a and a head unit 8a are provided to mount electronic components on the substrate B on the mounting stage 6a. The plurality of electronic component supply devices 7a are arranged side by side in the X direction on the opposite side of the substrate transport path TP from the mounting processing position MPa. Further, the head unit 8a is provided so as to be movable in the X direction and the Y direction, and the head unit 8a is moved in the X direction and the Y direction by the head unit driving mechanism for the head unit 8a that constitutes a part of the component transport unit 22. Is moved back and forth between the electronic component supply device 7a and the mounting processing position MPa, and the suction nozzle provided at the lower end is provided in the head unit 8a corresponding to the plurality of heads mounted on the head unit 8a. A Z-axis servo motor that moves up and down in the axial direction and an R-axis servo motor that rotates and positions in the R-axis direction are also operated to mount a plurality of electronic components from the electronic component supply device 7a at predetermined positions on the substrate B (Z-axis). Servo motors and R-axis servo motors also form part of the component transport unit 22). When this mounting process is completed, the substrate B is returned to the first standby position SP1 in the reverse procedure to the above, and the substrate B is transported downstream, that is, in the (+ X) direction at an appropriate timing.

  A second standby position SP2 is set on the downstream (+ X direction) side of the first standby position SP1. A second mounting table 4b is provided on the (−Y) direction side (the upper side in FIG. 2) of the second standby position SP2, and a mounting stage 6b and a pair of conveyor rails are provided with respect to the second mounting table 4b. 61, 61, a plurality of electronic component supply devices 7b, and a head unit 8b are provided. The arrangement of these components 6b to 8b is reversed in the Y direction from the arrangement of the components 6a to 8a provided in the first mounting table 4a, but the basic configuration and operation are the same. That is, the mounting stage 6b is moved from the second standby position SP2 and the second standby position SP2 in the (−Y) direction side (upper side in FIG. 2) by the stage driving mechanism for the second mounting table 4b that constitutes a part of the substrate transport unit 21. It is possible to reciprocate freely between the mounting processing position MPb which is far away from (). When the mounting stage 6b receives the substrate B at the second standby position SP2, the mounting stage 6b moves to the (−Y) direction side at an appropriate timing, and fixes the substrate B at the mounting processing position MPb. In the second mounting table 4b, in order to mount electronic components on the substrate B on the mounting stage 6b, a plurality of electronic component supply devices (for example, tape feeders) 7b are opposite to the substrate transport path TP with respect to the mounting position. Are arranged side by side in the X direction. In addition, the head unit 8b is provided so as to be movable in the X direction and the Y direction, and the head unit 8b is moved in the X direction and the Y direction by the head unit driving mechanism for the head unit 8b that constitutes a part of the component transport unit 22. And the reciprocating movement between the electronic component supply device 7a and the mounting processing position MPa is provided in the head unit 8b corresponding to a plurality of heads mounted in the head unit 8b, and the suction nozzle provided in the lower end is set to Z The Z-axis servo motor that moves up and down in the axial direction and the R-axis servo motor that rotates and positions in the R-axis direction are also operated to reciprocate between the electronic component supply device 7b and the mounting processing position MPb, and the electronic component supply device 7b. A plurality of electronic components are mounted at predetermined positions on the substrate B. When this mounting process is completed, the substrate B is returned to the second standby position SP2 in the reverse procedure to the above, and the substrate B is transported downstream, that is, in the (+ X) direction at an appropriate timing.

  A third standby position SP3 is set on the downstream side (+ X direction) of the second standby position SP2. Then, on the (+ Y) direction side (lower side in FIG. 2) of the third standby position SP3, the same configuration as the first mounting table 4a (tape feeder 7a, head unit 8a, and tape feeder corresponding to the mounting stage 6a). 7c, head unit 8c, and mounting stage 6c, as well as the head unit drive mechanism, multiple heads, Z-axis servo motor, R-axis servo motor, stage drive mechanism, conveyor rails 61 and 61, rail drive mechanism, etc.) A third mounting table 4c is provided, and electronic components are mounted on the board B at the mounting processing position MPc by the same operation as the first mounting table 4a. When the mounting process is completed, the mounting stage 6c moves in the (−Y) direction to return the substrate B to the third standby position SP3, and further, the substrate B is transported downstream, that is, in the (+ X) direction at an appropriate timing. Is done.

  Further, the unloading position SPout is set on the downstream side (+ X direction) of the third standby position SP3, that is, on the most downstream side of the substrate transport path TP. A carry-out stage 5b having the same configuration as the carry-in stage 5a is provided on the (−Y) direction side (the upper side in FIG. 2) of the carry-out position SPout. The carry-out stage 5b has a pair of conveyor rails 51 and 51, and the conveyor width of the rails 51 and 51 can be changed according to the size of the substrate B by a rail driving mechanism that constitutes a part of the substrate transport unit 21. It has become. Further, the carry-out stage 5b is moved away from the carry-out position SPout and the carry-out position SPout in the (−Y) direction side (upper side in FIG. 2) by a stage driving mechanism that constitutes a part of the substrate carrying unit 21 (FIG. 2). The position can be moved back and forth between (solid line position). Then, the carry-out stage 5b is moved to the carry-out position SPout when the substrate is transported by the stage drive mechanism, and the substrate B can be received by the main transport mechanism. On the other hand, the unloading stage 5b is moved to the retracted position when the substrate transport is completed.

  As described above, the surface mounter 1 executes the mounting at the mounting target positions corresponding to each of the plurality of components on the single board B by sharing the mounting processing positions MPa to MPc. At this time, the components indicating the mounting processing positions MPa to MPc and information indicating the corresponding mounting target positions are stored in the mounting program storage unit 32 as “mounting data”. In this embodiment, the mounting data is obtained by the server 93 based on the result of inspecting the board B on which the component is mounted by the surface mounting machine 1 by the inspection machine 91. This operation will be described in detail through the description of the overall configuration of the component mounting system MS.

  As shown in FIG. 1, in the component mounting system MS, the configuration related to the present invention includes a surface mounter 1, an inspection device 91, and a server 93. The surface mounter 1, the inspection device 91, and the server 93 are connected to a local area network LAN via a communication unit CP included in each. Various data, information, and the like can be communicated via the local area network LAN between the surface mounter 1, the inspection machine 91, and the server 93. In this embodiment, communication is performed using a wired LAN, but the communication method and mode are not limited to this.

  As described above, the board B on which components are mounted by the surface mounter 1 is inspected by the inspection machine 91. The inspection machine 91 includes a camera 911 and an inspection machine controller 912. The camera 911 photographs the surface of the substrate B that has been transported from the surface mounter 1 to the inspection machine 91. The inspection machine controller 912 includes an arithmetic processing unit 9121 composed of a CPU and the like. The arithmetic processing unit 9121 is used to manage the entire inspection machine controller 912 and, if necessary, through the communication unit CP. The inspection machine 91 and the outside communicate with each other. Furthermore, the inspection machine controller 912 includes an inspection program storage unit 9122 that stores an inspection program that controls an inspection executed by the inspection machine 91, and an image processing unit 9123 that performs image processing on the imaging result of the camera 911. .

  Then, the arithmetic processing unit 9121 causes the camera 911 to perform imaging according to the inspection program received from the server 93 and stored in the inspection program storage unit 9122. Accordingly, the camera 911 captures an image of the surface of the board B on which the component is mounted by the surface mounter 1. In this way, the image captured by the camera 911 is output to the image processing unit 9123. On the other hand, the image processing unit 9123 analyzes the received image to obtain the mounting position of the component on the board B. The mounting positions of the components are obtained in association with the mounting processing positions MPa to MPc for each component mounted on the board B. For example, when 10 components with mounting numbers 1 to 10 are mounted on the substrate B, the mounting position of the component on the substrate B and the mounting of the component among the mounting processing positions MPa to MPc are shared. The mounted processing position is obtained for each of the ten components.

  Subsequently, the arithmetic processing unit 9121 determines the mounting position of each component based on the actual mounting position of each component obtained by the image processing unit 9123 and the mounting target position data that is the position where each component is to be mounted. An error with respect to the mounting target position is calculated. This mounting position error is obtained in association with the mounting processing positions MPa to MPc for each individual component mounted on the board B (= for each mounting target position). That is, when 10 components with the mounting numbers 1 to 10 are mounted on the board B, the mounting position error of the components on the board B and the mounting process in which the components are mounted among the mounting processing positions MPa to MPc. A position is determined for each of the ten parts. The mounting position error associated with the mounting processing positions MPa to MPc and obtained for each individual component is transmitted as “mounting error data” from the inspection machine 91 to the server 93.

  The server 93 is configured by a personal computer, and includes an arithmetic processing unit 931 and a memory 932 configured by a CPU and the like in addition to the communication unit CP. Further, the server 93 is provided with a driver (not shown) capable of reading information recorded on a recording medium such as an optical disc such as a CD (Compact Disc) or DVD (Digital Versatile Disc) or a USB (Universal Serial Bus) memory. ing. In the recording medium 95, a control program 97 for causing the server 93 to execute the control operation of the surface mounter 1 and the inspection machine 91 is recorded. Accordingly, the server 93 operates in accordance with the contents of the control program 97 and executes control of the surface mounter 1 and the inspection machine 91, and the like.

  When the server 93 configured as described above receives the mounting error data from the inspection machine 91, the server 93 stores and stores the mounting error data in the memory 932. Based on the mounting error data, the server 93 performs mounting data in the following procedure. Create First, the server 93 treats the mounting position accuracy required when mounting a component for each component (even if the component number is the same, if the mounting target position is different, the server 93 treats it as a separate component. In other words, the mounting accuracy data shown in FIG. 5 is compared with the mounting error data which is the mounting result at the mounting processing positions MPa to MPc. This accuracy data can be stored and accumulated in the memory 932 together with the mounting error data. Subsequently, the server 93 obtains mountable mounting processing positions for each component from the mounting processing positions MPa to MPc.

  A specific example of mounting 10 components of mounting numbers 1 to 10 on the board B is as follows. FIG. 3 is a table showing an example of mounting accuracy data stored in the memory. In the figure, “part number” is an identification number assigned to each part in accordance with the type of part such as a capacitor or resistor and the difference in part dimensions. Parts having the same part number are different in type and dimension. While the same, parts having different part numbers differ in type or size. As shown in the figure, in the memory 932, a mounting target position (mounting target coordinate X, mounting target coordinate Y) and required accuracy (required accuracy X, required accuracy Y) are provided for each component of the mounting numbers 1 to 10. Associated and stored. Here, the mounting target coordinate X is a coordinate on the X axis, the mounting target coordinate Y is a coordinate on the Y axis, the required accuracy X is the required accuracy on the X axis, and the required accuracy Y is Y This is the required accuracy on the axis. In the specific example of FIG. 3, even if the components have the same component number, the required accuracy differs if the mounting target position is different.

  As a result of comparing the mounting error data with the mounting accuracy data, the mounting position error of the component of mounting number 1 at the mounting processing positions MPa, MPb, and MPc is “10”, “20”, “40” (unit: μm). The mounting processing positions MPa and MPb having mounting position errors equal to or lower than the required accuracy “30” (unit μm) of the component of mounting number 1 are selected as mounting processing position candidates that share mounting of the component of mounting number 1. (Such mounting processing positions MPa and MPb are referred to as distribution candidates). Similarly, candidate mounting positions (distribution candidates) are selected for each of the other components having mounting numbers 2 to 10. Then, the mounting processing positions that actually share the mounting are determined for each component so that the mounting times at the mounting processing positions MPa to MPc are equalized. Thereby, for example, the mounting processing position for sharing the mounting of the component with mounting number 1 is determined as one of the distribution candidates MPa and MPb. In this way, the components that share the mounting are redistributed among the mounting processing positions MPa, MPb, and MPc.

  The mounting data newly created by redistribution by the server 93 is transmitted to the surface mounting machine 1 and stored in the mounting program storage unit 32 of the mounting machine controller 3. Then, the surface mounter 1 executes mounting of a predetermined component at a mounting target position at predetermined mounting processing positions MPa to MPc according to the mounting data.

  Subsequently, specific examples of the operations of the surface mounter 1, the inspection device 91, and the server 93 described above will be described with reference to flowcharts (FIGS. 4 to 6). FIG. 4 is a flowchart showing an example of the operation of the surface mounter. FIG. 5 is a flowchart showing an example of the operation of the inspection machine. FIG. 6 is a flowchart illustrating an example of the operation of the server. 4 to 6 are executed under the control of the server 93 based on the control program 97.

  As shown in FIG. 4, in the surface mounter 1, when production is started (step S101), N (mnt) indicating the number of mounted parts on the surface mounter 1 is set to “0” (step S102). ), The substrate B is carried in (step S103). In subsequent step S104, it is confirmed whether or not the mounting data change notification is received from the server 93. This mounting data change notification is transmitted to the surface mounting machine 1 when the server 93 redistributes the mounting data.

  When the mounting data change notification is received (in the case of “YES” in step S104), the process proceeds to step S105, the mounting data redistributed by the server 93 is stored in the mounting program storage unit 32, and the mounting data is regenerated. While being changed to the one after distribution (step S105), component mounting on the board B is executed at the mounting processing position MPa based on the mounting data after redistribution (step S106). On the other hand, if the mounting data change notification has not been received (in the case of “NO” in step S104), the process proceeds to step S106 as it is, and component mounting on the board B is executed without changing the mounting data ( Step S106).

  When the component mounting at the mounting processing position MPa in step S106 is completed, the process proceeds to step S107, and the mounting number N (mnt) on the surface mounting machine 1 is incremented by “1”. If the mounting number N (mnt) is less than or equal to the planned production number (step S108), a new board is carried in (step S103).

  In step S103, the substrate B is transported from the mounting processing position MPa to the mounting processing position MPb in synchronization with the board loading, and in the subsequent step S106, the next substrate B1 is mounted at the mounting processing position MPa. In parallel with this, mounting on the substrate B is performed at the mounting processing position MPb. This mounting on the board B is performed based on mounting data corresponding to the board B. When the component mounting on the board B1 at the mounting processing position MPa in step S106 is completed and the component mounting on the board B at the mounting processing position MPb is completed, steps S107 and S108 are performed, and the number N (mnt) of mounting is set. If the number is less than the planned production number (step S108), a new substrate (substrate B2) is carried in (step S103).

  In step S103, the substrate B1 is transported from the mounting processing position MPa to the mounting processing position MPb and the substrate B is transported from the mounting processing position MPb to the mounting processing position MPc in synchronization with the board loading, and in the subsequent step S106 The next substrate B2 is mounted at the mounting processing position MPa, and at the same time, mounting on the substrate B is performed based on mounting data corresponding to the substrate B at the mounting processing position MPc. Mounting is performed based on mounting data corresponding to the substrate B1 at the mounting processing position MPb. When the component mounting on the board B2 at the mounting processing position MPa, the board B1 at the mounting processing position MPb, and the board B at the mounting processing position MPc in step S106 is completed, steps S107 and S108 are performed, and the number N (mnt of mounting) ) Is less than or equal to the planned production number (step S108), a new substrate (substrate B3) is carried in (step S103), and the substrate B2 is moved from the mounting processing position MPa to the mounting processing position MPb in synchronism with this board loading. The board B1 is transported from the mounting processing position MPb to the mounting processing position MPc, and the board B is unloaded from the mounting processing position MPc to the downstream machine. Then, components are mounted on the boards B3 to B1 based on the mounting data corresponding to the boards B3 to B1 at the mounting processing positions MPa to MPc.

  In step S108, when the number N (mnt) of mounting is equal to or more than the planned number of production, loading of a new board is stopped, but mounting from the mounting processing position MPa to the mounting processing position MPb and mounting from the mounting processing position MPb is performed. The processing position MPc and the transporting and unloading of each board from the mounting processing position MPc to the downstream machine are performed in synchronization, mounting on each board at the mounting processing position MPb and the mounting processing position MPc, and the subsequent mounting processing position MPb. When the board processing at the mounting processing position MPc and the board processing from the mounting processing position MPc to the downstream machine are completed, the board mounting at the mounting processing position MPc and the board transporting from the mounting processing position MPc to the downstream machine are completed. The production ends (step S102). The above is the description of the flowchart showing the operation of the surface mounter 1.

  Next, a flowchart (FIG. 5) showing the operation of the inspection machine 91 will be described. As shown in FIG. 5, in the inspection machine 91, when production is started (step S201), N (insp) indicating the number of inspections in the inspection machine 91 is set to “0” (step S202). The substrate B is carried into the inspection machine 91 (step S203). Subsequently, the mounting positions of all the mounted components mounted on the substrate B are measured by the above-described method (step S204), and the mounting position errors with respect to the mounting target positions of all the mounted components are calculated (step S205). In this way, “mounting error data” indicating the mounting position error for each component in association with the mounting processing positions MPa to MPc is obtained.

  Although not specifically described above, the inspection device 91 determines whether the board is good or bad based on the mounting error data. Specifically, in the inspection machine 91, the mounting accuracy data for the mounting target position similar to that shown in FIG. 3 is stored in the built-in memory. In step S206, the mounting position error and the mounting position accuracy are compared for all the components mounted on the board B. In step S207, whether or not there is a component whose mounting position error exceeds the mounting position accuracy. Is judged. If such a component exists (in the case of “YES” in step S207), the process proceeds to step S208, and the board quality determination is performed. Specifically, the inspection machine 91 outputs an error signal, and an operator who perceives the error signal visually determines the quality of the substrate. Incidentally, as this error signal, an audio signal such as a buzzer or an image signal displayed on a display (not shown) provided in the inspection machine 91 can be used.

  Then, the substrate pass / fail determination in step S208 is completed, and the operator presses the return switch to proceed to step S209. The mounting error data obtained in step S205 is transmitted to the server 93. On the other hand, when it is determined in step S207 that there is no component whose mounting position error exceeds the mounting position accuracy (in the case of “NO” in step S207), the process proceeds to step S209 without performing the board quality determination. The mounting error data obtained in step S205 is transmitted to the server 93.

  Subsequently, the inspection number N (insp) in the inspection machine 91 is incremented by “1” (step S210), and the substrate B is unloaded from the inspection machine 91 (step S211). Steps S203 to S211 are repeatedly executed until the inspection number N (insp) is equal to or greater than the production plan number (step S212). Then, when the inspection number N (insp) becomes equal to or larger than the production plan number, the production is finished (step S213). The above is the description of the flowchart showing the operation of the inspection machine 91.

  Next, a flowchart (FIG. 6) showing the operation of the server 93 will be described. As shown in FIG. 6, when production is started (step S301), the server 93 sets N (insp) indicating the number of sheets to be inspected by the inspection machine 91 to “0” (step S302). The mounting error data is received from 91 as an inspection result (S303). The mounting error data is stored and accumulated in a memory 932 built in the server 93 (FIG. 7).

  FIG. 7 is a table showing an example of mounting error data accumulated in the memory of the server. In the figure, the case where 10 components of mounting numbers 1 to 10 are mounted on the substrate B is illustrated. As shown in the figure, in the memory 932, “component number” and “mounting position error” of each of the mounting numbers 1 to 10 mounted on the board B at the mounting processing position MPa are stored in association with each other. . The mounting position error is accumulated in the memory 932 every time it is newly measured. For example, the mounting position error of the component with the mounting number 1 mounted at the mounting processing position MPa is measured as “20”, “15”,..., “30” for the first, second,. It is remembered. Further, these average values are also calculated and stored in the memory 932 as average mounting errors. Similarly, the “part number” and the “mounting position error” of each of the mounting numbers 1 to 10 are stored in association with each other for the mounting positions MPb and MPc.

  When the storage of the mounting error data in the memory 932 (step S303) is completed, the inspection number N (insp) is incremented by 1 (step S304), and whether the inspection number N (insp) is equal to or greater than the production planned number. Is determined (step S305). If the inspection number N (insp) is equal to or greater than the production planned number (“YES” in step S305), the process proceeds to step S309, where the production is finished, while the inspection number N (insp) is less than the production planned number. If (NO in step S305), the process proceeds to step S306.

  In step S306, it is determined whether or not mounting data redistribution is possible. In step S306, it is determined whether or not mounting error data necessary for mounting data redistribution is available. The role of this step S306 will be specifically described as follows.

  That is, in the example illustrated in FIG. 7, the mounting position errors for all the components having the mounting numbers 1 to 10 are stored in the memory 932 for all the three mounting processing positions MPa to MPc. However, the mounting of the ten components on one board B is performed at the mounting processing positions MPa to MPc. Therefore, for example, if component mounting is performed using mounting data for mounting three components at the mounting processing position MPa, the mounting position error of the mounting processing position MPa obtained by inspecting one board B is as follows. Only for 3 parts. Therefore, for the mounting position error of the mounting processing position MPa for the remaining seven components, it is necessary to inspect the board B on which the components are mounted based on other mounting data. Actually, when the setup work is performed in accordance with the change of the electronic component supply device 7a (tape feeder) or the like, and the mounting data is changed in accordance with this, the mounting process for these remaining seven components is performed. The mounting position error at the position MPa is measured and stored in the memory 932.

  Due to such circumstances, the mounting position errors for all the components having the mounting numbers 1 to 10 are not necessarily stored in the memory 932 for all of the three mounting processing positions MPa to MPc. Therefore, in step S306, it is determined whether mounting error data necessary for redistribution is available. Specifically, whether or not mounting position errors at a plurality of mounting processing positions are stored in the memory 932 is determined for each component. Here, when only the mounting position error at a single mounting processing position is stored in the memory 932 for all the components, it is impossible to perform redistribution, and the process proceeds from step S306 to step S303. Return. On the other hand, if mounting position errors at a plurality of mounting processing positions are stored in the memory 932 for at least one component, a plurality of mounting processing positions can be selected as distribution candidates for this component. In step S306, it is determined that redistribution is possible (determined as “YES”), and the process proceeds to step S307.

  In step S307, the mounting data is redistributed (mounting position determination process). Specifically, among the mounting position errors stored in the memory 932, the latest (most recently measured) mounting position error and the mounting position accuracy are compared for each component. In the same manner as described above, distribution candidates are selected from the mounting processing positions MPa to MPc, and the mounting is actually performed from among the distribution candidates so that the mounting times at the mounting processing positions MPa to MPc are equalized. A mounting processing position to be shared is determined for each component. FIG. 8 is a diagram illustrating an example of the mounting data after redistribution. In the example of the figure, mounting of five components is shared at the mounting processing position MPa, mounting of three components is shared at the mounting processing position MPb, and mounting of two components is shared at the mounting processing position MPc. The implementation data has been redistributed. In subsequent step S308, the redistributed mounting data is transmitted to the surface mounting machine 1.

  As described above, in this embodiment, the position of the component actually mounted on the substrate B is measured by the surface mounter 1, and the components mounted at the mounting processing positions MPa to MPc based on the measurement result. The mounting position error is obtained in association with each mounting processing position MPa to MPc for each component. Based on the result of comparing the mounting position error and the mounting position accuracy for each component, a mounting processing position for mounting is determined for each component from among a plurality of mounting processing positions MPa to MPc (mounting data Redistribution). That is, the result of obtaining the mounting position error by measuring the position of the component actually mounted at each mounting processing position MPa to MPc is fed back to the mounting position determination process. Therefore, even if the mounting position errors at the mounting processing positions MPa to MPc change with time, the mounting position error after the change can be reflected in the mounting position determination process. Therefore, the distribution of the mounting components to the mounting processing positions MPa to MPc is maintained in an appropriate state regardless of the time-dependent change in the mounting position errors of the mounting processing positions MPa to MPc, and each component at each mounting target position. Mounting that satisfies the required mounting position accuracy is possible.

  Further, in the redistribution of the mounting data in this embodiment, the mounting position accuracy and the mounting position error are compared for each component. As a result, the mounting position accuracy is less than 100% (100% or less with respect to the mounting position accuracy and the variation in mounting is considered. In such a case, for example, the mounting position is determined to be mounted at a mounting processing position where it is determined that the component is mounted with a mounting position error of 80% or less, 70% or less, or 60% or less of the mounting position accuracy. doing. As a result, in the component mounting after the redistribution of the mounting data, it is possible to mount the component within the range of the mounting position accuracy even if there is a variation in mounting, which is preferable.

  As described above, in this embodiment, the component mounting system MS corresponds to the “component mounting system” of the present invention, the control program 97 corresponds to the “program” of the present invention, and the recording medium 95 corresponds to the “recording system” of the present invention. It corresponds to “medium”. Further, the surface mounting machine 1 corresponds to the “mounting processing section” of the present invention, the mounting processing positions MPa to MPc correspond to the “mounting processing position” of the present invention, and the inspection machine 91 corresponds to the “measurement section” “ It corresponds to a “mounting position error acquisition unit”, the memory 932 of the server 93 corresponds to the “storage unit” of the present invention, and the server 93 corresponds to the “mounting position determination unit” of the present invention. Step S204 corresponds to the “measurement step” of the present invention, step S205 corresponds to the “mounting error acquisition step” of the present invention, step S307 corresponds to the “mounting position determination step” of the present invention, and step S106. Corresponds to the “component mounting process” of the present invention.

  The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. For example, instead of FIG. 6 described above, the server 93 may be operated according to the flowchart shown in FIG. Here, FIG. 9 is a flowchart showing a modification of the operation of the server. The difference between the flowchart of FIG. 6 and the flowchart of FIG. 9 is only the step after step S305 (step S306 in FIG. 6 and step S310 in FIG. 9), so only this difference will be described here and the common parts will be described. Are denoted by corresponding reference numerals, and description thereof is omitted.

  According to the flowchart shown in FIG. 9, the server 93 executes step S310 following step S305, and determines whether or not there is a mounted component whose mounting position error exceeds the mounting position accuracy. Specifically, it is as follows. The server 93 compares the mounting accuracy data stored in the 932 memory with the mounting error data. From this comparison result, when the mounting position error of a certain component exceeds the mounting position accuracy required for the component, or exceeds a predetermined ratio (a ratio of greater than 0% and less than 100%) of the mounting position accuracy. If found, the server 93 modifies the mounting data so as to change the mounting processing position for sharing the mounting of the component.

  For example, if the mounting position error of the component with the mounting number 1 mounted at the mounting processing position MPa exceeds the mounting position accuracy required for the component, or if the mounting position error is taken into consideration If the mounting position accuracy exceeds a predetermined ratio such as 80%, 70%, or 60% of the mounting position accuracy, the mounting processing position sharing the mounting of the component of mounting number 1 is the mounting processing. The position is changed to either the position MPb or the mounting processing position MPc. That is, the component with the mounting number 1 that has been distributed to the mounting processing position MPa is redistributed to the mounting processing position MPb or the mounting processing position MPc, and the mounting data is corrected accordingly. For any component, when the mounting position error is within the range of the mounting position accuracy, the mounting position error is within 80%, 70%, or the like with respect to the mounting position accuracy in consideration of mounting variation. When it is within a predetermined ratio such as 60%, the server 93 does not particularly modify the mounting data. In such a configuration, even if a mounting failure error occurs when the mounting position error exceeds the mounting position accuracy or a predetermined percentage of the mounting position accuracy, the component must be within the range of the mounting position accuracy in the component mounting after redistribution. It can be mounted and is preferable.

  Moreover, in the said embodiment, component mounting to the board | substrate B was performed in three mounting process positions MPa-MPc. However, the number of mounting processing positions is not limited to three and may be two or more.

  In the above embodiment, the number of surface mounters 1 provided in the component mounting system MS is one. However, the number of surface mounters 1 included in the component mounting system MS is not limited to this, and may be plural. Therefore, for example, the component mounting system MS may be configured by arranging a plurality of surface mounters 1 having only one mounting processing position, and the component mounting system MS may be provided with a plurality of mounting processing positions.

  In the above embodiment, the number of components mounted on one board B is ten. However, this is merely an example, and the number of parts mounted on one board B is ten. Not limited.

  In the above embodiment, distribution candidates are selected from the mounting processing positions MPa to MPc for all the components mounted on the board B and redistributed to the mounting processing positions MPa to MPc. However, only a part of a plurality of components mounted on the board B can be redistributed to the mounting processing positions MPa to MPc.

  At this time, the components redistributed among the plurality of mounting processing positions MPa to MPc can be mounted at any of the mounting processing positions MPa to MPc so that the electronic component supply device 7a at the mounting processing positions MPa to MPc can be mounted. It is good to set in advance for all of ~ 7c.

  In the above embodiment, the mounting data redistributed by the server 93 is automatically transmitted to the mounting program storage unit 32 of the surface mounter 1 through the local area network LAN. However, the operator may check the mounting data redistributed by the server 93 and store it in the mounting program storage unit 32 of the surface mounting machine 1. In this case, the operator can change the settings of the electronic component supply devices 7a to 7c at the mounting processing positions MPa to MPc at the same time as storing the mounting data after redistribution in the mounting program storage unit 32. Therefore, it is not necessary to set the redistribution target parts in advance in all of the electronic component supply devices 7a to 7c at the mounting processing positions MPa to MPc.

  In the above embodiment, an example has been shown in which the required mounting position accuracy differs depending on the mounting target position even if the component type is the same. However, if the component type is the same, it is required even if there is a difference in the mounting target position. The mounting position accuracy may be the same. In this case, component types with low mounting position accuracy (that is, requiring strict mounting accuracy) are concentrated at mounting processing positions with high mounting accuracy, and mounting position accuracy is low (that is, mounting accuracy is not required so much). The component types may be appropriately redistributed to the mounting processing positions MPa to MPc so that the mounting times at the mounting processing positions MPa to MPc are equalized.

MS ... component mounting system B ... substrate 1 ... surface mounter 3 ... mounter controller 31 ... arithmetic processing unit 32 ... mounting program storage unit MPa ... mounting processing position MPb ... mounting processing position MPc ... mounting processing position 91 ... inspection machine 911 ... Camera 912 ... Inspection machine controller 9121 ... Operation processing unit 9122 ... Inspection program storage unit 93 ... Server 931 ... Operation processing unit 932 ... Memory 95 ... Recording medium 97 ... Control program

Claims (6)

A mounting processing unit capable of mounting a component on the substrate at each mounting processing position while moving the substrate between a plurality of mounting processing positions; In a component mounting system that mounts components,
A measuring unit for measuring the position of a component mounted on the substrate by the mounting processing unit;
Mounting based on the measurement result of the measurement unit, the mounting position error with respect to the mounting target position of the component mounted at the mounting processing position is associated with each mounting processing position for each mounting target position of the component An error acquisition unit;
A storage unit that stores mounting position accuracy for the mounting target position required when mounting the component for each mounting target position of the component;
Based on the result of comparing the mounting position accuracy and the mounting position error for each mounting target position of the component , the mounting processing position for mounting from among the plurality of mounting processing positions is determined as the mounting target of the component. further comprising a mounting position determining section for performing a mounting position determining process of determining for each location,
Each of the plurality of components is mounted by the mounting processing unit to the corresponding mounting target position on the substrate at the mounting processing position determined by the mounting position determining unit for each mounting target position of the component. Component mounting system characterized by In the mounting position determination process, as a result of comparing the mounting position accuracy and the mounting position error for each mounting target position of the component, it is determined that the component is mounted with the mounting position error equal to or lower than the mounting position accuracy. component mounting system according to claim 1 is a process of determining to perform mounting to the mounting target position corresponding of the component by the mounting processing position that is. The mounting position determining unit, for the component mounted on the substrate, wherein the mounting position error is the mounting position accuracy, or exceeds the predetermined ratio of the mounting position accuracy, if it is found from the measurement result of the measuring unit the component mounting system according to claim 1 or 2 performs the mounting position determination process. Component mounting method for mounting a plurality of components on a single substrate using a mounting processing unit capable of mounting components on the substrate at each mounting processing position while moving the substrate between a plurality of mounting processing positions In
A measuring step of measuring a position of a component mounted on the substrate by the mounting processing unit;
Based on the measurement result in the measurement step, a mounting position error with respect to the mounting target position of the component mounted at the mounting processing position is obtained in association with each mounting processing position for each mounting target position of the component. Mounting error acquisition process;
Based on the result of comparing the mounting position accuracy with respect to the mounting target position required when mounting the component and the mounting position error for each mounting target position of the component , from among the plurality of mounting processing positions. A mounting position determining step for determining the mounting processing position for mounting for each mounting target position of the component;
A component mounting step of mounting each of the plurality of components at the mounting processing position determined in the mounting position determination step by the mounting processing unit on the corresponding mounting target position on the substrate. Component mounting method. Mounting a plurality of components on a single board in a mounting processing unit capable of mounting components on the board at each mounting processing position while moving the board between a plurality of mounting processing positions using a computer In the program to be executed,
A measurement step for causing the measurement unit to measure the position of the component mounted on the substrate by the mounting processing unit;
Based on the measurement result in the measurement step, a mounting position error with respect to the mounting target position of the component mounted at the mounting processing position is obtained in association with each mounting processing position for each mounting target position of the component. Mounting error acquisition process;
Based on the result of comparing the mounting position accuracy with respect to the mounting target position required when mounting the component and the mounting position error for each mounting target position of the component , from among the plurality of mounting processing positions. A mounting position determining step for determining the mounting processing position for mounting for each mounting target position of the component;
A component mounting step for causing the mounting processing unit to perform an operation of mounting each of the plurality of components at the mounting processing position determined in the mounting position determining step to the corresponding mounting target position on the substrate ; A program characterized by being executed by a computer.   A recording medium on which the program according to claim 5 is recorded.

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