JP5414874B1

JP5414874B1 - Electronics

Info

Publication number: JP5414874B1
Application number: JP2012238531A
Authority: JP
Inventors: 浩渡辺
Original assignee: Mitsubishi Electric Corp
Current assignee: Mitsubishi Electric Corp
Priority date: 2012-10-30
Filing date: 2012-10-30
Publication date: 2014-02-12
Anticipated expiration: 2032-10-30
Also published as: JP2014090043A

Abstract

【課題】電子回路基板と別置きされた電気部品の電気的接続端子を、電子回路基板のスルーホールに簡単に挿入させられる電子機器を得る。
【解決手段】電気部品４１が実装されるベース部材１２上に、基板挿入ガイド３１が装着された電子回路基板２１を組み付けて電子機器１が形成される。その基板挿入ガイド３１は、スルーホール部２８に接続端子部４１ａを導く案内孔３２と、ベース部材１２側に突き出す位置決め本固定部（位置決め部）３４ａ、３４ｂを有し、その位置決め本固定部３４ａ、３４ｂをベース部材１２に設けた嵌合部５ａ、５ｂに嵌合させることで電子回路基板２１をベース部材１２上に位置決めし、接続端子部４１ａを案内孔３２に案内してスルーホール部２８の貫通孔に挿入させるよう構成される。
【選択図】図５An electronic device in which an electrical connection terminal of an electrical component placed separately from an electronic circuit board is easily inserted into a through hole of the electronic circuit board is obtained.
An electronic device is formed by assembling an electronic circuit board on which a board insertion guide is mounted on a base member on which an electrical component is mounted. The board insertion guide 31 includes a guide hole 32 that guides the connection terminal portion 41a to the through-hole portion 28, and positioning main fixing portions (positioning portions) 34a and 34b protruding to the base member 12 side, and the positioning main fixing portion 34a. , 34b are fitted into fitting portions 5a and 5b provided on the base member 12, so that the electronic circuit board 21 is positioned on the base member 12, and the connection terminal portion 41a is guided to the guide hole 32 and the through hole portion 28 is positioned. It is comprised so that it may insert in a through-hole.
[Selection] Figure 5

Description

本発明は、電子回路基板を筐体内に内蔵した電子機器に関する。 The present invention relates to an electronic device in which an electronic circuit board is built in a housing.

従来、筐体に電子回路基板を内蔵し、電子回路基板と別置きで配置された複数の電気部品の電気的接続端子を、電気的接続のため電子回路基板のスルーホールに挿入する際、この挿入をスムーズに行えるようにするため、電気的接続端子を誘い込む形状を有する基板挿入ガイドを使用した電子機器が知られている（例えば、特許文献１参照。）。
また、基板挿入ガイドを使用せずに電気部品の接続端子を電子回路基板のスルーホールに接続する電子機器も知られている。（例えば、特許文献２参照。）。 Conventionally, when an electronic circuit board is built in a casing and electrical connection terminals of a plurality of electrical components arranged separately from the electronic circuit board are inserted into through holes of the electronic circuit board for electrical connection, 2. Description of the Related Art An electronic device using a board insertion guide having a shape for guiding an electrical connection terminal in order to smoothly perform insertion is known (for example, see Patent Document 1).
There is also known an electronic device that connects a connection terminal of an electrical component to a through hole of an electronic circuit board without using a board insertion guide. (For example, refer to Patent Document 2).

特開２００４−８７６０５号公報（図１、図２。）Japanese Unexamined Patent Publication No. 2004-87605 (FIGS. 1 and 2) 国際出願番号ＰＣＴ／ＪＰ２０１２／０５７０３４（図４、図５。）International application number PCT / JP2012 / 057034 (FIGS. 4 and 5)

しかしながら、特許文献１記載の装置では、基板挿入ガイド（特許文献１内のガイド部材に相当。）がそれ自身に設けられた嵌合ピンにより、電子回路基板に装着されるだけなので、振動や経年変化で嵌合が緩み、基板挿入ガイドが電子回路基板から脱落することが懸念されるという問題点があった。
また、基板挿入ガイドを装着し、それを下側に向けた状態で電子回路基板を組み付けするとき、位置決め機構が無いので、多数ある電気的接続端子が基板挿入ガイドの端子挿入案内部に入る前に位置決めすることができず、それら電気的接続端子が基板挿入ガイドの端子挿入案内部内にスムーズ入るように組み付けるのは困難であった。 However, in the apparatus described in Patent Document 1, since the board insertion guide (corresponding to the guide member in Patent Document 1) is simply attached to the electronic circuit board by the fitting pin provided on itself, vibration and aging are caused. There has been a problem that the mating is loosened due to the change, and there is a concern that the board insertion guide may fall off the electronic circuit board.
Also, when mounting the board insertion guide and assembling the electronic circuit board with it facing downward, there is no positioning mechanism, so there are many electrical connection terminals before entering the terminal insertion guide part of the board insertion guide Therefore, it is difficult to assemble the electrical connection terminals so that the electrical connection terminals smoothly enter the terminal insertion guide portion of the board insertion guide.

位置決め機構無しでは、電気的接続端子の曲げバラツキと電子回路基板の組み付け姿勢（前後左右方向や回転、傾き）を加味した端子挿入案内部形状にしなければならず、基板挿入ガイドが大型化する。また、位置決め機構無しでは、組み付け作業性が悪く、作業者の組み付け方によっては、電気的接続端子を変形させてしまうというという問題点があった。
さらに、基板挿入ガイドが電子回路基板に密着して取り付けられているので、半田付け時、密着部の半田フィレット形成を阻害し、半田付け部の信頼性を低下させるという問題点があった。 Without the positioning mechanism, the shape of the terminal insertion guide must be made in consideration of the bending variation of the electrical connection terminals and the assembly posture of the electronic circuit board (front and rear, left and right directions, rotation and inclination), and the board insertion guide becomes large. Further, without the positioning mechanism, the assembling workability is poor, and there is a problem that the electrical connection terminal is deformed depending on how the worker is assembled.
Further, since the board insertion guide is attached in close contact with the electronic circuit board, there is a problem that the solder fillet formation at the close contact portion is hindered during soldering and the reliability of the soldered portion is lowered.

特許文献２記載の装置では、電子回路基板に基板挿入ガイドが装着されていない上、電子回路基板とは別置きで多品種の電気部品が配置されている。さらに、これら部品の電気的接続端子は一列に並んでいないので、電子回路基板のスルーホールにこれら端子を挿入するには手間がかかり、組み付け作業性が悪いという問題点があった。
また、電子回路基板を固定する支柱（特許文献２内のボスに相当。）は金属製であり、電子回路基板のその周囲は絶縁耐圧距離確保のため、場合によっては数ｍｍ前後の範囲の電子部品実装禁止領域が必要になり、基板小型化の障害になるという問題点があった。 In the apparatus described in Patent Document 2, a board insertion guide is not mounted on the electronic circuit board, and various types of electrical components are arranged separately from the electronic circuit board. Furthermore, since the electrical connection terminals of these components are not arranged in a line, it takes time to insert these terminals into the through holes of the electronic circuit board, and there is a problem that the assembly workability is poor.
Moreover, the support | pillar (equivalent to the boss | hub in patent document 2) which fixes an electronic circuit board is metal, and the circumference | surroundings of the electronic circuit board are the electronic of the range of about several millimeters depending on the case in order to ensure a withstand voltage distance. There is a problem that a component mounting prohibited area is required, which is an obstacle to downsizing of the board.

この発明は上記の課題を解消するためになされたものであり、電子回路基板と別置きされた電気部品の電気的接続端子を、電子回路基板のスルーホールに簡単に挿入できるようにし、組み立て性を向上させるとともに、構成部品の脱落防止を図り、信頼性を向上させ
た電子機器を得ることを目的とする。 The present invention has been made in order to solve the above-described problems, and enables an electrical connection terminal of an electrical component placed separately from an electronic circuit board to be easily inserted into a through-hole of the electronic circuit board, thereby making it easy to assemble. It is an object of the present invention to obtain an electronic device with improved reliability while preventing dropout of components.

この発明に係わる電子機器は、筺体を構成するベース部材、上記ベース部材上に固定され、上方に接続端子部が突出する電気部品、上記接続端子部が挿入されるスルーホール部を有し、上記電気部品と電気的に接続される電子回路基板、上記電子回路基板の上記スルーホール部を含む領域の裏面側に装着され、上記スルーホール部に上記接続端子部を導く案内孔と、上記ベース部材側に突き出す位置決め部を有し、上記位置決め部を上記ベース部材に設けた嵌合部に嵌合させることで上記電子回路基板を上記ベース部材上に位置決めし、上記接続端子部を上記案内孔に案内して上記スルーホール部に挿入させる基板挿入ガイドを備え、上記ベース部材は、上記電気部品の搭載面となる上面より突出した支柱を有し、上記支柱に上記基板挿入ガイドを介して上記電子回路基板が固定され、上記ベース部材に設けられた上記嵌合部は、上記電気部品の搭載面となる上面に設けられた凹部と、上記凹部の底面部から上面側に突出する上記支柱によって形成されたものである。
また、この発明に係わる電子機器は、筺体を構成するベース部材、上記ベース部材上に固定され、上方に接続端子部が突出する電気部品、上記接続端子部が挿入されるスルーホール部を有し、上記電気部品と電気的に接続される電子回路基板、上記電子回路基板の上記スルーホール部を含む領域の裏面側に装着され、上記スルーホール部に上記接続端子部を導く案内孔と、上記ベース部材側に突き出す位置決め部を有し、上記位置決め部を上記ベース部材に設けた嵌合部に嵌合させることで上記電子回路基板を上記ベース部材上に位置決めし、上記接続端子部を上記案内孔に案内して上記スルーホール部に挿入させる基板挿入ガイドを備え、上記ベース部材は、上記電気部品の搭載面となる上面より突出した支柱を有し、上記支柱に上記基板挿入ガイドを介して上記電子回路基板が固定され、上記基板挿入ガイドの上記位置決め部は略円柱形状であり、上記ベース部材に設けられた上記嵌合部は、上記電気部品の搭載面となる上面に設けられた凹部であり、上記凹部の開口形状は略円形、または角部が丸みをもった形状であるものである。 An electronic device according to the present invention includes a base member constituting a casing, an electrical component that is fixed on the base member and from which the connection terminal portion protrudes, and a through-hole portion into which the connection terminal portion is inserted. An electronic circuit board that is electrically connected to an electrical component, a guide hole that is mounted on the back side of a region including the through-hole portion of the electronic circuit board and guides the connection terminal portion to the through-hole portion, and the base member And positioning the electronic circuit board on the base member by fitting the positioning portion to a fitting portion provided on the base member, and the connection terminal portion to the guide hole. guide and includes a board insertion guide to be inserted into the through hole portion, the base member has a post protruding from the upper surface of the mounting surface of the electrical component, the board insertion moth to the post The electronic circuit board is fixed via a door, and the fitting portion provided on the base member includes a concave portion provided on an upper surface serving as a mounting surface of the electric component, and a bottom surface portion of the concave portion from an upper surface side. It is formed by the protruding column.
The electronic device according to the present invention includes a base member constituting the casing, an electrical component fixed on the base member and protruding from the connection terminal portion, and a through hole portion into which the connection terminal portion is inserted. An electronic circuit board that is electrically connected to the electrical component, a guide hole that is mounted on the back side of the region including the through-hole part of the electronic circuit board and guides the connection terminal part to the through-hole part, and A positioning portion that protrudes toward the base member; the electronic circuit board is positioned on the base member by fitting the positioning portion to a fitting portion provided on the base member; and the connection terminal portion is guided. A board insertion guide for guiding the hole to be inserted into the through-hole portion, wherein the base member has a support column protruding from an upper surface serving as a mounting surface of the electrical component, and the substrate is mounted on the support column; The electronic circuit board is fixed via an insertion guide, the positioning portion of the board insertion guide is substantially cylindrical, and the fitting portion provided on the base member is an upper surface serving as a mounting surface of the electric component The opening shape of the recess is substantially circular or the corner has a rounded shape .

この発明の電子機器によれば、基板挿入ガイドを電子回路基板の裏面側に装着した状態で、ベース部材の嵌合部に、基板挿入ガイドの位置決め部を嵌合させて位置決めできるため、別置きされた電気部品の接続端子部を、基板挿入ガイドの案内孔にスムーズに通すことができ、基板挿入ガイドが装着されている電子回路基板のスルーホールに、接続端子部を容易に挿入することができるという効果がある。 According to the electronic apparatus of the present invention, since the positioning of the board insertion guide can be fitted and positioned in the fitting portion of the base member in a state where the board insertion guide is mounted on the back side of the electronic circuit board, it is placed separately. The connection terminal part of the electrical component thus inserted can be smoothly passed through the guide hole of the board insertion guide, and the connection terminal part can be easily inserted into the through hole of the electronic circuit board on which the board insertion guide is mounted. There is an effect that can be done.

本発明の実施の形態１に係る電子機器の外観を示す斜視図である。It is a perspective view which shows the external appearance of the electronic device which concerns on Embodiment 1 of this invention. 図１の電子機器のカバーを外した状態を示す斜視図である。It is a perspective view which shows the state which removed the cover of the electronic device of FIG. 図２の電子機器の電子回路基板を外した状態を示す斜視図である。It is a perspective view which shows the state which removed the electronic circuit board of the electronic device of FIG. 図２の状態の電子機器を真上から見た平面図である。It is the top view which looked at the electronic device of the state of FIG. 2 from right above. 図４のＡ−Ａ線に沿った矢視断面図である。It is arrow sectional drawing along the AA line of FIG. 図５から基板挿入ガイドだけを抜き出した断面図である。It is sectional drawing which extracted only the board | substrate insertion guide from FIG. 図１の電子機器を示す分解斜視図である。It is a disassembled perspective view which shows the electronic device of FIG. 本発明の実施の形態２に係る電子機器の主要部を示す斜視図である。It is a perspective view which shows the principal part of the electronic device which concerns on Embodiment 2 of this invention. 本発明の実施の形態２に係る電子機器の図５相当する要部断面図である。It is principal part sectional drawing equivalent to FIG. 5 of the electronic device which concerns on Embodiment 2 of this invention.

実施の形態１．
以下、この発明の実施の形態１の電子機器について図１〜図７を参照して説明する。図１は、この発明の実施の形態１に係る電子機器１の外観を示す斜視図である。図２は、図１の電子機器１からシールドカバー１１を取り外した状態を示す斜視図である。図３は、図２の電子機器１から電子回路基板２１を外した状態を示す斜視図である。図４は、図２の状態の電子機器１を真上から見た平面図である。図５は、図４の電子機器１のＡ−Ａ線に沿った矢視断面図である。図６は、図５の電子機器１から基板挿入ガイド３１だけを抜き出した断面図である。図７は、図１の電子機器１の分解斜視図である。なお、各図において、同一または相当部材、相当部位については、同一符号を付して説明するものとする。 Embodiment 1 FIG.
Hereinafter, an electronic apparatus according to Embodiment 1 of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing an external appearance of an electronic apparatus 1 according to Embodiment 1 of the present invention. FIG. 2 is a perspective view showing a state where the shield cover 11 is removed from the electronic apparatus 1 of FIG. FIG. 3 is a perspective view showing a state in which the electronic circuit board 21 is removed from the electronic apparatus 1 of FIG. FIG. 4 is a plan view of the electronic device 1 in the state of FIG. 2 as viewed from directly above. FIG. 5 is a cross-sectional view taken along line AA of the electronic apparatus 1 of FIG. FIG. 6 is a cross-sectional view in which only the board insertion guide 31 is extracted from the electronic apparatus 1 of FIG. FIG. 7 is an exploded perspective view of the electronic device 1 of FIG. In addition, in each figure, the same or equivalent member and an equivalent part shall be demonstrated by attaching | subjecting the same code | symbol.

この電子機器１は、図１に示すように、ベース部材１２を備えており、このベース部材１２の天面はシールドカバー１１によって覆われ、シールドカバーネジ１７でシールドカバー１１をベース部材１２の天面側に固定している。このベース部材１２およびシールドカバー１１で構成された筐体内は密閉された状態となっている。
また、ベース部材１２の側面部には電源コネクタ１３および信号コネクタ１５が配設され、それぞれ電源コネクタ用ネジ１４及び信号コネクタ用ネジ１６で固定されている。 As shown in FIG. 1, the electronic apparatus 1 includes a base member 12. The top surface of the base member 12 is covered with a shield cover 11, and the shield cover 11 is attached to the top of the base member 12 with a shield cover screw 17. It is fixed to the surface side. The inside of the casing constituted by the base member 12 and the shield cover 11 is in a sealed state.
Further, a power connector 13 and a signal connector 15 are disposed on the side surface of the base member 12, and are fixed by a power connector screw 14 and a signal connector screw 16, respectively.

また、図２に示すように、図１からシールドカバー１１を外した状態（ベース部材１２に電気部品と、電子回路基板を実装した組み立て段階に相当する。）では、電子機器１の上面には、電子回路基板２１の上面側が見え、電子回路基板２１の裏面側に装着した基板挿入ガイドおよびベース部材１２との固定をするネジ（固定部材）２３ａ、２３ｂの二つのネジ頭が見え、そのネジ頭間には、ベース部材１２上に搭載する電気部品の接続端子部（電気部品リード端子部）４１ａが電子回路基板２１を貫き端子先端が上方に突き出した状態となっている。また、電子回路基板２１のネジ２３ａ、２３ｂ、接続端子部４１ａの近傍には、基板挿入ガイドに一体形成されたピン形状の基板仮固定部（基板挿入ガイド仮固定ピン）３３ａ、３３ｂが、電子回路基板２１に開口された嵌入孔に嵌入されて、その先端部が電子回路基板２１上に突き出した状態となっている。また、電子回路基板用ネジ２２によって、電子回路基板２１とベース部材１２の支柱とが固定される。 As shown in FIG. 2, when the shield cover 11 is removed from FIG. 1 (corresponding to an assembly stage in which an electrical component and an electronic circuit board are mounted on the base member 12), the upper surface of the electronic device 1 is The upper surface side of the electronic circuit board 21 can be seen, and the two screw heads of the board insertion guide mounted on the back surface side of the electronic circuit board 21 and the screws (fixing members) 23a and 23b for fixing to the base member 12 can be seen. Between the heads, a connection terminal portion (electric component lead terminal portion) 41a of an electric component mounted on the base member 12 penetrates the electronic circuit board 21 and the terminal tip protrudes upward. Further, in the vicinity of the screws 23a and 23b and the connection terminal portion 41a of the electronic circuit board 21, pin-shaped substrate temporary fixing portions (substrate insertion guide temporary fixing pins) 33a and 33b integrally formed with the substrate insertion guide are electronic It is inserted into the insertion hole opened in the circuit board 21, and the tip end portion protrudes on the electronic circuit board 21. Further, the electronic circuit board 21 and the support column of the base member 12 are fixed by the electronic circuit board screws 22.

また、図３に示すように、図２から電子回路基板２１を取り去った状態（ベース部材１２上に電気部品４１を実装した組み立て段階に相当する。）では、ベース部材１２の上面（電気部品の搭載面）には電気部品４１が、放熱絶縁シート４３を介して電気部品用ネジ４２で固定されている。電気部品４１の配置部の両側部には、基板挿入ガイド３１（電子回路基板２１の裏面に装着された基板組み立てのための案内部材である。詳細については後述する。）との嵌合を行う嵌合部５ａ、５ｂが設けられ、嵌合部５ａ、５ｂは、ベース部材２１の上面から掘り下げられた凹部５０ａ、５０ｂと、その凹部底面から電子回路基板２１側に突出する支柱５４ａ、５４ｂをそれぞれ含む構成である。その他、ベース部材１２の上面には、電子回路基板２１との係止および固定のための支柱５１、５２、５３、電子回路基板位置決めピン５５ａ、５５ｂが配置形成されている。 As shown in FIG. 3, when the electronic circuit board 21 is removed from FIG. 2 (corresponding to an assembly stage in which the electric component 41 is mounted on the base member 12), the upper surface of the base member 12 (of the electric component). The electrical component 41 is fixed to the mounting surface) with the electrical component screws 42 via the heat insulating sheet 43. On both sides of the arrangement part of the electrical component 41, a board insertion guide 31 (a guide member for assembling a board mounted on the back surface of the electronic circuit board 21. Details will be described later) is fitted. Fitting portions 5a and 5b are provided. The fitting portions 5a and 5b include recesses 50a and 50b dug down from the upper surface of the base member 21, and support columns 54a and 54b protruding from the bottom surface of the recess to the electronic circuit board 21 side. It is the composition which includes each. In addition, on the upper surface of the base member 12, support columns 51, 52, 53 and electronic circuit board positioning pins 55 a, 55 b for locking and fixing with the electronic circuit board 21 are arranged and formed.

図４に示すように、図２のシールドカバー１１を外した状態の電子機器１の平面図では、ネジ２３ａ、２３ｂの間に、基板挿入ガイドの一部であるピン形状の基板仮固定部３３ａ、３３ｂ、接続端子部４１ａが、図中Ａ−Ａ線上に並ぶように配置されている。 As shown in FIG. 4, in the plan view of the electronic device 1 with the shield cover 11 of FIG. 2 removed, a pin-shaped substrate temporary fixing portion 33a which is a part of the substrate insertion guide is interposed between the screws 23a and 23b. , 33b and the connection terminal portion 41a are arranged on the line AA in the drawing.

図５に示すように、図４のＡ−Ａ線矢視断面図では、電気部品４１が実装されたベース部材１２の上面と電子回路基板２１の裏面との間には基板挿入ガイド３１が介在している。この基板挿入ガイド３１は、まず電子回路基板２１の裏面側に装着され、その後、電子回路基板２１と共にベース部材１２側に挿入され、固定される。
ベース部材１２の嵌合部５ａ、５ｂに形成された支柱５４ａ、５４ｂは、ベース部材１２の上面から掘り下げられた形状の凹部５０ａ、５０ｂの底面から上側に突出した略円柱形状であり、この例では、支柱５４ａ、５４ｂの上端部は、ベース部材１２上に載置した電気部品４１の上端部よりも低く、ベース部材１２の上面よりも高くなるよう調整されている。支柱５４ａ、５４ｂの高さは、実装する電子回路基板２１の裏面形状や基板挿入ガイド３１のベース部材２１側への突出形状によって、嵌合部５ａ、５ｂの形状が変化するため、各部材の高さ等については、適宜最適な寸法に変更されることは言うまでもない。 As shown in FIG. 5, in the cross-sectional view taken along line AA in FIG. 4, a board insertion guide 31 is interposed between the upper surface of the base member 12 on which the electrical component 41 is mounted and the back surface of the electronic circuit board 21. doing. The board insertion guide 31 is first mounted on the back surface side of the electronic circuit board 21 and then inserted and fixed together with the electronic circuit board 21 on the base member 12 side.
The columns 54a and 54b formed on the fitting portions 5a and 5b of the base member 12 have a substantially cylindrical shape protruding upward from the bottom surfaces of the concave portions 50a and 50b having a shape dug down from the top surface of the base member 12, and in this example Then, the upper end portions of the columns 54 a and 54 b are adjusted to be lower than the upper end portion of the electric component 41 placed on the base member 12 and higher than the upper surface of the base member 12 . The heights of the support posts 54a and 54b vary depending on the shape of the back surface of the electronic circuit board 21 to be mounted and the shape of the board insertion guide 31 protruding toward the base member 21. Needless to say, the height and the like are appropriately changed to optimum dimensions.

また、詳細については後述するが、基板挿入ガイド３１の、ベース部材１２側に突出する位置決め本固定部（位置決め部に相当する。）３４ａ、３４ｂは略円筒形状で、略円柱状の支柱５４ａ、５４ｂに嵌合しつつ、円柱側面部でガイドされてベース部材１２側に嵌め込まれるが、位置決め本固定部３４ａ、３４ｂの突出量は、支柱５４ａ、５４ｂの上端に基板挿入ガイド３１の位置決め本固定部３４ａ、３４ｂの下端が接した段階で、接続端子部４１ａの上端が基板挿入ガイド３１に接触しない状態となるように調整されている。 Although details will be described later, positioning main fixing portions (corresponding to positioning portions) 34a and 34b projecting toward the base member 12 of the substrate insertion guide 31 are substantially cylindrical, and substantially columnar columns 54a, While being fitted to 54b, it is guided by the side surface of the column and fitted to the base member 12 side, but the amount of protrusion of the positioning main fixing portions 34a and 34b is fixed to the upper end of the support posts 54a and 54b. It is adjusted so that the upper end of the connection terminal portion 41 a is not in contact with the board insertion guide 31 when the lower ends of the portions 34 a and 34 b are in contact with each other.

また、電子回路基板２１が実装された状態では、電気部品４１の接続端子部４１ａは、基板挿入ガイド３１に設けられた貫通孔である案内孔３２を介して、電子回路基板２１のスルーホール部２８に案内され挿入される。
さらに、基板挿入ガイド３１の上面と電子回路基板２１の裏面との間には隙間６１が形成された状態となっている。 When the electronic circuit board 21 is mounted, the connection terminal portion 41 a of the electrical component 41 is connected to the through hole portion of the electronic circuit board 21 through the guide hole 32 that is a through hole provided in the board insertion guide 31. 28 is guided and inserted.
Further, a gap 61 is formed between the upper surface of the board insertion guide 31 and the back surface of the electronic circuit board 21.

また、図６に、図５の基板挿入ガイド３１の拡大図を示すように、接続端子部４１aが案内される案内孔３２は、ベース部材２１に近い部分の開口寸法が広くなるテーパー形状の貫通孔として形成がなされている。また、位置決め本固定部３４ａ、３４ｂの上端部には、電子回路基板２１とベース部材１２との本固定時に、ネジ等の固定部材を通すための貫通孔である基板挿入ガイド固定部ネジ用孔３７ａ、３７ｂが開口されている。 6 shows an enlarged view of the board insertion guide 31 of FIG. 5, the guide hole 32 through which the connection terminal portion 41 a is guided has a taper-shaped through-hole in which the opening size near the base member 21 is widened. It is formed as a hole. In addition, at the upper ends of the positioning main fixing portions 34a and 34b, a board insertion guide fixing portion screw hole which is a through hole through which a fixing member such as a screw is passed when the electronic circuit board 21 and the base member 12 are fixed to each other. 37a and 37b are opened.

また、図７に、電子機器１の分解斜視図を示すように、電子回路基板２１には、接続端子部４１ａを通す貫通孔であるスルーホール部２８と、基板挿入ガイド３１のピン形状の基板仮固定部３３ａ、３３ｂを嵌入させる嵌入孔２６ａ、２６ｂ、電子回路基板２１をベース部材１２側に固定するためのネジ２３ａ、２３ｂを通すための貫通孔である電子回路基板孔２５ａ、２５ｂが開口されている。また、電子回路基板２１の周囲には、ベース部材１２側の電子回路基板位置決めピン５５ａ、５５ｂと嵌合する貫通孔である電子回路基板孔２７ａ、２７ｂが開口され、その他、電子回路基板２１をベース部材１２側の支柱５１、５２、５３に固定するためのネジを通す電子回路基板孔２４が開口されている。 Further, as shown in an exploded perspective view of the electronic device 1 in FIG. 7, the electronic circuit board 21 includes a through hole portion 28 that is a through hole through which the connection terminal portion 41 a is passed, and a pin-shaped substrate of the substrate insertion guide 31. Electronic circuit board holes 25a and 25b, which are through holes for passing through the screws 23a and 23b for fixing the electronic circuit board 21 to the base member 12 side, and the insertion holes 26a and 26b for inserting the temporary fixing portions 33a and 33b are opened. Has been. In addition, electronic circuit board holes 27a and 27b, which are through holes that fit into the electronic circuit board positioning pins 55a and 55b on the base member 12 side, are opened around the electronic circuit board 21. An electronic circuit board hole 24 through which a screw for fixing to the support columns 51, 52, 53 on the base member 12 side is opened.

このように、本発明の実施の形態１の電子機器１は、筺体を構成するベース部材１２、ベース部材１２上に固定され、上方に接続端子部４１ａが突出する電気部品４１、接続端子部４１ａが挿入されるスルーホール部２８を有し、電気部品４１と電気的に接続される電子回路基板２１、電子回路基板２１のスルーホール部２８を含む領域の裏面側に装着され、スルーホール部２８に接続端子部４１ａを導く案内孔３２と、ベース部材１２側に突き出す位置決め本固定部３４ａ、３４ｂを有し、位置決め本固定部３４ａ、３４ｂをベース部材１２に設けた嵌合部５ａ、５ｂに嵌合させることで電子回路基板２１をベース部材１２上に位置決めし、接続端子部４１ａを案内孔３２に案内してスルーホール部２８に挿入させる基板挿入ガイド３１を備えた構成である。 As described above, the electronic device 1 according to the first embodiment of the present invention includes the base member 12 constituting the casing, the electric component 41 that is fixed on the base member 12, and the connection terminal portion 41a protrudes upward, and the connection terminal portion 41a. Is mounted on the back side of the region including the through hole portion 28 of the electronic circuit board 21 and the electronic circuit board 21 electrically connected to the electrical component 41. In the fitting portions 5a and 5b provided in the base member 12, the guide hole 32 for guiding the connection terminal portion 41a and the positioning main fixing portions 34a and 34b protruding to the base member 12 side are provided. The board insertion guide 31 for positioning the electronic circuit board 21 on the base member 12 by being fitted and guiding the connection terminal portion 41a to the guide hole 32 and inserting it into the through hole portion 28 is provided. Example was a configuration.

さらに、そのベース部材１２は、電気部品４１の搭載面となる上面より突出した支柱５４ａ、５４ｂを有し、支柱５４ａ、５４ｂに基板挿入ガイド３１を介して電子回路基板２１を固定するよう構成されている。
また、その支柱５４ａ、５４ｂは、ベース部材１２の嵌合部５ａ、５ｂに設けられている。 Further, the base member 12 has support posts 54 a and 54 b protruding from the upper surface serving as a mounting surface of the electric component 41, and is configured to fix the electronic circuit board 21 to the support posts 54 a and 54 b via the board insertion guide 31. ing.
Further, the columns 54 a and 54 b are provided in the fitting portions 5 a and 5 b of the base member 12.

また、基板挿入ガイド３１の一部が、支柱５４ａ、５４ｂを覆う形状に形成されている。
さらに、基板挿入ガイド３１は、絶縁材料製で、その絶縁材料とは、例えばＰＰＳ、ＰＢＴ、ＰＡなどである。 Further, a part of the substrate insertion guide 31 is formed in a shape covering the columns 54a and 54b.
Furthermore, the board insertion guide 31 is made of an insulating material, and the insulating material is, for example, PPS, PBT, PA, or the like.

また、支柱５４ａ、５４ｂは、ベース部材１２と一体形成され、その形状は例えば略円柱形状である。支柱５４ａ、５４ｂは、上述したように、嵌合部５ａ、５ｂの凹部５０ａ、５０ｂの底面部から、ベース部材１２の上面よりも突出するように形成される。また、凹部５０ａ、５０ｂは、略円柱形状の支柱５４ａ、５４ｂを取りまくよう、掘り下げられた溝部となっている。ここで、位置決め本固定部３４ａ、３４ｂの形状を略円筒形とすることで、略円柱形状の支柱５４ａ、５４ｂとの嵌合が、軸中心の回転方向の制約が小さくなる点において、容易となる。 Further, the columns 54a and 54b are integrally formed with the base member 12, and the shape thereof is, for example, a substantially cylindrical shape. As described above, the columns 54a and 54b are formed so as to protrude from the bottom surface of the recesses 50a and 50b of the fitting portions 5a and 5b from the top surface of the base member 12. Moreover, the recessed parts 50a and 50b are groove parts dug down so as to surround the substantially columnar columns 54a and 54b. Here, by making the shape of the positioning main fixing portions 34a and 34b substantially cylindrical, the fitting with the substantially columnar columns 54a and 54b is easy in that the restriction on the rotational direction of the shaft center is reduced. Become.

また、支柱５４ａ、５４ｂは、基板挿入ガイド３１の案内と電子回路基板２１の本固定のねじ受けとの両方の用途に利用することが可能であり、例えば、電子回路基板２１の固定高さを一定としたときに、凹部５０ａ、５０ｂの深さをより大きくすることで、基板挿入ガイド３１側の位置決め本固定部３４ａ、３４ｂの長さをより長く設けることが可能となるなど、ベース部材１２の上面に突出する電気部品４１の突出量に応じて寸法を調節することができる。 Further, the pillars 54a and 54b can be used for both the guide of the board insertion guide 31 and the permanent fixing screw receiver of the electronic circuit board 21. For example, the fixing height of the electronic circuit board 21 can be increased. When fixed, the base member 12 can be provided such that the depths of the recesses 50a and 50b are made larger so that the length of the positioning main fixing portions 34a and 34b on the substrate insertion guide 31 side can be longer. The dimension can be adjusted according to the protruding amount of the electric component 41 protruding on the upper surface of the plate.

次に、本発明の電子機器１の組立て手順について説明する。
まず、ベース部材１２の上面に、放熱絶縁シート４３を介して電気部品４１を実装する。
一方、別置きとなる電子回路基板２１の裏面には、基板挿入ガイド３１が装着される。このとき、基板挿入ガイド３１のピン形状の基板仮固定部３３ａ、３３ｂを、電子回路基板２１の嵌入孔２６ａ、２６ｂに、裏面側から圧入させることで、基板挿入ガイド３１を電子回路基板２１に容易に仮固定でき、組立て性に優れている。 Next, a procedure for assembling the electronic device 1 of the present invention will be described.
First, the electrical component 41 is mounted on the upper surface of the base member 12 via the heat dissipation insulating sheet 43.
On the other hand, a board insertion guide 31 is mounted on the back surface of the electronic circuit board 21 that is separately provided. At this time, the board insertion guide 31 is inserted into the electronic circuit board 21 by pressing the pin-shaped board temporary fixing portions 33a and 33b of the board insertion guide 31 into the insertion holes 26a and 26b of the electronic circuit board 21 from the back side. It can be easily temporarily fixed and has excellent assemblability.

次に、基板挿入ガイド３１が装着された電子回路基板２１を、ベース部材１２の上面側に組み付ける。このとき、最初に、電子回路基板２１の裏面方向に突出した状態の基板挿入ガイド３１の位置決め本固定部３４ａ、３４ｂの下端が、ベース部材１２の嵌合部５ａ、５ｂの支柱５４ａ、５４ｂの上端に接する状態に位置合わせされ、続いて支柱５４ａ、５４ｂの側面部で位置決め本固定部３４ａ、３４ｂを案内しつつ、支柱５４ａ、５４ｂに略円筒状の位置決め本固定部３４ａ、３４ｂが被せられて嵌合する状態となる。このとき、接続端子部４１ａは、基板挿入ガイド３１の案内孔３２を通って、電子回路基板２１のスルーホール部２８にスムーズに挿入される。 Next, the electronic circuit board 21 on which the board insertion guide 31 is mounted is assembled to the upper surface side of the base member 12. At this time, first, the lower ends of the positioning main fixing portions 34a and 34b of the board insertion guide 31 in a state of protruding in the back surface direction of the electronic circuit board 21 are the support pillars 54a and 54b of the fitting portions 5a and 5b of the base member 12. Positioned so as to be in contact with the upper end, and then guiding the positioning main fixing portions 34a, 34b with the side surfaces of the columns 54a, 54b, the columns 54a, 54b are covered with the substantially cylindrical positioning main fixing portions 34a, 34b. To be fitted. At this time, the connection terminal portion 41 a is smoothly inserted into the through hole portion 28 of the electronic circuit board 21 through the guide hole 32 of the board insertion guide 31.

基板挿入ガイド３１が装着された電子回路基板２１をベース部材１２側に嵌合させた後、電子回路基板位置決めピン５５ａ、５５ｂと電子回路基板孔２７ａ、２７ｂで位置決めし、支柱５１〜５３、５４ａ、５４ｂに電子回路基板用ネジ２２、ネジ２３ａ、２３ｂで固定を行う。このとき、支柱５４ａ、５４ｂに基板挿入ガイド３１の位置決め本固定部３４ａ、３４ｂが被さる形で共締め固定の状態となっている。 After the electronic circuit board 21 on which the board insertion guide 31 is mounted is fitted on the base member 12 side, the electronic circuit board positioning pins 55a and 55b and the electronic circuit board holes 27a and 27b are used for positioning, and the columns 51 to 53 and 54a are positioned. , 54b are fixed with electronic circuit board screws 22 and screws 23a, 23b. At this time, the fixing main fixing portions 34a and 34b of the board insertion guide 31 are covered with the support posts 54a and 54b so that they are fixed together.

上述したように、電子回路基板２１のベース部材１２側への固定が完了した状態では、接続端子部４１ａは案内孔３２とスルーホール部２８を通って、電子回路基板２１の上面側へ突出しており、その後、スルーホール部２８周囲のランド（図示せず）に半田付けされて電気的な接続がなされる。このとき、図５の断面図に示したように、電子回路基板２１のスルーホール部２８においては、基板挿入ガイド３１との間に隙間６１が設けられるように構成されている。電子回路基板２１と基板挿入ガイド３１を密着させず適度な隙間６１を設けたことで、半田付けの際、電子回路基板２１の基板挿入ガイド３１側にも半田フィレットが形成された状態となる。次に、ベース部材１２の上面にシールドカバー１１をシールドカバーネジ１７で固定して、図１の電子機器１が完成する。 As described above, in a state where the fixing of the electronic circuit board 21 to the base member 12 side is completed, the connection terminal portion 41a passes through the guide hole 32 and the through hole portion 28 and protrudes to the upper surface side of the electronic circuit board 21. After that, it is soldered to a land (not shown) around the through-hole portion 28 to be electrically connected. At this time, as shown in the cross-sectional view of FIG. 5, the through hole portion 28 of the electronic circuit board 21 is configured such that a gap 61 is provided between the board insertion guide 31 and the through hole portion 28. By providing an appropriate gap 61 without bringing the electronic circuit board 21 and the board insertion guide 31 into close contact with each other, a solder fillet is also formed on the board insertion guide 31 side of the electronic circuit board 21 during soldering. Next, the shield cover 11 is fixed to the upper surface of the base member 12 with the shield cover screw 17 to complete the electronic apparatus 1 shown in FIG.

このように形成された実施の形態１の電子機器１によれば、基板挿入ガイド３１は、電子回路基板２１側に突出する基板仮固定部３３ａ、３３ｂを有し、その基板仮固定部３３ａ、３３ｂを電子回路基板２１の嵌入孔２６ａ、２６ｂに嵌入させることで電子回路基板２１に仮装着され、その後、位置決め本固定部３４ａ、３４ｂにより、支柱５４ａ、５４ｂに電子回路基板２１と共に、ネジ２３ａ、２３ｂで固定されるので、振動や経年変化による脱落を防止でき、信頼性が向上する。 According to the electronic device 1 of the first embodiment formed in this way, the board insertion guide 31 has the board temporary fixing parts 33a and 33b protruding to the electronic circuit board 21 side, and the board temporary fixing part 33a, 33b is inserted into the insertion holes 26a and 26b of the electronic circuit board 21 to be temporarily attached to the electronic circuit board 21. Then, the positioning main fixing portions 34a and 34b are attached to the columns 54a and 54b together with the electronic circuit board 21 and the screws 23a. , 23b, so that dropout due to vibration or aging can be prevented and reliability is improved.

また、基板挿入ガイド３１は、ピン形状の基板仮固定部３３ａ、３３ｂを、電子回路基板２１の嵌入孔２６ａ、２６ｂに圧入することで容易に仮固定でき、その後、位置決め本固定部３４ａ、３４ｂにより、支柱５４ａ、５４ｂに電子回路基板２１とともに、ネジ２３ａ、２３ｂで固定されるので、電子回路基板２１の固定と基板挿入ガイド３１の本固定が一度で済み、組み立て性が向上する。 The board insertion guide 31 can be easily temporarily fixed by press-fitting the pin-shaped board temporary fixing parts 33a and 33b into the insertion holes 26a and 26b of the electronic circuit board 21, and then the positioning main fixing parts 34a and 34b. Accordingly, the electronic circuit board 21 and the screws 23a and 23b are fixed to the support posts 54a and 54b together with the electronic circuit board 21, so that the fixing of the electronic circuit board 21 and the main fixing of the board insertion guide 31 can be performed only once, and the assemblability is improved.

また、略筒形状（円筒形状以外の筒形状も含む。）の位置決め本固定部３４ａ、３４ｂを支柱５４ａ、５４ｂに被せて位置決めしながら、電子回路基板２１を組み付けていくことで、電子回路基板２１の組立時において、接続端子部４１ａが、案内孔３２内に挿入される前に電子回路基板２１の位置決めをすることができる。これにより、案内孔３２内に接続端子部４１ａがダメージを受けることなくスムーズに入り、その後、電子回路基板２１のスルーホール２８に挿入されるので、組み付け作業性も向上する。また、上記のような嵌合により、ほぼ接続端子部４１ａの曲げバラツキを考慮するだけで、電子回路基板２１の組み付け姿勢（前後左右方向や回転、傾き）は、あまり加味しなくてもよくなり、基板挿入ガイド３１を小型化でき、電子機器１の小型化にもつながり、作業者の組み付け方による、接続端子部４１ａの変形も防止できる。 Further, the electronic circuit board 21 is assembled while the positioning main fixing portions 34a and 34b having a substantially cylindrical shape (including a cylindrical shape other than the cylindrical shape) are placed on the columns 54a and 54b and positioned. At the time of assembling 21, the electronic circuit board 21 can be positioned before the connection terminal portion 41 a is inserted into the guide hole 32. As a result, the connection terminal portion 41a smoothly enters the guide hole 32 without being damaged, and is thereafter inserted into the through hole 28 of the electronic circuit board 21, so that the assembly workability is also improved. In addition, with the fitting as described above, the assembly posture (front and rear, right and left directions, rotation and inclination) of the electronic circuit board 21 does not have to be taken into account so much only by considering the bending variation of the connection terminal portion 41a. The board insertion guide 31 can be reduced in size, leading to a reduction in the size of the electronic device 1, and the deformation of the connection terminal portion 41a due to the way the worker is assembled can be prevented.

さらに、組み付け姿勢が、位置決め本固定部３４ａ、３４ｂと嵌合部（支柱５４ａ、５４ｂを含む。）よりなる位置決め機構によって、ほぼ定まった状態になるため、基板挿入ガイド３１の案内孔３２の寸法を、位置決め機構が無い場合よりも小さくすることができ、装置全体を小型化することが可能となる。 Further, since the assembly posture is substantially determined by the positioning mechanism including the positioning main fixing portions 34a and 34b and the fitting portions (including the columns 54a and 54b), the dimension of the guide hole 32 of the board insertion guide 31 is determined. Can be made smaller than when there is no positioning mechanism, and the entire apparatus can be reduced in size.

基板挿入ガイド３１は電子回路基板２１のスルーホール部２８においては、電子回路基板２１の裏面と基板挿入ガイド３１の上面との間を密着させず適度な隙間６１を設けるようにしたので、この隙間６１に、接続端子部４１ａの半田付けの際に半田フィレット（図示せず）が形成されることで、電子回路基板２１の基板挿入ガイド３１側にも半田フィレットが存在する状態が得られ、半田付け部の電気的接合状態を良好に保つことができ、信頼性を向上させることができる。 The board insertion guide 31 is provided with an appropriate gap 61 in the through-hole portion 28 of the electronic circuit board 21 so that the back surface of the electronic circuit board 21 and the upper surface of the board insertion guide 31 are not in close contact with each other. 61, a solder fillet (not shown) is formed when the connection terminal portion 41a is soldered, so that a state in which a solder fillet exists also on the board insertion guide 31 side of the electronic circuit board 21 is obtained. The electrical connection state of the attachment portion can be kept good, and the reliability can be improved.

また、基板挿入ガイド３１は絶縁材料製であり、支柱５４ａ、５４ｂを基板挿入ガイド３１の位置決め本固定部３４ａ、３４ｂで覆うようにするので、電子回路基板２１において、支柱５４ａ、５４ｂ周囲に電子部品（図示せず）を搭載するとき、支柱５４ａ、５４ｂとの絶縁耐圧距離が小さくでき、電子部品実装禁止領域を狭くできるので、電子回路基板２１の小型化につながる。 Further, the board insertion guide 31 is made of an insulating material, and the columns 54 a and 54 b are covered with the positioning main fixing portions 34 a and 34 b of the board insertion guide 31. When components (not shown) are mounted, the withstand voltage distance between the columns 54a and 54b can be reduced and the electronic component mounting prohibited area can be narrowed, leading to downsizing of the electronic circuit board 21.

さらに、基板挿入ガイド３１の案内孔３２は、接続端子部４１ａの挿入口に向かってテーパ状に広がりを持つ形状に形成されるため、組み付け時に基板挿入ガイド３１の挿入方向にわずかなズレが生じていたとしても、接続端子部４１ａの先端を案内孔３２のテーパ形状に沿って深部へと案内することができ、電子回路基板２１のスルーホール部２８へ導くことができ、精度良く組立てを行うことが可能となる。 Further, since the guide hole 32 of the board insertion guide 31 is formed in a shape having a taper shape extending toward the insertion port of the connection terminal portion 41a, a slight deviation occurs in the insertion direction of the board insertion guide 31 during assembly. Even if it is, the tip of the connection terminal portion 41a can be guided to the deep portion along the tapered shape of the guide hole 32, and can be guided to the through-hole portion 28 of the electronic circuit board 21, and the assembly is performed with high accuracy. It becomes possible.

実施の形態２．
図８はこの発明の実施形態２の電子機器の主要部を示す斜視図であり、図９は発明の実施の形態１の図５に相当する実施の形態２の電子機器１の要部断面図である。この実施の形態２においても実施の形態１と同様に、電子回路基板２１の裏面には、先に基板挿入ガイド３１が、基板仮固定部３３ａ、３３ｂを、嵌入孔２６ａ、２６ｂに圧入することで仮固定されている。基板挿入ガイド３１が装着された電子回路基板２１は電子回路基板位置決めピン５５ａ、５５ｂと電子回路基板孔２７ａ、２７ｂで位置決めされ、ベース部材１２の支柱５１〜５３、５７ａ、５７ｂに電子回路基板用ネジ２２、ネジ（固定部材）２３ａ、２３ｂで固定されている。このとき支柱５７ａ、５７ｂに基板挿入ガイド本固定部３６ａ、３６ｂが被さる形で共締め固定されて組み付けされている。 Embodiment 2. FIG.
FIG. 8 is a perspective view showing the main part of the electronic device according to the second embodiment of the present invention, and FIG. 9 is a cross-sectional view of the main part of the electronic device 1 according to the second embodiment corresponding to FIG. It is. Also in the second embodiment, as in the first embodiment, the board insertion guide 31 first presses the board temporary fixing portions 33a and 33b into the fitting holes 26a and 26b on the back surface of the electronic circuit board 21. It is temporarily fixed with. The electronic circuit board 21 on which the board insertion guide 31 is mounted is positioned by the electronic circuit board positioning pins 55a and 55b and the electronic circuit board holes 27a and 27b, and the electronic circuit board is mounted on the columns 51 to 53, 57a and 57b of the base member 12. It is fixed with screws 22 and screws (fixing members) 23a and 23b. At this time, the substrate insertion guide main fixing portions 36a and 36b cover the support columns 57a and 57b and are fastened together and assembled.

ここで、基板挿入ガイド３１の位置決め部３５ａ、３５ｂは略円柱形状（棒形状）であり、ベース部材１２に設けられた嵌合部５６ａ、５６ｂは、例えば、ベース部材１２の上面に位置決め以外の用途で形成された、電気部品４１の搭載面となる上面から掘り下げられた凹部であり、この凹部の開口形状は略円形、または角部が丸みをもった形状に形成されている。また、棒形状の位置決め部３５ａ、３５ｂは、嵌合部５６ａ、５６ｂの丸い穴、または凹部内壁の丸みを持った角部に沿うように形成されており、この位置決め部３５ａ、３５ｂがベース部材１２の嵌合部（凹部）５６ａ、５６ｂの内壁に沿う形で挿入されている。また、電子回路基板２１とベース部材１２との距離を所定寸法に保つために介在させる支柱５７ａ、５７ｂは、実施の形態１では、嵌合部５ａ、５ｂの一部で同じ位置に設けられた例を示したが、この実施の形態２では、嵌合部５６ａ、５６ｂとは別の位置に形成されている。
他の構成は上述した実施の形態１の電子機器１と同様である。 Here, the positioning portions 35a and 35b of the board insertion guide 31 have a substantially cylindrical shape (bar shape), and the fitting portions 56a and 56b provided on the base member 12 are other than positioning on the upper surface of the base member 12, for example. It is a recessed part dug down from the upper surface used as the mounting surface of the electrical component 41 formed by the use, and the opening shape of this recessed part is formed in the substantially circular shape or the shape with a rounded corner | angular part. The rod-shaped positioning portions 35a and 35b are formed along the round holes of the fitting portions 56a and 56b or the rounded corners of the concave inner walls, and the positioning portions 35a and 35b are formed as base members. Twelve fitting portions (concave portions) 56a and 56b are inserted along the inner walls. Further, in the first embodiment, the support columns 57a and 57b that are interposed in order to keep the distance between the electronic circuit board 21 and the base member 12 at a predetermined dimension are provided at the same position in a part of the fitting portions 5a and 5b. Although an example has been shown, the second embodiment is formed at a position different from the fitting portions 56a and 56b.
Other configurations are the same as those of the electronic apparatus 1 of the first embodiment described above.

この実施の形態２の電子機器１によれば、棒形状の位置決め部３５ａ、３５ｂを嵌合部５６ａ、５６ｂの内壁に沿わせて位置決めしながら、電子回路基板２１をベース部材１２側に組み付けていくことで、電子回路基板２１の組立時において、接続端子部４１ａが案内孔３２内に入る前に電子回路基板２１の位置決めをすることができる。これにより、案内孔３２内に接続端子部４１ａがスムーズに入り、その後、電子回路基板２１のスルーホール部２８の貫通孔に挿入されるので、組み付け作業性も向上し、作業者の組み付け方（組み付け姿勢のズレ）による、接続端子部４１ａの変形も防止できる。そのため、実施の形態１と同様に、基板挿入ガイド３１が小型化でき、電子回路基板２１の小型化にもつながる。これ以外にも、実施の形態１と同等の効果を得ることができる。 According to the electronic device 1 of the second embodiment, the electronic circuit board 21 is assembled on the base member 12 side while positioning the rod-shaped positioning portions 35a and 35b along the inner walls of the fitting portions 56a and 56b. Thus, when the electronic circuit board 21 is assembled, the electronic circuit board 21 can be positioned before the connection terminal portion 41 a enters the guide hole 32. As a result, the connection terminal portion 41a smoothly enters the guide hole 32, and is then inserted into the through hole of the through hole portion 28 of the electronic circuit board 21, so that the assembling workability is improved and the operator's assembling method ( It is possible to prevent the connection terminal portion 41a from being deformed due to the displacement of the assembly posture. Therefore, similarly to the first embodiment, the board insertion guide 31 can be reduced in size, and the electronic circuit board 21 can be reduced in size. In addition to this, an effect equivalent to that of the first embodiment can be obtained.

なお、上述の実施の形態１、２では、電子回路基板２１が１枚収納された電子機器１について説明したが、複数枚の電子回路基板２１が実装される場合であっても同様に、この発明を適用することができる。 In the first and second embodiments described above, the electronic apparatus 1 in which one electronic circuit board 21 is housed has been described. Similarly, even when a plurality of electronic circuit boards 21 are mounted, The invention can be applied.

また、電気部品４１は１種類としたが、複数種類の電気部品とすること、または、接続端子部４１ａはインサート成形したモールド部品の端子でもよい。電子回路基板２１のスルーホール部２８や、基板挿入ガイド３１の案内孔３２は、挿入される端子の形状によって適宜適切な形状とすればよい。実施の形態２の嵌合部５６ａ、５６ｂは専用の位置決め孔としてもよい等、本発明の主旨に適合する範囲で、様々な変形が可能であることは言うまでもない。 Moreover, although the electrical component 41 was made into one type, it may be made into multiple types of electrical components, or the connection terminal part 41a may be a terminal of a molded molded part. The through hole portion 28 of the electronic circuit board 21 and the guide hole 32 of the board insertion guide 31 may be appropriately formed according to the shape of the terminal to be inserted. Needless to say, the fitting portions 56a and 56b of the second embodiment may be variously modified within a range that conforms to the gist of the present invention, such as a dedicated positioning hole.

また、上述の実施の形態１、実施の形態２では、支柱５４ａ、５４ｂ、５７ａ、５７ｂ（ベース部材１２と基板挿入ガイド３１との距離を所定の寸法とするために介在させる部材。）は、ベース部材１２から、電子回路基板２１側へ突出して形成された例を示したが、これに限らず、支柱を、基板挿入ガイド３１側に、ベース部材１２に向かって突出して形成することもできる。その場合、実施の形態１においては、ベース部材１２側の嵌合部５ａ、５ｂの形状を対応するように変形させることは言うまでもない。
なお、本発明は、その発明の範囲内において、各実施の形態を適宜、変更、省略することが可能である。 Further, in the first and second embodiments described above, the columns 54a, 54b, 57a, and 57b (members interposed in order to set the distance between the base member 12 and the substrate insertion guide 31 to a predetermined dimension) are as follows. Although the example which protruded from the base member 12 to the electronic circuit board 21 side was shown, not only this but a support | pillar can also be formed protruding toward the base member 12 in the board | substrate insertion guide 31 side. . In that case, in Embodiment 1, it cannot be overemphasized that it deform | transforms so that the shape of the fitting parts 5a and 5b by the side of the base member 12 may respond | correspond.
In the present invention, each embodiment can be appropriately changed or omitted within the scope of the invention.

１電子機器、５ａ、５ｂ、５６ａ、５６ｂ嵌合部、１１シールドカバー、１２ベース部材、１３電源コネクタ、１４電源コネクタ用ネジ、１５信号コネクタ、１６信号コネクタ用ネジ、１７シールドカバーネジ、２１電子回路基板、２２電子回路基板用ネジ、２３ａ、２３ｂネジ（固定部材）、２４、２５ａ、２５ｂ、２７ａ、２７ｂ電子回路基板孔、２６ａ、２６ｂ嵌入孔、２８スルーホール部、３１基板挿入ガイド、３２案内孔、３３ａ、３３ｂ基板仮固定部（基板挿入ガイド仮固定ピン）、３４ａ、３４ｂ位置決め本固定部（位置決め部）、３５ａ、３５ｂ位置決め部、３６ａ、３６ｂ基板挿入ガイド本固定部、３７ａ、３７ｂ基板挿入ガイド固定部ネジ用孔、４１電気部品、４１ａ接続端子部、４２電気部品用ネジ、４３放熱絶縁シート、５０ａ、５０ｂ凹部、５１、５２、５３、５４ａ、５４ａ、５７ａ、５７ｂ支柱、５５ａ、５５ｂ電子回路基板位置決めピン、６１隙間（基板挿入ガイドと電子回路基板の隙間）。 DESCRIPTION OF SYMBOLS 1 Electronic device, 5a, 5b, 56a, 56b Fitting part, 11 Shield cover, 12 Base member, 13 Power connector, 14 Power connector screw, 15 Signal connector, 16 Signal connector screw, 17 Shield cover screw, 21 Electronics Circuit board, 22 Screw for electronic circuit board, 23a, 23b Screw (fixing member), 24, 25a, 25b, 27a, 27b Electronic circuit board hole, 26a, 26b Insertion hole, 28 Through hole part, 31 Substrate insertion guide, 32 Guide hole, 33a, 33b Substrate temporary fixing portion (substrate insertion guide temporary fixing pin), 34a, 34b Positioning main fixing portion (positioning portion), 35a, 35b Positioning portion, 36a, 36b Substrate insertion guide main fixing portion, 37a, 37b Board insertion guide fixing part screw hole, 41 electrical parts, 41a connection terminal part, 4 Screws for electrical parts, 43 Heat radiation insulating sheet, 50a, 50b Recess, 51, 52, 53, 54a, 54a, 57a, 57b Strut, 55a, 55b Electronic circuit board positioning pin, 61 Gap (board insertion guide and electronic circuit board Gap).

Claims

A base member constituting the housing, an electrical component fixed on the base member and having a connection terminal portion protruding upward, and a through-hole portion into which the connection terminal portion is inserted, and electrically connected to the electrical component An electronic circuit board, a guide hole that is mounted on the back side of the region including the through-hole portion of the electronic circuit board, guides the connection terminal portion to the through-hole portion, and a positioning portion that protrudes toward the base member side. The electronic circuit board is positioned on the base member by fitting the positioning portion to a fitting portion provided on the base member, and the connection terminal portion is guided to the guide hole to be in the through hole portion. comprising a substrate insertion guide to be inserted, said base member has a post protruding from the upper surface of the mounting surface of the electrical component, the electronic circuit board through the substrate insertion guide to said strut Fixed, the base member in the fitting portion provided in a recess provided in the upper surface of the mounting surface of the electric component, it is formed by the struts projecting on the upper surface side from the bottom of the recess Electronic equipment characterized by

A base member constituting the housing, an electrical component fixed on the base member and having a connection terminal portion protruding upward, and a through-hole portion into which the connection terminal portion is inserted, and electrically connected to the electrical component An electronic circuit board, a guide hole that is mounted on the back side of the region including the through-hole portion of the electronic circuit board, guides the connection terminal portion to the through-hole portion, and a positioning portion that protrudes toward the base member side. The electronic circuit board is positioned on the base member by fitting the positioning portion to a fitting portion provided on the base member, and the connection terminal portion is guided to the guide hole to be in the through hole portion. A board insertion guide to be inserted; and the base member has a column projecting from an upper surface serving as a mounting surface of the electric component, and the electronic circuit board is inserted into the column via the substrate insertion guide. The positioning portion of the board insertion guide is fixed and substantially cylindrical, and the fitting portion provided on the base member is a recess provided on an upper surface serving as a mounting surface of the electrical component. The opening shape of the electronic device is substantially circular or has a rounded corner.

The electronic apparatus according to claim 2 , wherein the support column is provided in a portion other than the fitting portion of the base member.

The electronic apparatus according to claim 1 , wherein a plurality of the support pillars are used to fix one electronic circuit board.

When the electronic circuit board is assembled, the positioning portion of the board insertion guide is inserted into the fitting portion, and then the connection terminal portion of the electrical component is connected to the board insertion guide. The electronic device according to claim 1 , wherein the electronic device is inserted into the guide hole.

The board insertion guide has a board temporary fixing part protruding toward the electronic circuit board side, and is temporarily attached to the electronic circuit board by fitting the board temporary fixing part into the insertion hole of the electronic circuit board. The electronic device according to claim 1 , wherein:

The electronic device according to claim 6 , wherein the substrate temporary fixing portion of the substrate insertion guide has a pin shape.

The board insertion guide and the electronic circuit gap is provided between the substrate and the gap, according to claim 1, wherein the solder fillet when soldering the connecting terminal portion is formed The electronic device as described in any one.

The electronic apparatus according to claim 1 , wherein the guide hole of the board insertion guide is formed in a shape having a taper shape extending toward an insertion port of the connection terminal portion. .

5. The electronic apparatus according to claim 1 , wherein a part of the substrate insertion guide is formed in a shape covering the support column.

The electronic device according to claim 1 , wherein the substrate insertion guide is made of an insulating material.

The electronic apparatus according to claim 1 , wherein the support column has a substantially cylindrical shape integrated with the base member.