JP4964103B2 - Power drive unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power drive unit which has improved assembly accuracy by fixing an electromagnetic shield plate at a desired position of an electronic circuit board and also securely connecting signal pins of a power module to the electronic circuit board. <P>SOLUTION: The power drive unit is equipped with at least the electronic circuit board 40, the power module 44 having the signal pins 42a and 42c connected to the electronic circuit board, and the electromagnetic shield plate 46 interposed between the electronic circuit board and power module, the power drive unit is further equipped with a fixing member 50 which fixes the electromagnetic shield plate to the electronic circuit board, and guide portions 62a, 62c and 62d for the signal pins, which are drilled through the fixing member 50. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a power drive unit, and more specifically, includes an electronic circuit board, a power module having signal pins connected to the electronic circuit board, and an electromagnetic shield plate interposed between the electronic circuit board and the power module. The present invention relates to a power drive unit provided at least.

  Recently, hybrid vehicles equipped with an internal combustion engine, an electric motor, a battery, and the like have been proposed. In such a hybrid vehicle, the internal combustion engine and the electric motor are controlled in accordance with the traveling state (high speed, low speed, etc.) of the vehicle to travel. The electric motor in such a hybrid vehicle is composed of, for example, a brushless DC motor, and direct current output from a battery is supplied to a power drive unit (PDU (Power Drive Unit)), more precisely, a stator U via a power module in the power drive unit. It is driven by sending it to a three-phase coil consisting of phase, V phase and W phase.

As an example of the power drive unit, the technique described in Patent Document 1 below can be cited. In the technique described in Patent Document 1, an electromagnetic shield plate is interposed between an electronic circuit board and a power module (power switching semiconductor element), so that the electronic circuit board is affected by electromagnetic waves from the power module. Configured to not.
Japanese Patent Laid-Open No. 2002-76257 (paragraphs 0027, 0028, FIG. 2, etc.)

  However, in the technique described in Patent Document 1, since the electromagnetic shield plate is simply fixed to the electronic circuit board with screws, the electromagnetic shield plate is not disposed at a desired position with respect to the electronic circuit board. If so, there is a risk of displacement. Therefore, for example, if the electromagnetic shield plate is displaced and disposed on the through hole of the electronic circuit board, the signal pin of the power module cannot be inserted into the through hole, resulting in a disadvantage that the assembly accuracy is lowered. .

  Accordingly, an object of the present invention is to eliminate the above-described problems, and to fix the electromagnetic shield plate at a desired position on the electronic circuit board, and to securely connect the signal pins of the power module to the electronic circuit board. An object of the present invention is to provide a power drive unit that improves the attaching accuracy.

  In order to achieve the above object, according to a first aspect of the present invention, there is provided an electronic circuit board, a power module having a signal pin connected to the electronic circuit board, and an interposition between the electronic circuit board and the power module. A power drive unit including at least an electromagnetic shield plate to be inserted is provided with a fixing member for fixing the electromagnetic shield plate to the electronic circuit board, and a guide portion for the signal pin is formed in the fixing member.

  According to a second aspect of the present invention, a snap fit that can be elastically deformed is formed in the fixing member, and a locking hole for the snap fit is formed in the electronic circuit board.

  According to a third aspect of the present invention, a positioning pin is formed on the fixing member, and an insertion hole for the positioning pin is formed in the electronic circuit board.

  According to a fourth aspect of the present invention, the fixing member is configured to have a substantially triangular shape in plan view.

  In the power drive unit according to the first aspect of the invention, the electromagnetic shield plate is provided with a fixing member for fixing the electromagnetic shield plate to the electronic circuit board, and the guide member for the signal pin is formed in the fixing member. While being able to fix to the desired position of an electronic circuit board, the signal pin of a power module can be reliably connected to an electronic circuit board by inserting the guide part of a fixing member, Therefore Assembling accuracy can be improved. In addition, since the electromagnetic shield plate is fixed to the electronic circuit board by the fixing member, the number of assembling steps can be reduced as compared with the conventional technique of fixing with the screw.

  In the power drive unit according to the second aspect, the snap fit that can be elastically deformed is formed in the fixing member, and the electronic circuit board is formed with the snap fit locking hole. In addition, the electromagnetic shield plate can be easily fixed to the electronic circuit board.

  In the power drive unit according to claim 3, since the positioning pin is formed in the fixing member and the insertion hole for the positioning pin is formed in the electronic circuit board, in addition to the above effect, the electromagnetic shield plate Can be reliably fixed to a desired position on the electronic circuit board, and the assembling accuracy can be further improved.

  In the power drive unit according to claim 4, since the fixing member is configured to have a substantially triangular shape in a plan view, in addition to the above-described effects, for example, compared to a case where the fixing member has a substantially L shape in a plan view. Therefore, it becomes difficult to deform, that is, the deformation amount of the fixing member when an external force is applied can be reduced, and dimensional stability can be ensured.

  The best mode for carrying out a power drive unit according to the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 is a schematic diagram generally showing a control apparatus for a hybrid vehicle including a power drive unit according to an embodiment of the present invention.

  In FIG. 1, reference numeral 10 indicates an internal combustion engine (hereinafter referred to as “engine”). The engine 10 is an injection type spark ignition type four-cylinder engine using gasoline as fuel. The output of the engine 10 is input to the speed change mechanism 14 via the drive shaft 12. The speed change mechanism 14 includes an automatic transmission, and is connected to drive wheels 16 of a hybrid vehicle (not shown) on which the engine 10 is mounted to change the engine output and transmit the power to the drive wheels 16 to drive the hybrid vehicle.

  A motor (electric motor) 20 is connected to the drive shaft 12 between the engine 10 and the speed change mechanism 14. The motor 20 always rotates when the engine 10 rotates, and is energized at the time of starting to crank and start the engine 10, and also energized at the time of acceleration or the like to assist (increase) the rotation of the engine 10. When the motor 20 is not energized, the motor 20 idles with the rotation of the engine 10, and at the time of deceleration when the fuel supply to the engine 10 is stopped (fuel cut), the kinetic energy generated by the rotation of the drive shaft 12 is converted into electric energy. In other words, the motor 20 functions as a generator.

  The motor 20 is connected to a battery 24 via a power drive unit (hereinafter referred to as “PDU”) 22. The motor 20 is a brushless DC motor, more specifically, an AC synchronous motor. The PDU 22 includes a power module (three-phase inverter circuit) as will be described later, and supplies direct current (electric power) supplied (discharged) from the battery 24 to a three-phase coil including the U, V, and W phases of the motor 20. The electric power generated by the regenerative operation of the motor 20 is supplied to the battery 24 (the battery 24 is charged). Thus, in the illustrated hybrid vehicle, the drive / regeneration of the motor 20 is controlled via the PDU 22. The battery 24 is formed by appropriately connecting a number of nickel metal hydride (Ni-MH) batteries in series.

  Further, the hybrid vehicle includes an engine control unit (referred to as “ENGECU”) 26 that controls the operation of the engine 10, a motor control unit (referred to as “MOTECU”) 30 that controls the operation of the motor 20, and a state of charge SOC of the battery 24. A battery control unit (referred to as “BATECU”) 32 for calculating (State Of Charge) and managing charge / discharge, and a shift control unit (referred to as “T / MECU”) 34 for controlling the operation of the transmission mechanism 14 are provided. It is done. All of the ECUs (Electronic Control Units) such as the above-described ENGECU 26 are composed of a microcomputer and are connected to each other via a bus 36 so as to be communicable with each other.

  Next, the PDU 22 according to this embodiment will be described. FIG. 2 is an exploded perspective view showing the PDU 22 as a whole.

  The PDU 22 includes one electronic circuit board (hereinafter simply referred to as a “board”) 40 constituting the MOTECU 30, a plurality (six) of power modules 44 having signal pins 42 connected to the board 40, and the board 40. One electromagnetic shield plate 46 interposed between the power module 44, a fixing member 50 for fixing the electromagnetic shield plate 46 to the substrate 40, a heat sink 52 to which the power module 44 and the like are attached, the substrate 40, and the power module 44, an electromagnetic shield plate 46, a fixing member 50, and the like 54. The PDU 22 also includes a current sensor, a smoothing capacitor, and the like, but since they have no direct relationship with the gist of the present application, illustration and description are omitted. In FIG. 2, electronic components (for example, connectors) mounted on the substrate, through holes (described later), and the like are omitted for simplification of illustration.

  Hereinafter, each element constituting the PDU 22 will be described. The six power modules 44 include IGBTs (Insulated-Gate Bipolar Transistors (not shown)) for forming a three-phase inverter circuit. Each is provided and configured as a three-phase inverter circuit module. More specifically, a power module having a high-side switch (switching element) and a power module having a low-side switch (switching element) are connected in series to form a single-phase inverter circuit, and three sets of single-phase inverter circuits are arranged in parallel. By being connected, the six power modules 44 are configured as a three-phase inverter circuit module.

  A plurality (six) of signal pins 42 are attached to the power module 44 so as to extend upward (specifically, the direction in which the substrate 40 is arranged). As shown in the figure, the six signal pins 42 are divided into three, two, and one, and are arranged separately from each other. In the following description, when the divided signal pins are particularly distinguished, three signal pins are referred to as “first signal pin 42 a”, two signal pins are referred to as “second signal pin 42 b”, one signal The pin is referred to as “third signal pin 42c”. In this specification, the description indicating the vertical relationship such as upper, lower, upper surface, and lower surface represents the vertical relationship when the case 54 side is up and the heat sink 52 side is down in the PDU 22.

  The heat sink 52 is made of a material having thermal conductivity such as aluminum, and a plurality of cooling fins 56 are formed on the lower surface 52a thereof. Thereby, for example, heat generated in the power module 44 or the like is transmitted to the cooling fins 56 of the heat sink 52 to be dissipated. Also, bolt holes 58 are formed in the four corners of the upper surface (surface to which the power module 44 is attached) 52b of the heat sink 52.

  The fixing member 50 is manufactured from a resin material, and a plurality (six, exactly the same number as the power module 44) is interposed between the power module 44 and the electromagnetic shield plate 46. That is, one fixing member 50 is provided for one power module 44.

  FIG. 3 is an enlarged perspective view showing one of the six fixing members 50 shown in FIG. 2 in an enlarged manner, and FIG. 4 is an enlarged perspective view when the fixing member 50 shown in FIG. 3 is viewed from the back side of the drawing. It is. 5 is a cross-sectional view taken along line VV in FIG. 3, FIG. 6 is a cross-sectional view taken along line VI-VI, and FIG. 7 is a cross-sectional view taken along line VII-VII.

  As shown in FIGS. 3 and 4, the fixing member 50 has a substantially triangular shape in plan view (more precisely, a substantially right triangle shape), and has a substantially triangular shape (substantially right triangular shape in the plan view) at the center. ) Is formed. Further, the fixing member 50 is positioned with respect to the guide portion 62 that guides the signal pin 42 of the power module 44, a plurality (two) of elastically deformable snap fits 64, the substrate 40 and the electromagnetic shield plate 46. A positioning pin 66, a first boss 70 that presses the electromagnetic shield plate 46, and a second boss 72 that presses the substrate 40 are provided.

  A plurality of (6) guide portions 62 are provided in the fixing member 50 and at the portion corresponding to the position of the signal pin 42 when the power module 44 is assembled to the fixing member 50. ) Drilled. In the following description, when the six guide portions 62 are particularly distinguished, the guide portion corresponding to the first signal pin 42a is referred to as “first guide portion 62a”, and the one corresponding to the second signal pin 42b. The "second guide part 62b" and the one corresponding to the third signal pin 42c are called "third guide part 62c".

  The guide portion 62 is formed to have a substantially quadrangular pyramid shape. To be precise, the guide portion 62 has a substantially circular shape in plan view on the upper surface 50a side of the fixing member 50, and a substantially square shape on the lower surface 50b side. The inclination angle α (shown in FIG. 5) is, for example, 13 degrees. In the guide portion 62, as will be described later, since the signal pin 42 is inserted from below to above, the quadrangular portion is referred to as an “inlet portion 62d” and the circular portion is referred to as an “exit portion 62e”.

  The reason why the entrance portion 62d is rectangular rather than circular is to make the region into which the signal pin 42 can be inserted as wide as possible (that is, to increase the range in which the positional deviation of the signal pin 42 is allowed). The diameter of the outlet portion 62e (indicated by reference numeral d1 in FIG. 5) is larger than the diameter of the signal pin 42 and smaller than the diameter of the through hole of the substrate 40, for example, 1.0 mm.

  The two snap fits 64 are respectively formed continuously from the lower surface 50 b of the fixing member 50 so as to be positioned near the center of the space 60. The claw portion 64a of the snap fit 64 is positioned above the upper surface 50a of the fixing member 50 as shown in FIG.

  A plurality (two) of positioning pins 66 are formed (projected) on the upper surface 50 a of the fixing member 50. Specifically, a first positioning pin 66a is provided in the vicinity of the third guide portion 62c of the fixing member 50, and the second guide portion 62b is provided between the first guide portion 62a and the second guide portion 62b. A positioning pin 66b is projected. As shown in FIGS. 5 and 6, the first and second positioning pins 66 a and 66 b are both reduced in diameter toward the tip, that is, the tip (upper end) is formed in a truncated cone shape. The Further, as can be seen from FIG. 7 and the like, the distance from the upper surface 50 a to the tip of the positioning pin 66 is set to be longer than that from the tip of the snap fit 64.

  A plurality (two) of the first bosses 70 are arranged on the upper surface 50a of the fixing member 50 and in the vicinity of the snap fit 64 (position where the snap fit 64 is sandwiched). Three second bosses 72 are arranged one by one on the upper surface 50a of the fixing member 50 and in the vicinity of the first to third guide portions 62a to 62c. The first boss 70 and the second boss 72 are both cylindrical, and the height h1 of the first boss 70 is smaller than the height h2 of the second boss 72, as shown in FIG. Set to a value. Further, the difference between the heights h1 and h2 is, for example, substantially the same value as the thickness (plate thickness) of the electromagnetic shield plate 46.

  FIG. 8 is a plan view of the electromagnetic shield plate 46 shown in FIG.

  As shown in FIG. 8, the electromagnetic shield plate 46 is formed with a plurality of insertion holes (or notches) through which the signal pins 42 of the power module 44 and the snap fits 64 of the fixing member 50 are inserted. More specifically, in the electromagnetic shield plate 46, a snap-fit insertion hole 74 through which the claw portion 64a can be inserted is provided at a portion corresponding to the position of the snap fit 64 when the fixing member 50 is assembled to the substrate 40. A plurality (six) are drilled.

  Further, in the electromagnetic shield plate 46, the signal pin 42c and the second boss 72 extending from the guide portion 62c can be inserted into portions of the fixing member 50 corresponding to the positions of the third guide portion 62c and the second boss 72. A plurality (six) of signal pin insertion holes 76 are formed.

  Further, a plurality (six) of positioning pin insertion holes 80 through which the positioning pins 66a can be inserted are formed in portions of the electromagnetic shield plate 46 corresponding to the positions of the first positioning pins 66a of the fixing member 50. . There are three types of positioning pin insertion holes 80 as shown in the figure. That is, the positioning pin insertion hole 80 (indicated by reference numeral 80a) drilled in the upper right of the electromagnetic shield plate 46 is an elongated hole having an elliptical shape in plan view. Further, the positioning pin insertion hole 80b in the lower left of the drawing of the electromagnetic shield plate 46 is a round hole having a circular shape in plan view, and the four positioning pin insertion holes 80c at the center of the drawing are inserted into other positioning pin insertion holes 80c. The round holes are larger than the holes 80a and 80b.

  In the electromagnetic shield plate 46, a plurality of notch portions 82 are provided at portions corresponding to the positions of the first and second guide portions 62a and 62b, the second boss 72, and the second positioning pin 66b of the fixing member 50 (see FIG. 6) formed.

  FIG. 9 is a plan view of the substrate 40 shown in FIG.

  As shown in FIG. 9, a through hole 84 through which the signal pin 42 of the power module 44 is inserted is formed in the substrate 40. More specifically, 18 first through holes 84a through which the first signal pins 42a are inserted (3 × number of power modules (6)), and second through which the second signal pins 42b are inserted. Twelve through holes 84b (2 × 6) and six third through holes 84c (1 × 6) through which the third signal pins 42c are inserted are formed.

  Further, a plurality (six) of locking holes 86 are formed in a portion of the substrate 40 corresponding to the position of the snap fit 64 of the fixing member 50. In the substrate 40, a first insertion hole (insertion hole) 90 through which the positioning pin 66a can be inserted is provided at a position corresponding to the position of the first positioning pin 66a of the fixing member 50, and the position of the second positioning pin 66b. A plurality of (six) second insertion holes (insertion holes) 92 through which the positioning pins 66b can be inserted are formed in the portions corresponding to. The first insertion hole 90 is a long hole having an elliptical shape in plan view, similar to the positioning pin insertion hole 80a, while the second positioning pin 66b is a planar surface similar to the positioning pin insertion hole 80b. It is a round hole having a circular shape.

  Returning to the description of FIG. 2, the case 54 has a shape in which the power module 44 and the like can be accommodated therein, and mounting holes 94 corresponding to the bolt holes 58 are formed in the four corners of the flange portion.

  Next, assembly (assembly) of the PDU 22 configured as described above will be described.

  FIG. 10 is a plan perspective view showing a state in which the electromagnetic shield plate 46 and the fixing member 50 are attached to the substrate 40, and FIG. 11 is a partially enlarged plan perspective view thereof. 12 is a partial side view showing a state in which the power module 44 is connected to the substrate 40 shown in FIG. 10, and FIG. 13 is a partially transparent perspective view of FIG. In the perspective view of FIG. 13, the substrate 40 is indicated by an imaginary line, and other members are indicated by a solid line.

  First, the electromagnetic shield plate 46 is inserted between the substrate 40 and the fixing member 50, and the fixing member 50 is attached to the substrate 40, thereby fixing the electromagnetic shield plate 46 to the back surface of the substrate 40. More specifically, as shown in FIG. 10, the electromagnetic shield plate 46 is disposed at a desired position with respect to the substrate 40. More specifically, the snap-fit insertion hole 74 is near the locking hole 86, the signal pin insertion hole 76 is near the through hole 84 c, the positioning pin insertion hole 80 is near the insertion hole 90, and the notch 82. The electromagnetic shield plate 46 is disposed so that the through holes 84a and 84b and the insertion hole 92 are in the vicinity. In FIG. 10, the fixing member 50 at the upper left of the drawing is omitted so that the positional relationship between the substrate 40 and the electromagnetic shield plate 46 is clear.

  Next, as shown well in FIG. 11 and the like, the positioning pin 66a of the fixing member 50 is inserted into the insertion hole 90 through the positioning pin insertion hole 80 (80a, b, c), and the positioning pin 66b is notched 82. Through the insertion hole 92. Thereby, the fixing member 50 and the electromagnetic shield plate 46 are positioned at a desired position with respect to the substrate 40.

  At this time, since the positioning pin insertion hole 80a is configured to be a long hole, the tolerance can be set relatively loose, and the positioning pin insertion hole 80b is a round hole. Can be positioned systematically at a desired position with respect to the substrate 40. That is, the positioning pin insertion hole 80b functions as a positive reference hole when the electromagnetic shield plate 46 is positioned with respect to the substrate 40, and the positioning pin insertion hole 80a functions as a sub reference hole. Similarly, since the insertion hole 90 is a long hole, the tolerance can be set relatively loose, and the insertion hole 92 is a round hole, so that the fixing member 50 can be reliably positioned at a desired position with respect to the substrate 40. it can. In this way, the insertion hole 92 is caused to function as the primary reference hole and the insertion hole 90 when the fixing member 50 is positioned with respect to the substrate 40 as the secondary reference hole.

  After the snap fit 64 of the fixing member 50 is inserted into the snap fit insertion hole 74, the snap fit 64 is locked in the locking hole 86. In this state, the first boss 70 is brought into contact with the electromagnetic shield plate 46 and presses (presses) the electromagnetic shield plate 46 toward the substrate 40. Further, after the second boss 72 is inserted through the signal pin insertion hole 76 or the notch 82, the second boss 72 is brought into contact with the substrate 40, thereby maintaining the positional relationship between the fixing member 50 and the substrate 40 in parallel. By attaching the fixing member 50 to the substrate 40 as described above, the electromagnetic shield plate 46 is securely fixed to the back surface of the substrate 40 while being sandwiched between the fixing members 50.

  Next, the substrate 40 on which the electromagnetic shield plate 46 is fixed by the fixing member 50 is connected to the power module 44. Specifically, as shown in FIGS. 12 and 13, the signal pin 42 of the power module 44 is inserted through the guide portion 62 of the fixing member 50, more precisely through the inlet portion 62 d of the guide portion 62. Since the guide part 62 is formed so as to have a substantially square pyramid shape as described above, the signal pin 42 is allowed to reach the outlet part 62e while the movement in the left-right direction on the paper surface is gradually restricted.

  Thereafter, the signal pin 42 is inserted into the through hole 84 via the signal pin insertion hole 76 or the notch 82 and soldered to electrically connect the substrate 40 to the power module 44. At this time, since the diameter d1 of the outlet portion 62e of the guide portion 62 is set to a value smaller than the hole diameter of the through hole 84 as described above, for example, the fixing member 50 is slightly smaller than the through hole 84 of the substrate 40. Even in the state where the position is shifted, the signal pin 42 can be inserted into the through hole 84.

  The power module 44 assembled with the substrate 40 in this way is fixed to an appropriate position on the heat sink 52, and the case 54 is attached to the heat sink 52 by inserting bolts (not shown) through the attachment holes 94 and the bolt holes 58, The PDU 22 is completed.

  As described above, in the embodiment of the present invention, the electronic circuit board (substrate) 40 and the signal pins 42 (first to third signal pins 42a, 42b, 42c) connected to the electronic circuit board are provided. A power drive unit 22 including at least a power module 44 having an electromagnetic shield plate 46 interposed between the electronic circuit board and the power module, and a fixing member 50 for fixing the electromagnetic shield plate to the electronic circuit board. In addition, the signal pin guide portion 62 (first to third guide portions 62a, 62b, 62c) is formed in the fixing member.

  Thereby, the electromagnetic shield plate 46 can be fixed to a desired position of the electronic circuit board 40, and the signal pin 42 of the power module 44 can be reliably connected to the electronic circuit board 40 by inserting the guide portion 62 of the fixing member. Therefore, assembly accuracy can be improved. Further, since the electromagnetic shield plate 46 is configured to be fixed to the electronic circuit board 40 by the fixing member 50, the number of assembling steps can be reduced as compared with the conventional technique in which the electromagnetic shield plate 46 is fixed with screws.

  Further, a snap fit 64 that can be elastically deformed is formed on the fixing member, and a snap fit locking hole 86 is formed in the electronic circuit board. Thereby, the electromagnetic shielding board 46 can be easily fixed to the electronic circuit board 40.

  Further, positioning pins 66 (first and second positioning pins 66a and 66b) are formed in the fixing member, and insertion holes 90 and 92 for the positioning pins are formed in the electronic circuit board. Thereby, the electromagnetic shielding board 46 can be reliably fixed to the desired position of the electronic circuit board 40, and the assembly accuracy can be further improved.

  The fixing member 50 is configured to have a substantially triangular shape in plan view. This makes it difficult to deform, for example, when the fixing member has a substantially L shape in plan view, i.e., reduces the deformation amount of the fixing member when an external force is applied, and ensures dimensional stability. it can.

  In the above, the example in which the power drive unit 22 is mounted on a hybrid vehicle has been described. However, the power drive unit 22 according to the present invention can also be applied to an electric vehicle.

  In addition, the fixing member 50 is configured to have a substantially triangular shape in plan view. However, depending on the shape of the power module, the number of signal pins, or the positional relationship when a plurality of power modules are arranged, for example, a rectangular shape in plan view, etc. It is good also as an optimal shape.

1 is a schematic diagram showing an overall control apparatus for a hybrid vehicle including a power drive unit according to an embodiment of the present invention. It is a disassembled perspective view which shows generally the power drive unit shown in FIG. It is an expansion perspective view which expands and represents the fixing member shown in FIG. FIG. 4 is an enlarged perspective view when the fixing member shown in FIG. 3 is viewed from the back side of the paper. It is the VV sectional view taken on the line of FIG. It is the VI-VI sectional view taken on the line of FIG. It is the VII-VII sectional view taken on the line of FIG. It is a top view of the electromagnetic shielding board shown in FIG. FIG. 3 is a plan view of the substrate shown in FIG. 2. FIG. 3 is a plan perspective view showing a state where an electromagnetic shield plate and a fixing member are attached to the substrate shown in FIG. FIG. 11 is a partially enlarged plan perspective view of FIG. 10. It is a partial side view which shows the state by which the power module was connected to the board | substrate shown in FIG. FIG. 13 is a partially transparent perspective view of FIG. 12.

Explanation of symbols

  22 Power Drive Unit (PDU), 40 Electronic Circuit Board (Board), 42 Signal Pin, 44 Power Module, 46 Electromagnetic Shield Plate, 50 Fixing Member, 62 Guide Part, 64 Snap Fit, 66 Positioning Pin, 86 Locking Hole, 90 , 92 Insertion hole

Claims (4)

  In the power drive unit comprising at least an electronic circuit board, a power module having a signal pin connected to the electronic circuit board, and an electromagnetic shield board interposed between the electronic circuit board and the power module, the electromagnetic shield board A power drive unit comprising: a fixing member for fixing the signal pin to the electronic circuit board; and a guide portion for the signal pin formed in the fixing member.   2. The power drive unit according to claim 1, wherein a snap fit that can be elastically deformed is formed in the fixing member, and a locking hole for the snap fit is formed in the electronic circuit board.   The power drive unit according to claim 1, wherein a positioning pin is formed in the fixing member, and an insertion hole for the positioning pin is formed in the electronic circuit board.   The power drive unit according to claim 1, wherein the fixing member has a substantially triangular shape in plan view.

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