JP5488582B2 - Manufacturing method of organic EL display device - Google Patents

Description

  The present invention relates to a manufacturing apparatus and a manufacturing method of an organic EL display device, and more particularly to a manufacturing apparatus and a manufacturing method of an organic EL display device applied when a transfer layer is transferred to a substrate using a laser thermal transfer method.

  In recent years, an organic EL display device using an organic EL (Electro Luminescence) element which is an organic electroluminescence element has attracted attention as one of thin display devices. Since the organic EL display device is a self-luminous display device that does not require a backlight, it has advantages such as a wide viewing angle and low power consumption.

  In general, an organic EL element used in an organic EL display device has a structure in which an organic layer made of an organic material is sandwiched between electrodes (anode and cathode) from above and below. Then, by applying a positive voltage to the anode and a negative voltage to the cathode, respectively, holes are injected into the organic layer from the anode, and electrons are injected from the cathode, so that holes are generated in the organic layer. The mechanism is such that electrons recombine and emit light.

  Generally, the organic layer of the organic EL element is composed of a plurality of functional layers including, for example, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and the like. The organic material forming each functional layer has low water resistance and cannot use a wet process. For this reason, the vacuum deposition method is employed in the process of forming the organic layer. Further, as a measure for colorization, an RGB light emitting layer is formed by using three kinds of organic materials corresponding to R (red), G (green), and B (blue) emission colors.

  The RGB light emitting layers are formed in a predetermined color arrangement on a substrate (hereinafter referred to as “element forming substrate”) used for forming an organic EL element. For this reason, it is necessary to perform patterning on the element formation substrate so that the RGB light-emitting layer is applied separately for each pixel, and laser thermal transfer is known as one of the patterning methods (for example, Patent Documents). 1).

  In the laser thermal transfer method, the transfer donor provided with the transfer layer and the substrate to be transferred are bonded to each other, and the laser light is absorbed by the photothermal conversion layer by irradiating the laser beam from the back side of the transfer donor. In this method, a part of the transfer layer (a part irradiated with laser light) is selectively transferred to the transfer substrate using this thermal energy.

  When the light emitting layer is formed on the element forming substrate by the laser thermal transfer method, it is necessary to separate the transfer donor and the element forming substrate after transferring the light emitting layer to the element forming substrate by irradiation with laser light.

JP 2002-110350 A

  However, since the transfer donor and the element forming substrate are bonded together, for example, in a state in which the transfer donor is held in a vacuum, separation is difficult due to the influence of peeling charging and the like. In particular, when a glass substrate is used as the base material for the transfer donor, the substrate itself is bent, which is increasingly difficult. Such a problem becomes more prominent as the substrate becomes larger.

  The apparatus for manufacturing an organic EL display device according to the present invention transfers a transfer layer formed on a transfer substrate to an element formation substrate of an organic EL element by a laser thermal transfer method, and then transfers the transfer substrate and the element formation substrate. And a substrate holding unit holding the transfer substrate and the element forming substrate, and adsorbing to the transfer substrate or the element forming substrate. A plurality of suction pad rows arranged in a row in a predetermined direction, and a plurality of drive means for supporting the plurality of suction pad rows so as to be movable toward and away from the substrate holding portion independently. The plurality of suction pad rows are separated from the substrate holding portion by a plurality of driving means in a state where the plurality of suction pad rows are sucked to the transfer substrate or the element forming substrate. That by moving in the forward direction, it is to separate the transfer substrate and the element forming substrate.

  In this organic EL display device manufacturing apparatus, a plurality of suction pad rows are sequentially moved in a direction away from the substrate holding portion by a plurality of driving means while a plurality of suction pad rows are sucked onto one substrate. The two substrates are separated by a combination of an operation that causes the substrate separation and an operation that propagates the substrate separation.

  In addition, in the method for manufacturing an organic EL display device according to the present invention, the transfer layer formed on the transfer substrate is transferred to the element formation substrate of the organic EL element by a laser thermal transfer method, and then the transfer substrate and the element formation are performed. A method of manufacturing an organic EL display device used for separating a substrate for use, wherein when the transfer substrate and the element formation substrate are bonded together, at least one part protrudes from the other end. Are pasted together.

  In this method of manufacturing an organic EL display device, when two substrates are bonded together, at least a part of one substrate is bonded so as to protrude from the end of the other substrate, so that the protruding portion is formed on one substrate. Is secured. For this reason, when separating the two substrates, the two substrates can be separated by using the protruding portion of one of the substrates.

  According to the present invention, in the transfer step included in the manufacturing process of the organic EL display device, the transfer layer is transferred from the transfer substrate to the element formation substrate by a laser thermal transfer method, and then the two substrates (element formation substrate, Transfer substrate) can be easily separated.

It is sectional drawing which shows the structural example of the organic electroluminescent display apparatus made into manufacture object by this invention. It is sectional drawing which shows the structural example of an organic EL element. It is a figure which shows the color arrangement | sequence of the pixel of an organic EL element. It is a figure which shows the manufacturing process of an organic electroluminescence display. It is a figure for demonstrating the structure and preparation procedure of a transfer substrate. It is a perspective view which shows the structural example of the manufacturing apparatus of an organic electroluminescence display. It is the figure which expanded a part of FIG. It is FIG. (1) explaining operation | movement of a manufacturing apparatus. It is FIG. (2) explaining operation | movement of a manufacturing apparatus. It is FIG. (3) explaining operation | movement of a manufacturing apparatus. It is FIG. (4) explaining operation | movement of a manufacturing apparatus. It is FIG. (5) explaining operation | movement of a manufacturing apparatus. It is a figure explaining the structure and operation | movement of a manufacturing apparatus provided with the board | substrate pushing-up mechanism. It is FIG. (1) which shows the operation example which induces separation of a board | substrate. It is FIG. (2) which shows the operation example which induces separation of a board | substrate. It is a top view which shows the structural example of a board | substrate bonding apparatus. It is a figure which shows the bonding state of the board | substrates of the same size. It is a figure (the 1) which shows the bonding state of the board | substrates of different sizes. It is a figure (the 2) which shows the bonding state of the board | substrates of different sizes. FIG. 11 is a diagram (part 3) illustrating an operation example that causes separation of a substrate; It is a figure which shows the operation example which propagates isolation | separation of a board | substrate.

  Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings.

<Configuration of organic EL display device>
FIG. 1 is a cross-sectional view showing a configuration example of an organic EL display device to be manufactured in the present invention. The illustrated organic EL display device 1 is configured using a plurality of organic EL elements 2. The organic EL element 2 is divided for each unit pixel by the difference in emission colors of R (red), G (green), and B (blue). However, FIG. 1 shows only one of them.

  The organic EL element 2 is formed on the element forming substrate 3. On the element formation substrate 3, a lower electrode 4, an insulating layer 5, an organic layer 6, and an upper electrode 7 are sequentially laminated together with a switching element (not shown) such as a thin film transistor. Further, the upper electrode 7 is covered with a protective layer 8, and a counter substrate 10 is disposed on the protective layer 8 via an adhesive layer 9.

  The element forming substrate 3 and the counter substrate 10 are constituted by, for example, glass substrates. The element forming substrate 3 and the counter substrate 10 are arranged so as to face each other with the lower electrode 4, the insulating layer 5, the organic layer 6, the upper electrode 7, the protective layer 8, and the adhesive layer 9 interposed therebetween. Has been.

  One of the lower electrode 4 and the upper electrode 7 serves as an anode electrode, and the other serves as a cathode electrode. The lower electrode 4 is made of a highly reflective material when the organic EL display device 1 is a top emission type, and is made of a transparent material when the organic EL display device 1 is a transmissive type.

  Here, as an example, it is assumed that the organic EL display device 1 is a top emission type and the lower electrode 4 is an anode electrode. In this case, the lower electrode 4 includes silver (Ag), aluminum (Al), chromium (Cr), iron (Fe), cobalt (Co), nickel (Ni), copper (Cu), tantalum (Ta), tungsten ( W), platinum (Pt), and gold (Au), such as a highly reflective conductive material or an alloy thereof.

  When the organic EL display device 1 is a top emission type and the lower electrode 4 is a cathode electrode, the lower electrode 4 is made of an aluminum (Al), indium (In), magnesium (Mg) -silver (Ag) alloy, Like a lithium (Li) -fluorine (F) compound and a lithium-oxygen (O) compound, it is composed of a conductive material having a small work function and high light reflectance.

  Further, when the organic EL display device 1 is a transmissive type and the lower electrode 4 is an anode electrode, the conductivity is high such as ITO (Indium-Tin-Oxide) or IZO (Indium-Zinc-Oxide). The lower electrode 4 is made of a material. Further, when the organic EL display device 1 is a transmissive type and the lower electrode 4 is a cathode electrode, the lower electrode 4 is made of a conductive material having a small work function and high light transmittance.

  The insulating layer 5 is formed on the upper surface of the element forming substrate 3 so as to cover the periphery of the lower electrode 4. A window is formed in the insulating layer 5 for each unit pixel, and the lower electrode 4 is exposed at the opening of the window. The insulating layer 5 is formed using an organic insulating material such as polyimide or photoresist, or an inorganic insulating material such as silicon oxide.

  For example, as shown in FIG. 2, the organic layer 6 has a four-layer structure in which a hole injection layer 61, a hole transport layer 62, a light emitting layer 63, and an electron transport layer 64 are stacked in this order from the element forming substrate 3 side. It is what has.

  The hole injection layer 61 is formed of, for example, m-MTDATA [4,4,4-tris (3-methylphenylphenylamino) triphenylamine]. The hole transport layer 62 is formed of, for example, α-NPD [4,4-bis (N-1-naphthyl-N-phenylamino) biphenyl]. Note that the material is not limited to this, and hole transport materials such as a benzidine derivative, a styrylamine derivative, a triphenylmethane derivative, and a hydrazone derivative can be used. Moreover, the hole injection layer 61 and the hole transport layer 62 may each have a laminated structure including a plurality of layers.

  The light emitting layer 63 is formed of a different organic light emitting material for each RGB color component. Specifically, the red light emitting layer 63r includes, for example, 2,6≡bis [(4′≡methoxydiphenylamino) styryl] ≡1,5≡dicyanonaphthalene (BSN) as a dopant material to ADN as a host material. It is composed of a mixture of 30% by weight. The green light emitting layer 63g is composed of, for example, 5% by weight of coumarin 6 as a dopant material mixed with ADN as a host material. For example, the blue light emitting layer 63b is formed by adding 4,4′≡bis [2≡ {4≡ (N, N≡diphenylamino) phenyl} vinyl] biphenyl (DPAVBi) as a dopant material to ADN as a guest material. Consists of a mixture by weight%. The light emitting layers 63r, 63g, and 63b for each color are arranged in a matrix according to the color arrangement of the pixels shown in FIG. 3, for example.

  The electron transport layer 64 is made of, for example, 8≡hydroxyquinoline aluminum (Alq3).

  The upper electrode 7 is made of a transparent or translucent conductive material when the organic EL display device 1 is a top emission type, and is made of a highly reflective material when the organic EL display device 1 is a transmission type. Is done.

  The element forming substrate 3, the lower electrode 4, the insulating layer 5, the organic layer 6, and the upper electrode 7 constitute the organic EL element 2 (red organic EL element 2r, green organic EL element 2g, blue organic EL element 2b). Has been.

  The protective layer 8 is formed for the purpose of preventing moisture from reaching the organic layer 6. For this reason, the protective layer 8 is formed with sufficient film thickness using a material with low water permeability and water absorption. Further, since the protective layer 8 needs to transmit light emitted from the organic layer 6 when the organic EL display device 1 is a top emission type, it is made of a material having a light transmittance of about 80%, for example. Composed.

  Further, when the upper electrode 7 is formed of a metal thin film, and this metal thin film directly forms the insulating protective layer 8, an inorganic amorphous insulating material such as amorphous silicon is used as a material for forming the protective layer 8. (Α-Si), amorphous silicon carbide (α-SiC), amorphous silicon nitride (α-Si1-xNx), amorphous carbon (α-C), and the like can be suitably used. Such an inorganic amorphous insulating material does not constitute grains, and therefore has a low water permeability and becomes a good protective layer 8.

  The adhesive layer 9 is formed of, for example, a UV (ultraviolet) curable resin. The adhesive layer 9 is for fixing the counter substrate 10.

  Although illustration is omitted here, when the organic EL display device 1 having such a configuration is provided with a combination of color filters, light emission emitted from the organic EL elements 2r, 2g, and 2b corresponding to each color of RGB. A color filter that transmits only light in the vicinity of the peak wavelength of the spectrum is provided on the light extraction surface side of each color organic EL element 2r, 2g, 2b.

<Production flow of organic EL display device>
As shown in FIG. 4, the organic EL display device is roughly divided into a “transfer substrate (transfer donor) manufacturing step: S 1”, an “element forming substrate first film forming step: S 2”, and “ It is manufactured through “transfer process: S3”, “second film formation process of element forming substrate: S4”, and “sealing process: S5”. Here, a hole injection layer 61, a hole transport layer 62, and an electron transport layer 64, which are organic layers common to each unit pixel, are formed on the element forming substrate 3 in a solid manner, and are divided for each unit pixel. A manufacturing flow of the organic EL display device 1 having a structure in which the light emitting layer 63 (63r, 63g, 63b) is separately applied by a laser thermal transfer method will be described.

(Transfer substrate manufacturing process: S1)
First, as shown in FIG. 5, a light absorbing layer 14 made of a light absorbing metal layer is formed on the surface of the transfer substrate 13. The transfer substrate 13 is made of, for example, a transparent glass substrate, and may be a flexible sheet. Here, the surface bonded to the element forming substrate 3 in the “transfer step” described later is defined as the front surface of the transfer substrate 13, and the opposite surface (back side) is defined as the back surface of the transfer substrate 13. When the transfer layer formed on the transfer substrate 13 is transferred to the element formation substrate 3 by the laser transfer method, the light absorption layer 14 absorbs laser light emitted from the light source and converts it into thermal energy. Become a layer. The light absorption layer 14 is formed of chromium with a film thickness of 200 nm (nanometers) by sputtering, for example. The light absorption layer 14 may be formed of molybdenum.

  Next, the transfer substrate 13 on which the light absorption layer 14 has been formed is introduced into a vacuum vapor deposition apparatus, and the light emitting layer 15 serving as the transfer layer is formed on the transfer substrate 13 using this vacuum vapor deposition apparatus. The light emitting layer 15 is formed in a solid (wide plate shape) so as to cover the light absorption layer 14. The light emitting layer 15 is a thin film layer that is the basis of the light emitting layer 63 that is finally formed on the element forming substrate 3. The thickness of the light emitting layer 15 is 30 nm, for example. In this manner, at least the photothermal conversion layer and the transfer layer are formed on the transfer substrate 13, thereby producing a transfer donor.

  When the red light emitting layer 63r, the green light emitting layer 63g, and the blue light emitting layer 63b are formed on the element forming substrate 3, the light emitting layers 63r, 63g, and 63b for each color are separately formed using at least three transfer substrates 13. To form.

(First film forming step of element forming substrate: S2)
The lower electrode 4 is formed on the element forming substrate 3 such as a glass substrate by forming a conductive material, and the lower electrode 4 is patterned in accordance with the arrangement of unit pixels. The thickness of the lower electrode 4 is, for example, 100 to 200 nm.

  Next, an insulating layer 5 is formed by depositing, for example, silicon oxide by sputtering on the element forming substrate 3 so as to cover the lower electrode 4, and the insulating layer 5 is opened by lithography. As a result, the surface of the lower electrode 4 is exposed in the unit pixel region. The thickness of the insulating layer 5 is 2 μm, for example.

  Next, a hole injection layer 61 is formed by evaporating, for example, m-MTDATA on the element formation substrate 3 so as to cover the insulating layer 5 and the lower electrode 4 exposed at the opening. The thickness of the hole injection layer 61 is, for example, 25 nm.

  Next, the hole transport layer 62 is formed by evaporating, for example, α-NPD on the element formation substrate 3 so as to cover the hole injection layer 61. The thickness of the hole transport layer 62 is, for example, 30 nm. Although not shown here, the light emission auxiliary layer may be formed by evaporating a material having the same composition as that of the light emitting layer 63 on the hole transport layer 62.

(Transfer process: S3)
The transfer substrate 13 obtained in “Transfer Substrate Fabrication Step: S1” and the element formation substrate 3 obtained in “Element Formation Substrate First Film Formation Step: S2” are organic layers ( The light emitting layer 15 and the hole transport layer 62) are arranged in close contact with each other, whereby the element forming substrate 3 and the transfer substrate 13 are bonded together. Such substrate bonding is preferably performed in a vacuum atmosphere or an inert gas atmosphere.

  Further, after the element forming substrate 3 and the transfer substrate 13 are bonded together, the substrates can be reliably brought into close contact with each other by evacuating the substrates. However, since the insulating layer 5 is formed to be sufficiently thicker than the hole injection layer 61 and the hole transport layer 62 on the element forming substrate 3, the thickness of the insulating layer 5 is included in each unit pixel portion. A gap equivalent to about 2 μm is secured.

  Next, an infrared laser beam having a wavelength of, for example, 800 nm is irradiated from the back side of the transfer substrate 13 to be absorbed by the light absorption layer 14, and a part of the light emitting layer 15 is transferred using the converted heat energy. The substrate 13 is selectively transferred from the substrate 13 to the element forming substrate 3. At this time, the transfer pattern of the light emitting layer 15 transferred to the element forming substrate 3 depends on the irradiation position of the laser beam in the substrate surface of the transfer substrate 13. Thereby, the light emitting layer 63 is formed in the unit pixel portion on the element forming substrate 3. After the light emitting layer 15 is transferred in this way, the element forming substrate 3 and the transfer substrate 13 are separated. The substrate separation method will be described in detail later.

  Usually, only one light-emitting layer 15 is formed on one transfer substrate. Therefore, when forming the RGB light-emitting layers 63r, 63g, and 63b on the element forming substrate 3, those three colors are used. The same operation as described above will be repeated.

(Second film formation step of element forming substrate: S4)
First, the electron transport layer 64 is formed on the device formation substrate 3 so as to cover the hole transport layer 62 and the light emitting layer 63 using the device formation substrate 3 obtained in the above-mentioned “transfer process: S3”. . The electron transport layer 64 is formed, for example, by depositing 8≡hydroxyquinoline aluminum (Alq3) on the entire display area by a vacuum deposition method. The display area described here refers to a rectangular area in which a plurality of unit pixels are arranged in a matrix. The electron transport layer 64 has a thickness of 20 nm, for example.

  Next, the upper electrode 7 is formed on the element forming substrate 3 so as to cover the electron transport layer 64. For the upper electrode 7, for example, LiF is formed with a film thickness of about 0.3 nm (deposition rate˜0.01 nm / sec) by a vacuum evaporation method, and then an Mg—Ag alloy is formed with a film thickness of 10 nm by a vacuum evaporation method. By forming, it forms as two conductive layers.

(Sealing process: S5)
First, the protective layer 8 is formed on the element forming substrate 3 so as to cover the upper electrode 7 using the element forming substrate 3 obtained in the above “second film forming step of element forming substrate: S4”. To do. The protective layer 8 is formed by depositing an insulating material or a conductive material on the upper electrode 7. At that time, the protective layer 8 may be formed by a film forming method with a small energy of film forming particles, for example, a vapor deposition method or a CVD method so as not to affect the base.

  When the protective layer 8 is formed of a conductive material, a transparent conductive material such as ITO or IXO is used. For example, when the protective layer 8 is formed of amorphous silicon nitride, it is formed to a thickness of 2 to 3 μm by the CVD method. However, in that case, the film formation temperature is set to room temperature in order to prevent a decrease in luminance due to deterioration of the organic layer 6, and further, film formation is performed under the condition that the film stress is minimized in order to prevent the protective layer 8 from peeling off. It is desirable to do. The protective layer 8 is preferably formed continuously in the same thin film forming apparatus as that for forming the upper electrode 7 without exposing the upper electrode 7 to the atmosphere. Thereby, deterioration of the organic layer 6 by air | atmosphere can be prevented.

  Next, the adhesive layer 9 is formed on the element forming substrate 3 so as to cover the protective layer 8. The adhesive layer 9 is formed, for example, by applying a UV curable resin on the protective layer 8 by spin coating to flatten the step due to the opening of the insulating layer 5.

  Next, the counter substrate 10 is fixed on the element forming substrate 3 through the adhesive layer 9 to complete the organic EL display device 1. When the organic EL display device 1 is a top emission type and is combined with a color filter, the color filter is formed on the counter substrate 10 in advance.

  FIG. 6 is a perspective view showing a configuration example of a manufacturing apparatus (substrate separation apparatus) for an organic EL display device used when separating the element formation substrate 3 and the transfer substrate 13 in the transfer step S3. The illustrated organic EL display device manufacturing apparatus 21 is used when two substrates, one of which is a transfer substrate 13 and the other of which is an element forming substrate 3, are separated at atmospheric pressure. The manufacturing apparatus 21 of the organic EL display device is roughly divided into a main body frame 22 formed in a generally rectangular shape, a substrate holding part 23 fixed to the main body frame 22, and a substrate suction that moves along the main body frame 22. The unit 24 and the substrate storage cassette 25 are provided.

  The outer frame portion of the main body frame 22 is formed in a rectangular shape in plan view. The substrate holding part 23 is provided on one side in the longitudinal direction of the main body frame 22, and the substrate storage cassette 25 is provided on the other side in the longitudinal direction of the main body frame 22. Further, in the longitudinal direction of the main body frame 22, the substrate holding part 23 and the substrate storage cassette 25 are arranged at a predetermined distance.

  The substrate holding unit 23 is partitioned into a rectangle within the frame of the main body frame 22. The longitudinal direction of the substrate holding part 23 coincides with the short direction of the main body frame 22, and the short direction of the substrate holding part 23 coincides with the longitudinal direction of the main body frame 22. The substrate holding unit 23 is configured using a plurality of suction pads 26.

  Two suction pads 26 are attached to the upper surface of the pad support member 27. The pad support member 27 is formed in a rectangular plate shape in plan view. The suction pads 26 are arranged at both ends of the pad support member 27 in the longitudinal direction. The pad support member 27 is disposed so that the longitudinal direction of the pad support member 27 coincides with the short direction of the main body frame 22. A plurality of pad support members 27 are provided in a rectangular frame that partitions the substrate holding portion 23. Specifically, a total of twelve pad support members 27 are provided in a 4 × 3 array, four in the lateral direction of the main body frame 22 and three in the longitudinal direction of the main body frame 22.

  The substrate suction unit 24 is provided so as to be capable of reciprocating between the substrate holding portion 23 and the substrate storage cassette 25 in the longitudinal direction of the main body frame 22. The substrate suction unit 24 has a plurality (five in the illustrated example) of suction heads 30. Each suction head 30 is attached to a common base 31. The gantry 31 is formed in a rectangular shape in plan view. The gantry 31 is formed in a gate shape when viewed from the longitudinal direction of the main body frame 22. Four wheels 32 are provided at the lower end of the gantry 31, and the gantry 31 is configured to move in the longitudinal direction of the main body frame 22 as each wheel 32 rotates.

  The suction head 30 is configured using a support plate 33, a lifting cylinder 34, a pair of guide bushes 35, a pad mounting base 36, and a plurality of suction pads 37. The support plate 33 is fixed to the upper portion of the gantry 31 so as to extend in the short direction of the gantry 31. The support plate 33 is formed in a rectangular plate shape in plan view. An elevating cylinder 34 and a pair of guide bushes 35 are attached to the support plate 33. The raising / lowering cylinder 34 is disposed at the center in the longitudinal direction of the support plate 33. The pair of guide bushes 35 are arranged on both sides of the lifting cylinder 34 so as to sandwich the lifting cylinder 34 in the longitudinal direction of the support plate 33.

  The pad mounting base 36 is disposed below the support plate 33 so as to face the support plate 33. The pad attachment base 36 is formed in a rectangular plate shape in plan view, and is arranged side by side at a predetermined interval in the short side direction of the main body frame 22 (longitudinal direction of the substrate suction unit 24). The pad mounting base 36 is supported by the above-described lifting cylinder 34 and a pair of guide bushes 35 so as to be lifted and lowered. The lifting cylinder 34 serves as an actuator (driving means) that moves the pad mounting base 36 up and down, and the pair of guide bushes 35 serve as members that guide the lifting movement of the pad mounting base 36. One lifting / lowering cylinder 34 is provided for each suction head 30. For this reason, the plurality of suction heads 30 can be driven independently of each other.

  The plurality of suction pads 37 are arranged in a row (one row) on the lower surface of the pad mounting base 36 along the longitudinal direction of the pad mounting base 36, and the plurality of suction pads 37 constitute a suction pad row. One suction pad row is provided for each pad mounting base 36 (one row). For this reason, a plurality of suction pad rows are arranged in the lateral direction of the main body frame 22 in the same manner as the pad mounting base 36. In this case, the direction of arrangement of the plurality of suction pads 37 provided on one suction head 30 (pad mounting base 36) and the direction of arrangement of the plurality of suction pad rows provided on the substrate suction unit 24 differ from each other by about 90 degrees. It becomes. That is, the arrangement direction of the suction pads 37 coincides with the longitudinal direction of the main body frame 22, and the arrangement direction of the suction pad rows coincides with the short direction of the main body frame 22. Further, each suction pad 37 constituting the suction pad row is configured using, for example, a pad that can be swung or a bellows-like pad so as to follow the inclination angle of the substrate at the time of separation.

  Here, among the suction pad rows provided in the plurality of suction heads 30, the suction force of the suction pad row disposed at one end in the short direction of the main body frame 22 is the suction force of the other suction pad rows. Is set larger than. Specifically, for example, as shown in FIGS. 6 and 7, the identification number No. is assigned to each suction head 30 from one end to the other end of the main body frame 22 in the short direction. 1-No. 5 (the display of the suction heads 30 of No. 4 and No. 5 is omitted in FIG. 7). If the suction head 30 of the first suction head sucks the vicinity of the short side of the substrate with a plurality of suction pads 37, No. 1 is used. No. 1 suction head 30 is arranged with eight suction pads 37 at a first interval. 2-No. In each of the five suction heads 30, six suction pads 37 are arranged at a second interval wider than the first interval.

  No. For the first suction head 30, a suction pad 37 having a first pad diameter (for example, φ = 20 mm) is used. 2-No. As the suction heads 30, the suction pads 37 having a second pad diameter (for example, φ = 16 mm) smaller than the first pad diameter are used. As a result, no. The suction force of the suction pad row provided in the suction head 30 of No. 2-No. It becomes larger than the suction force of the suction pad row provided in the fifth suction head 30.

  In addition, among the plurality of suction heads 30, in the short direction of the main body frame 22, the driving force of the lifting cylinder 34 that lifts and lowers the suction pad row disposed at one end is the lift that lifts and lowers the other suction pad rows. It is set to be larger than the driving force of the cylinder 34 for use. Specifically, no. As the suction head 30, a lifting cylinder 34 having a first cylinder bore diameter (for example, φ = 30 mm) is used. 2-No. For the suction heads 30 of 5, elevating cylinders 34 each having a second cylinder bore diameter (for example, φ = 25 mm) smaller than the first cylinder bore diameter are used. Thereby, when air supply of the same pressure was performed, No. The driving force of the elevating cylinder 34 provided in the suction head 30 of No. 1 2-No. It becomes larger than the driving force of the raising / lowering cylinder 34 provided in the 5 suction heads 30.

  When two substrates are separated using the organic EL display device manufacturing apparatus 21 having the above-described configuration, the substrates are separated according to the following procedure. First, as shown in FIG. 8, in the state where the substrate suction unit 24 is retracted to the substrate storage cassette 25 side, the two bonded substrates (hereinafter also referred to as “bonded substrates”) 41 and 42 are substrates. Set in the holding unit 23. For example, if one (upper) substrate 41 is the element forming substrate 3, the other (lower) substrate 42 corresponds to the transfer substrate 13, and one (upper) substrate 41, 42. If the substrate 41 is a transfer substrate 13, the other (lower) substrate 42 corresponds to the element forming substrate 3. Each board | substrate 41 and 42 is formed in the rectangle. The two substrates 41 and 42 are set in such a direction that the longitudinal direction of the substrate coincides with the short direction of the main body frame 22 and the short direction of the substrate coincides with the long direction of the main body frame 22.

  In the substrate holding part 23, the lower substrate 42 of the two bonded substrates 41, 42 is brought into contact with each suction pad 26, and each suction pad 26 is sucked by evacuation, thereby lowering the lower substrate 42. The substrate 42 on the side is sucked by the plurality of suction pads 26. Accordingly, the two substrates 41 and 42 are held in a fixed state in a horizontal posture by the substrate holding unit 23.

  Next, by moving the substrate suction unit 24 to the substrate holding unit 23 side, all the suction pads 37 provided in a row in each suction head 30 are made to face the upper substrate 41. In this case, a plurality of (five in the illustrated example) suction pad rows included in the substrate suction unit 24 are arranged at a predetermined interval in the longitudinal direction of the substrate. Further, the suction pad row arranged at one end in the substrate longitudinal direction is arranged in a line along one short side portion of the substrate 41, and the suction pad row arranged at the other end in the substrate longitudinal direction is a substrate 41 is arranged in a line along the other short side portion. The arrangement direction of the suction pad rows is not limited to the longitudinal direction of the substrate, but may be the lateral direction of the substrate. However, from the standpoint of ease of substrate separation, the longitudinal direction of the substrate is preferable.

  Next, by driving the plurality of lifting cylinders 34 simultaneously or sequentially, the suction pads 37 provided on each suction head 30 are lowered together with the pad mounting base 36 as shown in FIG. As a result, each suction pad row moves in a direction approaching the substrate holding portion 23 in accordance with the driving of the elevating cylinder 34. For this reason, all the suction pads 37 are in contact with the upper surface of the upper substrate 41. In this state, each suction pad 37 is sucked by evacuation, whereby the upper substrate 41 is sucked by the plurality of suction pads 37. As a result, the two bonded substrates 41 and 42 are sucked and held simultaneously by the substrate holding unit 23 and the substrate sucking unit 24. When the operation so far is viewed from the longitudinal direction of the main body frame 22, it is as shown in FIGS.

  Next, as shown in FIG. 1 is driven to drive the lifting / lowering cylinder 34 provided in the suction head 30. The plurality of suction pads 37 provided on one suction head 30 are raised together with the pad mounting base 36. As a result, no. In one suction head 30, the suction pad row moves in a direction away from the substrate holding unit 23 in accordance with the driving of the elevating cylinder 34. For this reason, a peeling force (pulling force) for peeling the upper substrate 41 from the lower substrate 42 acts on one short side portion of the two bonded substrates 41 and 42, and this peeling force. Therefore, the upper substrate 41 is peeled off from the lower substrate 42.

  In particular, when separating the two bonded substrates 41 and 42, an operation that triggers the separation of the substrates is required. This operation requires a very large force due to the influence of peeling charging and the like. In contrast, no. In one suction head 30, the suction force of the suction pad rows is ensured to be large by increasing the pad diameter of the suction pads 37 or by increasing the spacing between the suction pad rows as compared to the other suction heads 30. In addition, by increasing the bore diameter of the lifting cylinder 34, a large driving force for lifting is secured. For this reason, no. By driving one suction head 30, it is possible to cause the substrate 41 to peel off the two substrates 41 and 42 by applying a force necessary to induce the separation of the substrates. However, at this stage, only a part of the two substrates 41 and 42 is peeled off, and the two substrates 41 and 42 are not completely separated.

  Next, as shown in FIG. 2 is driven to drive the elevating cylinder 34 provided in the suction head 30 of No. 2. The plurality of suction pads 37 provided on the second suction head 30 are raised together with the pad mounting base 36. As a result, no. In the second suction head 30, the suction pad row moves away from the substrate holder 23 in accordance with the driving of the lifting cylinder 34.

  Next, as shown in FIG. 3 by driving the lifting / lowering cylinder 34 provided in the suction head 30 of No. 3. The plurality of suction pads 37 provided on the three suction heads 30 are raised together with the pad mounting base 36. As a result, no. In the third suction head 30, the suction pad row moves away from the substrate holder 23 in accordance with the driving of the lifting cylinder 34.

  Next, as shown in FIG. 4 by driving the lifting / lowering cylinder 34 provided in the suction head 30 of No. 4. The plurality of suction pads 37 provided on the four suction heads 30 are raised together with the pad mounting base 36. As a result, no. In the fourth suction head 30, the suction pad row moves away from the substrate holder 23 in accordance with the driving of the lifting cylinder 34.

  Next, as shown in FIG. No. 5 by driving the lifting / lowering cylinder 34 provided in the suction head 30. The plurality of suction pads 37 provided on the five suction heads 30 are raised together with the pad mounting base 36. As a result, no. In the suction head 30 of No. 5, the suction pad row moves in a direction away from the substrate holder 23 in accordance with the driving of the lifting cylinder 34. At this stage, the two substrates 41 and 42 are completely separated.

  Thereafter, as shown in FIG. 12, the substrate 41 is placed immediately above the substrate storage cassette 25 by moving the substrate suction unit 24 toward the substrate storage cassette 25 while holding the substrate 41 by the substrate suction unit 24. In this state, by simultaneously driving the plurality of lifting cylinders 34, the suction pads 37 provided on each suction head 30 are lowered together with the pad mounting base 36. Then, the substrate 41 is stored in the substrate storage cassette 25 by releasing the suction by all the suction pads 37. As a result, the substrate 41 is transferred from the substrate suction unit 24 to the substrate storage cassette 25.

  When the two substrates 41 and 42 are separated using the organic EL display device manufacturing apparatus 21 as described above, No. 1-No. A plurality of suction pad rows corresponding to the suction heads 30 of No. 1 to No. By driving a plurality of lifting cylinders 34 so as to be raised in order toward No. 5, first, The suction pad row of the first suction head 30 performs an operation for inducing separation of the substrate. 2-No. The operation of propagating the separation of the substrate can be performed by the suction pad row of the five suction heads 30. Therefore, the two substrates 41 and 42 can be separated without greatly deforming. Even if the two substrates 41 and 42 are in close contact with each other, no. The end portions of the two substrates 41 and 42 can be peeled using the pulling force by the single suction head 30.

  Moreover, if the manufacturing apparatus 21 of said organic EL display apparatus is used, even when handling large glass substrates, such as G6-G8 generation, for example, it will become possible to isolate | separate a board | substrate. In particular, when separating large glass substrates such as G6 to G8 generation, it is possible to keep the space for separation small compared to the case where the edge of the substrate is mechanically held and lifted by a mechanical chuck or the like. it can. Accordingly, the height dimension and volume of the apparatus can be kept small. Furthermore, the amount of deformation such as bending of the substrate can be suppressed to a small value, and the occurrence of cracks and the like can be prevented.

  In the above-described embodiment, No. 1 disposed at the extreme end in the longitudinal direction of the substrate suction unit 24. Although the operation of inducing the separation of the substrate is performed using the single suction head 30, the present invention is not limited to this, and the mechanism for inducing the separation of the substrate may be promoted using a mechanism different from the suction head 30. Good.

  Specifically, for example, a substrate push-up mechanism 43 as shown in FIG. 13 can be used. The substrate push-up mechanism 43 is configured using a push-up cylinder 44 and a push-up member 45. The push-up cylinder 44 is configured using, for example, an air cylinder. The push-up cylinder 44 is disposed downward.

  The push-up member 45 is attached to the tip end of the piston rod of the push-up cylinder 44. The push-up member 45 pushes up the end portion of the substrate 41 using the protruding portion 41 </ b> A of the upper substrate 41 out of the two bonded substrates 41 and 42 set on the substrate holding portion 23. The “protruding portion” of the substrate described here is a portion where the two substrates do not overlap each other at the outer peripheral portion of the substrate when the two bonded substrates are viewed from a direction perpendicular to the substrate surface ( The part that protrudes outside in the state of a single plate.

  In the substrate push-up mechanism 43 having the above-described configuration, when the push-up cylinder 44 is driven, the push-up member 45 moves up and down according to the advance / retreat operation of the piston rod. Therefore, in the actual substrate separation operation, first, as shown in FIG. 13A, the bonded substrates 41 and 42 are set on the substrate holding portion 23, and the lower substrate 42 is sucked to each suction pad 26. In this state, the suction pad row provided in each suction head 30 is made to oppose the upper substrate 41, and one of the push-up members 45 of the substrate push-up mechanism 43 is placed on the protruding portion 41 A of the upper substrate 41. Opposite parts.

  Next, as shown in FIG. 13B, the plurality of lifting cylinders 34 are driven simultaneously or sequentially to lower the suction pad row provided in each suction head 30 together with the pad mounting base 36, All the suction pads 37 are brought into contact with the upper substrate 41, and in this state, each of the suction pads 37 is sucked by evacuation, whereby the upper substrate 41 is sucked onto the plurality of suction pads 37.

  Next, as shown in FIG. 13C, the push-up member 45 is raised by driving the push-up cylinder 44, so that the protruding portion 41 </ b> A of the board 41 is pushed up by the push-up member 45 and upward (in a direction away from the board 42). No. 2 closest to the substrate push-up mechanism 43 in conjunction with the push-up operation. 1 is driven to drive the lifting / lowering cylinder 34 of the suction head 30. The suction pad row provided in one suction head 30 is raised together with the pad mounting base 36. Thereby, a peeling force (push-up force) for peeling the upper substrate 41 from the lower substrate 42 acts on one short side portion of the two bonded substrates 41 and 42, and this peeling force. Therefore, the upper substrate 41 is peeled off from the lower substrate 42. In this way, the operation that causes the substrate separation is performed by the substrate push-up mechanism 43.

  In addition to the above-described incentive action for substrate separation, the short side portion of the substrate 41 has No. A pulling force by one suction head 30 acts, and the short side portion of the substrate 41 is pulled up by this pulling force. In this case, the substrate separation inducing operation is performed by the substrate push-up mechanism 43. The pad suction force and cylinder driving force of one suction head 30 may be equal to or less than those of the other suction heads 30.

  Thereafter, in the same manner as above, no. 2-No. No. 5 suction cylinder 30 is driven in order, and each suction pad row is raised in order according to this. 2-No. The pulling operation for propagating the separation of the substrate is performed by the five suction heads 30. As a result, the two substrates 41 and 42 are completely separated.

  In addition, the triggering operation of the substrate separation is not limited to the above-described push-up operation, for example, after clamping the protruding portion 41A of the upper substrate 41 with an openable clamp member 53, as shown in FIG. As shown in FIG. 14B, an operation of lifting the end of the substrate 41 by raising the clamp member 53 vertically or in an arc shape may be used. In addition to this, for example, as shown in FIG. 15A, the piston rod of the push-up cylinder 54 is advanced from the lower side of the substrate 41 to move upward, as shown in FIG. You may utilize the operation | movement which pushes up the protrusion part 41A and pushes up with the cylinder 54. FIG.

  In order to secure the protruding portion on the substrate 41 and / or the substrate 42, it is desirable to bond the two substrates 41 and 42 using a substrate bonding apparatus as shown in FIG. The illustrated substrate bonding apparatus includes four abutting positioning blocks 51 that hold the four corners of the substrate 41 and four push-up positioning blocks 52 that hold the four corners of the substrate 42. is there. Here, it is assumed that the two substrates 41 and 42 are formed in a rectangular shape with the same size.

  When the two substrates 41 and 42 are bonded using the substrate bonding apparatus having the above-described configuration, one substrate 41 is held against the four positioning blocks 51 corresponding thereto, and the other substrate 42 is held. The four positioning blocks 52 corresponding to this are abutted and held.

  At that time, the four positioning blocks 51 and the four positioning blocks 52 are arranged in advance by shifting their positions by predetermined dimensions in the longitudinal direction and the short direction of the substrates 41 and 42. As a result, the two substrates 41 and 42 are arranged with their positions relatively shifted in the substrate longitudinal direction and the substrate lateral direction in the substrate surface direction, and thus the two substrates 41 and 42 are placed in this state. Bond together by vacuuming. Thus, as shown in FIGS. 17A and 17B, one substrate 41 is provided with an L-shaped protruding portion 41A, and the other substrate 42 is also provided with an L-shaped protruding portion 42A.

  In addition, the four positioning blocks 51 and the four positioning blocks 52 are arranged in advance by shifting the positions. For example, the two positioning blocks 51 and 52 correspond to the two substrates 41 and 42, respectively. After the holding, the positions of the two substrates 41 and 42 may be relatively shifted by moving the four positioning blocks 51 or the four positioning blocks 52 together.

  Further, if the outer peripheral sizes of the two substrates 41 and 42 are different in size, when the substrates 41 and 42 are bonded together, a protruding portion can be secured at least on the outer peripheral portion of the substrate. . For example, as shown in FIGS. 18A and 18B, when the outer peripheral size of one substrate 41 is larger than the outer peripheral size of the other substrate 42, a rectangular shape is formed on the outer peripheral portion of the one substrate 41. An annular protrusion 41A can be secured. Further, as shown in FIGS. 19A and 19B, when the outer peripheral size of one substrate 41 is smaller than the outer peripheral size of the other substrate 42, a rectangular shape is formed on the outer peripheral portion of the other substrate 42. An annular protrusion 42A can be secured.

  As described above, when the two substrates 41 and 42 are bonded together by the substrate bonding apparatus, by using the organic EL display device manufacturing apparatus 21 in the above-described transfer step S3 by securing a protruding portion on at least one of the substrates. When the two substrates are separated, it is possible to separate the element forming substrate 3 and the transfer substrate 13 by using the protruding portion previously secured at the time of bonding the substrates.

  In addition, by securing an L-shaped protruding portion along the long side portion perpendicular to the short side portion of the substrate and the short side portion of the substrate to at least one of the two bonded substrates, It is possible to perform an operation for inducing substrate separation and an operation for propagating the substrate separation by using the protruding portion. The operation for inducing the substrate separation is performed by pressurizing one side portion of the L-shaped protruding portion, and the operation for propagating the substrate separation is performed by pressing the other side portion of the L-shaped protruding portion. Then, after the two substrates are separated by an operation that induces the substrate separation, the two substrates are completely separated by an operation that propagates the substrate separation.

  As an operation for inducing the separation of the substrate, for example, a lifting operation by the clamp member 53 shown in FIGS. 14A and 14B, or a lifting operation by the lifting cylinder 54 shown in FIGS. 15A and 15B. It is also possible to press the protruding portion 42A of the substrate 42 so as to peel from the substrate 41 by the operation or the pressing operation by the pressing cylinder 55 as shown in FIGS.

  As an operation for propagating the substrate separation, for example, as shown in FIG. 21, a plurality (five in the illustrated example) of pushing members at predetermined intervals in the longitudinal direction of the protruding portion 41A along the long side portion of the substrate 41. 56a to 56e are arranged, and the plurality of pushing members 56a to 56e are operated in order (56a → 56b → 56c → 56d → 56e) from the substrate separation start side (side from which the substrate is peeled off by the protruding mechanism or the like), respectively. It can also be implemented by pressing the protruding portion 41A of the substrate 41 in one direction (a direction away from the substrate 42) by the pushing members 56a to 56e.

  DESCRIPTION OF SYMBOLS 1 ... Organic EL display device, 2 ... Organic EL element, 3 ... Element formation substrate, 13 ... Transfer substrate, 15 ... Light emitting layer (transfer layer), 23 ... Substrate holding part, 24 ... Substrate adsorption unit, 41, 42 ... Substrate, 41A, 42A ... Projecting part, 43 ... Substrate push-up mechanism

Claims (3)

In the step of forming the organic EL element for constituting the organic EL display device, the substrate provided with the transfer layer and the element forming substrate of the organic EL element are bonded together, and the transfer layer on the substrate is bonded by the laser thermal transfer method. A method for producing an organic EL display device used for separating the substrate and the element formation substrate after being transferred onto the element formation substrate,
When the substrate and the element forming substrate are bonded together, at least one of the substrates is bonded so that it protrudes from the other end, and at least one of the L-shaped protruding portions is secured.
When the substrate and the element formation substrate are separated, one side of the L-shaped protruding portion is pressed in a direction away from the other substrate to separate the substrate and the element formation substrate. Thereafter, the L-shaped protruding portion is operated by sequentially operating a plurality of pushing members arranged at predetermined intervals in the longitudinal direction of the other side portion of the L-shaped protruding portion from one side of the L-shaped protruding portion. Sequentially pressing a plurality of portions in the other side portion in a direction away from the other substrate from one side of the L-shaped protruding portion to completely separate the two substrates,
A method for manufacturing an organic EL display device.   The method for manufacturing an organic EL display device according to claim 1, wherein when the substrate and the element forming substrate are bonded together, the substrates are bonded to each other while being relatively displaced in the substrate surface direction.   The method for manufacturing an organic EL display device according to claim 1, wherein when the substrate and the element forming substrate are bonded together, the substrates having different outer peripheral sizes are bonded together.

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