JP5324323B2 - Chemical flow method, and method and apparatus for manufacturing integrated circuit device using the same - Google Patents

Description

  The present invention relates to a chemical flow method, a method of manufacturing an integrated circuit element using the same, and an apparatus, a method of flowing a chemical such as a cleaning liquid, an etching liquid, etc., and an integrated circuit such as a semiconductor element and a flat display element. The present invention relates to a method and an apparatus for manufacturing an element.

  In general, in manufacturing an integrated circuit element such as a semiconductor element or a flat display element, a unit process using a chemical such as a cleaning liquid or an etching liquid is repeatedly performed. Here, examples of the unit process include a cleaning process using a cleaning liquid and an etching process using an etching liquid. In the unit process using the mentioned chemical, a bath containing the chemical is mainly used. In performing the unit process using the bus, the substrate for manufacturing the integrated circuit element is dipped in the chemical contained in the bus, or the substrate for manufacturing the integrated circuit element is positioned inside the bus. Then, the chemical is caused to flow inside the bath. Here, when the integrated circuit element is a semiconductor element, the substrate is exemplified by a semiconductor wafer, and when the integrated circuit element is a flat display element, the substrate is exemplified by a glass substrate.

  However, the substrate is often bent when performing the unit process using the bus mentioned above. In particular, in the case of a large-area glass substrate, a serious bending situation may occur. This is due to the pattern of the substrate located inside the bus and the direction of the chemical flowing into the bus when performing the unit process. That is, when dipping the substrate, dipping the substrate parallel to the bottom of the bus, or flowing chemical, the chemical flows from under the back of the substrate to the back of the substrate, thereby causing buoyancy, drag, etc. to the substrate. The result is a situation where the substrate is bent as a result.

  Thus, when performing a unit process using a bus, if the substrate bends, it acts as a cause of defects in the process, and when the substrate is transferred for a subsequent process, the sensor that detects the substrate malfunctions. There are cases where the substrate is transferred.

  A first object of the present invention is to provide a chemical flow method for reducing bending of a substrate for manufacturing an integrated circuit device.

  A second object of the present invention is to provide a method of manufacturing an integrated circuit element to which the chemical flow method mentioned above is applied.

  A third object of the present invention is to provide an integrated circuit element manufacturing apparatus for easily carrying out the mentioned integrated circuit element manufacturing method.

In a chemical flow method according to an embodiment of the present invention for achieving the first object, a portion of a substrate positioned inside the bus is bent by the chemical flow after the chemical flows into the bus. The chemical flowed to a part of the substrate is caused to flow outside the bath so that a force acts in a direction opposite to a force applied to the part of the substrate so that the part of the substrate is bent.

  In order to achieve the second object, a method of manufacturing an integrated circuit device according to an embodiment of the present invention causes a chemical to flow inside the bus and accommodates the chemical inside the bus. Then, after dipping the substrate into a chemical contained in the bus so that the substrate for manufacturing the integrated circuit element sinks, the substrate is processed using the chemical. In addition, when processing the substrate using the chemical, if a portion of the substrate is bent, the chemical stored in the portion of the substrate out of the chemical stored in the bus is external to the bus. Let it flow.

  In the method of manufacturing an integrated circuit device according to an embodiment of the present invention, a portion of the substrate can be bent by drag or buoyancy.

  In an integrated circuit device manufacturing method according to an embodiment of the present invention, the substrate may be dipped in parallel with the bus bottom surface.

  In an integrated circuit device manufacturing method according to an embodiment of the present invention, a chemical contained in a portion of the substrate can be flowed from below the back surface of the portion of the substrate to the outside of the bus. The chemical accommodated in a part of the substrate can be flowed from the bottom of a part of the back surface to the outside of the bus through the bottom of the bus.

  In the method of manufacturing an integrated circuit device according to an embodiment of the present invention, the chemical that has flowed to the outside of the bus can be further flowed to the inside of the bus.

  According to another aspect of the present invention, there is provided a method for manufacturing an integrated circuit device, wherein a substrate for manufacturing the integrated circuit device is transferred into a bus. Subsequently, after a chemical is flown into the bus so that the substrate transferred into the bus sinks, the substrate is processed using the chemical that is flowed so as to sink the substrate. In addition, when the substrate is processed using the chemical, if a part of the substrate is bent, the chemical flowing to the part of the substrate is caused to flow to the outside of the bus.

  In the method of manufacturing an integrated circuit device according to another embodiment of the present invention, when the substrate is transferred into the bus, the substrate can be transferred into the bus in parallel with the bottom of the bus. The substrate can be transferred into the bus parallel to the bus bottom through the side of the bus. In addition, when the substrate is transferred to the inside of the bus, the substrate can be transferred using a roller installed inside the bus. In this case, the roller is an outer portion of the upper surface of the substrate. And a lower roller in contact with the back surface of the substrate.

  In the method of manufacturing an integrated circuit device according to another embodiment of the present invention, when the chemical is caused to flow inside the bus, the chemical can be caused to flow from below the back surface of the substrate to the back surface of the substrate. A portion of the chemical may flow from the outline of the substrate to the center of the substrate.

  In the method of manufacturing an integrated circuit device according to another embodiment of the present invention, the portion of the substrate may include a central portion of the substrate. A portion of the substrate can be bent by drag, buoyancy, or the like.

In a method of manufacturing an integrated circuit device according to another embodiment of the present invention, when a chemical that is flowed to a part of the substrate is caused to flow outside the bus, the chemical is flowed to the outside of the bus from below the back surface of the part of the substrate. The chemical can be flowed, and in particular, the chemical can be flowed from the bottom of a part of the substrate to the outside of the bus through the bus bottom.

  In a method of manufacturing an integrated circuit device according to another embodiment of the present invention, the chemical that has flowed to the outside of the bus can be further flowed to the inside of the bus.

  In order to achieve the third object, an integrated circuit device manufacturing apparatus according to an embodiment of the present invention includes a bus that contains a chemical therein, a chemical supply unit that causes the chemical to flow inside the bus, and the bus. When processing a substrate by dipping a substrate for manufacturing an integrated circuit element into the chemical contained in the substrate, when a part of the substrate is bent, the chemical contained in the bus, A chemical discharge unit is provided for allowing the chemical contained in a part of the substrate to flow outside the bath.

  In the integrated circuit device manufacturing apparatus according to the embodiment of the present invention, the chemical discharge unit includes a discharge line installed outside the bus from a lower surface of a part of the substrate and a pump connected to the discharge line. In particular, the discharge line may be installed outside the bus through the bus bottom surface from below the back surface of a portion of the substrate.

  The apparatus for manufacturing an integrated circuit device according to an embodiment of the present invention may further include a chemical circulation unit that further flows a chemical that flows to the outside of the bus through the chemical discharge unit to the inside of the bus.

  In an apparatus for manufacturing an integrated circuit device according to an embodiment of the present invention, a sensor for detecting that a part of the substrate is bent and a sensing signal of the sensor are input, and the operation of the chemical discharge unit is controlled by the sensing signal. A controller may further be included.

  An integrated circuit device manufacturing apparatus according to another embodiment of the present invention for achieving the third object includes a bus in which a substrate for manufacturing an integrated circuit device is located, and a bus in which the substrate is positioned. When the substrate is processed using a chemical supply unit that causes the chemical to flow inside, and the chemical that causes the inside of the bus to flow, if a portion of the substrate bends, the chemical that flows to the portion of the substrate is transferred to the bus. Includes a chemical discharge part that flows to the outside.

  The apparatus for manufacturing an integrated circuit device according to another embodiment of the present invention may further include a roller installed inside the bus and transporting the substrate into the bus. An upper roller in contact with the outer shell portion of the upper surface and a lower roller in contact with the back surface of the substrate can be included, and when the roller is installed inside the bus in this way, it is installed on the side of the bus so that it can be opened and closed, The image forming apparatus may further include a transfer window that provides a path for transferring the substrate by the roller installed in the bus through the bus side.

  In an apparatus for manufacturing an integrated circuit device according to another embodiment of the present invention, the chemical supply unit may cause the chemical to flow inside the bus so that a substrate located inside the bus sinks. The chemical supply unit may include a supply line installed on the back surface of the substrate from below the back surface of the substrate, and a pump connected to the supply line. In particular, the supply line is connected to the substrate through the bottom surface of the bus. The supply line may be installed on the back surface of the substrate from below the back surface, and the supply line may be installed so that a part of the chemical flows from the outline of the substrate to the center of the substrate.

  In an apparatus for manufacturing an integrated circuit device according to another embodiment of the present invention, the chemical discharge unit is a discharge line installed outside the bus from a lower surface of a part of the substrate and a pump connected to the discharge line. In particular, the discharge line may be installed outside the bus from the bottom of a part of the substrate through the bottom of the bus.

  The apparatus for manufacturing an integrated circuit device according to another embodiment of the present invention may further include a chemical circulation unit that further flows a chemical that flows to the outside of the bus through the chemical discharge unit to the inside of the bus.

  In an apparatus for manufacturing an integrated circuit device according to another embodiment of the present invention, a sensor for detecting that a part of the substrate is bent and a sensing signal of the sensor are input, and the operation of the chemical discharge unit is controlled by the sensing signal. The control part which performs can be further included.

  In the present invention, when a part of the substrate bends due to substrate dipping or chemical flow, the chemical contained in the substrate or the chemical flowing in the part of the substrate is discharged to the outside of the bath. Thus, when the chemical is discharged to the outside of the bath, a suction force is generated around a portion of the substrate, which is a portion where the chemical is discharged, and the buoyancy that causes the substrate to bend due to the chemical. In the case of adjusting so as to act in the opposite direction to the drag force, the combined force, etc., the situation where the substrate is bent can be sufficiently reduced. In particular, in the present invention, it is possible to reduce the situation in which the substrate bends due to chemicals even with a simple structural change of the manufacturing apparatus.

  Therefore, the present invention can sufficiently reduce defects in a unit process for manufacturing an integrated circuit element using a bus, and can stably transfer a substrate for a subsequent process. Therefore, the present invention can be expected to improve reliability and productivity by manufacturing integrated circuit elements.

1 is a schematic configuration diagram showing an integrated circuit device manufacturing apparatus according to Embodiment 1 of the present invention. FIG. Process drawing for demonstrating with respect to an example which uses the manufacturing apparatus of the integrated circuit element of FIG. Process drawing for demonstrating with respect to the other example which uses the manufacturing apparatus of the integrated circuit element of FIG. The schematic block diagram which shows the manufacturing apparatus of the integrated circuit element by Example 2 of this invention. The figure for demonstrating the transfer window of the manufacturing apparatus of the integrated circuit element of FIG. Process drawing for demonstrating with respect to an example which uses the manufacturing apparatus of the integrated circuit element of FIG.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention can be variously modified and can have various forms, and specific embodiments will be described in detail with reference to the drawings. However, this should not be construed as limiting the invention to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals have been given to like components while describing the figures. In the drawings, the size of the structure is shown enlarged from the actual size for the sake of clarity of the present invention.

The terms such as first and second can be used to describe various components, but the components are not limited by the terms. The terminology is used only for the purpose of distinguishing one component from another. For example, the first component may be referred to as the second component, and, similarly, the second component may be referred to as the first component, without departing from the scope of the present invention. The singular form includes the plural form unless the context clearly indicates otherwise.

In this application, terms such as “comprising” or “having” are intended to mean that a feature, number, step, operation, component, part, or combination thereof described in the specification is present. It should be understood that it does not exclude the possibility of the presence or addition of one or more other features or numbers, steps, actions, components, parts, combinations thereof, etc. .

  Unless defined differently, all terms used herein, including technical or scientific terms, are generally understood by those with ordinary knowledge in the technical field to which this invention belongs. Have the same meaning. Terms such as those defined in commonly used dictionaries should be construed as having a meaning consistent with the meaning possessed in the context of the related art and, unless explicitly defined in this application, are unusual. Or is not overly interpreted in a formal sense.

[Example 1]
FIG. 1 is a schematic configuration diagram showing an integrated circuit device manufacturing apparatus according to Embodiment 1 of the present invention.

  Referring to FIG. 1, an integrated circuit device manufacturing apparatus 100 includes a bus 11, a chemical supply unit 13, a chemical discharge unit 15, and the like, and further includes a chemical circulation unit 17, a sensor 19, a control unit 21, and the like. . Here, examples of the integrated circuit element include a semiconductor element and a flat display element. When the integrated circuit element is a semiconductor element, examples of the substrate 10 described later include a semiconductor wafer. When the integrated circuit element is a flat panel display element, an example of the substrate 10 described later is a glass substrate. Etc.

  Specifically, the bath 11 is a member that contains a chemical therein. Examples of chemicals accommodated in the bath 11 include cleaning liquid and etching liquid. Examples of the manufacturing apparatus 100 mentioned above include a cleaning apparatus and an etching apparatus that include the bus 11.

  The chemical supply unit 13 uses a chemical supply unit 13 to flow a chemical into the bath 11 as a member that flows into the bath 11, and a certain amount of chemical is continuously accommodated in the bus 11. Maintain the state. Here, the chemical supply unit 13 is installed so as to flow chemicals from below the back surface of the substrate 10 which is mainly dipped inside the bus 11 to the back surface of the substrate 10 as indicated by reference numeral 23.

  In addition, the chemical supply unit 13 includes a supply line 13 a installed on the back surface of the substrate 10 from below the back surface of the substrate 10 and a pump 13 b connected to the supply line 13 a. Although not shown, a valve capable of opening and closing may be further set in the supply line 13a. Here, the pump 13b is installed to smoothly flow chemicals by a pumping operation. In particular, it will be described that the chemical supply unit 13 is installed so that the chemical flows from under the back surface of the substrate 10 to the back surface of the substrate 10, but is not limited thereto. That is, as mentioned, when the bath 11 has a structure capable of chemical flow, the chemical supply unit 13 can be formed in various structures. Further, the number of chemical supply units 13 is not limited. That is, the chemical supply unit 13 can be installed regardless of the number. Moreover, the chemical supply part 13 is not limited to the installation position. That is, the chemical supply unit 13 can be installed at various positions.

  The chemical discharge unit 15 is a member that causes the chemical contained in the bus 11 to flow to the outside of the bus 11, and when the substrate 10 is processed by dipping the substrate 10 into the chemical in the bus 11, When a part of the substrate 10 bends, the chemical contained in the substrate 10 is installed to flow outside. In addition, it is preferable that the chemical discharge unit 15 be concentrated on a portion close to a portion where the substrate 10 bends, and in particular, the chemical flows from the bottom of a part of the substrate 10 to the outside of the bus 11. It is more preferable that it is installed. The chemical discharge unit 15 includes a discharge line 15a installed outside the bus 11 from the bottom of a part of the back surface of the substrate 10 and a pump 15b connected to the discharge line 15a. In particular, the discharge line 15 a is preferably installed so that chemical flows from the bottom of a part of the substrate 10 to the outside of the bus 11 through the bottom of the bus 11. The pump 15b is installed in order to smoothly flow chemicals from below the back surface of a part of the substrate 10 to the outside of the bus 11 through a pumping operation. Although not shown, a valve capable of opening and closing may be further installed in the discharge line 15a. In the case where the chemical discharging unit 15 is installed in a part where the substrate 10 is bent, the number of the chemical discharging units 15 is not limited to the number of the chemical discharging units 15 installed.

  As described above, the integrated circuit element manufacturing apparatus 100 according to the first embodiment of the present invention includes the bus 11, the chemical supply unit 13, and the chemical discharge unit 15 mentioned above. Hereinafter, a method of using the integrated circuit element manufacturing apparatus 100 including the bus 11, the chemical supply unit 13, and the chemical discharge unit 15 will be described.

  FIG. 2 is a process diagram for explaining an example of using the integrated circuit device manufacturing apparatus of FIG.

  Referring to FIG. 2, the chemical is contained in the bath 11 (S201). That is, the chemical is supplied into the bath 11 by using the chemical supply unit 13 to store the chemical in the bus 11.

  Subsequently, the substrate 10 for manufacturing the integrated circuit element is dipped into the chemical contained in the bus 11 (S203). At this time, the substrate 10 is dipped so as to sink into the chemical. Also, the substrate 10 can be dipped parallel to the bottom surface of the bus 11. Then, the substrate 10 is processed in a state where the substrate 10 is chemically dipped (S205). Here, the processing of the substrate 10 can be achieved by using a member such as a brush, shaking the substrate 10, or continuously flowing the chemical inside the bus 11. It is not limited to.

  However, when the substrate 10 is dipped by the chemical contained in the bus 11, a situation occurs in which a part of the substrate 10 is bent. This is because a drag force, a buoyancy, and the like act on a part of the substrate 10 in the same direction as the reference numeral 25. At this time, the mentioned drag and buoyancy may act independently, or the combined force of the drag and buoyancy may act in combination. For this, the chemical contained in a part of the substrate 10 is caused to flow to the outside of the bath 11 using the chemical discharging unit 15 (S207). As described above, when the chemical contained in a part of the substrate 10 is discharged to the outside of the bath 11, a suction input is generated in the same direction as the reference numeral 27 in a part of the substrate 10. By counteracting the drag, buoyancy, and combined force of these acting in the same direction as the drawing reference 25 referred to in the suction input generated in the same direction as the drawing reference 27, the substrate 10 is dipped by the dipping of the substrate 10. It is possible to sufficiently reduce the bending of a part.

Thus, in the process using the integrated circuit element manufacturing apparatus 100 according to the first embodiment of the present invention, the substrate 10 is processed by manufacturing the integrated circuit element by dipping the substrate 10 into the chemical contained in the bus 11. When a part of the substrate 10 is bent during processing, the situation in which the part of the substrate 10 is bent can be reduced by causing the chemical contained in the part of the bus 11 to flow outside the bus 11.

  And, in Example 1 of the present invention, the portion where the substrate 10 bends is limited to the central portion, and the chemical discharge unit 15 is also correspondingly installed on the back surface of the central portion of the substrate 10, It can be understood that the chemical discharge unit 15 is installed with reference to a portion where the substrate 10 is bent intensively. In addition, the chemical discharge unit 15 is limited so that the chemical flows from the bottom of the back surface of the substrate 10 to the outside of the bus 11, but the buoyancy, drag, and combination thereof that cause the substrate 10 to bend. It can be understood that the suction input generated by the chemical discharge unit 15 acts in the opposite direction to the force or the like.

  Further, the chemical lost by flowing outside the bath 11 through the chemical discharge unit 15 is continuously replenished through the chemical supply unit 13 so that a certain amount of chemical is accommodated inside the bus 11. Can be maintained.

  1 may further include a chemical circulation unit 17, a sensor 19, a control unit 21, and the like.

The chemical circulation unit 17 is a member that further causes the chemical flowing outside the bus 11 through the chemical discharge unit 15 to flow inside the bus 11. In addition, the chemical circulation part 17
Is connected to the chemical discharge unit 15 and installed to flow the chemical into the interior of the bus 11, or is connected between the chemical discharge unit 15 and the chemical supply unit 13, and is connected to the inside of the bus 11 through the chemical supply unit 13. Can be installed to cause the chemical to flow. As described above, by circulating the chemical using the chemical circulation unit 17, it is possible to maintain a certain amount of chemical inside the bath 11. In addition, the amount of chemical consumption that is lost can be reduced by flowing outside the bus 11 through the chemical discharge unit 15.

The sensor 19 and the control unit 21 are members installed to embody the automation of the integrated circuit element manufacturing apparatus 100 according to the first embodiment. The sensor 19 detects that a part of the substrate 10 is bent by dipping. The control unit 21 receives the sensing signal of the sensor 19 and controls the operation of the chemical discharge unit 21 by the sensing signal. Here, the sensor 19 can be provided by a member that senses a distance interval, and the control unit 21 can be provided by an IC chip to which a program that can determine an operation command of the chemical discharge unit 15 is input. it can. Thus, by providing the sensor 19 and the control unit 21, the chemical discharge unit 15 can be operated only when a part of the substrate 10 is bent by dipping. By providing the sensor 19 and the control unit 21 mentioned above, it is possible to actively cope with a situation where a part of the substrate 10 is bent by dipping.

As described above, the integrated circuit device manufacturing apparatus 100 according to the first embodiment of the present invention includes the bus 11 mentioned above.
, Chemical supply unit 13, chemical discharge unit 15, chemical circulation unit 17, sensor 19, control unit 21, and the like. Hereinafter, a method of using the integrated circuit element manufacturing apparatus 100 including the bus 11, the chemical supply unit 13, the chemical discharge unit 15, the chemical circulation unit 17, the sensor 19, and the control unit 21 will be described.

  FIG. 3 is a process diagram for explaining another example in which the integrated circuit device manufacturing apparatus of FIG. 1 is used.

Referring to FIG. 3, the chemical is contained in the bath 11 (S301). That is, the chemical is flowed into the bath 11 using the chemical supply unit 13, and the chemical is accommodated in the bus 11.

Then, the substrate 10 for manufacturing the integrated circuit element is dipped into the chemical contained in the bus 11 (S303). At this time, the substrate 10 is dipped so as to sink into the chemical. The substrate 10 can be dipped parallel to the bottom surface of the bus 11. Then, the substrate 10 is processed in a state where the substrate 10 is chemically dipped (S305). In particular, also in the case of step S305 in FIG. 3, a member such as a brush is used as in step S205 in FIG. 2, the substrate 10 is shaken, or the chemical inside the bus 11 is continuously flowed. Thus, the processing of the substrate 10 can be achieved.

Subsequently, the sensor 19 is used to sense whether there is a part of the substrate 10 that is bent by dipping (S307 and S309). When it is sensed that a part of the substrate 10 is bent, the sensor 19 outputs a sensing signal to the control unit 21, and the control unit 21 receiving the sensing signal instructs the chemical discharging unit 15 to operate. To do. For this, the chemical contained in a part of the substrate 10 is caused to flow to the outside of the bath 11 using the chemical discharge unit 15 (S311). As described above, when the chemical contained in a part of the substrate 10 is discharged to the outside of the bath 11, a suction input is generated in the same direction as the reference numeral 27 in a part of the substrate 10. By counteracting the drag, buoyancy, combined force, etc. acting in the same direction as the drawing reference 25 referred to in the suction input generated in the same direction as the drawing reference 27, the substrate 10 is dipped by the dipping of the substrate 10. It is possible to sufficiently reduce the bending of a part.

Then, the chemical flowing to the outside of the bus 11 using the chemical circulation unit 17 is further flowed to the inside of the bus 11 (S313). In this way, by using the chemical circulation unit 17 to further flow the chemical into the bath 11, a certain amount of chemical is continuously maintained in the bus 11. Can be reduced.

Further, when the sensor 19 and the control unit 21 are provided, the chemical discharge unit 15 is installed in a large number of portions, so that it is possible to actively cope with the situation where the substrate 10 is bent by the chemical. That is, a part where the substrate 10 is bent is accurately sensed, and a chemical is flowed to the outside of the bus 11 through the chemical discharge part 15 located in a part of the substrate 10 among the chemical discharge parts 15 installed in many parts through the sensing. Can be achieved.

In the case of the manufacturing method in which the substrate 10 is dipped into the chemical housed in the bus 11 as in the first embodiment of the present invention, it can be positively applied to the semiconductor element among the integrated circuit elements. .

As described above, when the apparatus and method according to the first embodiment of the present invention are used, it is possible to sufficiently reduce the situation in which the substrate 10 is bent by the chemical in the unit process using the chemical. Therefore, by reducing defects caused by the bending of the substrate 10, it is possible to improve the reliability in the unit process, and in addition, the subsequent process can be stably performed by transferring the substrate 10 stably. Productivity can be improved by manufacturing circuit elements.

[Example 2]
FIG. 4 is a schematic block diagram showing an integrated circuit device manufacturing apparatus according to Embodiment 2 of the present invention.

Referring to FIG. 4, the integrated circuit device manufacturing apparatus 400 includes a bus 41, a chemical supply unit 43, a chemical discharge unit 45, and the like, in addition to a roller 63, transfer windows 65 a and 65 b described later, and a chemical circulation unit 47. , A sensor 49, a control unit 51, and the like. In the case of the second embodiment as in the first embodiment, examples of the integrated circuit element include a semiconductor element and a flat display element. When the integrated circuit element is a semiconductor element, an example of the substrate 40 is a semiconductor wafer. When the integrated circuit element is a flat display element, an example of the substrate 40 is a glass substrate. Can be mentioned.

Specifically, the bus 41 is a member in which a substrate 40 for manufacturing an integrated circuit element is located and accommodates a chemical flowed from the chemical supply unit 43. And the chemical supply part 43 is a member which makes a chemical flow into the inside of the bus | bath 41 in which the board | substrate 40 is located as mentioned. In particular, the manufacturing apparatus 400 according to the second embodiment has a configuration in which a chemical is flowed into the bus 41 after the substrate 40 is positioned inside the bus 41. That is, it is assumed that no chemical is contained in the bus 41 or chemicals are contained in such a degree that the substrate 40 located inside the bus 41 does not sink sufficiently. After being positioned, the chemical supply unit 43 is used to cause the chemical to flow into the bus 41 so that the substrate 40 positioned inside the bus 41 sinks sufficiently.

The mentioned chemical supply unit 43 is a member that causes the chemical to flow into the bus 41 where the substrate 40 is located. The chemical supply unit 43 is formed from below the back surface of the substrate 40 located inside the bus 41 as indicated by reference numeral 53. Installed to flow chemicals on the back. In addition, the chemical supply unit 43 includes a supply line 43 a installed on the back surface of the substrate 40 from below the back surface of the substrate 40 and a pump 43 b connected to the supply line 43 a. In particular, in the case of the supply line 43a, the supply line 43a can be installed so that the chemical flows from below the back surface of the substrate 40 located inside the bus 41 to the back surface of the substrate 40 through the bottom surface of the bus 41. In addition, the supply line 43 a can be installed such that a part of the chemical flows from the outline of the substrate 40 to the center of the substrate 40. In this case, by setting the supply line 43 a so as to be positioned outside the bus 41, a part of the chemical can flow from the outline of the substrate 40 to the center of the substrate 40. In this way, the supply line 43a is installed so that the chemical flows from under the outer back surface of the substrate 40 to the back surface at the center of the substrate 40 in order to improve process efficiency through a smooth chemical flow. The pump 43b is installed to smoothly flow chemicals by a pumping operation, and although not shown, a valve capable of opening and closing may be installed in the supply line 43a. In the second embodiment, the installation structure of the chemical supply unit 43 is described as being mentioned, but the present invention is not limited to this. That is, as mentioned, it can be understood that the chemical supply unit 43 is installed on the basis of high process efficiency. Further, the number of chemical supply units 43 is not limited to the number.

The chemical discharge unit 45 is a member that causes the chemical that flows inside the bus 41 to flow outside the bus 41. When the substrate 40 is placed in the bus 41 and then processed, a part of the substrate 40 is placed. Is bent, the chemical that is flowed to a part of the substrate 40 is set to flow outside. In addition, it is desirable that the chemical discharging unit 45 is intensively installed in a portion close to a portion where the substrate 40 bends. In particular, the chemical discharging portion 45 may flow the chemical from below the back surface of a portion of the substrate 40 to the outside of the bus 41. It is more desirable to be installed in

The chemical discharge unit 45 includes a discharge line 45a installed outside the bus 41 from below the back surface of a part of the substrate 40 and a pump 45b connected to the discharge line 45a. In particular, the discharge line 45 a is preferably installed so that the chemical flows from the bottom of the back surface of a part of the substrate 40 to the outside of the bus 41 through the bottom surface of the bus 41. Pump 45b
Is installed to smoothly flow chemicals from under the back surface of a portion of the substrate 40 to the outside of the bus 41 through a pumping operation. And although not shown in figure, the valve | bulb which can be opened and closed may be further installed in the discharge line 45a. Moreover, the chemical discharge part 45 is not limited to the installation number, when installing in the part in which the board | substrate 40 bends.

As described above, the integrated circuit device manufacturing apparatus 400 according to the second embodiment of the present invention also includes the bus 41, the chemical supply unit 43, and the chemical discharge unit 45 as in the manufacturing apparatus 100 according to the first embodiment.

Therefore, in manufacturing using the manufacturing apparatus 400 including the bus 41, the chemical supply unit 43, and the chemical discharge unit 45 mentioned above, first, the substrate 40 is positioned inside the bus 41. At this time, as described above, the chemical is contained in the bus 41 to such an extent that the chemical is not contained or the substrate 40 located inside the bus 41 is not sufficiently sunk. The substrate 40 is transferred in parallel with the bottom surface of the bus 41. Then, the processing of the substrate 40 is performed by causing the chemical to flow such that the substrate 40 positioned inside the bus 41 is sufficiently sunk. In particular, the chemical from the chemical supply unit 43 flows from below the back surface of the substrate 40 to the back surface of the substrate 40. Further, a part of the chemical by the chemical supply unit 43 flows from the outline of the substrate 40 to the center of the substrate 40. That is, when using the chemical supply unit 43 mentioned above, the chemical flows from the bottom of the back surface of the substrate 40 to the center of the back surface of the substrate 40.

Due to the chemical flow, buoyancy, drag, combined force thereof, and the like are applied in the same direction as the reference numeral 55, and as a result, a state in which a part of the substrate 40 is bent occurs. In particular, as mentioned above, when the chemical is flowed from under the outline of the back surface of the substrate 40 to the center of the back surface of the substrate 40, buoyancy, drag, combined force, etc. are applied to the central portion of the substrate 40. As a result, a situation occurs in which the central portion of the substrate 40 is bent. Therefore, the chemical discharging unit 45 is used to flow the chemical flowing to a part of the substrate 40 to the outside of the bath 41. At this time, as mentioned above, when the central portion of the substrate 40 bends, the chemical discharge unit 45 causes the chemical flowing to the central portion of the substrate to flow outside the bath 41. As described above, when the chemical discharged to the part of the substrate 40 is caused to flow to the outside of the bus 41 using the chemical discharge unit 45, the suction input is generated in the part of the substrate 41 in the same direction as the reference numeral 57. The In other words, the suction force is generated in the opposite direction to the buoyancy, drag, and combined force applied to the substrate 40 by the chemical flow using the chemical supply unit 43. The chemical flow for processing the substrate 40 by offsetting the drag, buoyancy, combined force, and the like acting in the same direction as the reference numeral 25 with the suction input generated in the same direction as the reference numeral 57. As a result, the situation in which a portion of the substrate 40 is bent can be sufficiently reduced.

  As described above, in the process using the integrated circuit element manufacturing apparatus 200 according to the second embodiment of the present invention, the substrate 40 is positioned in the bus 41, and then the chemical is flowed into the bus 41 to thereby integrate the integrated circuit. When a part of the substrate 40 is bent when processing the substrate 40 by manufacturing an element, a situation in which a part of the substrate 40 is bent is reduced by causing a chemical flowing in a part of the bus 41 to flow outside the bus 41. Can be made.

  In Embodiment 2 of the present invention, the portion where the substrate 40 bends is limited to the central portion, and the chemical discharge portion 45 is also installed on the back surface of the central portion of the substrate 40 correspondingly, and flows to the central portion of the substrate 40. However, it can be understood that the chemical discharge unit 45 is installed on the basis of a portion where the substrate 40 is bent intensively. In addition, the chemical discharge unit 45 is limited so that the chemical flows from the bottom of the back surface of the substrate 40 to the outside of the bus 41. However, the buoyancy, the drag force, and the synthesis of these are generated. It can be understood that the suction input generated by the chemical discharge unit 45 acts in the opposite direction to the force or the like.

  In addition, the lost chemical can be replenished continuously through the chemical supply unit 43 by flowing outside the bus 41 through the chemical discharge unit 45.

  The roller 63 mentioned is a member for transferring the substrate 40 to the inside of the bus 41 and is installed inside the bus 41. The roller 63 includes an upper roller 63a and a lower roller 63b. The upper roller 63a is installed so as to be in contact with the outer portion of the upper surface of the substrate 40, and the lower roller 63b is in contact with the back surface of the substrate 40. Installed. At this time, the upper roller 63a is installed so as to contact only the outer portion of the upper surface of the substrate 40 in order to smoothly flow chemicals on the upper surface of the substrate 40, and the lower roller 63b is connected to the substrate 40 to be transferred. It is installed in a structure that crosses the substrate 40 to prevent it from drooping down.

  As described above, when the upper roller 63a is installed so as to contact only the outer portion of the upper surface of the substrate 40, the buoyancy, drag, and synthetic force of these due to the chemical flow are concentrated on the central portion of the substrate 40. Can. In addition, as described above, when the chemical supply unit 43 is installed so that chemical flows from the bottom of the back surface of the substrate 40 to the center of the back surface of the substrate 40, buoyancy, drag, These synthetic powers can be concentrated. Therefore, as described above, when the chemical supply unit 43 and the upper roller 63a are installed, the chemical discharge unit 45 causes the chemical flowing in the central portion of the substrate 40 to flow intensively outside the bus 41. It is preferable to be installed as described above.

  And when the roller 63a which transfers the board | substrate 40 to the inside of the bus | bath 41 is included like the manufacturing apparatus 400 of Example 2, the transfer path | route of the board | substrate 40 should be formed in the side surface of the bus | bath 41. FIG. That is, the transfer path of the substrate 40 should be provided on the side surface of the bus 41 having the same height as the path where the roller 63 is installed and the substrate 40 is transferred.

  In the second embodiment, transfer windows 65a and 65b are installed on the side surface of the bus 41 so as to be opened and closed as shown in FIG. Here, the transfer window 65a is a member that provides a path for transferring the substrate 40 to the inside of the bus 41, and the transfer window 65b provides a path for transferring the substrate 40 to the outside of the bus 41. It can be understood as a member. The transfer windows 65a and 65b may be provided with members that are opened and closed by a shutter method or the like. For this, the substrate 40 can be transferred to the inside of the bus 41 by the roller 63 through the transfer windows 65 a and 65 b installed on the side surface of the bus 41, or the substrate 40 can be transferred to the outside of the bus 41. When the transfer windows 65a and 65b mentioned above are installed, the chemical inside the bus 41 can flow out of the bus 41 through the transfer windows 65a and 65b when the transfer windows 65a and 65b are opened. In addition, a member for circulating the chemicals flowing outside the bus 41 through the transfer windows 65a and 65b may be further formed.

  Further, the integrated circuit element manufacturing apparatus 400 of FIG. 2 may further include a chemical circulation unit 47, a sensor 49, a control unit 51, and the like, similar to the integrated circuit element manufacturing apparatus 100 of FIG. And since the chemical circulation part 47, the sensor 49, and the control part 51 in Example 2 have the same structure as the chemical circulation part 17, the sensor 19, and the control part 21 in Example 1, the detailed description is abbreviate | omitted. .

  In the following, the integrated circuit element manufacturing apparatus 400 including the bath 41, the chemical supply unit 43, the chemical discharge unit 45, the roller 63, the transfer windows 65a and 65b, the chemical circulation unit 47, the sensor 49, and the control unit 51 is used. The method to do will be described.

FIG. 6 is a process diagram for explaining an example of using the integrated circuit device manufacturing apparatus of FIG.

  Referring to FIG. 6, the transfer of the substrate 40 mentioned above first opens the transfer window 65a provided on one side of the bus 41 (S601). At this time, if the chemical is sufficiently contained in the bath 41, the chemical can flow out of the bath 41 through the transfer window 65 a on one side surface. Further, the transfer window 65b on the opposite side is also opened to transfer the substrate 40, which has been completed, to the outside of the bus 41 for the subsequent process. As also mentioned in this case, the chemical can flow out of the bath 41 through the transfer window 65b. The chemical that flows to the outside of the bus 41 through the transfer windows 65a and 65b can be further flowed to the inside of the bus 42 using a circulation member (not shown). Subsequently, the substrate is transferred into the bus 41 through the transfer window 65a on one side surface. At this time, the substrate 40 is transferred by the roller 63 installed inside the bus 41 (S603). Since the transfer window 64 a and 65 b and the roller 63 are used to transfer the substrate 40 to the inside of the bus 41, the substrate 40 is transferred in parallel with the bottom surface of the bus 41.

  In this way, the substrate 40 is transferred into the bus 41 by opening the transfer windows 65 a and 65 b and transferring using the roller 63. At this time, no chemical is contained in the bus 41 or the chemical is contained to such an extent that the substrate 40 located inside the bus 41 does not sink sufficiently. This is because the chemical flows outside the bus 41 by opening the transfer windows 65a and 65b, as mentioned above. Then, the chemical is flowed into the bus 41 where the substrate 40 is located using the chemical supply unit 43 (S605). At this time, the chemical flow is performed to such an extent that the substrate 40 sinks sufficiently.

  Subsequently, the substrate is processed by causing the chemical to flow inside the bus (S607). Here, the processing of the substrate can be achieved by continuous transfer of the substrate, process processing using a member such as a brush, in addition to the chemical flow.

  Subsequently, the sensor 49 is used to sense whether there is a part of the substrate 40 bent by the chemical flow (S609 and S611). When it is sensed that a part of the substrate 40 is bent, the sensor 49 outputs a sensing signal to the control unit 51, and the control unit 51 that receives the sensing signal instructs the chemical discharge unit 45 to operate. (S613). For this, the chemical discharged to a part of the substrate 40 using the chemical discharge unit 45 is caused to flow to the outside of the bus 41 (S615). As described above, when the chemical flowing in a part of the substrate 40 is discharged to the outside of the bus 41, suction input is generated in the same direction as the reference numeral 57 in the part of the substrate 40. By counteracting the drag, buoyancy, combined force and the like acting in the same direction as the drawing reference 55 referring to the suction input generated in the same direction as the drawing reference 57, the substrate 40 is dipped by the dipping of the substrate 40. It is possible to sufficiently reduce the bending of a part.

  In particular, the second embodiment has a configuration in which the outer contour of the upper surface of the substrate 40 is supported by the upper roller 63 a of the rollers 63. The chemical supply unit 43 has a configuration in which chemical flows from the bottom of the back surface of the substrate 40 to the center of the back surface of the substrate 40. In addition, the central portion of the substrate 40 can be bent intensively. As described above, when the central portion of the substrate 40 is bent intensively, the central portion of the substrate 40 is bent by causing the chemical flowing to the central portion of the substrate 40 to flow out of the bus 41 intensively. Can be reduced.

Then, the chemical that flows to the outside of the bus 41 using the chemical circulation unit 47 is further flowed to the inside of the bus 41 (S615). In this way, by using the chemical circulation unit 47 to further flow the chemical into the bath 41, a certain amount of chemical is continuously maintained in the bus 41 so that the substrate 40 is sufficiently submerged, In particular, chemical consumption can be reduced.

  In addition, in the case of a manufacturing method in which chemical flows through the substrate 10 positioned inside the bus 41 as in the second embodiment of the present invention, it is more actively applied to the flat display element among the integrated circuit elements. Can do.

  As described above, even when the apparatus and method according to the second embodiment of the present invention are used, the situation where the substrate 40 is bent by the chemical can be sufficiently reduced in the unit process using the chemical as in the first embodiment. Therefore, by reducing defects caused by the bending of the substrate 40, it is possible to improve the reliability in the unit process, as well as stably transporting the substrate 40 in the subsequent process, thereby providing an integrated circuit element. It is possible to improve productivity by manufacturing.

  The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious that a person having ordinary knowledge in the technical field to which the present invention pertains can make various changes or modifications within the scope of the technical idea described in the claims. Of course, it is understood that these also belong to the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 10 ... Board | substrate, 11 ... Bath, 13 ... Chemical supply part, 15 ... Chemical discharge part, 15a ... Discharge line, 15b ... Pump, 17 ... Chemical circulation part, 19 ... Sensor, 21 ... Control part, 100 ... Integrated circuit element manufacturing device.

Claims (17)

An integrated circuit device manufacturing apparatus for processing a substrate with chemicals in a bus,
And chemical supply unit for supplying a chemical from the back below the board in said bus,
In order to prevent the bending of the chemical supply unit occurs board than the force based on the supplied chemical from the back surface beneath the base plate, the external bus to the back surface of the lower portion take force based on the supply of chemical in the base plate A chemical discharge section for discharging chemicals into
An apparatus for manufacturing an integrated circuit element , comprising: a chemical circulation unit that communicates the chemical supply unit and the chemical discharge unit outside the bus, and causes the chemical flowing outside the bus to flow inside the bus. 2. The integrated circuit device manufacturing apparatus according to claim 1, wherein the substrate is dipped parallel to the bottom surface of the bus. 3. The apparatus for manufacturing an integrated circuit element according to claim 1, wherein the chemical supply unit causes the chemical to flow into the bus so that a substrate located inside the bus sinks. 4. The integrated circuit device manufacturing method according to claim 1, wherein the chemical supply unit includes a supply line installed below a back surface of the substrate and a pump connected to the supply line. 5. apparatus.   5. The integrated circuit device manufacturing apparatus according to claim 4, wherein the supply line is installed so that a part of the chemical flows from the outer periphery of the substrate to the center of the substrate. 6. The chemical discharge unit according to claim 1, further comprising a discharge line extending from a lower part of the back surface of a part of the substrate to the outside of the bus and a pump connected to the discharge line.
An integrated circuit device manufacturing apparatus according to the item.   7. The integrated circuit device manufacturing apparatus according to claim 6, wherein the discharge line extends from below the back surface of a part of the substrate to the outside of the bus through the bottom surface of the bus.   The sensor according to any one of claims 1 to 7, further comprising: a sensor that senses that a part of the substrate is bent; and a controller that controls the operation of the chemical discharge unit based on a sensing signal output from the sensor. 2. An apparatus for manufacturing an integrated circuit device according to 1. An integrated circuit device manufacturing apparatus for processing a substrate with chemicals in a bus,
A transfer gate provided on each side wall of the bus, and having a gate window that is opened when the substrate is transferred into the bus and sealed when the substrate is being processed inside the bus;
A substrate transfer roller positioned parallel to the transfer gate inside the bus so that the substrate is transferred parallel to the bottom of the bus through the transfer gate;
And chemical supply section for supplying a chemical into the bus from the back below the board,
In order to prevent the bending of the chemical supply unit occurs board than the force based on the supplied chemical from the back surface beneath the base plate, the external bus to the back surface of the lower portion take force based on the supply of chemical in the base plate A chemical discharge section for discharging chemicals into
A chemical circulation unit that communicates the chemical supply unit and the chemical discharge unit outside the bus, and causes the chemical flowing outside the bus to flow inside the bus; and
An integrated circuit device manufacturing apparatus.     The apparatus for manufacturing an integrated circuit device according to claim 9, wherein the roller includes an upper roller that contacts an outer portion of an upper surface of the substrate and a lower roller that contacts a back surface of the substrate.   The apparatus of claim 10, wherein the lower roller is disposed across the back surface of the substrate and prevents the lower roller from dripping while the substrate is transferred. 12. The integrated circuit device manufacturing apparatus according to claim 9, wherein the chemical supply unit causes the chemical to flow inside the bus so that a substrate located inside the bus sinks. . The integrated circuit device manufacturing method according to any one of claims 9 to 12, wherein the chemical supply unit includes a supply line installed below the back surface of the substrate and a pump connected to the supply line. apparatus.   14. The apparatus for manufacturing an integrated circuit device according to claim 13, wherein the supply line is installed so that a part of the chemical flows from the outer periphery of the substrate to the center of the substrate.   The integration according to any one of claims 9 to 14, wherein the chemical discharge unit includes a discharge line extending from below a back surface of a part of the substrate to the outside of the bus and a pump connected to the discharge line. Circuit element manufacturing equipment.   The integrated circuit device manufacturing apparatus according to claim 15, wherein the discharge line extends from below the back surface of a part of the substrate to the outside of the bus through the bottom surface of the bus.   The sensor according to any one of claims 9 to 16, further comprising: a sensor that senses that a part of the substrate is bent; and a controller that controls the operation of the chemical discharge unit based on a sensing signal output from the sensor. 2. An apparatus for manufacturing an integrated circuit device according to 1.

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