JP5358104B2 - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that using silicone resin as a sealer to a reflection case causes black discoloration at the base of the lead material at the bottom wall of the case, resulting in deterioration of reflection efficiency and also causes stress application to bonding wire due to a larger linear expansion coefficient of the silicone resin than the material of the reflection case. <P>SOLUTION: A light-emitting apparatus includes: a housing case 10 integrally molding a reflection case 11 and a terminal supporting portion 20 in the rear part of the reflection case 11; and lead members 30 and 40 inserted into the housing case 10, wherein their base portions 31 and 41 have the same width as the bottom wall of the reflection case 11. The base portions 31 and 41 are silver plated, and the reflection case 11 is filled with a sealer containing a phosphor dispersed therein, wherein each of the base portions of the lead members 30 and 40 is coated with a white reflecting layer 15. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a side-emitting type light emitting device that is surface-mounted on a wiring board.

An example of the light emitting device of the above type is shown in Patent Document 1. In this light emitting device, the reflection case is formed in a thin box shape in order to suppress the overall thickness. A terminal holding portion is integrally provided on the bottom wall portion of the reflection case to constitute a housing portion. A lead member is inserted into the casing, and the base of the lead member is exposed on the bottom wall of the reflection case. In addition, the portion of the lead member that is pulled out of the reflection case is bent along the terminal holding portion from the side portion of the reflection case, and further bent along the lower surface of the terminal holding portion, and the tip thereof becomes a notch as a connection portion. Stored.
An LED chip (light emitting element) is mounted on the base portion of the lead member exposed to the bottom of the reflection case, and a bonding wire is suspended from the bonding region of the LED chip and the lead member.
Please also refer to Patent Document 2 and Patent Document 3 which disclose techniques related to the present application.

JP 2006-253551 A JP 2002-520823 A JP 2001-24228 A

In the side light emitting type light emitting device, the reflective case is formed thin from the viewpoint of suppressing the overall thickness. In order to improve the light extraction efficiency from the light emitting element in such a thin reflective case, the base of the lead member exposed on the bottom wall of the reflective case is silver-plated to make it a mirror surface and to increase the reflective area In addition, the width of the base is substantially equal to the width of the bottom wall of the reflection case.
In a thin reflective case, the side wall (the side wall in contact with the substrate and the side wall facing it) is close to the light emitting element and it is difficult to incline the side wall. For this reason, it has been considered that the light extraction efficiency from the light emitting element is improved by increasing the reflection efficiency at the bottom wall portion of the reflection case.

The inventors of the present invention have made extensive studies on the light emitting device, and have found the following problems to be solved.
When the light emitting device is used for a long time, the base portion of the lead member may turn black and the output as the light emitting device may decrease. This is presumably because the silver plating applied to the surface of the lead member reacts with chlorine to become silver chloride, which is further decomposed and silver ions are precipitated in a granular form.
Such blackening of the lead member is particularly noticeable when a silicone resin excellent in light resistance and heat resistance is employed as a sealing material filled in the reflective case.
This is presumably because chlorine in the air reacts with the base surface of the lead member through the silicone resin sealing material because the gas barrier property of the silicone resin is low. In addition, since the silicone resin has a larger coefficient of linear expansion than the material of the reflective case (generally polyamide-based resin), a gap is generated at the interface between the sealing material made of the silicone resin and the reflective case due to thermal history, or It is also considered that the blackness is caused by the deterioration of the airtightness and the entry of external impurities including chlorine from the interface to reach the base surface of the lead member.

  Further, when the reflective case is filled with a silicone resin having a large linear expansion coefficient, stress is applied to the bonding wire suspended between the light emitting element and the lead member due to thermal deformation of the silicone resin. Therefore, there exists a possibility that a wire may be disconnected. In other words, attention must be paid to the bonding work in order to prevent the wire breakage, which causes a reduction in work efficiency and a yield.

The present invention has been made to solve the above problems.
The first aspect of the present invention is defined as follows. That is,
A side-emitting type light emitting device that is surface-mounted on a wiring board,
A casing formed by integrally molding the reflecting case and the terminal holding portion at the rear of the reflecting case;
A lead member to be inserted into the housing portion, comprising a base portion having a width substantially equal to the width of the bottom wall portion of the reflection case, wherein the base portion is silver-plated;
A white reflective layer covering the base of the lead member in the reflective case;
A sealing material filled in the reflection case, wherein the phosphor is dispersed in a silicone resin; and
A light emitting device comprising:

According to the light emitting device configured as described above, since the base portion of the lead member is covered with the white reflective layer, the reflection efficiency is maintained in the portion. That is, it does not turn black like the base of the silver plated lead member. Thereby, the output as a light-emitting device can be maintained over a long period of time.
Here, the reflection efficiency of the white reflective layer is lower than that of the base part of the specular lead member with silver plating. However, according to the study by the present inventors, it was confirmed that the initial output (luminance) as the light emitting device was improved by about 3% when the base portion of the lead member was covered with the white reflective layer.
This is because light from the light emitting element is diffusely reflected (diffuse reflected) in the white reflective layer, so that light is more uniformly supplied to the phosphor in the sealing material, and the amount of light emitted from the phosphor increases. Although the amount of light reflected at the bottom wall of the reflection case is reduced, the total amount of light emitted from the light emitting device is increased.

Furthermore, since the emitted light from the light emitting element is more uniformly supplied to the phosphor, uneven color of the light emitted from the light emitting device is suppressed. Here, the color unevenness refers to non-uniformity of color on the irradiation surface of the light emitted from the light emitting device, and the path length (optical path) through which the light emitted from the light emitting element propagates in the sealing material containing the phosphor. This is due to the non-uniformity of the length.
The action of the white reflective layer 5 is schematically shown in FIG. As shown in FIG. 10A, the color is different between the irradiation surface A where the light from the light emitting element 2 arrives without being reflected and the irradiation surface B irradiated with the light reflected in the reflection case. come. More specifically, since the light irradiated to the irradiation surface A has a relatively short distance through the sealing material 4, the light emission color (for example, blue) of the light emitting element is easily reflected as it is. On the other hand, since the light that has passed through the sealing material 4 for a long distance is irradiated onto the irradiation surface B, the mixing of the light from the light emitting element 2 and the light from the phosphor proceeds, and the whitening of the light is promoted. Yes.

According to the present invention, light color unevenness is suppressed for the following reason (see FIG. 10B).
The first reason is that the light from the light emitting element 2 is diffusely reflected by the white reflective layer 5 so that lights having different optical path lengths are mixed with each other.
As a second reason, the distance between the surface of the sealing material 4 and the reflective surface (the surface of the white reflective layer 5) is shortened due to the presence of the white reflective layer 5, so that the light irradiated to the irradiation surface B is encapsulated. The length of the passage passing through is shortened. Thereby, when the light irradiated to the irradiation surface A and the light irradiated to the irradiation surface B are compared, the difference of the distance which passes in the sealing material 4 becomes small by presence of the white reflective layer 5. FIG. Therefore, the variation in color between the irradiation surface A and the irradiation surface B is reduced.

The material of the white reflective layer 5 can be arbitrarily selected as long as the light from the light emitting element 2 can be irregularly reflected (diffuse reflected). For example, an inorganic material such as a polyamide-based synthetic resin or alumina can be used.
Such a material can be previously formed into a plate shape and laminated on the base of the lead member. Such a material may be liquefied and applied onto the base of the lead member.
More preferably, a white synthetic resin is adopted as the material of the reflective case, and the white reflective layer 5 is integrally formed with the material of the reflective case using the lead member as an insert.

  The distance h1 between the surface of the base 3 of the lead member and the surface of the white reflective layer 5 is preferably shorter than the distance h2 between the surface of the base 3 of the lead member and the surface of the light emitting element 2. Thereby, the light emitted from the light emitting element 2 to the side can be more reliably reflected on the surface of the white reflective layer 5. More preferably, the distance h1 from the surface of the base portion 3 of the lead member to the surface of the white reflective layer 5 is shorter than the distance from the surface of the base portion 3 of the lead member to the light emitting layer of the light emitting element.

Another aspect of the present invention is defined as follows. That is,
In the light emitting device defined in the previous aspect, the base of the lead member includes a first region for mounting a light emitting element and a second region for bonding a bonding wire from the light emitting element, and the white reflective layer includes The base is covered between the first region and the second region.
According to the invention thus defined, the white reflective layer is disposed between the light emitting element and the second region (bonding region), and the silicone resin having a large linear expansion coefficient can be replaced with the white reflective layer. . For example, if the white reflective layer is made of the same material as the reflective case, the stress applied to the bonding wire due to thermal deformation of the silicone resin is alleviated. Thereby, disconnection of a bonding wire can be prevented beforehand.

Another aspect of the present invention is defined as follows. That is,
In the light emitting device defined in the previous aspect, the first region is located at a substantially center of the bottom wall portion of the reflection case, and the second region is located in contact with the side wall of the reflection case.
According to the invention thus defined, the light emitting element and the position where the wire is bonded to the lead member are separated as much as possible. Here, the side wall indicates a short width perpendicular to the wire erection direction. Thereby, the thermal influence from the light emitting element with respect to the 2nd area | region (exposed from the white reflective layer) of a lead member becomes small, and the blackening in the said 2nd area | region can be suppressed.
In addition, from the standpoint of uniforming the light emission balance of the light emitting device, securing the high reflection efficiency at the position where the bottom wall of the reflecting case is a mirror surface (silver plated surface) at the position farthest from the light emitting element. Is preferred. That is, the opening of the reflection case emits light more uniformly.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1A is a perspective view of the light emitting device 1 of the embodiment as viewed from the front, and FIG. 1B is a perspective view of the light emitting device 1 as viewed from the back. FIG. 2 is a six-sided view, (A) is a plan view, (B) is a left side view, (C) is a front view, (D) is a right side view, (E) is a bottom view, and (F) is a bottom view. It is a rear view. 3 is a sectional view taken along line III-III in FIG. 2C, FIG. 4 is a sectional view taken along line IV-IV in FIG. 2A, and FIG. 5 is a sectional view taken along line VV in FIG.
As shown in FIG. 1, the light emitting device 1 according to the embodiment includes a housing 10, a first lead member 30, a second lead member 40, and an LED chip 60.
As shown in FIGS. 1 and 3, the housing unit 10 includes a reflective case 11 and a terminal holding unit 20. The reflection case 11 has a thin cup shape, and the inner peripheral surface of the recess 13 is a reflection surface 15.
The recess is filled with a silicone resin as a sealing material 14, and the phosphor is uniformly dispersed in the silicone resin. As this phosphor, a known material such as a YAG system or a BOS system that absorbs blue light from the LED chip 60 and emits yellow light can be used.
The reflection surface 15 includes a side wall reflection part 155 and a bottom reflection part 156 (white reflection layer). These reflecting portions 155 and 156 are formed of white resin integrally with the housing portion 10.

The reflecting surface 15 is a bowl-like curved surface as a whole, and the LED chip 60 is disposed at the center point of the curved surface. By making the entire reflection surface into a bowl-shaped curved surface, the light emitted from the LED chip 60 in the lateral direction is efficiently and uniformly reflected in the optical axis direction of the reflection case 11. It is preferable to arrange the LED chip 60 at the origin of the parabola, with the reflecting surface 15 having a rotating parabola shape. Windows 16 and 17 are formed on the reflecting surface 15, and bonding regions 32 and 42 (second regions) are exposed through the windows 16 and 17.
The window 16 and the window 17 are arranged so as to sandwich the LED chip 60. The shape of the window is not particularly limited as long as the bonding wire can be first bonded. The window 16 and the window 17 are preferably formed as far as possible from the LED chip 60. Thereby, it becomes difficult to receive the thermal influence from LED chip 60. FIG. Since the base portions 31 and 41 of the lead members 30 and 40 are exposed in the bonding regions 32 and 42, the blackening can be prevented if the thermal influence from the LED chip 60 is reduced.
Moreover, since the reflecting surface is entirely curved, bubbles are less likely to be generated when the sealing member is filled. It is because the corner | angular part used as the starting point of bubble generation can be decreased.

The terminal holding part 20 is integrally formed with the reflection case 11 on the rear side of the reflection case 11 and is solid as a whole. Four cutouts 23, 24, 25 and 26 are formed in the terminal holding portion 20. The connection portion 33 of the first lead member 30 is wrapped around the first notch 23. Similarly, the connection portion 43 of the second lead member 40 goes around the second notch 24. A heat sink 51 wraps around the third notch 25. A heat sink 52 wraps around the fourth notch 26. Here, the heat radiating plate 51 and the heat radiating plate 52 are a part of the first lead member that is pulled out from the housing 10 and exposed to the outside. The connecting portions 33 and 43 and the heat sinks 51 and 52 that wrap around the notches 23, 24, 25, and 26 are substantially flush with the lower surface of the terminal holding portion 20. Thereby, it is possible to prevent an excessive impact from being applied to the lead members 30 and 40.
The solid part that separates the first notch 23 and the third notch 25 is the first separation part 27, and the solid part that separates the third notch 25 and the fourth notch 26. Is the second separation portion 28, and the solid portion that separates the fourth notch 26 and the second notch 24 is the third separation portion 29. By the presence of the first to third separation portions 27, 28, 29, the first and second connection portions 33, 43 and the heat sinks 51, 52 are short-circuited and the heat sinks 51, 52 are short-circuited reliably. Can be prevented. Further, the connection portions 33 and 43 and the heat sinks 51 and 52 are pulled out from different surfaces of the housing portion, and further, the separation portion (solid portion of the resin) is widened to damage the housing portion (cracks, cracks, etc.). ) Can be prevented.

The first lead member 30 includes a base portion 31, a connection portion 33, and heat sinks 51 and 52. The base portion 31 has a length of about 3/4 in the left-right direction of the housing portion 10. The LED chip 60 is mounted on a portion of the base 31 that is located substantially at the center of the reflection case 11 by a known method. Heat sinks 51 and 52 are extended so as to sandwich the position where the LED chip 60 is mounted on the first lead member 30.
A portion of the first lead member 30 that is pulled out from the housing portion 10 is a connection portion 33. The connecting portion 33 is first bent along the side surface of the terminal holding portion 20 and is further bent along the lower surface of the terminal holding portion 20 and stored in the first notch 23.

The second lead member 40 includes a base portion 41 and a connection portion 43. The base 41 has a length of about ¼ in the left-right direction of the casing 10.
A portion of the second lead member 40 that is pulled out from the housing portion 10 is a connection portion 43. The connection portion 43 is first bent along the side surface of the terminal holding portion 20, and is similarly bent along the lower surface of the terminal holding portion 20 and is accommodated in the second notch 24.

In the above, the housing | casing part 10 consists of a polyamide material which disperse | distributed the white pigment. In addition, it can be formed of a white ceramic material. In consideration of moldability, a resin material that can be easily formed by insert molding described later and that can form a complicated shape as in the present application is preferable. Thereby, the reflection surface 15 of the reflection case 11 becomes white, and efficiently diffuses light (diffuse reflection) from the LED chip 60.
A copper plate or an aluminum plate can be employed for the lead members 30 and 40. And the surface of the base parts 31 and 41 is silver-plated to make a mirror surface.
As the LED chip, a group III nitride compound semiconductor light emitting element that emits light of a short wavelength is used. White light emission can be obtained by combining an appropriate phosphor with this LED chip. In this embodiment, a blue light emitting diode and a phosphor that absorbs blue light and emits yellow light are selected as the LED chip. The emission color of the LED chip can be arbitrarily selected. In addition, a plurality of LED chips can be mounted on the lead member.

The light emitting device 1 of the example is manufactured as follows.
The copper plate is press-punched to obtain the lead members 30 and 40 in a state where the connection portion and the heat radiating plate are developed. The lead members 30 and 40 are subjected to silver plating. The target of the silver plating process is one surface of the bases 31 and 41. Only the portions of the base portions 31 and 41 that are exposed from the reflection case 11 (that is, the portions that are not covered with the side wall reflection portion 155 and the bottom reflection portion 156) can be the silver plating target region. And the housing | casing part 10 is injection-molded by using this lead member 30 and 40 as an insert. Thereafter, the LED chip 60 is mounted on the first lead member 30, and bonding wires 63 and 64 are bonded (see FIG. 3).

At this time, one end (first bond end 63A) of the bonding wire 63 held by the head (not shown) of the bonding apparatus is first bonded to the bonding region 32 of the lead member 30. The bonding method is welding (ball bonding) using ultrasonic waves, heat, a load, or the like. Thereafter, the head is moved from the bonding region 32 in the vertical direction while feeding the bonding wire 63. This is to prevent a lateral load from being applied to the joint and to prevent the joint from being damaged. The head pulled up to a predetermined height is moved laterally, and the other end (second bond end 63B) of the bonding wire 63 is bonded to a predetermined electrode of the LED chip 60. The bonding method is wedge bonding (tailless bonding). After this joining is performed, the bonding wire 63 is cut.
Thus, in the bonding wire 63 subjected to the bonding operation, the height of the first bond end 63A bonded to the lead member 30 defines the overall height. When the conventional example (see FIG. 9) in which the first bond end 63A is bonded to the LED chip is compared with the configuration of this example, it can be seen that the bonding wire is lowered as a whole. Thereby, the reflective case 11 can be made thin (here, the width indicates the length in the vertical direction in FIG. 3), and the demand for downsizing of the light emitting device can be met. Also, the amount of bonding wire material used can be reduced.

  The bonding wire 64 is similarly arranged. That is, the first bond end 64 A is bonded to the bonding region 42 of the lead member 40, and the second bond end 64 B is bonded to a predetermined electrode of the LED chip 60.

The LED chip 60 and the bonding wires 63 and 64 are sealed with a translucent silicone resin from the viewpoint of heat resistance and light resistance. A phosphor is dispersed in the silicone resin.
Thereafter, the copper plate is cut into the state shown in FIG.
In FIG. 6, a portion indicated by reference numeral 133 in the first lead member 30 drawn out from the right side surface of the housing portion 10 in the figure is bent along the terminal holding portion 20 to become a connection portion 33. Further, a portion indicated by reference numeral 143 in the second lead member 40 drawn out from the left side surface of the housing portion 10 in the drawing is bent along the terminal holding portion 20 to become the connection portion 43. The portions indicated by reference numerals 151 and 152 in the first lead member 30 drawn out from the lower surface of the housing portion 10 are bent along the terminal holding portion 20 to become heat radiation plates 51 and 52.

Here, since the lead members are pulled out from all different surfaces of the housing part 10, it is possible to prevent an excessive load from being concentrated on the housing part 10 when the pulled-out portion is bent. Thereby, damage to case part 10 can be prevented.
In particular, two heat sinks 51 and 52 are drawn out from the lower surface of the casing 10 and bent. Here, compared with the case where one heat radiating plate having the same area as the heat radiating plates 51 and 52 is used, the force required to bend the heat radiating plate is reduced by employing two heat radiating plates in this way. Therefore, a large force is not applied to the casing, and the casing is not damaged when the heat sink is bent. Therefore, the manufacturing yield can be improved and an inexpensive light-emitting device can be provided.

Three or more heat sinks can be formed. Also in this case, each heat radiating plate is pulled out from the lower surface of the housing portion and bent along the lower surface of the terminal holding portion. The shape of the heat sink can be arbitrarily selected. The shape of each heat sink can be made different. Further, the heat radiating plate can be designed so as to protrude from the bottom surface of the casing. As a result, when the light emitting device is assembled to the wiring board, the position of the heat sink can be visually confirmed, and alignment with the contact position of the wiring board is facilitated.
Since the connecting portion also has thermal conductivity, it is preferable that the pair of connecting portions and the plurality of heat sinks disposed therebetween are evenly distributed in the terminal holding portion.

FIG. 7 shows a first lead member 230 and a second lead member 240 of another embodiment. FIG. 7A shows a state in which the first and second lead members 230 and 240 are inserted into the housing portion 210, and FIG. 7B is an exploded view of the first and second lead members 230 and 240 and the housing portion 210. It is. The base portion 231 of the first lead member 230 is inserted into the housing portion 210, and the LED chip is mounted on the base portion 231. A portion of the housing portion 210 that faces the LED chip is an opening 211, and the base 231 is exposed through the opening 211, and the LED chip is mounted on the exposed portion. In the first lead member 231, the connecting portions 261 and 262 that connect the portions 251 and 252 serving as heat sinks and the base portion 231 are covered with the material of the housing portion 210. The material portions 215 and 216 constitute the bottom reflecting surface of the reflecting case. When the portions 251 and 252 serving as heat sinks are bent to the back side in the drawing, the material portions 215 and 216 press the base 231 to prevent the base 231 from rolling up.
Further, since the connecting portions 261 and 262 are formed narrow by the concave portions 271 to 274, they can be bent with a small force. Thereby, damage of the housing | casing part 210 can be prevented beforehand.

Furthermore, since the narrow connection portions 261 and 262 fit within the width of the housing portion 210 as shown in FIG. 7A, in other words, the width of the connection portions 261 and 262 is smaller than that of the housing portion 210. Since it is narrower than the width, when the portions 251 and 252 serving as heat sinks in the connecting portions 261 and 262 are bent from the base portion 231, the casing portion 210 is supported and the bending work is facilitated, and the base portion 231 is peeled off. Can be prevented.
In the above, the recesses 271 to 274 are all pierced in the direction of the central axis of the base 231. As a result, the foldable region is widened, so that it can be applied to the casing unit 210 having a narrower width. That is, the degree of freedom in designing the housing unit 210 is improved.

In FIG. 8, the usage aspect of the light-emitting device 1 of an Example is shown.
In FIG. 8, reference numeral 70 denotes a wiring board, on which a pattern is formed of a conductive metal material. The connecting portions 33 and 43 are connected to a predetermined pattern on the wiring board and soldered. Reference numeral 73 denotes solder. At this time, it is preferable to connect the heat sinks 51 and 52 to the pattern portion on the surface of the wiring board. This is because heat sinking can be effectively performed by bringing the heat radiating plates 51 and 52 into contact with a metal material. In the wiring board, the heat radiation plates 51 and 52 can be brought into contact with thermal vias (portions where the metal material penetrates in the thickness direction of the wiring board).

The heat generated in the LED chip 60 is transmitted exclusively to the first lead member 30, and this heat is radiated to the wiring board 70 via the heat radiation plates 51 and 52 and the connection portion 33. Here, since the heat sinks 51 and 52 are formed at positions close to the LED chip 60, the heat of the LED chip 60 can be efficiently released.
Since the heat sink is also a part of the lead member, this heat sink may be electrically connected to the wiring board as an electrode. Thereby, the freedom degree of the pattern of a wiring board improves.

In the light emitting device of the embodiment configured as described above, the light emitted from the LED chip 60 to the side is reflected by the bottom reflecting portion 156 and emitted to the outside. Since the bottom reflection part 156 is made of white resin, the light from the LED chip 60 is efficiently diffusely reflected (diffuse reflection).
Incidentally, the comparison of the light emission output with the light emitting device of the example in which the bottom reflecting portion 156 is omitted (comparative example) is as follows. In the comparative example, the surface of the base of the lead member plated with silver is exposed at the bottom of the reflection case.
In the comparison of the initial light emission output and the output after the 3000 hour endurance test, the output ratio of the light emitting device of the example and the light emitting device of the comparative example excluding the white reflective layer from the example is 65% of the example and 35% of the comparative example. (See FIG. 11A).

Here, the durability test was performed under the conditions of applied current: 50 mA and environmental temperature: 25 ° C.
In the comparative example, the base portion of the lead member was blackened. The light emission output is a comparison of the luminance of the light emitting device, and is expressed as a relative luminance with the initial luminance of the example and the comparative example as 100%.
When the 3000 hour endurance test was performed under the conditions of an applied current of 20 mA and an environmental temperature of 85 ° C., the output ratio between the light emitting device of the example and the light emitting device of the comparative example was 65% of the example and 35% of the comparative example. (See FIG. 11B).
Further, when the 3000 hour endurance test was performed under the conditions of an applied current of 20 mA and an environmental temperature of 100 ° C., the output ratio between the light emitting device of the example and the light emitting device of the comparative example was 50% of the example and 35% of the comparative example. (See FIG. 11C).

In the above-described embodiment, the reflection surface 15 of the reflection case 11 is formed in a curved surface, but it may be a flat surface (see FIG. 12). 12, the same elements as those of FIG. 3 are denoted by the same reference numerals, and the description thereof is partially omitted.
In the example of FIG. 12, the bottom reflection portion 256 (white reflection layer) has a flat plate shape, and the upper surface angle facing the LED chip 60 is cut into a taper shape. Thereby, the light emitted from the LED chip 60 to the side can be reflected more efficiently. In FIG. 12, reference numeral 250 denotes a reflecting surface, and reference numeral 255 denotes a side wall reflecting portion.
In the example of FIGS. 3 and 12, the bottom reflecting portion 156 can be separated from the housing portion 10.

  The present invention is not limited to the description of the embodiments and examples of the invention described above. Various modifications may be included in the present invention as long as those skilled in the art can easily conceive without departing from the description of the scope of claims.

FIG. 1 is a perspective view of a light emitting device according to an embodiment of the present invention, FIG. 1 (A) is a perspective view seen from the front, and FIG. 1 (B) is a perspective view seen from the back. FIG. 2 is also a six-sided view, (A) is a plan view, (B) is a left side view, (C) is a front view, (D) is a right side view, (E) is a bottom view, and (F). FIG. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. FIG. 5 is a cross-sectional view taken along line VV in FIG. FIG. 6 is a diagram showing a manufacturing process of the light emitting device of the embodiment. FIG. 7 shows another embodiment of the lead member, FIG. 7 (A) shows a state where the lead member and the casing are assembled, and FIG. 7 (B) shows the lead member and the casing disassembled. Indicates the state. FIG. 8 is a usage diagram of the light emitting device. FIG. 9 is a cross-sectional view showing a configuration of a conventional light emitting device. FIG. 10 is a diagram for explaining the operation of the white reflective layer 5. FIG. 11 is a graph showing the durability test results of the light emitting devices of the example and the comparative example. FIG. 12 is a cross-sectional view showing a configuration of a light emitting device according to another embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light-emitting device 2 Light-emitting element 3 Lead member base parts 4 and 14 Sealing member 10 Housing part 11 Reflective case 15 Reflective surface 16, 17 Window 20 Terminal holding part 23, 24, 25, 26 Notch 27, 28, 29 Separation Part 30 First lead member 31 Base part 33 Connection part 40 Second lead member 41 Base part 43 Connection parts 51, 52 Heat sink 60 LED chip

Claims (3)

A side-emitting type light emitting device that is surface-mounted on a wiring board,
A casing formed by integrally molding the reflecting case and the terminal holding portion at the rear of the reflecting case;
A lead member to be inserted into the housing portion, comprising a base portion having a width substantially equal to the width of the bottom wall portion of the reflection case, wherein the base portion is silver-plated;
A white reflective layer formed integrally with the housing , covering the base of the lead member in the reflective case, and having a bowl-shaped curved surface on the entire surface;
A sealing material filled in the reflective case, wherein the phosphor is dispersed in a silicone resin;
With
At the base of the lead member, a first region for mounting a light emitting element and a second region for bonding a bonding wire from the light emitting element are formed,
The white reflective layer covers the base between the first region and the second region,
A light emitting device in which a window is formed on the bowl-shaped curved surface of the white reflective layer, and the second region is exposed through the window . The light emitting device according to claim 1 , wherein a distance between the surface of the base portion of the lead member and the surface of the white reflective layer is shorter than a distance between the surface of the base portion of the lead member and the surface of the light emitting element mounted on the base portion. . 3. The light emitting device according to claim 1, wherein the first region is located substantially at a center of a bottom wall portion of the reflection case, and the second region is located in contact with a side wall of the reflection case.

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