JP2008010562A - Light source device and plane lighting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the burr of a tie-bar cut, to form substantial outside dimensions to the outside dimensions or less of a molding section, and to improve even the thermal stability of the whole light source device. <P>SOLUTION: In a light source device 1, lead frames 2 are insert-molded by a reflective resin and semiconductor light-emitting element chips 6 are arranged, and the light source device 1 is filled with a transparent resin 5. In the light source device 1, the reverse sides of the lead frames 2 placing the semiconductor light-emitting element chips 6 on the lead frames 2 are used as bottoms 4b, and the lead frames 2 are cut and bent in the direction of the bottoms 4b while one is bent again along the bottoms 4b. In the light source device 1, the cuts of the lead frames 2 are formed on the side inner than the external shape of the outgoing surface of the light source device 1, and the lead frames 2 are not connected mutually and mechanically, and the lead frames 2 are held by the reflective resin. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention is a light source device in which a lead frame is insert-molded with a reflective resin or the like, a semiconductor light-emitting element chip is disposed, and a transparent resin is filled, and the lead frame for mounting the semiconductor light-emitting element chip on the lead frame After cutting the lead frame tie bar, bend the lead frame that becomes the electrode terminal in the direction of the bottom and bend it again along the bottom. Since the lead frame is not mechanically connected to each other and is held mechanically by the reflective resin, the tie bar cut part does not exist and there is no tie bar cut burr. Can be less than or equal to the outer shape of the mold part, and can also be applied to the incident part of the light guide plate for an extremely thin flat illumination device. When a plurality of semiconductor light emitting element chips are used in one package of the light source device, the semiconductor light emitting element chip having the shortest wavelength with respect to the plurality of semiconductor light emitting element chips mounted on the independent lead frames is mainly used. The present invention relates to a light source device capable of improving the thermal stability of the entire light source device by being provided at a position, and a flat illumination device using the light source device.

  As a conventional light source device, an LED light source is known in which an LED lamp in which a light emitting chip installed on a lead frame is sealed with a resin mold is inserted into a through hole formed in a white support and fixed. It has been.

In addition, a conventional semiconductor device for insert molding using a lead frame has a configuration including external support leads for continuously molding the lead frame. Since the lead frame is obtained in large numbers until it is molded, the lead frame is cut and separated into individual semiconductor devices after the molding is completed. At that time, the tie bar cut residue remains in the semiconductor device.
JP 2003-258137 A

  In the conventional light source device 1z described above, as shown in FIGS. 9 and 10, the lead frame 20 includes a lead frame 2 (in this case, 2a and 2c) on which the semiconductor light emitting element chip 6d is placed, and terminals at both ends. The lead frames 2a and 2b are the tie bars 22 and the tie bars 23 of the lead frame 20 that hold the lead frames 2a and 2b. The lead frame 2 (2a, 2c) for mounting the semiconductor light emitting element chip 6d and the lead frame 2b for bonding the bonding wire 9c for electrically connecting the semiconductor light emitting element chip 6d, and the case 44 of the light source device 1z, The part to be formed is insert-molded with a reflective resin or the like. Then, after the cases 44 of the light source device 1z are successively formed on the lead frame 20, the semiconductor light emitting element chip 6d is die-bonded with an adhesive or the like, and a bonding wire 9c that is electrically connected to the semiconductor light emitting element chip 6d is bonded. Thereafter, the transparent resin 5 or the like is filled in the opening 4a surrounded by the peripheral wall 44c of the case 44, and after curing, the tie bar 22 and the tie bar 23 of the lead frame 20 unnecessary for the light source device 1z are cut, as shown in FIG. The light source device 1z can be obtained. However, as shown in FIG. 10, after the tie bar cut of the tie bar 22 of the lead frame 20, the burr 22b, the uncut portion 22b, etc. remain and protrude beyond the original shape of the light source device 1z. Has dimensional challenges.

  Also, in the case of a conventional light source device in which a plurality of semiconductor light emitting element chips having different wavelengths of light are housed in one package, particularly in a light source device that obtains white light using three color lights of RGB (red, green, and blue). When a semiconductor light emitting device chip having a long wavelength such as R (red) is placed at the center position when these are arranged in series, the semiconductor light emitting device chip such as R (red) is the same as other semiconductor light emitting device chips. When making it equal to the luminance, it is necessary to pass more current than other semiconductor light emitting element chips. Similarly, in order to obtain the color temperature of white light, it is necessary to flow more current than other semiconductor light emitting element chips, and there is a problem that Joule heat is trapped at the center position of the entire light source device.

Further, FIG. 11 shows a conventional flat illumination device 10. In the conventional flat illumination device 10, the conventional light source device 44 as described above is placed on the substrate 18, and the light guide plate 12 is opposed to the position of the opening 4 a that is the emission surface of the light source device 44. The incident end face portion 13 is directed.
Light emitted from the opening 4a of the light source device 44 is guided into the light guide plate 12 from the incident end surface portion 13 of the light guide plate 12, and is emitted toward the counter-incident end surface portion 14 at a position facing the incident end surface portion 13. In addition, light is emitted from a groove or the like provided on the counter-exit surface 16 and the light leaking from the counter-exit surface 16 is reflected by the reflector 18 c and returned to the light guide plate 12 again.
Here, a reflector 18c is provided on the light-exiting surface portion side of the light guide plate 12.

  However, the overall size of the flat illumination device 10 is determined by the size of the conventional light source device 44. In the conventional light source device 44, since there are burrs 22b and the like, the actual size becomes larger than the size (thickness) of the light source device 44 and the light guide plate 12, and the size of the flat illumination device 10 is also large (thick). There is a problem that becomes.

(Object of invention)
The present invention has been made to solve the above-described problems. A lead frame on which a semiconductor light emitting element chip is mounted and a lead frame having a circuit configuration are supported by an external lead frame, and these semiconductor light emitting element chips are provided. The side opposite to the lead frame for mounting the circuit board or the circuit configuration lead frame is the bottom, the light emitting part that emits light emitted from the semiconductor light-emitting element chip is opposed to the bottom part, is connected to the bottom part, and the short side parts that face each other Reflective resin or the like such that a lead frame for mounting a semiconductor light emitting element chip or a circuit configuration lead frame is provided on both sides of the long side surface portion. Insert molding, and after the semiconductor light-emitting element chip is electrically bonded by die bonding and bonding wire, the light is transmitted from the bottom part to the light emitting part. After filling the resin, the lead frame on which the semiconductor light emitting element chip is mounted and the lead frame for circuit configuration are tie-bar cut to the length to be an electrode terminal, and then the lead frame and circuit configuration on which the semiconductor light emitting element chip is mounted Bend the lead frame for the bottom, and then re-bend the lead frame for mounting the semiconductor light-emitting element chip on one side and the lead frame for circuit configuration along the bottom and Since the light source device is obtained by separating a portion where a small part of the external lead frame is sandwiched as an individual light source device from the external lead frame with a small external force, the external dimensions of the light source device are completely four side surfaces. The tie bar cut part that can correspond to the incident part of the light guide plate for an extremely thin flat illumination device. Since it does not exist, it is thin without tie bar cut burrs, and when multiple semiconductor light emitting device chips are used in one package of the light source device, the wavelength is the largest for these multiple semiconductor light emitting device chips mounted on mutually independent lead frames. An object of the present invention is to provide a light source device capable of improving the thermal stability of the entire light source device by providing a short semiconductor light emitting element chip at the center position, and a thin flat illumination device using the light source device.

  In the light source device according to claim 1 of the present invention, the opposite side of the lead frame on which the semiconductor light emitting element chip is placed on the lead frame is the bottom, the lead frame is cut, then bent toward the bottom and one side along the bottom. The lead frame is bent again and has a cut portion inside the light-emitting device outer shape, and the lead frames are not mechanically connected to each other and are held by a reflective resin.

  The light source device according to claim 1 is configured such that the opposite side of the lead frame on which the semiconductor light emitting element chip is placed on the lead frame is the bottom, the lead frame is cut, then bent toward the bottom and one side is bent again along the bottom, Since the lead frame has a cut portion inside the light-emitting device outer shape and the lead frames are not mechanically connected to each other and are held by a reflective resin, the light-source device has an outer shape. Since there is no lead frame (tie bar) that is equivalent to the outer shape and holds the light source device, no burr occurs when the lead frame (tie bar cut) is cut.

  The light source device according to claim 2 is characterized in that the bottom of the reflective resin extends to the opposite side of the exit surface.

  In the light source device according to the second aspect, since the bottom portion of the reflective resin extends to the opposite side of the emission surface, the lead frame serving as a terminal can be bent along the bottom portion in the bottom portion direction.

  Furthermore, the light source device according to claim 3 has a plurality of semiconductor light emitting element chips, and is placed on a lead frame independent of each other and has a lead frame on which a semiconductor light emitting element chip having the shortest wavelength is placed at a central position. It is characterized by.

Since the light source device according to claim 3 includes a plurality of semiconductor light emitting element chips and is placed on the lead frames independent of each other and includes the lead frame on which the semiconductor light emitting element chip having the shortest wavelength is placed at the central position, In order to be placed on an independent lead frame, it is possible to independently set a current and a voltage for each semiconductor light emitting element chip, and to control the entire emitted light color from the light source device.
In addition, when the color of the emitted light from the light source device is changed to white light, the three-color light of RGB (red, green, and blue) is used to arrange them in series to obtain the color temperature of white light. Since the light emitting element chip has high impedance, there is little Joule heat, and Joule heat can be prevented from being trapped at the center position of the entire light source device.

Further, in the flat illumination device according to claim 4, the lead frame is insert molded with the opposite side of the lead frame on which the semiconductor light emitting element chip is placed on the lead frame by a reflective resin, and after cutting the lead frame, Bend toward the bottom and re-bend one side along the bottom. The lead frame has a cut portion inside the light-emitting surface of the light source device, and the lead frame is not mechanically connected to each other. A light source device comprising:
An incident end face part that guides outgoing light to a position facing the light output part of the light source device, an outgoing surface part that emits light to the outside, a reverse side part on the opposite side, and a side that connects the outgoing surface part and the rear part A light guide plate comprising an end surface portion and a non-incident end surface portion located on the opposite side of the incident end surface portion;
And a reflective sheet or a reflective case provided under the back surface portion.

In the flat illumination device according to claim 4, the lead frame is insert-molded with a reflective resin and the opposite side of the lead frame on which the semiconductor light-emitting element chip is placed on the lead frame, and the lead frame is cut, and then the bottom direction And bent one side again along the bottom, the cut part of the lead frame has an inner side of the outer shape of the emission surface of the light source device, the lead frame is not mechanically connected to each other, and the lead frame is held by reflective resin A light source device comprising:
An incident end face part that guides outgoing light to a position facing the light output part of the light source device, an outgoing surface part that emits light to the outside, a reverse side part on the opposite side, and a side that connects the outgoing surface part and the rear part A light guide plate comprising an end surface portion and a non-incident end surface portion located on the opposite side of the incident end surface portion;
Since it has a reflective sheet or reflective case provided under the back surface, there is no burr or the like on the outside of the light source device, and the size (thickness) of the light emitting portion of the light source device and the incident end surface portion of the light guide plate The size (thickness) can be matched.

Furthermore, the flat illumination device according to claim 5 is a lead in which a plurality of semiconductor light emitting element chips are placed on lead frames independent of each other by a reflective resin and a semiconductor light emitting element chip having the shortest wavelength is placed thereon. A frame is provided at the center position, insert mold molding is performed with the opposite side of the lead frame as the bottom, and after cutting the lead frame, the lead frame is bent toward the bottom, and one is bent again along the bottom. A light source device having an inner side of the outer surface of the emission surface, the lead frames being not mechanically connected to each other and holding the lead frames with a reflective resin;
An incident end face part that guides outgoing light to a position facing the light output part of the light source device, an outgoing surface part that emits light to the outside, a reverse side part on the opposite side, and a side that connects the outgoing surface part and the rear part A light guide plate comprising an end surface portion and a non-incident end surface portion located on the opposite side of the incident end surface portion;
And a reflective sheet or a reflective case provided under the back surface portion.

According to a fifth aspect of the present invention, there is provided a flat illumination device comprising: a lead frame on which a plurality of semiconductor light emitting element chips are placed on independent lead frames by a reflective resin; and the semiconductor light emitting element chip having the shortest wavelength is placed on the lead frame. In the center position, insert mold molding with the opposite side of the lead frame as the bottom, after cutting the lead frame, bend in the direction of the bottom and bend again along the bottom, the cut part of the lead frame is the emission surface of the light source device A light source device having an inner side than the outer shape, and the lead frames are not mechanically connected to each other and are held by a reflective resin;
An incident end face part that guides outgoing light to a position facing the light output part of the light source device, an outgoing surface part that emits light to the outside, a reverse side part on the opposite side, and a side that connects the outgoing surface part and the rear part A light guide plate comprising an end surface portion and a non-incident end surface portion located on the opposite side of the incident end surface portion;
Since it has a reflective sheet or reflective case provided under the back surface, there is no burr or the like on the outside of the light source device, and the size (thickness) of the light emitting portion of the light source device and the incident end surface portion of the light guide plate The size (thickness) can be made to coincide with each other, and current and voltage can be set independently for each semiconductor light emitting element chip for mounting on lead frames independent from each other, and from the light source device The overall emitted light color can be controlled.
In addition, when the color of the emitted light from the light source device is changed to white light, the three-color light of RGB (red, green, and blue) is used to arrange them in series to obtain the color temperature of white light. Since the light emitting element chip has high impedance, there is little Joule heat, and Joule heat can be prevented from being trapped at the center position of the entire light source device.

As described above, the light source device according to claim 1 has the opposite side of the lead frame on which the semiconductor light-emitting element chip is placed on the lead frame as the bottom, and after cutting the lead frame, bends it toward the bottom and one side becomes the bottom. The light source device is formed by holding the lead frame with a reflective resin without being mechanically connected to each other. Since the outer shape of the light source device is equal to the outer shape of the exit surface and there is no lead frame (tie bar) for holding the light source device, no burr occurs when the lead frame (tie bar cut) is cut.
For this reason, the dimensions of the light source device are firmly protected when mounted on the device, and the miniaturization, workability and reliability are improved.

In the light source device according to the second aspect, since the bottom portion of the reflective resin extends to the opposite side of the emission surface, the lead frame serving as a terminal can be bent along the bottom portion in the bottom portion direction.
For this reason, the electrode terminals can be obtained within the dimensions of the light source device itself, and the contact area can be increased when being mounted on a substrate or the like, so that contact failure is eliminated and reliability is improved.

Since the light source device according to claim 3 includes a plurality of semiconductor light emitting element chips and is placed on the lead frames independent of each other and includes the lead frame on which the semiconductor light emitting element chip having the shortest wavelength is placed at the central position, In order to be placed on an independent lead frame, it is possible to independently set a current and a voltage for each semiconductor light emitting element chip, and to control the entire emitted light color from the light source device.
In addition, when the color of the emitted light from the light source device is changed to white light, the three-color light of RGB (red, green, and blue) is used to arrange them in series to obtain the color temperature of white light. Since the light emitting element chip has high impedance, there is little Joule heat, and Joule heat can be prevented from being trapped at the center position of the entire light source device.
Therefore, since the speed at which the chromaticity is stabilized is fast and the width of the chromaticity is small, stable white light can be obtained in a short time, enabling long-time use, and improving the lifetime of the semiconductor light emitting element chip. At the same time, reliability is improved.

In the flat illumination device according to claim 4, the lead frame is insert-molded with a reflective resin and the opposite side of the lead frame on which the semiconductor light-emitting element chip is placed on the lead frame, and the lead frame is cut, and then the bottom direction And bent one side again along the bottom, the cut part of the lead frame has an inner side of the outer shape of the emission surface of the light source device, the lead frame is not mechanically connected to each other, and the lead frame is held by reflective resin A light source device comprising:
An incident end face part that guides outgoing light to a position facing the light output part of the light source device, an outgoing surface part that emits light to the outside, a reverse side part on the opposite side, and a side that connects the outgoing surface part and the rear part A light guide plate comprising an end surface portion and a non-incident end surface portion located on the opposite side of the incident end surface portion;
Since it has a reflective sheet or reflective case provided under the back surface, there is no burr or the like on the outside of the light source device, and the size (thickness) of the light emitting portion of the light source device and the incident end surface portion of the light guide plate The size (thickness) can be matched.
Therefore, it can be reduced in size and productivity and reliability are improved.

According to a fifth aspect of the present invention, there is provided a flat illumination device comprising: a lead frame on which a plurality of semiconductor light emitting element chips are placed on independent lead frames by a reflective resin; and the semiconductor light emitting element chip having the shortest wavelength is placed on the lead frame. In the center position, insert mold molding with the opposite side of the lead frame as the bottom, after cutting the lead frame, bend in the direction of the bottom and bend again along the bottom, the cut part of the lead frame is the emission surface of the light source device A light source device having an inner side than the outer shape, and the lead frames are not mechanically connected to each other and are held by a reflective resin;
An incident end face part that guides outgoing light to a position facing the light output part of the light source device, an outgoing surface part that emits light to the outside, a reverse side part on the opposite side, and a side that connects the outgoing surface part and the rear part A light guide plate comprising an end surface portion and a non-incident end surface portion located on the opposite side of the incident end surface portion;
Since it has a reflective sheet or reflective case provided under the back surface, there is no burr or the like on the outside of the light source device, and the size (thickness) of the light emitting portion of the light source device and the incident end surface portion of the light guide plate The size (thickness) can be made to coincide with each other, and current and voltage can be set independently for each semiconductor light emitting element chip for mounting on lead frames independent from each other, and from the light source device The overall emitted light color can be controlled.
In addition, when the color of the emitted light from the light source device is changed to white light, the three-color light of RGB (red, green, and blue) is used to arrange them in series to obtain the color temperature of white light. Since the light emitting element chip has high impedance, there is little Joule heat, and Joule heat can be prevented from being trapped at the center position of the entire light source device.
Therefore, the size can be reduced, the productivity is improved, and the lifetime and reliability of the semiconductor light-emitting element chip and the long-time use are improved.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
In the present invention, a lead frame for mounting a semiconductor light emitting element chip and a lead frame having a circuit configuration are supported by an external lead frame, and a lead frame for mounting these semiconductor light emitting element chips and a lead frame for circuit configuration are provided. The opposite side is the bottom, the light output part that emits light emitted from the semiconductor light emitting element chip is opposed to the bottom part, is connected to the surrounding bottom part, and the short side part and the long long side part that face each other The semiconductor light emitting device chip is formed by insert molding with a reflective resin or the like so that a lead frame for mounting the semiconductor light emitting device chip or a circuit configuration lead frame is provided on both sides of the long side surface portion. After electrically bonding with bonding and bonding wire, after filling the transparent resin from the bottom to the light emitting part, after curing the transparent resin The lead frame on which the conductor light emitting element chip is mounted and the circuit configuration lead frame are tie-bar cut to such a length as to be an electrode terminal, and then the lead frame on which the semiconductor light emitting element chip is mounted and the circuit configuration lead frame on the bottom ( Bending in two directions (long side surface side), and further bending the lead frame for mounting the semiconductor light emitting element chip on one side surface side or the circuit configuration lead frame along the bottom portion, Since the light source device is obtained by separating a portion where a small part of the external lead frame is sandwiched between the ends as an individual light source device with a small external force, the external dimensions of the light source device are completely It has dimensions consisting of four side parts, and can be used for the incident part of a light guide plate for an extremely thin flat illumination device. Since there is no lead frame to hold and no lead frame to hold circuit configuration lead frames, there is no tie bar cut part, so there is no tie bar cut burr and it is thin, and a semiconductor light emitting device in one package of the light source device When a plurality of chips are used, the thermal stability of the entire light source device is improved by providing the semiconductor light emitting element chip having the shortest wavelength at the central position with respect to the plurality of semiconductor light emitting element chips mounted on the lead frames independent of each other. It is possible to provide a light source device that can be used and a thin flat illumination device using the light source device.

  1 is a schematic perspective view of a light source device according to the present invention, FIG. 2 is a schematic perspective view of the light source device according to the present invention (in the rear surface direction), FIG. 3 is a schematic lead frame diagram of the light source device according to the present invention, and FIG. FIG. 5 is a schematic sectional view of a light source device according to the present invention, FIG. 6 is a schematic sectional side view of the light source device according to the present invention, and FIG. 7 is a flat illumination device according to the present invention. FIG. 8 is a chromaticity characteristic diagram according to a difference in color arrangement of the semiconductor light emitting element chip when the light source device according to the present invention emits white light.

  As shown in FIG. 1 and FIG. 2, the light source device 1 mounts the semiconductor light emitting element chip 6 and supports the lead frame 2a and the lead frame 2b having a circuit configuration with an external lead frame, and the molding portion 4 emits semiconductor light. The opposite side on which the element chip 6 is placed is the bottom part 4b, connected to the bottom part 4b, facing the bottom part 4b and surrounding the opening 4a (light emitting part) that emits light emitted from the semiconductor light emitting element chip 6. A lead frame 2a for mounting the semiconductor light-emitting element chip 6 and for circuit configuration, etc. on both sides of the long side surface portion is composed of four side surface portions 4c, both short end portions and long long side surface portions facing each other. Insert mold molding is performed with a reflective resin or the like so as to provide the lead frame 2b, and the lead frame 2a or the lead frame 2b for mounting the semiconductor light emitting element chip 6 or the circuit configuration is bent toward the bottom 4b. Is a structure in which a two terminal bent again in two directions the lead frame 2a and the lead frame 2b of one first side of the semiconductor light-emitting device mounted and the circuit configuration of the chip 6 along the bottom 4b.

Further, as shown in FIG. 3, the light source device 1 is of an injection or transfer mold type, and includes lead frames 2 (2a-1) and 2 (2a-1b), 2 on which the semiconductor light emitting element chip 6 is placed. (2a-2) and 2 (2a-2b), 2 (2b-3) and 2 (2b-3b), and lead frames 2 (2b-1) and 2 (2b-1b) and 2 (2b- 2) and 2 (2b-2b), 2 (2a-3) and 2 (2a-3b), etc., the space part 11 for separating them and the molding part 4 during insert molding, die bonding and wire It is made of a phosphor bronze material or the like in which an anti-bending hole 11 'or the like is provided so that each unit becomes flat when bonding and filling with a transparent resin, etc., and a punched pattern shape such as a press is formed. The lead frame 20 is inserted into the resin, and the resin is formed on the lead frame 20 (2), so that the molding portion 4 corresponding to the main body portion of the light source device 1 is formed.
The hole 25 is a hole for continuously processing and molding the lead frame 20.
However, there is nothing in the opening 4a during insert molding.

  Furthermore, the light source device 1 is composed of four side surfaces 4c, which are both short end portions of the short side surfaces facing each other and the long long side surface portions connected to the bottom portion 4b, and the inner side of these side surface portions 4c is a position close to the bottom portion 4b. It consists of a molding part 4 having a thick inclined surface 4e, and the emitted light from the semiconductor light emitting element chip 6 is efficiently emitted from the opening 4a while being reflected by the inclined surface 4e.

Further, the inclined surface 4e reflects light other than the straight light from the semiconductor light emitting element chip 6 out of the light emitted from the semiconductor light emitting element chip 6 by the inclined surface 4e and emits it from the opening 4a.
Further, the surface of the inclined surface 4e does not have to be a mirror surface completely, and it is possible to obtain a broad reflected light by processing a fine unevenness and to increase the bonding (bonding) strength with the transparent resin to be filled. Can do.

  In addition, the resin forming the molding part 4 including the bottom part 4b and the side part 4c of the light source device 1 is an insulating material such as a modified polyamide, polybutylene terephthalate, nylon 46, liquid crystal polymer such as aromatic polyester, or the like. In addition, in order to improve light reflectivity and obtain light shielding properties, a mixture in which white powder such as titanium oxide is mixed is subjected to heat injection molding.

  The lead frames 2 (2a, 2b) and 20 are made of a material having good electrical conductivity such as phosphor bronze material and aluminum and having toughness and plasticity. As shown in FIG. 4, among the four side surfaces between the opening 4a and the bottom 4b of the molded portion 4, the lead frame 2 (on which the semiconductor light emitting element chips 6 provided on both sides on the long side surface side are placed. 2a-1) and 2 (2a-1b), 2 (2a-2) and 2 (2a-2b), 2 (2b-3) and 2 (2b-3b), and lead frame 2 (2b-1) having a circuit configuration ) And 2 (2b-1b), 2 (2b-2) and 2 (2b-2b), 2 (2a-3), 2 (2a-3b), etc. have a certain length so as to become electrode terminals. And cut (tie bar cut).

Furthermore, these lead frames 2a and 2b are bent in the direction of the bottom 4b, and electrode terminals 2a-1, 2a-2, 2b-3, 2b-1, 2b-2, 2a-3 (these And the other opposing lead frames 2a and 2b are bent again along the bottom 4b to form electrode terminals 2a-1b, 2a-2b, 2b-3b, 2b-1b and 2b. -2b, 2a-3b (hereinafter referred to as 2x-nb) and the like.
In the present invention, the lead frames 2a-1 and 2a-1b, 2a-2 and 2a-2b, 2b-3 and 2b-3b on which the semiconductor light emitting element chip 6 is placed are defined as cathodes (cathodes). 2b-1 and 2b-1b and 2b-2b, 2a-3 and 2a-3 side are anode (anode) side.

Further, the bottom portion 4b is provided with an inclined surface portion 4f inclined on the lead frame 2x-n side so that the lead frame 2x-n can be finely moved in the direction of the inclined surface portion 4f.
Further, a recognition notch 4d is provided at one end of the molded part 4 (outside the opening 4a) of the light source device 1 so that the polarity of the electrode terminal can be seen.

  In this way, the bottom 4b of the molding part 4 is extended to the opposite side of the opening 4a (light emitting surface), and the lead frame 2a and the lead frame 2b serving as electrode terminals are bent along the bottom 4b in the direction of the bottom 4b. Thereby, the electrode terminals 2x-n and 2x-nb can be obtained within the dimensions of the light source device 1 itself. Although not shown, the contact area can be increased when mounting on a substrate or the like, so that contact failure can be eliminated and reliability can be improved.

  The lead frame 2 (2a, 2b) is subjected to a treatment such as gold plating after plating of noble metal such as gold plating or the like, and when the exposed portion or the semiconductor light emitting element chip 6 is placed and die-bonded, or a bonding wire When wire bonding is performed on the wire 9a and the bonding wire 9b, the surface of the lead frame 2 (2a, 2b) is prevented from being oxidized and the electric resistance is reduced.

  Further, the electrode terminals 2x-n and the electrode terminals 2x-nb are subjected to solder plating or the like, and are completely melted and electrically connected with other electric parts, wirings, etc. by soldering to reduce the contact resistance.

Further, lead frames 2x-n and 2x-nb on which the semiconductor light emitting element chip 6 is placed, lead frames 2x-n and 2x-nb having a circuit configuration, and the like are provided on both sides of the long side surface portion. As a result, as shown in FIG. 6, the lead frame 2x-n slightly moves in the direction of the inclined surface portion 4f by the inclined surface portion 4f of the electrode portion 2x-nb bent once and the electrode terminal 2x-nb bent twice by the inclined surface portion 4f of the bottom portion 4b. This acts as a spring and can be held in a socket or the like (not shown).
Further, although not shown, when the lead frame 2x-nb is inserted on the circuit pattern provided on the substrate, it can be inserted without damaging the circuit pattern on the substrate.
Further, in the case of electrical connection to an electrical circuit different from the above, it is possible to reliably connect with solder or the like or a faston terminal to the lead frame 2x-n provided in the upper part.

  The semiconductor light emitting element chip 6 is selected from LED, laser, and the like. For example, in the LED, red light emission (R), blue light emission (B) made of a semiconductor chip of a compound such as a quaternary compound or a compound of InGaAlP, InGaAlN, InGaN, etc. It is a high brightness light emitting element such as green light emission (G). In the case of white light, the semiconductor light-emitting element chip 6 is provided with these three primary colors of red light emission (R), blue light emission (B), and green light emission (G) very close to the bottom portion 4. Various emission colors can be emitted in combination.

  Further, when a plurality of semiconductor light emitting element chips 6 are placed in series on the light source device 1, the semiconductor light emitting element chip 6b having the shortest wavelength is placed at the center position. Thus, for example, as shown in FIG. 4, when the entire emitted light color from the light source device 1 is changed to white light, these red light emitting semiconductor light emitting element chips are used by using three color lights of RGB (red, green, blue). 6a, blue light emitting semiconductor light emitting element chip 6b, and green light emitting semiconductor light emitting element chip 6c are arranged in this order to obtain white light.

  Here, FIG. 8 shows the light source device 1 in which the semiconductor light emitting element chips 6 are arranged in one package in the order of BRG (blue, red, green), and the one packaged in the order of RBG (red, blue, green). FIG. As shown in FIG. 8, first, the light source device 1 is arranged in the order of BRG (blue, red, green) on the condition that a current of 8 mA is supplied to each LED of RGB (red, green, blue). The packaged product (thin solid line a in FIG. 8) and the RBG (red, blue, green) arranged in the order of one package (thick solid line A in FIG. 8) were comparatively measured.

As a result, in the BRG (thin solid line a in FIG. 8), it takes a long time for the chromaticity x to stabilize from the start, and there is a large amount of variation (lowering) in the chromaticity y when the chromaticity is stabilized from the start. I understand.
On the other hand, in the RBG (thick solid line A in FIG. 8), the time until the chromaticity x is stabilized from the start is not so long, and there is no fluctuation (lowering) amount of the chromaticity y when the chromaticity is stabilized from the start. I understand that.

Similarly, when a current of 12 mA or 15 mA is applied to each LED of RGB (red, green, blue), BRG (blue, red, green) is supplied to the light source device 1 more than when a current of 8 mA is applied. In the one package (thin broken line b or thin one-dot chain line c in FIG. 8) arranged in this order, it takes a long time for the chromaticity x to stabilize from the start, and the variation in the chromaticity y when the chromaticity is stabilized from the start ( It turns out that the amount is low.
Further, when the light source device 1 is arranged in the order of RGB (red, blue, green) in a single package and a current of 12 mA or 15 mA is similarly applied to each light emitting LED (bold broken line B or thick in FIG. 8). In the one-dot chain line C), the chromaticity x is stabilized from the start as compared with the one packaged in the order of BRG (blue, red, green) (thin dashed line b and fine one-dot chain line c in FIG. 8). It can be seen that the time until the time is short and the amount of fluctuation (lowering) in chromaticity y is small when it is stable from the start.
For the measurement, an integrating sphere: IS-080-SF from Labsphere (USA) and a spectroscope: LE-3300 from Otsuka Electronics Co., Ltd. were used.

  As described above, when the color temperature of the white light is set, the semiconductor light emitting element chip 6b having the shortest wavelength has a high impedance so that the Joule heat is small and the Joule heat is not trapped in the central position of the light source device 1 as a whole. it can. Moreover, since the speed at which chromaticity stabilizes is fast and the width of chromaticity shift is small, stable white light can be obtained in a short time, enabling long-term use, and improving the lifetime of the semiconductor light emitting element chip 6. As well as improving reliability.

  Thus, in order to place the semiconductor light emitting element chip 6 on the lead frame 2a and the lead frame 2b independent of each other, the current and voltage can be set independently for each semiconductor light emitting element chip 6 and the light source device 1 can be set. It is possible to control the entire emitted light color from the.

Further, as shown in FIG. 5, after the semiconductor light emitting element chip 6 is die-bonded to the lead frame 2a or the lead frame 2b with the adhesive 8, the wire bonding is performed using the bonding wire 9a or the bonding wire 9b, and then to the opening 4a. The space is filled with a transparent resin 5 such as a transparent epoxy resin or silicone resin.
In the case of emitting monochromatic light from the light source device 1, the light source device 1 is filled with a transparent resin 5 such as a transparent epoxy resin or a silicone resin adjusted to the same color as the light emitted from the semiconductor light emitting element chip 6 to produce clearer light emission. Color can be emitted.
Further, a resin prepared by mixing a colorless transparent resin with a wavelength conversion material made of an inorganic fluorescent pigment, an organic fluorescent dye, or the like is excited by the emission color of the semiconductor light emitting element chip 6 itself and the semiconductor light emitting element chip 6. Then, light that is a mixture of light emitted from the semiconductor light emitting element chip 6 and light having a different wavelength may be emitted.

Further, when the semiconductor light emitting element chip 6 is die-bonded, an adhesive in which a fluorescent material that is a wavelength conversion material for yellow light emission is mixed with a colorless and transparent adhesive 8, and a blue light emitting semiconductor light emitting element chip 6 is further provided thereon. It may be provided. As a result, the blue light emitted from the blue light emitting semiconductor light emitting element chip 6 itself is directly emitted in the direction of the opening 4a (light emitting surface), and the light emitted from the blue light emitting semiconductor light emitting element chip 6 in the bottom direction is converted into the wavelength conversion material. And is excited by the blue light of the semiconductor light emitting element chip 6, and the yellow light emitted by the yellow light emitting fluorescent material is reflected by the lead frame 2a and the lead frame 2b (bottom part) and passes through the semiconductor light emitting element chip 6 again. Thus, when the light is emitted in the direction of the opening 4a (outgoing surface), white light can be emitted from the opening 4a (outgoing surface) by mixing the yellow emission color and the blue emission color.
Further, a fluorescent material may be mixed and filled in the transparent resin 5 such as a transparent epoxy resin or silicone resin filling the space.

  Furthermore, if transparent resin 5 such as colorless and transparent epoxy resin or silicone resin is filled, the semiconductor light emitting element chip 6 is more strongly fixed and light emitted from the semiconductor light emitting element chip 6c is exposed without being exposed to the air layer. Can be emitted from the opening 4a (emission surface) without being attenuated.

  Although the description will be made before and after, the lead frame 2x-n and the lead frame 2x-nb have a certain length so as to become electrode terminals after the transparent resin 5 or the like is filled from the opening 4a of the molding portion 4. After cutting (tie bar cutting), bending in the direction of the bottom 4b, and further bending the lead frame 2x-nb along the bottom 4b, a small one of the external lead frame 20 is formed on both short ends of the molded portion 4. The temporary holding portion 21 that is the portion between which the portion is sandwiched is obtained as an individual light source device 1 separated from the external lead frame 20 by a small external force.

In this way, the lead frames 20, 2x-n, 2x-nb, etc. are not mechanically connected to each other, and the lead frame 2x-n, the lead frame 2x-nb, etc. are held by the reflective resin molding part 4. The lead frame (tie bar cut) was cut because the outer shape of the light source device 1 (molded portion 4) is equivalent to the outer shape of the opening 4a (emission surface) and there is no lead frame (tie bar) for holding the light source device 1. No burr occurs.
For this reason, the dimensions of the light source device can be firmly maintained when mounted on the device, and the miniaturization, workability, and reliability can be improved.
In the above description, a plurality of semiconductor light emitting element chips 6a, 6b, 6c and the like are used. However, one semiconductor light emitting element chip 6 may be used alone.

FIG. 7 shows a flat illumination device 1b of the present invention.
The flat illumination device 1 b uses the light source device 1 described above, and has a configuration in which the light guide plate 12 and the light source device 1 are placed on a substrate 18.
Although not shown, a case or the like may be used instead of the substrate 18.

In the light source device 1, the lead frame 2 is insert-molded with an insulating resin having improved light reflectivity in a molding portion 4 including a bottom portion 4b, a side surface portion 5a, a side surface portion 4c, an inclined surface 4e, an opening portion 4a, and the like. Electrode terminals 2x-n and electrode terminals 2x-nb are provided outside, and a semiconductor light emitting element chip 6 surrounded by an opening 4a is placed thereon and filled with a transparent resin 5 or the like.
In addition, since description of the light source device 1 was described above, since it overlaps, description is abbreviate | omitted.

In addition, the light source device 1 places the electrode terminals 2x-n and the electrode terminals 2x-nb so as to be in contact with the circuit pattern 19 provided on the substrate 18, and the exit surface as the opening 4a is incident on the light guide plate 12. It is placed so as to be close to or in contact with the end face.
Although not shown, the electrode terminal 2x-n and the electrode terminal 2x-nb may be connected to the circuit pattern 19 provided on the substrate 18 with solder or the like, and the electrode terminal 2x-n is finely moved in the direction of the inclined surface portion 4f. It may be held in a socket or the like, or may be connected to the Faston terminal to the electrode terminal 2x-n.

The light guide plate 12 is made of a transparent acrylic resin (PMMA) or polycarbonate (PC) having a refractive index of about 1.4 to 1.7, and includes an incident end face portion 13 that guides light from the light source device 1, and an incident end face. The anti-incident end face part 14 located on the opposite side of the part 13, the outgoing face part 15 that emits light from the incident end face part 13, the counter outgoing face part 16 located on the opposite side of the outgoing face part 15, and these outgoing face parts 15 And a side surface portion 17 intersecting with the counter-light emitting surface portion 16. Although not shown, the light exit plate 15 and the counter light exit surface 16 of the light guide plate 12 are provided with dots, grooves, and the like having various shapes so as to efficiently emit light to the outside.
In addition, various shapes, such as a fine arc shape, a fine ellipse, a fine polygonal column, a fine prism, a fine polygonal pyramid, and a polygonal trapezoidal cone, are processed on the emitting surface portion 15 and the anti-emitting surface portion 16.

Further, the light incident on the light guide plate 12 travels into the light guide plate 12 in a range where the refraction angle γ satisfies the expression 0 ≦ | γ | ≦ Sin ⁻¹ (1 / n). For example, since the refractive index of acrylic resin, which is a resin material used for the general light guide plate 12, is about n = 1.49, the maximum incident angle is from the direction of the exit surface 15 of the entrance end face 13 to the counter exit surface 16. The light in the direction and the light from the counter-exiting surface portion 16 direction to the emitting surface portion 15 direction have an incident angle of 90 °, and the refraction angle γ refracted by the incident end surface portion 13 is in the range of γ = 0 to ± 42 °.

Further, the light incident on the light guide plate 12 within the range of the refraction angle γ = 0 to ± 42 ° is expressed as Sin α = (1 / n) at the boundary surface between the light guide plate 12 and the air layer (refractive index n = 1). ) Can be used to express the critical angle. For example, since the refractive index of acrylic resin, which is a resin material used for the general light guide plate 12, is about n = 1.49, the critical angle α is about α = 42 °. If the exit surface 15 and the counter-exit surface 16 of the light guide plate 12 are not convex or concave to deflect the light beam, or if the critical angle α is not exceeded, the light in the light guide plate 12 emits the output surface 15 or the counter-exit surface 16. Thus, the light travels in the opposite direction of the incident end face portion 13 while being totally reflected.
However, in the above case, the thickness of the light guide plate 12 is uniform and flat, and although not shown, the wedge-shaped light guide plate 12 breaks the critical angle α due to the wedge-shaped taper (degree of inclination). Causes taper leak.

  The substrate 18 is made of a non-conductive substance and a non-conductive substance mixed with a white material such as titanium oxide in a thermoplastic resin, and is opposite to the anti-emission surface part 16 of the light guide plate 12. Leakage from 16 is made incident on the light guide plate 12 again to increase the efficiency of the emitted light.

Further, the substrate 18 is provided with a metal conductive pattern 19 such as copper or aluminum at positions corresponding to the electrode terminals 2x-n and 2x-nb of the light source device 1.
The electrode terminal 2b-1b corresponds to the pattern 19 (1b), the electrode terminal 2a-1b corresponds to the pattern 19 (1a), and the electrode terminal 2a-3b corresponds to the pattern 19 (3a). Yes.

  Although not shown here, a case may be used instead of the substrate 18, and it is made of a non-conductive material having reflectivity like the substrate 18, and covers the area other than the emission surface portion 15 to increase the efficiency of the emitted light. .

The shape of the light guide plate 12 may be the same as the size of the exit surface (opening) 4a of the light source device 1 and the incident end face portion 13 of the light guide plate 12, and the thickness of the flat light guide plate 12 and the incident end face portion 13 is sufficient. Either the light guide plate 12 whose thickness is thinner than the thickness of the anti-incident end face portion 14, the light guide plate 12 whose thickness of the incident end face portion 13 is thicker than the thickness of the anti-incident end face portion 14, or the like may be used.
Therefore, since the light source device 1 is thin, the entire thickness can be reduced by the thickness of the light guide plate 12 corresponding to the thickness of the light source device 1, and the weight can be reduced.

  As described above, according to the present invention, the lead frame 20 is provided with the pattern of the semiconductor light-emitting element chip 6 and the lead frames 2a and 2b for electrode terminals, and the plurality of lead frames 2a and 2b and one of the lead frames 20 are provided. The portion is electrically insulating and insert-molded with a reflective resin or the like to provide an opening (light emitting portion) 4a for emitting light emitted from the semiconductor light emitting element chip 6 and a bottom portion 4b on the opposite side. After the semiconductor light emitting element chip 6 is electrically bonded by die bonding and bonding wires 8a and 8b, it is filled with a transparent resin such as an epoxy resin or a silicone resin, and the lead frames 2a and 2b are formed to an arbitrary length after the transparent resin is cured. Cut and bend the cut lead frames 2a and 2b along the direction of the bottom 4b (opposite the opening 4a) Further, after bending one of the lead frames 2a and 2b so as to be wound around the bottom portion 4b again, the light source device capable of removing the molded part 4 (light source device 1) temporarily held by a part of the lead frame 20 from the lead frame 20. However, since the outer shape of the molded part 4 is the maximum outer shape as it is, and there is no burr when the tie bar or the like is cut, the entire thickness of the flat illumination device 1b is reduced even if it is used as a light source as a component such as the flat illumination device 1b. Can be reduced in weight, and when reproducing a white light source using a semiconductor light emitting element chip 6 of RGB (red, green, blue) or the like, B (blue) having a short wavelength at the center position can be achieved. Since the semiconductor light emitting element chip is arranged, the light source device generates Joule heat generated in order to flow more current than other semiconductor light emitting element chips 6 like the R (red) semiconductor light emitting element chip 6. With chromaticity with the speed to stabilize the chromaticity is faster by placing the in the corner is the light source device 1 which can range shift is small, a flat illumination device 1b using this light source device.

  Suitable for light sources for backlights of small mobile products, light sources for all small and thin electrical products, etc. Especially, it is a semiconductor light-emitting element chip, so it has a wide operating temperature range and is fully compatible with usage environments such as car navigation systems. It is possible to provide a light source device and a small mobile product flat illumination device.

1 is a schematic perspective view of a light source device according to the present invention. It is a schematic perspective view (back surface direction) of the light source device which concerns on this invention. It is a general | schematic lead frame figure of the light source device which concerns on this invention. It is a schematic front view of the light source device according to the present invention. It is a schematic sectional drawing of the light source device which concerns on this invention. It is a schematic side sectional view of a light source device according to the present invention. 1 is a schematic perspective view of a flat illumination device according to the present invention. FIG. 4 is a chromaticity characteristic diagram of a semiconductor light emitting device chip arranged in one package in the order of BRG and a one package arranged in the order of RBG in the light source device according to the present invention. It is a general | schematic lead frame figure of the conventional light source device. (A), (b) It is the schematic front view and schematic sectional drawing of the conventional light source device. It is a schematic sectional drawing of the conventional plane illuminating device.

Explanation of symbols

1, 1z light source device 1b flat illumination device 2, 2a, 2b, 20 lead frame 2a-1, 2a-1b lead frame 2a-2, 2a-2b lead frame 2a-3, 2a-3b lead frame 2b-1, 2b -1b Lead frame 2b-2, 2b-2b Lead frame 2b-3, 2b-3b Lead frame 4 Molded portion 4a Opening portion 4b Bottom portion 4c Side surface portion 4d Recognition not-contact portion 4e Inclined surface 4f Inclined surface portion 5 Transparent resin 6, 6a , 6b Semiconductor light emitting element chip 6c, 6d Semiconductor light emitting element chip 8 Adhesive 9a, 9b, 9c Bonding wire 10 Planar illumination device 11 Space portion 11 'Anti-bending hole 12 Light guide plate 13 Incident end surface portion 14 Anti-incident end surface portion 15 Outgoing surface portion 16 Counter-exiting surface portion 17 Side surface portion 18 Base 19 Pattern 21 Temporary holding portion 22 Tie bar 2 b burr 23 tie bar 25 holes 44 case 44c wall α critical angle γ refraction angle n the refractive index

Claims (5)

In a light source device in which a lead frame is insert molded with a reflective resin, a semiconductor light emitting element chip is arranged, and a transparent resin is filled.
The lead frame opposite to the lead frame on which the semiconductor light emitting element chip is placed on the lead frame is a bottom, and after cutting the lead frame, the lead frame is bent toward the bottom and the other is bent again along the bottom. The light source device is characterized in that the cut portion of the light source device is inside the outer shape of the light emitting surface of the light source device, and the lead frames are not mechanically connected to each other and are held by the reflective resin. The light source device according to claim 1, wherein the reflective resin has the bottom portion extending to the opposite side of the emission surface. The semiconductor device further comprises a plurality of the semiconductor light emitting element chips, mounted on the lead frames independent of each other, and provided with the lead frame on which the semiconductor light emitting element chip having the shortest wavelength is mounted at a central position. Item 2. The light source device according to Item 1. The lead frame is insert-molded with the opposite side of the lead frame on which the semiconductor light emitting element chip is placed on the lead frame by a reflective resin as the bottom, and the lead frame is cut and then bent toward the bottom and the other is The lead frame is bent again along the bottom, the cut portion of the lead frame is inside the light emitting device outer shape, and the lead frame is not mechanically connected to each other and the lead frame is held by the reflective resin. A light source device comprising:
An incident end face portion that guides the emitted light to a position facing the light exit portion of the light source device, an exit surface portion that emits light to the outside, a back surface portion on the opposite side, and the exit surface portion and the back surface portion. A light guide plate comprising a side end surface portion to be connected and a non-incident end surface portion located on the opposite side of the incident end surface portion;
A flat illumination device comprising a reflective sheet or a reflective case provided under the back surface portion. A lead frame having a plurality of semiconductor light emitting element chips mounted on the lead frame independent of each other by a reflective resin, the lead frame having the semiconductor light emitting element chip having the shortest wavelength mounted thereon is provided at a central position, and the lead Insert mold molding with the opposite side of the frame as the bottom, after cutting the lead frame, bend in the direction of the bottom and bend one again along the bottom, and the cut part of the lead frame is from the light emitting device outer shape of the light source device A light source device in which the lead frame is not mechanically connected to each other and is held by the reflective resin,
An incident end face portion that guides the emitted light to a position facing the light exit portion of the light source device, an exit surface portion that emits light to the outside, a back surface portion on the opposite side, and the exit surface portion and the back surface portion. A light guide plate comprising a side end surface portion to be connected and a non-incident end surface portion located on the opposite side of the incident end surface portion;
A flat illumination device comprising a reflective sheet or a reflective case provided under the back surface portion.

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