JP5229323B2 - 積層コイル部品およびその製造方法 - Google Patents
積層コイル部品およびその製造方法 Download PDFInfo
- Publication number
- JP5229323B2 JP5229323B2 JP2010527735A JP2010527735A JP5229323B2 JP 5229323 B2 JP5229323 B2 JP 5229323B2 JP 2010527735 A JP2010527735 A JP 2010527735A JP 2010527735 A JP2010527735 A JP 2010527735A JP 5229323 B2 JP5229323 B2 JP 5229323B2
- Authority
- JP
- Japan
- Prior art keywords
- magnetic ceramic
- inner conductor
- magnetic
- laminated
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 239000000919 ceramic Substances 0.000 claims description 233
- 239000004020 conductor Substances 0.000 claims description 215
- 239000011148 porous material Substances 0.000 claims description 56
- 238000005245 sintering Methods 0.000 claims description 41
- 238000007747 plating Methods 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 28
- 238000010304 firing Methods 0.000 claims description 27
- 239000000243 solution Substances 0.000 claims description 22
- 239000003929 acidic solution Substances 0.000 claims description 20
- 230000002378 acidificating effect Effects 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000011521 glass Substances 0.000 description 21
- 238000012360 testing method Methods 0.000 description 16
- 238000005452 bending Methods 0.000 description 12
- 238000005259 measurement Methods 0.000 description 11
- 239000000047 product Substances 0.000 description 11
- 239000002002 slurry Substances 0.000 description 11
- ZFZQOKHLXAVJIF-UHFFFAOYSA-N zinc;boric acid;dihydroxy(dioxido)silane Chemical compound [Zn+2].OB(O)O.O[Si](O)([O-])[O-] ZFZQOKHLXAVJIF-UHFFFAOYSA-N 0.000 description 10
- 230000007423 decrease Effects 0.000 description 8
- 229910000859 α-Fe Inorganic materials 0.000 description 8
- 229910006404 SnO 2 Inorganic materials 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000001878 scanning electron micrograph Methods 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- 238000013001 point bending Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000035939 shock Effects 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 239000002003 electrode paste Substances 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000007847 structural defect Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000001238 wet grinding Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 229910002794 Si K Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000000445 field-emission scanning electron microscopy Methods 0.000 description 1
- 238000002847 impedance measurement Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000011268 mixed slurry Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Inorganic materials [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- FAKFSJNVVCGEEI-UHFFFAOYSA-J tin(4+);disulfate Chemical compound [Sn+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O FAKFSJNVVCGEEI-UHFFFAOYSA-J 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/10—Composite arrangements of magnetic circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010527735A JP5229323B2 (ja) | 2008-09-04 | 2009-06-26 | 積層コイル部品およびその製造方法 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008226641 | 2008-09-04 | ||
| JP2008226641 | 2008-09-04 | ||
| PCT/JP2009/061688 WO2010026825A1 (ja) | 2008-09-04 | 2009-06-26 | 積層コイル部品およびその製造方法 |
| JP2010527735A JP5229323B2 (ja) | 2008-09-04 | 2009-06-26 | 積層コイル部品およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2010026825A1 JPWO2010026825A1 (ja) | 2012-02-02 |
| JP5229323B2 true JP5229323B2 (ja) | 2013-07-03 |
Family
ID=41796998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010527735A Active JP5229323B2 (ja) | 2008-09-04 | 2009-06-26 | 積層コイル部品およびその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5229323B2 (ko) |
| KR (1) | KR101215923B1 (ko) |
| CN (1) | CN102132363A (ko) |
| WO (1) | WO2010026825A1 (ko) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5195758B2 (ja) * | 2007-09-14 | 2013-05-15 | 株式会社村田製作所 | 積層コイル部品およびその製造方法 |
| KR101503104B1 (ko) * | 2011-08-01 | 2015-03-16 | 삼성전기주식회사 | 금속 자성 분말, 상기 금속 자성 분말을 포함하는 자성층 재료, 및 자성층 재료를 이용한 자성층을 포함하는 적층형 칩 부품 |
| JP5900373B2 (ja) * | 2013-02-15 | 2016-04-06 | 株式会社村田製作所 | 電子部品 |
| JP6398857B2 (ja) * | 2015-04-27 | 2018-10-03 | 株式会社村田製作所 | 電子部品及びその製造方法 |
| JP7453758B2 (ja) * | 2019-07-31 | 2024-03-21 | 株式会社村田製作所 | コイル部品 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6014416A (ja) * | 1983-07-05 | 1985-01-25 | Tdk Corp | 電子部品の製造方法 |
| JPH0864460A (ja) * | 1994-08-23 | 1996-03-08 | Matsushita Electric Ind Co Ltd | チップ型電子部品およびその製造方法 |
| JPH0883715A (ja) * | 1994-09-09 | 1996-03-26 | Murata Mfg Co Ltd | 積層セラミック電子部品およびその製造方法 |
| JPH10340623A (ja) * | 1997-06-06 | 1998-12-22 | Tdk Corp | 圧入用導体ペースト、それを用いた積層セラミック部品およびその製造方法 |
| JP2000077259A (ja) * | 1998-08-28 | 2000-03-14 | Murata Mfg Co Ltd | 積層型コンデンサ及びその製造方法 |
| JP2005038904A (ja) * | 2003-07-15 | 2005-02-10 | Murata Mfg Co Ltd | 積層セラミック電子部品およびその製造方法 |
| JP2005044819A (ja) * | 2002-06-19 | 2005-02-17 | Murata Mfg Co Ltd | 積層型電子部品の製造方法 |
| WO2009034824A1 (ja) * | 2007-09-14 | 2009-03-19 | Murata Manufacturing Co., Ltd. | 積層コイル部品およびその製造方法 |
-
2009
- 2009-06-26 CN CN2009801334295A patent/CN102132363A/zh active Pending
- 2009-06-26 JP JP2010527735A patent/JP5229323B2/ja active Active
- 2009-06-26 KR KR1020117001083A patent/KR101215923B1/ko active IP Right Grant
- 2009-06-26 WO PCT/JP2009/061688 patent/WO2010026825A1/ja active Application Filing
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6014416A (ja) * | 1983-07-05 | 1985-01-25 | Tdk Corp | 電子部品の製造方法 |
| JPH0864460A (ja) * | 1994-08-23 | 1996-03-08 | Matsushita Electric Ind Co Ltd | チップ型電子部品およびその製造方法 |
| JPH0883715A (ja) * | 1994-09-09 | 1996-03-26 | Murata Mfg Co Ltd | 積層セラミック電子部品およびその製造方法 |
| JPH10340623A (ja) * | 1997-06-06 | 1998-12-22 | Tdk Corp | 圧入用導体ペースト、それを用いた積層セラミック部品およびその製造方法 |
| JP2000077259A (ja) * | 1998-08-28 | 2000-03-14 | Murata Mfg Co Ltd | 積層型コンデンサ及びその製造方法 |
| JP2005044819A (ja) * | 2002-06-19 | 2005-02-17 | Murata Mfg Co Ltd | 積層型電子部品の製造方法 |
| JP2005038904A (ja) * | 2003-07-15 | 2005-02-10 | Murata Mfg Co Ltd | 積層セラミック電子部品およびその製造方法 |
| WO2009034824A1 (ja) * | 2007-09-14 | 2009-03-19 | Murata Manufacturing Co., Ltd. | 積層コイル部品およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010026825A1 (ja) | 2010-03-11 |
| KR20110018448A (ko) | 2011-02-23 |
| JPWO2010026825A1 (ja) | 2012-02-02 |
| CN102132363A (zh) | 2011-07-20 |
| KR101215923B1 (ko) | 2012-12-27 |
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