JP5277874B2 - Opto-electric hybrid board and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optoelectric hybrid substrate which has small optical loss and excellent insulation characteristic of electric wiring, and to provide an electronic device with the optoelectric hybrid substrate. <P>SOLUTION: The optoelectric hybrid substrate 1 includes: a flexible substrate 10 having an optical element mounting part for mounting an optical element 50 on its upper surface side, and having through holes 101 each of which is located at the electrode part of the optical element 50 when the optical element 50 is mounted on the optical element mounting part; projection electrodes each of which is composed of a conductive post 30 which fills the through hole 101 and a projected part 31 connected to the conductive post 30 and provided to project from the upper surface of the substrate 10 and to be used for the electric connection with the optical element 50; an optical waveguide 20 which is provided to the lower surface side of the substrate 10 and has a mirror 23; and a wiring pattern 40 provided between the substrate 10 and the optical waveguide 20, wherein the optical waveguide 20 and the optical element 50 are optically connected, and the wiring pattern 40 is electrically connected with the optical element 50 via the projected electrodes. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to an opto-electric hybrid board and an electronic apparatus.

  In recent years, with the wave of computerization, wideband lines (broadband) capable of exchanging large amounts of information at high speed have been spreading. In addition, as a device for transmitting information to these broadband lines, a transmission device such as a router device or a WDM (Wavelength Division Multiplexing) device is used. In these transmission apparatuses, a large number of signal processing boards in which arithmetic elements such as LSIs and storage elements such as memories are combined are installed, and each line is interconnected.

  Each signal processing board has a circuit in which arithmetic elements, storage elements, etc. are connected by electrical wiring. However, with the increase in the amount of information to be processed in recent years, each board has a very high throughput. It is required to transmit. However, with the speeding up of information transmission, problems such as generation of crosstalk and high-frequency noise, deterioration of electric signals, and mismatch of characteristic impedance are becoming apparent. For this reason, electrical wiring becomes a bottleneck, making it difficult to improve the throughput of the signal processing board.

  On the other hand, an optical communication technique for transferring data using an optical frequency carrier wave has been developed. In recent years, an optical waveguide has been widely used as a means for guiding the optical frequency carrier wave from one point to another point. This optical waveguide has a linear core part and a cylindrical clad part provided so as to cover the periphery thereof. The core part is made of a material that is substantially transparent to light of an optical frequency carrier wave, and the cladding part is made of a material having a refractive index lower than that of the core part.

  In such an optical waveguide, light introduced from one end of the core portion is conveyed to the other end while being reflected at the boundary with the cladding portion. A light emitting element such as a semiconductor laser is disposed on the incident side of the optical waveguide, and a light receiving element such as a photodiode is disposed on the emission side. Light incident from the light emitting element propagates through the optical waveguide, is received by the light receiving element, and performs communication based on the blinking pattern of the received light.

  Recently, there has been a movement to replace electric wiring in a signal processing board with an optical waveguide. By replacing the electrical wiring with an optical waveguide, it is expected that the problem of the electrical wiring as described above will be solved and the signal processing board will be able to further increase the throughput.

  However, electric wiring for supplying electric power is indispensable for driving each element such as a light emitting element and a light receiving element which perform mutual conversion between an optical signal and an electric signal as well as an arithmetic element and a storage element. For this reason, electrical wiring and optical waveguides are mixedly mounted on the signal processing substrate, and development of such a substrate (photoelectric combined substrate) is being promoted.

  For example, in Patent Document 1, an optical transmission IC and an optical reception IC are mounted, and a thin-film optical waveguide for transmitting an optical signal between the optical transmission IC and the optical reception IC is formed. A printed circuit board capable of transmitting an optical signal is described. The printed board is provided with a through-hole penetrating in the thickness direction, and through this through-hole, between the optical transmission IC and the optical waveguide mounted on different surfaces of the printed board, and the light The receiving IC and the optical waveguide are connected to each other.

  In manufacturing such a printed circuit board, first, each IC provided with bumps and other passive components such as integrated circuits, resistors, capacitors, and the like are mounted on the printed circuit board. Next, the printed circuit board described in Patent Document 1 is manufactured by performing solder connection collectively by reflow in this state.

  However, in this method, it is necessary to form bumps on each IC, which leads to a complicated manufacturing process. In addition, there is a concern that the shape and type of ICs that can be mounted are limited due to the necessity of forming bumps. Furthermore, this bump is formed by, for example, fusing a solder ball to the electrode pad of each IC. At this time, the position of the solder ball with respect to the electrode pad tends to shift, so that each IC is fixed to the printed circuit board. In addition, the mutual positional accuracy is lowered, and there is a possibility that the optical loss due to the optical axis shift between the optical waveguide and each IC increases.

JP 2005-294407 A

  An object of the present invention is to provide an opto-electric hybrid board with little optical loss and excellent electrical wiring insulation, and an electronic device including the opto-electric hybrid board.

Such an object is achieved by the present inventions (1) to (12) below.
(1) It has an optical element mounting portion for mounting an optical element on one surface side, and when the optical element is mounted on the optical element mounting portion, a through hole is provided at the position of the electrode portion of the optical element. A flexible substrate having flexibility;
A protruding electrode that fills the through-hole and is provided so as to protrude from the one surface of the flexible substrate and is used for electrical connection with an electrode portion of the optical element;
Provided on the other surface side of the flexible substrate, a linear core part, a cylindrical clad part provided so as to cover the periphery of the core part, and a light beam propagating through the core part is bent. An optical waveguide comprising a mirror;
A conductor pattern provided between the flexible substrate and the optical waveguide;
The optical waveguide is configured such that the core portion is optically connected to the light receiving portion or the light emitting portion of the optical element via the mirror,
The conductor pattern is configured to be electrically connected to the electrode portion of the optical element through the protruding electrode ,
The opto-electric hybrid board according to claim 1, wherein the conductor pattern and the protruding electrode are configured to overlap the core portion in plan view .

(2) The opto-electric hybrid board according to (1) , wherein the optical waveguide has a function as an insulating layer that insulates the conductor pattern.

(3) The flexible substrate includes an optical through hole penetrating the flexible substrate, and the optical through hole is on an optical path between the mirror and the light receiving unit or the light emitting unit of the optical element. The opto-electric hybrid board according to (1) or (2) , which is located in

(4) The opto-electric hybrid board according to the above (3) , wherein the optical through hole is light transmissive and is filled with a filler having a higher refractive index than the flexible substrate.

(5) The protruding electrode has a conductor post provided in the through hole and a protruding portion provided at an end of the conductor post,
The opto-electric hybrid board according to any one of (1) to (4) , wherein a surface of the protrusion is covered with a nickel coating layer and a gold coating layer.

(6) The photoelectric hybrid substrate according to any one of (1) to (5) , wherein a protruding height of the protruding electrode from one surface of the flexible substrate is 5 to 30 μm.

(7) The opto-electric hybrid board according to any one of (1) to (6) , wherein the flexible substrate has an average thickness of 7 to 50 μm.

(8) The opto-electric hybrid board according to any one of the above (1) to (7) , wherein the flexible substrate is composed of a polyimide resin as a main material.

(9) An optical element is mounted on the optical element mounting portion,
The opto-electric hybrid board according to any one of (1) to (8) , wherein an electrode portion of the mounted optical element and the protruding electrode are electrically connected.

(10) The flexible substrate has a region in which the optical waveguide is not provided, and a rigid substrate having rigidity is laminated in the region, in any one of (1) to (9) The opto-electric hybrid board described.

(11) The conductor pattern extends to the region, and an electric element is mounted on the region.
The opto-electric hybrid board according to any one of (1) to (10) , wherein the protruding electrode and the electric element are electrically connected via the extended conductor pattern.

(12) An electronic apparatus comprising the opto-electric hybrid board according to any one of (1) to (11) .

  According to the present invention, the optical waveguide and the optical element can be arranged through a very thin flexible substrate, so that the optical path length between them can be shortened. Light loss can be suppressed.

  Further, since the conductor pattern is disposed between the flexible substrate and the optical waveguide, the optical waveguide can function as an insulating film of the conductor pattern, and the insulation of the conductor pattern is improved.

  Furthermore, since the optical element mounting portion for mounting the optical element on the flexible substrate is constituted by the protruding electrode formed on the flexible substrate side, the positional accuracy of the optical element with respect to the flexible substrate is improved. Can be increased. Thereby, the optical axis alignment between the optical waveguide and the optical element is facilitated, and optical loss during this period can be suppressed.

  The opto-electric hybrid board and electronic apparatus of the present invention will be described below in detail based on preferred embodiments shown in the accompanying drawings.

<Opto-electric hybrid board>
FIG. 1 is a longitudinal sectional view showing an embodiment of the opto-electric hybrid board according to the present invention. In the following description, the upper side in FIG. 1 is referred to as “upper” and the lower side is referred to as “lower”.

  An opto-electric hybrid board 1 shown in FIG. 1 is divided into a rigid part 11 having rigidity and a flexible part 12 having flexibility, and has a flexible (flexible) board 10 as a member common to these parts. .

  The rigid portion 11 is configured by a laminate in which the flexible substrate 10 described above and two rigid (rigid) substrates 111 and 112 are stacked on the lower surface side thereof. Thereby, in the rigid part 11, the flexible board | substrate 10 will be reinforced with each rigid board | substrate 111,112, and sufficient rigidity is ensured.

  On the other hand, the flexible part 12 is comprised by the laminated body which laminated | stacked the flexible substrate 10 mentioned above and the optical waveguide 20 which has flexibility on the lower surface side. Thereby, in the flexible part 12, sufficient flexibility is ensured. The optical waveguide 20 is formed with a mirror 23 that crosses the middle at an angle of 45 °. This mirror 23 converts the direction of the optical path passing through the core portion of the optical waveguide 20 to a right angle upward. It carries out optical path conversion or optical path conversion that converts the optical path to a right angle so that light incident from above (side) the optical waveguide 20 is reflected toward the core.

  Further, an optical element 50 is provided on the upper surface of the flexible substrate 10 of the flexible part 12, and the optical path directed upward is guided to the light receiving part or the light emitting part of the optical element 50. That is, the optical waveguide 20 and the light receiving portion or the light emitting portion of the optical element 50 are optically connected via the mirror 23. In the flexible substrate 10, an optical through hole 13 that penetrates the flexible substrate 10 is formed in a portion through which the optical path between the optical element 50 and the mirror 23 passes. Since the optical through hole 13 is formed, it is not necessary for the flexible substrate 10 to have optical transparency, so that the range of selection of the constituent material of the flexible substrate 10 can be widened. In other words, when the flexible substrate 10 is light transmissive, the light through hole 13 can be omitted.

  The flexible substrate 10, the rigid substrate 111, and the rigid substrate 112 are each formed with a plurality of through holes 101, and each through hole 101 is filled with a conductor post 30 made of a conductive material. Yes.

  A wiring pattern (conductor pattern) 40 is disposed between the substrates 10, 111, and 112 and between the lower surfaces of the substrates. The wiring pattern 40 connects the conductor posts 30, thereby constructing an electric circuit in the opto-electric hybrid board 1.

  Furthermore, each conductor post 30 is provided such that its upper end protrudes from the upper surface of the flexible substrate 10. As will be described in detail later, this protruding portion is a protruding portion 31 that is responsible for electrical connection with the optical element 50 and the electric element 60 mounted on the opto-electric hybrid board 1. For example, among these protrusions 31, protrusions 31 for connection to the optical element 50 are disposed above the mirror 23, and the upper surface of these protrusions 31 serves as an optical element mounting part.

  Such an opto-electric hybrid board 1 has an optical circuit composed of the conductor posts 30 and the wiring pattern 40 and the optical waveguide 20 mixed therein, and an electrical signal in the electrical circuit, an optical signal in the optical waveguide 20, These signals can be transmitted and processed by the optical element 50 and the electric element 60 mounted on the opto-electric hybrid board 1.

Hereinafter, each part of the opto-electric hybrid board 1 will be described in detail.
The flexible substrate 10 is a substrate made of a material having flexibility and insulating properties. Examples of such materials include various resin materials such as polyimide resins, epoxy resins, and polyester resins such as polyethylene terephthalate resins. Among them, materials mainly composed of polyimide resins are preferably used. The polyimide resin is particularly suitable as a constituent material of the flexible substrate 10 because it has high heat resistance and excellent flexibility.

  Moreover, as the flexible substrate 10, a substrate (a copper-clad film or the like) in which a conductive film is previously formed on one surface is preferably used. In this case, the wiring pattern 40 described later can be easily formed by patterning the conductive film into a desired shape by a photolithography method and an etching method.

  In addition, the average thickness of the flexible substrate 10 is preferably about 7 to 50 μm, more preferably about 10 to 40 μm, from the viewpoint of flexibility and thinning of the opto-electric hybrid board 1. The flexible substrate 10 having such a thickness has sufficient flexibility and prevents unintentional deformation due to its own weight or the weight of various elements to be mounted. Further, the opto-electric hybrid board 1 can be reduced in thickness, and the distance between the mirror 23 and the optical element 50 can be sufficiently shortened. As a result, for example, light that has been propagated through the optical waveguide 20 and then reflected upward by the mirror 23 can reach the optical element 50 before widely diverging, so that optical loss in optical communication can be suppressed. It is possible to increase the S / N ratio of optical communication. Further, when the optical element 50 is a light emitting element, it can reach the mirror 23 before the emitted light is diffused, so that the S / N ratio of the optical communication can be similarly increased.

  In addition, the optical through hole 13 formed in the flexible substrate 10 may be filled with a light-transmitting filler as necessary. In this case, the filler preferably has a refractive index higher than that of the flexible substrate 10. By using such a filler, leakage of light from the light through hole 13 to the flexible substrate 10 side can be suppressed. That is, since the optical through hole 13 has the same structure as the optical waveguide, loss of light passing through the optical through hole 13 can be suppressed.

  The filler may also be filled in a space located above the optical through hole 13, that is, a space between the optical element 50 and the optical through hole 13. Thereby, the certainty of the optical communication between the mirror 23 and the optical element 50 can be further improved.

  The main material of such a filler is appropriately selected according to the constituent material of the flexible substrate 10, but for example, various acrylic resins, various polycarbonate resins, various epoxy resins, various silicone resins, various norbornenes. Based resins and the like.

  Examples of the optical element 50 include a light emitting element such as a surface emitting laser (VCSEL), a light receiving element such as a photodiode (PD, APD), and the like.

  The rigid substrate 111 and the rigid substrate 112 are substrates each made of a material having rigidity and insulating properties. Examples of such materials include base materials such as paper, glass cloth, and resin films, and resins such as phenol resins, polyester resins, epoxy resins, cyanate resins, polyimide resins, and fluorine resins. What impregnated the material is mentioned.

  The average thickness of each of the rigid substrates 111 and 112 is not particularly limited, but is preferably about 50 μm to 3 mm, more preferably about 100 μm to 2.5 mm, from the viewpoint of reducing the thickness of the opto-electric hybrid substrate 1.

  In addition, each through-hole 101 and the optical through-hole 13 can be easily formed in each board | substrate 10, 111, 112 using a laser processing etc., respectively.

  The optical waveguide 20 has a linear core portion 21 and a cylindrical clad portion 22 provided so as to cover the periphery of the core portion 21, and the light incident on one end of the core portion 21 is cored. It can be totally reflected at the interface between the part 21 and the clad part 22 and propagate to the other end.

  The cross-sectional shape of the optical waveguide 20 is preferably a square such as a square or a rectangle (rectangle). Although the width and height of the core part 21 are not specifically limited, It is preferable that it is about 1-200 micrometers, It is more preferable that it is about 5-100 micrometers, It is further more preferable that it is about 10-60 micrometers.

  The core portion 21 and the clad portion 22 have different light refractive indexes, and the difference in refractive index is preferably 0.5% or more, and more preferably 0.8% or more. On the other hand, the upper limit value may not be set, but is preferably about 5.5%. If the difference in refractive index is less than the lower limit, the effect of transmitting light may be reduced, and even if the upper limit is exceeded, no further increase in light transmission efficiency can be expected.

The difference in refractive index is expressed by the following equation when the refractive index of the core portion 21 is A and the refractive index of the cladding portion 22 is B.
Refractive index difference (%) = | A / B-1 | × 100

  Each constituent material of the core part 21 and the clad part 22 is not particularly limited as long as the above-described refractive index difference is generated. Specifically, acrylic resin, methacrylic resin, polycarbonate, polystyrene, epoxy resin, Various resin materials such as polyamide, polyimide, polybenzoxazole, polysilane, polysilazane, and cyclic olefin resins such as benzocyclobutene resin and norbornene resin, and glass materials such as quartz glass and borosilicate glass Can be used.

  The mirror 23 provided in the optical waveguide 20 is formed by performing laser processing, grinding processing, or the like on the optical waveguide 20. A reflective film may be formed on the surface of the mirror 23 (mirror surface) as necessary. As the reflective film, a metal film such as Au, Ag, or Al is preferably used.

  Such an optical waveguide 20 may be formed by depositing the above material on the lower surface of the flexible substrate 10, or may be bonded to the lower surface of the flexible substrate 10 after the optical waveguide 20 is formed in advance. .

  In addition, it is preferable that the average thickness of the optical waveguide 20 is about 15-200 micrometers, and it is more preferable that it is about 30-100 micrometers. If the thickness of the optical waveguide 20 is within the above range, as will be described in detail later, the insulating property of the optical waveguide 20 is sufficiently high. That is, the optical waveguide 20 functions sufficiently as an insulating layer that can reliably insulate the wiring pattern 40.

  Moreover, it is preferable that the average thickness of the core part 21 is about 5-100 micrometers, and it is more preferable that it is about 25-80 micrometers.

  On the other hand, the average thickness of the cladding portion 22 is preferably about 3 to 50 μm, and more preferably about 5 to 30 μm.

  Each conductor post 30 is made of, for example, a conductive material that is a combination of one or more selected from the group consisting of Sn, Pb, Ag, Zn, Bi, Sb, and Cu. Examples of combinations of two or more include Sn—Pb (solder), Sn—Ag, Sn—Zn, Sn—Bi, Sn—Sb, Sn—Ag—Bi, Sn—Cu, etc. Is mentioned.

  Examples of a method for forming the conductor post 30 include a method of applying a conductive paste, a plating method, and the like.

  The protrusion 31 provided on the upper end portion of each conductor post 30 is composed of a metal film or the like formed on the upper end surface of each conductor post 30. Such a protrusion 31 is provided at the upper end of each conductor post 30.

  Examples of the conductive material that forms the protrusion 31 include Ni, Al, Au, Pt, and the like in addition to the metal materials described above. Moreover, as a preferable combination of the conductive materials constituting the protruding portion 31, there is a laminated film formed by sequentially forming a Ni layer and an Au layer from the conductor post 30 side. In such a laminated film, the Ni layer can improve the adhesion between the conductor post 30 and the Au layer, and the Au layer having high chemical stability prevents the conductor post 30 from being oxidized or deteriorated. Is possible.

  Moreover, it is preferable that the protrusion height from the upper surface of the flexible substrate 10 of the protrusion part 31 is about 5-30 micrometers, and it is more preferable that it is about 10-25 micrometers. By setting the protruding height of the protruding portion 31 within the above range, the protruding portion 31 can be selectively and reliably brought into contact with the electrode pad of the optical element 50, and a reliable electrical connection is possible. Further, it is possible to prevent the distance between the optical element 50 and the mirror 23 from becoming unnecessarily long. For example, after propagating through the optical waveguide 20, the light reflected upward by the mirror 23 is diffused before being widely diffused. 50, the optical loss in optical communication can be suppressed, and the S / N ratio of optical communication can be increased. Further, when the optical element 50 is a light emitting element, it can reach the mirror 23 before the emitted light is diffused, so that the S / N ratio of the optical communication can be similarly increased.

  In addition, although the protrusion part 31 may be comprised with the metal material which the whole (the whole part which protrudes from the upper surface of the flexible substrate 10) mentioned above, an inner part is comprised integrally with the conductor post 30, A configuration in which the above-described coating of the metal material is formed only on the surface may be employed.

  Further, in the present embodiment, the protruding electrode composed of the conductor post 30 and the protruding portion 31 is described. However, the protruding electrode may be formed by integrating two portions.

  Further, as described above, between the respective conductor posts 30, the wiring disposed between the flexible substrate 10, the rigid substrate 111, and the rigid substrate 112, the lower surface, and between the flexible substrate 10 and the optical waveguide 20. Although connected by the pattern 40, the same material as the conductive material constituting the protrusion 31 can be used for the constituent material of the wiring pattern 40.

  As shown in FIG. 1, in the flexible portion 12, the wiring pattern 40 is disposed between the flexible substrate 10 and the optical waveguide 20. However, as described above, the optical waveguide 20 is made of various resin materials or glass. Since it is made of material, it has high insulation. For this reason, the optical waveguide 20 also functions as an insulating film that ensures the insulation of the wiring pattern 40. In other words, since it is not necessary to provide an insulating film covering the wiring pattern 40, the structure and manufacturing process of the opto-electric hybrid board 1 can be simplified.

  In addition, an electric element 60 is provided on the upper surface of the flexible substrate 10 of the rigid portion 11, and an electric field is provided between the wiring pattern 40 and the electrode pad of the electric element 60 via the conductor post 30 and the protruding portion 31. Connected.

  The electric element 60 may be any electric element such as an LSI, a RAM, a resistor, or a capacitor, but the electric element 60 shown in FIG. 1 includes a driver IC 61, a transimpedance amplifier (TIA), and a limiting amplifier (LA). And a combination IC 62.

  Among these, the driver IC 61 controls the operation of the light emitting element when the optical element 50 is a light emitting element. The combination IC 62 operates to amplify a detection signal from the light receiving element when the optical element 50 is a light receiving element. That is, in the opto-electric hybrid board 1, the optical element 50 and the electric element 60 operate in a coordinated manner so that the mutual conversion between the optical signal and the electric signal is performed reliably, and the signal processing with high speed and low noise is performed. It can be done easily.

  Since each such electric element 60 is connected via the protruding electrodes (conductor post 30 and protruding portion 31) provided on the opto-electric hybrid board 1 side, the positional accuracy with respect to the opto-electric hybrid board 1 is increased. Can do. Thereby, the optical axis alignment between the optical waveguide 20 and the optical element 50 becomes easy, and the optical loss during this can be suppressed.

  In addition, conventionally, since it is necessary to form bumps on each of the optical element and the electric element to be mounted on the opto-electric hybrid board, restrictions have occurred on the shape and type of the element that can be mounted. As described above, the bump electrode is provided instead of the bump on the opto-electric hybrid board 1 side, so that it is not necessary to form the bump on each element. Therefore, elements selected from a wide variety can be mounted on the opto-electric hybrid board 1 regardless of the shape and the like.

  Here, FIG. 2 is a longitudinal sectional view showing another configuration example of the embodiment of the opto-electric hybrid board according to the present invention.

  The opto-electric hybrid board 1 shown in FIG. 2 is the same as the opto-electric hybrid board 1 shown in FIG. 1 except that the positional relationship between the flexible board 10 and the two rigid boards 111 and 112 in the rigid portion 11 is different. .

  Specifically, the opto-electric hybrid board 1 shown in FIG. 2 is laminated in the rigid portion 11 so that the flexible board 10 is sandwiched between the two rigid boards 111 and 112.

  Such an opto-electric hybrid board 1 shown in FIG. 2 also has the same operations and effects as the opto-electric hybrid board 1 shown in FIG.

<Electronic equipment>
An electronic device (an electronic device of the present invention) including the opto-electric hybrid board of the present invention can be applied to any electronic device that performs signal processing of both an optical signal and an electric signal. For example, a router device, a WDM device, etc. Application to electronic devices such as mobile phones, game machines, personal computers, televisions, home servers, etc. is preferable. In any of these electronic devices, it is necessary to transmit a large amount of data at high speed between an arithmetic device such as an LSI and a storage device such as a RAM. Therefore, by providing such an electronic device with the opto-electric hybrid board according to the present invention, problems such as noise and signal deterioration peculiar to the electric wiring are eliminated, and a dramatic improvement in the performance can be expected.

  In addition, the amount of heat generated in the optical waveguide portion is greatly reduced compared to electrical wiring. For this reason, the degree of integration in the substrate can be increased, the power required for cooling can be reduced, and the power consumption of the entire electronic device can be reduced.

  The embodiments of the opto-electric hybrid board and the electronic device according to the present invention have been described above. However, the present invention is not limited to this, and for example, each part constituting the opto-electric hybrid board exhibits the same function. It can be replaced with any configuration obtained. Moreover, arbitrary components may be added.

It is a longitudinal cross-sectional view which shows embodiment of the opto-electric hybrid board | substrate of this invention. It is a longitudinal cross-sectional view which shows the other structural example of embodiment of the opto-electric hybrid board | substrate of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Opto-electric hybrid board 10 Flexible board 11 Rigid part 12 Flexible part 13 Optical through hole 101 Through hole 111, 112 Rigid board 20 Optical waveguide 21 Core part 22 Clad part 23 Mirror 30 Conductor post 31 Projection part 40 Wiring pattern (conductor pattern)
50 Optical element 60 Electric element 61 Driver IC
62 Combination IC

Claims (12)

An optical element mounting portion for mounting an optical element on one surface side, and when the optical element is mounted on the optical element mounting portion, a flexible structure having a through hole at the position of the electrode portion of the optical element A flexible substrate having
A protruding electrode that fills the through-hole and is provided so as to protrude from the one surface of the flexible substrate and is used for electrical connection with an electrode portion of the optical element;
Provided on the other surface side of the flexible substrate, a linear core part, a cylindrical clad part provided so as to cover the periphery of the core part, and a light beam propagating through the core part is bent. An optical waveguide comprising a mirror;
A conductor pattern provided between the flexible substrate and the optical waveguide;
The optical waveguide is configured such that the core portion is optically connected to the light receiving portion or the light emitting portion of the optical element via the mirror,
The conductor pattern is configured to be electrically connected to the electrode portion of the optical element through the protruding electrode ,
The opto-electric hybrid board according to claim 1, wherein the conductor pattern and the protruding electrode are configured to overlap the core portion in plan view . The opto-electric hybrid board according to claim 1 , wherein the optical waveguide has a function as an insulating layer that insulates the conductor pattern. The flexible substrate includes an optical through hole penetrating the flexible substrate, and the optical through hole is located on an optical path between the mirror and the light receiving unit or the light emitting unit of the optical element. The opto-electric hybrid board according to claim 1 or 2 . 4. The opto-electric hybrid board according to claim 3 , wherein the optical through-hole is light transmissive and is filled with a filler having a refractive index higher than that of the flexible substrate. The protruding electrode has a conductor post provided in the through hole and a protrusion provided at an end of the conductor post,
The protrusion has a surface, the opto-electric hybrid board according to any one of claims 1 to 4 are covered with a coating layer and the gold coating layer of nickel. The one projection height from the surface of the flexible substrate, the opto-electric hybrid board according to any one of claims 1, which is 5 to 30 [mu] m 5 of the protruding electrode. Opto-electric hybrid board according to any one of the average thickness of the flexible substrate, claims 1 is 7~50μm 6. The opto-electric hybrid board according to any one of claims 1 to 7 , wherein the flexible board is composed of a polyimide resin as a main material. An optical element is mounted on the optical element mounting portion,
Opto-electric hybrid board according to any one of claims 1 to 8 and the electrode portion of the mounted light element and the protruding electrodes are electrically connected. The flexible substrate has a region where the optical waveguide is not provided, the region, the opto-electric hybrid board according to any one of the rigid substrates claims 1 are stacked 9 having a rigid . The conductor pattern is extended to the region, and an electric element is mounted on the region.
Via said extended conductor pattern, the opto-electric hybrid board according to any one of claims 1 to 10 and the projection electrodes and the electrical device is electrically connected. An electronic apparatus comprising the electro-optic hybrid circuit board according to any one of claims 1 to 11.

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