JP5262455B2 - Exposure apparatus, exposure method, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure device that suppresses occurrence of an exposure defect. <P>SOLUTION: The exposure device includes a first movable member which is movable in a predetermined plane including a first position irradiated with exposure light, while holding a substrate, a measurement system including an encoder head disposed at the first movable member, and measuring position information on the first movable member, and a holding device for holding a scale unit including a scale plate in a releasable state at a position where it can face the encoder unit. The holding device has a support member for supporting the scale unit slidably in a direction substantially parallel with the predetermined plane. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to an exposure apparatus that exposes a substrate, an exposure method, and a device manufacturing method.

In the manufacturing process of micro devices such as semiconductor devices and electronic devices, an exposure apparatus that exposes a substrate with exposure light is used. The exposure apparatus includes a movable member such as a substrate stage that moves while holding the substrate, and exposes the substrate while measuring position information of the movable member with a position measurement system. The following patent document discloses an example of a technique for measuring position information of a movable member using an encoder system having an encoder head that can face a scale plate.
US Patent Application Publication No. 2006/0227309

  In the encoder system, for example, when the surface state of the scale plate deteriorates, there is a possibility that the position information of the movable member cannot be accurately measured. As a result, for example, a defect may occur in a pattern formed on the substrate, which may cause an exposure failure and a defective device.

  An object of an aspect of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, there is provided an exposure apparatus for exposing a substrate with exposure light, the first movable movable while holding the substrate within a predetermined plane including a first position irradiated with the exposure light. A member and an encoder head arranged on the first movable member, a measurement system for measuring position information of the first movable member, and a scale unit including a scale plate are releasably held at a position that can face the encoder head. An exposure apparatus is provided that includes a support member that slidably supports the scale unit in a direction substantially parallel to a predetermined surface.

  According to a second aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the first aspect and developing the exposed substrate.

  According to a third aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light, wherein the movable member is movable while holding the substrate within a predetermined plane including a first position where the exposure light is irradiated. An encoder head of a measurement system for measuring position information is disposed on a movable member, a scale unit including a scale plate is releasably held at a position facing the encoder head, and the scale unit is predetermined. There is provided an exposure method including: sliding in a direction substantially parallel to the surface to replace the scale unit; and performing position control of the movable member based on the measurement result of the measurement system to expose the substrate. The

  According to a fourth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure method of the third aspect and developing the exposed substrate.

  According to the present invention, it is possible to suppress the occurrence of exposure failure and suppress the occurrence of defective devices.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. In addition, the rotation (inclination) directions around the X, Y, and Z axes are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram showing an exposure apparatus EX according to the first embodiment, and FIG. 2 is an enlarged view of a part of FIG. In this embodiment, the exposure apparatus EX includes, for example, US Pat. No. 6,341,007, US Pat. No. 6,400,491, US Pat. No. 6,549,269, US Pat. No. 6,590,634, and US Pat. No. 6,208,407. , U.S. Pat.No. 6,262,796, U.S. Pat.No. 6,674,510, U.S. Pat.No. 6,208,407, U.S. Pat.No. 6,710,849, U.S. Pat. A case where the exposure apparatus is a twin stage type exposure apparatus including a plurality (two) of substrate stages 1 and 2 that can move while holding the substrate P will be described as an example.

  1 and 2, the exposure apparatus EX is independent of the mask stage 3 that can move while holding the mask M, the first substrate stage 1 that can move while holding the substrate P, and the first substrate stage 1. A second substrate stage 2 that is movable while holding the substrate P, a first drive system 41 that moves the mask stage 3, and a second drive system 42 that moves the first and second substrate stages 1 and 2. , An interferometer system 4 including a laser interferometer that measures position information of each stage 1, 2, 3, an encoder system 5 that measures position information of the first substrate stage 1 and the second substrate stage 2, and the substrate P An alignment system 6 for detecting alignment marks, a focus / leveling detection system 7 for detecting positional information on the surface of the substrate P, an illumination system IL for illuminating the mask M with exposure light EL, and an exposure system And it includes a projection optical system PL for projecting a pattern image of the mask M illuminated by the light EL to the substrate P, and a control unit 8 for controlling the operation of the entire exposure apparatus EX.

  Further, the exposure apparatus EX includes, for example, a column 9 disposed on a floor surface FL in a clean room, a body 12 including a support frame 11 disposed on the column 9 via a vibration isolator 10, and a vibration isolating to the column 9. A first base member 14 having a guide surface 14G, which is arranged via the apparatus 13 and movably supports the first substrate stage 1 and the second substrate stage 2, and a column 15 and a vibration isolator 16 on the support frame 11. And a second base member 17 having a guide surface 17G that movably supports the mask stage 3.

  Further, the exposure apparatus EX includes a chamber device 19 that forms an internal space 18 in which at least the projection optical system PL is disposed. The chamber device 19 can adjust the environment (including temperature, humidity, and cleanliness) of the internal space 18. In the present embodiment, at least a part of the illumination system IL, the mask stage 3, the projection optical system PL, and the first and second substrate stages 1 and 2 are arranged in the internal space 18.

  Further, the exposure apparatus EX includes an exposure station ST1 in which an exposure process for the substrate P is executed, and a measurement station ST2 in which a predetermined measurement process for exposure and an exchange process for the substrate P are executed. The illumination system IL, the mask stage 3, and the projection optical system PL are arranged in the exposure station ST1. Projection optical system PL is supported by support frame 11. Of the plurality of optical elements of the projection optical system PL, the first optical element 20 closest to the image plane of the projection optical system PL has an emission surface 21 for emitting the exposure light EL. The irradiation position SP1 to which the exposure light EL emitted from the first optical element 20 is irradiated is arranged at the exposure station ST1. The alignment system 6 and the focus / leveling detection system 7 are arranged in the measurement station ST2. At least a part of the alignment system 6 and at least a part of the focus / leveling detection system 7 are supported by the support frame 11.

  The alignment system 6 detects the alignment mark of the substrate P and measures the position information of the substrate P in the XY plane. The alignment system 6 detects the alignment mark of the substrate P in order to detect the position information of the shot area of the substrate P. The alignment system 6 includes a plurality of optical elements including the second optical element 22 that can face the substrate P, and detects an alignment mark on the substrate P using these optical elements. The first and second substrate stages 1 and 2 can move to a measurement position SP <b> 2 that holds the substrate P and faces the second optical element 22. The alignment system 6 uses the second optical element 22 to acquire the position information of the shot area of the substrate P, or the alignment mark of the substrate P placed at the measurement position SP2 or the first and second substrate stages 1. 2 is detected.

  The focus / leveling detection system 7 detects position information (position information regarding the Z-axis, θX, and θY directions) of the surface of the substrate P held by the first and second substrate stages 1 and 2. The focus / leveling detection system 7 includes a projection device 7A, which is disposed at the measurement position SP2 and can irradiate detection light from an oblique direction onto the surface of the substrate P held by the first and second substrate stages 1 and 2, and the substrate. And a light receiving device 7B capable of receiving the detection light irradiated on the surface of P and reflected on the surface of the substrate P. The focus / leveling detection system 7 can detect not only the position information of the surface of the substrate P but also the position information of the upper surfaces of the first and second substrate stages 1 and 2. The measurement position SP2 for measuring the position information of the substrate P by the alignment system 6 and the focus / leveling detection system 7 is arranged in the measurement station ST2.

  Each of the first and second substrate stages 1 and 2 includes a first area of the exposure station ST1 including the irradiation position SP1 and a guide surface including the second area of the measurement station ST2 different from the first area, including the measurement position SP2. The predetermined area of 14G can be moved while holding the substrate P. In the present embodiment, the guide surface 14G is substantially parallel to the XY plane. Each of the first and second substrate stages 1 and 2 is movable in the guide surface 14G between the exposure station ST1 and the measurement station ST2.

  In the present embodiment, the first and second substrate stages 1 and 2 are operated on the first base member 14 by the operation of the second drive system 42 including a planar motor, for example, the X axis, the Y axis, the Z axis, and θX. , ΘY, and θZ directions. A planar motor for moving the first and second substrate stages 1 and 2 is, for example, a magnet disposed on the first and second substrate stages 1 and 2 as disclosed in US Pat. No. 6,452,292. An array and a coil array disposed on the first base member 14.

  The encoder system 5 measures position information of the first and second substrate stages 1 and 2 (substrate P) in the XY plane. The encoder system 5 includes an encoder head 51 disposed on the first substrate stage 1, an encoder head 52 disposed on the second substrate stage 2, and at least part of the periphery of the optical path of the exposure light EL. And a scale unit 50 including 53.

The scale unit 50 includes a scale plate 53 and a holding member 54 that can hold the scale plate 53. The scale plate 53 is formed of the same material such as ceramics or low expansion glass. The scale plate 53 includes a reflective diffraction grating. The diffraction grating includes a two-dimensional grating that is periodic in the X-axis direction and the Y-axis direction. The holding member 54 is a plate-like member that is thicker than the thickness of the scale plate 53. The holding member 54 is made of a material having a low coefficient of thermal expansion. The holding member 54 is made of, for example, optical glass or ceramics (Shot Corporation's Zerodur (trade name), Al ₂ O _3, TiC, or the like). The holding member 54 may be made of metal. The holding member 54 has a holding surface that faces one surface (upper surface) of the scale plate 53. The diffraction grating is disposed on the other surface (lower surface) of the scale plate 53.

  In addition, the exposure apparatus EX includes a holding device 60 that holds the scale unit 50 in a releasable manner at a position that can face the encoder heads 51 and 52. The holding device 60 holds the scale unit 50 so that the lower surface of the scale plate 53 faces the encoder heads 51 and 52. The holding device 60 holds the scale unit 50 so that the lower surface of the scale plate 53 that can face the encoder heads 51 and 52 is substantially parallel to the XY plane.

  In the present embodiment, the holding device 60 includes a support member 61 that supports the scale unit 50 so as to be slidable in a direction substantially parallel to the XY plane. In the present embodiment, the support member 61 is disposed on the support frame 11. In the present embodiment, the holding device 60 has a plurality of support members 61. The encoder system 5 has a plurality of scale units 50. The plurality of scale units 50 are supported by each of the support members 61.

  In the present embodiment, the support member 61 is disposed on at least a part of the periphery of the projection optical system PL (first optical element 20). Therefore, the scale unit 50 is also disposed at least partly around the first optical element 20 (the optical path of the exposure light EL).

  The support member 61 is disposed in each of the exposure station ST1 and the measurement station ST2. Therefore, the scale unit 50 (scale plate 53) is also disposed in each of the exposure station ST1 and the measurement station ST2. The encoder heads 51 and 52 of the first and second substrate stages 1 and 2 arranged in the exposure station ST1 can face the lower surface of the scale plate 53 arranged in the exposure station ST1. Similarly, the encoder heads 51 and 52 of the first and second substrate stages 1 and 2 disposed in the measurement station ST2 can face the lower surface of the scale plate 53 disposed in the measurement station ST2. An example of an encoder system including an encoder head and a scale plate (grid plate) arranged on a substrate stage is disclosed in US Patent Application Publication No. 2006/0227309.

  In the present embodiment, the encoder system 5 can measure the positional information regarding the Z-axis direction of the lower surface of the scale plate 53 facing the encoder heads 51 and 52 based on the measurement values of the encoder heads 51 and 52. The encoder heads 51 and 52 of this embodiment irradiate the scale plate 53 with measurement light and receive the measurement light from the scale plate 53, whereby the lower surface of the scale plate 53 in the Z-axis direction and the encoder head 51, 52 can be measured. The control device 8 can derive position information regarding the Z-axis direction of the first and second substrate stages 1 and 2 with respect to the scale plate 53 based on the measurement values of the encoder heads 51 and 52.

  A plurality of encoder heads 51 are arranged around the substrate P held by the first substrate stage 1. Similarly, a plurality of encoder heads 52 are arranged around the substrate P held by the second substrate stage 2.

  The encoder system 5 can measure the position information of the first substrate stage 1 in the XY plane by the encoder head 51 and a scale plate (grid plate) 53 including a two-dimensional lattice. The encoder system 5 performs the measurement operation with the plurality of encoder heads 51 and the scale plate 53 facing each other, and based on the measurement results of the plurality of encoder heads 51, the X-axis and Y-axis of the first substrate stage 1. It is possible to measure position information regarding the three directions of the axis and the θZ direction. Similarly, the encoder system 5 can measure the position information of the second substrate stage 2 in the XY plane with the encoder head 52 and a scale plate (grid plate) 53 including a two-dimensional lattice. The encoder system 5 performs the measurement operation with the plurality of encoder heads 52 and the scale plate 53 facing each other, and based on the measurement results of the plurality of encoder heads 52, the X-axis, Y-axis of the second substrate stage 2. It is possible to measure position information regarding the three directions of the axis and the θZ direction.

  Further, the exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes the substrate P with the exposure light EL through the liquid LQ. The exposure apparatus EX includes a liquid immersion member 23 that can form an immersion space so that the optical path of the exposure light EL emitted from the first optical element 20 is filled with the liquid LQ. The immersion space is a space filled with the liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ. In the present embodiment, the liquid immersion member 23 includes a seal member as disclosed in, for example, US Patent Application Publication No. 2004/0165159.

  The liquid immersion member 23 holds the liquid LQ with the surface of the object disposed at the irradiation position SP1, thereby exposing the exposure light EL between the first optical element 20 and the object disposed at the irradiation position SP1. The liquid immersion space is formed so that the optical path of the liquid is filled with the liquid LQ. The object arranged at the irradiation position SP1 includes the first and second substrate stages 1 and 2 and the substrate P held by the first and second substrate stages 1 and 2. At least during exposure of the substrate P, the liquid immersion member 23 forms an immersion space so that a partial region (local region) on the surface of the substrate P including the projection region PR of the projection optical system PL is covered with the liquid LQ. Form. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The exposure apparatus EX moves the substrate P in the Y axis direction with respect to the projection area PR of the projection optical system PL, and in the illumination area IR of the illumination system IL in synchronization with the movement of the substrate P in the Y axis direction. On the other hand, the substrate P is exposed with the exposure light EL through the projection optical system PL and the liquid LQ while moving the mask M in the Y-axis direction. As a result, an image of the pattern of the mask M is projected onto the substrate P.

The illumination system IL illuminates a predetermined illumination region IR with exposure light EL having a uniform illuminance distribution. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

  The mask stage 3 is movable in the guide surface 17G of the second base member 17 including the illumination region IR while holding the mask M. The guide surface 17G is substantially parallel to the XY plane. In the present embodiment, the mask stage 3 is movable in three directions of the X axis, the Y axis, and the θZ direction by the operation of the first drive system 41 including a planar motor. The planar motor for moving the mask stage 3 includes a magnet array disposed on the mask stage 3 and a coil array disposed on the second base member 17.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection region PR includes the irradiation position SP1. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. A plurality of optical elements of the projection optical system PL are held by the lens barrel 24. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The position information of the mask stage 3 (mask M) is measured by the laser interferometer 25 of the interferometer system 4. The laser interferometer 25 measures position information using a reflection mirror provided on the mask stage 3. The control device 8 operates the first drive system 41 based on the measurement result of the laser interferometer 25, and executes position control of the mask stage 3 (mask M). In addition, the position information of the first and second substrate stages 1 and 2 (substrate P) in the X axis, Y axis, and θZ directions is measured by the encoder system 5, and the position information of the substrate P in the Z axis, θX, and θY directions is measured. The surface position information is detected by a focus / leveling detection system 7. The control device 8 operates the second drive system 42 based on the measurement result of the encoder system 5 and the detection result of the focus / leveling detection system 7, and positions of the first and second substrate stages 1 and 2 (substrate P). Execute control.

  FIG. 3 is a plan view showing the first substrate stage 1 holding the substrate P. FIG. As shown in FIG. 3, a plurality of encoder heads 51 are arranged around the substrate P held by the first substrate stage 1. Further, the first substrate stage 1 includes a measuring unit 26 that can measure the exposure light EL emitted from the first optical element 20. At least a part of the measurement unit 26 is disposed on the upper surface of the first substrate stage 1 that can face the emission surface 21 of the first optical element 20. The measurement unit 26 includes an aerial image measurement sensor and can measure an aerial image of the projection optical system PL. The measurement unit 26 includes, for example, a transmission unit 27 that can pass the exposure light EL disposed on at least a part of the upper surface of the first substrate stage 1, and an optical sensor that can receive the exposure light EL through the transmission unit 27. including. The measurement unit 26 can measure a spatial image of the projection optical system PL and obtain position information of the irradiation position SP1 of the exposure light EL emitted from the first optical element 20 (projection position of the projection optical system PL). . The measuring unit 26 includes a reference mark 28 detected by the alignment system 6 and a reference surface 29 detected by the focus / leveling detection system 7. The second substrate stage 2 has the same configuration as the first substrate stage 1. That is, a plurality of encoder heads 52 are arranged on the second substrate stage 2. Further, the second substrate stage 2 has a measurement unit 36 having the same configuration as the measurement unit 26 of the first substrate stage 1. The measurement unit 36 includes a transmission unit 37, a reference mark 38, and a reference surface 39. As shown in FIG. 3, a plurality of shot regions S are arranged in a matrix on the substrate P.

  Next, the scale unit 50 and the holding device 60 will be described. 4 is a perspective view of the scale unit 50 viewed from the −Z side, FIG. 5 is a perspective view of the holding device 60 viewed from the −Z side, and FIG. 6 is a scale unit 50 held by the holding device 60. It is the perspective view which looked at from the -Z side.

  As shown in FIG. 4, the scale unit 50 includes a scale plate 53 and a holding member 54 that can hold the scale plate 53. The holding member 54 has a holding surface 55 that can face the upper surface of the scale plate 53. In the present embodiment, the holding member 54 holds the scale plate 53 so that it can be released. In the present embodiment, the holding member 54 includes a leaf spring member 56 that can sandwich the scale plate 53 with the holding surface 55. In the present embodiment, the holding member 54 holds the scale plate 53 by sandwiching the scale plate 53 with the holding surface 55 using the leaf spring member 56. In addition, the scale plate 53 is released from the holding member 54 by releasing the holding by the leaf spring member 56.

  In the present embodiment, the scale unit 50 includes an identifier 57 that holds unique information of the scale plate 53. In the present embodiment, the identifier 57 is disposed on the holding member 54. The identifier 57 may be disposed on the scale plate 53.

  In the present embodiment, the scale unit 50 includes a reflective surface 58 that can reflect the measurement light from the encoder heads 51 and 52 on the surface facing the encoder heads 51 and 52. In the present embodiment, the reflection surface 58 is disposed on the holding member 54.

  The holding device 60 includes a support member 61 that slidably supports the scale unit 50 in a direction substantially parallel to the XY plane. In the following description using FIGS. 5 and 6, the case where the support member 61 supports the scale unit 50 so as to be slidable in the X-axis direction will be described as an example. it can.

  In FIGS. 5 and 6, the support member 61 is disposed on the guide surface 62 that guides the flange 54 </ b> F of the holding member 54 in the X-axis direction, the holding surface 63 that can face the upper surface 59 of the holding member 54, and the holding surface 63. A suction portion 64. The flange 54F is formed on each side surface of the holding member 54 on the + Y side and the −Y side so as to extend in the X-axis direction. The guide portion 62 is disposed so as to extend in the X-axis direction on each of the + Y side and the −Y side of the holding surface 63 so as to correspond to the flange 54F.

  The suction part 64 includes a suction port connected to the vacuum system 65. The adsorbing part 64 can adsorb the upper surface 59 of the holding member 54 disposed at a position facing the holding surface 63. The operation of the vacuum system 65 is controlled by the control device 8. The control device 8 operates the vacuum system 65 in a state where the holding surface 63 and the upper surface 59 are opposed to each other, and performs an adsorption operation (suction operation) by the adsorption unit 64, whereby the upper surface 59 of the holding member 54. Can be held by the holding surface 63. Moreover, the scale unit 50 can be released from the holding device 60 by releasing the suction operation by the suction unit 64.

  In the present embodiment, the entering operation of the scale unit 50 with respect to the support member 61 and the retracting operation of the scale unit 50 from the support member 61 are executed at the end portion 61T on the + X side (one side) with respect to the holding surface 63. .

  The holding device 60 includes a positioning mechanism 66 that positions the scale unit 50. The positioning mechanism 66 includes a convex portion 66 </ b> T that is disposed on the −X side (the other side) with respect to the holding surface 63 and protrudes to the −Z side from the holding surface 63. In the present embodiment, the flange 54F of the scale unit 50 enters the guide portion 62 from the end portion 61T of the support member 61 on the + X side with respect to the holding surface 63. The scale unit 50 in which the flange 54F has entered the guide portion 62 slides in the −X direction with respect to the support member 61 until the upper surface 59 of the holding member 54 and the holding surface 63 face each other while being guided by the guide portion 62. To move. In the present embodiment, the scale unit 50 is positioned with respect to the holding device 60 by the contact between the end of the holding member 54 on the −X side and the convex portion 66T. Then, when the holding member 54 and the convex portion 66T are in contact with each other and the upper surface 59 of the holding member 54 and the holding surface 63 face each other, the suction operation by the suction portion 64 is executed, whereby the scale unit 50 is held by the holding device. 60.

  In addition, the scale unit 50 slides in the + X direction with respect to the support member 61 from the state facing the holding surface 63 in order to release from the holding device 60 after the suction operation by the suction unit 64 is released. Moving. Due to the movement of the scale unit 50 in the + X direction, the flange 54F is separated from the guide portion 62 from the end portion 61T of the support member 61. As a result, the scale unit 50 is released from the holding device 60.

  In the present embodiment, the scale unit 50 includes a temperature adjusting device 67 that adjusts the temperature of the scale plate 53. In the present embodiment, at least a part of the temperature adjustment device 67 is provided on the holding member 54.

  As shown in FIG. 6, in the present embodiment, the temperature adjustment device 67 includes an internal flow path 68 that is formed inside the holding member 54 and through which the temperature adjustment liquid flows. The holding member 54 has an inlet 69 for introducing a liquid into the internal flow path 68 and an outlet 70 for the liquid flowing through the internal flow path 68 to exit. The inlet 69 and the outlet 70 are disposed on the side surface of the holding member 54. The inlet 69 is connected to the liquid supply device 73 via the connector 71 provided on the tube 71 and the support frame 11. The liquid supply device 73 can supply a temperature-adjusted liquid. The outlet 70 is connected to a liquid recovery device 76 via a connector 74 provided on the tube 74 and the support frame 11. The liquid recovery apparatus 76 includes, for example, a vacuum system and can recover the liquid. The liquid supply device 73 supplies the temperature adjusting liquid to the internal flow path 68 via the connector 72 and the tube 71. The liquid supplied to the internal flow path 68 flows out of the outlet 70 after flowing through the internal flow path 68. The liquid recovery device 76 recovers the liquid that has flowed through the internal flow path 68 via the tube 74 and the connector 75. When the liquid supplied from the liquid supply device 73 flows through the internal flow path 68, the temperature of the scale plate 53 held by the holding member 54 is adjusted. The temperature of the scale plate 53 can also be adjusted by supplying a temperature-adjusted gas to the internal flow path 68.

  In the present embodiment, the inlet 69 and the outlet 70 are disposed in the vicinity of the + X side end portion 54 </ b> T of the holding member 54. The connectors 72 and 75 are disposed in the vicinity of the + X side end 61T of the support member 61.

  FIG. 7 is a plan view of the lower surface of the support frame 11 as viewed from the −Z side. As shown in FIG. 7, a plurality of support members 61 and scale units 50 are arranged on the lower surface of the support frame 11. Further, the support member 61 and the scale unit 50 are disposed in each of the exposure station ST1 and the measurement station ST2. In the example shown in FIG. 7, the holding device 60 can slide the scale units 50 </ b> A, 50 </ b> B, 50 </ b> C, and 50 </ b> D to be slidable in the X-axis direction and the scale units 50 </ b> E and 50 </ b> F in the Y-axis direction. And a plurality of support members 61 to be supported. In the present embodiment, a part of the scale unit 50C is disposed in the exposure station ST1, and a part is disposed in the measurement station ST2. In other words, the scale unit 50C is arranged so as to cover a part of the exposure station ST1 and a part of the measurement station ST2. Similarly, the scale unit 50D is arranged so as to cover a part of the exposure station ST1 and a part of the measurement station ST2.

  In the present embodiment, each of the scale units 50 is slidable relative to the support member 61 so as to move between the internal space 18 and the external space 33 of the chamber device 19. In the vicinity of each support member 61, an opening 31 formed in the chamber device 19 and an opening / closing mechanism 32 for opening and closing the opening 31 are arranged. Each of the scale units 50 can move between the internal space 18 and the external space 33 through the opening 31.

  In the present embodiment, each of the support members 61 is disposed on the support frame 11 so that the end portion 61T and the opening 31 face each other. Therefore, the scale unit 50 moved from the external space 33 to the internal space 18 can smoothly enter the support member 61. The scale unit 50 retracted from the support member 61 can smoothly move to the external space 33.

  Next, an example of the operation of the exposure apparatus EX having the above-described configuration will be described with reference to the flowchart of FIG.

  In the present embodiment, for example, when the first substrate stage 1 is disposed at the exposure station ST1, the second substrate stage 2 is disposed at the measurement station ST2. For example, when the exposure processing of the substrate P held on the first substrate stage 1 existing in the exposure station ST1 is being executed, the substrate P before exposure held on the second substrate stage 2 existing in the measurement station ST2 is executed. Position information measurement processing is executed. The position information of the substrate P includes alignment information of the substrate P with respect to a detection reference (reference position) of the alignment system 6 (position information of each shot area S of the substrate P in the X axis, Y axis, and θZ directions), and a predetermined reference. It includes at least one of position information of the surface of the substrate P with respect to the surface (position information in the Z-axis, θX, and θY directions).

  The control device 8 starts replacement of the substrate P and predetermined measurement processing at the measurement station ST2. For example, the control device 8 arranges the second substrate stage 2 at the substrate exchange position of the measurement station ST2, and loads the substrate P before exposure onto the second substrate stage 2 using a transfer system (not shown). And the control apparatus 8 starts the measurement process of the positional information on the board | substrate P in measurement station ST2. On the other hand, the first substrate stage 1 is arranged at the exposure station ST1, and the exposure processing of the substrate P after the measurement processing at the measurement station ST2 is started.

  In the present embodiment, the measurement processing of the position information of the substrate P in the measurement station ST <b> 2 includes a detection operation using the alignment system 6 and the focus / leveling detection system 7. The control device 8 moves the second substrate stage 2 in the XY directions at the measurement station ST <b> 2 and arranges the measurement unit 36 of the second substrate stage 2 in the detection region of the alignment system 6. The control device 8 measures the position information of the second substrate stage 2 in the XY plane using the encoder system 5 (encoder head 52), and uses the alignment system 6 to measure the reference mark 38 of the measuring unit 36. Is detected (step SA1). The control device 8 derives position information of the reference mark 92 in the XY plane of the coordinate system defined by the encoder system 5 based on the measurement result of the encoder system 5 and the detection result of the alignment system 6.

  Further, the control device 8 measures the position information of the second substrate stage 2 in the Z-axis direction using the encoder head 52 at the measurement station ST2, and uses the focus / leveling detection system 7 to measure the position of the measurement unit 36. The reference plane 39 is detected (step SA2). Based on the measurement result of the encoder head 52 and the detection result of the focus / leveling detection system 7, the control device 8 is in the Z axis, θX, and θY directions of the coordinate system defined by the encoder system 5 (encoder head 52). The position information of the reference plane 93 is derived.

  Further, the control device 8 uses the encoder system 5 to measure the position information of the second substrate stage 2 in the XY plane at the measurement station ST2, and holds it on the second substrate stage 2 using the alignment system 6. The alignment mark of the substrate P that has been processed is detected (step SA3). The control device 8 derives the position information of the alignment mark in the XY plane of the coordinate system defined by the encoder system 5 based on the measurement result of the encoder system 5 and the detection result of the alignment system 6.

  In addition, the control device 8 uses the focus / leveling detection system 7 to measure the position information of the second substrate stage 2 in the Z-axis direction using the encoder head 52 at the measurement station ST2, and uses the second substrate stage 2 to measure the position information. 2 detects position information of the surface of the substrate P held by 2 (step SA4). Based on the measurement result of the encoder head 52 and the detection result of the focus / leveling detection system 7, the control device 8 is in the Z axis, θX, and θY directions of the coordinate system defined by the encoder system 5 (encoder head 52). Position information on the surface of the substrate P is derived.

  The control device 8 determines each shot of the substrate P with respect to the detection reference (reference position) of the alignment system 6 defined based on the detection result of step SA1 based on the position information of the alignment mark of the substrate P detected in step SA3. Area position information (array information) is derived by arithmetic processing (step SA5).

  In the present embodiment, the control device 8 selects a part of the shot areas (for example, about 8 to 16) from the plurality of shot areas of the substrate P as the alignment shot area, and sets the selected shot area as the selected shot area. Corresponding alignment marks are detected using the alignment system 6. Then, the control device 8 derives the arrangement information of each shot region of the substrate P by statistically calculating the position information of the detected alignment mark as disclosed in, for example, US Pat. No. 4,780,617. , EGA (Enhanced Global Alignment) processing is executed. Thereby, the control device 8 can derive the arrangement information of each shot region of the substrate P in the XY plane.

  Further, the control device 8 derives an approximate plane (approximate surface) of each shot region on the surface of the substrate P with respect to the reference plane 93 based on the position information of the surface of the substrate P detected in step SA4 (step SA6).

  When the processing at the exposure station ST1 and the processing at the measurement station ST2 are completed, the control device 8 moves the first substrate stage 1 to the measurement station ST2 and moves the second substrate stage 2 to the exposure station ST1. The control device 8 moves the first substrate stage 1 holding the exposed substrate P to the measurement station ST2, and then unloads the substrate P on the first substrate stage 1 using the transport system. Then, the substrate P before exposure is loaded onto the first substrate stage 1 of the measurement station ST2, and measurement processing including the above-described steps SA1 to SA6 is performed.

  The control device 8 moves the second substrate stage 2 holding the substrate P subjected to measurement processing in the measurement station ST2 to the exposure station ST1, and then moves the second substrate stage 2 in the exposure station ST1 to perform projection. The measurement unit 36 of the second substrate stage 2 is arranged in the projection region PR of the optical system PL.

  The position and orientation of the second substrate stage 2 are controlled so that the image plane of the projection optical system PL formed via the liquid LQ and the reference plane 39 substantially coincide. Thereby, the relationship between the measurement value of the encoder head 52, the image plane of the projection optical system PL formed through the liquid LQ, and the reference plane 39 is defined. The control device 8 derives the relationship between the approximate plane of the substrate P derived in step SA6, the measurement value of the encoder head 52, and the image plane of the projection optical system PL formed via the liquid LQ (step SA7). ).

  Then, the control device 8 uses the encoder system 5 to measure the position information of the second substrate stage 2 in the XY plane, and uses the transmission unit 37 and the optical sensor of the measurement unit 36 to align the alignment mark of the mask M. Are detected via the liquid LQ (step SA8). That is, the control device 8 makes the projection optical system PL and the measurement unit 36 face each other, and fills the optical path between the first optical element 20 of the projection optical system PL and the measurement unit 36 with the liquid LQ, and then mask M The alignment mark is illuminated with the exposure light EL. Thereby, the aerial image of the alignment mark of the mask M is projected onto the measurement unit 36 via the projection optical system PL and the liquid LQ. The optical sensor of the measuring unit 36 measures the aerial image of the alignment mark on the mask M via the liquid LQ. The control device 8 derives position information of the aerial image in the XY plane of the coordinate system defined by the encoder system 5 based on the measurement result of the encoder system 5 and the measurement result of the measurement unit 36 (optical sensor). The position of the aerial image is the position of the projection region PR, and is the irradiation position SP1 of the exposure light EL.

  The pattern of the mask M and the alignment mark are formed in a predetermined positional relationship. Further, the positional relationship between the reference mark 37 of the measuring unit 36 and the transmitting unit 38 (light sensor) is known. The control device 8 derives the positional relationship between the reference position in the XY plane of the coordinate system defined by the encoder system 5 and the irradiation position SP1 based on the measurement result of step SA8 (step SA9).

  The control device 8 obtains the positional relationship between the reference position in the XY plane of the coordinate system defined by the encoder system 5 and each shot area S of the substrate P obtained in step SA5 (array information of the shot area S with respect to the reference position). Based on the positional relationship between the reference position in the XY plane of the coordinate system defined by the encoder system 5 and the irradiation position SP1 obtained in step SA9, the coordinate system in the XY plane defined by the encoder system 5 The relationship between each shot area of the substrate P and the irradiation position SP1 is derived (step SA10).

  Further, the control device 8 is based on the measured value of the encoder head 52 associated with the approximate plane of the substrate P and the image plane of the projection optical system PL formed through the liquid LQ, which is obtained in step SA7. While adjusting the position of the surface (exposure surface) of the substrate P, the position of the substrate P in the XY plane is determined based on the positional relationship between each shot region of the substrate P in the XY plane and the irradiation position SP1 obtained in step SA10. The position is controlled, and each shot area S of the substrate P is sequentially exposed (step SA11).

  After the exposure process of the substrate P on the second substrate stage 2 is completed, the control device 8 moves the second substrate stage 2 of the exposure station ST1 to the measurement station ST2, and the substrate P that has completed the measurement process at the measurement station ST2. Is moved to the exposure station ST1. The control device 8 unloads the exposed substrate P held on the second substrate stage 2 moved to the measurement station ST2 by using the transport system.

  By repeating the above procedure, the first substrate stage 1 and the second substrate stage 2 are alternately put into the exposure station ST1, and a plurality of substrates P are sequentially exposed.

  As described above, in the present embodiment, the position information of the first and second substrate stages 1 and 2 is measured using the encoder system 5. In that case, when the state of the lower surface of the scale plate 53 deteriorates, for example, the lower surface of the scale plate 53 is contaminated, foreign matter adheres to the lower surface of the scale plate 53, or the lower surface of the scale plate 53 is deformed. There is a possibility that the positional information of the first and second substrate stages 1 and 2 cannot be accurately measured.

  Therefore, in the present embodiment, the replacement operation of the scale unit 50 is executed at a predetermined timing. By exchanging the scale unit 50 including the scale plate 53 having a good surface (lower surface) state, the position information of the first and second substrate stages 1 and 2 is accurately measured using the scale plate 53. Can do. In this embodiment, since the scale unit 50 including the scale plate 53 is releasably held by the holding device 60, the scale unit 50 can be replaced smoothly.

  Next, an example of the replacement operation of the scale unit 50 will be described. In order to replace the scale unit 50, the control device 8 controls the holding device 60 so that the scale unit 50 held by the holding device 60 can be released from the holding device 60. Specifically, the control device 8 stops the operation of the vacuum system 65 and releases the suction operation by the suction unit 64.

  In order to remove the scale unit 50 from the holding device 60, in other words, to move the scale unit 50 from the internal space 18 to the external space 33, the opening / closing mechanism 32 is operated and the opening 31 is opened. Then, the scale unit 50 is taken out from the holding device 60.

  In the present embodiment, the scale unit 50 is slidably supported by the support member 61 in a direction substantially parallel to the XY plane. Therefore, the scale unit 50 can be easily taken out by sliding with respect to the support member 61. For example, even when the space in which the scale unit 50 is arranged (in this embodiment, the space surrounded by the body 12) is small, the scale unit 50 can be easily taken out.

  Then, after the scale unit 50 is taken out from the internal space 18, a new scale unit 50 is disposed in the holding device 60. Even when the scale unit 50 is arranged on the holding device 60, the scale unit 50 can be smoothly arranged by sliding in the direction substantially parallel to the XY plane with respect to the support member 61.

  Then, after being replaced with a new scale unit 50, the control device 8 uses the scale unit 50 to measure the position information of the first and second substrate stages 1 and 2, and based on the measurement result, The position control of the first and second substrate stages 1 and 2 is executed, and the exposure processing of the substrate P is executed.

  As described above, according to the present embodiment, the holding device 60 that has the support member 61 that slidably supports the scale unit 50 in a direction substantially parallel to the XY plane and that holds the scale unit 50 in a releasable manner. Since it is provided, the scale unit 50 can be exchanged smoothly. Even when the state of the lower surface of the scale plate 53 of the scale unit 50 disposed in the internal space 18 deteriorates, the scale unit 50 is replaced with a new scale unit 50 (the scale unit 50 including the scale plate 53 with the lower surface in good condition). ) And can be easily replaced. Therefore, the position information of the first and second substrate stages 1 and 2 can be accurately measured using the new scale unit 50, and the substrate P can be exposed satisfactorily.

  In the present embodiment, the scale plate 53 is held by the holding member 54 and moved (replaced) together with the holding member 54. Therefore, for example, it is possible to move (exchange) smoothly while suppressing deformation of the scale plate 53 and the like.

  In the present embodiment, the holding device 60 includes a plurality of support members 61, and the encoder system 5 includes a plurality of scale units 50. Even if the size of one scale unit 50 is small, the positional information of the first and second substrate stages 1 and 2 moving on the guide surface 14G can be measured in a wide range by arranging a plurality of scale units 50. Can do. In addition, since the size of one scale unit 50 can be reduced, the replacement operation can be executed smoothly.

  In this embodiment, the temperature of the scale plate 53 can be adjusted by the temperature adjustment device 67. Thereby, the thermal deformation of the scale plate 53 can be suppressed, and the position information of the first and second substrate stages 1 and 2 can be accurately measured using the scale plate 53.

  In the present embodiment, the scale unit 50 has a reference surface 58 that can reflect the measurement light from the encoder heads 51 and 52. Therefore, the operating state of the encoder heads 51 and 52 can be detected (checked) using the reference surface 58. For example, as shown in FIG. 9, measurement light is emitted by the encoder head 51 in a state where the reference surface 58 and the encoder head 51 are opposed to each other. When the encoder head 51 is normal, by performing the emission operation, the measurement light is emitted from the encoder head 51 and irradiated onto the reference surface 58, and the measurement light reflected by the reference surface 58 is received by the encoder head 51. The light enters the element in a predetermined state. On the other hand, when the encoder head 51 is abnormal, the state of the measurement light incident on the light receiving element of the encoder head 51 changes. The control device 8 can check the operating state of the encoder head based on the state of the measurement light incident on the light receiving element.

  In the present embodiment, the scale unit 50 has an identifier 57 that holds unique information of the scale plate 53. The identifier 57 includes, for example, an IC tag, a barcode, and a QR code. The unique information of the scale plate 53 includes information regarding the diffraction grating formed on the scale plate 53. The information regarding the diffraction grating includes error information (manufacturing error information) of the diffraction grating. The error information includes, for example, the grating pitch of the diffraction grating or the distribution of the grating pitch on the lower surface of the scale plate 53. Information regarding the diffraction grating can be measured by a predetermined measuring device when the scale plate 53 is manufactured.

  As shown in FIG. 10, the exposure apparatus EX includes a reading device 34 that reads the identifier 57. The reading device 34 outputs the reading result to the control device 8. In addition, information regarding the diffraction grating corresponding to the identifier 57 is stored in advance in the predetermined storage device. Information relating to the diffraction grating corresponding to the identifier 57 is input to the control device 8 from the storage device. The control device 8 corrects the measurement result of the encoder system 5 based on the reading result of the reading device 34 and information input from the storage device, and based on the corrected measurement result, the first and second substrates. The position control of the stages 1 and 2 is executed. Thereby, the measurement error of the encoder system 5 due to the manufacturing error of the diffraction grating is corrected. Therefore, the control device 8 can move the first and second substrate stages 1 and 2 to desired positions based on the corrected measurement result of the encoder system 5. Note that, instead of correcting the measurement result of the encoder system 5 based on the measurement result of the reading device 34, the drive amount of the second drive system 42 when moving the first and second substrate stages 1 and 2 is corrected. Alternatively, both the measurement result of the encoder system 5 and the drive amount of the second drive system 42 may be corrected.

  By replacing the scale unit 50, the positions of the lower surface of the scale plate 53 of the scale unit 50 before the replacement and the lower surface of the scale plate 53 of the scale unit 50 after the replacement are in the Z axis, θX, and θY directions. It can change. Therefore, in the present embodiment, the control device 8 performs a calibration operation for calibrating the measurement values of the encoder heads 51 and 52 using the scale unit 50. The control device 8 performs calibration so that the measured values of the encoder heads 51 and 52 using the scale unit 50 before replacement and the measured values of the encoder heads 51 and 52 using the scale unit 50 after replacement have a predetermined relationship. To do.

  FIG. 11 is a schematic diagram illustrating an example of the calibration operation. In the present embodiment, the control device 8 performs calibration based on the measurement result of the interferometer system 4 that can measure the position information of the first and second substrate stages 1 and 2. Hereinafter, the case where the measurement value of the encoder head 51 is calibrated will be described as an example, but the same applies to the case where the measurement value of the encoder head 52 is calibrated.

  In the present embodiment, the interferometer system 4 includes a Z interferometer 77 that can measure position information of the first substrate stage 1 in the Z-axis direction as disclosed in, for example, US Pat. No. 6,674,510. ing. As shown in FIG. 11, the first substrate stage 1 has a reflection mirror 78 </ b> M having a reflection surface 78 to which measurement light from the Z interferometer 77 is irradiated. The reflection surface 78 is inclined by 45 degrees with respect to the XY plane. The support frame 11 is provided with a reflection mirror 79M having a reflection surface 79 substantially parallel to the XY plane. As shown in FIG. 7, the reflection mirror 79M is disposed in each of the exposure station ST1 and the measurement station ST2. Further, a part of the reflection mirror 79Ma shown in FIG. 7 is arranged in the exposure station ST1, and a part thereof is arranged in the measurement station ST2. In other words, the reflection mirror 79Ma is arranged so as to cover a part of the exposure station ST1 and a part of the measurement station ST2.

  As shown in FIG. 11, the measurement light emitted from the Z interferometer 77 and incident on the reflecting surface 78 is reflected by the reflecting surface 78 and enters the reflecting surface 79. The measurement light incident on the reflection surface 79 and reflected by the reflection surface 79 is incident on the reflection surface 78, reflected by the reflection surface 78, and incident on the Z interferometer 77. The Z interferometer 77 measures position information of the first substrate stage 1 in the Z-axis direction of the coordinate system defined by the interferometer system 4 (Z interferometer 77) based on the incident measurement light.

  When the measurement value of the encoder head 51 is calibrated, the control device 8 uses the encoder head 51 to measure the position information of the lower surface of the scale plate 53 in the Z-axis, θX, and θY directions, and the Z interferometer 77. Is used to measure position information of the first substrate stage 1 in the Z axis, θX, and θY directions.

  The control device 8 performs the measurement result of the Z interferometer 77 when the measurement operation of the encoder head 51 using the scale unit 50 before replacement is executed, and the measurement operation of the encoder head 51 using the scale unit 50 after replacement. The measurement value of the encoder head 51 is calibrated using the measurement result of the Z interferometer 77 when it is being executed. The position of the reflecting surface 79 is fixed before and after the scale unit 50 is replaced. Therefore, the control device 8 measures the encoder head 50 when measuring the positions of the scale unit 50 (scale plate 53) in the Z-axis, θX, and θY directions before the replacement with reference to the measurement value of the Z interferometer 77. The value can be associated with the measured value of the encoder head 50 when the positions of the scale unit 50 (scale plate 53) after replacement in the Z-axis, θX, and θY directions are measured.

  For example, when executing processing using the focus / leveling detection system 7 in steps SA2, SA4, SA6, SA7, etc., the control device 8 detects the detection result of the focus / leveling detection system 7 and the scale unit 50 before replacement. The position information of the surface of the substrate P is obtained or the position control is executed based on the measured value of the encoder head 51 using the encoder and the measured value of the encoder head 51 using the scale unit 50 after replacement.

  In the present embodiment, the scale unit 50 is disposed in each of the exposure station ST1 and the measurement station ST2. The control device 8 can perform calibration so that the measurement value of the encoder head 51 using the scale unit 50 of the exposure station ST1 and the measurement value of the encoder head 51 using the scale unit 50 of the measurement station ST2 have a predetermined relationship. it can.

  The control device 8 measures the measurement result of the Z interferometer 77 when the measurement operation of the encoder head 51 using the scale unit 50 of the exposure station ST1 is executed, and the measurement of the encoder head 51 using the scale unit 50 of the measurement station ST2. Calibration can be performed using the measurement result of the Z interferometer 77 when the operation is being performed.

  When executing the process using the focus / leveling detection system 7, the control device 8 detects the detection result of the focus / leveling detection system 7, the measurement value of the encoder head 51 using the scale unit 50 of the exposure station ST1, and the measurement. Based on the measurement value of the encoder head 51 using the scale unit 50 of the station ST2, position information on the surface of the substrate P is obtained or position control is executed.

  In the present embodiment, the first substrate stage 1 has a plurality of encoder heads 51. As shown in FIG. 12, the control device 8 includes a first group 51A including a plurality of encoder heads 51 disposed on the first substrate stage 1 and capable of facing the scale unit 50G of the exposure station ST1, and the first group 51A. When the encoder head 51 faces the scale unit 50G of the exposure station ST1, the second group 51B includes a plurality of encoder heads 51 that can face the scale unit 50H of the measurement station ST2. Each of the first and second groups 51A and 52B includes at least three encoder heads 51. The control device 8 can measure position information in the Z-axis, θX, and θY directions of the lower surface of the scale plate 53 of the scale units 50G, 50H using the encoder heads 51 of the first and second groups 51A, 52B. is there. Based on the measurement results of the first group 51A and the second group 52B, the control device 8 measures the measurement value of the encoder head 51 using the scale unit 50G of the exposure station ST1 and the encoder using the scale unit 50H of the measurement station ST2. Calibration can be performed so that the measured value of the head 51 has a predetermined relationship.

  The scale unit 50G may be a scale unit before replacement, and the scale unit 50H may be a scale unit after replacement. Even in this case, the control device 8 uses the measurement value of the encoder head 51 that uses the scale unit 50G before replacement and the scale unit 50H after replacement based on the measurement results of the first group 51A and the second group 52B. Calibration can be performed so that the measured value of the encoder head 51 has a predetermined relationship.

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 13 is a view showing an example of an exposure apparatus EX according to the second embodiment. In FIG. 13, the exposure apparatus EX includes a detection device 80 that detects the state of the scale unit 50. The detection device 80 can detect the state of the lower surface of the scale plate 53.

  In the present embodiment, the detection device 80 includes an imaging device (camera) 81 having an imaging device 82 that can acquire an optical image (image) of the scale unit 50 (scale plate 53).

  In the present embodiment, the exposure apparatus EX includes a stage 90 that can move the guide surface 14G without holding the substrate P. The stage 90 is movable independently of the first and second substrate stages 1 and 2. The stage 90 is movable to a position facing the lower surface of the scale plate 53. The stage 90 can move on the guide surface 14G by the operation of the second drive system 42 including a planar motor.

  In the present embodiment, the camera 81 is disposed on the stage 90. The camera 81 emits light for illuminating the scale plate 53 and an optical system 84 that guides the light emitted from the light source 83 to the scale plate 53 and guides the light from the scale plate 53 to the image sensor 82. And. The optical system 84 includes a half mirror 84M.

  The control device 8 arranges the stage 90 at a position facing the scale plate 53 at a predetermined timing, and executes a detection operation using the camera 81. The control device 8 determines whether the scale unit 50 needs to be replaced based on the detection result of the camera 81. Determination of whether or not the scale unit 50 needs to be replaced includes determination of whether or not the scale unit 50 (scale plate 53) is defective. The defect includes, for example, contamination of the scale plate 53 or foreign matter attached to the scale plate 53.

  For example, when it is determined that the scale plate 53 is defective based on the detection result of the camera 81, the control device 8 determines that the scale unit 50 needs to be replaced and stops the exposure operation of the substrate P. For example, the replacement of the scale unit 50 is instructed using an alarm device, a display device, or the like. Thus, in this embodiment, the exchange operation of the scale unit 50 is executed based on the detection result of the camera 81.

  In the present embodiment, the exposure apparatus EX includes a maintenance device 100 that maintains the scale unit 50 (scale plate 53). In the present embodiment, the maintenance device 100 can perform cleaning of the scale unit 50. In the present embodiment, the maintenance device 100 includes a gas supply device 101 that supplies gas to the scale unit 50. The gas supply device 101 includes a gas supply unit 102 that sends out clean gas, and a nozzle member 103 that is supplied with gas from the gas supply unit 102. The nozzle member 103 has an air outlet 104 that blows out gas, and supplies the gas from the gas supply unit 102 to the scale unit 50.

  In the present embodiment, the maintenance device 100 is disposed on the stage 90. The air outlet 104 of the nozzle member 103 is disposed on the upper surface of the stage 90 that can face the scale unit 50. The control device 8 cleans the scale unit 50 by supplying gas from the air outlet 104 to the scale unit 50 with the scale unit 50 (scale plate 53) and the air outlet 104 facing each other. For example, the foreign matter adhering to the surface of the scale unit 50 (the lower surface of the scale plate 53) is removed by the gas supplied from the air outlet 104.

  When the controller 81 detects the state of the lower surface of the scale plate 53 with the camera 81 and determines that, for example, foreign matter has adhered to the scale plate 53 based on the detection result of the camera 81, the control unit 8 replaces the scale unit 50. Prior to the execution, the scale unit 5 can be cleaned using the gas supply device 101. Then, after cleaning, the control device 8 uses the camera 81 to detect the state of the lower surface of the scale plate 53 again. The control device 8 determines whether or not the scale unit 50 needs to be replaced based on the detection result of the camera 81. For example, when it is determined that the foreign matter on the scale plate 53 has been removed by cleaning using the gas supply device 101, the control device 8 executes a normal sequence including an exposure process for the substrate P without performing the replacement operation of the scale unit 50. To do. On the other hand, when it is determined that the foreign matter on the scale plate 53 is not removed even by the cleaning using the gas supply device 101, the control device 8 performs an operation for performing the replacement operation of the scale unit 50.

  Note that the scale unit 50 can also be cleaned using a maintenance apparatus 100B as shown in FIG. A maintenance device 100B shown in FIG. 14 includes a gas supply device 101B that supplies gas to the scale unit 50, and a suction device 105 that sucks foreign matter from the scale unit 50. The gas supply device 101B includes a gas supply unit 102B and a nozzle member 103B in which an air outlet 104B is formed. The suction device 105 includes a nozzle member 107 in which a suction port 106 is formed, and a suction unit 108 including a vacuum system capable of sucking foreign matter through the suction port 106. The nozzle members 103B and 107 are arranged on the stage 90. The scale unit 50 can also be cleaned by the maintenance device 100B shown in FIG.

  The scale unit 50 can also be cleaned by omitting the gas supply device 101B and using a maintenance device including the suction device 105.

  Further, the state of the scale unit 50 can be detected using a detection device 80B as shown in FIG. 15, and the scale unit 50 can be maintained using a maintenance device 100C as shown in FIG.

  In FIG. 15, the detection device 80 </ b> B includes a projection device 85 that irradiates the scale unit 50 (scale plate 53) with detection light, and a light receiving device 86 that is disposed at a predetermined position with respect to the detection light. The projection device 85 and the light receiving device 86 are disposed on the stage 90. For example, when there is no defect (foreign matter) on the lower surface of the scale plate 53, the light generated from the scale plate 53 travels in a predetermined direction when the projection device 85 irradiates the lower surface of the scale plate 53 with detection light. The light receiving device 86 is disposed at a position where light traveling in the predetermined direction does not enter. On the other hand, when a defect (foreign matter) exists on the lower surface of the scale plate 53, at least a part of the light generated from the scale plate 53 when the projection device 85 irradiates the lower surface of the scale plate 53 with the light receiving device. 86 is incident. Therefore, the control device 8 can determine whether or not the scale plate 53 is defective based on the light reception result of the light receiving device 86, and can determine whether or not the scale unit 50 needs to be replaced.

  The maintenance device 100C includes an irradiation device 109 that irradiates the scale unit 50 with ultraviolet light. The irradiation device 109 includes a light source 110 that emits ultraviolet light, and an optical system 112 that guides the ultraviolet light from the light source 110 to the emission unit 111 disposed on the stage 90. The optical system 112 includes an optical fiber and a reflection mirror. By irradiating the scale unit 50 with ultraviolet light, the scale unit 50 is optically cleaned. By irradiating the scale unit 50 with ultraviolet light, foreign substances such as organic substances adhering to the scale unit 50 can be removed.

  In the first and second embodiments described above, the example in which the fluid for adjusting the temperature is supplied to the internal flow path 68 of the holding member 54 in order to adjust the temperature of the scale plate 53 has been described. For example, FIG. As shown, the temperature of the scale plate 53 can be adjusted by using the Peltier element 67 </ b> P disposed on the holding member 54. Further, power can be supplied to the holding member 54 via the cable 120. The Peltier element 67P is disposed in the vicinity of the holding surface 55, and can favorably adjust the temperature of the scale plate 53 held on the holding surface 55. Further, the Peltier element 67P and the internal flow path 68 through which the temperature adjusting fluid flows can be used in combination.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot area of the substrate is formed by one scanning exposure. The present invention can be applied to an exposure apparatus that performs double exposure almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The present invention also includes a substrate stage that holds and moves the substrate P as disclosed in, for example, US Pat. No. 6,897,963 and European Patent Application Publication No. 1713113, and the like. In addition, the present invention can also be applied to an exposure apparatus equipped with a movable measuring stage equipped with a measuring instrument (measuring member) capable of executing predetermined measurement related to exposure. Further, a measuring instrument (measuring member) may be mounted on the stage 90 described above.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above-described embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as exposure light EL. For example, as disclosed in US Pat. No. 7,023,610. A harmonic generator that outputs pulsed light with a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used). The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. Examples of self-luminous image display elements include CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission Display). And a plasma display panel (PDP).

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens, and an immersion space is formed in a predetermined space between the optical member and the substrate. It is formed.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  As described above, the exposure apparatus EX of the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 17, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for manufacturing a mask (reticle) based on the design step, and a substrate which is a base material of the device. Substrate processing step 204 including substrate processing (exposure processing) including exposing the substrate with exposure light using a mask pattern and developing the exposed substrate according to the above-described embodiment. The device is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a package process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 1st Embodiment. It is the figure which expanded a part of exposure apparatus which concerns on 1st Embodiment. It is a top view which shows the 1st substrate stage which concerns on 1st Embodiment. It is a perspective view which shows an example of the scale unit which concerns on 1st Embodiment. It is a perspective view which shows an example of the holding | maintenance apparatus which concerns on 1st Embodiment. It is a perspective view which shows an example of the scale unit and holding | maintenance apparatus which concern on 1st Embodiment. It is a figure which shows an example of the scale unit and holding | maintenance apparatus which concern on 1st Embodiment. It is a flowchart for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a figure which shows an example of the exposure apparatus which concerns on 2nd Embodiment. It is a figure which shows an example of the exposure apparatus which concerns on 2nd Embodiment. It is a figure which shows an example of the exposure apparatus which concerns on 2nd Embodiment. It is a figure which shows an example of the exposure apparatus which concerns on 2nd Embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... 1st board | substrate stage, 2 ... 2nd board | substrate stage, 4 ... Interferometer system, 5 ... Encoder system, 6 ... Alignment system, 7 ... Focus leveling detection system, 8 ... Control apparatus, 11 ... Support frame, 18 ... Internal space, 19 ... chamber device, 20 ... first optical element, 23 ... liquid immersion member, 33 ... external space, 34 ... reading device, 41 ... first drive system, 42 ... second drive system, 51 ... encoder head, 52 ... Encoder head, 53 ... Scale plate, 54 ... Holding member, 57 ... Identifier, 58 ... Reference plane, 60 ... Holding device, 61 ... Supporting member, 64 ... Suction part, 66 ... Positioning mechanism, 67 ... Temperature adjusting device, 67P ... Peltier element, 73 ... Liquid supply device, 76 ... Liquid recovery device, 77 ... Z interferometer, 80 ... Detection device, 81 ... Imaging device, 85 ... Projection device, 86 Light receiving device, 90 ... stage, 100 ... maintenance device, 101 ... gas supply device, 105 ... suction device, 109 ... irradiation device, EL ... exposure light, EX ... exposure device, P ... substrate, SP1 ... irradiation position, SP2 ... measurement Position, ST1 ... Exposure station, ST2 ... Measurement station

Claims (47)

An exposure apparatus that exposes a substrate with exposure light,
An exposure station having a first region including a first position irradiated with the exposure light ;
A measurement station including a second position for measuring position information of the substrate and having a second area different from the first area;
A first movable member movable while holding the substrate in a predetermined plane including the first region and the second region ;
A measurement system including an encoder head disposed on the first movable member, and measuring position information of the first movable member;
A holding device that releasably holds a scale unit including a scale plate at a position that can face the encoder head in each of the exposure station and the measurement station ;
The position of the surface of the substrate placed on the measurement station and held by the first movable member
A detection system capable of detecting position information ,
The holding device, the scale unit have a support member for slidably supported substantially parallel to the predetermined plane,
Based on the detection result of the detection system, the measurement value of the encoder head using the scale unit of the measurement station, and the measurement value of the encoder head using the scale unit of the exposure station, the substrate of the exposure station An exposure apparatus that performs surface position control . A detection device for detecting a state of the scale unit;
The detection based on the detection result of the apparatus, the scale unit exposure apparatus according to claim 1, further comprising a, a determination unit for determining the necessity of replacement of. An exposure apparatus that exposes a substrate with exposure light,
A first movable member movable while holding the substrate in a predetermined plane including a first position irradiated with the exposure light;
A measurement system including an encoder head disposed on the first movable member, and measuring position information of the first movable member;
A holding device that releasably holds a scale unit including a scale plate at a position that can face the encoder head;
A detection device for detecting a state of the scale unit;
A determination device that determines whether or not the scale unit needs to be replaced based on a detection result of the detection device;
The exposure apparatus includes an exposure apparatus having a support member that slidably supports the scale unit in a direction substantially parallel to the predetermined surface. The exposure apparatus according to claim 2 or 3 , wherein the detection device includes an imaging device capable of acquiring an optical image of the scale unit. The exposure apparatus according to claim 2, wherein the detection apparatus includes a projection apparatus that irradiates the scale unit with detection light, and a light receiving apparatus that is disposed at a predetermined position with respect to the detection light. A second movable member different from the first movable member;
At least in part, an exposure apparatus according to any one of claims 2-5 disposed on the second movable member of the detecting device. The exposure apparatus according to any one of claims 2 to 6 , wherein an exchange operation of the scale unit is executed according to a detection result of the detection apparatus. The necessity of the determination of the exchange of the scale units, exposure apparatus according to any one of claims 2-7 comprising determining the presence or absence of a defect of the scale unit. The exposure apparatus according to claim 8 , wherein the defect includes foreign matter attached to the scale unit. A maintenance device for maintaining the scale unit;
The determining device, on the basis of the detection result of the detecting device detects the state of the scale unit after maintenance by the maintenance device, any one of claims 2 to 9 for determining the necessity of replacement of the scale unit The exposure apparatus described. The exposure apparatus according to claim 1, further comprising a maintenance device for maintenance of the scale unit. An exposure apparatus that exposes a substrate with exposure light,
A first movable member movable while holding the substrate in a predetermined plane including a first position irradiated with the exposure light;
A measurement system including an encoder head disposed on the first movable member, and measuring position information of the first movable member;
A holding device that releasably holds a scale unit including a scale plate at a position that can face the encoder head;
A maintenance device for maintaining the scale unit,
The exposure apparatus includes an exposure apparatus having a support member that slidably supports the scale unit in a direction substantially parallel to the predetermined surface. The exposure apparatus according to claim 10 , wherein the maintenance includes cleaning of the scale unit. The maintenance device includes an exposure apparatus according to any one claim of the scale unit claims 10 to 13 including a gas supply device for supplying a gas to. The exposure apparatus according to any one of claims 10 to 14 , wherein the maintenance device includes a suction device that sucks foreign matter of the scale unit. The maintenance device, the scale unit exposure apparatus according to any one of claims 10 to 15 including the irradiation device for irradiating ultraviolet light. A second movable member different from the first movable member;
The exposure apparatus according to any one of claims 10 to 16 , wherein at least a part of the maintenance apparatus is disposed on the second movable member. The exposure apparatus according to any one of claims 1 to 17 , wherein the measurement system is capable of measuring position information on a surface of the scale plate facing the encoder head based on a measurement value of the encoder head. Exposure apparatus according to any one of claims 1 to 18 comprising a calibration device for calibrating the measurement values of the encoder head with the scale unit. The calibration apparatus according to claim 19, wherein the second measurement value of the encoder head using the first measurement value and the second scale unit of the encoder head using the first scale unit is calibrated so as to have a predetermined relationship Exposure equipment. The calibration device includes an interferometer system capable of measuring position information of the first movable member,
21. The exposure apparatus according to claim 20, wherein calibration is performed based on a measurement result of the interferometer system. The calibration apparatus executes a measurement result of the interferometer system when a measurement operation of the encoder head using the first scale unit is being executed, and a measurement operation of the encoder head using the second scale unit. The exposure apparatus according to claim 21 , wherein calibration is performed using a measurement result of the interferometer system when the interferometer system is being operated. The calibration device includes a first group including a plurality of encoder heads arranged on the first movable member and capable of facing the first scale unit, and the first group of encoder heads includes the first scale unit. A second group including a plurality of encoder heads capable of facing the second scale unit when facing each other;
21. The exposure apparatus according to claim 20, wherein calibration is performed based on the measurement results of the first group and the second group. The first scale unit includes a scale unit before replacement,
The exposure apparatus according to any one of claims 20 to 23 , wherein the second scale unit includes a scale unit after replacement. The first scale unit includes a scale unit of the measurement station,
The exposure apparatus according to any one of claims 20 to 24 , wherein the second scale unit includes a scale unit of the exposure station. 26. The exposure apparatus according to any one of claims 1 to 25 , wherein the scale unit includes a holding member that holds the scale plate. 27. The exposure apparatus according to claim 26 , wherein the holding member is capable of releasing the scale plate. 28. The exposure apparatus according to claim 26 or 27 , further comprising a temperature adjusting device that is provided at least in part on the holding member and adjusts the temperature of the scale plate. 29. The exposure apparatus according to claim 28 , wherein the temperature adjusting device includes an internal flow passage formed inside the holding member and through which a temperature adjusting fluid flows. 30. The exposure apparatus according to claim 29 , further comprising a supply device that supplies the fluid to the internal flow path. 31. The exposure apparatus according to claim 29 or 30 , further comprising a collection device that collects the fluid that has flowed through the internal flow path. 32. The exposure apparatus according to any one of claims 28 to 31 , wherein the temperature adjusting device includes a Peltier element disposed on the holding member. 33. The exposure apparatus according to any one of claims 1 to 32 , wherein the scale unit includes a reference surface capable of reflecting measurement light from the encoder head on a facing surface facing the encoder head. 34. The exposure apparatus according to any one of claims 1 to 33 , wherein the scale unit includes an identifier that holds unique information of the scale plate. A reader for reading the identifier;
35. The exposure apparatus according to claim 34 , wherein a measurement result of the measurement system is corrected based on a reading result of the reading apparatus. 36. The exposure apparatus according to any one of claims 1 to 35 , wherein the holding device includes a positioning mechanism that positions the scale unit. 37. The exposure apparatus according to any one of claims 1 to 36 , comprising at least two of the first movable members. 38. The exposure apparatus according to any one of claims 1 to 37 , wherein the holding device holds the scale unit such that a surface of the scale plate that can face the encoder head is substantially parallel to the predetermined surface. An optical member for emitting the exposure light;
A support frame for supporting the optical member,
The exposure apparatus according to any one of claims 1 to 38 , wherein the support member is disposed on the support frame. 40. The exposure apparatus according to claim 39 , wherein the support member is disposed at least at a part of the periphery of the optical member. 41. The exposure apparatus according to any one of claims 1 to 40 , wherein the holding device includes a plurality of the support members. A chamber device that forms an internal space in which the optical member is disposed;
The exposure apparatus according to any one of claims 1 to 41 , wherein the scale unit is slidable with respect to the support member so as to move between the internal space and the external space. 43. The exposure apparatus according to any one of claims 1 to 42 , further comprising a control device that controls the holding device in order to replace the scale unit. The holding device includes an adsorption unit that adsorbs at least a part of the scale unit;
44. The exposure apparatus according to claim 43 , wherein the control device controls a suction operation of the suction unit. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 44 ;
Developing the exposed substrate; and a device manufacturing method. An exposure method for exposing a substrate with exposure light,
An encoder head of a measurement system for measuring position information of a movable member that is movable while holding the substrate in a predetermined plane including a first position irradiated with the exposure light is disposed on the movable member. ,
Holding the scale unit including the scale plate in a releasable position at a position facing the encoder head;
Maintaining the scale unit;
Detecting the state of the scale unit after the maintenance;
Determining whether or not the scale unit needs to be replaced based on the detection result of the state of the scale unit after the maintenance;
Sliding the scale unit in a direction substantially parallel to the predetermined surface to replace the scale unit;
An exposure method comprising: performing position control of the movable member based on a measurement result of the measurement system to expose the substrate. Exposing the substrate using the exposure method of claim 46 ;
Developing the exposed substrate; and a device manufacturing method.

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