JP5115434B2 - Method for producing group III nitride compound semiconductor device - Google Patents

Description

  The present invention relates to a method for producing a group III nitride compound semiconductor device. In the present invention, a group III nitride compound semiconductor is epitaxially grown on a heterogeneous substrate to form an element structure, and then a conductive support substrate is bonded via a metal, solder, or other conductive layer, and in the vicinity of the interface with the heterogeneous substrate. The present invention relates to a so-called laser lift-off technique in which a thin layer of a Group III nitride compound semiconductor is decomposed by laser irradiation to remove a heterogeneous substrate. The present invention is particularly effective for a method for producing a group III nitride compound semiconductor light emitting device having a p-type layer and an n-type layer above and below a pn junction or an active layer.

With a laser lift-off technique starting from Kelly et al., Which will be described later as Non-Patent Document 1, it becomes possible to replace a light emitting device and other group III nitride compound semiconductor devices from a substrate used for epitaxial growth to a conductive support substrate. It was. Thereby, for example in a light emitting diode, an electrode can be provided in the back surface of a support substrate. As a result , similarly to the GaAs-based light emitting element, it is possible to obtain a light emitting element having so-called positive and negative counter electrodes at two locations on the back surface of the substrate and the uppermost surface of the epitaxial layer.
The advantage of the positive and negative electrodes facing each other with the light emitting layer sandwiched between them is that the light emitting layer area can be formed as much as the horizontal area of the support substrate, and that uniform light emission can be obtained. It is an improvement.

FIG. 5 and FIG. 6 are two process diagrams (cross-sectional views) that briefly show two different technologies published at the present time.
As shown in FIG. 5, consider a case in which a heterogeneous substrate such as a sapphire substrate is used as the epitaxial growth substrate 100 and an n-type layer 11 and a p-type layer 12 are formed in this order, for example. In this specification, an n-type layer 11 and a p-type layer 12 having a light emitting region L formed therebetween are collectively referred to as an epitaxial layer 10. In this specification, an example in which the n-type layer 11 and the p-type layer 12 are provided and the light-emitting region L is formed between them is illustrated, but the configuration of the light-emitting element has such a simple structure. Of course, it is not limited.
A contact electrode 121 is formed on the p-type layer 12 and bonded to a conductive support substrate 200 made of, for example, silicon using a solder layer (solder layer) 50 via a metal or other conductive layer 122. A metal or other conductive layer 222 is separately provided on the support substrate 200 between the solder layer (solder layer) 50. In this way, the laser LSR is irradiated, for example, for each chip so that the outer periphery of the laser irradiation region does not cross the chip that is finally separated.
Thus, for example, a part of the gallium nitride GaN layer is decomposed into a thin film and decomposed into molten metal gallium (Ga) and nitrogen (N ₂ ) gas. If the gallium nitride GaN layer is decomposed sequentially from the outer periphery of the bonded wafer, the molten metal gallium (Ga) and nitrogen (N ₂ ) gas generated by the decomposition can be discharged to the outer periphery of the wafer.

FIG. 6 shows a technique for providing an air hole tr communicating with the outside of the wafer in order to more easily discharge molten metal gallium (Ga) and nitrogen (N ₂ ) gas generated by decomposition. The air hole tr is formed by dry etching using a resist mask from the p-type layer 12 side of the epitaxial layer before bonding to the support substrate 200. At this time, since dry etching using a resist mask is performed from the p-type layer 12 side, the side surface of the etched outer peripheral portion of the epitaxial layer has a taper (inclination). The taper (inclination) is such that the horizontal cross-sectional area of the p-type layer 12 is the smallest, and the horizontal area increases in order according to the light emitting region L and the n-type layer 11. Usually, in the dry etching of a group III nitride compound semiconductor using a resist mask, the taper (inclination) forms 60 to 80 degrees with the horizontal plane. That is, in FIG. 6, when separated into light emitting element chips, an inverted tapered element structure is obtained in which the horizontal sectional area of the upper n-type layer 11 is larger than the horizontal sectional area of the lower p-type layer 12. .
Since the side surfaces of the p-type layer 12 and the n-type layer 11 are exposed by dry etching, it is necessary to cover the side surfaces of the p-type layer 12 and the n-type layer 11 with the insulating protective film 40 in order to avoid a short circuit. For this reason, after forming the contact electrode 121, in order to ensure the adhesiveness with the insulating protective film 40, in the laminated structure of the conductive layers 122 and 123, it is necessary to use a thing with high adhesiveness with the insulating protective film 40. is there.
In FIG. 6, the conductive layers 122 and 123 and the solder layer (solder layer) 125 are formed so as not to block the air holes tr.

As a prior art of the present invention, a publication of a prior application filed by the present applicant is shown as Patent Document 1.
JP 2008-186959 A Appl. Phys. Lett. , Vol. 69, 1996, pp. 1749-1751

At present, the yield is extremely poor even if an attempt is made to obtain a light emitting element by laser lift-off technology.
In fact, in the method of FIG. 5, liquid Ga and nitrogen gas are generated by decomposition at the interface of the GaN layer, which is the laser irradiation region, with the sapphire substrate, resulting in very large volume expansion. Separation occurs when there is no escape route for nitrogen gas. In order to create a nitrogen gas escape path, for example, even if the GaN layer is decomposed from the interface with the sapphire substrate in order from the outer periphery of the bonded wafer, the laser irradiation is performed on the region where the laser irradiation is performed. Since a non-existent region is always adjacent, a considerable load is applied near the boundary with the adjacent portion. For this reason, in the vicinity of the boundary between the laser irradiation region and the non-laser irradiation region, separation occurs at the interface of the laminated portion having weak adhesion, and further, a crack occurs in the silicon substrate or the like as the support substrate.

In the method of FIG. 6, it is not preferable to form a conductive layer near the side surface of the outer peripheral portion of the epitaxial layer. This is because when a conductive layer for energizing the support substrate 200 and the p-type layer 12 of the epitaxial layer 10 is formed on the side surface of the outer peripheral portion, the conductive layer becomes an n-type layer of the epitaxial layer 10 in a later step. This is because it may come into contact with 11. In this case, the pn electrode becomes conductive without passing through the light emitting layer or the like, and the device becomes a rejected product. That is, the yield is deteriorated.
In order to avoid such pn conduction, it is necessary not to form the conductive layers 122 and 123 and the solder (solder) layer 125 on the insulating protective film 40 on the outer peripheral portion of the epitaxial layer 10. However, for this purpose, because of work such as lift-off using a resist mask, it is necessary to repeat application of resist material, exposure and patterning with a solvent, vapor deposition of metal, etc., and lift-off work. In this case, for example, due to adhesion of resist residues and contaminants, the adhesion between the laminated layers deteriorates, and peeling or cracking occurs at the time of laser lift-off.

  Moreover, although the technique of patent document 1 by the present applicant was presented, it is necessary to form a thick resin only on the outer periphery of each element so as not to cover the metal electrode after separating the epitaxial layer 10 for each element. There is. It is not always easy to form a thick resin only on the outer periphery of each element so as not to cover the metal electrode, and a method for avoiding this is desired.

  The present invention has been made to solve the above problems. The purpose is to improve the yield so as to have good device characteristics when forming a group III nitride compound semiconductor device using a laser lift-off technique.

According to the first aspect of the present invention, a heterogeneous substrate is used as an epitaxial growth substrate, a support substrate is bonded to the uppermost surface of an epitaxial layer made of a group III nitride compound semiconductor via a conductive layer, and then the epitaxial growth substrate is removed by laser lift-off. In the method for producing a group III nitride compound semiconductor device,
Prior to bonding to the support substrate, air that reaches at least from the uppermost surface of the epitaxial layer formed on the epitaxial growth substrate to the interface between the lowermost surface of the epitaxial layer and the epitaxial growth substrate, and communicates with the outside of the wafer when bonded to the support substrate. A first groove forming step of forming a first groove acting as a hole;
A second groove forming step of forming a second groove for separating the epitaxial layer for each chip by removing the epitaxial layer corresponding to the outer periphery of each chip after peeling off the epitaxial growth substrate by laser lift-off;
An insulating protective film forming step of forming an insulating protective film that at least completely covers the outer peripheral side surface of the epitaxial layer of each chip exposed in the second groove forming step;
And a support substrate cutting step of cutting the support substrate to separate each chip.
The main feature of the present invention is that, for laser lift-off, the nitrogen gas and molten group III element generated when the group III nitride compound semiconductor layer is decomposed into a thin film by laser irradiation are easily removed. Forming the first groove and forming the second groove for forming the outer periphery of the epitaxial layer of the element chip to be finally obtained are performed separately. As specified in the claims described later, the structure of the first groove may be removed when the second groove is formed or may be removed in the supporting substrate cutting step.

The invention according to claim 2 is characterized in that a contact electrode is formed on the uppermost surface of the epitaxial layer after the first groove forming step.
In the invention according to claim 3, the conductive layer formed on the epitaxial growth substrate side of the conductive layer covers the contact electrode before joining the epitaxial layer formed on the epitaxial growth substrate to the support substrate. It is characterized in that it is formed on the entire surface .
The invention according to claim 4 is characterized in that the first groove forming step is performed by a dicer.
The invention according to claim 5 is characterized in that the first groove forming step is performed by dry etching.
The invention according to claim 6 is characterized in that the first groove forming step is performed by decomposition of the epitaxial layer by laser irradiation.

The invention according to claim 7 is characterized in that the second groove forming step is performed by dry etching.
The invention according to claim 8 is characterized in that, in the second groove forming step, the epitaxial layer constituting the side surface of the first groove is also removed.
According to a ninth aspect of the present invention, in the second groove forming step, a mask that covers the first groove is formed so as not to destroy the structure of the first groove, and in the support substrate cutting step, the first groove is formed. The structure that has been formed is removed.

  The invention according to claim 10 is characterized in that the supporting substrate cutting step is performed by laser irradiation.

According to the present invention, an extremely high yield rate can be achieved. The reason is as follows.
First, the first groove forming step secures a first groove that acts as an air hole communicating with the outside of the wafer in the state of the wafer bonded with the support substrate. As a result, during laser irradiation for laser lift-off, nitrogen gas generated by the decomposition of the group III nitride compound semiconductor layer is easily discharged out of the wafer. This is because, during laser irradiation for laser lift-off, the laser is not irradiated from the portion where nitrogen gas is generated between the epitaxial growth substrate and the epitaxial layer, and the epitaxial growth substrate and the epitaxial layer are separated from each other. This means that the stress load on the part that remains completely joined is reduced. For this reason, there is a possibility that peeling will occur between the layers of the laminated epitaxial layer, conductive layer, and support substrate in the laser-irradiated region and any of the adjacent laser-irradiated region and laser-unirradiated region. Becomes smaller. In addition, the possibility of cracks occurring in the epitaxial growth substrate and the support substrate during each process is reduced.

  Furthermore, compared with the technique shown in FIG. 6, it is not necessary to form an insulating protective film at the time of laser lift-off according to the present invention. This is because the side surface of the first groove acting as an air hole communicating with the outside of the wafer at the time of laser irradiation for laser lift-off is removed in a later process, and the final group III nitride compound semiconductor device It is because it does not remain as an outer peripheral part. In this regard, in the first groove forming step, it is possible to reduce the load on the epitaxial growth substrate and the epitaxial layer, and it is possible to avoid the deterioration of the element characteristics.

Further, since it is not necessary to form an insulating protective film before laser lift-off, a resist mask necessary for forming the insulating protective film is not formed. In addition, as shown below, a conductive layer can be formed on the entire surface of the epitaxial growth substrate having the epitaxial layer in which the first groove is formed. In other words, after the contact electrode is formed and before the laser lift-off, there is no need for any process involving heating other than the laminating process, such as formation of a resist mask. This means that the laser lift-off can be started in a state where the adhesion between the respective layers is strong without adhesion of resist residues and contaminants. That is, the layers stacked before the laser lift-off do not undergo a patterning process using a photoresist, and therefore, adhesion between the layers is not deteriorated and peeling can be avoided.
Due to the above-described action, the group III nitride compound semiconductor device obtained by the present invention has little deterioration in device characteristics. That is, an extremely high yield rate can be achieved by the method for producing a group III nitride compound semiconductor device of the present invention.

  In the practice of the present invention, both the epitaxial growth substrate and the conductive support substrate can be a relatively thick substrate having a thickness of about 500 μm, which facilitates handling. In the case of finally dividing into individual elements, for example, when cutting using a laser is applied, the support substrate is preferably thinned to 100 μm to 200 μm and then an electrode layer is formed on the back surface.

In designing the laser irradiation area (shot area) at the time of laser lift-off, it is preferable that the outer periphery of the laser irradiation area (shot area) does not cross each chip to be finally obtained. The outer periphery of the laser irradiation region (shot area) is the boundary between the region where the group III nitride compound semiconductor layer is decomposed and the region where it does not occur, and the boundary between the portion where the junction with the epitaxial growth substrate disappears and the portion where the junction still remains This is because when a chip crosses each chip, a stress is generated in the chip.
For example, if the planar shape of the chip is a square or the like, the laser irradiation area (shot area) of the chip size or the laser irradiation area (shot area) of a size matching the square area where a plurality of chips are combined. It is better to adjust as follows.

The first groove formed according to the present invention needs to substantially coincide with at least the outer periphery of each laser irradiation region (shot area). That is, it is preferable that there is no portion where the first groove is not formed on the outer periphery of each laser irradiation region (shot area).
The first groove may or may not be provided so as to cross, for example, a portion corresponding to the inside of each laser irradiation region (shot area). This is significant when each laser irradiation region (shot area) separates a plurality of chips from the epitaxial growth substrate.
Further, since the first groove needs to communicate with the outside of the wafer, for example, the first groove may be formed so as to reach the outer periphery of the epitaxial substrate even in the region where the chip is not formed.
The side surface of the first groove may be finally removed. If the side surface of the first groove is finally removed, when the first groove is formed, the p-type layer and the n-type layer of the epitaxial layer serving as the side surface form the first groove. Or it may be in a short state after that. This is because the bridge portion in which the short circuit has occurred is finally removed, so that the pn short circuit of each chip is eliminated. In this respect, the technology that can be employed in the first groove forming step has a very wide selection range. For example, dicing by a dicer, dry etching using a mask, melting and decomposition by laser irradiation, or etching by sandblasting can be employed.

The second groove formed according to the present invention is formed so that the epitaxial layer forming each chip is separated for each chip. At this time, the epitaxial layer constituting the first groove may be removed, and the epitaxial layer between the first groove and the outer periphery of each chip is removed while leaving the epitaxial layer on the side surface of the first groove. Also good. When the epitaxial layer on the side surface of the first groove is left in the second groove forming step, the epitaxial layer on the side surface of the first groove is preferably removed in the supporting substrate cutting step.
In the second groove forming step, it is not preferable that, for example, the p-type layer and the n-type layer are short-circuited on the side surface of the outer peripheral portion of the epitaxial layer. For this reason, the selection range of the technology that can be adopted in the second groove forming step is slightly narrowed.

Any cutting method can be used for the supporting substrate cutting step. In this case, a metal or other conductive layer and a small piece of the conductive support substrate may be scattered and attached. Therefore, it is important to form an insulating protective film after the second groove forming step to prevent the p-type layer and the n-type layer from being short-circuited in the support substrate cutting step.
The technology that can be adopted as the cutting method has a very wide selection range. A combination of half cutting with a dicer or the like and mechanical cutting, or decomposition by laser irradiation is also preferable.

FIG. 1 is a cross-sectional view showing a configuration of a group III nitride compound semiconductor device (blue LED) 1000 obtained by a manufacturing method according to a specific embodiment of the present invention.
A group III nitride compound semiconductor element (blue LED) 1000 in FIG. 1 is a conductive layer made of a stack of a plurality of metals on the surface of a conductive support substrate 200 that is an n-type silicon substrate. A layer 222, a solder layer (solder layer) 50 which is a low melting point alloy layer, a conductive layer 122 made of a stack of a plurality of metals, a p-contact electrode 121, and a single layer or a plurality of p-type Group III nitride compound semiconductor layers. It has a laminated structure of a p-type layer 12 that is a layer, a light emitting region L, an n-type layer 11 that is a single layer or multiple layers of an n-type Group III nitride compound semiconductor layer, and an n-contact electrode 130.
When the description in the claims is compared with the configuration of the present embodiment, what corresponds to the “conductive layer” in the claims is the conductive layer 222, the solder layer (solder layer) 50, the conductive layer 122, and the p-contact electrode 121. .
The outer peripheral side surfaces of the p-type layer 12 and the n-type layer 11 sandwiching the light emitting region L are covered with an insulating protective film 40. Further, the horizontal cross-sectional area of the p-type layer 12 and the n-type layer 11 (hereinafter sometimes referred to collectively as the epitaxial layer 10) is the n-contact electrode of the n-type layer 11 from the support substrate side 200 side of the p-type layer 12. It gradually decreases toward the 130 side. Therefore, the outer peripheral side surface of the epitaxial layer covered with the insulating protective film 40 is inclined (forward taper) so as to spread from the upper side where the n contact electrode 130 is formed toward the lower side which is the support substrate side 200 side. ) Is formed.
The n-type layer 11 has a surface 11s having irregularities in order to improve light extraction efficiency.
In addition, a conductive layer 232 and a solder layer (solder layer) 235 made of a stack of a plurality of metals are formed on the opposite surface (back surface) of the support substrate 200.

In this embodiment, each layer is configured as follows.
The conductive layers 222 and 232 made of a plurality of metal layers are each laminated in the order of titanium (Ti), nickel (Ni), and gold (Au) from the support substrate 200 side. Note that the nickel (Ni) layer prevents diffusion of tin (Sn) in the solder layer (solder layer) 50.
The solder layers (solder layers) 50 and 235 are each formed of solder made of an alloy of gold and tin (Au—Sn). A thin gold (Au) layer is formed on the surface of the solder layer (solder layer) 235 to prevent oxidation of tin.
The p contact electrode 121 is formed of an alloy of silver (Ag), palladium (Pd), and copper (Cu).
The conductive layer 122 made of a stack of a plurality of metals has titanium (Ti), titanium nitride (TiN), titanium (Ti), nickel (Ni), gold (Au) from the side close to the p-type layer 12 and the p contact electrode 121. ) Are stacked in this order.
The n-contact electrode 130 has a laminated structure of vanadium (V) and gold (Au).
The insulating protective film 40 is made of silicon nitride (Si ₃ N ₄ ).

  The group III nitride compound semiconductor device (blue LED) 1000 of FIG. 1 was manufactured as follows. The process drawing (cross-sectional view) at this time is shown in FIG. A to FIG. Indicated by S. FIG. E, FIG. I, FIG. K and FIG. M are process diagrams, respectively. D, FIG. H, FIG. J and FIG. It is a partial enlarged view of L.

An epitaxial layer 10 was formed by epitaxially growing an n-type layer 11 and a p-type layer 12 in this order on an epitaxial growth substrate 100 made of sapphire having a thickness of 500 μm (FIG. 2.A). The light emitting region L is formed with an MQW structure. In A, it is indicated by a thick broken line.
Next, the 1st groove | channel tr-1 used as the air hole at the time of laser lift-off was formed with the dicer. The first trench tr-1 was formed by removing the total thickness of the p-type layer 12 and the n-type layer 11 of about 4 μm and the depth of the epitaxial growth substrate 100 of about 10 μm. The width of the first groove tr-1 was about 20 μm (FIG. 2.B).
Next, an Ag—Pd—Cu alloy layer is formed on the entire surface by a sputtering apparatus, a resist mask is formed, unnecessary portions of the Ag—Pd—Cu alloy layer are removed, the resist mask is removed, and then the alloy is heated. As a result, a p-contact electrode 121 was formed (FIG. 2.C).

Next, a Ti layer, a TiN layer, a Ti layer, a Ni layer, and an Au layer were sequentially formed on the entire surface by a sputtering apparatus. These five layers are collectively shown as a conductive layer 122. The TiN layer, which is a compound layer, needs to be implemented by a sputtering apparatus, but the subsequent Ti layer, Ni layer, and Au layer may be formed by vapor deposition.
Further, an AuSn layer and an Au layer were formed on the entire surface as the solder layer 125 by a resistance heating vapor deposition apparatus. The final formed Au layer is a protective film from oxidation of tin (Sn) and others. (Fig. 2.D)
Here, even if the conductive layer 122 and the solder layer (solder layer) 125 may cover the first groove tr-1, the first groove tr-1 is ensured to communicate with the outside as an air hole. Or communication is possible at the time of laser irradiation during laser lift-off. In fact, FIG. As shown in E, the conductive layer 122 and the solder layer (solder layer) 125 can be formed thickly at the bottom of the first trench tr-1, but they are not formed on the side wall or are extremely thin even if formed. Therefore, the position where nitrogen generated at the interface 11sf of the n-type layer 11 with the epitaxial growth substrate 100 should be discharged to the first trench tr-1 (vnt in FIG. 2.E) is at the time of laser lift-off. The nitrogen gas is easily removed and the generated nitrogen gas can be easily discharged.

Next, a conductive layer 222 made of a Ti layer, a Ni layer and an Au layer and a solder layer 225 made of an AuSn layer and an Au layer are formed on the entire surface of the support substrate 200 made of silicon having a thickness of 500 μm by a resistance heating vapor deposition apparatus. . The final formed Au layer is a protective film from oxidation of tin (Sn) and others.
In this way, the epitaxial growth substrate 100 having the epitaxial layer and the support substrate 200 are joined with the solder layers (solder layers) 125 and 225 facing each other. The solder layers (solder layers) 125 and 225 are low melting point alloy layers. The heating temperature was 320 ° C., and the pressure was 196 kPa (about 2 atm, 2 kgf / cm ² ) (FIG. 2.F).
At this time, the two Au thin films between the two AuSn layers are absorbed by the AuSn layer and become one AuSn layer. Hereinafter, an integrated solder layer (solder layer) 125 and 225 is shown as a solder layer (solder layer) 50 (FIG. 2.G).

Next, laser lift-off is performed. The thin film portion is decomposed by irradiating the n-type layer 11 of the epitaxial layer near the interface 11sf with the epitaxial growth substrate 100 made of sapphire. At this time, the laser irradiation region (shot area) was a square region having a side of 2 mm including 16 square chips formed at a pitch of 500 μm. Thus, FIG. In G, the thin film portion of the n-type layer 11 in the vicinity of the interface 11sf with the epitaxial growth substrate 100 made of sapphire was decomposed to break the bonds, and the epitaxial growth substrate 100 was peeled off (FIG. 2.H). Since the first groove tr-1 communicated with the outside of the wafer, even if nitrogen gas is generated, the nitrogen gas is immediately discharged to the outside of the wafer through the first groove tr-1, and the epitaxial layer 10 is irradiated by laser irradiation. The epitaxial growth substrate 100, the support substrate 200, and the conductive layers formed therebetween are subjected to a small load. For this reason, it was finally confirmed that no peeling or cracking occurred.
At this time, the bottom surface and part of the side surface of the first groove tr-1 are formed on the sapphire substrate 100, and the bottom surface of the first groove tr-1 that is a part of the sapphire substrate 100 The conductive layer 122 and the solder layer (solder layer) 125 formed on the side surfaces were removed together with the sapphire substrate 100 (a partially enlarged view of FIGS. 2.I and 2.H).

Next, the outer peripheral portion of the chip of the epitaxial layer 10 was removed by dry etching using a mask to form a second trench tr-2 (FIG. 2.J).
At this time, SiO ₂ was formed by CVD as an etching mask and used as a predetermined shape. At this time, a part of the side surface of the first trench tr-1 is formed in the epitaxial layer 10 including the n-type layer 11 and the p-type layer 12, and is a part of the epitaxial layer 10. The conductive layer 122 and the solder layer (solder layer) 125 (inside the broken line ellipse indicated by the symbol M in FIG. 2.I) formed on the side surface of the first groove tr-1 together with the epitaxial layer 10 It was removed (Figure 2.K).

Next, in order to form the insulating protective film 40, SiN was formed on the entire surface by CVD (FIG. 2.L). At this time, the insulating protective film 40 made of SiN is once deposited also on the bottom of the first groove tr-1 on the solder layer (solder layer) 50 side (FIG. 2.M).
Next, the insulating protective film 40 made of SiN was removed by dry etching except the outer peripheral portion of each element, which was a necessary portion, to expose the surface 11f of the n-type layer 11 (FIG. 2.N). The surface 11f of the n-type layer 11 is a so-called (000-1) plane or -c plane and is easily etched.
Therefore, the surface of the n-type layer 11 of the wafer was immersed in an aqueous potassium hydroxide solution (KOHaq) having a concentration of 1 mol / L (1M) and left at 60 ° C. to form an uneven surface 11s (FIG. 2.O).
Next, using a resist mask, an n-electrode 130 was formed by stacking V and Au in a desired region (FIG. 2.P).

Next, the back surface of the support substrate 200 made of silicon was polished to a thickness of 120 μm (FIG. 2.Q).
A conductive layer 232 made of a Ti layer, a Ni layer, and an Au layer and a solder layer (solder layer) 235 made of an AuSn layer and an Au layer were deposited on the polished surface of the support substrate 200 made of silicon (FIG. 2.R). The final formed Au layer is a protective film from oxidation of tin (Sn) and others. Note that the solder layer (solder layer) 235 may not be formed.
Next, the support substrate 200 was cut using a laser (FIG. 2. S). FIG. The inside of the two broken lines indicated by C in S was decomposed and melted by a laser to separate each element. Thus, a group III nitride compound semiconductor device (blue LED) 1000 of FIG. 1 was obtained. The group III nitride compound semiconductor device (blue LED) 1000 thus obtained has an extremely high pass rate of 95% among chips obtained from one epitaxial growth substrate 100 (support substrate 200). Yield rate was shown.

In the first embodiment, FIG. J and its enlarged view, FIG. As indicated by K, when the second trench tr-2 was formed, the side surface of the epitaxial layer 10 forming the first trench tr-1 was also removed. When the second trench tr-2 is formed, the side surface of the epitaxial layer 10 forming the first trench tr-1 is left, and the first trench tr-1 is cut in the cutting process of the support substrate 200. It is good also as removing the structure of. This is referred to as Example 2 in FIG. A and FIG. A description will be given using B.
FIG. A is shown in FIG. Fig. 2 is an enlarged view of J. It is an enlarged view of 1 process of the present Example corresponding to K. FIG. In the first embodiment, when the second groove tr-2 is formed, the side surface of the epitaxial layer 10 forming the first groove tr-1 is also removed, so that the conductive layer 122 and the solder layer (solder layer) 125 are removed. FIG. 2 shows that the portion (inside the broken line ellipse indicated by the symbol M in FIG. 2.I) formed on the side surface of FIG. I and FIG. K. In the present embodiment, when the second groove tr-2 is formed, the side surface of the epitaxial layer 10 forming the first groove tr-1 is not removed, so that the conductive layer 122 and the solder layer (solder layer) 125 are not removed. The portion formed on the side surface (inside the broken line ellipse indicated by the symbol M in FIG. 2.I) is not removed (FIG. 3.A). For this implementation, a portion covering the first groove tr-1 may be formed as an etching mask formed prior to the etching for forming the second groove. The advantage of this embodiment is that the first groove tr-1 is covered with a mask during dry etching. Therefore, if the first groove tr-1 is not covered with a mask, a metal piece that may not be decomposed and removed (see FIG. 2. To prevent the epitaxial layer from being short-circuited by I) inside the broken-line ellipse indicated by the symbol M. In addition, metal pieces remain in the etching chamber, and internal metal contamination is reduced.
After the insulating protective film is formed, in the supporting substrate cutting step, FIG. As shown in B, the inside of the two broken lines indicated by C is disassembled with a laser and separated into each element.

(Modification)
For example, in the support substrate cutting step, laser irradiation for cutting (separation) may be performed a plurality of times. For example, FIG. 4 conceptually shows that the inside of the broken ellipse is decomposed or melted by laser irradiation. As shown in FIG. 4, it is preferable to arrange a plurality of broken-line ellipses so that a necessary range is decomposed or melted.
Advantages of the present technology include omission of thinning of the support substrate 200 prior to the support substrate cutting step in the first embodiment. Alternatively, when the first groove formation performed by the dicer in Example 1 is performed by laser irradiation, the laser irradiation in the supporting substrate cutting step is adjusted to the same light collection degree and output as in the first groove formation. It is also possible.

Sectional drawing which shows the structure of the group III nitride compound semiconductor element (blue LED) obtained by the manufacturing method which concerns on this invention. Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on this invention. Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on this invention. Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on this invention. Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on this invention. FIG. The elements on larger scale of process drawing of D (sectional drawing). Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on this invention. Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on this invention. Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on this invention. FIG. The elements on larger scale of process drawing of H (sectional drawing). Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on this invention. FIG. J is a partially enlarged view (sectional view) of the process diagram of J. FIG. Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on this invention. FIG. The elements on larger scale of process drawing of L (sectional drawing). Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on this invention. Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on this invention. Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on this invention. Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on this invention. Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on this invention. Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on this invention. Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on Example 2. FIG. Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on Example 2. FIG. Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on a modification. Process drawing (sectional drawing) which shows 1 process of the manufacturing method which concerns on a prior art example. Process drawing (sectional drawing) which shows 1 process of the other manufacturing method which concerns on a prior art example.

1000: Group III nitride compound semiconductor device (blue LED)
100: Sapphire substrate (epitaxial growth substrate)
11: n-type layer L: light emitting region 12: p-type layer 121: p-contact electrode 122, 222, 232: conductive layer 125, 225, 235, 50: solder layer (solder layer)
130: n-electrode 200: silicon substrate (support substrate)
40: Insulating protective film made of SiN

Claims (10)

A group III nitride compound in which a heterogeneous substrate is used as an epitaxial growth substrate, a support substrate is bonded to the uppermost surface of an epitaxial layer made of a group III nitride compound semiconductor via a conductive layer, and then the epitaxial growth substrate is removed by laser lift-off. In a method for manufacturing a semiconductor element,
Prior to bonding with the support substrate, when reaching at least from the uppermost surface of the epitaxial layer formed on the epitaxial growth substrate to the interface between the lowermost surface of the epitaxial layer and the epitaxial growth substrate, and when bonded to the support substrate, A first groove forming step of forming a first groove acting as an air hole communicating with the outside of the wafer;
A second groove forming step of forming a second groove for separating the epitaxial layer for each chip by removing the epitaxial layer corresponding to the outer periphery of each chip after peeling off the epitaxial growth substrate by laser lift-off;
An insulating protective film forming step of forming an insulating protective film that at least completely covers an outer peripheral side surface of the epitaxial layer of each chip exposed in the second groove forming step;
A method of manufacturing a group III nitride compound semiconductor device, comprising: a support substrate cutting step of cutting the support substrate to separate each chip. 2. The method for producing a group III nitride compound semiconductor device according to claim 1, wherein a contact electrode is formed on the uppermost surface of the epitaxial layer after the first groove forming step. Conductive layer formed on the epitaxial growth substrate side of the conductive layer, prior to bonding the epitaxial layer formed on the epitaxial growth substrate to the support substrate, to cover the contact electrode, said top surface of said epitaxial layer The method for producing a group III nitride compound semiconductor device according to claim 2, wherein the group III nitride compound semiconductor device is formed over the entire surface . The method for manufacturing a group III nitride compound semiconductor device according to any one of claims 1 to 3, wherein the first groove forming step is performed by a dicer. 4. The method of manufacturing a group III nitride compound semiconductor device according to claim 1, wherein the first groove forming step is performed by dry etching. 5. 4. The method of manufacturing a group III nitride compound semiconductor device according to claim 1, wherein the first groove forming step is performed by decomposing the epitaxial layer by laser irradiation. 5. . The method for producing a group III nitride compound semiconductor device according to claim 1, wherein the second groove forming step is performed by dry etching. The group III nitride according to any one of claims 1 to 7, wherein in the second groove forming step, the epitaxial layer that has formed the side surface of the first groove is also removed. For manufacturing a semiconductor compound semiconductor device. In the second groove forming step, a mask that covers the first groove is formed so as not to destroy the structure of the first groove, and in the supporting substrate cutting step, the first groove is formed. The method for producing a group III nitride compound semiconductor device according to any one of claims 1 to 7, wherein the structure is removed. The method of manufacturing a group III nitride compound semiconductor device according to claim 1, wherein the supporting substrate cutting step is performed by laser irradiation.

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