JP5004722B2 - Method for manufacturing organic EL panel and method for manufacturing organic EL display - Google Patents

Description

  The present invention relates to a method for manufacturing an organic EL panel and a method for manufacturing an organic EL display, and more particularly to a technique for obtaining a large number of display areas.

  The organic EL panel has features such as thinness, wide viewing angle, low power consumption, and excellent moving image display characteristics. Conventionally, an organic EL panel is configured by arranging a large number of pixels in a matrix. .

  Such an organic EL panel can be mass-produced by forming a plurality of display regions on an insulating substrate as a mother substrate and cutting the insulating substrate so as to cut out the plurality of display regions.

  Since the insulating substrate is generally made of glass, static electricity may accumulate in the insulating substrate during the manufacturing process, and the static electricity may be discharged by wirings or circuits constituting the display region and may be destroyed.

In the field of liquid crystal displays, a short circuit line is separately provided between the outer periphery of the liquid crystal elements and between the liquid crystal elements so that the liquid crystal elements are not destroyed by electrostatic discharge, and the adjacent short lines are connected to each other. A technique has been proposed in which the liquid crystal elements to be operated have the same potential and suppress electrostatic discharge (see Patent Documents 1 to 4 below).
JP-A-2-242229 JP-A-5-232511 JP 2006-284870 A Japanese Patent No. 3223490

  However, the short-circuit lines of Patent Documents 1 to 4 are formed in a line shape between the outer periphery of the liquid crystal elements and between the liquid crystal elements. When the short-circuit line is formed in a line shape, it is difficult to sufficiently protect against static electricity accumulated on the insulating substrate because the electrostatic capacity capable of accumulating static electricity is smaller than that formed in a flat plate shape. . If static electricity is accumulated on the insulating substrate beyond the electrostatic capacity of the short-circuit wire, electric discharge is likely to occur, and as a result, the display area may be destroyed and the manufacturing yield may be reduced.

  In addition, since the short circuit is formed on these mother substrates so as to surround the outer periphery of the display region, the mother substrate must be cut so as to cut off the short-circuit line in order to cut out the display region from the mother substrate. I must. As a result, there is a problem that the cutting process becomes complicated and the manufacturing process becomes complicated.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an organic EL panel manufacturing method capable of improving the manufacturing yield and simplifying the manufacturing process.

  The manufacturing method of the organic EL panel of the present invention includes a plurality of display areas formed on an insulating substrate, and the adjacent display areas are connected to each other through a flat common electrode included in each display area. A step of preparing a substrate connected to each other and having the plurality of display regions formed at the same potential; and a step of cutting the insulating substrate along an outer periphery of the display region to divide adjacent common electrodes And.

Further, in the method for producing an organic EL panel of the present invention, the display area is rectangular, and a short circuit line is formed in a line along at least one side of the outer periphery of the display area on the insulating substrate. The short-circuit lines in adjacent display areas are directly connected to each other, and a part of the common electrode is directly connected to the short-circuit line, and the short-circuit line is cut in the dividing step. Features.
Further, the organic EL panel manufacturing method of the present invention is formed along a plurality of cutting regions formed on the insulating substrate, a display region formed inside each of the cutting regions, and one end of the display region. In the step of preparing a substrate provided with a short-circuit line, and in the adjacent display regions, one display region straddles the cut region and is connected to the short-circuit line formed in the other cut region. And the adjacent display areas are set at the same potential, and the adjacent display areas are cut along the outer periphery of the cutting area, and the insulating substrate is provided. To do.

  Moreover, the manufacturing method of the organic EL display according to the present invention includes a plurality of display areas formed on an insulating substrate, and the adjacent display areas are connected to each other through a flat common electrode included in each display area. Preparing a substrate connected to each other and having the plurality of display regions formed at the same potential, cutting the insulating substrate along the outer periphery of the display region, and separating adjacent common electrodes from each other Then, a step of cutting out the organic EL panel and a step of mounting a driving IC on the organic EL panel are provided.

  According to the present invention, in the manufacturing process of the organic EL panel, it is possible to suppress discharge of static electricity accumulated on the insulating substrate, simplify the cutting process of the insulating substrate, improve the manufacturing yield, and improve the manufacturing process. It is possible to provide a method of manufacturing an organic EL panel capable of shortening

  The organic EL panel according to the present invention is used for home appliances such as a television, and electronic devices such as a mobile phone or a computer device. Such an organic EL panel will be described with reference to the drawings. FIG. 1 is a plan view of a mother substrate as a substrate according to an embodiment of the present invention. FIG. 2 is a plan view showing a simplified display area according to the embodiment of the present invention.

  As shown in FIG. 1, a plurality of display areas 2 are formed in a matrix on a rectangular mother substrate 1. The mother substrate 1 is made of, for example, an insulating substrate such as glass or plastic, and one side is set to, for example, 30 cm or more and 200 cm or less. In the present specification, a piece of the mother substrate 1 after cutting the mother substrate 1 along the outer periphery of the display region 2 is referred to as an organic EL panel 3. The organic EL display includes such an organic EL panel 3 and a drive IC mounted on the organic EL panel 3. The line L shown in FIG. 1 is a virtual line along the outer periphery of the display area 2 that cuts the mother substrate 1, and the area surrounded by the line L is the cutting area of the present invention. The display area 2 includes a plurality of pixel circuits 5 each including a driver element 15 and a switching element 16 as will be described later.

  A short-circuit line 4 made of a conductive material such as aluminum or copper is formed along the outer periphery of the mother substrate 1 and between the display regions 2. The short-circuit line 4 is formed in a line shape and is electrically connected to a scanning line 8 described later. In addition, the width | variety of the short circuit wire 4 is set to 50 micrometers or more and 3 mm or less, for example.

  Here, the reason why the short-circuit wire 4 is provided will be described. In the manufacturing process from the formation of the plurality of display regions 2 on the mother substrate 1 to the cutting of the mother substrate 1, the mother substrate 1 is an insulating substrate. Will occur. The driver element 15 and the switching element 16 included in the pixel circuit 5 have low resistance to static electricity. When the static electricity is discharged, dielectric breakdown occurs in the driver element 15 and the switching element 16. Electrical characteristics may be partially or fully degraded. Therefore, by providing the short-circuit line 4 on the mother substrate 1 and electrically connecting the scanning line 8 and the short-circuit line 4, electrostatic discharge generated on the mother substrate can be suppressed.

  As shown in FIG. 2, pixels are arranged in a matrix in the central region of the organic EL panel 3, and a pixel circuit 5 is provided for each pixel. The display area 2 is connected to a plurality of pixel circuits 5 and signal lines 6, connected to a signal line driving circuit 7 for supplying a luminance signal to the plurality of pixel circuits 5, and a scanning line 8. A scanning line driving circuit 10 for supplying a scanning signal for selecting the pixel circuit 5 for supplying the pixel circuit 5 to the pixel circuit 5, and a current to the light emitting element 11 provided in the pixel circuit 5 via the power supply line 12. And a power line drive circuit 13 connected to an earth line 9 functioning as a ground. Note that drive ICs such as the signal line drive circuit 7, the scan line drive circuit 10, and the power supply line drive circuit 13 are mounted on the organic EL panel 3 after cutting the mother substrate 1.

  Further, the signal line driving circuit 7, the scanning line driving circuit 10, and the power supply line driving circuit 13 for driving the display area 2 are installed at the end of the organic EL panel 3. Note that one side of the organic EL panel 3 is set to, for example, 2 cm to 50 cm.

  FIG. 3 is an example of a pixel circuit included in each pixel arranged in a matrix on the panel. As shown in FIG. 3, the pixel circuit 5 includes a light emitting element 11 whose positive side (anode side) is connected to the power supply line 12, a drain electrode connected to the negative side (cathode side) of the light emitting element 11, and a source electrode. Is connected to the ground line 9 which is a ground, the drain electrode is connected to the gate electrode of the driver element 15 made of TFT, the source electrode is connected to the signal line 6, and the gate electrode is the scanning line 8. And a switching element 16 made of a TFT connected to the TFT. The capacitor 14 is an element for charging or discharging the write voltage from the signal line 6.

  Here, the light emitting element 11 has a mechanism for emitting light by current injection. The light emitting element 11 has a structure including at least an anode layer and a cathode layer formed of a conductive material having a low resistivity, and a light emitting layer between the anode layer and the cathode layer, and is injected into the light emitting layer. It has a function of generating light by recombination of the generated holes and electrons.

  An outline of the operation of the pixel circuit 5 will be described. When the potential of the scanning line 8 is set to a high level, the switching element 16 is turned on and becomes conductive. When the potential written to the signal line 6 is applied, the capacitor 14 is charged or discharged, and a predetermined potential is written to the gate electrode of the driver element 15. On the other hand, when the potential of the scanning line 8 is set to a low level, the switching element 16 is turned off and does not conduct, and the scanning line 8 and the switching element 16 are electrically disconnected. 14 is held stably.

  Then, the current flowing through the driver element 15 and the light emitting element 11 has a value corresponding to the gate-source potential of the driver element 15, and the light emitting element 11 continues to emit light with a luminance corresponding to the current value. That is, in the pixel circuit 5 shown in FIG. 3, once the potential is written, the light emitting element 11 continues to emit light with a predetermined luminance until the next writing is performed.

  Next, the structure of the display area 2 constituting such a pixel circuit 5 will be described. FIG. 4A is a cross-sectional view showing a cross-sectional structure of the display area according to the embodiment of the present invention. FIG. 4B is a plan view showing a planar structure of an anode layer as a common electrode included in the display region according to the embodiment of the present invention. FIG. 4A shows a cross-sectional structure of one pixel in the display area.

  As shown in FIG. 4A, in the display region 2, a conductive circuit layer 18 having a driver element 15 and a switching element 16 is formed on an insulating substrate 17 made of the same material as the mother substrate 1. Further, an insulating film 19 made of, for example, silicon nitride or silicon oxide is formed on the circuit layer 18 except for a part of the circuit layer 18. Further, in the circuit layer 18, the driver element 15 and the switching element 16 are TFTs, and the insulating film 19 is also formed in an uneven shape. In order to planarize the unevenness, a planarizing film 20 made of an organic material having an insulating property such as a novolac resin, an acrylic resin, an epoxy resin, or a silicon resin is formed on the insulating film 19. The thickness of the planarizing film 20 is set to 2 μm or more and 5 μm or less, for example.

  A contact hole 21 that penetrates the planarizing film 20 is formed on the planarizing film 20. The cross section of the contact hole 21 is formed in a taper shape in which the lower part is narrower than the upper part. Further, a contact electrode layer 22 made of a metal such as aluminum, copper, silver, gold, rhodium or neodymium, or an alloy thereof is formed from the inner peripheral surface of the contact hole 21 to the planarizing film 20.

  Further, the light emitting element 11 is formed on the planarizing film 20. The light emitting element 11 includes a first electrode layer 23 serving as an anode layer functioning as the power line 12, a charge injection layer 24 formed on the first electrode layer 23, and a light emitting layer formed on the charge injection layer 24. The organic light emitting layer 25 and a second electrode layer 26 as a cathode layer formed on the organic light emitting layer 25 are included.

  As shown in FIG. 4B, the first electrode layer 23 is formed on the planarization film 20 and is provided side by side with the contact electrode layer 22. The first electrode layer 23 can be made of the same material as that of the contact electrode layer 22 and is made of a conductive material having a high light reflectance. Thus, by forming the first electrode layer 23 from a conductive material having a high light reflectance, the light extraction efficiency can be improved in the top emission type light emitting element 11. The thickness of the first electrode layer 14 is set to, for example, 50 nm or more and 500 nm or less.

  The first electrode layers 23 in each pixel are directly connected to each other and have a function as a common electrode of the present invention. The common electrode is integrally formed except for the contact electrode layer 22 and a region surrounding the outer periphery of the contact electrode layer 22. The capacitance of the common electrode can hold a large amount of charge, that is, static electricity because the common electrode is not a line but a plate. Note that the length of one side of the first electrode layer 23 as a common electrode is set to, for example, 35 mm or more and 400 mm or less.

  An insulator 27 is formed on the first electrode layer 23 so as to expose a region where the light emitting element 11 is formed and a part of the contact electrode layer 222. The insulator 27 is interposed between the first electrode layer 23 and the second electrode layer 26 to prevent a short circuit therebetween. The insulator 27 is made of, for example, an organic insulating material such as phenol resin, acrylic resin, or polyimide resin, or an inorganic insulating material such as silicon nitride.

  On the insulator 27, a partition wall 28 is formed so as to surround a region where the light emitting element 11 is formed and a part of the exposed contact electrode layer 22, that is, the periphery of each pixel. The cross section of the partition wall 28 is narrower at the lower part than at the upper part, and is made of an organic insulating material such as phenol resin, acrylic resin, or polyimide resin.

  Next, each layer which comprises the light emitting element 11 formed on the 1st electrode layer 23 is demonstrated. The charge injection layer 24 is formed from the first electrode layer 23 to the insulator 27. The charge injection layer 24 is formed of, for example, N, N′-bis (3-methylphenyl)-(1,1′-biphenyl) -4,4′-diamine (TPD), 4,4′-bis [N- ( Aromatic diamine compounds such as naphthyl) -N-phenyl-amino] biphenyl (α-NPD), oxazole, oxadiazole, triazole, imidazole, imidazolone, stilbene derivative, pyrazoline derivative, tetrahydroimidazole, polyarylalkane, butadiene, and Starburst aromatics and amine compounds such as 4,4 ′, 4 ″ -tris (N- (3-methylphenyl) N-phenylamino) triphenylamine (m-MTDATA) can be used. The thickness of the charge injection layer 24 formed immediately above the electrode layer 23 is, for example, 10 nm or more and 50 nm or less. It has been set.

  The organic light emitting layer 25 may be a light emitting resin such as phthalocyanine, trisaluminum complex, benzoquinolinolato or beryllium complex, or a material containing an additive such as DCJTB, coumarin, quinacridone, styrylamine or perlin. it can. Note that a transport layer such as α-NPD or TPD, and an injection layer such as nickel oxide, titanium oxide, fluorocarbon, or CuPc can be interposed between the organic light emitting layer 25 and the second electrode layer 26. .

  The second electrode layer 26 extends from a conductive material that transmits light to the organic light emitting layer 25 to the insulator 27, and is directly connected to the contact electrode layer 22 from which the extended portion is exposed. The second electrode layer 26 is made of, for example, a transparent electrode such as ITO or IZO, platinum, gold, nickel, silver, copper, or an alloy thereof.

  Further, a protective layer 29 made of an inorganic material such as silicon nitride, silicon oxide, or silicon nitride carbide is formed so as to cover the light emitting element 11 formed in each pixel. The protective layer 29 seals the light emitting element 11 and protects the light emitting element 11 from moisture and outside air, has a light-transmitting function, and has a thickness of, for example, 100 nm to 5 μm.

  In addition, a sealing substrate 30 is formed on the insulating substrate 17 so as to face the light emitting element 11. The sealing substrate 30 is made of a transparent substrate, and for example, glass or plastic can be used. Further, a sealing material 31 is interposed between the insulating substrate 17 and the sealing substrate 30, and a plurality of pixels are sealed by the insulating substrate 17, the partition wall 28, the sealing substrate 30, and the sealing material 31. . The sealing material 31 can be made of a photo-curing or thermosetting resin such as an acrylic resin, an epoxy resin, a urethane resin, or a silicon resin. Preferably, a photocurable epoxy resin that is cured by irradiation with ultraviolet rays is employed.

  As described above, in the organic EL panel according to the embodiment of the present invention, before the mother substrate 1 is cut, the first electrode layers 23 are directly connected between the adjacent display regions 2. . Moreover, since a part of common electrode is directly connected with the short circuit wire 4, each display area 2 can be made into the same electric potential. Therefore, even if static electricity is generated in the mother substrate 1 during the manufacturing process, a high voltage is applied to the TFT even if charges due to static electricity enter the scanning line by short-circuiting the common electrode having a large electrostatic capacity. And the TFT is not destroyed.

  Further, in the organic EL panel according to the embodiment of the present invention, before the mother substrate 1 is cut, as shown in FIG. 1, display areas are arranged in a matrix form so as to obtain a large number of organic EL panels. A mounting area for mounting a driving IC such as the signal line driving circuit 7, the scanning line driving circuit 10, and the power line driving circuit 13 is provided at one end of each display area. Wirings such as signal lines 6 are routed in a mounting region where these driving ICs are mounted. Such wiring is connected to the short-circuit line 4 formed along one end of the adjacent display area, and the number of short-circuit lines is set to be between the adjacent display areas. .

  Temporarily, if the short-circuit line 4 is formed so as to surround the outer periphery of each display area as in the past, and a plurality of short-circuit lines are formed between adjacent display areas, the work of cutting out the display area from the mother substrate is as follows: It will be a difficult task. That is, unless the mother substrate is cut along the inner periphery of the short-circuit line, the display area cannot be cut out, and a process of separating all the short-circuit lines is required, which complicates the cutting process. In addition, since the distance between the short-circuit line and the display area is set short so as to obtain a large number of pieces, the positioning process of the location to be cut must also be fine-tuned over time and manufactured. The process becomes complicated. On the other hand, in the organic EL panel according to the embodiment of the present invention, in the adjacent display areas, one display area is connected to a short-circuit line formed in the other connection area, and between the adjacent display areas. Thus, the number of short-circuit wires can be reduced to one. And the display area which adjoins that one short circuit line can reduce the number of the short circuit lines on a mother board | substrate. As a result, it is possible to increase the number of display areas to be taken in large numbers on the mother board, and further reduce the number of processes for cutting out all short-circuit lines after cutting out the display areas, thereby shortening the manufacturing process. Can do.

  Further, as shown in FIG. 1, when the mother substrate is viewed in plan, one end of the common electrode in which no wiring such as the signal line 6, the scanning line 8, and the ground line 9 is interposed between the short-circuit line and the common electrode. The short-circuit line formed along the line is provided at a distance from the signal line and the like, and the short-circuit line and the wiring are not short-circuited by electrostatic discharge. There is no need for separation, and the manufacturing process can be further simplified. The remaining part of the short-circuit line formed at the end of the organic EL panel after cutting the mother substrate is directly connected to the common electrode, which functions as a ground, and the display area becomes electrically unstable. Never become.

  Below, the manufacturing method of the organic electroluminescent panel which concerns on embodiment of this invention is demonstrated. First, a mother substrate 1 as a substrate is prepared. The mother substrate 1 is an insulating substrate 17 before being cut, and a plurality of display regions 2 are simultaneously formed on the mother substrate 1. Each display region 2 is formed on the mother substrate 1 by using a conventionally known thin film forming technique such as a vapor deposition method, a CVD method, a spin coating method or a sputtering method, and a conventionally known thin film processing technique such as masking, photolithography or etching. A circuit layer 18 including a TFT and an insulating film 19 are formed for each pixel.

  Then, an uncured organic resin to be the planarizing film 20 is deposited using a conventionally known spin coating method so as to cover the circuit layer 18 and the insulating film 19. An exposure mask is placed on the organic resin, exposure development and baking are performed to expose a part of the circuit layer 18 and form a planarization film 20 having a contact hole 21 whose width is narrower than the upper part. .

  Next, a metal film that forms the first electrode layer 23 and the contact electrode layer 22 as a common electrode layer is formed on the planarizing film 20. The metal film is deposited on all the areas where the plurality of display areas 2 are formed on the mother substrate 1. Further, simultaneously with the formation of the metal film, the short-circuit line 4 is formed in a line shape between the outer periphery of the mother substrate 1 and the display areas 2. The short-circuit line 4 and a part of the metal film are formed by being directly connected.

  Then, the first electrode layer 23 and the contact electrode layer 22 are formed for each display region 2 by patterning the metal film using a conventionally known thin film processing technique. Further, an organic insulating material that can become the insulator 27 is deposited on the first electrode layer 23 and the contact electrode layer 22, and the patterned insulator 27 is formed using a conventionally well-known thin film processing technique.

  Next, a partition wall 28 having a narrower cross section than the upper part is formed on the insulator 27 using a conventionally known thin film processing technique. The partition wall 28 is formed so as to surround each pixel.

  Then, masking is performed so as to expose the region where the light emitting element 11 is formed, and the charge injection layer 24, the organic light emitting layer 25, and the second electrode layer 26 are sequentially formed by using a conventionally known vapor deposition method. The second electrode layer 26 is directly connected to the contact electrode layer 22. In this way, the light emitting element 11 can be formed for each pixel.

  Further, the protective layer 29 is formed so as to cover the light emitting element 11 using a conventionally known thin film forming technique. Then, a sealing substrate 30 having the same size as the mother substrate is disposed opposite to the insulating substrate 17 on which the light emitting element 11 is formed, and both are bonded via a seal 31. The operation of fixing the sealing substrate 30 to the insulating substrate 17 with the sealing material 31 is performed, for example, in an inert gas atmosphere such as nitrogen gas or argon gas or in a high vacuum, thereby sealing the insulating substrate 17 and the insulating substrate 17. It is possible to suppress moisture and outside air from being contained between the substrate 30 and the substrate 30. In this way, the mother substrate 1 having a plurality of display areas 2 can be manufactured. The plurality of display regions 2 are directly connected via the first electrode layer 23 as a common electrode, and are formed at the same potential.

  Since the mother substrate 1 is insulative before the mother substrate 1 on which the plurality of display regions 2 are formed, static electricity may be accumulated on the mother substrate 1 in the manufacturing process. The above-described mother substrate 1 has the first electrode layers 23 directly connected to each other, has a large capacitance, and is used as a short-circuit wiring, so that a high voltage is applied to the TFT due to static electricity. Can be effectively suppressed. As a result, the TFT can be effectively prevented from being destroyed, and the manufacturing yield can be improved.

  Then, the mother substrate 1 having a plurality of display regions 2 is cut using the laser cutter, for example, by cutting the line L along the outer periphery of the display region 2 between the insulating substrate 17 and the sealing substrate 30, and adjacent common electrodes Divide. At this time, the short-circuit line 4 formed along at least one side of the outer periphery of the display region 2 can be cut at the same time when the common electrode is cut to produce the organic EL panel 3.

  Then, a driving IC as the signal line driving circuit 7, the scanning line driving circuit 10, and the power supply line driving circuit 13 can be mounted on the cut organic EL panel 3 to manufacture an organic EL display.

  In addition, this invention is not limited to the above-mentioned form, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

It is a top view of the mother board concerning the embodiment of the present invention. It is a top view of the organic electroluminescent panel which concerns on embodiment of this invention. FIG. 3 is an electric circuit diagram of a pixel circuit according to an embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a light emitting element which concerns on embodiment of this invention, Comprising: (a) is sectional drawing of a light emitting element, (b) is a top view of the 1st electrode layer which is a common electrode.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mother board | substrate 2 Display area 3 Panel 4 Short circuit line 5 Pixel circuit 6 Signal line 7 Signal line drive circuit 8 Scan line 9 Ground line 10 Scan line drive circuit 11 Light emitting element 12 Power line 13 Power line drive circuit 14 Capacitor 15 Driver element 16 Switching element 17 Insulating substrate 18 Circuit layer 19 Insulating film 20 Planarizing film 21 Contact hole 22 Contact electrode layer 23 First electrode layer 24 Charge injection layer 25 Organic light emitting layer 26 Second electrode layer 27 Insulator 28 Partition 29 Protective layer 30 Sealing Stop board 31 Sealing material

Claims (3)

Among a plurality of display areas formed on an insulating substrate, the adjacent display areas are connected to each other via a flat common electrode included in each display area, and the plurality of display areas are connected to each other. Preparing a substrate formed at the same potential;
Cutting the insulating substrate along the outer periphery of the display area, and separating adjacent common electrodes;
Equipped with a,
The display area is rectangular, and on the insulating substrate, a line-shaped short-circuit line is formed along at least one side of the outer periphery of the display area, and the short-circuit lines in the adjacent display areas are directly connected to each other. As well as
A part of the common electrode is directly connected to the short-circuit line,
In the step of cutting, the short-circuit line is cut,
The organic EL panel , wherein the insulating substrate is cut so that a part of the short-circuit line remains directly connected to the common electrode at an end of the panel cut out by cutting the insulating substrate. Manufacturing method.
Preparing a substrate comprising a plurality of cutting regions formed on an insulating substrate, a display region formed inside each of the cutting regions, and a short-circuit line formed along one end of the display region; ,
In the adjacent display areas, one of the display areas straddles the cutting area and is connected to the short-circuit line formed in the other cutting area, and the adjacent display areas are set to the same potential. And
Cutting the insulating substrate along the outer periphery of the cutting area between the adjacent display areas;
With
The organic EL panel , wherein the insulating substrate is cut so that a part of the short-circuit line remains directly connected to the common electrode at an end of the panel cut out by cutting the insulating substrate. Manufacturing method.
A method for manufacturing an organic EL display, comprising a step of mounting a driving IC on the organic EL panel manufactured by the method for manufacturing an organic EL panel according to claim 1 .

Images