JP5076869B2 - Optical substrate manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a structure for connecting a light receiving/emitting element to an optical waveguide and an optical signal path changing component by using an inexpensive material and a simple process, and also to provide an inexpensive optical substrate having excellent connection characteristics and a method of manufacturing the optical substrate, using this structure. <P>SOLUTION: The optical substrate has: an insulation resin layer on the first face the electric wiring of which is patterned; the light receiving/emitting element which is provided on the first face of the insulation resin layer so that the light receiving/emitting face is directed to the side facing the first face of the insulation resin layer; an optical wiring; and the optical signal path changing component which connects the light receiving/emitting element and the optical wiring, wherein the positioning frame of the light receiving/emitting element is formed integrally with the optical signal path changing component. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to an optical substrate having electrical wiring and optical wiring, and a method for manufacturing the same.

  With the advancement of advanced information technology in recent years, the performance improvement of information processing devices such as routers and servers used for information communication has progressed remarkably, and further speeding up of communication signals is required in these devices. . In this speeding up, the communication quality of the electrical wiring in the electronic circuit or the electric circuit becomes an obstacle to improving the performance, so that this obstacle cannot be ignored in increasing the communication speed. Therefore, as a promising technology for solving problems that hinder high-speed communication, such as speeding up processing signals and reducing electrical noise, information can be transmitted and received at high transmission speeds using optical signals. The technology using optical wiring that can be used is attracting attention. In particular, in order to realize large-capacity optical interconnection using optical wiring, high density optical wiring and low loss connection are important, and various technical studies for high performance and cost reduction have been conducted. Yes.

  The optical signal is diffused when output from the light emitting element or the optical wiring. For this reason, it is necessary to connect the optical signal connection components at intervals as close as possible. Further, since the optical signal leaks and loses when the connection position of the optical connection is shifted, it is necessary to accurately connect the positions. In addition, since the optical waveguide for propagating the optical signal is provided in the horizontal direction in the substrate plane, it is necessary to convert the optical signal path by approximately 90 ° in order to input / output the optical signal to / from the light emitting / receiving surface of the light emitting / receiving element. is there.

  Conventionally, in order to mount these components with high accuracy, a mounting frame in which silicon or the like is etched is used to mount each component in the frame (see Patent Document 1). However, although such mounting is suitable for module manufacturing, there is a problem that the mounting density does not increase when applied to a high-density mounting substrate.

  In addition, a method has been reported in which a 90 ° mirror is formed on the end face of an optical waveguide, a light emitting / receiving element is mounted on a submount substrate, and the submount substrate is self-aligned (Patent Document 2). However, with this method, it is necessary to maintain each process of mounting / receiving element mounting accuracy, self-alignment mounting accuracy, and optical waveguide mounting accuracy with high accuracy, and there is a problem that yield decreases. In addition, a technique has been reported in which a mirror component is installed on a substrate and an optical waveguide and a light emitting / receiving element are mounted (Patent Document 3). However, with this method, high accuracy is required for mounting the mirror component, and there is a possibility that the mirror component is displaced or deformed when the light emitting / receiving element is mounted later.

JP 63-266407 A JP 2006-234850 A JP2002-82244

  The present invention has been made in view of the drawbacks of the prior art, and provides a structure in which a light emitting / receiving element, an optical waveguide, and an optical signal path conversion component are connected by an inexpensive material and a simple process. Accordingly, it is an object of the present invention to provide an optical substrate with low cost and good connection characteristics and a method for manufacturing the same.

  According to a first aspect of the present invention, there is provided an insulating resin layer having an electric wiring patterned on a first surface, and an insulating resin layer provided on the first surface of the insulating resin layer. A light emitting / receiving element arranged with the light emitting surface facing the first surface of the insulating resin layer, an optical wiring, and an optical signal path conversion component for connecting the light receiving / emitting element and the optical wiring; An optical substrate having a light receiving / emitting element positioning frame integrally formed with the optical signal path conversion component.

  A second invention is the optical substrate according to the invention of the optical substrate, wherein the optical wiring and the integrally molded component are arranged in a region where the insulating resin layer is removed by patterning.

  According to a third aspect of the present invention, in the optical substrate invention, the insulating resin layer is formed of a photosensitive insulating resin, and the optical wiring placement portion and the optical signal path conversion component placement portion are removed by patterning by photolithography. It is an optical substrate characterized by being made.

  According to a fourth aspect of the present invention, there is provided the optical substrate according to the above-described optical substrate, wherein the optical wiring includes an optical waveguide connected to the optical signal path conversion component and an optical fiber connected to the optical waveguide. It is.

  A fifth invention is the optical substrate according to the invention of the optical substrate, wherein at least the optical wiring and the light receiving and emitting elements on the optical substrate are covered with a mold resin.

The sixth invention is:
An insulating resin layer forming step of patterning the insulating resin layer on the metal layer to provide a removal region;
On the carrier film, an insulating resin substrate installation step in which the insulating resin layer surface is bonded to face the carrier film; and
Patterning the metal layer and forming a wiring pattern;
A step of arranging an integrally molded component comprising an optical signal path conversion component and a positioning frame of the light emitting and receiving element in the removal region;
A mounting step for mounting the light receiving / emitting element on the positioning frame and mounting the optical wiring in the removal region and connecting to the optical signal path conversion component, and mounting.
A carrier film removing step for removing the carrier film;
It is a manufacturing method of the optical board | substrate characterized by providing.
The seventh invention provides a method for producing the optical substrate,
A mold resin forming step of covering a part or the whole of the insulating resin layer with a mold resin is provided.

The eighth invention
An insulating resin layer forming step of patterning the insulating resin layer on the metal layer to provide a removal region;
On the carrier film, an insulating resin substrate installation step in which the insulating resin layer surface is bonded to face the carrier film; and
Patterning the metal layer and forming a wiring pattern;
A step of arranging an integrally molded component comprising an optical signal path conversion component and a positioning frame of the light emitting and receiving element in the removal region;
A step of arranging and mounting the light emitting / receiving element on the positioning frame, and placing a dummy film of an optical wiring in contact with the optical signal path conversion component in the removal region;
A mold resin forming step of covering at least the dummy film on the carrier film with a mold resin;
A film removal step of removing the carrier film and the dummy film;
An optical wiring arrangement step of arranging an optical wiring in a portion where the dummy film has been arranged;
It is a manufacturing method of an optical substrate provided.

A ninth invention is an invention of a manufacturing method of the optical substrate,
In the insulating resin layer forming step, the insulating resin layer is made of a photosensitive resin, and the removal region is formed by patterning the photosensitive resin by photolithography.

A tenth aspect of the invention is an optical component comprising the above optical substrate.
An eleventh aspect of the invention is an electronic apparatus comprising the optical substrate.

The present invention has the following effects.
According to the first invention, the optical signal path conversion component and the positioning frame of the light receiving and emitting element are integrally molded, so that the positioning of the light receiving and emitting element and the optical signal path converting component can be performed with high accuracy and ease. Is possible.

  According to the second invention, the arrangement portion of the optical wiring and the integrally molded component is removed by patterning in the insulating resin layer, so that the alignment of the optical wiring and the integrally molded component is easy, and the mounting is performed at a high density. Is possible.

  According to the third invention, since the insulating resin layer is formed of the photosensitive insulating resin, the film thickness can be reduced and can be easily controlled at the time of manufacture. The height of the lower surface of the light receiving / emitting element positioning frame 45b of the conversion component 45, that is, the height of the optical signal converting part 45a, and the thickness of the insulating resin layer, the electrical wiring, and the joint of the light receiving / emitting element of the solder bump 90 are added. Since it can match | combine, a connection with an electrical wiring becomes easy. In addition, since patterning can be performed with high accuracy by photolithography, each component can be aligned with high accuracy, so that an optical substrate capable of low-loss connection can be realized.

  According to the fourth invention, by disposing the optical waveguide and the optical fiber in the optical substrate, it becomes possible to mount both at the same time with high accuracy. Thereby, the optical connection efficiency is improved and the manufacturing cost is also reduced.

  According to the fifth aspect, the environmental reliability of the optical substrate is improved by molding the optical substrate with the molding resin.

According to the sixth invention, by manufacturing the optical substrate on the carrier film, the integrally molded component and the optical wiring are arranged in a carrier film shape, so that the lower surface of the optical substrate is flat with respect to the carrier film surface. This facilitates LGA mounting and electrical connector mounting on the lower surface of the optical substrate.
According to the seventh invention, the environmental reliability of the optical substrate is improved by molding the optical substrate with the molding resin.

  According to the eighth invention, it is possible to improve the environmental reliability of the optical substrate by covering the upper surface of the optical substrate with the mold resin as described above. By installing the dummy film and performing the molding, it is possible to prevent the optical waveguide from being damaged by the high temperature process of the molding process. In addition, it is possible to manufacture the optical substrate with high productivity by manufacturing the intermediate body of the electric circuit package excluding the optical wiring portion in advance.

  According to the ninth aspect, by using a photosensitive insulating resin for the insulating resin layer, the insulating resin can be patterned by photolithography by ultraviolet irradiation. Thereby, it becomes possible to model an optical wiring installation part and an optical signal path conversion component installation part with high accuracy, and an optical waveguide and an optical signal path conversion component can be mounted by external abutment alignment.

    By using an optical component or an electronic device provided with the optical substrate of the present invention, signals can be efficiently transmitted and received without being affected by noise.

<Optical substrate>
A cross-sectional view of the optical substrate according to the present invention is shown in FIG. 1 (A), and a plan view thereof is shown in FIG. 1 (B). In the optical substrate of the present invention, there is an insulating resin layer 11 having a wiring pattern 21 in which a metal layer is patterned on a first surface, and a light emitting / receiving element 60 is provided on the first surface of the insulating resin layer. The light emitting / receiving elements are positioned and arranged by the light emitting / receiving element positioning frame 45a. The light emitting / receiving element positioning frame 45a is integrally formed with the optical signal path conversion component 45b as shown in FIG. The light emitting / receiving element is optically connected to the optical signal converter 45b. Further, the optical signal path conversion component is optically connected to a connection portion of the optical wiring having the optical waveguide 50 and the optical fiber 55. The optical wiring and the integrally molded component are disposed in the region where the insulating resin layer is removed by patterning. Hereinafter, the optical substrate of the present invention will be described in detail.

  As shown in FIG. 3, the insulating resin layer 11 is patterned by removing a region corresponding to the integrally molded component 45 and the optical wiring. In the case of forming a multilayer substrate wiring, a via hole portion for establishing electrical connection between the wiring pattern formed on the first surface of the insulating resin layer and the back surface may be removed. When arranging a plurality of optical fibers in the optical wiring region, the insulating resin layer portions between the optical fibers may be independent, but these are held by the mold resin 70 or the carrier film. Arbitrary organic materials and inorganic materials can be selected for the insulating resin layer. Specifically, an acrylic material, a silicone material, a silicon wafer, a metal material, a glass material, a prepreg, a laminated plate material, and the like can be used, but it is particularly preferable that the material is formed of a photosensitive resin. This is because, as will be described later, by forming an insulating resin layer using a photosensitive resin, patterning can be performed with high accuracy, so that the optical waveguide and the optical fiber can be connected with high positional accuracy. Therefore, an optical substrate capable of low loss connection can be realized by the present invention. Examples of the photosensitive resin include a photosensitive polyimide resin, a photosensitive acrylic resin, a photosensitive epoxy resin, and a photosensitive epoxy acrylate resin obtained by polymerizing these.

  Further, the film thickness of the insulating resin layer 11 can be reduced if it is a photosensitive resin, and can be easily controlled during production. The film thickness of the insulating resin layer is not particularly limited, but by adjusting the film thickness of the insulating resin layer, the height of the lower surface of the light receiving and emitting element positioning frame 45b of the optical signal path conversion component 45, that is, the optical signal conversion unit 45a. Can be combined with the thickness of the insulating resin layer, the electric wiring, and the joint portion of the solder bump 90 on the light emitting / receiving element, so that the connection with the electric wiring is facilitated. This is because the thickness of the solder bump varies depending on the pitch of the electric wiring, and thus varies depending on the required electric wiring board. Therefore, it is preferable to control the film thickness of the insulating resin layer. Needless to say, it is necessary that the height of the light receiving and emitting element positioning frame is at least the height of the frame. The height of the light receiving / emitting element positioning frame, that is, the height of the optical signal converter is desirable because the optical substrate can be most highly densified when it matches the height of the optical waveguide. Therefore, in this case, it is desirable that the thickness of the insulating resin layer is not more than the thickness of the optical waveguide. For example, the thickness of the optical waveguide in the multimode is about 100 μm, and the thickness of the electric wiring is about 10 μm. Therefore, when the solder bump height is 40 μm, the thickness of the insulating resin layer is 50 μm. And

  As described above, the integrally molded component 45 includes the light receiving and emitting element positioning frame 45a and the optical signal path conversion component 45b. The light receiving / emitting element positioning frame has a shape substantially equal to the outer shape of the light receiving / emitting element and can be mounted with high accuracy by fitting the light receiving / emitting element into the light receiving / emitting element positioning frame. The optical signal path conversion component converts the traveling direction of the optical signal from the light receiving / emitting element to the optical wiring or from the optical wiring to the light receiving / emitting element. Conventionally, high-accuracy alignment has been required for mounting the light emitting / receiving element and the optical signal path conversion component. Therefore, in the present invention, the light receiving / emitting element positioning frame enables high-precision positioning mounting of the light receiving / emitting element, and the optical signal path conversion component is integrally formed with the light receiving / emitting element positioning frame, so that light receiving / emitting light is received in the mounting stage. Positioning to match the light emitting / receiving portion (input / output position of the optical signal) of the element with the optical signal path conversion position of a predetermined optical signal path conversion component becomes unnecessary. As a result, it is possible to manufacture an optical substrate capable of easily positioning and mounting the light emitting / receiving elements.

  The optical signal path conversion component 45b can use a structure such as a mirror, a grating, or a MEMS. As a material constituting the optical signal path conversion component, a polymer material, a metal material, or the like can be used. When a mirror structure is formed, metal deposition on the mirror surface, dielectric multilayer film deposition on the mirror surface Etc. can be selected. As described above, the height of the optical signal path conversion component preferably matches the thickness of the optical waveguide. If the height of the optical signal path conversion component is lower than the thickness of the optical waveguide, the lower surface of the light receiving and emitting element will be in contact with the optical waveguide, so that it cannot be joined by butt contact. When the signal path conversion component becomes high, the optical signal path conversion component becomes unnecessarily large, which hinders high density.

  The light receiving / emitting element positioning frame 45a is not particularly limited as long as the light receiving / emitting element can be fixed on the optical signal path conversion component. As a material for forming the light receiving / emitting element positioning frame, the same material as that of the optical signal path conversion component can be used. The integrally molded part is desirably molded using means such as die machining or cutting in order to improve the accuracy of external processing.

  The optical wiring includes at least an optical waveguide 50 optically connected to the optical conversion component 45 and an optical fiber 55 optically connected to the optical waveguide. Further, the optical wiring to be mounted on the optical substrate of the present invention may be configured so that only the optical waveguide portion is connected to the optical fiber outside the optical substrate. In this case, the optical waveguide portion of the insulating resin layer 11 is removed by patterning, and a cutout portion is formed at the edge of the insulating resin layer.

  As the optical waveguide 50, a general optical wiring optical waveguide composed of a core and a clad covering the outer periphery of the core can be used. As materials, polymer materials such as carbonate-based, epoxy-based, acrylic-based, imide-based, urethane-based and norbornene-based materials and inorganic materials such as quartz can be used. As the transmission mode, a single mode, a multi mode, a single multi mixed wiring, or the like can be employed.

  As the optical fiber 55, a general optical fiber can be used. Specifically, a quartz optical fiber, a polymer optical fiber, or the like can be used. In order to reduce the optical connection loss, it is desirable to match the optical waveguide 50 and the film thickness (or optical fiber diameter). Further, by matching the film thickness of the optical waveguide with the film thickness of the optical fiber, the lower surface of the insulating resin layer and the lower surface of the optical waveguide and the optical fiber become flat on the same plane as shown in FIG. The connector can be installed on the lower surface with high accuracy. Specifically, an LGA, a PGA, a small electrical connector, or the like can be installed.

  As the light emitting / receiving element 60, a single channel or a plurality of channels of optical elements can be used. Specifically, an edge-emitting LD, a surface-emitting LD, a surface-receiving PD, or the like can be used. The light receiving and emitting element 60 can be mounted by wire bonding or the like other than the flip chip mounting by the solder bump 90 as shown in FIG.

  Moreover, the control chip 40 of the light emitting / receiving element 60 can be mounted on the wiring pattern 21 as necessary. The control chip 40 can be mounted by wire bonding or flip chip mounting.

  Further, the transparent resin 80 can be filled in the light input / output surface interface between the optical path conversion product and the optical waveguide 50 and the gap between the optical waveguide 50 and the optical fiber 55 as necessary. As the transparent resin 80, a generally used polymer material can be used. Specifically, a carbonate material, an epoxy material, an acrylic material, an imide material, a urethane material, a silicone material, an organic material mixed with an inorganic filler, and the like can be used. However, the material is not limited thereto. It is desirable to use an optical resin having a refractive index equivalent to that of the optical waveguide 50 in order to eliminate the difference in refractive index at the interface. By filling the transparent resin 80, the optical loss at the connection portion between the light receiving and emitting element and the optical waveguide can be reduced, and the strength of the connection portion can be improved to obtain an optical substrate with high environmental reliability.

  Furthermore, by molding an arbitrary part on the substrate with the mold resin 70, the environmental reliability of the substrate and the mounted component can be improved. In this case, in order to prevent mold resin from entering the interface between the light emitting / receiving element 60 and the optical signal path conversion component 45b, it is desirable to fill the transparent resin 80 in advance.

  The optical substrate of the present invention is effective for electronic devices or optical components that involve a large amount of information input / output. Specific examples of electronic devices equipped with optical substrates include input and output of large information such as various electronic computers including notebook computers and large commercial computers, home game machines, recording / playback machines, televisions, and routers. Use in information / communication equipment is effective because it enables efficient signal transmission and reception without being affected by noise. In addition, specific examples of the optical component on which the optical substrate 1 is mounted include an optical interconnection (photoelectric wiring board), an optical connector, an optical coupler, an optical coupler, an optical switch, an optical splitter, or an optical transceiver, The same effect can be expected by mounting on optical components.

<Optical substrate manufacturing method>
Next, the manufacturing method of the optical board | substrate of this invention is demonstrated. In the following description, a case where a photosensitive resin is used for the insulating resin layer will be described.

  First, the insulating resin layer of the insulating resin film is patterned using the metal layer 20 that forms the wiring pattern and the film in which the insulating resin layer 10 is laminated, and the optical wiring installation part, the integrally molded part installation part, the insulation of the via hole region Remove the resin layer. As the metal layer for forming the wiring pattern, for example, a copper foil can be used. As the photosensitive resin used for the insulating resin layer, a photosensitive polyimide resin, a photosensitive acrylic resin, a photosensitive epoxy resin, a photosensitive epoxy acrylate resin obtained by polymerizing these, or the like can be used. As a photolithography process, exposure is performed using a mask corresponding to the pattern of the photosensitive resin as shown in FIG. 3, and development is performed to form an insulating resin layer (FIG. 4B).

  At this time, the thickness of the insulating resin layer 10 is made thinner than the thickness of the optical waveguide 50, and the total thickness of the insulating resin 10, the metal layer 20, and the mounting solder bump 90 is the same as the thickness of the optical waveguide 50. Things are desirable. As a result, the heights of the light emitting / receiving element and the optical waveguide are matched to each other and can be directly joined to each other.

  Next, the insulating resin surface is laminated on the carrier film 30 (FIG. 4C). A general laminating method can be used for bonding. For the carrier film 30, a commonly used polymer material can be used. Specifically, a carbonate material, an epoxy material, an acrylic material, an imide material, a urethane material, a silicone material, an organic material mixed with an inorganic filler, and the like can be used. However, the material is not limited thereto. Further, an ultraviolet peelable adhesive layer can be provided on the carrier film 30.

  By performing each process on the carrier film, the lower surface of the optical substrate can be made flat. Thereby, a connector can be installed with high accuracy on the lower surface of the optical substrate. Specifically, an LGA, a PGA, a small electrical connector, or the like can be installed. Further, since the insulating resin layer is held and fixed by the carrier film, the optical substrate can be stably mounted even when the insulating resin layer is thin.

  Next, the copper foil 20 is patterned to form a wiring pattern and a mounting pad (FIG. 4D). As a method for patterning the copper foil, a known metal processing method can be used. Specifically, a resist pattern is formed according to the wiring pattern and the mounting pad, and the wiring pattern is formed by etching. Further, if necessary, Ni, Au plating or solder resist printing may be performed.

  Further, as described above, a control chip for the light emitting / receiving element may be mounted as necessary (FIG. 5E). In this case, the control chip 40 of the light emitting / receiving element 60 can be mounted on the patterned copper foil 21. The control chip 40 can be mounted by wire bonding or flip chip mounting.

  Next, the integrally molded component 45 is mounted (FIG. 5F). Since the insulating resin layer 11 in the integrally molded component arrangement region is removed by patterning in the step of FIG. 4B, it is possible to easily and accurately align the region in accordance with the removal region.

  Next, the light emitting / receiving element 60 is mounted in alignment with the light emitting / receiving element positioning frame 45b of the integrally molded component 45 (FIG. 5G). For the mounting of the light emitting / receiving element and the wiring pattern, a method such as wire bonding can be used in addition to the flip chip mounting by the solder bump 90 as shown in the figure.

  Next, an optical waveguide and an optical fiber are mounted on the optical wiring installation portion from which the insulating resin layer has been removed (FIG. 4 (h)). At this time, since the insulating resin layer 11 is removed by patterning in the process of FIG. 4B as in the case of the integrally molded component, it is possible to easily and accurately align the area in accordance with the removal region of each optical wiring. Further, if the height of the optical waveguide and the height of the optical fiber match, the center positions of both core regions can be matched, so that optical connection can be facilitated. The order of the mounting process of the optical wiring and the light receiving / emitting element is not particularly limited, and each optical wiring may be mounted before mounting the light receiving / emitting element.

  Next, the entire substrate or an arbitrary portion can be molded with a molding resin (FIG. 5 (i)). As described above, the environmental reliability of the optical substrate can be improved by covering the optical wiring and the light emitting / receiving element with the mold resin. In this case, the carrier film can be finally peeled off with the mold resin to obtain the optical substrate 101 of the present invention (FIG. 5 (j)). In addition, when the ultraviolet peeling type adhesion layer is provided in the carrier film 30, the carrier film can be peeled by ultraviolet irradiation.

  As described above, the bottom surface of the optical substrate can be flattened by performing the manufacturing process of each optical substrate on the carrier film. This makes it possible to mount bumps on the lower surface of the optical substrate and to mount connectors and the like with high accuracy, and has the effect of increasing the number of choices for the electrical connection method of the optical substrate. Specifically, an LGA, a PGA, a small electrical connector, or the like can be installed. In addition, since the optical wiring and the optical signal path conversion component are arranged so as to coincide with the removal region of the insulating resin layer, and the optical signal path conversion portion and the light receiving and emitting element are positioned by the integrally molded component, Can be mounted with high accuracy.

  Moreover, the optical board | substrate of this invention can be produced using a dummy film instead of FIG.5 (h)-(j). In this case, after mounting the light emitting / receiving element (FIG. 6G), the dummy film 53 and the dummy film 58 having the same height as the optical waveguide and the optical fiber are arranged at the arrangement positions of the optical waveguide and the optical fiber, respectively. (FIG. 6 (h)). Each dummy film may be separate or integrated. Further, a dummy film may be disposed before mounting the light emitting / receiving element. As the dummy films 53 and 58, polymer films can be used. Specifically, a carbonate material, an epoxy material, an acrylic material, an imide material, a urethane material, a silicone material, an organic material mixed with an inorganic filler, and the like can be used. However, the material is not limited thereto. Since the heating process at the time of molding is passed through the dummy film, it is desirable to use a film that can withstand the heating process. Further, by providing a heat-resistant adhesive layer on the upper and lower surfaces of the dummy film, it is possible to prevent penetration of the mold resin.

  Next, before the optical substrate is molded with a molding resin, it is preferable to fill the interface between the light emitting / receiving surface of the light emitting / receiving element 60 and the optical signal path conversion component 45b with a transparent resin as shown in FIG. 6 (i). This is because, as described above, the mold resin can be prevented from entering between the light emitting / receiving element and the optical waveguide, and the optical loss at the connection portion between the light receiving / emitting element and the optical waveguide can be reduced. Similarly, transparent resin is also filled at the interface between the optical signal path conversion component and the dummy film corresponding to the optical waveguide placement location, the dummy film corresponding to the optical waveguide placement location, and the dummy film equivalent to the optical fiber placement location. Also good.

  Next, the entire substrate or an arbitrary portion is molded with a molding resin (FIG. 6 (j)), and the carrier film and each dummy film are peeled off (FIG. 6 (k)). By covering at least the dummy film with the mold resin, a portion where the dummy film is peeled is formed as an arrangement portion of the optical wiring. When the ultraviolet peelable adhesive layer is provided on the carrier film 30, the carrier film can be peeled off by ultraviolet irradiation as described above.

  Through the above steps, the electric circuit package 100 in which the portions other than the optical waveguide and the optical wiring of the optical fiber are mounted is manufactured. The electric circuit package can be formed in a substantially rectangular shape in plan view. Therefore, if an insulating resin substrate 20 made of a material that can be applied to a known roll-to-roll manufacturing apparatus or the like is selected, an intermediate body of the electric circuit package is continuously formed in the horizontal direction to collectively form a resin mold. In addition, a large number of electric circuit packages can be manufactured by cutting each unit package. That is, it is possible to manufacture an optical substrate with high productivity by manufacturing an electrical circuit package excluding an optical wiring portion made of an optical waveguide and an optical fiber as a previous stage.

  Finally, the optical substrate 101 of the present invention can be manufactured by fitting and joining the optical waveguide and the optical fiber to the place where the dummy film is removed (FIG. 6 (l)). In this manufacturing method, since the arrangement portion of the optical waveguide and the optical fiber is a groove-shaped opening due to the pattern of the insulating resin layer and the mold resin, the connection between the optical waveguide and the light emitting and receiving element, the optical waveguide and the optical fiber And can be mounted with high accuracy. In addition, since the molding is performed before the optical waveguide is mounted, the optical waveguide can be prevented from being damaged due to a high temperature process in the molding process.

  Examples of the present invention will be described below, but the present invention is not construed as being limited thereto. For example, although the optical waveguide of the optical substrate is described as one layer, it is not always necessary to have one layer. In the following description, the optical waveguide is described as multimode, but it is not necessarily required to be multimode.

<Example 1>
First, as a photosensitive insulating material, 52 parts by weight of bisphenol A type epoxy acrylate (Lipoxy VR-90: Showa High Polymer) and 15 parts by weight of phthalic anhydride are stirred in a propylene glycol monomethyl ether acetate solvent at 110 ° C. for 30 minutes for alkali development. Type photosensitive insulating resin varnish raw material was prepared. Furthermore, 50 parts by weight of the alkali-developable photosensitive insulating resin varnish raw material, 17 parts by weight of an alicyclic epoxy compound (EHPE3150: Daicel Chemical), 30 parts by weight of a photocurable epoxy resin (Cyclomer M100: Daicel Chemical), Propylene glycol monomethyl ether acetate solvent was added to 3 parts by weight of a photoinitiator (LucirinTPO: BASF) and dispersed in a continuous horizontal sand mill for about 3 hours to prepare an alkali development type photosensitive insulating resin varnish.

  Next, the alkali development type photosensitive insulating resin varnish is applied onto the copper foil with a slit coater and dried at 70 ° C. for 20 minutes to form a semi-cured photosensitive insulating resin layer having a thickness of about 50 μm. A foil-coated photosensitive insulating resin was produced.

Next, a photomask was brought into close contact with the photosensitive insulating resin layer 10, exposed to 500 mJ / cm ² with an ultra-high pressure mercury lamp, and cured with ultraviolet rays. Thereafter, development with about 5% organic amine-based alkaline aqueous solution, washing with water, and sufficient drying in a 90 ° C. oven were performed to obtain a patterned insulating resin layer 11.

  Next, the insulating resin layer 11 was laminated on the carrier film 30 (PET: manufactured by Toyo Ink).

  Next, an etching resist pattern 25 was formed on the copper foil 20, and the copper foil was etched to obtain a patterned copper foil (wiring pattern 21).

  Next, a control chip 40 (VCSEL driver chip: manufactured by HELIX AG) was mounted on the wiring pattern 21, and electrical connection was performed by wire bonding.

  Next, an integrally molded part 45 (stainless steel, cut product) was placed on the carrier film from which the insulating resin was removed by patterning. The installation position alignment performed abutment alignment using the outer shape of the insulating resin layer 11.

  Next, an optical waveguide film 51 (multimode epoxy optical waveguide film: manufactured by NTT-AT) was placed on the carrier film from which the insulating resin was removed by patterning. The installation position alignment performed abutment alignment using the outer shape of the insulating resin layer 11.

  Next, an optical fiber 56 (multimode quartz-based bare core optical fiber: manufactured by Fujikura) was placed on the carrier film from which the insulating resin was removed by patterning.

  Next, the light emitting element 61 (4ch VCSEL: made by ULM) was mounted on the copper foil 21 and the optical signal path conversion component and the integrally formed light receiving and emitting element alignment frame 45. Further, a micro solder bump 90 was used for connection between the optical element 61 and the copper foil 21.

  Next, the optical film 100 was produced by peeling the carrier film 30.

  As a result of evaluating the optical characteristics of the produced optical substrate, a stable light output of 0.9 to 1.1 mW was confirmed in each channel.

<Example 2>
First, in the same manner as in Example 1, after preparing an alkali development type photosensitive insulating resin varnish, a photosensitive insulating resin with a copper foil on one side was produced using the varnish.

Next, a photomask was brought into close contact with the photosensitive insulating resin layer 10, exposed to 500 mJ / cm ² with an ultra-high pressure mercury lamp, and cured with ultraviolet rays. Thereafter, development with about 5% organic amine-based alkaline aqueous solution, washing with water, and sufficient drying in a 90 ° C. oven were performed to obtain a patterned insulating resin layer 11.

  Next, the insulating resin layer 11 was laminated on the carrier film 30 (PET: manufactured by Toyo Ink).

  Next, a patterned copper foil 21 was obtained by forming an etching resist pattern 25 on the copper foil 20 and etching the copper foil.

  Next, a control chip 40 (VCSEL driver chip: manufactured by HELIX AG) was mounted on the copper foil 21, and electrical connection was performed by wire bonding.

  Next, an optical signal path conversion component and an integrally formed light receiving / emitting element alignment frame 45 (stainless steel, cut product) were placed on the carrier film from which the insulating resin was removed by patterning. The installation position alignment performed abutment alignment using the outer shape of the insulating resin layer 11.

  Next, an optical waveguide dummy film 53 (polyimide film: manufactured by DuPont) was placed on the carrier film from which the insulating resin was removed by patterning. The installation position alignment performed abutment alignment using the outer shape of the insulating resin layer 11.

  Next, an optical fiber dummy film 58 (polyimide film: DuPont) was placed on the carrier film from which the insulating resin was removed by patterning. The installation position alignment performed abutment alignment using the outer shape of the insulating resin layer 11.

  Next, the light emitting element 61 (4ch VCSEL: manufactured by ULM) was mounted on the copper foil 21 and the optical signal path conversion component and the integrally formed light receiving and emitting element alignment frame 45). Further, a micro solder bump 90 was used for connection between the optical element 61 and the copper foil 21.

Next, a refractive index matching material 81 (epoxy adhesive: manufactured by NTT-AT) is injected into the interface between the optical waveguide dummy film 53 and the light emitting element 61 and the interface between the optical waveguide dummy film 53 and the optical fiber dummy film 58. The periphery of the refractive index matching material 81 was cured by exposure to ultraviolet rays of 500 mJ / cm ² .

  Next, the whole was molded with a mold resin 70.

  Next, the carrier film 30, the optical waveguide dummy film 53, and the optical fiber dummy film 58 were peeled off.

  Next, an optical waveguide film 52 (multimode epoxy-based optical waveguide film: manufactured by NTT-AT) was installed at the place where the optical waveguide dummy film was peeled off. The installation position alignment performed abutment alignment using the outer shape of the insulating resin layer 11.

  Next, an optical fiber 57 (multimode quartz-based bare core optical fiber: manufactured by Fujikura) was installed at the place where the optical fiber dummy film was peeled off. The installation position alignment performed abutment alignment using the outer shape of the insulating resin layer 11. The optical substrate 100 was produced through the above steps.

  As a result of evaluating the optical characteristics of the produced optical substrate, a stable light output of 0.9 to 1.1 mW was confirmed in each channel.

It is explanatory drawing of the optical board | substrate of this invention ((A): Top view, (B): Sectional drawing). It is explanatory drawing of the integrally molded component which concerns on the optical board | substrate of this invention ((A): Top view, (B): Sectional drawing). It is explanatory drawing of the patterned insulating resin layer which concerns on the optical board | substrate of this invention. It is explanatory drawing of the manufacturing method of the optical board | substrate of this invention. It is explanatory drawing of the manufacturing method of the optical board | substrate of this invention. It is explanatory drawing of the manufacturing method of the optical board | substrate of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Insulating resin layer 11 Patterned insulating resin layer 20 Metal layer 21 Wiring pattern 30 Carrier film 40 Control chip 45 Integrated molding component 45a Light emitting / receiving element positioning frame 45b Optical signal path conversion component 50 Optical waveguide 51 Optical waveguide film 52 Optical waveguide film 53 Optical waveguide dummy film 55 Optical fiber 56 Optical fiber 57 Optical fiber 58 Optical fiber dummy film 60 Light emitting / receiving element 61 Optical element (VCSEL)
70 Mold resin 80 Transparent resin 90 Solder bump 100 Electric circuit package 101 Optical substrate

Claims (4)

An insulating resin layer forming step of patterning the insulating resin layer on the metal layer to provide a removal region;
On the carrier film, an insulating resin substrate installation step in which the insulating resin layer surface is bonded to face the carrier film; and
Patterning the metal layer and forming a wiring pattern;
A step of arranging an integrally molded component comprising an optical signal path conversion component and a positioning frame of the light emitting and receiving element in the removal region;
A mounting step for mounting the light receiving / emitting element on the positioning frame and mounting the optical wiring in the removal region and connecting to the optical signal path conversion component, and mounting.
A carrier film removing step for removing the carrier film;
A method for producing an optical substrate, comprising: The method for producing an optical substrate according to claim 1 , further comprising a molding resin forming step of covering a part or the whole of the insulating resin layer with a molding resin. An insulating resin layer forming step of patterning the insulating resin layer on the metal layer to provide a removal region;
On the carrier film, an insulating resin substrate installation step in which the insulating resin layer surface is bonded to face the carrier film; and
Patterning the metal layer and forming a wiring pattern;
A step of arranging an integrally molded component comprising an optical signal path conversion component and a positioning frame of the light emitting and receiving element in the removal region;
A step of arranging and mounting the light emitting / receiving element on the positioning frame, and placing a dummy film of an optical wiring in contact with the optical signal path conversion component in the removal region;
A mold resin forming step of covering at least the dummy film on the carrier film with a mold resin;
A film removal step of removing the carrier film and the dummy film;
An optical wiring arrangement step of arranging an optical wiring in a portion where the dummy film has been arranged;
A method for manufacturing an optical substrate. Wherein the insulating resin layer forming step, the insulating resin layer is made of photosensitive resin, light as claimed in claim 1, wherein the forming the removal area of the photosensitive resin is patterned by photolithography A method for manufacturing a substrate.