JP2008129385A - Optical component mounting substrate and optical module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical component mounting substrate that accurately mounts an optical component such as an optical fiber on a wiring substrate equipped with a wiring pattern. <P>SOLUTION: On the wiring substrate 10 equipped with wiring patterns 14a, 14b, there is installed an optical fiber mounting part 30 which is composed of a metallic layer or a resin layer and which is provided with a V groove 30a for arranging an optical fiber 40 on the surface side. An optical module in which optical wiring and electric wiring are mixedly loaded is composed of the optical fiber 40, an optical waveguide 50, and optical semiconductor element 60, mounted on the optical component mounting substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical component mounting substrate and an optical module, and more specifically, an optical component mounting substrate capable of constituting an opto-electric hybrid substrate by mounting an optical component such as an optical fiber on a wiring substrate, and the same. The present invention relates to an optical module.

  Conventionally, optical communication systems have been required to have high speed and large capacity, and accordingly, downsizing, high performance and low cost of optical communication modules equipped with optical fibers and optical waveguides are desired. Has been.

  In recent years, in order to facilitate the assembly of optical communication modules, techniques for mounting optical components such as optical fibers and optical waveguides on a silicon substrate that can be precisely processed have been actively developed. Patent Document 1 describes a polymer optical waveguide device having a structure in which an optical waveguide is provided at the center of a silicon substrate, and V-grooves for mounting optical fibers are provided on both sides of the silicon substrate across the optical waveguide. Has been. The V groove of the silicon substrate is formed by processing the silicon substrate by a dicing saw or anisotropic etching.

Patent Document 2 describes an optical component mounting substrate having a structure in which a groove for holding an optical fiber, a groove for inserting an optical element, and an optical waveguide are formed on the surface of a glass substrate by press molding. Has been.
JP 2001-281479 A Japanese Patent Laid-Open No. 7-218739

  By the way, in recent years, an optical module (an opto-electric hybrid board) in which optical wiring and electrical wiring are mixedly mounted in a substrate by mounting an optical fiber, an optical waveguide, and an optical semiconductor element on a wiring substrate such as a printed wiring board. ).

  However, as described above, in the prior art, a method of mounting an optical fiber by forming a V-groove in a single silicon substrate or the like having no wiring pattern is the mainstream, and on a wiring board having a wiring pattern. No consideration is given to a technique for mounting an optical fiber by optically coupling it to an optical waveguide or the like with high efficiency.

  The present invention was created in view of the above problems, and is equipped with an optical component on which an optical component such as an optical fiber can be mounted accurately and easily on a wiring substrate provided with a wiring pattern to constitute an opto-electric hybrid substrate. It is an object of the present invention to provide a substrate for use and an optical module using the substrate.

  In order to solve the above-described problems, the present invention relates to an optical component mounting board, and is provided on a wiring board provided with a wiring pattern, and on the wiring board, and is formed of a metal layer or a resin layer so that the surface side has light. And an optical fiber mounting portion having a groove for arranging the fiber.

  In the present invention, an optical fiber mounting portion formed from a metal layer or a resin layer having a groove for positioning and arranging an optical fiber on a wiring board (printed wiring board or the like) is provided. By configuring the optical fiber mounting part from a metal layer or a resin layer, it is possible to easily form an optical fiber mounting part having a groove that is positioned and arranged with high precision on a wiring board.

  Since the groove of the optical fiber mounting portion is formed by pressing a metal layer or a resin layer with a mold, a highly accurate groove can be easily formed at low cost with high production efficiency. In addition, the number, shape (V-groove, etc.), opening width, and depth of the grooves can be easily changed by changing the mold, and can easily correspond to the specifications of various optical fibers.

  Also, when the wiring board is formed from a copper-clad laminate, it is more resistant to shock and vibration and is less likely to break than when using a silicon substrate, and handling is easier, improving manufacturing yield and production efficiency. Can do.

  In the optical component mounting substrate of the present invention, the optical fiber is mounted in the groove of the optical fiber mounting portion on the wiring substrate. Then, an optical semiconductor element that is optically coupled to the optical fiber is connected to and mounted on the wiring pattern of the wiring board to constitute an optical module in which the optical wiring and the electrical wiring are mixedly mounted.

  Alternatively, an optical waveguide may be provided between the optical paths of the optical fiber and the optical semiconductor element, and one end of the optical waveguide may be optically coupled to the optical fiber and the other end may be optically coupled to the optical semiconductor element.

  In the optical module of the present invention, since the optical fiber mounting portion having a groove with high positional accuracy is provided on the wiring board, the optical fiber and the optical semiconductor element or the optical waveguide are optically and efficiently transmitted on the wiring board. Can be combined and implemented.

  In this manner, a highly reliable and high performance optical module in which the optical wiring and the electrical wiring are mixedly mounted in the substrate can be configured.

  As described above, according to the present invention, since an optical fiber can be mounted on a wiring board with high accuracy, a high-performance optical module in which optical wiring and electrical wiring are mixedly mounted can be configured.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

(First embodiment)
FIG. 1 is a sectional view showing an optical component mounting board according to the first embodiment of the present invention, and FIG. 2 is a perspective view showing the optical component mounting board.

  As shown in FIG. 1, the optical component mounting board 1 of the present embodiment is basically configured by a wiring board 10 and an optical fiber mounting portion 30 provided on one end side on the wiring board 10. In the wiring substrate 10, a through-hole TH is provided through an insulating core substrate 12 made of glass epoxy resin or the like, and a through-hole conductive layer 11 is formed on the inner surface of the through-hole TH. The through hole TH is filled with a resin 13.

  Further, first wiring patterns 14 a made of copper or the like are formed on both surfaces of the core substrate 12, and the first wiring patterns 14 a on both surfaces of the core substrate 12 are interconnected via the through-hole conductive layer 11. ing. The through-hole conductive layer 11 may be formed so as to be completely embedded in the through-hole TH.

  Further, an interlayer insulating layer 16 made of a resin or the like covering the first wiring pattern 14a is formed on both sides of the core substrate 12 respectively. Via holes VH having a depth reaching the first wiring pattern 14a are provided in the interlayer insulating layers 16 on both sides of the core substrate 12 respectively. In addition, second wiring patterns 14b that are electrically connected to the first wiring patterns 14a through the via holes VH are formed on the interlayer insulating layers 16 on both sides of the core substrate 12, respectively.

  Further, on both sides of the core substrate 12, solder resists 18 having openings 18x provided on necessary portions of the second wiring pattern 14b are respectively formed. On the lower surface side of the core substrate 12, a nickel (Ni) plating layer 22 and a gold (Au) plating layer 24 are formed on the second wiring pattern 14 b in the opening 18 x of the solder resist 18 to provide a connection portion C <b> 1. The connection portion C is provided with an external connection terminal 20 made of a solder ball or the like.

  On the upper surface side of the core substrate 12, Ni / Au plating is applied to the portion of the second wiring pattern 14 b in the opening 18 x of the solder resist 18 to provide a connection portion C <b> 2 to which the optical semiconductor element is connected. Yes.

  The wiring board 10 according to this embodiment is obtained by processing a copper-clad laminate and forming build-up wiring on both sides thereof. FIG. 1 illustrates a form in which two layers of build-up wiring (first and second wiring patterns 14a and 14b) are formed on both sides of the core substrate 12, but n layers (n is an integer of 1 or more). The wiring pattern may be formed.

  As the core substrate 12 of the wiring substrate 10, a metal substrate such as a ceramic substrate, a silicon substrate, or copper may be used in addition to the resin insulating substrate. When a silicon substrate or a metal substrate is used as the core substrate 12, an insulating layer is provided on the upper surface, the lower surface, and the inner surface of the through hole.

  2 in addition, the optical fiber mounting portion 30 provided on one end side of the wiring board 10 is made of a metal layer, and a plurality of V grooves 30a on which optical fibers are mounted are provided on the surface side. ing. As the metal layer constituting the optical fiber mounting portion 30, a copper layer or a laminated metal film having a Ni layer as a main part and an Au layer coated thereon is preferably used.

  When the optical fiber mounting part 30 is made of a copper layer, the copper layer constituting the optical fiber mounting part 30 is formed by the same process as the second wiring pattern 14b by a semi-additive method or the like. In the example of FIG. 1, the thickness of the second wiring pattern 14b is 20 to 30 μm, and the optical fiber mounting portion 30 is set to a suitable thickness (about 100 μm) for mounting the optical fiber. It is thicker than 14b.

  In the case of the example in FIG. 1, first, the copper layer constituting the second wiring pattern 14b and the optical fiber mounting portion 30 is simultaneously formed by a semi-additive method or the like. Thereafter, the resist that exposes the optical fiber mounting portion 30 is patterned, and the thickness of the optical fiber mounting portion 30 is adjusted to a required thickness by electrolytic plating or the like. Alternatively, after forming the second wiring pattern 14b, a copper foil may be attached to a region where the optical fiber mounting portion 30 is formed.

  The thicknesses of the second wiring pattern 14b and the optical fiber mounting portion 30 are appropriately adjusted according to the electrical design of the wiring board 10 and the specifications of the optical fiber, and can be set to optimum thicknesses.

  As shown in FIGS. 3A and 3B, the V-groove 30a of the optical fiber mounting portion 30 is formed by pressing a metal layer 30x with a mold 25 having a V-shaped protruding portion 25a. The copper layer or copper foil formed on the wiring board 10 may be pressed with a mold to form the V-groove 30a, or the V-groove is previously formed on the copper foil with the mold, and the copper foil is wired. The optical fiber mounting portion 30 may be formed by being stuck on the interlayer insulating layer 16 of the substrate 10.

  The thickness of the optical fiber mounting portion 30 and the opening width and depth of the V-groove 30a are appropriately adjusted according to the diameter of the optical fiber. As shown in FIG. 3B, for example, when the diameter of the optical fiber is about 125 μm, the thickness t of the optical fiber mounting portion 30 is about 100 μm, and the opening width w of the V-groove 30a is about 125 μm. The thickness d is about 60 μm.

  Further, in the case where a multilayer metal film made of Ni layer / Au layer is used as the metal layer constituting the optical fiber mounting portion 30, the multilayer metal is formed in a separate process after the second wiring pattern 14b of the wiring substrate 10 is formed. An optical fiber mounting portion 30 made of a film (Ni layer / Au layer) is formed by electroless plating or the like. Thereafter, the laminated metal film (Ni layer / Au layer) is pressed by a mold to form a V-groove.

  In addition, although the copper layer and Ni layer / Au layer were illustrated as a metal layer which comprises the optical fiber mounting part 30, if it is a metal (aluminum etc.) which can form a V groove with a metal mold | die, the optical fiber mounting part 30 It can be used as a material.

  In the present embodiment, the V groove 30a of the optical fiber mounting portion 30 is formed by a mold. Therefore, by changing the mold, grooves of various shapes such as a semicircular mold or a rectangular mold can be used in addition to the V groove 30a. Can be easily formed. When forming an optical fiber mounting portion on a silicon substrate as in the prior art, it is difficult to form a groove other than the V-groove because shape control is difficult.

  In this way, the optical fiber mounting portion 30 is provided on one end side on the wiring substrate 10, and the optical waveguide is formed in the central portion adjacent to the optical fiber mounting portion 30 on the wiring substrate 10. Region A (FIGS. 1 and 2) is defined.

  As described above, in the optical component mounting substrate 1 according to the present embodiment, the optical fiber mounting portion 30 is configured of the metal layer including the V-groove 30a, and thus the wiring substrate including the wiring patterns 14a and 14b. The optical fiber mounting portion 30 can be easily formed on the substrate 10. Further, since the V-groove 30a is formed by pressing the metal layer 30x with a mold, the V-groove 30a can be formed with higher production efficiency and lower cost than when the V-groove is formed in the silicon substrate. Moreover, since the number, shape, opening width and depth of the V-groove 30a can be easily adjusted by changing the mold, it is possible to easily cope with various optical fiber specifications.

  Furthermore, since the wiring board 10 of the present embodiment is preferably formed from a copper-clad laminate, it is more resistant to shock and vibration than a silicon substrate and is not easily destroyed, and handling is facilitated and manufacturing. Yield and production efficiency can be improved.

  Next, an optical module configured by mounting optical components on the optical component mounting board 1 of the present embodiment will be described. FIG. 4 is a sectional view showing the optical module of the first embodiment of the present invention, and FIG. 5 is a perspective view showing a state in which the optical fiber and the optical waveguide are mounted on the optical component mounting substrate of the first embodiment of the present invention. is there.

  As shown in FIGS. 4 and 5, in the optical module 2 of the present embodiment, the optical fibers 40 are mounted in the plurality of V grooves 30 a of the optical fiber mounting portion 30 of the optical component mounting substrate 1 described above. As a method of attaching the optical fiber 40, Ni / Au plating is applied to the surface of the optical fiber 40, and the optical fiber 40 is brazed and fixed to the V groove 30a of the optical fiber mounting portion 30 with solder. By adopting such a method, the equipment of the existing mounting line can be used, so that the productivity is high and the cost is advantageous. In addition, you may fix the optical fiber 40 to the V groove 30a of the optical fiber mounting part 30 using an adhesive agent.

  Furthermore, an optical waveguide 50 optically coupled to the optical fiber 40 is provided in the optical waveguide formation region A at the center of the wiring substrate 10. Here, the structure of the optical waveguide 50 will be described. As shown in FIG. 6, a plurality of core portions 50b are formed by patterning on the first cladding layer 50a, and the refractive index of the core portion 50b is the first refractive index. It is set higher than the refractive index of one cladding layer 50a. The core portion 50b is formed by patterning the core layer formed on the first cladding layer 50a by photolithography and RIE.

  The core portion 50b is covered with a second cladding layer 50c made of the same material as the first cladding layer 50a. As materials for the first and second cladding layers 50a and 50c and the core portion 50b, quartz glass, fluorine-based polyimide, UV curable epoxy resin, or the like is preferably used. As the formation method, a CVD method or a coating method is adopted.

  In this way, the optical waveguide 50 is configured such that the core portion 50b is surrounded by the first and second cladding portions 50a and 50c. As a method for forming the optical waveguide 50 on the wiring substrate 10, there is a method in which the separated optical waveguide 50 is fixed to the optical waveguide formation region A of the wiring substrate 10 with an adhesive or the like. Alternatively, the optical waveguide 50 having the above-described structure may be formed on the wiring board 10.

  The optical fiber 40 is aligned in a self-aligned manner by the V groove 30 a of the optical fiber mounting portion 30, and one end of the optical fiber 40 is optically coupled to the core portion 50 b on one end side of the optical waveguide 50. One end side of the optical waveguide 50 on the side of the optical fiber 40 is a light incident / exit part 52 that emits light to the optical fiber 40 or enters light from the optical fiber 40.

  In general, the allowable positional deviation between the optical fiber 40 and the core portion 50b of the optical waveguide 50 is about ± 5 μm, and high processing accuracy is required when forming the V-groove 30a of the optical fiber mounting portion 30. In the present embodiment, the V-groove 30a of the optical fiber mounting portion 30 is formed by pressing the metal layer 30x with a metal mold, so that the above specification of the allowable displacement can be sufficiently satisfied.

  Thus, the optical waveguide 50 and the optical fiber 40 are arranged in the horizontal direction, and the light incident / exit section 52 of the optical waveguide 50 and one end of the optical fiber 40 are opposed and optically coupled.

  Further, an optical path changing portion 51 is provided on the other end side of the optical waveguide 50. The optical path changing portion 51 is formed by being processed into a 45 ° slope and coated with metal (gold or the like). As a result, the light incident from the optical fiber 40 and propagating through the optical waveguide 50 is emitted by the optical path conversion unit 51 after the optical path is converted by 90 °. On the other hand, the light incident on the optical path changing unit 51 of the optical waveguide 50 from the upper side is similarly converted by 90 ° so that the light is efficiently propagated to the core part 50 b of the optical waveguide 50.

  As shown in FIG. 4, the bump 60 a of the optical semiconductor element 60 is connected and mounted on the connection portion C <b> 2 of the second wiring pattern 14 b on the upper surface side of the wiring substrate 10. The optical semiconductor element 60 may be a light emitting element (laser diode (LD)) or a light receiving element (photodiode (PD)). In the optical semiconductor element 60, a light emitting unit (or light receiving unit) 60 x is provided on the lower surface side, and the light emitting unit (or light receiving unit) 60 x is disposed above the optical path conversion unit 51 of the optical waveguide 50 to emit light. Combined.

  As described above, the optical module 2 of the present embodiment is configured by mounting the optical fiber 40, the optical waveguide 50, and the optical semiconductor element 60 on the optical component mounting substrate 1 described above while being optically coupled to each other.

  When the optical semiconductor element 60 is a light receiving element, light from the optical fiber 40 enters the core part 50b from the light incident / exit part 52 of the optical waveguide 50, propagates by repeating total reflection in the core part 50b, and passes through the optical path. The light is converted by 90 ° by the converter 51 and enters the light receiving part 60 x of the optical semiconductor element 60. The optical semiconductor element 60 converts an optical signal into an electrical signal, and the electrical signal is supplied to an LSI chip (not shown) mounted on the wiring substrate 10 via the second wiring pattern 14b and the like.

  When the optical semiconductor element 60 is a light emitting element, an electrical signal output from an LSI chip (not shown) or the like mounted on the wiring substrate 10 is transmitted via the second wiring pattern 14b or the like. Device). Furthermore, the optical semiconductor element 60 converts the electrical signal into an optical signal, and light emitted from the light emitting unit 60x enters the optical path conversion unit 51 of the optical waveguide 50, and the optical path is converted by 90 °. The light incident on the core part 50 b of the optical waveguide 50 propagates by repeating total reflection in the core part 50 b and enters the optical fiber 40 from the light incident / exit part 52.

  In this manner, in the optical module 2 of the present embodiment, the function of the optical waveguide 50 optically coupled to the optical fiber 40 can perform light branching / merging, optical modulation, or optical amplification.

  As described above, in the optical module 2 of the present embodiment, the optical fiber mounting portion 30 having the V-groove 30a with high positional accuracy is provided on the wiring board 10, and therefore the optical fiber 40 is provided on the wiring board 10. And the optical waveguide 50 can be optically coupled with high efficiency and mounted.

  Further, the optical semiconductor element 60 optically coupled to the optical waveguide 50 can be connected to the second wiring pattern 14b of the wiring substrate 10 and mounted. In this way, a highly reliable high performance optical module 2 in which optical wiring and electrical wiring are mixedly mounted can be configured.

(Second Embodiment)
FIG. 7 is a sectional view showing an optical component mounting board according to a second embodiment of the present invention. As shown in FIG. 7, in the optical component mounting substrate 1a of the second embodiment, the optical fiber mounting portion 31 is made of a resin layer, and a plurality of V grooves 31a are provided on the surface side of the resin layer. In the method of forming the optical fiber mounting portion 31 of the second embodiment, the resin layer of the B stage (semi-cured state) is pressed by the same mold 25 as that of the first embodiment to form a plurality of V grooves 31a. . Then, the optical fiber mounting part 31 which consists of a resin layer is obtained by heat-processing and hardening the resin layer in which the V groove | channel 31a was provided.

  As a method of forming the optical fiber mounting portion 31 made of a resin layer on the wiring board 10, a V-shaped groove 31a is formed by sticking a resin film of a required size on the wiring board 10 and then pressing with a mold. Alternatively, a resin film in which the V groove 31a is formed may be attached to the wiring board 10.

  In addition, an insulating layer other than a resin film can be used as long as it is a material that can form a V-groove by pressing with a mold.

  Since other elements are the same as those in the first embodiment, the same reference numerals are given and description thereof is omitted.

  Also in the optical component mounting substrate 1a of the second embodiment, an optical module is configured by mounting optical fibers, optical waveguides, and optical semiconductor elements as in the first embodiment. In the second embodiment, since the optical fiber mounting portion 31 is formed from a resin layer, the optical fiber is fixed to the V-groove 31a with an adhesive.

(Third embodiment)
FIG. 8 is a sectional view showing an optical module according to the third embodiment of the present invention. The feature of the third embodiment is that the optical waveguide is omitted and the optical semiconductor element is directly optically coupled to the optical fiber. In 3rd Embodiment, the same code | symbol is attached | subjected to the same element as 1st Embodiment, and the description is abbreviate | omitted.

  As shown in FIG. 8, in the optical module 2a of the third embodiment, the optical fiber mounting part 30 is provided on one end side on the wiring board 10 as in the first embodiment. The optical fiber 40 is fixed to the V groove 30a.

  In the third embodiment, the optical waveguide 50 of the first embodiment is omitted, and the optical semiconductor element 61 is connected to the connection portion C2 of the second wiring pattern 14b in the vicinity of the optical fiber 40 on the wiring substrate 10 and mounted. Has been. The optical semiconductor element 61 may be a light emitting element (laser diode (LD)) or a light receiving element (photodiode (PD)).

  In the optical semiconductor element 61 according to the third embodiment, a light emitting part (or light receiving part) 61x is provided on a side surface thereof, and the light emitting part (or light receiving part) 61x is disposed to face one end side of the optical fiber 40. The optical fiber 40 is optically coupled.

  When the optical semiconductor element 61 is a light receiving element, the light from the optical fiber 40 enters the light receiving surface 61x of the optical semiconductor element 61 (light receiving element). The optical semiconductor element 61 (light receiving element) converts an optical signal into an electrical signal, and the electrical signal is supplied to an LSI chip (not shown) mounted on the wiring substrate 10 through the second wiring pattern 14b and the like.

  When the optical semiconductor element 61 is a light emitting element, an electrical signal from an LSI chip (not shown) or the like mounted on the wiring substrate 10 is transmitted via the second wiring pattern 14b or the like to the optical semiconductor element 61 (light emitting element). To be supplied. The optical semiconductor element 61 (light emitting element) converts the electrical signal into an optical signal, and light emitted from the light emitting portion 61 x enters the optical fiber 40.

  As in the first embodiment, the optical module 2a of the third embodiment is provided with an optical fiber mounting portion 30 made of a metal layer or a resin layer provided with a V-groove 30a with high positional accuracy on the wiring board 10. . As a result, the optical fiber 40 disposed in the V-groove 30a of the optical fiber mounting portion 30 is accurately aligned with the light emitting portion (or light receiving portion) 61x of the optical semiconductor element 61, so that the optical semiconductor element 61 can be efficiently illuminated. Combined. In this way, a high-performance optical module in which optical wiring and electrical wiring are mixedly mounted in the substrate can be easily configured.

FIG. 1 is a sectional view showing an optical component mounting board according to a first embodiment of the present invention. FIG. 2 is a perspective view showing the optical component mounting board according to the first embodiment of the present invention. FIGS. 3A and 3B are cross-sectional views showing how the grooves of the optical fiber mounting portion are formed in the optical component mounting substrate according to the first embodiment of the present invention. FIG. 4 is a cross-sectional view showing the optical module according to the first embodiment of the present invention. FIG. 5 is a perspective view showing a state in which the optical module and the optical waveguide are mounted on the optical component mounting substrate according to the first embodiment of the present invention. FIG. 6 is a cross-sectional view showing the structure of the optical waveguide mounted on the optical module according to the first embodiment of the present invention. FIG. 7 is a sectional view showing an optical component mounting board according to a second embodiment of the present invention. FIG. 8 is a sectional view showing an optical module according to the third embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,1a ... Optical fiber mounting board | substrate, 2, 2a ... Optical module, 10 ... Wiring board, 11 ... Through-hole conductive layer, 12 ... Core board | substrate, 13 ... Resin, 14a ... 1st wiring pattern, 14b ... 2nd wiring Pattern: 16 ... Interlayer insulating layer, 18 ... Solder resist, 18a ... Opening, 20 ... External connection terminal, 22 ... Ni layer, 24 ... Gold layer, 30, 31 ... Optical fiber mounting part, 30a, 31a ... V groove, DESCRIPTION OF SYMBOLS 40 ... Optical fiber, 50 ... Optical waveguide, 50a, 50c ... Cladding layer, 50b ... Core part, 51 ... Optical path conversion part, 52 ... Light entrance / exit part, 60, 61 ... Optical semiconductor element, 60a ... Bump, 60x, 61x ... light emitting part (or light receiving part), A ... optical waveguide forming region, C1, C2 ... connecting part, TH ... through hole, VH ... via hole.

Claims (10)

A wiring board with a wiring pattern;
An optical component mounting board, comprising: an optical fiber mounting portion provided on the wiring board, formed from a metal layer or a resin layer, and provided with a groove for arranging an optical fiber on the surface side. .   2. The optical component mounting substrate according to claim 1, wherein the metal layer is made of a laminated metal film in which a gold layer is formed on a copper layer or a nickel layer.   2. The optical component mounting substrate according to claim 1, wherein the groove is formed by pressing the metal layer or the resin layer with a mold.   The optical component mounting substrate according to claim 1, wherein the groove is a V-groove, a semicircular groove, or a rectangular groove.   The wiring pattern is formed of n layers (n is an integer of 1 or more) on both sides of the wiring board, and the wiring pattern on both sides of the wiring board is a through-hole conductive layer provided on the wiring board. The optical component mounting board according to claim 1, wherein the optical component mounting boards are interconnected by each other. A wiring board with a wiring pattern;
An optical fiber mounting portion provided on the wiring board, formed from a metal layer or a resin layer, and provided with a groove for arranging an optical fiber on the surface side;
The optical fiber disposed in the groove of the optical fiber mounting portion;
An optical module comprising: an optical semiconductor element connected to and mounted on the wiring pattern on the wiring board and optically coupled to the optical fiber. An optical waveguide provided between the optical paths of the optical fiber and the optical semiconductor element;
The optical module according to claim 6, wherein one end side of the optical waveguide is optically coupled to the optical fiber, and the other end side is optically coupled to the optical semiconductor element.   The optical module according to claim 6, wherein the optical fiber is fixed to the groove of the optical fiber mounting portion with solder.   The optical waveguide has a structure in which a core portion is surrounded by a cladding layer, the optical waveguide and the optical fiber are arranged in a horizontal direction, and one end of the core portion of the optical waveguide and one end of the optical fiber The optical module according to claim 7, wherein and are optically coupled to face each other.   One end of the optical waveguide on the optical semiconductor element side is provided with an optical path conversion unit that converts an optical path by 90 °, and the optical semiconductor element has a light emitting unit or a light receiving unit disposed above the light conversion unit. The optical module according to claim 7, wherein the optical module is mounted.

Images