JP5062542B2 - Motor control device - Google Patents

Description

  The present invention relates to a motor control device such as an inverter device or a servo amplifier that mainly operates with a high-voltage power supply, and more particularly to automatic assembly of a motor control device and support for increasing the effect of reducing parts.

Since a conventional motor control device, for example, an inverter device, uses a power semiconductor module including an IGBT (Insulated Gate Bipolar Transistor) element that generates high heat, the power semiconductor module is brought into close contact with a heat sink to provide a cooling effect. (For example, Patent Document 1). In order to further increase the cooling effect, a fan is used to increase the cooling effect by forced air cooling.
In addition, a resin support is configured between the heat sink and the substrate so that heat from the heat sink side is not transmitted to the substrate side.
In a conventional motor control device, for example, an inverter device, the configuration shown in FIGS. 5 and 6 has been adopted.
5 and 6, the support 12 is placed on the upper surface 11a of the heat sink 11, and the power semiconductor module 13 is inserted into the module through hole 12a of the support 12 with the external electrode terminal 13a facing up. 15 is mounted on the support through the external electrode terminal 13a of the power semiconductor module 13 in the terminal through hole 15a, and the power semiconductor module 13 is mounted on the power semiconductor module mounting surface formed on the upper surface 11a of the heat sink 11. 11b.
In this state, the screw 14 is passed through the screw hole 13b of the power semiconductor module 13 and screwed into the screw hole 11c provided in the power semiconductor module mounting surface 11b, thereby fastening the power semiconductor module 13 to the power semiconductor module. Mounting is performed in close contact with the mounting surface 11b.
Further, the screw 15 is passed through the screw through hole 15b of the substrate 15 and the screw through hole 12b of the support 12, and is screwed into the screw hole 11d provided in the upper surface 11a of the heat sink, whereby the substrate 15 and the support are supported. 12 is fastened and fixed to the heat sink 11. At this time, the head of the screw 14 enters the screw through hole 15 b formed in the substrate 15.
A cooling fan 16, a cable 16 a, a connector 16 b, and a fan case 17 attached with a cable 16 c are attached to the ground side of the heat sink 11.
In this configuration, the support 12 is molded of resin in order to form a complicated shape and insulate heat from the heat sink 11.
JP 2004-349548 A

However, the configuration of the conventional motor control device has the following problems.
Since the number of external electrode terminals 13a of the power semiconductor module 13 is large, it is difficult to position the external electrode terminals 13a, and it is difficult to mount the support 12 and the power semiconductor module 13 on the heat sink 11 and place the substrate 15 thereon. . Therefore, the power semiconductor module 13, the support 12, and the heat sink 11 are attached to the substrate 15 using a special jig. Since a special jig is used, it takes time to set the jig, and there is a limit to shortening the work time. Also, since the setting to the jig can only be done manually, it was impossible to assemble with a robot. Further, since a jig is required for assembly, a jig is required for each model, and the jig must be managed.
Since a jig is required, the purchase cost of the jig is necessary, and the work cost and the management cost are necessary, resulting in an increase in cost. For this reason, there has been a limit to realizing cost reduction of the motor control device.
The present invention has been made in view of such problems, and it is an object of the present invention to provide a motor control device that can facilitate assembly of the device, reduce component costs, and reduce costs. It is.

In order to solve the above problems, the present invention is configured as follows.
The invention according to claim 1 is a power semiconductor module including a heat sink having fins, a support formed of a resin that is in close contact with the heat sink, a plurality of external electrode terminals that are in close contact with the heat sink, and the plurality of A board to which an external electrode terminal is connected and a heat sink positioning boss formed on the support are provided, and a temporary fixing spring for temporarily fixing the power semiconductor module is formed on the support.
The invention described in claim 2 is characterized in that a support boss for positioning the substrate is formed on the support.
The invention described in claim 3 is characterized in that a terminal through hole through which a plurality of external electrode terminals of the power semiconductor module are passed is formed in the support.
The invention described in claim 4 is characterized in that a recess is formed on the back side of the support boss.
The invention according to claim 5 is characterized in that a claw for fixing the substrate is formed on the support.

The present invention has the following effects.
According to the first aspect of the present invention, since the heat sink positioning boss for positioning the heat sink is formed on the support, the support can be guided into the heat sink, and the assembly can be easily performed. Since assembly can be easily performed, automatic assembly by a robot can be easily performed, and workability can be improved.
According to the second aspect of the present invention, since the support boss for positioning the substrate is formed on the support, the substrate can be guided and can be easily assembled. Since assembly can be easily performed, automatic assembly by a robot can be easily performed, and workability can be improved.
According to the first to third aspects of the invention, the support is formed with a terminal through hole through which the plurality of external electrode terminals of the power semiconductor module are passed, and a temporary fixing spring capable of temporarily fixing the power semiconductor module. , So that the terminal can always be in the same position relative to the support. Since the terminals can always be at the same position with respect to the support, the mounting error of the heat sink, the support, and the power semiconductor module is eliminated, and the assembly can be easily performed. Since assembly can be easily performed, automatic assembly by a robot can be easily performed, and workability can be improved.
Further, since no special jig is required, the purchase cost, work cost, and management cost of the jig become unnecessary. Furthermore, the cost of the motor control device can be reduced by eliminating the need to purchase jigs, work costs, and management costs.
According to the invention described in claim 4, since the support boss recess is formed on the back side of the support boss of the support, the supports can be stacked, and a large amount of support can always be placed at the same position. become. Since a large amount of support can always be placed at the same position, the layout supply device can be reduced in size, and the position search of parts by a robot can be easily performed. Since the position search of parts by the robot can be easily performed, automatic assembly by the robot can be easily performed, and workability can be improved.
According to the invention described in claim 5, since the claw for fixing the substrate to the support is formed, the fixing screw for the substrate becomes unnecessary. By eliminating the need for fixing screws for the board, the time required for component and screw tightening operations is reduced, and component costs and work costs are eliminated. Since the parts cost and the work cost are not required, the cost of the motor control device can be reduced.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing a motor control device according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the motor control device in FIG. 3A and 3B are diagrams of the support in FIG. 2, where FIG. 3A is a plan view, FIG. 3B is a right side view, FIG. 3C is a front view, and FIG. 4A and 4B are views showing a support when a plurality of power semiconductor modules are mounted. FIG. 4A is a front view of the support, FIG. 4B is a right side view of the support, and FIG. 4C is a plan view.
1 to 4, 1 is a heat sink for cooling, 2 is a support made of resin, 3 is a power semiconductor module including an inverter IGBT element and the like, and has a structure having a plurality of external electrode terminals 3a. . 3b is a screw through hole, 4 is a screw for attaching the power semiconductor module 3 to the heat sink 1, and 5 is a substrate to which the external electrode terminal 3a of the power semiconductor module 3 is connected. 5a is a terminal through hole for passing the external electrode terminal 3a of the power semiconductor module 3, 5b is a support boss through hole provided in the substrate 5, and 5c is a screw through hole for inserting the head of the screw 4. . A fan 6 includes a cable 6a and a connector 6b. Reference numeral 7 denotes a fan case for fixing the fan 6 to the heat sink 1.

  The heat sink 1 has, for example, a rectangular parallelepiped shape, the upper surface 1a is formed in a flat shape, and a plurality of support boss positioning holes 1b and support mounting bosses 1c for mounting the support 2 are formed. A plurality of screw holes 1e for attaching the power semiconductor module 3 to the power semiconductor module attachment surface 1d formed on the upper surface 1a of the heat sink 1 are formed.

The support 2 is provided with a module through hole 2a in the substantially central portion of the upper surface, and two support bosses 2b are provided, for example, with the module through hole 2a interposed therebetween. Furthermore, heat sink mounting holes 2c for mounting the heat sink 1 are provided, for example, at four locations on the side surface. Further, substrate fixing claws 2d for fixing the substrate 5 are provided at a plurality of locations on the outer peripheral portion of the upper surface. Further, on the back surface, a heat sink positioning boss 2e for positioning when the heat sink 1 is attached, a connector fixing portion 2f for fixing the connector 6b, and a support boss 2b for stacking the supports 2 together. A support boss recess 2g provided by forming a recess on the back surface is provided.
Further, the support 2 shown in FIG. 2 shows a configuration when one power semiconductor module 3 is mounted, but the support 2 when a plurality of, for example, two power semiconductor modules are mounted is shown in FIG. The configuration is as shown. The support 2 is provided with a plurality of temporary fixing springs 2h for temporarily fixing the power semiconductor module 3 and terminal through holes 2i for allowing the external electrode terminals 3a of the power semiconductor module 3 to pass.

  The power semiconductor module 3 is disposed on a power semiconductor module mounting surface 1 a formed on the upper surface of the heat sink 1, and a screw 4 is passed through a screw through hole 3 b of the power semiconductor module 3, thereby the power semiconductor module mounting surface. Temporary fixing is performed by screwing and tightening into a screw hole 1e formed in 1a.

  The substrate 5 is disposed on the support 2 and fixed by a support boss 2b and a substrate fixing claw 2d. The power semiconductor module 3 is also fastened and fixed. In this state, the terminals of the power semiconductor module 3 are soldered to the substrate 5.

The fan 6 is disposed on the heat sink 1 and fixed to the heat sink 1 with a fan case 7. The cable 6a, the connector 6b, and the cable 6c are fixed to the fan connector fixing portion 2f of the support 2.

In the motor control apparatus of the present invention, the heat sink positioning boss 2e and the support boss 2b, the heat sink mounting hole 2c, the power semiconductor module terminal through hole 2i, and the power semiconductor module temporary fixing spring 2h are formed in the support 2. There is no mounting error, and assembly can be easily performed. Since assembly can be easily performed, automatic assembly by a robot can be easily performed, and workability is improved.
Furthermore, the support boss recesses 2g enable the support to be stacked, and a large amount of support can always be placed at the same position. Since a large amount of support can always be placed at the same position, the layout supply device can be reduced in size, and the position search of parts by a robot can be easily performed. Since the position search of parts by the robot can be easily performed, automatic assembly by the robot can be easily performed, and workability can be improved. Further, since no special jig is required, the purchase cost, work cost, and management cost of the jig become unnecessary. By eliminating the purchase cost, work cost, and management cost of the jig, the cost of the motor control device can be reduced.
Further, since the substrate fixing claw 2d is formed, a substrate fixing screw is not required. By eliminating the need for fixing screws for the board, the time required for component and screw tightening operations is reduced, and component costs and work costs are eliminated. By eliminating the need for parts and work costs, the cost of the motor control device can be reduced.
Further, since the fan connector fixing portion 2f is formed, the routing of the cable wiring is simplified and the replacement can be easily performed. As a result, the replacement by the customer can be easily performed, and the maintainability is improved.

It is a perspective view which shows the motor control apparatus in the Example of this invention. FIG. 2 is an exploded perspective view of the motor control device in FIG. 1. FIG. 3 is a diagram of the support in FIG. 2, (a) is a plan view, (b) is a right side view, (c) is a front view, and (d) is a rear view. (A) of the support which shows an Example is a top view, (b) is a right view, (c) is a front view. It is a perspective view which shows the motor control apparatus in a prior art. FIG. 6 is an exploded perspective view of the motor control device in FIG. 5. FIG.

1 heat sink 1a upper surface 1b support boss positioning hole 1c support mounting boss 1d power semiconductor module mounting surface 1e screw hole 2 support 2a module through hole 2b support boss 2c heat sink mounting hole 2d board fixing claw 2e heat sink positioning boss 2f connector fixing part 2g support boss Recess 2h Temporary retaining spring 2i Terminal through hole 3 Power semiconductor module 3a External electrode terminal 3b Screw through hole 4 Power semiconductor module fixing screw 5 Substrate 5a Terminal through hole 5b Support boss through hole 5c Screw through hole 6 Fan 6a Cable 6b Connector 6c Cable 7 Fan case 8 Board fixing screw

Claims (5)

A heat sink with fins,
A support formed of a resin that adheres to the heat sink;
A power semiconductor module comprising a plurality of external electrode terminals in close contact with the heat sink;
A substrate to which the plurality of external electrode terminals are connected;


A heat sink positioning boss formed on the support;
With
A motor control device, wherein a temporary spring for temporarily fixing the power semiconductor module is formed on the support.   2. The motor control device according to claim 1, wherein a support boss for positioning the substrate is formed on the support.   The motor control device according to claim 1, wherein a terminal through hole through which a plurality of external electrode terminals of the power semiconductor module are passed is formed in the support.   The motor control device according to claim 2, wherein a recess is formed on a back side of the support boss.   The motor control device according to claim 1, wherein a claw for fixing the substrate is formed on the support.

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