JP4918057B2 - Phosphorus-containing ester group-containing tetracarboxylic acid or dianhydride thereof and phosphorus-containing polyesterimide - Google Patents
Phosphorus-containing ester group-containing tetracarboxylic acid or dianhydride thereof and phosphorus-containing polyesterimide Download PDFInfo
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- JP4918057B2 JP4918057B2 JP2008065852A JP2008065852A JP4918057B2 JP 4918057 B2 JP4918057 B2 JP 4918057B2 JP 2008065852 A JP2008065852 A JP 2008065852A JP 2008065852 A JP2008065852 A JP 2008065852A JP 4918057 B2 JP4918057 B2 JP 4918057B2
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- Prior art keywords
- phosphorus
- formula
- dianhydride
- polyesterimide
- bis
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims description 82
- 229910052698 phosphorus Inorganic materials 0.000 title claims description 82
- 239000011574 phosphorus Substances 0.000 title claims description 82
- 229920003055 poly(ester-imide) Polymers 0.000 title claims description 40
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 title claims description 39
- 125000004185 ester group Chemical group 0.000 title claims description 26
- 150000000000 tetracarboxylic acids Chemical class 0.000 title claims description 12
- 239000002243 precursor Substances 0.000 claims description 16
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 125000001931 aliphatic group Chemical group 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 125000002723 alicyclic group Chemical group 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- -1 phosphazene compound Chemical class 0.000 description 30
- 239000002904 solvent Substances 0.000 description 23
- 229920001721 polyimide Polymers 0.000 description 20
- 239000004642 Polyimide Substances 0.000 description 18
- 239000010408 film Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 15
- 239000000243 solution Substances 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 14
- 150000004985 diamines Chemical class 0.000 description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 229920005575 poly(amic acid) Polymers 0.000 description 11
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 11
- 239000002253 acid Substances 0.000 description 10
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
- 239000003063 flame retardant Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- PBKONEOXTCPAFI-UHFFFAOYSA-N 1,2,4-trichlorobenzene Chemical compound ClC1=CC=C(Cl)C(Cl)=C1 PBKONEOXTCPAFI-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000003444 phase transfer catalyst Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000012043 crude product Substances 0.000 description 4
- 125000006159 dianhydride group Chemical group 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000005809 transesterification reaction Methods 0.000 description 4
- 239000008096 xylene Substances 0.000 description 4
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 3
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000005481 NMR spectroscopy Methods 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000004821 distillation Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000004714 phosphonium salts Chemical class 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 2
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 2
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical group C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 150000001555 benzenes Chemical class 0.000 description 2
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 2
- DMVOXQPQNTYEKQ-UHFFFAOYSA-N biphenyl-4-amine Chemical compound C1=CC(N)=CC=C1C1=CC=CC=C1 DMVOXQPQNTYEKQ-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 239000012295 chemical reaction liquid Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- YMHQVDAATAEZLO-UHFFFAOYSA-N cyclohexane-1,1-diamine Chemical compound NC1(N)CCCCC1 YMHQVDAATAEZLO-UHFFFAOYSA-N 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 150000002168 ethanoic acid esters Chemical class 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 2
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 2
- BRKFQVAOMSWFDU-UHFFFAOYSA-M tetraphenylphosphanium;bromide Chemical compound [Br-].C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BRKFQVAOMSWFDU-UHFFFAOYSA-M 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- YKNMIGJJXKBHJE-UHFFFAOYSA-N (3-aminophenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=CC(N)=C1 YKNMIGJJXKBHJE-UHFFFAOYSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UMRXKNAASA-N (3ar,4s,7r,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound O=C1OC(=O)[C@@H]2[C@H]1[C@]1([H])C=C[C@@]2([H])C1 KNDQHSIWLOJIGP-UMRXKNAASA-N 0.000 description 1
- GWLKCPXYBLCEKC-UHFFFAOYSA-N 1,2-dichloro-3-methylbenzene Chemical compound CC1=CC=CC(Cl)=C1Cl GWLKCPXYBLCEKC-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- KUFFULVDNCHOFZ-UHFFFAOYSA-N 2,4-xylenol Chemical compound CC1=CC=C(O)C(C)=C1 KUFFULVDNCHOFZ-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- DZLUPKIRNOCKJB-UHFFFAOYSA-N 2-methoxy-n,n-dimethylacetamide Chemical compound COCC(=O)N(C)C DZLUPKIRNOCKJB-UHFFFAOYSA-N 0.000 description 1
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 1
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 1
- ZGZXMBROUFILGU-UHFFFAOYSA-N 3-(1,1,1,3,3,3-hexafluoropropan-2-yl)phthalic acid Chemical compound OC(=O)C1=CC=CC(C(C(F)(F)F)C(F)(F)F)=C1C(O)=O ZGZXMBROUFILGU-UHFFFAOYSA-N 0.000 description 1
- SMDGQEQWSSYZKX-UHFFFAOYSA-N 3-(2,3-dicarboxyphenoxy)phthalic acid Chemical compound OC(=O)C1=CC=CC(OC=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O SMDGQEQWSSYZKX-UHFFFAOYSA-N 0.000 description 1
- LXJLFVRAWOOQDR-UHFFFAOYSA-N 3-(3-aminophenoxy)aniline Chemical compound NC1=CC=CC(OC=2C=C(N)C=CC=2)=C1 LXJLFVRAWOOQDR-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- ZMPZWXKBGSQATE-UHFFFAOYSA-N 3-(4-aminophenyl)sulfonylaniline Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=CC(N)=C1 ZMPZWXKBGSQATE-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- TYKLCAKICHXQNE-UHFFFAOYSA-N 3-[(2,3-dicarboxyphenyl)methyl]phthalic acid Chemical compound OC(=O)C1=CC=CC(CC=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O TYKLCAKICHXQNE-UHFFFAOYSA-N 0.000 description 1
- CKOFBUUFHALZGK-UHFFFAOYSA-N 3-[(3-aminophenyl)methyl]aniline Chemical compound NC1=CC=CC(CC=2C=C(N)C=CC=2)=C1 CKOFBUUFHALZGK-UHFFFAOYSA-N 0.000 description 1
- FGWQCROGAHMWSU-UHFFFAOYSA-N 3-[(4-aminophenyl)methyl]aniline Chemical compound C1=CC(N)=CC=C1CC1=CC=CC(N)=C1 FGWQCROGAHMWSU-UHFFFAOYSA-N 0.000 description 1
- UCFMKTNJZCYBBJ-UHFFFAOYSA-N 3-[1-(2,3-dicarboxyphenyl)ethyl]phthalic acid Chemical compound C=1C=CC(C(O)=O)=C(C(O)=O)C=1C(C)C1=CC=CC(C(O)=O)=C1C(O)=O UCFMKTNJZCYBBJ-UHFFFAOYSA-N 0.000 description 1
- PAHZZOIHRHCHTH-UHFFFAOYSA-N 3-[2-(2,3-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=CC(C(O)=O)=C(C(O)=O)C=1C(C)(C)C1=CC=CC(C(O)=O)=C1C(O)=O PAHZZOIHRHCHTH-UHFFFAOYSA-N 0.000 description 1
- GBUNNYTXPDCASY-UHFFFAOYSA-N 3-[3-[2-[3-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(C=CC=2)C(C=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)(C(F)(F)F)C(F)(F)F)=C1 GBUNNYTXPDCASY-UHFFFAOYSA-N 0.000 description 1
- LBPVOEHZEWAJKQ-UHFFFAOYSA-N 3-[4-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 LBPVOEHZEWAJKQ-UHFFFAOYSA-N 0.000 description 1
- XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 description 1
- KOUQMRHSPOKPBD-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)phenyl]butan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=C(N)C=CC=2)C=CC=1C(C)(CC)C(C=C1)=CC=C1OC1=CC=CC(N)=C1 KOUQMRHSPOKPBD-UHFFFAOYSA-N 0.000 description 1
- NYRFBMFAUFUULG-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=C(N)C=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=CC(N)=C1 NYRFBMFAUFUULG-UHFFFAOYSA-N 0.000 description 1
- NQZOFDAHZVLQJO-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(OC=3C=CC(OC=4C=C(N)C=CC=4)=CC=3)=CC=2)=C1 NQZOFDAHZVLQJO-UHFFFAOYSA-N 0.000 description 1
- JERFEOKUSPGKGV-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfanylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(SC=3C=CC(OC=4C=C(N)C=CC=4)=CC=3)=CC=2)=C1 JERFEOKUSPGKGV-UHFFFAOYSA-N 0.000 description 1
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Description
本発明は、新規な含リンエステル基含有テトラカルボン酸またはその二無水物、それを使用して製造される含リンポリエステルイミド前駆体、および含リンポリエステルイミドに関する。 The present invention relates to a novel phosphorus-containing ester group-containing tetracarboxylic acid or a dianhydride thereof, a phosphorus-containing polyesterimide precursor produced using the same, and a phosphorus-containing polyesterimide.
ポリイミドは、電気・電子部品等の材料として広く利用されている。例えば、フレキシブルプリント基板のベースフィルム、接着層、半導体素子の保護膜・絶縁膜、液晶ディスプレーなどの表示素子等、種々の用途に採用・検討されている。用途拡大に伴い、その要求特性も変化する必要に迫られている。取り分けフレキシブルプリント基板の薄膜化に伴い、そのベースのポリイミドフィルムも薄膜化している。同時に、薄膜化したポリイミドは、ポリイミドが本来持つ難燃性が低下する恐れがある。その為、薄膜化したポリイミドでも従来と同等以上の難燃性が求められている。 Polyimide is widely used as a material for electrical and electronic parts. For example, it has been adopted and studied for various applications such as base films for flexible printed boards, adhesive layers, protective films / insulating films for semiconductor elements, and display elements such as liquid crystal displays. As the application expands, the required characteristics have to change. In particular, as the flexible printed circuit board is made thinner, the base polyimide film is also made thinner. At the same time, the thin film of polyimide may reduce the inherent flame retardancy of the polyimide. For this reason, even a thin-film polyimide is required to have flame retardance equal to or higher than that of the conventional one.
難燃性の高いポリイミドとして、リン化合物であるホスファゼン化合物を導入する技術が開示されている(例えば、特許文献1及び2参照)。しかしながら、25μmより薄い膜の難燃特性は記載されていない。また導入するホスファゼン化合物の合成法は、複数工程を含む複雑なものであり、実用的でない。 A technique for introducing a phosphazene compound, which is a phosphorus compound, as a highly flame-retardant polyimide has been disclosed (see, for example, Patent Documents 1 and 2). However, the flame retardant properties of membranes thinner than 25 μm are not described. Moreover, the synthesis method of the phosphazene compound to be introduced is complicated and includes a plurality of steps, and is not practical.
また、ジアミン成分にリンを含む含リンジアミン化合物が報告されている(例えば、非特許文献1及び2参照)。これらは主にエポキシ樹脂用硬化剤として、難燃性、耐熱性の向上に利用されている。しかしながら、これらの含リンジアミン化合物をポリイミドに利用された公知技術は少ない。 Moreover, the phosphorus-containing diamine compound which contains phosphorus in a diamine component has been reported (for example, refer nonpatent literature 1 and 2). These are mainly used as epoxy resin curing agents to improve flame retardancy and heat resistance. However, there are few known techniques in which these phosphorus-containing diamine compounds are used for polyimide.
含リンジアミンとビスマレイミドを重合させて、ポリアミドイミドとする耐熱材料の報告がある(例えば、非特許文献3)。また、含リンジアミンとリンを含まない芳香族酸二無水物を重合させたポリイミドを生体材料として利用する報告がある(例えば、特許文献3)。しかしこれらの文献には、難燃性薄膜の例は記載されていない。 There is a report of a heat-resistant material obtained by polymerizing phosphorus-containing diamine and bismaleimide to form polyamideimide (for example, Non-Patent Document 3). In addition, there is a report of using polyimide obtained by polymerizing phosphorus-containing diamine and aromatic dianhydride not containing phosphorus as a biomaterial (for example, Patent Document 3). However, these documents do not describe examples of flame retardant thin films.
更に、近年の電子材料の高密度集積化に伴い、熱拡散性が良いこともポリイミドに強く望まれているが、これまでに良好な熱拡散性を有するポリイミド薄膜の例は見られない。
本発明は、難燃性、高熱拡散性に寄与する新規な含リンエステル基含有テトラカルボン酸またはその二無水物、それを利用して製造される含リンポリエステルイミド前駆体および含リンポリエステルイミドを提供するものである。 The present invention provides a novel phosphorus-containing ester group-containing tetracarboxylic acid or its dianhydride that contributes to flame retardancy and high thermal diffusibility, a phosphorus-containing polyesterimide precursor and a phosphorus-containing polyesterimide produced using the same. It is to provide.
本発明者らは、上記のような課題を解決するために種々研究を行い、特定の構造を有する含リンエステル基含有テトラカルボン酸またはその二無水物を見出し、さらに、それを使用して製造される含リンポリエステルイミド前駆体及び含リンポリエステルイミドが優れた難燃性並びに熱拡散率を有することを見出し、本発明を完成した。
即ち本発明は以下に示すものである。
The present inventors have conducted various studies in order to solve the above-mentioned problems, and have found a phosphorus-containing ester group-containing tetracarboxylic acid having a specific structure or a dianhydride thereof, and further produced it using the same. The present invention was completed by finding that the phosphorus-containing polyesterimide precursor and phosphorus-containing polyesterimide produced have excellent flame retardancy and thermal diffusivity.
That is, the present invention is as follows.
1.式(1)で表される含リンエステル基含有テトラカルボン酸または式(2)で表されるその二無水物:
〔式(1)及び(2)中、
Arは、式(3):
より選択される三価の芳香族基を表し、
式(1)〜(3)中、R1、R2、R3、R4、及びR5は、同一または異なって、水素原子或いは炭素数1〜4のアルキル基を表す〕。
1. Phosphorus-containing ester group-containing tetracarboxylic acid represented by formula (1) or its dianhydride represented by formula (2):
[In Formula (1) and (2),
Ar represents the formula (3):
Represents a trivalent aromatic group selected from
In formulas (1) to (3), R 1 , R 2 , R 3 , R 4 and R 5 are the same or different and represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
2.式(5):
(式(5)中、Arは式(1)及び(2)におけるのと同義であり、R1及びR2は式(1)〜(3)におけるのと同義であり、Xは、二価の芳香族基、脂環式基または脂肪族基を表し、Rは水素原子、或いは炭素数1〜4のアルキル基を表す。)で表される反復単位を有する含リンポリエステルイミド前駆体。
2. Formula (5):
(In the formula (5), Ar is as defined in the formulas (1) and (2), R 1 and R 2 are as defined in the formulas (1) to (3), and X is divalent. An aromatic group, an alicyclic group, or an aliphatic group, and R represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.)
3.式(4):
(式(4)中、Arは式(1)及び(2)におけるのと同義であり、R1及びR2は式(1)〜(3)におけるのと同義であり、Xは式(5)におけるのと同義である)で表される反復単位を有する含リンポリエステルイミド。
3. Formula (4):
(In the formula (4), Ar has the same meaning as in the formulas (1) and (2), R 1 and R 2 have the same meaning as in the formulas (1) to (3), and X represents the formula (5 And a phosphorus-containing polyesterimide having a repeating unit represented by the following formula.
本発明の含リンエステル基含有テトラカルボン酸またはその二無水物は、優れた難燃性及び/又は熱拡散性を持つポリエステルイミドフィルムの原料、耐熱性難燃エポキシ樹脂の硬化剤または樹脂改質剤として有用である。 The phosphorus-containing ester group-containing tetracarboxylic acid or its dianhydride according to the present invention is a raw material for a polyesterimide film having excellent flame retardancy and / or thermal diffusibility, a curing agent or resin modification for a heat-resistant flame-retardant epoxy resin. Useful as an agent.
以下に本発明の実施の形態について詳細に説明するが、これらは本発明の実施形態の一例であり、これらに限定されない。 Although embodiments of the present invention will be described in detail below, these are examples of the embodiments of the present invention, and the present invention is not limited to these.
<含リンエステル基含有テトラカルボン酸またはその二無水物及びその製造方法>
本発明の含リンエステル基含有テトラカルボン酸またはその二無水物は、式(1)または(2)で表される。ここで、R1、R2及びR3として好ましいのは、水素、メチル、エチルである。
<Phosphorus-containing ester group-containing tetracarboxylic acid or dianhydride thereof and production method thereof>
The phosphorus-containing ester group-containing tetracarboxylic acid or dianhydride thereof of the present invention is represented by the formula (1) or (2). Here, hydrogen, methyl and ethyl are preferable as R 1 , R 2 and R 3 .
本発明の含リンエステル基含有テトラカルボン酸またはその二無水物の製造方法は特に限定されず、従来公知の方法で製造することができる。例えば、特開2006−206486に開示された技術に基づき、製造することができる。 The manufacturing method of the phosphorus-containing ester group containing tetracarboxylic acid or its dianhydride of this invention is not specifically limited, It can manufacture by a conventionally well-known method. For example, it can be manufactured based on the technique disclosed in JP-A-2006-206486.
即ち、本発明の含リンエステル基含有テトラカルボン酸またはその二無水物は、式(6):
(式(6)中、Arは式(1)及び(2)におけるのと同義であり、R1及びR2は式(1)〜(3)におけるのと同義であり、Raは、同一または異なって、炭素数1〜4のアルキル基を表す)で表される含リン芳香族アルカンエステルと、式(7):
で示されるトリメリット酸無水物とを、相間移動触媒の存在下、溶媒中でエステル交換反応させて製造することができる。
That is, the phosphorus-containing ester group-containing tetracarboxylic acid or dianhydride thereof of the present invention has the formula (6):
(In the formula (6), Ar is as defined in the formulas (1) and (2), R 1 and R 2 are as defined in the formulas (1) to (3), and R a is the same. Or a phosphorus-containing aromatic alkane ester represented by the formula (7):
The trimellitic anhydride represented by the formula (1) can be produced by a transesterification reaction in a solvent in the presence of a phase transfer catalyst.
本発明における式(6)に係る含リン芳香族アルカンエステルは、式(8):
(式(8)中、Arは式(1)及び(2)におけるのと同義であり、R1及びR2は式(1)〜(3)におけるのと同義である。)
で表される化合物を塩化アセチル等のハロゲン化アセチルによりアセトキシ化することで容易に製造することができる。
The phosphorus-containing aromatic alkane ester according to the formula (6) in the present invention has the formula (8):
(In the formula (8), Ar has the same meaning as in the formulas (1) and (2), and R 1 and R 2 have the same meaning as in the formulas (1) to (3).)
Can be easily produced by acetoxylation with an acetyl halide such as acetyl chloride.
本発明における式(6)に係る含リン芳香族アルカンエステルとしては、酢酸エステル、プロピオン酸エステル、酪酸またはイソ酪酸エステルが例示されるが、好ましくは酢酸エステルが挙げられる。 Examples of the phosphorus-containing aromatic alkane ester according to the formula (6) in the present invention include acetic acid ester, propionic acid ester, butyric acid or isobutyric acid ester, preferably acetic acid ester.
式(6)で示される含リン芳香族アルカンエステルと、トリメリット酸無水物とのエステル交換反応は、相間移動触媒の存在下、溶媒中で行われ、式(2)で示される含リンエステル基含有テトラカルボン酸二無水物を得る。ここでは、トリメリット酸無水物2モルに対し、含リン芳香族アルカンエステルを0.95〜1.50モル反応させるのが好ましい。式(1)で示される含リンエステル基含有テトラカルボン酸は、式(2)で示される含リンエステル基含有テトラカルボン酸二無水物を水と反応させることで、容易に得ることが出来る。 The transesterification reaction between the phosphorus-containing aromatic alkane ester represented by the formula (6) and trimellitic anhydride is carried out in a solvent in the presence of a phase transfer catalyst, and the phosphorus-containing ester represented by the formula (2) A group-containing tetracarboxylic dianhydride is obtained. Here, it is preferable to react 0.95 to 1.50 mol of phosphorus-containing aromatic alkane ester with respect to 2 mol of trimellitic anhydride. The phosphorus-containing ester group-containing tetracarboxylic acid represented by the formula (1) can be easily obtained by reacting the phosphorus-containing ester group-containing tetracarboxylic dianhydride represented by the formula (2) with water.
本発明に係る相間移動触媒としては、上記方法において設定される反応温度に耐えうる触媒であれば良く、公知のもの、例えば、アンモニウム塩、ホスホニウム塩、スルホニウム塩、クラウンエーテル等が利用できるが、好ましくは、ホスホニウム塩、スルホニウム塩が利用できる。ホスホニウム塩としては、例えば、トリフェニルホスフィン、臭化テトラフェニルホスホニウム、塩化テトラフェニルホスホニウム、塩化テトラブチルホスホニウム等、スルホニウム塩としては、ヨウ化スルホニウム、臭化トリフェニルスルホニウム等が挙げられる。 The phase transfer catalyst according to the present invention may be any catalyst that can withstand the reaction temperature set in the above method, and known ones such as ammonium salts, phosphonium salts, sulfonium salts, crown ethers and the like can be used. Preferably, a phosphonium salt or a sulfonium salt can be used. Examples of the phosphonium salt include triphenylphosphine, tetraphenylphosphonium bromide, tetraphenylphosphonium chloride, and tetrabutylphosphonium chloride. Examples of the sulfonium salt include sulfonium iodide and triphenylsulfonium bromide.
相間移動触媒の量は、式(6)で示される含リン芳香族アルカンエステルに対し、0.1〜10重量%、好ましくは0.3〜5.0重量%である。 The amount of the phase transfer catalyst is 0.1 to 10% by weight, preferably 0.3 to 5.0% by weight, based on the phosphorus-containing aromatic alkane ester represented by the formula (6).
エステル交換反応には、溶媒を用いる。使用する溶媒は、反応温度(170〜250℃)付近または反応温度を越える沸点を持ち、設定される反応温度に応じ適宜選択されるが、反応に関与しないもの、すなわち含リン芳香族アルカンエステル、トリメリット酸無水物および相間移動触媒に対し、不活性でなければならない。例えば、1,2−ジクロロベンゼン、1,2,4−トリクロロベンゼンのようなポリ塩化ベンゼン、2,3−ジクロロトルエンのようなポリ塩化トルエンが使用可能である。脱水された非プロトン性極性溶媒、例えばスルホラン、N−メチルピロリドンも使用可能である。溶媒の使用量は、式(6)で示される含リン芳香族アルカンエステルに対し、50〜800重量%、好ましくは100〜500重量%である。 A solvent is used for the transesterification reaction. The solvent to be used has a boiling point in the vicinity of the reaction temperature (170 to 250 ° C.) or exceeding the reaction temperature, and is appropriately selected according to the set reaction temperature, but does not participate in the reaction, that is, a phosphorus-containing aromatic alkane ester, Must be inert to trimellitic anhydride and phase transfer catalyst. For example, polychlorinated benzenes such as 1,2-dichlorobenzene and 1,2,4-trichlorobenzene, and polychlorinated toluenes such as 2,3-dichlorotoluene can be used. Dehydrated aprotic polar solvents such as sulfolane and N-methylpyrrolidone can also be used. The usage-amount of a solvent is 50 to 800 weight% with respect to the phosphorus-containing aromatic alkane ester shown by Formula (6), Preferably it is 100 to 500 weight%.
エステル交換反応温度は、170〜250℃で行われるが、200〜240℃が好ましい。 The transesterification reaction temperature is 170 to 250 ° C, preferably 200 to 240 ° C.
反応終了後、反応母液をそのまま濾別して、粗製物を得る。粗製物を芳香族溶媒、例えば、トルエン、キシレン、或いはモノクロロベンゼンのような塩素化ベンゼンで還流洗浄し、精製する。この時、ジメチルホルムアミド、ジメチルアセトアミドのようなアミド溶媒を共存させても良い。還流洗浄された精製物を濾別し、160〜250℃、好ましくは180〜220℃で乾燥させ目的物を得る。 After completion of the reaction, the reaction mother liquor is filtered off as it is to obtain a crude product. The crude product is purified by reflux washing with an aromatic solvent such as toluene, xylene, or chlorinated benzene such as monochlorobenzene. At this time, an amide solvent such as dimethylformamide or dimethylacetamide may coexist. The purified product washed under reflux is filtered off and dried at 160 to 250 ° C., preferably 180 to 220 ° C., to obtain the desired product.
<含リンポリエステルイミド前駆体及びその製造方法>
本発明の含リンポリエステルイミド前駆体は、式(5)で表される反復単位を有する。式(5)におけるXは、任意の二価の芳香族基、脂環式基又は脂肪族基であり、合成原料のジアミンに由来する。Xとして特に好ましいのは、二価の芳香族基としては、4,4‘−オキシジアニリンであり、二価の脂環式基としては、シクロヘキサンジアミンであり、二価の脂肪族基としては、ヘキサメチレンジアミンである。
<Phosphorus-containing polyesterimide precursor and method for producing the same>
The phosphorus-containing polyesterimide precursor of the present invention has a repeating unit represented by the formula (5). X in Formula (5) is an arbitrary divalent aromatic group, alicyclic group or aliphatic group, and is derived from a diamine as a synthesis raw material. Particularly preferred as X is 4,4′-oxydianiline as the divalent aromatic group, cyclohexanediamine as the divalent alicyclic group, and divalent aliphatic group as the divalent aliphatic group. Hexamethylenediamine.
含リンポリエステルイミド前駆体は、式(5)で表される反復単位を、全反復単位に対して、好ましくは5%以上、更に好ましくは50%以上、もっとも好ましくは100%含む。 The phosphorus-containing polyesterimide precursor preferably contains 5% or more, more preferably 50% or more, and most preferably 100% of the repeating unit represented by the formula (5) with respect to all repeating units.
含リンポリエステルイミド前駆体は、好ましくは2000mPa・s以上、更に好ましくは2000〜200000mPa・s、もっとも好ましくは2000〜100000mPa・sの粘度を有し得る。含リンポリエステルイミド前駆体は含リンポリエステルイミドの難燃性、高熱拡散性に寄与する。 The phosphorus-containing polyesterimide precursor may have a viscosity of preferably 2000 mPa · s or more, more preferably 2000 to 200000 mPa · s, and most preferably 2000 to 100000 mPa · s. The phosphorus-containing polyesterimide precursor contributes to the flame retardancy and high thermal diffusibility of the phosphorus-containing polyesterimide.
含リンポリエステルイミド前駆体は、上記で得られた含リンエステル基含有テトラカルボン酸二無水物を用いて公知の方法で製造できる。すなわち、含リンポリエステルイミド前駆体(ポリアミック酸)の製造方法は、式(1)で表される含リンエステル基含有テトラカルボン酸二無水物を必須成分として含む酸二無水物と、式(4)のXに相当する1種以上のジアミン成分とを、酸二無水物に対してジアミン成分を、0.5〜2.0当量の範囲内の任意の割合で反応させることからなる。含リンポリエステルイミド前駆体から得られる、後述する含リンポリエステルイミドの分子量を小さくし、その末端を酸無水物にして得たい場合は、酸無水物に対するジアミン成分の量を0.5当量に近づければ良く、また、含リンポリエステルイミドの分子量を小さくし、その末端をアミンにして得たい場合は、酸無水物に対するジアミン成分の量を2.0当量に近づければ良い。さらに、得られる含リンポリエステルイミドの分子量を大きくしたい場合には、酸無水物に対するジアミン成分の量を1.0当量に近づければ良い。 The phosphorus-containing polyesterimide precursor can be produced by a known method using the phosphorus-containing ester group-containing tetracarboxylic dianhydride obtained above. That is, a method for producing a phosphorus-containing polyesterimide precursor (polyamic acid) includes an acid dianhydride containing a phosphorus-containing ester group-containing tetracarboxylic dianhydride represented by the formula (1) as an essential component, and a formula (4 ) And one or more diamine components corresponding to X are reacted with the acid dianhydride at an arbitrary ratio within the range of 0.5 to 2.0 equivalents. When the molecular weight of the phosphorus-containing polyesterimide, which will be described later, obtained from the phosphorus-containing polyesterimide precursor is reduced and the end of the phosphorus-containing polyesterimide is obtained as an acid anhydride, the amount of the diamine component relative to the acid anhydride is brought close to 0.5 equivalents. In addition, when the molecular weight of the phosphorus-containing polyesterimide is reduced and the terminal is obtained as an amine, the amount of the diamine component relative to the acid anhydride may be close to 2.0 equivalents. Furthermore, when it is desired to increase the molecular weight of the resulting phosphorus-containing polyesterimide, the amount of the diamine component relative to the acid anhydride may be close to 1.0 equivalent.
反応温度は概ね0℃〜100℃の反応温度範囲である。好ましくは0℃〜60℃、さらに好ましくは0℃〜40℃である。使用するジアミン成分の反応性にもよるが、反応温度が低すぎると反応に時間がかかり、逆に高すぎるとポリアミック酸にした場合に、分子量が大きくなりにくい傾向がある。反応時間としてはおよそ30分〜48時間である。 The reaction temperature is generally in the range of 0 ° C to 100 ° C. Preferably it is 0 degreeC-60 degreeC, More preferably, it is 0 degreeC-40 degreeC. Depending on the reactivity of the diamine component to be used, if the reaction temperature is too low, the reaction takes time. On the other hand, if the reaction temperature is too high, the molecular weight tends not to increase when a polyamic acid is used. The reaction time is approximately 30 minutes to 48 hours.
含リンエステル基含有テトラカルボン酸二無水物を用いて含リンポリエステルイミド前駆体を製造する場合、含リンポリエステルイミドの難燃効果を出すには、使用する酸二無水物の合計に対して、含リンエステル基含有テトラカルボン酸二無水物が1モル%〜100モル%であることが必要であり、好ましくは5モル%〜100モル%であり、より好ましくは7〜100モル%である。含リンエステル基含有テトラカルボン酸二無水物の比率を1モル%以下とすると難燃効果が不十分となり、該比率を20モル%以上にしても難燃効果の大幅な向上は見込めないから、比率は、1〜20モル%、好ましくは5〜15モル%、更に好ましくは7モル%〜13モル%とすることもできる。 When producing a phosphorus-containing polyesterimide precursor using a phosphorus-containing ester group-containing tetracarboxylic dianhydride, in order to exert the flame-retardant effect of the phosphorus-containing polyesterimide, the total of the acid dianhydrides to be used, The phosphorus-containing ester group-containing tetracarboxylic dianhydride needs to be 1 mol% to 100 mol%, preferably 5 mol% to 100 mol%, more preferably 7 to 100 mol%. If the ratio of the phosphorus-containing ester group-containing tetracarboxylic dianhydride is 1 mol% or less, the flame retardant effect becomes insufficient, and even if the ratio is 20 mol% or more, a significant improvement in the flame retardant effect cannot be expected. The ratio can be 1 to 20 mol%, preferably 5 to 15 mol%, more preferably 7 to 13 mol%.
含リンエステル基含有テトラカルボン酸二無水物を用いて含リンポリエステルイミド前駆体を製造する場合、含リンポリエステルイミドの熱拡散効果を出すには、使用する酸二無水物の合計に対して、含リンエステル基含有テトラカルボン酸二無水物が50モル%以上必要であり、好ましくは70モル%以上、更に好ましくは90モル%以上である。50モル%より少ないと熱拡散効果が顕著ではない。 When producing a phosphorus-containing polyesterimide precursor using a phosphorus-containing ester group-containing tetracarboxylic dianhydride, in order to exert the thermal diffusion effect of the phosphorus-containing polyesterimide, the total of the acid dianhydrides to be used, The phosphorus-containing ester group-containing tetracarboxylic dianhydride is required to be 50 mol% or more, preferably 70 mol% or more, more preferably 90 mol% or more. When it is less than 50 mol%, the thermal diffusion effect is not remarkable.
反応溶媒は通常、非プロトン性極性溶媒が使用されるが、他の溶媒を使用しても差し支えない。使用可能な溶媒としては、例えばN,N−ジメチルホルムアミド、N,N−ジメチルアセトアミド、N,N−ジメチルメトキシアセトアミド、N−メチル−2−ピロリドン、ジメチルスルホキシド、ジメチルスルホン、スルホラン、ヘキサメチルホスホルアミド、フェノール、o−クレゾール、m−クレゾール、p−クレゾール、2,3−キシレノール、2,4−キシレノール、2,5−キシレノール、2,6−キシレノール、3,4−キシレノール、3,5−キシレノール、エチレングリコール、ジエチレングリコール、トリエチレングリコール、グライム、ジグライム、トリグライム、トルエン、キシレンなどが挙げられる。これらの溶媒は単独あるいは二種以上混合して用いることができる。溶媒の使用量に特に制限はないが、生成するポリアミック酸の含量が5〜20重量%以下とするのが望ましい。 As the reaction solvent, an aprotic polar solvent is usually used, but other solvents may be used. Usable solvents include, for example, N, N-dimethylformamide, N, N-dimethylacetamide, N, N-dimethylmethoxyacetamide, N-methyl-2-pyrrolidone, dimethyl sulfoxide, dimethyl sulfone, sulfolane, hexamethyl phosphor Amide, phenol, o-cresol, m-cresol, p-cresol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, 3,4-xylenol, 3,5- Examples include xylenol, ethylene glycol, diethylene glycol, triethylene glycol, glyme, diglyme, triglyme, toluene, xylene and the like. These solvents can be used alone or in combination of two or more. Although there is no restriction | limiting in particular in the usage-amount of a solvent, It is desirable for the content of the polyamic acid to produce | generate to be 5 to 20 weight% or less.
必須成分である含リンエステル基含有テトラカルボン酸二無水物に加えて、他の酸二無水物を使用することができるが、この他の酸二無水物に特に制限は無い。例えばシクロブタンテトラカルボン酸二無水物、シクロペンタンテトラカルボン酸二無水物、1,2,4,5−シクロヘキサンテトラカルボン酸二無水物、1,2,3,4−シクロヘキサンテトラカルボン酸二無水物、ピロメリット酸二無水物、1,1−ビス(2,3−ジカルボキシフェニル)エタン二無水物、ビス(2,3−ジカルボキシフェニル)メタン二無水物、ビス(3,4−ジカルボキシフェニル)メタン二無水物、3,3’,4,4’−ビフェニルテトラカルボン酸二無水物、2,2−ビス(3,4−ジカルボキシフェニル)プロパン二無水物、2,2−ビス(2,3−ジカルボキシフェニル)プロパン二無水物、2,2−ビス(3,4−ジカルボキシフェニル)−1,1,1,3,3,3−ヘキサフルオロプロパン二無水物、2,2−ビス(2,3−ジカルボキシフェニル)−1,1,1,3,3,3−ヘキサフルオロプロパン二無水物、ビス(3,4−ジカルボキシフェニル)スルホン二無水物、ビス(3,4−ジカルボキシフェニル)エーテル二無水物、ビス(2,3−ジカルボキシフェニル)エーテル二無水物、3,3’,4,4’−ベンゾフェノンテトラカルボン酸二無水物、2,2’,3,3’−ベンゾフェノンテトラカルボン酸二無水物等である。 In addition to the phosphorus-containing ester group-containing tetracarboxylic dianhydride which is an essential component, other acid dianhydrides can be used, but there is no particular limitation on the other acid dianhydrides. For example, cyclobutanetetracarboxylic dianhydride, cyclopentanetetracarboxylic dianhydride, 1,2,4,5-cyclohexanetetracarboxylic dianhydride, 1,2,3,4-cyclohexanetetracarboxylic dianhydride, Pyromellitic dianhydride, 1,1-bis (2,3-dicarboxyphenyl) ethane dianhydride, bis (2,3-dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) ) Methane dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, 2,2-bis (2 , 3-dicarboxyphenyl) propane dianhydride, 2,2-bis (3,4-dicarboxyphenyl) -1,1,1,3,3,3-hexafluoropropane dianhydride, , 2-bis (2,3-dicarboxyphenyl) -1,1,1,3,3,3-hexafluoropropane dianhydride, bis (3,4-dicarboxyphenyl) sulfone dianhydride, bis ( 3,4-dicarboxyphenyl) ether dianhydride, bis (2,3-dicarboxyphenyl) ether dianhydride, 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride, 2,2 ′ 3,3′-benzophenone tetracarboxylic dianhydride and the like.
反応に使用される1種類以上のジアミン成分としては特に制限は無い。例えば、芳香族ジアミンとしては、p−フェニレンジアミン、m−フェニレンジアミン、4,4’−ジアミノジフェニルエーテル、3,4’−ジアミノジフェニルエーテル、3,3’−ジアミノジフェニルエーテル、4,4’−ジアミノジフェニルチオエーテル、3,4’−ジアミノジフェニルチオエーテル、3,3’−ジアミノジフェニルチオエーテル、3,3’−ジアミノジフェニルメタン、3,4’−ジアミノジフェニルメタン、4,4’−ジアミノジフェニルメタン、4,4’−ジアミノジフェニルスルフォン、3,4’−ジアミノジフェニルスルフォン、3,3’−ジアミノジフェニルスルフォン、4,4’−ジアミノベンズアニリド、3,4’−ジアミノベンズアニリド、3,3’−ジアミノベンズアニリド、4,4’−ジアミノベンゾフェノン、3,4’−ジアミノベンゾフェノン、3,3’−ジアミノベンゾフェノン、ビス[4−(3−アミノフェノキシ)フェニル]メタン、ビス[4−(4−アミノフェニキシ)フェニル]メタン、1,1−ビス[4−(3−アミノフェノキシ)フェニル]エタン、1,1−ビス[4−(4−アミノフェノキシ)フェニル]エタン、1,2−ビス[4−(3−アミノフェノキシ)フェニル]エタン、1,2−ビス[4−(4−アミノフェノキシ)フェニル]エタン、2,2−ビス[4−(3−アミノフェノキシ)フェニル]プロパン、2,2−ビス[4−(4−アミノフェノキシ)フェニル]プロパン、2,2−ビス[4−(3−アミノフェノキシ)フェニル]ブタン、2,2−ビス[3−(3−アミノフェノキシ)フェニル]−1,1,1,3,3,3−ヘキサフルオロプロパン、2,2−ビス[4−(4−アミノフェノキシ)フェニル]−1,1,1,3,3,3−ヘキサフルオロプロパン、1,3−ビス(3−アミノフェノキシ)ベンゼン、1,4−ビス(3−アミノフェノキシ)ベンゼン、1,4’−ビス(4−アミノフェノキシ)ベンゼン、4,4’−ビス(4−アミノフェノキシ)ビフェニル、ビス[4−(3−アミノフェノキシ)フェニル]ケトン、ビス[4−(4−アミノフェノキシ)フェニル]ケトン、ビス[4−(3−アミノフェノキシ)フェニル]スルフィド、ビス[4−(4−アミノフェノキシ)フェニル]スルフィド、ビス[4−(3−アミノフェノキシ)フェニル]スルホン、ビス[4−(4−アミノフェノキシ)フェニル]スルホン、ビス[4−(3−アミノフェノキシ)フェニル]エーテル、ビス[4−(4−アミノフェノキシ)フェニル]エーテル、1,4−ビス[4−(3−アミノフェノキシ)ベンゾイル]ベンゼン、1,3−ビス[4−(3−アミノフェノキシ)ベンゾイル]ベンゼン、4,4’−ビス[3−(4−アミノフェノキシ)ベンゾイル]ジフェニルエーテル、4,4’−ビス[3−(3−アミノフェノキシ)ベンゾイル]ジフェニルエーテルなどであり、脂肪族又は脂環式ジアミンとしては、1,2−ジアミノエタン、1,2−ジアミノプロパン、1,3−ジアミノプロパン、1,4−ジアミノブタン、1,3−ジアミノペンタン、1,5−ジアミノペンタン、1,6−ジアミノヘキサン、1,7−ジアミノヘプタン、1,8−ジアミノオクタン、1,9−ジアミノノナン、1,10−ジアミノデカン、1,11−ジアミノウンデカン、1,12−ジアミノドデカン、2−メチル−1,5−ジアミノペンタン、4,4−ジメチルヘプタメチレンジアミン、ジ(アミノメチル)シクロヘキサン、ジアミノジシクロヘキシルメタン、ジアミノジシクロヘキシルエーテル、ジアミノシクロヘキサン、ジアミノヘキサヒドロジフェニル、イソホロンジアミン、m−キシリレンジアミン、p−キシリレンジアミン、1,3−ビス(アミノプロピル)テトラメチルシロキサン、α,ω―ビス(3−アミノプロピル)ポリジメチルシロキサンなどである。また、ジアミン成分として、非特許文献1〜3及び特許文献3に記載されるような含リンジアミンを使用することもできる。 There is no restriction | limiting in particular as 1 or more types of diamine component used for reaction. For example, aromatic diamines include p-phenylene diamine, m-phenylene diamine, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl ether, 4,4'-diaminodiphenyl thioether. 3,4'-diaminodiphenylthioether, 3,3'-diaminodiphenylthioether, 3,3'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl Sulfone, 3,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, 4,4'-diaminobenzanilide, 3,4'-diaminobenzanilide, 3,3'-diaminobenzanilide, 4,4 '-Diam Benzophenone, 3,4'-diaminobenzophenone, 3,3'-diaminobenzophenone, bis [4- (3-aminophenoxy) phenyl] methane, bis [4- (4-aminophenoxy) phenyl] methane, 1,1 -Bis [4- (3-aminophenoxy) phenyl] ethane, 1,1-bis [4- (4-aminophenoxy) phenyl] ethane, 1,2-bis [4- (3-aminophenoxy) phenyl] ethane 1,2-bis [4- (4-aminophenoxy) phenyl] ethane, 2,2-bis [4- (3-aminophenoxy) phenyl] propane, 2,2-bis [4- (4-aminophenoxy) ) Phenyl] propane, 2,2-bis [4- (3-aminophenoxy) phenyl] butane, 2,2-bis [3- (3-aminophenoxy) phenyl] 1,1,1,3,3,3-hexafluoropropane, 2,2-bis [4- (4-aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, , 3-bis (3-aminophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene, 1,4′-bis (4-aminophenoxy) benzene, 4,4′-bis (4-aminophenoxy) ) Biphenyl, bis [4- (3-aminophenoxy) phenyl] ketone, bis [4- (4-aminophenoxy) phenyl] ketone, bis [4- (3-aminophenoxy) phenyl] sulfide, bis [4- ( 4-aminophenoxy) phenyl] sulfide, bis [4- (3-aminophenoxy) phenyl] sulfone, bis [4- (4-aminophenoxy) phenyl] sulfone, bi [4- (3-aminophenoxy) phenyl] ether, bis [4- (4-aminophenoxy) phenyl] ether, 1,4-bis [4- (3-aminophenoxy) benzoyl] benzene, 1,3- Bis [4- (3-aminophenoxy) benzoyl] benzene, 4,4′-bis [3- (4-aminophenoxy) benzoyl] diphenyl ether, 4,4′-bis [3- (3-aminophenoxy) benzoyl] Examples of aliphatic or cycloaliphatic diamines include 1,2-diaminoethane, 1,2-diaminopropane, 1,3-diaminopropane, 1,4-diaminobutane, 1,3-diaminopentane, 1,5-diaminopentane, 1,6-diaminohexane, 1,7-diaminoheptane, 1,8-diaminooctane, 1,9 Diaminononane, 1,10-diaminodecane, 1,11-diaminoundecane, 1,12-diaminododecane, 2-methyl-1,5-diaminopentane, 4,4-dimethylheptamethylenediamine, di (aminomethyl) cyclohexane, Diaminodicyclohexylmethane, diaminodicyclohexyl ether, diaminocyclohexane, diaminohexahydrodiphenyl, isophoronediamine, m-xylylenediamine, p-xylylenediamine, 1,3-bis (aminopropyl) tetramethylsiloxane, α, ω-bis ( 3-aminopropyl) polydimethylsiloxane. Moreover, phosphorus-containing diamine as described in a nonpatent literature 1-3 and the patent document 3 can also be used as a diamine component.
さらに、分子量を調節する目的で、あるいは他の目的で、次のモノアミンやジカルボン酸無水物を添加することも可能である。使用されるモノアミンとしては、アニリン、4−フェニルアニリン、4−フェノキシアニリン、シクロヘキシルアミン、m−アミノフェニルアセチレンなどであり、ジカルボン酸無水物としてはマレイン酸無水物、フタル酸無水物、ナジック酸無水物、フェニルエチニルフタル酸無水物、トリメリット酸無水物、アセチニルフタル酸無水物などである。 Furthermore, the following monoamines and dicarboxylic acid anhydrides can be added for the purpose of adjusting the molecular weight or for other purposes. The monoamine used is aniline, 4-phenylaniline, 4-phenoxyaniline, cyclohexylamine, m-aminophenylacetylene, etc., and the dicarboxylic acid anhydride is maleic acid anhydride, phthalic acid anhydride, nadic acid anhydride. Products, phenylethynylphthalic anhydride, trimellitic anhydride, acetylinylphthalic anhydride, and the like.
<含リンポリエステルイミド及びその製造方法>
本発明の含リンポリエステルイミドは、式(4)で表される反復単位を有する。式(4)におけるXは、式(5)におけるのと同様である。含リンポリエステルイミドは、式(4)で表される反復単位を、全反復単位に対して、好ましくは5%以上、更に好ましくは50%以上、もっとも好ましくは100%含む。含リンポリエステルイミドは、有機溶媒に不溶となり、粘度の測定ができない場合もあるが、溶媒可溶の場合は好ましくは1000mPa・s以上、更に好ましくは1000〜50000mPa・s、もっとも好ましくは1000〜30000mPa・sの粘度を有する。含リンポリエステルイミドは難燃性、高熱拡散性を有する。
<Phosphorus-containing polyesterimide and production method thereof>
The phosphorus-containing polyesterimide of the present invention has a repeating unit represented by the formula (4). X in formula (4) is the same as in formula (5). The phosphorus-containing polyesterimide preferably contains 5% or more, more preferably 50% or more, and most preferably 100% of the repeating unit represented by the formula (4) with respect to all repeating units. The phosphorus-containing polyesterimide is insoluble in an organic solvent, and the viscosity may not be measured. However, when the solvent is soluble, it is preferably 1000 mPa · s or more, more preferably 1000 to 50000 mPa · s, and most preferably 1000 to 30000 mPa. Has a viscosity of s. The phosphorus-containing polyesterimide has flame retardancy and high thermal diffusivity.
本発明の含リンポリエステルイミドの製造方法は、前述の含リンポリエステルイミド前駆体であるポリアミック酸溶液を加熱脱水してイミド化する方法、或いはこれを縮合触媒存在下の溶液中で化学閉環してイミド化する方法などの公知の手法を用いることができる。 The method for producing the phosphorus-containing polyesterimide of the present invention is a method in which the polyamic acid solution, which is the above-mentioned phosphorus-containing polyesterimide precursor, is heated and dehydrated, or chemically ring-closed in a solution in the presence of a condensation catalyst. A known method such as a method for imidization can be used.
ポリアミック酸溶液を加熱脱水してイミド化する方法とは、ステンレス箔、アルミ箔、銅箔、ガラス、シリコン等の基材表面にポリアミック酸溶液を塗布し、100℃〜500℃の範囲で加熱脱水してポリイミドとする方法である。この方法においては、含リンポリエステルイミドは、基材から剥離することで、通常はフイルム状態で得られる。また、銅箔等に塗布されてイミド化された場合は、そのまま積層板等の材料に使用されることもある。或いは、加熱脱水によるイミド化は、ポリアミック酸溶液に水と共沸する溶媒を予め添加しておき、溶媒中で熱イミド化を行い、イミド化に伴い発生する水を系外に排出し、溶媒中にポリイミドを得る方法によっても行うことができる。この場合、ポリイミドは溶媒中に溶解するか、析出する状態で得られる。得られたポリイミドが溶媒中に溶解している場合は、上述したのと同様に、ステンレス箔、アルミ箔、銅箔、ガラス、シリコン等の基材表面に該溶液を塗布し、乾燥機の中で溶媒の沸点以上に加熱して、溶媒を取り除き、基材から剥離してポリイミドフィルムを得るか、そのまま積層板等の材料として供される。また、溶媒中に析出している場合は、析出しているポリイミドを濾過等の方法により分取すればよい。分取されたポリイミドは乾燥され、別の溶媒に溶解されてフイルムなどの用途に利用されるか、或いは乾燥後に粉砕されて、射出成形や圧縮成形などに供することもできる。 The method of heating and dehydrating a polyamic acid solution to imidize is to apply a polyamic acid solution to the surface of a substrate such as stainless steel foil, aluminum foil, copper foil, glass, silicon, etc., and heat dehydrate in the range of 100 ° C to 500 ° C. To make polyimide. In this method, the phosphorus-containing polyesterimide is usually obtained in a film state by peeling from the substrate. Moreover, when apply | coating to copper foil etc. and imidating, it may be used for materials, such as a laminated board, as it is. Alternatively, imidization by heat dehydration is performed by adding a solvent that azeotropes with water in advance to the polyamic acid solution, performing thermal imidization in the solvent, and discharging water generated along with the imidization to the outside of the system. It can carry out also by the method of obtaining a polyimide inside. In this case, the polyimide is obtained in a state where it is dissolved or precipitated in the solvent. When the obtained polyimide is dissolved in a solvent, as described above, the solution is applied to the surface of a substrate such as stainless steel foil, aluminum foil, copper foil, glass, silicon, etc. The mixture is heated to the boiling point of the solvent to remove the solvent and peeled from the substrate to obtain a polyimide film, or used as a material for a laminated board or the like as it is. Moreover, what is necessary is just to fractionate the depositing polyimide by methods, such as filtration, when depositing in a solvent. The separated polyimide can be dried and dissolved in another solvent and used for applications such as a film, or can be pulverized after drying and used for injection molding or compression molding.
縮合触媒存在下の溶液中で化学閉環してイミド化する方法とは、得られた含リンポリエステルイミド前駆体であるポリアミック酸溶液に無水酢酸、およびピリジン,ピコリン,イミダゾール,キノリン,トリエチルアミン等を添加して、40℃〜160℃の範囲に1〜24時間加熱してイミド化を行うものである。反応終了後、含リンポリエステルイミドは通常は溶液の状態で得られるので、これを水、メタノール、エタノール、トルエン、キシレン、アセトン、或いはこれらの混合物である貧溶媒中に溶液を投入し、ポリイミドを析出させ、濾過することにより目的物が固形物の状態で得られる。得られたポリイミドは別の溶媒に溶解されてフイルムなどの用途に利用されるか、或いは乾燥後に粉砕されて、射出成形や圧縮成形などに供することもできる。 The method of imidization by chemical ring closure in a solution in the presence of a condensation catalyst is the addition of acetic anhydride and pyridine, picoline, imidazole, quinoline, triethylamine, etc. to the polyamic acid solution that is the resulting phosphorus-containing polyesterimide precursor. Then, imidization is performed by heating in the range of 40 ° C. to 160 ° C. for 1 to 24 hours. After completion of the reaction, the phosphorus-containing polyesterimide is usually obtained in the form of a solution. Therefore, the solution is put into a poor solvent such as water, methanol, ethanol, toluene, xylene, acetone, or a mixture thereof, and the polyimide is added. The target product is obtained in a solid state by precipitation and filtration. The obtained polyimide can be dissolved in another solvent and used for applications such as a film, or can be pulverized after drying and used for injection molding or compression molding.
以下に、本発明を具体的な実施例により示すが、本発明は実施例の内容に制限されるものではない。 Hereinafter, the present invention will be illustrated by specific examples, but the present invention is not limited to the contents of the examples.
(略語、試験方法の説明)
1H−NMRスペクトル:日本電子社製 核磁気共鳴装置 JNM−AL400 (DMSO−d6)
燃焼試験:UL規格に準じて判定した。
熱拡散率:(株)アイフェイズ社製 アイフェイズモバイル
ガラス転位温度:(株)島津製作所製 DSC−60 (昇温速度:10℃/分、窒素ガス中)
粘度:東機産業(株)製 B形粘度計 (測定温度25℃)
(Description of abbreviations and test methods)
1 H-NMR spectrum: JEOL nuclear magnetic resonance apparatus JNM-AL400 (DMSO-d 6 )
Combustion test: Determined according to UL standards.
Thermal diffusivity: manufactured by Eye Phase Co., Ltd. Eye phase mobile glass transition temperature: manufactured by Shimadzu Corporation DSC-60 (heating rate: 10 ° C./min, in nitrogen gas)
Viscosity: Toki Sangyo Co., Ltd. B-type viscometer
(実施例1)含リンエステル基含有酸二無水物(*1:TAHCHQ)の製法
攪拌機、温度計、蒸留用冷却管、窒素ガス導入管を付けた四つ口フラスコに含リン芳香族アルカンエステル(Arが下式:
で示され、RaがCH3である式(6)で表される化合物:マナック社製)32.43g(0.10モル)、トリメリット酸無水物38.43g(0.20モル)、1,2,4−トリクロロベンゼン120g及び臭化テトラフェニルホスホニウム0.42gを仕込み、窒素雰囲気下210℃で8時間反応させた。反応生成物を濾別し、粗製物を得た。粗製物をジメチルホルムアミド10%を含むトルエン溶液で1時間還流洗浄し、冷却後、濾別した。得られたウエット品を180℃で乾燥し、目的物57.0gを得た。本化合物の構造はNMRにて確認した(図1)。融点:308.0℃。
(Example 1) Method for producing phosphorus-containing ester group-containing acid dianhydride (* 1: TAHCHQ) Phosphorus-containing aromatic alkane ester in a four-necked flask equipped with a stirrer, thermometer, condenser for distillation, and nitrogen gas inlet tube (Ar is the following formula:
A compound represented by formula (6) wherein R a is CH 3 : Manac Co., Ltd.) 32.43 g (0.10 mol), trimellitic anhydride 38.43 g (0.20 mol), 120 g of 1,2,4-trichlorobenzene and 0.42 g of tetraphenylphosphonium bromide were charged and reacted at 210 ° C. for 8 hours in a nitrogen atmosphere. The reaction product was filtered off to obtain a crude product. The crude product was refluxed and washed with a toluene solution containing 10% of dimethylformamide for 1 hour, cooled and filtered. The obtained wet product was dried at 180 ° C. to obtain 57.0 g of the desired product. The structure of this compound was confirmed by NMR (FIG. 1). Melting point: 308.0 ° C.
(実施例2)含リンエステル基含有酸二無水物(*5:TAHCNQ)の製法
含リン芳香族アルカンエステルとして、Arが下式:
で示され、RaがCH3である式(6)で表される化合物45.84g(0.10モル)を用いた以外、実施例1に記載した方法に従って、本発明の式(2)で表される含リンエステル基含有酸二無水物(*5:TAHCNQ)を合成し、目的物62.1gを得た。本化合物の構造はNMRにて確認した(図2)。融点:311.2℃。
(Example 2) Method for producing phosphorus-containing ester group-containing acid dianhydride (* 5: TAHCNQ) As a phosphorus-containing aromatic alkane ester, Ar is represented by the following formula:
In accordance with the method described in Example 1, except that 45.84 g (0.10 mol) of the compound represented by formula (6) wherein R a is CH 3 is used, the formula (2) of the present invention is used. A phosphorus-containing ester group-containing acid dianhydride represented by the formula (* 5: TAHCNQ) was synthesized to obtain 62.1 g of the desired product. The structure of this compound was confirmed by NMR (FIG. 2). Melting point: 311.2 ° C.
(実施例3)
攪拌機、温度計、冷却管、窒素ガス導入管を付けた四つ口フラスコに、*2:ODA(和歌山精化工業(株)製)920.02g(0.1モル)、N−メチル−2−ピロリドン350gを仕込み、溶解させた。次に、同フラスコ内に、実施例1で得られた含リンエステル基含有酸二無水物(*1:TAHCHQ)67.25g(0.1モル)を投入した。この時、フラスコ内の温度は20℃〜45℃に保たれ、8時間攪拌を続けて反応を終了した。得られたポリアミック酸を含む反応液の粘度(B−型粘度計による)は100000mPa・sであった。続けて、このポリアミック酸をガラス板に塗布し80℃5分、130℃5分、180℃5分、210℃5分、260℃10分、310℃10分と順番に熱風乾燥機内で加熱して、熱イミド化を行った。熱イミド化の後、ガラス板からフイルムを引き剥がし、厚みを測定したところ20μmであった。DSCにより、このフイルムのガラス転位温度(Tg)を測定したところ220℃であった。このフイルムの燃焼性をUL規格に準じて判定したところ、94VTM−0であった。また、このフイルムの熱拡散率を測定したところ1.23E−7であった。
(Example 3)
In a four-necked flask equipped with a stirrer, a thermometer, a cooling tube, and a nitrogen gas introduction tube, * 2: ODA (manufactured by Wakayama Seika Kogyo Co., Ltd.) 920.02 g (0.1 mol), N-methyl-2 -350 g of pyrrolidone was charged and dissolved. Next, 67.25 g (0.1 mol) of the phosphorus-containing ester group-containing acid dianhydride (* 1: TAHCHQ) obtained in Example 1 was charged into the flask. At this time, the temperature in the flask was kept at 20 ° C. to 45 ° C., and stirring was continued for 8 hours to complete the reaction. The viscosity (by a B-type viscometer) of the obtained reaction liquid containing polyamic acid was 100,000 mPa · s. Subsequently, this polyamic acid is applied to a glass plate and heated in a hot air dryer in order of 80 ° C. for 5 minutes, 130 ° C. for 5 minutes, 180 ° C. for 5 minutes, 210 ° C. for 5 minutes, 260 ° C. for 10 minutes, and 310 ° C. for 10 minutes. Then, thermal imidization was performed. After thermal imidization, the film was peeled off from the glass plate, and the thickness was measured and found to be 20 μm. It was 220 degreeC when the glass transition temperature (Tg) of this film was measured by DSC. When the flammability of this film was determined according to the UL standard, it was 94 VTM-0. Moreover, it was 1.23E-7 when the thermal diffusivity of this film was measured.
(実施例4)
攪拌機、温度計、蒸留用冷却管、窒素ガス導入管を付けた四つ口フラスコに、実施例1で得られたTAHCHQ13.5g(0.02モル)、*3:ODPA(マナック(株)製)55.84g(0.18モル)、混合キシレン125g、N-メチル-2-ピロリドン140gを仕込み、この中にα,ω―ビス(3−アミノプロピル)ポリジメチルシロキサン(信越化学化学工業(株)製KF−8010 アミン当量415)を49.8g(0.06モル)を投入し、40℃以下で4時間攪拌した。次に、*4:BAPP(和歌山精化工業(株)製)57.47g(0.14モル)を投入して、さらに40℃以下で攪拌を4時間続けた。得られたポリアミック酸を含む反応液の粘度(B−型粘度計による)は10000mPa・sであった。さらに系内を200℃まで1時間を要して加熱攪拌し、200℃で6時間攪拌を継続した。途中留出してくる溶媒、水は蒸留用冷却管を通して系外に排出した。加熱終了後、N−メチル−2−ピロリドンで希釈して約30%濃度のポリイミド溶液を得た。得られた含リンポリエステルイミド溶液の粘度は3000mPa・sであった。この溶液をガラス板に塗布し80℃5分、130℃3分、180℃3分、210℃3分、260℃10分の順番で熱風乾燥機内で乾燥することにより溶媒を取り除いた。乾燥後、ガラス板からフイルムを引き剥がし、厚みを測定したところ20μmであった。DSCにより、このフイルムのガラス転位温度(Tg)を測定したところ130℃であった。このフイルムの燃焼性をUL規格に準じて測定したところ94VTM−1であった。
Example 4
In a four-necked flask equipped with a stirrer, a thermometer, a distillation condenser, and a nitrogen gas inlet tube, 13.5 g (0.02 mol) of TAHCHQ obtained in Example 1, * 3: ODPA (manac Co., Ltd.) ) 55.84 g (0.18 mol), mixed xylene 125 g, and N-methyl-2-pyrrolidone 140 g, and α, ω-bis (3-aminopropyl) polydimethylsiloxane (Shin-Etsu Chemical Co., Ltd.) ) 49.8 g (0.06 mol) of KF-8010 amine equivalent 415) was added and stirred at 40 ° C. or lower for 4 hours. Next, * 4: BAPP (manufactured by Wakayama Seika Kogyo Co., Ltd.) 57.47 g (0.14 mol) was added, and stirring was continued at 40 ° C. or lower for 4 hours. The viscosity (by a B-type viscometer) of the obtained reaction liquid containing polyamic acid was 10000 mPa · s. Further, the system was heated and stirred to 200 ° C. over 1 hour, and stirring was continued at 200 ° C. for 6 hours. The solvent and water distilled off in the middle were discharged out of the system through a distillation condenser. After the heating, the solution was diluted with N-methyl-2-pyrrolidone to obtain a polyimide solution having a concentration of about 30%. The viscosity of the obtained phosphorus-containing polyesterimide solution was 3000 mPa · s. This solution was applied to a glass plate, and the solvent was removed by drying in a hot air dryer in the order of 80 ° C. for 5 minutes, 130 ° C. for 3 minutes, 180 ° C. for 3 minutes, 210 ° C. for 3 minutes, and 260 ° C. for 10 minutes. After drying, the film was peeled off from the glass plate and the thickness was measured and found to be 20 μm. It was 130 degreeC when the glass transition temperature (Tg) of this film was measured by DSC. It was 94 VTM-1 when the combustibility of this film was measured according to UL specification.
(比較例1)
TAHCHQを使用しないで、ODPAの使用量を0.2モルに変えた以外は実施例4と同様の方法でフイルムを作成した。DSCにより、このフイルムのガラス転位温度(Tg)を測定したところ130℃であった。このフイルムの燃焼性をUL規格に準じて判定したところ、燃焼したので難燃性は無かった。
(Comparative Example 1)
A film was prepared in the same manner as in Example 4 except that TAHCHQ was not used and the amount of ODPA used was changed to 0.2 mol. It was 130 degreeC when the glass transition temperature (Tg) of this film was measured by DSC. When the flammability of this film was determined according to the UL standard, it was not flame retardant because it burned.
(参考例1)
リンを含有しない汎用ポリエステルイミドである東レ・デュポン(株)製カプトン(登録商標)Hの熱拡散率を測定したところ8.18E−8であった。
(Reference Example 1)
It was 8.18E-8 when the thermal diffusivity of Kapton (trademark) H by Toray DuPont Co., Ltd. which is a general purpose polyesterimide which does not contain phosphorus was measured.
本発明の含リンエステル基含有テトラカルボン酸二無水物を利用して得られるポリエステルイミドは、電子部品の軽量・短小化に伴い薄膜化しても従来と同様の耐熱難燃性を保持することができる。しかも、良好な熱拡散率を有するため、電子機器の蓄熱を有効に放熱できる。その他、エポキシ樹脂の硬化剤、その他樹脂の耐熱難燃改質剤として利用できる。 The polyesterimide obtained by using the phosphorus-containing ester group-containing tetracarboxylic dianhydride of the present invention can maintain the same heat and flame resistance as before even when the electronic parts are made lighter and shorter. it can. And since it has a favorable thermal diffusivity, the thermal storage of an electronic device can be thermally radiated effectively. In addition, it can be used as a curing agent for epoxy resins and a heat and flame retardant modifier for other resins.
Claims (3)
〔式(1)及び(2)中、
Arは、式(3):
より選択される三価の芳香族基を表し、
式(1)〜(3)中、R1、R2、R3、R4、及びR5は、同一または異なって、水素原子或いは炭素数1〜4のアルキル基を表す〕。 Phosphorus-containing ester group-containing tetracarboxylic acid represented by formula (1) or its dianhydride represented by formula (2):
[In Formula (1) and (2),
Ar represents the formula (3):
Represents a trivalent aromatic group selected from
In formulas (1) to (3), R 1 , R 2 , R 3, R 4 and R 5 are the same or different and each represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
(式(5)中、Arは請求項1の式(1)及び(2)におけるのと同義であり、R1及びR2は請求項1の式(1)〜(3)におけるのと同義であり、Xは、二価の芳香族基、脂環式基または脂肪族基を表し、Rは水素原子、或いは炭素数1〜4のアルキル基を表す)で表される反復単位を有する含リンポリエステルイミド前駆体。 Formula (5):
(In formula (5), Ar has the same meaning as in formulas (1) and (2) of claim 1, and R 1 and R 2 have the same meaning as in formulas (1) to (3) of claim 1. X represents a divalent aromatic group, alicyclic group or aliphatic group, and R represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms). Phosphor polyesterimide precursor.
(式(4)中、Arは請求項1の式(1)及び(2)におけるのと同義であり、R1及びR2は請求項1の式(1)〜(3)におけるのと同義であり、Xは請求項2の式(5)におけるのと同義である)で表される反復単位を有する含リンポリエステルイミド。 Formula (4):
(In the formula (4), Ar has the same meaning as in the formula of claim 1 (1) and (2), R 1 and R 2 are same as in the formula of claim 1 (1) - (3) Wherein X is as defined in formula (5) of claim 2).
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