JP4962565B2 - 共振素子および、その製造方法 - Google Patents
共振素子および、その製造方法 Download PDFInfo
- Publication number
- JP4962565B2 JP4962565B2 JP2009512910A JP2009512910A JP4962565B2 JP 4962565 B2 JP4962565 B2 JP 4962565B2 JP 2009512910 A JP2009512910 A JP 2009512910A JP 2009512910 A JP2009512910 A JP 2009512910A JP 4962565 B2 JP4962565 B2 JP 4962565B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- main surface
- coupling
- substrate
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 46
- 230000008878 coupling Effects 0.000 claims description 112
- 238000010168 coupling process Methods 0.000 claims description 112
- 238000005859 coupling reaction Methods 0.000 claims description 112
- 239000000758 substrate Substances 0.000 claims description 63
- 239000010410 layer Substances 0.000 claims description 48
- 239000011521 glass Substances 0.000 claims description 40
- 239000000919 ceramic Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 14
- 239000011241 protective layer Substances 0.000 claims description 12
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 11
- 238000000206 photolithography Methods 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims 1
- 239000002003 electrode paste Substances 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 238000013461 design Methods 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- 238000010304 firing Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 230000005672 electromagnetic field Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
- H01P1/20327—Electromagnetic interstage coupling
- H01P1/20336—Comb or interdigital filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/008—Manufacturing resonators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/088—Stacked transmission lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P7/00—Resonators of the waveguide type
- H01P7/08—Strip line resonators
- H01P7/084—Triplate line resonators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
- Y10T29/4916—Simultaneous circuit manufacturing
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Description
2…厚膜ガラス層
3A,3B…結合調整用電極
4A…はみ出し電極
10…基板
11A,11B,12A,12B,12C,18…側面電極
13A,13B,14…主面電極
15…接地電極
16A,16B,16C…端子電極
31,51…フィルタ
32A,32B,52A,52B,52C…結合調整用電極
38A,33A,34,33B,38B,53A,54A,54B,53B…主面電極
39A,59A…はみ出し電極
Claims (7)
- 誘電体からなる基板と、前記基板の裏主面側に形成した接地電極と、前記基板の表主面に形成した、前記接地電極および前記誘電体とともに共振器を構成する主面電極と、前記基板および前記主面電極の、表主面側の略全面に形成した電極保護層と、前記電極保護層の表主面側に形成した、両端が2つの共振器の主面電極に対向する結合調整用電極と、を備える共振素子の製造方法であって、
前記結合調整用電極の形状を製造ロットごとに設定する設定ステップと、
予め焼結された前記基板および前記電極保護層の表主面側に、製造ロットごとに前記設定ステップで設定された形状で前記結合調整用電極を形成し、前記結合調整用電極を前記電極保護層に焼き付ける形成ステップと、
を順に含む共振素子の製造方法。 - 前記設定ステップは、各製造ロットにおける前記共振器の所定の特性を測定し、その結果に基づいて、前記結合調整用電極の形成サイズを設定する工程である請求項1に記載の共振素子の製造方法。
- 前記形成ステップは、フォトリソグラフィプロセスにより前記結合調整用電極を形成するステップであり、
前記設定ステップは、前記フォトリソグラフィプロセスにおける露光時間または、露光マスクの開口形状を製造ロットごとに設定するステップである請求項2に記載の共振素子の製造方法。 - 前記電極保護層は、前記親基板よりも誘電率の低いものである請求項1〜3のいずれかに記載の共振素子の製造方法。
- 前記電極保護層はSiO2を主成分とする厚膜ガラスである請求項4に記載の共振素子の製造方法。
- 誘電体からなるセラミック基板と、前記セラミック基板の裏主面側に形成した接地電極と、前記セラミック基板の表主面に形成した、前記接地電極および前記誘電体とともに共振器を構成する主面電極と、前記セラミック基板および前記主面電極の、表主面側の略全面に形成した電極保護層と、前記電極保護層の表主面側に形成した、両端が2つの共振器の主面電極に対向する結合調整用電極と、を備える共振素子であって、
前記電極保護層は、SiO2を主成分とする焼結された厚膜ガラスであることを特徴とする共振素子。 - 前記結合調整用電極は、予め焼成された前記セラミック基板および前記電極保護層の表主面側にパターン形成されてから、前記電極保護層に焼き付けられてなることを特徴とする請求項6に記載の共振素子。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009512910A JP4962565B2 (ja) | 2007-04-27 | 2008-04-10 | 共振素子および、その製造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007118755 | 2007-04-27 | ||
JP2007118755 | 2007-04-27 | ||
PCT/JP2008/057079 WO2008136249A1 (ja) | 2007-04-27 | 2008-04-10 | 共振素子および、その製造方法 |
JP2009512910A JP4962565B2 (ja) | 2007-04-27 | 2008-04-10 | 共振素子および、その製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2008136249A1 JPWO2008136249A1 (ja) | 2010-07-29 |
JP4962565B2 true JP4962565B2 (ja) | 2012-06-27 |
Family
ID=39943366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009512910A Expired - Fee Related JP4962565B2 (ja) | 2007-04-27 | 2008-04-10 | 共振素子および、その製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7866028B2 (ja) |
JP (1) | JP4962565B2 (ja) |
WO (1) | WO2008136249A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101480754B1 (ko) | 2013-06-05 | 2015-01-09 | 한국과학기술원 | Pcb의 캐비티 공진을 이용한 무선 전력 송수신기 및 이의 제작 방법 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5133091B2 (ja) * | 2008-02-28 | 2013-01-30 | 太陽誘電株式会社 | 電子部品及びその製造方法 |
US7772941B2 (en) * | 2008-06-12 | 2010-08-10 | Hong Kong Applied Science And Technology Research Institute Co., Ltd. | Ultra-wideband/dualband broadside-coupled coplanar stripline balun |
JPWO2011058825A1 (ja) * | 2009-11-11 | 2013-03-28 | 株式会社村田製作所 | ストリップラインフィルタ、およびその製造方法 |
US8949080B2 (en) | 2010-08-25 | 2015-02-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods of designing integrated circuits and systems thereof |
CN101986458B (zh) * | 2010-09-16 | 2015-09-09 | 深圳市大富科技股份有限公司 | 谐振管加工方法及谐振管 |
US10374315B2 (en) | 2015-10-28 | 2019-08-06 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
US10601137B2 (en) | 2015-10-28 | 2020-03-24 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
US10355361B2 (en) | 2015-10-28 | 2019-07-16 | Rogers Corporation | Dielectric resonator antenna and method of making the same |
US10476164B2 (en) | 2015-10-28 | 2019-11-12 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
US11367959B2 (en) | 2015-10-28 | 2022-06-21 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
US11876295B2 (en) | 2017-05-02 | 2024-01-16 | Rogers Corporation | Electromagnetic reflector for use in a dielectric resonator antenna system |
US11283189B2 (en) | 2017-05-02 | 2022-03-22 | Rogers Corporation | Connected dielectric resonator antenna array and method of making the same |
GB2575946B (en) | 2017-06-07 | 2022-12-14 | Rogers Corp | Dielectric resonator antenna system |
US10892544B2 (en) | 2018-01-15 | 2021-01-12 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
US10910722B2 (en) | 2018-01-15 | 2021-02-02 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
US11616302B2 (en) | 2018-01-15 | 2023-03-28 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
US11552390B2 (en) | 2018-09-11 | 2023-01-10 | Rogers Corporation | Dielectric resonator antenna system |
US11031697B2 (en) | 2018-11-29 | 2021-06-08 | Rogers Corporation | Electromagnetic device |
US11637377B2 (en) | 2018-12-04 | 2023-04-25 | Rogers Corporation | Dielectric electromagnetic structure and method of making the same |
US11482790B2 (en) | 2020-04-08 | 2022-10-25 | Rogers Corporation | Dielectric lens and electromagnetic device with same |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59191902A (ja) * | 1983-04-15 | 1984-10-31 | Hitachi Ltd | フイルタ |
JPH03262303A (ja) * | 1990-03-13 | 1991-11-22 | Tokimec Inc | 分布型結合フィルタ |
DE69411973T2 (de) * | 1993-03-25 | 1998-12-10 | Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka | Geschichteter dielektrischer Resonator und dielektrisches Filter |
JP3176859B2 (ja) * | 1996-12-28 | 2001-06-18 | 東光株式会社 | 誘電体フィルタ |
JP3481069B2 (ja) * | 1997-02-26 | 2003-12-22 | 日本特殊陶業株式会社 | トリミングコンデンサ付積層回路 |
CN1243604A (zh) * | 1997-09-08 | 2000-02-02 | 日本碍子株式会社 | 压电/电致伸缩器件 |
JP3390344B2 (ja) | 1998-07-07 | 2003-03-24 | 日本碍子株式会社 | 積層型誘電体フィルタ及び高周波回路基板 |
JP2004147300A (ja) | 2002-10-04 | 2004-05-20 | Matsushita Electric Ind Co Ltd | 共用器、並びにそれを用いた積層型高周波デバイス及び通信機器 |
US7012481B2 (en) * | 2002-10-04 | 2006-03-14 | Matsushita Electric Industrial Co., Ltd. | Duplexer, and laminate-type high-frequency device and communication equipment using the same |
US7369018B2 (en) * | 2004-08-19 | 2008-05-06 | Matsushita Electric Industrial Co., Ltd. | Dielectric filter |
JP3942620B2 (ja) * | 2004-08-19 | 2007-07-11 | 松下電器産業株式会社 | 誘電体フィルタ |
CN101361222A (zh) * | 2006-09-29 | 2009-02-04 | 株式会社村田制作所 | 平衡不平衡转换元件和平衡不平衡转换元件的制造方法 |
-
2008
- 2008-04-10 JP JP2009512910A patent/JP4962565B2/ja not_active Expired - Fee Related
- 2008-04-10 WO PCT/JP2008/057079 patent/WO2008136249A1/ja active Application Filing
-
2009
- 2009-04-28 US US12/431,129 patent/US7866028B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101480754B1 (ko) | 2013-06-05 | 2015-01-09 | 한국과학기술원 | Pcb의 캐비티 공진을 이용한 무선 전력 송수신기 및 이의 제작 방법 |
Also Published As
Publication number | Publication date |
---|---|
WO2008136249A1 (ja) | 2008-11-13 |
US20090206957A1 (en) | 2009-08-20 |
JPWO2008136249A1 (ja) | 2010-07-29 |
US7866028B2 (en) | 2011-01-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4962565B2 (ja) | 共振素子および、その製造方法 | |
US7629867B2 (en) | Filter element and method for manufacturing the same | |
JP3115149B2 (ja) | 積層型誘電体フィルタ | |
US7907036B2 (en) | Microstripline filter and method for manufacturing the same | |
US7567143B2 (en) | Balanced-unbalanced transformation device and method for manufacturing balanced-unbalanced transformation device | |
JP4266380B2 (ja) | 積層型フィルタ | |
US7982559B2 (en) | Stripline filter | |
JP5163654B2 (ja) | ストリップラインフィルタおよびその製造方法 | |
JP4561836B2 (ja) | チップ素子 | |
US8130062B2 (en) | Microstripline filter | |
JPH05243812A (ja) | 積層型誘電体フィルタ | |
US20100090776A1 (en) | Balance-Unbalance Conversion Element | |
JPH05267905A (ja) | 積層型誘電体フィルタ | |
JP2000058382A (ja) | チップ型cr部品 | |
JP2810621B2 (ja) | 積層型誘電体フィルタ | |
US20090219115A1 (en) | Resonant Element and Method for Manufacturing the Same | |
JP4985761B2 (ja) | マイクロストリップラインフィルタ | |
US8203401B2 (en) | Strip line filter | |
JPH0621703A (ja) | 誘電体フィルターの周波数特性の調整方法 | |
JP2003060466A (ja) | 積層型lc複合部品 | |
JP2000349532A (ja) | アンテナ装置 | |
JP2002111308A (ja) | 積層型誘電体フィルタ | |
JPH05199010A (ja) | バンドパスフィルタ | |
JP2001102823A (ja) | ストリップライン共振器 | |
JP2561775C (ja) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120228 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120312 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4962565 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150406 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |