JP4826348B2 - Method for producing multilayer ceramic electronic component with protruding electrodes - Google Patents

Description

The present invention relates to a method for manufacturing a multilayer ceramic electronic component, and more particularly to a method for manufacturing a multilayer ceramic electronic component with protruding electrodes having a structure in which protruding electrodes are disposed on the surface.

  In recent years, the performance of electronic components in the electronics field has improved remarkably, contributing to faster information processing speeds, smaller devices, and more functions in information processing devices such as large computers, mobile communication terminals, and personal computers. Yes.

  As one of such electronic components, there is a multichip module (MCM) in which a plurality of semiconductor devices such as VLSI and ULSI are mounted on a ceramic substrate. In such a module, a ceramic multilayer substrate in which wiring conductors are three-dimensionally arranged is widely used in order to increase the mounting density of LSIs and to electrically connect the LSIs reliably.

  This ceramic multilayer substrate is formed by laminating a plurality of ceramic layers, and is provided with wiring conductors for circuit configuration on the surface or inside thereof, but is representative of cellular phones, automobile wireless communication devices, etc. In such mobile communication terminals, the demand for high-functional and high-density mounting has become strict, and further miniaturization is required. In addition, the demand for impact resistance of products using ceramic multilayer substrates is increasing due to their use.

  By the way, multilayer ceramic electronic components represented by such a ceramic multilayer substrate include ceramic layers 71, 72, 73, in-plane conductors 74, via hole conductors 76 filled in via holes 75, and the like, as shown in FIG. And a bump (projection electrode) 54 disposed so as to be connected to the conductor pattern 51 on the first main surface 53 of the multilayer ceramic body 52. Some have a structure (see Patent Document 1).

This multilayer ceramic electronic component is manufactured by the following method. The multilayer ceramic electronic component will be described with reference to FIG.
(1) A ceramic green sheet 80 is prepared by printing a conductive paste 81 to be an in-plane conductor 74 on the surface and / or filling a through hole (via hole) 75 with a conductive paste 82 to be a via-hole conductor 76. Laminate so as to be in the order and form.

  (2) The upper surface of the laminate is filled with a conductive paste 83 made of a ceramic material that is not substantially sintered at the temperature at which the ceramic green sheet 80 is sintered, and for forming the bumps 54 in the via holes 75. The ceramic green sheets 91 are laminated.

  (3) Furthermore, ceramic green sheets 92 and 93 made of a hard-to-sinter ceramic material that is not substantially sintered at the temperature at which the ceramic green sheet 80 is sintered are formed on the upper and lower main surfaces. The sheet 80 is laminated as a shrinkage suppression layer for suppressing shrinkage in the planar direction.

  (4) Then, although the ceramic green sheet 80 is sintered as a whole, the ceramic green sheet 91 in which the conductive paste 83 for bump formation is filled in the via hole 75 and the ceramic green sheets 92 and 93 which are shrinkage suppression layers are Firing at a temperature that does not sinter.

(5) Thereafter, the unsintered ceramic green sheets (shrinkage suppression layers) 92 and 93 and the unsintered ceramic green sheet 91 are removed.
Thereby, a multilayer ceramic electronic component having a structure as shown in FIG. 8 is obtained.

However, in the conventional method for manufacturing a multilayer ceramic electronic component, a step of removing the unsintered ceramic green sheets (shrinkage suppression layers) 92 and 93 and the unsintered ceramic green sheet 91 is necessary.
The removal of the plate-like shrinkage suppression layers 92 and 93 is relatively easy. However, when removing the ceramic green sheet 91 for bump formation, the ceramic green sheet 91 is formed with sintered bumps. For this reason, a mechanical removal operation using a brush or a removal operation using ultrasonic cleaning is required, which is not only troublesome, but also the bump 54 is removed in the removal process of the ceramic green sheet 91 for bump formation. There is a problem that the reliability is low.
Note that the smaller the plane cross-sectional area of the bump is, the smaller the bump is, the greater the risk of falling off.

  Also, it is difficult to remove the ceramic green sheet for bump formation between the bumps arranged at high density, especially near the base of the bump, and the glass diffused from the substrate side, that is, the sintered ceramic green sheet side. There is a problem that the ceramic sheet for bump formation is partially fixed to the substrate side even if it is substantially unsintered due to components or the like.

  Further, since the height of the bump 54 corresponds to the thickness of the hard-to-sinter ceramic green sheet 91 for bump formation, the suppression of shrinkage during firing depends on the hard-to-sinter ceramic green sheet 91 for bump formation. If the thickness of the hard-to-sinter ceramic green sheet 91 for bump formation corresponding to the height of the bump 54 does not provide a sufficient shrinkage suppression effect, the hard-to-sinter ceramic green for bump formation is obtained. Further, it is necessary to laminate a non-sinterable ceramic green sheet for suppressing shrinkage on the surface of the sheet 91, and there is a problem that the manufacturing process becomes complicated.

  It should be noted that increasing the thickness of the non-sinterable ceramic green sheet for suppressing shrinkage on only one surface may cause deformation factors such as warping of the multilayer ceramic body after firing. When the sinterable ceramic green sheet is thickened, it is inevitably necessary to increase the thickness of the non-sinterable ceramic green sheet for suppressing shrinkage on the other side as well. There is a problem in that the amount of use increases and the manufacturing process becomes complicated.

  Furthermore, according to the above-described conventional method for producing a multilayer ceramic electronic component, the non-sinterable ceramic green sheet for suppressing shrinkage needs to be disposed on the entire main surface of the multilayer ceramic body. There is a problem in that removal of the hardly sinterable ceramic green sheet on the (surface electrode) tends to be insufficient, and surface treatment defects and mounting component mounting defects are likely to occur.

Furthermore, since the multilayer ceramic body itself exhibits shrinkage behavior, if slippage occurs between the hard-to-sinter ceramic green sheet for bump formation and the multilayer ceramic body, the multilayer ceramic body is connected to the multilayer ceramic body with high accuracy. Therefore, there is a problem in that the necessary bump portion is displaced and a disconnection failure occurs.
JP-A-6-53655

The present invention solves the above-mentioned problems, and a multilayer with a protruding electrode that can efficiently manufacture a multilayer ceramic electronic component having a protruding electrode on its surface without requiring a complicated manufacturing process. An object of the present invention is to provide a method for manufacturing a ceramic electronic component.

In order to solve the above-mentioned problems, a method for producing a multilayer ceramic electronic component with protruding electrodes according to the present invention (Claim 1)
A non-sintered multilayer ceramic body comprising a non-sintered ceramic base material layer and a non-sintered ceramic base material layer having a non-sintered conductor pattern, wherein a non-sintered ceramic base material layer and a shrinkage suppression layer for suppressing shrinkage in a planar direction are laminated. An auxiliary layer having unsintered protruding electrodes is formed on the first main surface of the unsintered multilayer ceramic element through a disappearing layer in which at least a main part disappears at the firing temperature of the unsintered ceramic base layer. Forming a laminated body arranged in such a manner that the unsintered conductor pattern of the body and the unsintered protruding electrode are in contact with each other;
The laminate is fired at a temperature at which the unsintered ceramic base layer and the unsintered protruding electrode sinter, thereby eliminating at least the main part of the disappearing layer and the unsintered ceramic base. And a step of sintering the material layer and the unsintered protruding electrode.

  According to a second aspect of the present invention, there is provided a method for producing a multilayer ceramic electronic component with protruding electrodes, wherein the auxiliary layer is at a sintering temperature of the ceramic constituting the unsintered ceramic base layer. A ceramic auxiliary layer mainly composed of a ceramic powder that is not substantially sintered, and further comprising a step of removing the substantially unsintered ceramic auxiliary layer after the firing.

  According to a third aspect of the present invention, there is provided a method for manufacturing a multilayer ceramic electronic component with protruding electrodes, wherein the surface-mounted electronic component is mounted on the upper end face of the sintered protruding electrode in the configuration of the invention of claim 1 or 2. The method further includes a process.

  According to a fourth aspect of the present invention, there is provided a method for producing a multilayer ceramic electronic component with protruding electrodes, wherein the auxiliary layer and the disappearing layer are formed of the unsintered multilayer ceramic body in the configuration of any one of the first to third aspects. It arrange | positions to a partial area | region of said 1st main surface.

  Moreover, the manufacturing method of the multilayer ceramic electronic component with a protruding electrode of Claim 5 WHEREIN: In the structure of any one of Claims 1-4, in the said 1st main surface side of the said non-sintered multilayer ceramic body, The shrinkage suppression layer is provided.

  According to a sixth aspect of the present invention, there is provided a method for producing a multilayer ceramic electronic component with protruding electrodes, wherein the unsintered ceramic base layer is mainly composed of a low-temperature sintered ceramic. The shrinkage-suppressing layer is a shrinkage-suppressing layer mainly composed of a hardly-sinterable ceramic that does not substantially sinter at the sintering temperature of the low-temperature sintered ceramic. It is characterized by.

  The method for producing a multilayer ceramic electronic component with protruding electrodes according to claim 7 is characterized in that the hardly sinterable ceramic is fixed by glass that has exuded from the unsintered ceramic base layer during firing. Yes.

  Moreover, the manufacturing method of the multilayer ceramic electronic component with a protruding electrode of Claim 8 WHEREIN: The structure of any one of Claims 1-7 WHEREIN: The said vanishing layer is the said firing temperature of the said unsintered ceramic base material layer. It is characterized by being a resin layer made of a resin that decomposes or burns.

  The method for producing a multilayer ceramic electronic component with protruding electrodes according to claim 9 is the structure of any one of claims 1 to 8, wherein the auxiliary layer is provided on the vanishing layer, and then the auxiliary layer and Forming a through-hole penetrating the vanishing layer and stacking the layer filled with the conductive paste on the first main surface of the unsintered multilayer ceramic body to form the laminate. It is a feature.

  The method for producing a multilayer ceramic electronic component with projecting electrodes according to claim 10 is the case where a plurality of the unsintered projecting electrodes are formed in the auxiliary layer in the configuration of any one of the inventions according to claims 1 to 9. In this embodiment, a slit from the upper main surface to the lower main surface of the auxiliary layer is formed at a position between the unsintered protruding electrodes of the auxiliary layer.

  The method for producing a multilayer ceramic electronic component with protruding electrodes according to the present invention (Claim 1) is a non-sintered multi-layer ceramic having a non-sintered conductor pattern in which a non-sintered ceramic base layer and a shrinkage suppression layer are laminated. An auxiliary layer having an unsintered protruding electrode is formed on the first main surface of the element body via a disappearing layer in which at least the main part disappears in the firing step, and the unsintered conductive pattern of the unsintered multilayer ceramic element body A laminated body is formed so as to be in contact with the unsintered protruding electrode, and the laminated body is fired at a temperature at which the unsintered ceramic substrate layer and the unsintered protruding electrode are sintered. In addition, at least the main part of the disappearing layer disappears, and the unsintered ceramic base layer and the unsintered protruding electrode are sintered, so that the shrinkage of the multilayer ceramic body in the plane direction during the firing process Suppress the behavior, make the conventional Has been a problem in the process, it is possible to suppress the positional displacement of the protruding electrodes.

  In addition, even when an auxiliary layer for forming the protruding electrode is provided only on one main surface side of the multilayer ceramic body by disposing the shrinkage suppression layer on the multilayer ceramic body, the firing step It is possible to suppress the deformation (warping, etc.) of the multilayer ceramic body.

  By disposing the shrinkage suppression layer at an appropriate position between the ceramic base layers constituting the multilayer ceramic body, it becomes possible to reliably suppress the shrinkage behavior of the multilayer ceramic body, and the positional deviation of the protruding electrodes, Specifically, it is possible to suppress and prevent the occurrence of misalignment between the protruding electrode and the conductor pattern (connection electrode) to which the protruding electrode disposed on the multilayer ceramic body is to be connected.

  Further, the unsintered conductive pattern of the unsintered multilayer ceramic body to which the protruding electrodes are connected is a part of the unsintered conductor pattern for the circuit disposed on the unsintered multilayer ceramic body. Alternatively, it may be a connection electrode such as a via-hole conductor disposed for the purpose of connecting the protruding electrode. Further, the connection electrode may be connected to the circuit conductor pattern.

  In the present invention, as the auxiliary layer, for example, a ceramic green sheet mainly composed of a hardly sinterable ceramic powder can be cited as a preferred example. In addition, for example, a resin sheet or the like can be used. Is possible.

  Moreover, like the manufacturing method of the multilayer ceramic electronic component with a protruding electrode of Claim 2, in the structure of invention of Claim 1, an auxiliary | assistant layer is made into the sintering temperature of the ceramic which comprises a non-sintered ceramic base material layer. When the ceramic auxiliary layer is composed mainly of ceramic powder that does not substantially sinter, and the substantially unsintered ceramic auxiliary layer is removed after firing, the vanishing layer disappears in the firing step, and the ceramic A gap is formed between the auxiliary layer and the multilayer ceramic body, and the ceramic auxiliary layer remains in a substantially unsintered state after firing, so there is no need to apply a large force on the ceramic. The auxiliary layer can be easily removed, and the present invention can be made more effective.

  The ceramic auxiliary layer is filled with a resin without removing the unsintered ceramic auxiliary layer, so that the ceramic auxiliary layer is mounted on the pedestal portion provided with the protruding electrodes, that is, mounted on the surface mounting type electronic component. It can also be used as a pedestal for the purpose.

  Further, as in the method of manufacturing a multilayer ceramic electronic component with protruding electrodes according to claim 3, in the configuration of the invention according to claim 1 or 2, a surface mount type electronic component is mounted on the upper end face of the sintered protruding electrode. By further including the step of performing, it is possible to obtain a high-performance multilayer ceramic electronic component in which a surface-mount type electronic component such as a semiconductor element is mounted on the protruding electrode, and high-density mounting is possible.

  In the present invention, examples of the surface-mounted electronic component mounted on the upper end surface of the protruding electrode include a transistor, an IC, and an LSI, but the multilayer ceramic electronic component with the protruding electrode of the present invention is exemplified. In this case, since it is suitable for a mounting structure of a surface mounting type electronic component having a large number of narrow gap I / O terminals in a substantially same plane, for example, a BGA (Ball Grid Array) connection type such as an IC or LSI. This is particularly significant when a large semiconductor element is mounted with a bare chip.

  Further, in the present invention, the auxiliary layer and the disappearance layer are not limited to the configuration in which the auxiliary layer and the disappearance layer are disposed on the entire surface of the multilayer ceramic body. It is also possible to arrange the layer in a partial region of the first main surface of the unsintered multilayer ceramic body, and the protruding electrode is formed only in a predetermined region of the first main surface of the multilayer ceramic body. The multilayer ceramic electronic component can be efficiently manufactured. Therefore, it is possible to improve the degree of freedom in the configuration of the multilayer ceramic electronic component with protruding electrodes that can be manufactured.

  From the standpoint of ensuring ease of removal of the auxiliary layer by reliably suppressing the auxiliary layer from adhering to the ceramic base layer constituting the multilayer ceramic body, the disappearing layer is defined as the projected area of the auxiliary layer. It is preferable to form the same or slightly larger than that.

  Further, as in the method for producing a multilayer ceramic electronic component with protruding electrodes according to claim 5, in the configuration of any one of claims 1 to 4, on the first main surface side of the unsintered multilayer ceramic body, When the shrinkage suppression layer is provided, it is possible to more reliably suppress the positional deviation between the protruding electrode and the conductor pattern of the multilayer ceramic body, and the present invention can be further effectively realized.

  That is, there is a mismatch in sintering shrinkage behavior between the unsintered protruding electrode and the ceramic constituting the unsintered multilayer ceramic body, but the surface of the unsintered multilayer ceramic body is substantially By positioning the non-sintered shrinkage suppression layer, it is possible to suppress the occurrence of mismatching of the sintering shrinkage behavior and to suppress the positional deviation between the two.

  In addition, as in the method for producing a multilayer ceramic electronic component with protruding electrodes according to claim 6, in the structure of any one of claims 1 to 5, the unsintered ceramic base layer is mainly composed of a low-temperature sintered ceramic. When the unsintered ceramic base layer is used as a component, and the shrinkage suppression layer is a shrinkage suppression layer mainly composed of a hard-to-sinter ceramic that does not sinter substantially at the sintering temperature of the low-temperature sintered ceramic, The multilayer ceramic body can be surely fired at a low temperature without causing shrinkage in the planar direction, so that the dimensional accuracy in the planar direction is high and the desired characteristics are achieved while reducing the manufacturing cost. It is possible to provide a reliable multilayer ceramic electronic component with protruding electrodes.

  Further, as in the method for producing a multilayer ceramic electronic component with protruding electrodes according to claim 7, the non-sinterable ceramic constituting the shrinkage suppression layer is made of glass that has exuded from the unsintered ceramic base layer during firing. When fixed to the surroundings, the shrinkage suppression layer is integrated with the ceramic base material layer that constitutes the multilayer ceramic body, so it is not necessary to remove the shrinkage suppression layer after firing, simplifying the manufacturing process. Can be achieved.

Moreover, like the manufacturing method of the multilayer ceramic electronic component with a protruding electrode of Claim 8, in the structure of any one of Claims 1-7, a loss | disappearance layer is made into the calcination temperature of a non-sintered ceramic base material layer. When the resin layer is made of a resin that decomposes or burns, the lost layer can be efficiently lost in the firing step, and the present invention can be more effectively realized.
In the present invention, the “decomposing” resin means a resin that is decomposed into carbon dioxide gas, organic gas, and the like, and examples of such a resin include acrylic resins. The “burning resin” means a resin that generates carbon dioxide by bonding with oxygen, and examples of such a resin include butyral resins. It is also possible to use a resin that causes both “decomposition” and “combustion”.
However, the material constituting the vanishing layer is not limited to this, and other materials can be used.

  In addition, as in the method for producing a multilayer ceramic electronic component with protruding electrodes according to claim 9, in the configuration of any one of claims 1 to 8, after the auxiliary layer is provided on the disappearing layer, the auxiliary layer and the disappearing When the above-mentioned laminate is formed by forming a through hole penetrating the layer and stacking the layer filled with the conductive paste on the first main surface of the unsintered multilayer ceramic body The laminated body in which the auxiliary layer having the protruding electrode is disposed on the first main surface of the unsintered multilayer ceramic body can be efficiently formed, and the present invention can be further effectively realized.

  For example, on a carrier film that is made of resin and will function as a vanishing layer, a ceramic slurry mainly composed of a hard-to-sinter ceramic powder is applied, and through holes are formed there by laser processing or the like. A ceramic green sheet with a so-called carrier film filled with a conductive paste in the holes is attached to the first main surface of the unsintered multilayer ceramic body, to the first main surface of the unsintered multilayer ceramic body, It becomes possible to efficiently form a laminate in which an auxiliary layer having an unsintered protruding electrode is disposed via the vanishing layer (carrier film).

However, the conductive paste that fills the through-holes formed in the auxiliary layer preferably does not contain a component that reacts with the auxiliary layer, and more specifically, substantially contains a sintering aid component such as glass frit. It is desirable that it is not contained. However, the addition is not particularly hindered as long as it does not adversely affect conductivity, dropout, and the like.
Furthermore, from the standpoint of improving the peelability from the auxiliary layer and allowing the auxiliary layer to be easily removed without causing the protruding electrodes to drop off, the conductive layer is sufficiently contracted in the firing process as a conductive paste for filling the auxiliary layer. Thus, it is desirable to use a material that can form a gap with the surrounding auxiliary layer.

  Moreover, like the manufacturing method of the multilayer ceramic electronic component with a protruding electrode of Claim 10, in the structure of any one of Claims 1-9, a plurality of said unsintered protruding electrodes are formed in the auxiliary layer. In this case, by forming a slit from the upper main surface to the lower main surface of the auxiliary layer at a position between each unsintered protruding electrode of the auxiliary layer, it is substantially unbaked after firing. As a result, the auxiliary layer in which the slits are formed at positions between the unsintered protruding electrodes can be removed very easily, and the present invention can be more effectively realized.

  The features of the present invention will be described in more detail below with reference to examples of the present invention.

FIG. 1 is a cross-sectional view showing a configuration of a multilayer ceramic electronic component manufactured by a method for manufacturing a multilayer ceramic electronic component according to an embodiment (Example 1) of the present invention.
As shown in FIG. 1, the multilayer ceramic electronic component includes a ceramic base material layer 101 and a shrinkage suppression layer 103 for suppressing the shrinkage of the ceramic base material layer 101 in the planar direction, and a predetermined conductor. The multilayer ceramic body 104 on which the pattern 102 is disposed, and the lower end surface in contact with the multilayer ceramic body 104 disposed on the first main surface 104a of the multilayer ceramic body 104 so as to be connected to the conductor pattern 102 A protruding electrode 108 having a trapezoidal shape in which the area of the (bottom surface) 106 is larger than the area of the upper end surface (upper surface) 107 facing the bottom surface 106, and the solder electrode 109 is disposed on the protruding electrode 108. And a surface-mounted electronic component 110 provided.
In this multilayer ceramic electronic component, the conductor pattern 102 is filled with the in-plane conductor 111, the external conductor 114 disposed on the surface of the multilayer ceramic body 104, and the via hole 112, and the in-plane conductor 111 existing in different layers. Are formed from via-hole conductors 113 for connecting the in-plane conductors 111 and connecting the in-plane conductor 111 and the external conductor 114.
Further, the lower end face 106 of the protruding electrode 108 is connected and fixed to the connection electrode 102 a that is a part of the conductor pattern 102 of the multilayer ceramic body 104.

Hereinafter, a method for manufacturing the multilayer ceramic electronic component will be described with reference to the cross-sectional views of FIGS.
FIG. 2A is a cross-sectional view showing the structure of a laminate formed in one step of the method for manufacturing a multilayer ceramic electronic component according to Example 1 of the present invention before being fired, and FIG. FIG. 2 is an enlarged cross-sectional view showing a main part.

  (1) First, a laminate A shown in FIGS. 2A and 2B is manufactured. In producing this laminate A, a non-sintered conductor obtained by laminating a non-sintered ceramic base layer 1 and a shrinkage suppression layer 3 for suppressing the shrinkage of the non-sintered ceramic base layer 1 in the planar direction. An unsintered protruding electrode 8 is formed on the first main surface 4a of the unsintered multilayer ceramic body 4 provided with the pattern 2 via a vanishing layer 5 that disappears at the firing temperature of the unsintered ceramic base material layer 1. The unsintered connecting electrode 2a, which is a part of the unsintered conductor pattern 2 of the unsintered multilayer ceramic body 4, and the lower end face 6 of the unsintered projecting electrode 8 are in contact with each other. Arranged in such a manner. As a result, a laminate A having a structure as shown in FIGS. 2A and 2B is formed.

The unsintered conductor pattern 2 is a conductive material for via-hole conductors filled in the through-holes 12 formed in the conductive paste 11 for in-plane conductors, the unsintered ceramic base material layer 1 and the shrinkage suppression layer 3. The paste 13 is formed from an outer conductor conductive paste 14 disposed on the surface of the unsintered multilayer ceramic body 1.
In addition, the conductor pastes 11 for predetermined in-plane conductors disposed in different layers, or the conductor paste 11 for predetermined in-plane conductors and the conductor paste 14 for external conductors are formed by replacing the conductor paste 13 for via-hole conductors. Are connected to each other.

When forming the above-described laminate A, specifically, first, a ceramic green sheet that will form the unsintered ceramic base material layer 1 and the shrinkage suppression layer 3 is prepared, and the ceramic green sheet is appropriately formed. Conductive pastes 11, 13, and 14 for forming in-plane conductors, via-hole conductors, and external conductors are applied.
And the shrinkage | contraction suppression layer 3 is arrange | positioned at the upper and lower main surfaces of the unsintered multilayer ceramic body 4, and is arrange | positioned between the unsintered ceramic base material layers 1 which comprise the unsintered multilayer ceramic body 4. Thus, the ceramic green sheets are laminated and pressure-bonded in a predetermined order and direction, and an unsintered multilayer ceramic body (ceramic green sheet molded body) 4 as shown in FIGS. 2 (a) and 2 (b) is obtained. obtain.

In Example 1, a Ba—Al—Si—O-based ceramic material was used as the unsintered ceramic base layer 1, and a ceramic green sheet mainly composed of alumina was used as the shrinkage suppression layer 3.
The main component is ceramic powder that is prepared in advance and that does not substantially sinter at the sintering temperature of the ceramic constituting the unsintered ceramic base material layer 1 on which the vanishing layer 5 is disposed on one main surface. In the auxiliary layer 21, a protruding electrode forming through hole 22 that penetrates both the auxiliary layer 21 and the disappearing layer 5 is formed, and the protruding electrode forming conductive paste is formed in the protruding electrode forming through hole 22. (Unsintered protruding electrode 8) is filled. In addition, in this Example 1, on the carrier film (disappearance layer) which lose | disappears the above-mentioned shrinkage | contraction suppression layer 3 by baking processes, such as resin, as the auxiliary | assistant layer 21 by which the loss | disappearance layer 5 was arrange | positioned by one main surface. Is used.
When the shrinkage suppression layer 3 includes a glass component, a layer made of a material obtained by removing the glass component from the material constituting the shrinkage suppression layer 3 can be used as the auxiliary layer 21.

In addition, as a carrier film which functions as the vanishing layer 5, a sheet made of polypropylene is used.
Then, the auxiliary layer 21 in which the through hole 22 is filled with the conductive paste for forming the protruding electrode is placed at a predetermined position of the unsintered multilayer ceramic body (ceramic green sheet molded body) 4 so that the vanishing layer 5 is unfired. The laminated multilayer ceramic body 4 is laminated and pressure-bonded so as to be on the side. Thereby, the laminated body A which has a structure as shown to Fig.2 (a), (b) is obtained.

At this time, the auxiliary layer 21 is aligned in advance on, for example, another carrier film and is held on the carrier film, so that the unsintered multilayer ceramic element is efficiently obtained. The auxiliary layer 21 can be disposed at a predetermined position on the first main surface 4 a of the body 4.
In addition, the lamination order, lamination method, etc. at the time of laminating | stacking the unsintered ceramic base material layer 1, the shrinkage | contraction suppression layer 3, the loss | disappearance layer 5, and the auxiliary | assistant layer 21 are finally shown by Fig.2 (a). As long as the laminate A having such a structure can be obtained, the method is not particularly limited to the method described above.

  (2) Then, the laminate A is fired at a temperature at which the unsintered ceramic base layer 1 and the unsintered protruding electrode 8 are sintered, as shown in FIGS. 3 (a) and 3 (b). Then, the disappearing layer 5 (FIGS. 2A and 2B) is disappeared, and the unsintered ceramic base layer 1 and the unsintered protruding electrode 8 are sintered. 3A and 3B, the same reference numerals as those in FIGS. 1 and 2A and 2B denote the same or corresponding parts.

In this firing step, the hardly sinterable ceramic powder in the shrinkage suppression layer 3 is fixed by the glass component diffusing from the unsintered ceramic base layer 1, and as a result, the shrinkage suppression layer 3 becomes the ceramic base layer. 101 is fixed and integrated.
In addition, the sintered protruding electrode 108 has a trapezoidal shape in which the area of the lower end face 106 on the multilayer ceramic body side, which is the bottom face, is larger than the area of the upper end face 107 facing the bottom face 106 due to the behavior described later.

  As a result, the multilayer ceramic body 104 including the ceramic base layer 101 and the shrinkage suppression layer 103, including the predetermined conductor pattern 102, and the conductor pattern 102 on the first main surface 104a of the multilayer ceramic body 104. A laminated body A1 including a trapezoidal protruding electrode 108 and an auxiliary layer 21 arranged so as to be connected to a part of the connection electrode 102a is obtained.

In this firing step, the laminate A1 is fired at a temperature at which the ceramic material constituting the ceramic base layer 101 is sintered and the material constituting the shrinkage suppression layer 103 is not sintered. Thereby, when the ceramic base material layer 101 is about to shrink, the shrinkage suppression layer 103 acts to suppress the shrinkage of the ceramic base material layer 101. Thereby, the multilayer ceramic body 104 with a protruding electrode with high dimensional accuracy can be produced.
The atmosphere in the firing step is appropriately adjusted according to the type of ceramic material constituting the ceramic base material layer 101 and the type of conductive powder contained in the conductive paste for forming the unsintered conductor pattern 2. Is done.

(3) Next, as shown in FIGS. 4A and 4B, the auxiliary layer (ceramic auxiliary layer) 21 that is not substantially sintered is removed from the laminated body in which the vanishing layer has disappeared. Thus, the sintered protruding electrode 108 is exposed to the first main surface 104a of the sintered multilayer ceramic body 104. 4 (a) and 4 (b), the same reference numerals as those in FIGS. 1 and 3 (a) and 3 (b) denote the same or corresponding parts.
Since the auxiliary layer 21 is not substantially sintered, the removal can be easily performed by lightly shaking the sintered multilayer ceramic body 104 or performing a weak air blow.

(4) Then, a surface mount type electronic component (a semiconductor element in this embodiment 1) 110 is mounted on the upper end face 107 of the protruding electrode 108 via the solder 109 (see FIG. 1).
For example, the surface-mounted electronic component 110 is mounted on the upper end surface 107 of the protruding electrode 108 by supplying cream solder to the upper end surface 107 of the protruding electrode 108, and the surface-mounted electronic component 110 is mounted thereon. It can be performed by a method of placing and reflowing.
Thereby, a multilayer ceramic electronic component with protruding electrodes having a structure as shown in FIG. 1 is obtained.

  The structure of the multilayer ceramic electronic component with protruding electrodes manufactured as described above will be described in more detail below.

The ceramic base material layer 101 is formed by sintering a ceramic material and governs the substrate characteristics of the multilayer ceramic electronic component.
The thickness of the ceramic base layer 101 is preferably 10 μm to 100 μm after firing. The thickness of the ceramic base material layer 101 after firing is not necessarily limited to this range, but is less than or equal to the maximum thickness at which shrinkage can be suppressed by the shrinkable suppression layer 103 having a sinterable thickness described later. It is preferable to suppress to. In addition, the thickness of the ceramic base material layer 101 does not necessarily need to be the same for each layer.

Moreover, as a ceramic material which comprises the ceramic base material layer 101, it is desirable to use a material in which a part (for example, a glass component) permeates the shrinkage suppression layer 103 during firing.
Moreover, as a ceramic material which comprises the ceramic base material layer 101, LTCC (which can be fired at a relatively low temperature, for example, 1050 ° C. or lower so that it can be fired simultaneously with a conductor made of a low melting point metal such as silver or copper. It is preferable to use a low-temperature fired ceramic (Low Temperature Co-fired Ceramic). Specifically, a glass ceramic in which alumina and borosilicate glass are mixed, or a Ba—Al—Si—O ceramic that generates a glass component during firing as described above can be used. In Example 1 described above, a Ba—Al—Si—O-based ceramic that generates a glass component during firing is used as the ceramic material constituting the ceramic base layer 101.

As a material constituting the shrinkage suppression layer 103, in particular, when LTCC is used for the ceramic base layer 101, it is desirable to use a non-sinterable ceramic such as alumina, zirconia, or silica. In Example 1, alumina is used as a material for forming the shrinkage suppression layer 103 as described above.
Further, the shrinkage suppression layer 103 is fixed by a part of the ceramic material (for example, glass) constituting the ceramic base material layer 101 which has permeated from the ceramic base material layer 101, thereby solidifying the shrinkage suppression layer 103. Bonding of the ceramic base layer 101 and the shrinkage suppression layer 103 is brought about. The shrinkage-inhibiting layer may contain glass that does not sinter the shrinkage-inhibiting layer during firing.

Since the shrinkage suppression layer 103 contains a material having a sintering temperature higher than that of the ceramic material constituting the ceramic base material layer 101, the shrinkage in the planar direction of the ceramic base material layer 101 during the firing process is suppressed. Demonstrate the function to do. Further, as described above, the shrinkage suppression layer 103 is fixed and bonded when a part of the ceramic material constituting the ceramic base layer 101 penetrates. Therefore, strictly speaking, the thickness of the shrinkage suppression layer 103 is approximately 1 μm to after the firing, although it depends on the state of the ceramic base layer 101 and the shrinkage suppression layer 103, the desired shrinkage suppression effect (binding force), firing conditions, and the like. It is preferably 5 μm.
In Example 1, the thickness of the ceramic base material layer 101 was set to be 50 μm after firing, and the thickness of the shrinkage suppression layer 103 was set to be 5 μm after firing.

The material for forming the in-plane conductor 111, the via-hole conductor 113 filled in the via-hole 112, and the outer conductor 114 is mainly composed of a conductive component that can be fired simultaneously with the ceramic base layer 101. Any known material can be used. Specifically, Cu, Ag, Ni, Pd, and oxides and alloy components thereof can be used.
In Example 1, each conductor portion described above was formed using a conductive paste containing Cu as a main component.

  As the auxiliary layer 21, a ceramic green sheet made of the same material as the shrinkage suppression layer 103, that is, alumina, zirconia, silica, or the like can be used.

  Moreover, as the vanishing layer 5, a material made of a widely known material can be used as long as it decomposes and disappears in the firing step. Specifically, what dispersed polypropylene, polyethylene, polystyrene, crystalline cellulose, etc. in the organic binder is mentioned as a preferred example.

[Characteristic evaluation]
The characteristics of the multilayer ceramic electronic component produced by the method of Example 1 were evaluated.
For comparison, the following samples of Comparative Example 1, Comparative Example 2, and Comparative Example 3 were prepared and used for evaluation of characteristics together with the multilayer ceramic electronic component of Example 1 described above.

[Comparative Example 1]
A multilayer ceramic electronic component with protruding electrodes manufactured by the same method as in Example 1 except that it was manufactured without disposing the vanishing layer.
[Comparative Example 2]
A multilayer ceramic electronic component with protruding electrodes manufactured by the same method as that of the multilayer ceramic electronic component of Example 1 except that the multilayer ceramic body does not include a shrinkage suppression layer.
[Comparative Example 3]
A multilayer ceramic electronic component having the same configuration as that of the multilayer ceramic electronic component of Example 1 except that the multilayer ceramic body is not provided with a shrinkage suppression layer, and is manufactured without providing the vanishing layer. .

Appearance inspection was performed on the multilayer ceramic electronic component of Example 1 and the multilayer ceramic electronic components of Comparative Examples 1, 2, and 3. Ease of removal of the auxiliary layer, the rate of occurrence of the protruding electrode dropout, The occurrence of misalignment was examined and the conductivity of the protruding electrode was examined.
The results are shown in Table 1.

In Table 1, the occurrence rate of the protruding electrodes is the ratio of the number of the samples in which the protruding electrodes were removed to the total number of samples used for the evaluation.
Further, the conductivity of the protruding electrode indicates the ratio of the number of samples in which the protruding electrode is confirmed to be conductive with respect to the total number of samples subjected to the evaluation.

  As shown in Table 1, in Comparative Example 1, since the manufacturing was performed without providing the vanishing layer, it was difficult to remove the auxiliary layer, the residue was observed, and the incidence rate of the protruding electrode dropout was as high as 40%. It was. However, since Comparative Example 1 includes the shrinkage suppression layer, the occurrence of positional deviation of the protruding electrodes was not recognized, and the conductivity of the protruding electrodes was 100%.

  Further, Comparative Example 2 includes the disappearance layer, but does not include the shrinkage suppression layer, and thus the auxiliary layer can be easily removed. However, there is a difference in shrinkage between the multilayer ceramic body and the protruding electrode. In the part where the difference in shrinkage rate occurs (the part where the slip occurs), the protruding electrode does not become trapezoidal due to the behavior described later, but it becomes a rectangular parallelepiped, and the protruding electrode is dropped and misaligned. In addition, it was confirmed that the conductivity of the protruding electrode was as low as 75%. Further, since the positional deviation of the protruding electrodes occurs, there is a problem that the mountability of the surface mount electronic component is inferior.

  Further, Comparative Example 3 was manufactured without providing the vanishing layer, and since the multilayer ceramic body was not provided with a shrinkage suppression layer, it was difficult to remove the auxiliary layer and there was a residue. A difference in contraction rate occurs between the projection electrode and the protruding electrode, and in the portion where the difference in contraction rate occurs (where the slip occurs), the protruding electrode does not have a trapezoidal shape but a rectangular parallelepiped shape. It was confirmed that dropout and misalignment occurred, and the conductivity of the protruding electrode was as low as 80%. Further, since the positional deviation of the protruding electrodes occurs, there is a problem that the mountability of the surface mount electronic component is inferior.

  On the other hand, in the case of the multilayer ceramic electronic component of Example 1, in the manufacturing process, a vanishing layer is provided between the auxiliary layer and the unsintered multilayer ceramic body, and the multilayer ceramic body suppresses shrinkage. Each of the characteristics of the ease of removal of the auxiliary layer, the rate of occurrence of dropout of the protruding electrode, the presence or absence of misalignment of the protruding electrode, and the conductivity of the protruding electrode. It was confirmed that good characteristics can be obtained as compared with the multilayer ceramic electronic component of the comparative example.

  In the multilayer ceramic electronic component of Example 1, since the shrinkage suppression layer is disposed on the surface of the multilayer ceramic body, the lower end surface of the protruding electrode is connected to the conductor pattern of the multilayer ceramic body. Baked. Therefore, since the shrinkage of the multilayer ceramic body in the planar direction is suppressed, the lower part of the projecting electrode is restrained from shrinking, and the upper part contracts more than the lower part. The electrode is trapezoidal. As a result, the bonding strength to the multilayer ceramic body is improved, dropout and misalignment are less likely to occur, the continuity reliability is high, and the mountability of surface mount electronic components is excellent. Ceramic electronic components can be obtained.

  FIG. 5 is a view showing a laminated body A having slits, which is produced in the manufacturing process of the multilayer ceramic electronic component with protruding electrodes according to another embodiment (Example 2) of the present invention, and FIG. It is a figure which expands and shows the principal part of the laminated body A of. In FIG. 5, the parts denoted by the same reference numerals as those in FIGS. 1 and 2 (a) and 2 (b) indicate the same or corresponding parts.

  Also in this Example 2, first, similarly to Example 1, as shown in FIG. 5, the unsintered ceramic substrate layer 1 provided with the unsintered conductor pattern 2 and the unsintered ceramic substrate layer. 1 disappears at the firing temperature of the unsintered ceramic base material layer 1 on the first main surface 4a of the unsintered multilayer ceramic body 4 on which the shrinkage suppression layer 3 for suppressing shrinkage in the planar direction is laminated. The auxiliary layer 21 having a plurality of unsintered protruding electrodes 8 is connected to the unsintered conductive pattern of the unsintered multilayer ceramic body 4 and the lower end face 6 of the unsintered protruding electrodes 8 through the vanishing layer 5. The laminated body A was formed by arrange | positioning in the aspect which contact | abuts.

  Then, as shown in FIGS. 5 and 6, slits (dividing grooves) extending from the upper main surface to the lower main surface of the auxiliary layer 21 at positions between the unsintered protruding electrodes 8 of the auxiliary layer 21. 24 was formed. In Example 2, the slit 24 was formed so as to reach from the upper main surface of the auxiliary layer 21 to the middle in the thickness direction of the disappearing layer 5 disposed on the lower surface side of the auxiliary layer 21.

Then, as described above, the laminate A in which the slits 24 were formed in the auxiliary layer 21 was fired in the same manner as in Example 1 above. As a result, as shown in FIG. 7, the vanishing layer 5 disappears, the auxiliary layer 21 is substantially unsintered, and the auxiliary layer 21 is slit between the sintered protruding electrodes 108. A sintered laminate A1 in which 24 is formed is obtained.
Next, the substantially unsintered auxiliary layer 21 in which the slits 24 are formed is removed from the sintered laminate A1.

In addition, since the slit 24 is formed in the auxiliary layer 21, the auxiliary layer 21 can be removed very easily by shaking the laminate A1 lightly or performing a weak air blow.
Then, by mounting the surface-mounted electronic component 110 on the upper end surface 107 of the protruding electrode 108 via the solder 109, a multilayer ceramic electronic component having a structure as shown in FIG. 1 can be obtained.

[Characteristic evaluation]
The characteristics of the multilayer ceramic electronic component produced by the method of Example 2 were also evaluated in the same manner as in Example 1 above, and compared with the multilayer ceramic electronic component produced by the method of Example 1.
The results are shown in Table 2.

Note that the concept and evaluation method of the characteristics of the multilayer ceramic electronic component shown in Table 2 are the same as those in Example 1.
As shown in Table 2, according to the manufacturing method of Example 2, since the slits 24 are formed in the auxiliary layer 21, the auxiliary layer 21 is fragmented for each protruding electrode 8. It was confirmed that removal of the auxiliary layer 21 after firing becomes easier.

  That is, in the case of the method of the first embodiment, it is necessary to remove the auxiliary layer 21 in the entire region where the protruding electrodes 8 are disposed, but in the second embodiment, each protruding electrode 8 is removed. Since it is sufficient to remove the auxiliary layer 21 that has been fragmented each time, it is possible to reduce the stress applied to the protruding electrode 8 in the step of removing the auxiliary layer 21, and as a result, the protruding electrode 8 is dropped off. It is possible to avoid the occurrence.

In Example 2, the slit 24 is formed so as to reach the vanishing layer 5 disposed below the auxiliary layer 21, but the slit 24 is at least from the upper surface side to the lower surface side of the auxiliary layer. As long as it has reached the upper limit, and does not have to enter the disappearing layer 5.
Further, even when the depth of the slit 24 is made halfway in the thickness direction of the auxiliary layer 21, depending on specific conditions, the auxiliary layer removability may be sufficiently improved.

  In Examples 1 and 2, the auxiliary layer and the disappearing layer are formed in a partial region of the first main surface of the multilayer ceramic body. However, the auxiliary layer and the disappearing layer are formed in the first layer of the multilayer ceramic body. It is also possible to configure so as to be formed on the entire surface of one main surface.

  Further, in Examples 1 and 2 described above, the shrinkage suppression layer is also disposed inside the multilayer ceramic body. However, when the amount (number of sheets) of the shrinkage suppression layer disposed in the interior is small, the multilayer ceramic is subjected to a firing process. When the element body is contracted in the plane direction and no slit is formed in the auxiliary layer as in the first embodiment, the gap between the protruding electrode disposed in the auxiliary layer and the multilayer ceramic element body is reduced. However, in Example 2, since the slit is formed in the auxiliary layer, it is possible to eliminate the shrinkage suppression force in the plane direction by the auxiliary layer. It is possible to suppress the occurrence of misalignment between the electrode and the multilayer ceramic element (specifically, misalignment between the connection electrode of the multilayer ceramic element and the protruding electrode).

  That is, as in Example 2, it is possible to significantly relax the conditions for disposing the shrinkage suppression layer on the multilayer ceramic body side by forming a slit in the auxiliary layer, and to enable more flexible circuit design. Will be able to.

  In Examples 1 and 2, the auxiliary layer is made of a material that does not substantially sinter at the firing temperature of the ceramic constituting the multilayer ceramic body (specifically, the shrinkage suppression layer is formed). However, the constituent material of the auxiliary layer is not limited to this, and an auxiliary layer made of another material, for example, an auxiliary layer made of a resin material can be used.

  The invention of the present application is not limited to the above embodiment in other points as well, and the specific structure of the laminate, the method of forming the laminate, the multilayer ceramic body formed in the stage before the firing step Within the scope of the invention, there are various types of laminates of the ceramic base material layer and the shrinkage suppression layer, the firing conditions and firing method of the laminate, the types of surface-mounted electronic components mounted on the protruding electrodes, etc. Applications and modifications can be added.

According to the present invention, a multilayer ceramic electronic component having a protruding electrode on its surface can be efficiently manufactured without requiring a complicated manufacturing process and without causing a positional shift of the protruding electrode. .
Accordingly, the present invention relates to a multilayer ceramic electronic component with protruding electrodes suitable for use in applications such as a multichip module (MCM) on which semiconductor devices such as VLSI and ULSI are mounted, and a method for manufacturing the same. Can be widely used.

It is sectional drawing which shows the structure of the multilayer ceramic electronic component with a protruding electrode manufactured by the manufacturing method concerning one Example (Example 1) of this invention. (a) is sectional drawing which shows the structure of the laminated body formed in 1 process of the manufacturing method of the multilayer ceramic electronic component concerning Example 1 of this invention before giving to a baking process, FIG.2 (b) is It is sectional drawing which expands and shows a principal part. (a) is a figure which shows the state after sintering the laminated body shown in FIG. 2, (b) is sectional drawing which expands and shows the principal part. (a) is a view showing a state in which the auxiliary layer is removed from the laminated body in which the vanishing layer has disappeared in FIG. 3 and the protruding electrodes are exposed on the first main surface of the multilayer ceramic body, (b) ) Is a cross-sectional view showing an enlarged main part. Is a slit (divided groove) formed in one step of the method for manufacturing a multilayer ceramic electronic component according to another embodiment of the present invention (Example 2) in the auxiliary layer in the laminate before being subjected to the firing step. It is a figure which shows the state formed. It is a figure which expands and shows the principal part of the laminated body before baking formed in 1 process of the manufacturing method of the multilayer ceramic electronic component concerning Example 2 of this invention. It is a figure which shows the state after sintering the laminated body shown in FIG. It is a figure which shows the structure of the conventional multilayer ceramic electronic component. It is a figure which shows the manufacturing method of the conventional multilayer ceramic electronic component.

A laminate A1 laminate after firing 1 unsintered ceramic substrate layer 2 unsintered conductor pattern 2a unsintered connection electrode 3 shrinkage suppression layer before firing 4 unsintered multilayer ceramic body 4a unsintered multilayer ceramic First main surface of element body 5 Disappearing layer 6 Lower end surface of unsintered projecting electrode 8 Unsintered projecting electrode 11 Conductive paste for in-plane conductor 12 Through hole 13 Conductive paste for via-hole conductor 14 External Conductive paste for conductor 21 Auxiliary layer 22 Through hole for forming protruding electrode of auxiliary layer 24 Slit 101 Ceramic substrate layer 102 Conductive pattern 102a Connection electrode 103 Shrinkage suppression layer after firing 104 Multilayer ceramic element 104a Multilayer ceramic element First main surface of body 106 Lower end surface (bottom surface) of protruding electrode
107 Upper end surface (upper surface) of protruding electrode
108 Protruding electrode 109 Solder 110 Surface mount electronic component 111 In-plane conductor 112 Via hole 113 Via hole conductor 114 External conductor (surface conductor)

Claims (10)

A non-sintered multilayer ceramic body comprising a non-sintered ceramic base material layer and a non-sintered ceramic base material layer having a non-sintered conductor pattern, wherein a non-sintered ceramic base material layer and a shrinkage suppression layer for suppressing shrinkage in a planar direction are laminated. An auxiliary layer having unsintered protruding electrodes is formed on the first main surface of the unsintered multilayer ceramic element through a disappearing layer in which at least a main part disappears at the firing temperature of the unsintered ceramic base layer. Forming a laminated body arranged in such a manner that the unsintered conductor pattern of the body and the unsintered protruding electrode are in contact with each other;
The laminate is fired at a temperature at which the unsintered ceramic base layer and the unsintered protruding electrode sinter, thereby eliminating at least the main part of the disappearing layer and the unsintered ceramic base. And a step of sintering the unsintered projecting electrode. A method for producing a multilayer ceramic electronic component with a projecting electrode.   The auxiliary layer is a ceramic auxiliary layer mainly composed of a ceramic powder that does not substantially sinter at the sintering temperature of the ceramic constituting the green ceramic base layer. 2. The method for producing a multilayer ceramic electronic component with protruding electrodes according to claim 1, further comprising a step of removing the ceramic auxiliary layer for sintering.   The method for producing a multilayer ceramic electronic component with projecting electrodes according to claim 1, further comprising a step of mounting a surface mount type electronic component on the upper end face of the sintered projecting electrode.   The protruding electrode according to any one of claims 1 to 3, wherein the auxiliary layer and the vanishing layer are arranged in a partial region of the first main surface of the unsintered multilayer ceramic body. For manufacturing a multilayer ceramic electronic component with a head.   5. The multilayer ceramic electronic component with protruding electrodes according to claim 1, wherein the shrinkage suppression layer is disposed on the first main surface side of the unsintered multilayer ceramic body. Manufacturing method.   The unsintered ceramic base layer is a non-sintered ceramic base layer mainly composed of a low-temperature sintered ceramic, and the shrinkage suppression layer is substantially sintered at the sintering temperature of the low-temperature sintered ceramic. The method for producing a multilayer ceramic electronic component with protruding electrodes according to any one of claims 1 to 5, wherein the method is a shrinkage suppression layer mainly composed of a hardly sinterable ceramic.   The method for producing a multilayer ceramic electronic component with protruding electrodes according to claim 6, wherein the hardly sinterable ceramic is fixed by glass that has exuded from the unsintered ceramic base layer during firing. .   8. The protrusion electrode according to claim 1, wherein the vanishing layer is a resin layer made of a resin that decomposes or burns at the firing temperature of the unsintered ceramic base layer. A method of manufacturing a multilayer ceramic electronic component.   After providing the auxiliary layer on the vanishing layer, a through-hole penetrating the auxiliary layer and the vanishing layer is formed, and the layer filled with the conductive paste is formed into the unsintered multilayer ceramic body. The method for producing a multilayer ceramic electronic component with protruding electrodes according to claim 1, wherein the laminated body is formed by stacking on the first main surface.   In the case where a plurality of the unsintered protruding electrodes are formed on the auxiliary layer, the auxiliary layer is positioned between the unsintered protruding electrodes from the upper main surface to the lower main surface of the auxiliary layer. The manufacturing method of the multilayer ceramic electronic component with a protruding electrode in any one of Claims 1-9 characterized by the above-mentioned.

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