JP4844520B2 - Lighting device - Google Patents

Description

  The present invention relates to a lighting device.

2. Description of the Related Art Conventionally, lighting devices using light emitting elements such as organic EL elements have been provided, for example, as disclosed in Patent Document 1. This conventional example is an illuminating device in which a laminated body having a heat conductive layer, a first electrode, an insulating layer, an organic layer, and a second electrode is formed on a glass substrate. According to the method, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are sequentially formed. The heat conductive layer of the laminate is formed over substantially the entire area of the glass substrate, and a sealing glass that seals the laminate on the heat conductive layer is joined by an adhesive, A heat sink (heat radiating member) having a plurality of heat radiating fins is bonded to the outside of the sealing glass by an adhesive. Thus, the problem that the organic EL element is deteriorated and the light emission luminance is reduced by releasing the heat generated from the organic layer from the heat sink through the heat conductive layer when continuously driven with high luminance is eliminated. .
JP 2006-210216 A

  By the way, in the above-mentioned conventional example, since it is a structure in which an inorganic layer and an organic layer are laminated and sealed on a glass substrate, by covering and protecting the portion excluding the light emitting surface of the substrate and the laminate with a frame, It is necessary to increase safety when using it. In a lighting device in which a light emitting element and a circuit board including a lighting circuit that supplies lighting power to the light emitting element are integrated, the light emitting element and the circuit board are attached to the frame. However, when this frame is formed of a resin material, there is a problem that the lifetimes of both the light emitting element and the circuit board are reduced due to the heat generated by both the light emitting element and the circuit board.

  The present invention has been made in view of the above points, and an object of the present invention is to provide an illuminating device that can suppress a decrease in the lifetime of a light emitting element and a circuit board.

  In order to achieve the above object, the invention of claim 1 provides a substrate made of a light-transmitting material, a first electrode laminated on one surface side of the substrate, and a first electrode layer on the opposite side of the substrate. An organic layer including at least a light-emitting layer stacked on the surface, a second electrode stacked on the surface of the organic layer opposite to the substrate, and formed on the one surface side of the substrate and electrically connected to the first electrode A light-emitting element comprising a first power-feeding unit, a second power-feeding part formed on the one surface side of the substrate and electrically connected to the second electrode, and connected to an external power source and connected to the light-emitting element A lighting device comprising: a circuit board including a lighting circuit that supplies lighting power; and a plurality of power supply members that electrically connect between the circuit board and the first power supply unit and the second power supply unit. The circuit board is sealed with a resin material, and a metal plate is interposed between the circuit board and the light emitting element. Provided with a member, characterized in that contacting the light emitting element and a plate-like member.

  According to a second aspect of the present invention, in the first aspect of the invention, the plate-like member is formed integrally with a metal frame that holds the circuit board and the light emitting element, and the frame has a storage recess for storing the circuit board. The circuit board is sealed by filling the housing recess with a resin material.

  According to the present invention, the metal plate-like member is provided between the light-emitting element and the circuit board, and the plate-like member and the light-emitting element are brought into contact with each other. The temperature of the light-emitting element can be lowered by discharging to the outside through this, and therefore, the lifetime of the light-emitting element can be prevented from decreasing. In addition, since the circuit board is sealed with the resin material, the heat dissipation, waterproofness, and humidity resistance of the circuit board can be increased, and therefore the reduction in the life of the circuit board can be suppressed.

  Hereinafter, an embodiment of a lighting device according to the present invention will be described with reference to the drawings. In the following description, unless otherwise specified, the vertical and horizontal directions in FIG. 1A are defined as the vertical and horizontal directions. In the present embodiment, as shown in FIG. 1A, a light emitting element 1 formed in a substantially flat plate shape and a lighting circuit that is connected to an external power source (not shown) and supplies lighting power to the light emitting element 1. , A plurality (two in the drawing) of pin-shaped power supply members 2 that electrically connect the circuit board 4 and the light emitting element 1, and at least a part of which is in contact with the light emitting element 1. And a frame 3 for holding the light emitting element 1.

  As shown in FIG. 2, the light-emitting element 1 includes a substrate 10 made of a light-transmitting material, an organic light-emitting layer 11 made of an organic material laminated on the substrate 10, and an anode provided with the organic light-emitting layer 11 interposed therebetween. The first electrode layer 12 to be and the second electrode layer 13 to be the cathode, and the sealing for sealing the organic light emitting layer 11 provided so as to cover the first electrode layer 12 and the second electrode layer 13 The layer 14 includes a first power feeding unit 15 and a second power feeding unit 16 that are connected to the first electrode layer 12 and the second electrode layer 13 and supply a voltage from the external power source A, respectively.

  The substrate 10 is a flat plate-like member for supporting the organic light emitting layer 11 and is made of a light-transmitting material such as glass. The organic light emitting layer 11 includes at least a light emitting layer made of an organic material of a fluorescent material or an organic material containing a fluorescent material, and if necessary, a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer Etc. are configured.

  The first electrode layer 12 is a conductive thin film made of a light-transmitting material, and is formed of, for example, indium tin oxide (ITO) or the like. The first electrode layer 12 is drawn out so that a part of the first electrode layer 12 is exposed from a sealing layer 14 described later on one end side in the longitudinal direction of the substrate 10 to form an anode terminal portion 12a.

  The second electrode layer 13 is a conductive thin film made of a material that reflects light emitted from the organic light emitting layer 11. For example, aluminum (Al), aluminum lithium (Al: Li), magnesium silver (Mg: Ag) or other metal or alloy. In the present embodiment, the second electrode layer 13 is made of aluminum from the viewpoints of conductivity, reflectance, cost, and the like. A part of the second electrode layer 13 is drawn out so as to be exposed from a sealing layer 14 described later on the other end side in the longitudinal direction of the substrate 10 to form a cathode terminal portion 13a.

  The sealing layer 14 is an insulating thin film for hermetically sealing the organic light emitting layer 11 together with the substrate 10 and is formed of, for example, a silicon resin. The sealing layer 14 is formed so as to cover the upper surface and the right side surface of the second electrode layer 13 in FIG. 2 and the left side surface of the organic light emitting layer 11.

  The first power supply unit 15 and the second power supply unit 16 are both made of, for example, chrome plating, and have narrow width portions 15a and 16a having short widths, one end of which is connected to the anode terminal portion 12a or the cathode terminal portion 13a. The narrow width portions 15a and 16b are formed integrally with the other ends of the narrow width portions 15a and 16a, and the wide width portions 15b and 16b having long widths to which the power supply member 2 from the external power source A is connected. Each of the power supply portions 15 and 16 is formed outside the sealing layer 14.

  Various electronic components 4a are mounted on the lower surface of the circuit board 4, for example, a rectifier circuit composed of a diode bridge for full-wave rectification of an AC output of a commercial power supply, a capacitor for smoothing the rectified pulsating voltage, A lighting circuit including a DC-DC converter circuit that converts the smoothed DC voltage into a voltage corresponding to the rating of the light emitting element 1 is configured. Since such a circuit is well known, illustration and detailed description thereof are omitted here. The circuit board 4 has an external terminal portion (not shown) that is electrically connected to an external power source, and is electrically connected to the terminal portions 15 and 16 of the light emitting element 1 via the power supply member 2. A power supply terminal portion (not shown).

  Thus, the external terminal portion of the circuit board 4 and the external power source are connected via the lead wire 7, and the power supply member is provided between the power supply portions 15 and 16 of the light emitting element 1 and the power supply terminal portion of the circuit board 4. 2 and connecting the anode terminal portion 12a and the cathode terminal portion 13a to apply a DC voltage, the organic light emitting layer 11 emits visible light. The light emitted from the organic light emitting layer 11 is taken out from the lower surface of the substrate 10 in FIG. 2 directly or by being reflected by the second electrode layer 12, and the lower surface of the substrate 10 emits planar light (hereinafter, The surface of the substrate 10 that emits light in a planar manner is called “light emitting surface 10a”). The connection between the power supply terminal portion of the circuit board 4 and the power supply member 2 is performed by soldering or screwing.

  The frame 3 is formed of a metal material such as iron, copper, and stainless steel, for example, and protrudes downward from the substantially flat main body 30 and the left and right ends of the main body 30 as shown in FIG. It is comprised from the substantially bowl-shaped holding | maintenance part 31 formed in this way. In the present embodiment, aluminum is formed in consideration of thermal conductivity and weight. The light emitting element 1 is disposed on the lower surface of the main body 30 with the light emitting surface 10a facing downward. At this time, the light-emitting element 1 has the sealing layer 14 in contact with the main body portion 30 and the power feeding portions 15 and 16 are spaced apart from the main body portion 30 in the vertical direction. Is in contact with the main body 30 so as not to be short-circuited. The holding portion 31 protrudes in a direction in which the respective front end portions approach each other, and the light emitting element 1 is held between the front end portion and the main body portion 30, so that the space between the light emitting element 1 and the frame body 3 is held. Adhesion is maintained over a long period of time. Further, insertion holes 30 a for inserting the power supply member 2 are provided in both the left and right ends of the main body 30.

  As shown in FIG. 1A, the circuit board 4 is fixedly attached to the upper surface of the main body 30 of the frame 3 by a pair of substantially columnar fixing parts 6. Examples of the fixing means include caulking and screwing. In addition, the circuit board 4 is entirely sealed with an insulating resin material 5 while being fixedly attached to the frame 3. Thus, by sealing the circuit board 4 with the resin material 5, the heat dissipation, waterproofness, and humidity resistance of the circuit board 4 can be improved. Note that when the circuit board 4 is sealed with the resin material 5, an insulating member (not shown) is provided around the power supply member 2 so that the resin material 5 does not leak to the light emitting element 1 side through the insertion hole 30a. ). Further, the insulating member prevents the power feeding member 2 and the frame 3 from being short-circuited.

  As described above, since the main body 30 of the metal frame 3 is provided between the light emitting element 1 and the circuit board 4 and the light emitting element 1 is brought into contact with the main body 30, the light emitting element 1 at the time of driving the device is used. The temperature of the light emitting element 1 can be lowered by releasing the heat generated through the frame 3 to the outside, and hence the lifetime of the light emitting element 1 can be prevented from being reduced. In addition, since the circuit board 4 is sealed with the resin material 5, the heat dissipation, waterproofness, and humidity resistance of the circuit board 4 can be improved, and therefore the life of the circuit board 4 can be prevented from being reduced.

  As shown in FIG. 1 (b), a wall portion 32 that protrudes upward from the outer peripheral edge of the upper surface of the main body portion 30 of the frame body 3 is provided, and is surrounded by the wall portion 32 and the main body portion 30. A configuration in which the circuit board 4 is sealed by forming a storage recess 33 for storing the circuit board 4 in a portion and filling the storage recess 33 with a resin material 5 such as an epoxy resin or a urethane resin and curing it. It doesn't matter. Even when configured in this manner, the same effects as described above can be obtained. The frame body 3 of the present embodiment can be manufactured by, for example, bending welding of a sheet metal or die casting. Further, the wiring between the external power supply and the circuit board 4 is not limited to the wiring by the lead wire 7 of the present embodiment. For example, a connector is provided on the external terminal portion of the circuit board 4 and is routed from the external power supply. It may be a wiring connected to the connector of the cable to be used.

It is a figure which shows embodiment of the illuminating device of this invention, (a) is schematic, (b) is schematic when the accommodation recessed part is provided in the frame. It is the schematic which shows a light emitting element same as the above.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light emitting element 10 Board | substrate 11 Organic light emitting layer 12 1st electrode layer 13 2nd electrode layer 14 Sealing layer 15 1st electric power feeding part 16 2nd electric power feeding part 2 Electric power feeding member 3 Frame 30 Main body part 30a Insertion hole 31 Holding part 4 Circuit board 5 Resin material

Claims (2)

  A substrate made of a light-transmitting material, a first electrode stacked on one surface of the substrate, an organic layer including at least a light-emitting layer stacked on a surface of the first electrode layer opposite to the substrate, and an organic layer A second electrode laminated on the surface opposite to the substrate, a first power feeding part formed on the one surface side of the substrate and electrically connected to the first electrode, on the one surface side of the substrate A circuit board including a light emitting element formed of a second power feeding portion formed and electrically connected to the second electrode, a lighting circuit connected to an external power supply and supplying lighting power to the light emitting element; A lighting device including a plurality of power supply members that electrically connect between a substrate and a first power supply unit and a second power supply unit, wherein the circuit board is sealed with a resin material. A metal plate-like member is provided between the light-emitting element and the light-emitting element. Lighting device is characterized in that in contact.   The plate-like member is formed integrally with a metal frame that holds the circuit board and the light emitting element, the frame has a storage recess for storing the circuit board, and the circuit board is made of a resin material in the storage recess. The lighting device according to claim 1, wherein the lighting device is sealed by filling.

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