JP4799150B2 - Circuit board equipment - Google Patents

Description

  The present invention relates to a circuit board device for mounting an IC chip or the like, and more particularly to a circuit board device having a plurality of wiring layers.

  It has become common to add various additional functions other than a call function to a mobile phone. Multi-functionality of mobile phones can gain market evaluation and establish a position as a popular model. In particular, in recent years, the popularity of mobile phones equipped with FM tuners that receive radio has increased, and each manufacturer has been focusing on miniaturization of FM tuners.

In the FM tuner, two spiral coil patterns are required for the oscillation circuit. Conventionally, there has been proposed a high-frequency oscillation circuit that improves a maximum oscillation frequency by using a MOS transistor capable of controlling a bulk potential instead of a diode element (see, for example, Patent Document 1). There is another proposal of a circuit board including an LC circuit in which outer peripheral portions of a plurality of coil patterns are opposed to each other via a dielectric (see, for example, Patent Document 2).
JP 2001-332931 A JP 2004-87524 A

  In the case where a circuit board device in which two coil patterns are formed on the same wiring layer and one end of each coil pattern is connected to each other, one end of each coil pattern is formed in the dielectric layer located below the wiring layer. To another wiring layer located below the dielectric layer, and vias are electrically connected by a bridge line. Since an electromagnetic field is generated around the bridge line and the coil pattern, the operation performance may be adversely affected if other circuits exist in the vicinity of each other.

  For example, when the circuit board device is mounted on the board on the side where the bridge line is formed, the circuit board device electromagnetically interferes with the wiring formed on or near the surface of the board, and the operation performance of the circuit board device varies. Arise. In this case, the wiring formed on the board also receives electromagnetic interference from the bridge line and coil pattern in the circuit board device. As a result, it becomes difficult to fix the oscillation frequency in the oscillation circuit, which may hinder proper tuning.

  As a countermeasure against this situation, for example, it is conceivable to cover the entire surface of the bridge line sealed with a conductive layer (ground) to suppress leakage of electromagnetic fields from the bridge line and the coil pattern. However, since the number of steps is increased by forming the entire surface conductive layer, the manufacturing cost increases. Furthermore, the formation of the conductive layer increases the overall thickness of the circuit board device, and there is a problem that it does not meet the demand for downsizing.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a circuit board device that suppresses the generation of an electromagnetic field leaking from a bridge line or the like while meeting the demand for miniaturization.

  In order to solve the above problems, a circuit board device according to an aspect of the present invention includes a first wiring layer having a first wiring pattern formed in a spiral shape and a second wiring pattern formed in a spiral shape, A dielectric layer having a first via and a second via electrically connected to each of the first wiring pattern and the second wiring pattern, a bridge line electrically connecting the first via and the second via, and a bridge line And a second wiring layer having a conductor pattern having an outer edge at a position beyond the outer edge of the first wiring pattern and the second wiring pattern in the first wiring layer. When the circuit board device is mounted on a board or the like, the conductor pattern may function as a grounded ground layer. The first wiring layer, the dielectric layer, and the second wiring layer have a laminated structure. The outer edges of each wiring pattern and conductor pattern are determined with reference to a plane perpendicular to the stacking direction. The conductor pattern may be described as a conductor layer.

  According to this aspect, it is possible to suppress leakage of the electromagnetic field generated in the first wiring pattern and the second wiring pattern in the conductive layer. Further, by forming the conductive layer in the same layer as the bridge line, the circuit board device can be formed thin. By causing the bridge line to function as a coplanar line by the action of the conductor pattern, leakage of the electromagnetic field from the bridge line can be suppressed.

  When the direction connecting the center of the first wiring pattern and the center of the second wiring pattern is the first direction and the direction perpendicular to the first direction is the second direction, the outer edge of the first wiring pattern and the second wiring The length of the outer edge of the pattern along the first direction may be shorter than the length of the outer edge along the second direction. In this case, since the distance between the first via and the second via can be shortened and the length of the bridge line can be shortened, leakage of the electromagnetic field from the bridge line can be further suppressed.

  The second wiring layer may have a first electrode and a second electrode that are electrically connected to the first via and the second via, respectively, instead of the bridge line. In this case, since the area of the gap between the first electrode and the second electrode and the conductor pattern can be made smaller than the area of the gap between the bridge line and the conductor pattern, the first wiring pattern and the second wiring pattern The leakage of the electromagnetic field generated at can be further suppressed. Further, when the bridge line is formed on a board or the like on which the circuit board device is mounted, the characteristics can be adjusted, and the degree of freedom in circuit design is increased.

  Another aspect of the present invention is a circuit board device. The circuit board device includes a first wiring layer having a predetermined wiring pattern, a dielectric layer having a via electrically connected to the predetermined wiring pattern, a bridge line connected to the via, and a periphery of the bridge line. And a second wiring layer having a conductor pattern having an outer edge at a position beyond the outer edge of the predetermined wiring pattern in the first wiring layer. When the circuit board device is mounted on a board or the like, the conductor pattern may function as a grounded ground layer.

  According to this aspect, it is possible to suppress leakage of the electromagnetic field generated in the predetermined wiring pattern in the conductive layer. Further, by forming the conductive layer in the same layer as the bridge line, the circuit board device can be formed thin.

  ADVANTAGE OF THE INVENTION According to this invention, generation | occurrence | production of the electromagnetic field which leaks from a bridge line etc. can be suppressed, and the circuit board apparatus which met the request | requirement of size reduction can be provided.

  FIG. 1 is a circuit diagram of an oscillation circuit of an FM tuner device according to an embodiment of the present invention. The oscillation circuit 10 includes a first MOS transistor 20 and a second MOS transistor 22 for high-frequency oscillation, a first inductor 12 and a first variable capacitor 16 that constitute an LC resonance circuit, and a second inductor 14 and a second variable capacitor 18. Prepare. The LC circuit of the first inductor 12 and the first variable capacitor 16 and the LC circuit of the second inductor 14 and the second variable capacitor 18 are connected in series via the bridge line 30. By controlling the voltage applied from the control voltage input terminal 4, the capacitances of the first variable capacitor 16 and the second variable capacitor 18 are changed. Thereby, the oscillation frequency output from the output terminal 6 and the output terminal 8 can be made variable. A node that reaches the output terminal 6 is a node A, a node that reaches the control voltage input terminal 4 is a node B, and a node that reaches the output terminal 8 is a node C.

  In the oscillation circuit 10 of the present embodiment, the first inductor 12 and the second inductor 14 and the bridge line 30 connecting them are built in a circuit board device on which an IC chip is mounted. The circuit board device of the present embodiment is configured to have a plurality of wiring layers. In this specification, a layer in which the first inductor 12 and the second inductor 14 are formed is referred to as a “first wiring layer”, and a bridge line 30 is formed. The formed layer is called a “second wiring layer”. A dielectric layer is provided between the first wiring layer and the second wiring layer. Other configurations such as the first variable capacitor 16 and the second variable capacitor 18 may be formed by an IC chip. The IC chip and the circuit board device constitute a package IC.

  FIG. 2 is a diagram conceptually showing the relationship between the first wiring layer and the second wiring layer. The first wiring layer 110 and the second wiring layer 120 are configured in the circuit board device 100. In the first wiring layer 110, the first inductor 12 and the second inductor 14 are provided side by side. The first inductor 12 is configured as a first wiring pattern formed in a spiral shape. Similarly, the second inductor 14 is configured as a second wiring pattern formed in a spiral shape. The first wiring pattern and the second wiring pattern are both configured with the same characteristics, and here are patterns that are symmetric. Therefore, the number of turns of the wiring, the wiring width, and the distance between the wirings in the first wiring pattern and the second wiring pattern are the same, and the inductor characteristics are the same.

  The first end 32 of the first wiring pattern is located at the center of the first inductor 12. Similarly, the second end 34 of the second wiring pattern is located at the center of the second inductor 14. In the second wiring layer 120, the bridge line 30 connects the first end 32 and the second end 34. As described above, there is a dielectric layer (not shown) between the first wiring layer 110 and the second wiring layer 120, and in the dielectric layer, the first end portion 32 and the second end portion. By forming a via at a position where 34 is present, the first end 32 is electrically connected to the first contact 36 in the bridge line 30, and the second end 34 is connected to the second contact in the bridge line 30. 38 is electrically connected.

  In the second wiring layer 120, the conductor pattern 50 is provided around the bridge line 30. The conductor pattern 50 has an outer edge at a position beyond the outer edge of the first wiring pattern of the first inductor 12 and the second wiring pattern of the second inductor 14. The outer edges of the first wiring pattern and the second wiring pattern correspond to an outer peripheral frame when the first wiring pattern and the second wiring pattern are viewed as one body. Therefore, in this embodiment, the outer periphery of the conductor pattern 50 is set wider than the outer peripheral frame of the first wiring pattern and the second wiring pattern.

  FIG. 3 is a diagram conceptually showing the relationship between the first inductor, the second inductor, and the bridge line. In the circuit board device 100, the bridge line 30 electrically connects the first end 32 in the first inductor 12 and the second end 34 in the second inductor 14.

  FIG. 4 shows a cross-sectional structure of the package IC according to the example. The package IC1 includes a circuit device 40 and a circuit board device 100. The circuit device 40 is attached to the circuit board device 100. A die attach sheet 64 is bonded on the circuit board device 100, and the IC chip 60 is fixed on the die attach sheet 64. The IC chip 60 is protected by the sealing resin layer 62. Although not shown, the IC chip 60 is electrically connected to the first wiring layer 110 by, for example, wire bonding.

  The cross-sectional structure shown in FIG. 4 corresponds to the AA cross section of the circuit board device 100 in FIG. The circuit board device 100 includes a coating layer 112, a first wiring layer 110, a dielectric layer 115, a second wiring layer 120, and a coating layer 118 from the upper layer. A first inductor 12 is formed in the first wiring layer 110, and a first via 70 provided in the dielectric layer 115 is electrically connected to the first end portion 32 of the first inductor 12. . The other end of the first via 70 is electrically connected to the first contact 36 of the bridge line 30.

  In the second wiring layer 120, the bridge line 30 and the conductor pattern 50 are formed. The conductor pattern 50 has an outer edge at a position beyond the outer edge of the wiring pattern of the first inductor 12 in the first wiring layer 110. In other words, the conductor pattern 50 is configured to exist below the first wiring pattern of the first inductor 12. As a result, electromagnetic field leakage from the first inductor 12 can be absorbed by the conductor pattern 50. In the circuit board device 100 of the present embodiment, in order to suppress electromagnetic field leakage in the conductor pattern 50, it is not necessary to separately provide a grounding layer or the like in addition to the second wiring layer 120 to suppress electromagnetic field leakage. Since the wiring layer has a two-stage structure, the manufacturing process of the circuit board device 100 is facilitated, and the circuit board device 100 can be thinned. In the circuit board device 100 for FM tuner, since the first inductor 12 and the second inductor 14 have a large area, the generated electromagnetic field is also spread over a wide range and is easily affected by the outside. The second wiring layer 120 originally has only a role for forming the bridge line 30, but the conductor pattern 50 is formed at a position corresponding to the first inductor 12 and the second inductor 14 to influence the electromagnetic field. It is very advantageous to suppress the manufacturing cost.

  FIG. 5 shows a cross-sectional structure of the circuit board device. This cross-sectional structure corresponds to the BB cross section in FIG. The dielectric layer 115 is provided with a first via 70 that electrically connects the first end 32 of the first inductor 12 and the first contact 36 of the bridge line 30, and the second end of the second inductor 14. A second via 72 is provided to electrically connect 34 and the second contact 38 in the bridge line 30. As a result, the bridge line 30 connects the first inductor 12 and the second inductor 14.

  By forming the conductor pattern 50 large so as to include the wiring patterns of the first inductor 12 and the second inductor 14, the electromagnetic field generated in the first inductor 12 and the second inductor 14 leaks downward from the coating layer 118. The amount can be reduced. Thereby, even when the package IC 1 is attached to the board, the influence from the wiring or circuit of the board can be suppressed, so that the oscillation circuit 10 can oscillate a signal with a stable frequency.

  In the circuit board device 100 of the present embodiment, the bridge line 30 functions as a coplanar line by providing the conductor pattern 50 in the periphery. Thereby, the electromagnetic field generated in the bridge line 30 can be absorbed by the conductor pattern 50. The characteristic impedance of the coplanar line is preferably set lower than the characteristic impedance of the first inductor 12. As described above, the first inductor 12 and the second inductor 14 are configured to have the same symmetrical structure. By reducing the characteristic impedance of the coplanar line, stable operation of the oscillation circuit 10 can be guaranteed.

The characteristic impedance of the coplanar line can be obtained by the following equation.
The capacitance C depends on the gap between the bridge line 30 and the conductor pattern 50. If the gap is large, the capacitance C is small, and if the gap is small, the capacitance C is large. Therefore, in order to reduce the characteristic impedance of the coplanar line, it is preferable to make the gap between the bridge line 30 and the conductor pattern 50 as small as possible.

  FIG. 6 shows a modification of the cross-sectional structure of the circuit board device. In the circuit board device 100 shown in FIG. 6, the gap between the bridge line 30 and the conductor pattern 50 is configured to be narrower than that shown in FIG. As a result, the characteristic impedance of the coplanar line can be lowered, and therefore the electromagnetic field leaking from the bridge line 30 is easily absorbed by the conductor pattern 50.

  In the second wiring layer 120, the gap between the bridge line 30 and the conductor pattern 50 is preferably set to be equal to or less than the distance between the wires in the first wiring pattern of the first wiring layer 110. By setting the distance to be less than or equal to the distance between the wirings, the amount of electromagnetic field leakage from the first inductor 12 of the first wiring layer 110 can be reduced. Thus, the amount of electromagnetic field leakage can be reduced by narrowing the outlet through which the electromagnetic field leaks. In addition, the amount of electromagnetic field leakage from the bridge line 30 is also reduced. This is because the function as a coplanar line is enhanced by narrowing the gap.

  FIG. 7 is a diagram showing a simulation result of electromagnetic field leakage when the gap between the bridge line and the conductor pattern is changed. FIG. 7A shows the electric field distribution when the gap is narrowed, and FIG. 7B shows the electric field distribution when the gap is widened compared to the simulation conditions of FIG. 7A. From this simulation result, it can be seen that the amount of electromagnetic field leakage can be reduced by narrowing the gap.

  FIG. 8 shows another example of the relationship between the first wiring layer and the second wiring layer shown in FIG. The first wiring layer 110 and the second wiring layer 120 are configured in the circuit board device 100, and in the first wiring layer 110, the first inductor 12 and the second inductor 14 are provided side by side. The first end 32 and the first contact 36 are connected by a via, and the second end 34 and the second contact 38 are also connected by a via. In the second wiring layer 120, the bridge line 30 connects the first end 32 and the second end 34.

  In this modification, a third via that connects the third contact 39 in the bridge line 30 and the contact 33 in the first wiring layer 110 is formed in the dielectric layer 115. Thereby, the node B connected to the control voltage input terminal 4 can be configured on the first wiring layer 110. As described above, since the first inductor 12 and the second inductor 14 are formed in a bilaterally symmetric structure, the third contact 39 is formed at the midpoint between the first contact 36 and the second contact 38 and the contact 33. Is preferably formed at the midpoint between the first end portion 32 and the second end portion 34.

  By arranging the line reaching the node B in the first wiring layer 110, it is possible to reduce the line exposed in the second wiring layer 120 located on the board side at the time of mounting. Thereby, the electromagnetic field leaking to the outside of the circuit board device 100 can be reduced, and the influence of the electromagnetic field received from the outside of the circuit board device 100 can be reduced.

  FIG. 9 shows still another example of the relationship between the first wiring layer and the second wiring layer shown in FIG. In the circuit board device 100 of this modification, there are two points different from FIG. One is that the outer edges of the first inductor 12 and the second inductor 14 in the first wiring layer 110 have a rectangular shape whose horizontal direction is shorter than the vertical direction. The horizontal direction is a direction connecting the first end 32 and the second end 34 in the first wiring layer 110. The vertical direction is a direction perpendicular to the horizontal direction. By making the outer edges of the first inductor 12 and the second inductor 14 into a rectangular shape whose horizontal direction is shorter than the vertical direction, the distance between the first via 70 and the second via 72 can be reduced as compared with the case of the square shape. Can be shortened. Therefore, the length of the bridge line 30 in the second wiring layer 120 can be shortened, and the leakage of the electromagnetic field from the bridge line 30 can be further suppressed. In addition, since the first wiring layer 110 has a space for moving the positions of the first end 32 of the first inductor 12 and the second end 34 of the second inductor 14 in the vertical direction, the first end 32 and the second end By adjusting the position of the portion 34 in the vertical direction, the inductor values of the first inductor 12 and the second inductor 14 can be adjusted. Another difference is that the positions of the first end 32 of the first inductor 12 and the second end 34 of the second inductor 14 in the first wiring layer 110 are the center positions of the first inductor 12 and the second inductor 14. It is a point that is lower. In this case, compared with the case where the positions of the first end portion 32 and the second end portion 34 are at the center positions of the first inductor 12 and the second inductor 14, the second wiring layer 120 is connected to the node B of the bridge line 30. Since the length to reach can be shortened, leakage of the electromagnetic field from the bridge line 30 can be further suppressed.

  FIG. 10 shows another example of the relationship between the first wiring layer and the second wiring layer shown in FIG. In this modified example, since the node B connected to the control voltage input terminal 4 is configured on the first wiring layer 110 as in the case of FIG. 8, the second wiring layer positioned on the board side when mounted. Lines exposed at 120 can be reduced. Thereby, the electromagnetic field leaking to the outside of the circuit board device 100 can be reduced, and the influence of the electromagnetic field received from the outside of the circuit board device 100 can be reduced.

  FIG. 11 conceptually shows the relationship between the first wiring layer and the second wiring layer shown in FIG. 8 and the board on which the circuit board device is mounted. The first wiring layer 110 is the same as that of FIG. There are two differences from FIG. First, instead of the bridge line 30, the second wiring layer 120 is electrically connected to the first via 70, the second via 72, and the third via, respectively. This is a point having three electrodes 78. The other is that the bridge line 30 is formed on the board 80 on which the circuit board device 100 is mounted. In the board 80, a conductor pattern 52 is provided around the bridge line 30.

  FIG. 12 shows a cross-sectional structure of the first wiring layer, the second wiring layer, and the board shown in FIG. This cross-sectional structure corresponds to the BB cross section in FIG. The circuit board device 100 includes a coating layer 112, a first wiring layer 110, a dielectric layer 115, and a second wiring layer 120 from the upper layer. In the first wiring layer 110, the first inductor 12 and the second inductor 14 are formed. The dielectric layer 115 is provided with a first via 70, a second via 72, and a third via 73. In the second wiring layer 120, the first electrode 74, the second electrode 76, the third electrode 78, and the conductor pattern 50 are formed. The conductor pattern 50 has an outer edge at a position beyond the outer edges of the first wiring pattern of the first inductor 12 and the second wiring pattern of the second inductor 14 in the first wiring layer 110. That is, the conductor pattern 50 is configured to be present below the first wiring pattern of the first inductor 12 and the second wiring pattern of the second inductor 14. The conductor pattern 50 functions as a grounded ground layer when the circuit board device 100 is mounted on the board 80.

  The first via 70 electrically connects the first end 32 of the first inductor 12 and the first electrode 74. The second via 72 electrically connects the second end 34 of the second inductor 14 and the second electrode 76. The third via 73 electrically connects the contact 33 and the third electrode 78 in the first wiring layer 110. The bridge line 30 is formed on the board 80. The second wiring layer 120 and the board 80 are electrically connected by solder. The first solder 84 electrically connects the first electrode 74 and the first contact 36 of the bridge line 30. The second solder 86 electrically connects the second electrode 76 and the second contact 38 of the bridge line 30. The third solder 88 electrically connects the third electrode 78 and the third contact 39 of the bridge line 30.

  11 and 12, in the second wiring layer 120 located on the board side during mounting, the first electrode 74, the second electrode 76, the third electrode 78, and the conductor pattern 50 are not connected. Since the area of the gap can be made smaller than the area of the gap between the bridge line 30 and the conductor pattern 50, the electromagnetic field leaking to the outside of the circuit board device 100 can be reduced. Further, the influence of the electromagnetic field received from the outside of the circuit board device 100 can be reduced. 11 shows an example in which the bridge line 30 formed on the board 80 connects the first contact 36, the second contact 38, and the third contact 39 linearly. However, the bridge provided on the board 80 is illustrated. The line 30 can be freely formed on the user side. That is, by externally attaching components between the contacts or by drawing the bridge line 30 in a curved shape, the characteristics can be adjusted, and the degree of freedom in circuit design is increased.

  In the above, this invention was demonstrated based on the Example. This embodiment is an exemplification, and it will be understood by those skilled in the art that various modifications can be made to the combination of each component and each processing process, and such modifications are also within the scope of the present invention. .

  In the embodiment, the circuit board device 100 for the FM tuner has been described. However, the circuit board device 100 may be used for other purposes. For example, the circuit board device 100 can be used for a TV tuner, and can also be used for a wireless tag. On the circuit board device 100, not only an IC chip but also passive components may be mounted. Although the two-layer structure having two wiring layers has been described in the embodiment, the circuit board device 100 may be configured to have a laminated structure having three or more wiring layers. Further, the circuit board device 100 is not only the basis of the package IC, but may be a module or a sub board.

  In the embodiment, an example in which a MOS transistor is used as the high-frequency oscillation transistor of the oscillation circuit 10 has been described. However, a bipolar transistor can be used as the high-frequency oscillation transistor of the oscillation circuit 10. Further, the bridge line 30 is not limited to the first short contact 36 and the second contact 38 as shown in each drawing, or the straight shortest wiring connecting the first contact 36, the second contact 38 and the third contact 39. . The bridge line 30 may be a polygonal line or a curved line. In this case, the degree of freedom in circuit design increases.

  Further, the vertical positions of the first contact 36 and the second contact 38, or the first contact 36, the second contact 38, and the third contact 39 are not limited to the case where they coincide as shown in the drawings. These vertical positions may be offset (may be shifted). In this case, the degree of freedom in circuit design increases. This is particularly true when the first inductor 12 and the second inductor 14 are rectangular as shown in FIGS. 11 and 12, the example in which the node B connected to the control voltage input terminal 4 is configured on the first wiring layer 110 is shown as in FIG. The board 80 may be configured. In this case, it is not necessary to provide the third electrode 78 in the second wiring layer 120, and the electromagnetic field leaking to the outside of the circuit board device 100 can be further reduced.

Further, the first wiring pattern and the second wiring pattern formed in a spiral shape are not limited to a square shape as shown in each drawing. The first wiring pattern and the second wiring pattern formed in a spiral shape may have a circular shape, an elliptical shape, or an arbitrary polygonal shape.
Further, although the case where two coil patterns of the first inductor 12 and the second inductor 14 are formed in the circuit board device 100 has been described, other predetermined wiring patterns are formed in the first wiring layer 110. May be. Even in this case, the dielectric layer 115 has vias electrically connected to a predetermined wiring pattern, and the second wiring layer 120 has a bridge line 30 connected to the vias and the first wiring layer. A conductor pattern 50 having an outer edge at a position beyond the outer edge of the wiring pattern at 110 is formed. Thereby, the amount of electric field leaking from the wiring pattern to the lower side of the second wiring layer 120 can be reduced. In addition, since the bridge line 30 functions as a coplanar line, the amount of electromagnetic field leakage from the bridge line 30 can also be reduced.

It is a circuit diagram of the oscillation circuit of the FM tuner apparatus concerning the Example of this invention. It is a figure which shows notionally the relationship between the 1st wiring layer and 2nd wiring layer in a circuit board apparatus. It is a figure which shows notionally the relationship between the 1st inductor in a circuit board apparatus, a 2nd inductor, and a bridge line. It is a figure which shows the cross-section of the package IC concerning an Example. It is a figure which shows the cross-section of a circuit board apparatus. It is a figure which shows the modification of the cross-section of a circuit board apparatus. It is a figure which shows the simulation result of the electromagnetic field leakage when changing the gap of a bridge line and a conductor pattern. FIG. 4 is a diagram showing another example of the relationship between the first wiring layer and the second wiring layer shown in FIG. 2. It is a figure which shows another example of the relationship between the 1st wiring layer and 2nd wiring layer which were shown in FIG. FIG. 10 is a diagram showing another example of the relationship between the first wiring layer and the second wiring layer shown in FIG. 9. FIG. 9 is a diagram conceptually showing a relationship between a first wiring layer and a second wiring layer shown in FIG. 8 and a relationship with a board on which the circuit board device is mounted. It is a figure which shows the cross-section of the 1st wiring layer shown in FIG. 11, a 2nd wiring layer, and a board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Package IC, 10 ... Oscillator circuit, 12 ... 1st inductor, 14 ... 2nd inductor, 30 ... Bridge line, 32 ... 1st edge part, 34 ... Second end, 40 ... Circuit device, 50 ... Conductor pattern, 60 ... IC chip, 70 ... First via, 72 ... Second via, 100 ... Circuit board device, 110: first wiring layer, 115: dielectric layer, 120: second wiring layer.

Claims (5)

A first wiring layer having a first wiring pattern formed in a spiral shape and a second wiring pattern formed in a spiral shape;
A dielectric layer having a first via and a second via electrically connected to each of the first wiring pattern and the second wiring pattern;
A bridge line that electrically connects the first via and the second via, and provided around the bridge line, and exceeds an outer edge of the first wiring pattern and the second wiring pattern in the first wiring layer. A second wiring layer having a conductor pattern having an outer edge at a certain position;
A circuit board device comprising:   2. The circuit board device according to claim 1, wherein in the second wiring layer, the bridge line functions as a coplanar line when the conductor pattern is provided around the second wiring layer.   The circuit board device according to claim 2, wherein the characteristic impedance of the coplanar line is set lower than the characteristic impedance of the first wiring pattern or the second wiring pattern.   The gap between the bridge line and the conductor pattern in the second wiring layer is set to be equal to or less than a distance between wirings in the first wiring pattern or the second wiring pattern. 4. The circuit board device according to any one of 3. 2. The second wiring layer according to claim 1, wherein the second wiring layer includes a first electrode and a second electrode that are electrically connected to each of the first via and the second via, instead of the bridge line. circuit board equipment of.