JP4749097B2 - Non-contact IC label - Google Patents

Description

  The present invention relates to a non-contact type IC label capable of writing and reading information in a non-contact state, and more particularly to a structure for preventing unauthorized reuse.

  In recent years, with the progress of the information-oriented society, information is recorded on a card, and information management and settlement using the card are performed. In addition, information is recorded on a label attached to a product or the like, and management of the product or the like using this label is also performed.

  In information management using such a card or label, a non-contact type IC card or a non-contact type in which an IC chip capable of writing and reading information in a non-contact state on the card or label is mounted. Type IC labels are rapidly spreading due to their excellent convenience.

  7A and 7B are diagrams showing a configuration example of a general non-contact type IC label, where FIG. 7A is a diagram showing an internal structure, and FIG. 7B is a cross-sectional view taken along line AA ′ shown in FIG. .

  As shown in FIG. 7, in this configuration example, an antenna 412 made of a coiled conductive material and a contact 413 made of a conductive material are formed on one surface of a base substrate 414 made of paper or the like. An IC chip 411 capable of writing and reading information from the outside in a non-contact state via the antenna 412 is mounted, and an adhesive 420 is applied to the entire surface of the base substrate 414 where the antenna 412 is formed. The release paper 440 is detachably pasted by the adhesive 420. The contact point 413 is formed at both ends of the coiled antenna 412, and the IC chip 411 is bonded onto the base substrate 414 with a conductive adhesive (not shown) so that the IC chip 411 is connected to the contact point 413. Thus, a circuit including the antenna 412, the contact 413, and the IC chip 411 is formed.

  In the non-contact type IC label 401 configured as described above, the release paper 440 is peeled off and attached to an adherend such as an article with an adhesive 420, and an information writing / reading device (externally provided) ( (Not shown), a current flows to the antenna 412 by electromagnetic induction from the information writing / reading device, and this current is supplied to the IC chip 411 via the contact 413, so that in a non-contact state, Information is written to the IC chip 411 from the information writing / reading device, and information written to the IC chip 411 is read by the information writing / reading device.

  Here, the non-contact type IC label 401 as described above may be used as a sealed label for the purpose of preventing counterfeiting of products. In that case, the non-contact type IC label 401 is used by being attached to an adherend such as an article. Later, it is necessary to prevent unauthorized reuse.

Therefore, a release agent was applied to a part of a region where the antenna of the base substrate is formed, and an antenna was formed by applying a conductive paste thereon, and then the antenna of the base substrate was formed. A pressure-sensitive adhesive is applied to the entire surface, whereby when the non-contact IC label is peeled off from the adherend after being attached to the adherend, the release agent among the antennas formed on the base substrate The part formed in the area where the adhesive is not applied is peeled off from the adherend, and the part formed in the area where the release agent is applied is peeled off from the base substrate and left on the adherend together with the adhesive. Technology has been considered (for example, see Patent Document 1). In the non-contact type IC label configured in this way, when peeled from the adherend after being attached to the adherend, the release agent is not applied among the antennas formed on the base substrate. Since the part formed in the area peels off from the adherend, and the part formed in the area where the release agent is applied peels off from the base substrate and remains on the adherend together with the adhesive, the antenna is disconnected. Thus, it can be prevented from functioning as a non-contact type IC label and illegally reused.
JP 2000-105807 A

  However, in the non-contact type IC label as described above, when the non-contact type IC label is attached to the adherend and then peeled off from the adherend, a part of the antenna formed on the base substrate is removed. Since the release agent is applied to a part of the area of the base substrate where the antenna is formed in order to peel it off from the base substrate, the antenna and the adhesive peel off from the base substrate in the manufacturing process. There is a fear. In addition, the cost for the release agent is increased, and after the release agent is applied to the base substrate, the antenna is formed after the release agent is dried. There is a problem that.

  The present invention has been made in view of the problems of the prior art as described above, and is a non-contact type IC label that can be prevented from being illegally reused without using a release agent. The purpose is to provide.

In order to achieve the above object, the present invention provides:
An IC chip having a conductive pattern formed on one surface of the base substrate and capable of writing and / or reading information in a non-contact state via the conductive pattern is provided on the base substrate. mounted in a non-contact state via the sexual pattern to the write and / or read is made possible position of the information, the base member wherein the conductive pattern adherend by imparting cohesive agent is formed faces the In the non-contact type IC label attached to
The base substrate is a region that does not overlap the edge of the base substrate, and is formed in a shape facing a part of the conductive pattern, with a concave portion having a certain width closed,
The concave portion has a depth such that the breaking holding force of the base substrate in the concave portion is weaker than the adhesion force of the adhesive to the adherend .

  In the present invention configured as described above, when peeled from the adherend after being attached to the adherend by the adhesive applied to the base substrate, the base substrate is broken at the recess, The region is separated from the adherend through the recess and the region remaining on the adherend. Since the recess is formed in a region facing a part of the conductive pattern, when the base substrate is broken and separated by the recess, the conductive pattern is disconnected and does not function as a non-contact type IC label. Unauthorized reuse can be prevented.

  In addition, if the recess is formed in a closed shape, the base substrate will be broken at the recess even if the non-contact type IC label attached to the adherend is peeled from any direction. Become.

  As described above, in the present invention, since the base substrate has a recess in a region facing a part of the conductive pattern, the base substrate is peeled off from the adherend after being attached to the adherend. The base substrate is broken at the recess, and the conductive pattern is disconnected accordingly, so that it does not function as a non-contact type IC label, and it is possible to prevent unauthorized reuse without using a release agent. it can. Moreover, since the structure for breaking the conductive pattern as described above is provided by forming a recess in a region facing a part of the conductive pattern of the base substrate, the conductive pattern is broken. When providing a structure for the purpose, the conductive pattern is not adversely affected.

  In the case where the recess is formed in a closed shape, the base substrate is broken at the recess even when the non-contact type IC label attached to the adherend is peeled from any direction. be able to.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
1A and 1B are diagrams showing a first embodiment of a non-contact type IC label according to the present invention, where FIG. 1A is a view seen from the surface, and FIG. 1B is a cross-sectional view taken along line AA ′ shown in FIG. FIG.

  In this embodiment, as shown in FIG. 1, a coiled antenna 112 and a contact 113 that are conductive patterns are formed on one surface of a base substrate 114 made of paper, and from the outside through the antenna 112. The IC chip 111 capable of writing and reading information in a non-contact state is mounted, and an adhesive 120 is applied to the entire surface of the base substrate 114 on which the antenna 112 is formed. The release paper 140 is configured to be peeled and pasted. The contact 113 is formed at both ends of the coiled antenna 112, and the IC chip 111 is bonded onto the base substrate 114 by a conductive adhesive (not shown) so that the IC chip 111 is connected to the contact 113. Thus, a circuit including the antenna 112, the contact 113, and the IC chip 111 is formed. That is, the IC chip 111 is mounted at a position where information can be written and read out in a non-contact state via the antenna 112 and the contact 113 of the base substrate 114. The base substrate 114 is formed with a plurality of ring-shaped recesses 115 opened to the opposite side of the adhesive 120 in a region facing a part of the antenna 112. The interval between the recesses 115, that is, the diameter between the rings and the inside of the ring is preferably 1 mm or less, and more preferably 0.5 mm or less.

  In the non-contact type IC label 101 configured as described above, the release paper 140 is peeled off and attached to an adherend such as an article by the adhesive 120, and an information writing / reading device (externally provided) ( (Not shown) causes a current to flow through the antenna 112 by electromagnetic induction from the information writing / reading device, and this current is supplied to the IC chip 111 via the contact 113, so that in a non-contact state, Information is written to the IC chip 111 from the information writing / reading device, and information written to the IC chip 111 is read by the information writing / reading device.

  Below, the manufacturing method of the non-contact type IC label 101 mentioned above is demonstrated.

  FIG. 2 is a diagram for explaining a method of manufacturing the non-contact type IC label 101 shown in FIG.

  First, the antenna 112 and the contact point 113 are formed on one surface of the base substrate 114 made of paper by a method such as screen printing using a conductive paste (FIG. 2A). Note that the antenna 112 and the contact 113 may be formed from a metal thin film by vapor deposition or etching, not limited to screen printing using a conductive paste.

  Next, the IC chip 111 is mounted on the base substrate 114 so as to be connected to the contact 113, and the IC chip 111 is bonded onto the base substrate 114 with a conductive adhesive (not shown) (FIG. 2B). )). Thereby, the IC chip 111 is electrically connected to the contact 113, and a circuit including the antenna 112, the contact 113, and the IC chip 111 is formed.

  Next, the adhesive 120 is applied to the entire surface of the base substrate 114 where the antenna 112 is formed, and the release paper 140 is detachably attached so as to cover the adhesive 120 (FIG. 2 (c). )). In addition, as thickness of the adhesive 120, 20 micrometers or more are preferable, Furthermore, 30 micrometers or more are more preferable. Further, as the release paper 140, for example, a paper or a film that is a base material and a fluorine-based release agent such as silicone fluoride is applied on one surface thereof can be considered.

  Thereafter, a region facing the part of the antenna 112 of the base substrate 114 is irradiated with laser light from the surface opposite to the surface on which the adhesive 120 is applied (FIG. 2D), whereby the adhesive A ring-shaped recess 115 opened on the side opposite to the agent 120 is formed to complete the non-contact type IC label 101 as shown in FIG. 1 (FIG. 2E). At this time, the formation depth of the recess 115 is adjusted by adjusting the irradiation output of the laser beam. The formation depth of the recess 115 will be described later.

  Below, an effect | action in case it peels from the state which the non-contact-type IC label 101 mentioned above stuck on the to-be-adhered body is demonstrated.

  FIG. 3 is a diagram illustrating a state in which the non-contact type IC label 101 illustrated in FIG. 1 is peeled off from a state of being attached to an adherend.

  In order to peel the non-contact type IC label 101 attached to the adherend 150 from the adherend 150, when the interface between the non-contact type IC label 101 and the adherend 150 is peeled, first, the adhesive 120 is removed. The non-contact type IC label 101 is peeled off from the adherend 150 (FIG. 3A).

  When the non-contact type IC label 101 is pulled away from the adherend 150 in order to peel the non-contact type IC label 101 from the adherend 150, the base substrate 114 is continuously attached together with the adhesive 120. Attempt to peel off body 150. However, the base substrate 114 has a concave portion 115 that is closed in a ring shape. When the region peeled off from the adherend 150 reaches the concave portion 115, the ring of the concave portion 115 of the base base material 114 is formed. On the other hand, the outer region of the shape continues to be peeled off from the adherend 150 together with the adhesive 120, whereas in the ring-shaped inner region of the concave portion 115, the breaking holding force in the concave portion 115 of the base substrate 114 is Since it is weaker than the adhesion force with 120 to adherend 150, crevice 115 will break and it will remain with adherend 150 with adhesive 120 (Drawing 3 (b)).

  Here, the formation depth of the recess 115 will be described. As described above, the recess 115 formed in the base substrate 114 has such a depth that it breaks when the non-contact type IC label 101 is peeled off after being attached to the adherend 150, that is, the base substrate It is necessary to form such a depth that the breaking holding force in the concave portion 115 of the material 114 is weaker than the adhesion force of the adhesive 120 to the adherend 150. Therefore, if the depth of the concave portion 115 is too shallow, the base substrate 114 does not break without the fracture holding force in the concave portion 115 of the base substrate 114 becoming weaker than the adhesion force of the adhesive 120 to the adherend 150. It is not preferable. On the other hand, if the recess 115 is formed so that the base substrate 114 penetrates, the base substrate 114 is surely secured in the recess 115 when the non-contact type IC label 101 is peeled off after being stuck to the adherend 150. In this case, the antenna 112 may be damaged when the recess 115 is formed in the base substrate 114 by the laser beam. Therefore, if the recess 115 is formed to a depth such that the surface on which the adhesive 120 of the base substrate 114 is applied remains slightly, the antenna 112 is damaged when the recess 115 is formed in the base substrate 114. However, the concave portion 115 can be reliably broken when the non-contact type IC label 101 is peeled off after being attached to the adherend 150.

  Thereafter, when the non-contact type IC label 101 is continuously peeled off from the adherend 150, the base substrate 114 is broken at all the recesses 115, and the ring-shaped outer region of the recess 115 of the base substrate 114 is removed. It peels from the adherend 150 together with the adhesive 120, and the entire ring-shaped inner region of the recess 115 remains on the adherend 150 together with the adhesive 120 (FIG. 3C).

  4 is a view showing a state in which the non-contact type IC label 101 shown in FIG. 1 is completely peeled after being stuck to the adherend 150, and (a) is a state of the non-contact type IC label 101. FIG. (B) is a figure which shows the state of the to-be-adhered body 150 in which the non-contact-type IC label 101 was affixed.

  As shown in FIG. 4A, in the state in which the non-contact type IC label 101 shown in FIG. The ring-shaped outer region of the base material 114 is peeled off from the adherend 150 together with the adhesive 120, and accordingly, the antenna 112 formed on the peeled portion of the base substrate 114 is also peeled off from the adherend 150. It has become.

  On the other hand, as shown in FIG. 4B, the adherend 150 to which the non-contact type IC label 101 has been attached has a concave portion of the base substrate 114 of the non-contact type IC label 101 that has been attached. 115, the inner region of the ring shape remains attached with the adhesive 120, and accordingly, the antenna 112 formed in that region of the base substrate 114 also remains on the adherend 150. ing.

  As described above, when the non-contact type IC label 101 shown in FIG. 1 is attached to the adherend 150 and then peeled off from the adherend 150, the recess 115 of the antenna 112 of the non-contact type IC label 101 is removed. The portion facing the ring-shaped outer side of the ring-shaped part peels off from the adherend 150 together with the base substrate 114, while the portion facing the ring-shaped inner side of the recess 115 is stuck to the adherend 150 by the adhesive 120. Accordingly, the antenna 112 is disconnected and does not function as the non-contact type IC label 101, so that it can be prevented from being reused illegally.

(Second Embodiment)
5A and 5B are diagrams showing a second embodiment of the non-contact type IC label of the present invention, where FIG. 5A is a view seen from the surface, and FIG. 5B is a cross-sectional view taken along line AA ′ shown in FIG. FIG.

  In this embodiment, as shown in FIG. 5, a coiled antenna 212 and a contact point 213 that are conductive patterns are formed on one surface of a base substrate 214 made of paper, and from the outside via the antenna 212. The IC chip 211 capable of writing and reading information in a non-contact state is mounted, and an adhesive 220 is applied to the entire surface of the base substrate 214 on which the antenna 212 is formed. The release paper 240 is configured to be peeled and pasted. The contact point 213 is formed at both ends of the coiled antenna 212, and the IC chip 211 is bonded onto the base substrate 214 with a conductive adhesive (not shown) so that the IC chip 211 is connected to the contact point 213. Thus, a circuit including the antenna 212, the contact point 213, and the IC chip 211 is formed. That is, the IC chip 211 is mounted at a position where information can be written and read out in a non-contact state via the antenna 212 and the contact 213 of the base substrate 214. In addition, a lattice-shaped recess 215 that is open to the side opposite to the adhesive 220 is formed in the base substrate 214 in a region facing a part of the antenna 212. One side of the lattice serving as the interval between the recesses 215 is preferably 1 mm or less, and more preferably 0.5 mm or less.

  As described above, in the present embodiment, the recess 115 is formed in a ring shape on the base substrate 114 as shown in the first embodiment, but the lattice recess is formed on the base substrate 214. The only difference is that 215 is formed.

  When the non-contact type IC label 201 configured as described above is peeled off after being attached to an adherend, the region where the recesses 215 of the base substrate 214 are formed becomes brittle by the lattice-like recesses 215. Since the height of the concave portion 215 is increased, the base material 214 is separated into a region where the base substrate 214 is peeled off from the adherend and a region remaining on the adherend. The shape of the separation is arbitrary depending on the depth of the recess 215, the length of one side of the lattice constituting the recess 215, or the adhesive strength of the adhesive 220 to the adherend.

  Accordingly, in a state where the non-contact type IC label 201 shown in FIG. 5 is attached to the adherend and then peeled off from the adherend, the antenna 112 formed on the base substrate 214 is The portion formed in the region peeled from the adherend of 214 and the portion formed in the region remaining on the adherend of the base substrate 214 are disconnected, and do not function as the non-contact type IC label 201. It becomes possible to prevent unauthorized reuse.

  In the above-described two embodiments, the recesses 115 and 215 that are open on the opposite side of the adhesives 120 and 220 are formed in regions of the base bases 114 and 214 that face part of the antennas 112 and 212. However, it is also conceivable to form ring-shaped or lattice-shaped recesses that open on the opposite side of the adhesives 120, 220 on the entire surface of the base substrates 114, 214. However, in that case, when the base substrates 114 and 214 are peeled off from the release papers 140 and 240 and attached to the adherend, the base substrates 114 and 214 may be too fragile and difficult to handle. It is preferable to devise methods such as reducing the depth of the surface.

(Third embodiment)
FIGS. 6A and 6B are diagrams showing a third embodiment of the non-contact type IC label of the present invention, where FIG. 6A is a view seen from the surface, and FIG. 6B is a cross-sectional view taken along line AA ′ shown in FIG. FIG.

  In this embodiment, as shown in FIG. 6, a coil-shaped booster antenna 316 that is a conductive pattern is formed on one surface of a base substrate 314 made of paper, and an antenna 312 is provided. An IC chip 311 that performs non-contact writing and reading of information from outside via the booster antenna 316 is mounted, and an adhesive 320 is applied to the entire surface of the base substrate 314 where the booster antenna 316 is formed. The release paper 340 is detachably pasted by the adhesive 320. The base substrate 314 has a plurality of ring-shaped recesses 315 that are open to the side opposite to the adhesive 320 in a region facing a part of the booster antenna 316. The interval between the recesses 315, that is, the diameter between the rings and the inside of the ring is preferably 1 mm or less, and more preferably 0.5 mm or less.

  In the non-contact type IC label 301 configured as described above, the release paper 340 is peeled off and attached to the adherend with the adhesive 320, and an information writing / reading device (not shown) provided outside is provided. , Electromagnetic induction occurs between the antenna 312 provided on the IC chip 311 and the antenna on the information writing / reading device side, so that the information written in the IC chip 311 is in a non-contact state. The information is read / written by the information writing / reading device, or information is written from the information writing / reading device to the IC chip 311 in a non-contact state. Here, the sharpness Q indicating the ease of reception in the IC chip 311 is determined by the inductance, capacitance, and resistance component of the antenna 312. Therefore, for example, when the conductor diameter of the antenna 312 is increased, the sharpness Q is increased, thereby extending the communicable distance of the IC chip 311. In this embodiment, since the booster antenna 316 is formed on the base base material 314, the booster antenna 316 and the antenna 312 are electromagnetically coupled, whereby the apparent conductor diameter of the antenna 312 is increased and sharpened. Degree Q increases. Therefore, in this embodiment, information is written to and read from the IC chip 311 via the antenna 312 and the booster antenna 316. That is, the IC chip 311 is mounted at a position where information can be written and read out in a non-contact state at a predetermined communication distance via the antenna 312 and the booster antenna 316 of the base substrate 314.

  Also in the non-contact type IC label 301 described above, as in the case of the first embodiment, when the base substrate 314 is peeled off from the adherend after being attached to the adherend, The portion of the booster antenna 316 of the non-contact type IC label 301 is peeled off from the adherend together with the base substrate 314 while the portion of the booster antenna 316 of the non-contact type IC label 301 facing the ring-shaped outer side is peeled off from the adherend. Since the part facing the inside of the ring shape remains attached to the adherend with the adhesive 320, the booster antenna 316 is disconnected and the communication distance is greatly changed, preventing unauthorized reuse. can do.

  In this embodiment as well, a recess 315 that is open on the side opposite to the adhesive 320 is formed in a region of the base substrate 314 facing a part of the booster antenna 316, but the entire surface of the base substrate 314 is formed. It is also conceivable to form a ring-shaped recess opening on the side opposite to the adhesive 320. However, even in that case, when the base substrate 314 is peeled from the release paper 340 and attached to the adherend, the base substrate 314 may be too fragile and difficult to handle. It is preferable to devise methods such as shallowing.

  Further, in the above-described three embodiments, the base substrate 114, 214, 314 is described as an example made of paper, but the present invention is not limited to this, and a resin film in addition to paper. It is possible to use what consists of these. However, a substrate made of a fiber material is preferable from the viewpoint of the formation of the recesses 115, 215, 315 with a laser or the like and the breaking property when peeled off from the adherend, and it is considered to use paper fibers or resin fibers. More preferably, a paper material is more preferable in terms of proper printing. Moreover, you may use the coated paper which gave coating of resin etc. on the fiber-type raw material.

  It is also conceivable that a surface sheet is laminated on the base substrate 114, 214, 314. In this case, the concave portions 115, 215, and 315 formed in the base base materials 114, 214, and 314 cannot be visually recognized from the outside by this surface sheet. In addition, it is possible to perform desired printing on an arbitrary region on the surface of the non-contact type IC labels 101, 201, and 301.

  In addition, the concave portions 115, 215, and 315 formed on the base base materials 114, 214, and 314 are not limited to the ring shape or the lattice shape as described above, and face the antennas 112 and 212 or a part of the booster antenna 316. As long as it is formed on the base substrate 114, 214, 314, it may have any shape. However, if it is a closed shape such as a ring shape or a lattice shape, the base can be removed from any direction when the non-contact type IC labels 101, 201, 301 attached to the adherend are peeled from any direction. The base materials 114, 214, and 314 can be broken at the recesses 115, 215, and 315.

  In the above-described three embodiments, information is written to and read from the IC chip when a current flows through a coiled antenna or a booster antenna formed on the base substrate by electromagnetic induction. Although the inductive contactless IC label has been described as an example, the present invention is not limited to this, and has two antennas formed on a base substrate so as to face each other with a predetermined interval. It can be applied to any radio wave system that does not allow information to be written to or read from the IC chip when the antenna is disconnected or the communication distance differs greatly. Also, the IC chips 1111, 211, 311 may be capable of only reading or writing in a non-contact state.

It is a figure which shows 1st Embodiment of the non-contact-type IC label of this invention, (a) is the figure seen from the surface, (b) is A-A 'sectional drawing shown to (a). It is a figure for demonstrating the manufacturing method of the non-contact-type IC label shown in FIG. It is a figure which shows the state in case the non-contact type IC label shown in FIG. 1 peels from the state affixed on the to-be-adhered body. FIG. 2 is a view showing a state where the non-contact type IC label shown in FIG. 1 is completely peeled after being stuck to an adherend, and (a) is a view showing a state of the non-contact type IC label; These are figures which show the state of the to-be-adhered body in which the non-contact-type IC label was affixed. It is a figure which shows 2nd Embodiment of the non-contact-type IC label of this invention, (a) is the figure seen from the surface, (b) is A-A 'sectional drawing shown to (a). It is a figure which shows 3rd Embodiment of the non-contact-type IC label of this invention, (a) is the figure seen from the surface, (b) is A-A 'sectional drawing shown to (a). It is a figure which shows one structural example of a common non-contact-type IC label, (a) is a figure which shows an internal structure, (b) is A-A 'sectional drawing shown to (a).

Explanation of symbols

101, 201, 301 Non-contact type IC label 111, 211, 311 IC chip 112, 212, 312 Antenna 113, 213 Contact 114, 214, 314 Base substrate 115, 215, 315 Recess 120, 220, 320 Adhesive 140, 240, 340 Release paper 150 Substrate 316 Booster antenna

Claims (1)

An IC chip having a conductive pattern formed on one surface of the base substrate and capable of writing and / or reading information in a non-contact state via the conductive pattern is provided on the base substrate. mounted in a non-contact state via the sexual pattern to the write and / or read is made possible position of the information, the base member wherein the conductive pattern adherend by imparting cohesive agent is formed faces the In the non-contact type IC label attached to
The base substrate is a region that does not overlap the edge of the base substrate, and is formed in a shape facing a part of the conductive pattern, with a concave portion having a certain width closed,
The non-contact type IC label , wherein the concave portion has a depth at which a breaking holding force of the base substrate in the concave portion is weaker than an adhesive force of the adhesive to the adherend .

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