JP4636827B2 - 回路モジュール - Google Patents
回路モジュール Download PDFInfo
- Publication number
- JP4636827B2 JP4636827B2 JP2004222820A JP2004222820A JP4636827B2 JP 4636827 B2 JP4636827 B2 JP 4636827B2 JP 2004222820 A JP2004222820 A JP 2004222820A JP 2004222820 A JP2004222820 A JP 2004222820A JP 4636827 B2 JP4636827 B2 JP 4636827B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting substrate
- wiring layer
- fixing hole
- fixing plate
- circuit module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15158—Shape the die mounting substrate being other than a cuboid
- H01L2924/15162—Top view
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
Landscapes
- Structure Of Printed Boards (AREA)
Description
2 実装基板
3A 半導体素子
3B チップ素子
3C チップ素子
4 固定板
4C ビス孔
5 外部端子
6 半田
7 被覆樹脂
8A ビス
8B ヘッド
9 固定孔
12A 第1の絶縁膜
12B 第2の絶縁膜
12C 第3の絶縁膜
18A 第1の配線層
18B 第2の配線層
18C 第3の配線層
18D 第4の配線層
Claims (3)
- ガラス繊維またはフィラーが入った絶縁膜と配線層で多層の配線構造を成し、一主面に露出した露出配線層が設けられた実装基板と、
前記露出配線層に電気的に接続された回路素子と、
前記実装基板の側辺の近傍であり、厚み方向に貫通して設けられたビス挿入用の固定孔とを具備し、
前記側辺と前記固定孔に挟まれる機械的強度の弱い部分が切除されて、前記固定孔の内壁と前記実装基板の側辺が連続して形成され、
前記実装基板の前記一主面に露出して前記固定孔を囲むように配置されたリング状の金属からなる配線層であり、前記実装基板の前記側辺と近接した領域が切除されて設けられ、表面には、Ni、AuまたはAgがメッキにより設けられて、接着剤を介して固着されるCuまたはFeからなる固定板が設けられることを特徴とする駆動部やセンサ部を有する精密機器に内蔵されてビス止めされる回路モジュール。 - 前記固定板の材料は、Niから成り、還元処理を施すべく、前記Niの表面に水素ガスを吹き付けながら加熱処理され、前記メッキ膜は省かれてなる請求項1に記載の回路モジュール。
- 前記固定板の材料は、アルミニウムから成り、表面には酸化アルミニウムが形成されており、前記メッキ膜は省かれてなる請求項1に記載の回路モジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004222820A JP4636827B2 (ja) | 2004-07-30 | 2004-07-30 | 回路モジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004222820A JP4636827B2 (ja) | 2004-07-30 | 2004-07-30 | 回路モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006041410A JP2006041410A (ja) | 2006-02-09 |
JP4636827B2 true JP4636827B2 (ja) | 2011-02-23 |
Family
ID=35906044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004222820A Expired - Fee Related JP4636827B2 (ja) | 2004-07-30 | 2004-07-30 | 回路モジュール |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4636827B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104428912A (zh) | 2012-06-26 | 2015-03-18 | 株式会社村田制作所 | 安装基板和发光装置 |
US9814154B2 (en) | 2013-10-07 | 2017-11-07 | Hitachi Automotive Systems, Ltd. | Power converter |
CN118176834A (zh) * | 2021-10-25 | 2024-06-11 | 索尼集团公司 | 电子电路以及电子设备 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0613189U (ja) * | 1992-07-28 | 1994-02-18 | 京セラ株式会社 | 回路基板締結機構 |
JPH0741985U (ja) * | 1993-12-24 | 1995-07-21 | 富士通テン株式会社 | 端子板の固定構造 |
JPH08335752A (ja) * | 1995-04-04 | 1996-12-17 | Matsushita Electric Ind Co Ltd | フレキシブル配線板およびその製造方法 |
JPH11317570A (ja) * | 1998-05-06 | 1999-11-16 | Seiko Epson Corp | 電子機器 |
JPH11354946A (ja) * | 1998-06-04 | 1999-12-24 | Matsushita Electric Ind Co Ltd | 電子機器におけるプリント基板のアース方法及びアース構造 |
JP2000049424A (ja) * | 1998-07-29 | 2000-02-18 | Canon Inc | プリント回路基板 |
JP2001036265A (ja) * | 1999-06-11 | 2001-02-09 | Samsung Electronics Co Ltd | プリント基板装着器具を有する電子システム |
JP2003023273A (ja) * | 2001-07-06 | 2003-01-24 | Kitagawa Ind Co Ltd | プリント配線板のネジ取付構造、プリント配線板の接地構造、及び薄板状部材 |
JP2004014580A (ja) * | 2002-06-03 | 2004-01-15 | Nec Corp | 印刷配線板の金具取付構造 |
-
2004
- 2004-07-30 JP JP2004222820A patent/JP4636827B2/ja not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0613189U (ja) * | 1992-07-28 | 1994-02-18 | 京セラ株式会社 | 回路基板締結機構 |
JPH0741985U (ja) * | 1993-12-24 | 1995-07-21 | 富士通テン株式会社 | 端子板の固定構造 |
JPH08335752A (ja) * | 1995-04-04 | 1996-12-17 | Matsushita Electric Ind Co Ltd | フレキシブル配線板およびその製造方法 |
JPH11317570A (ja) * | 1998-05-06 | 1999-11-16 | Seiko Epson Corp | 電子機器 |
JPH11354946A (ja) * | 1998-06-04 | 1999-12-24 | Matsushita Electric Ind Co Ltd | 電子機器におけるプリント基板のアース方法及びアース構造 |
JP2000049424A (ja) * | 1998-07-29 | 2000-02-18 | Canon Inc | プリント回路基板 |
JP2001036265A (ja) * | 1999-06-11 | 2001-02-09 | Samsung Electronics Co Ltd | プリント基板装着器具を有する電子システム |
JP2003023273A (ja) * | 2001-07-06 | 2003-01-24 | Kitagawa Ind Co Ltd | プリント配線板のネジ取付構造、プリント配線板の接地構造、及び薄板状部材 |
JP2004014580A (ja) * | 2002-06-03 | 2004-01-15 | Nec Corp | 印刷配線板の金具取付構造 |
Also Published As
Publication number | Publication date |
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JP2006041410A (ja) | 2006-02-09 |
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