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JP4686629B2 - Electronic component mounting method - Google Patents

Electronic component mounting method Download PDF

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Publication number
JP4686629B2
JP4686629B2 JP2009225028A JP2009225028A JP4686629B2 JP 4686629 B2 JP4686629 B2 JP 4686629B2 JP 2009225028 A JP2009225028 A JP 2009225028A JP 2009225028 A JP2009225028 A JP 2009225028A JP 4686629 B2 JP4686629 B2 JP 4686629B2
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bonding material
electronic component
printed circuit
circuit board
magnetic
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JP2011077167A (en
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章 田中
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Toshiba Corp
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Toshiba Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75264—Means for applying energy, e.g. heating means by induction heating, i.e. coils
    • H01L2224/75265—Means for applying energy, e.g. heating means by induction heating, i.e. coils in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83862—Heat curing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Wire Bonding (AREA)

Description

本発明は実装面にハンダボール等の接続部を有する電子部品を回路基板上に実装する実装方法に関する。 The present invention relates to a mounting method for mounting an electronic component having a connecting part such as solder balls on the mounting surface on the circuit board.

近年、プリント回路基板の回路パターンにベアチップのような半導体チップの電極をはんだバンプなどで接続するフェイスダウン、例えばＢＧＡ（Ball Grid Allay）またはＣＰＳ（Chip Scale Package）で実装した半導体チップの実装構造が知られている。フェイスダウンによる実装は、半導体チップの実装占有面積を狭くできる利点を有する。しかしながら、フェイスダウンの実装は、プリント回路基板の材料（例えばガラス・エポキシ樹脂）と半導体チップの材料（シリコン）との間の熱膨張係数の差により、接合部であるはんだに応力が発生して接合部が破壊される虞がある。あるいは、プリント回路基板等に外力が作用した場合、電子部品の接合部に負荷が作用し、接合部が剥がれてしまう虞がある。   In recent years, there has been a mounting structure of a semiconductor chip mounted by face down, for example, BGA (Ball Grid Allay) or CPS (Chip Scale Package), where electrodes of a semiconductor chip such as a bare chip are connected to a circuit pattern of a printed circuit board by solder bumps. Are known. Mounting by face-down has the advantage that the mounting area of the semiconductor chip can be reduced. However, in face-down mounting, stress is generated in the solder that is the joint due to the difference in thermal expansion coefficient between the material of the printed circuit board (for example, glass / epoxy resin) and the material of the semiconductor chip (silicon). There is a risk of the joints being destroyed. Or when external force acts on a printed circuit board etc., a load will act on the junction part of an electronic component, and there exists a possibility that a junction part may peel.

このようなことから半導体チップの電極をはんだバンプなどで接続するフェイスダウン実装後、プリント回路基板と半導体チップとの間に熱硬化性樹脂溶液（アンダーフィル）を充填し、硬化させて接合材を形成し、プリント回路基板に半導体チップを固定することによって、ヒートサイクルなどの熱的応力に対するプリント回路基板と半導体チップとの間の接続信頼性の向上が図られている。   For this reason, after face-down mounting in which the electrodes of the semiconductor chip are connected by solder bumps, a thermosetting resin solution (underfill) is filled between the printed circuit board and the semiconductor chip and cured to bond the bonding material. By forming and fixing the semiconductor chip to the printed circuit board, the connection reliability between the printed circuit board and the semiconductor chip against thermal stress such as heat cycle is improved.

また、特許文献１には、熱硬化性樹脂とこの樹脂よりも比誘電率が小さいフィラー、例えばシリカフィラーとを含む充填材をプリント回路基板と半導体チップとの間に充填し、かつ、プリント回路基板側にシリカフィラーを位置させることにより、配線間のクロストークを低減する電子部品の実装体が開示されている。また、同特許文献１の段落［００２９］には「樹脂組成物３に含有されたフィラー２を予め磁性体が内蔵されたもの、例えば金属粉末の周囲をテフロン（登録商標）でコーティングしてなるものとしておき、磁石によってフィラー２が引き付けられる性質を利用して樹脂組成物３中の回路基板１４側または半導体装置１１側に位置させることも可能である。」と記載されている。   Further, in Patent Document 1, a filler containing a thermosetting resin and a filler having a relative dielectric constant smaller than that of the resin, for example, a silica filler, is filled between the printed circuit board and the semiconductor chip, and the printed circuit An electronic component mounting body that reduces crosstalk between wirings by positioning a silica filler on the substrate side is disclosed. Also, paragraph [0029] of Patent Document 1 states that “the filler 2 contained in the resin composition 3 is previously incorporated with a magnetic material, for example, a metal powder is coated around with Teflon (registered trademark). It is also possible to place the filler 2 on the circuit board 14 side or the semiconductor device 11 side in the resin composition 3 by utilizing the property that the filler 2 is attracted by a magnet.

特開２０００−２９４６０１号公報JP 2000-294601 A

しかしながら、特許文献１にはフィラーの分散によるプリント回路基板と電子部品との機械的な接続強度を向上させることに関しては着目していない。   However, Patent Document 1 does not focus on improving the mechanical connection strength between the printed circuit board and the electronic component by dispersing the filler.

本発明は、以上の点に鑑みなされたもので、その目的は、プリント回路基板と電子部品との間および電子部品の側面に接合材を充填して電子部品をプリント回路基板に固定する電子部品の実装方法であって、電子部品の機械的な接続強度を向上させることのできる実装方法を提供することにある。 The present invention has been made in view of the above points, and an object of the present invention is to fix an electronic component to a printed circuit board by filling a bonding material between the printed circuit board and the electronic component and on the side surface of the electronic component. It is an object to provide a mounting method capable of improving the mechanical connection strength of an electronic component.

この発明の態様に係る電子部品の実装方法は、プリント回路基板に電子部品を実装し、前記プリント回路基板と前記電子部品との間および前記電子部品の周囲に、熱硬化性樹脂と磁性体粉末とを含む接合材を充填し、電磁石からの磁力により前記接合材内の前記磁性体粉末が前記電子部品の周辺領域に集まるように該磁性体粉末の分散状態を制御するとともに、前記接合材を加熱して前記電子部品を前記接合材により前記プリント回路基板に接合することを特徴としている。 Mounting method of an electronic component according to an aspect of the invention, an electronic component is mounted on a printed circuit board, around and between the electronic component and the printed circuit board and the electronic component, a thermosetting resin and magnetic powder And controlling the dispersion state of the magnetic powder so that the magnetic powder in the bonding material gathers in the peripheral region of the electronic component by the magnetic force from the electromagnet, and the bonding material The electronic component is heated and bonded to the printed circuit board by the bonding material .

この発明の態様によれば、プリント回路基板と電子部品との間および電子部品の側面に接合材を充填して電子部品をプリント回路基板に固定する電子部品の実装方法であって、電子部品の機械的な接続強度を向上し信頼性の向上した実装方法を提供することができる。 According to an aspect of the present invention, there is provided a mounting method for an electronic component in which a bonding material is filled between the printed circuit board and the electronic component and on the side surface of the electronic component to fix the electronic component to the printed circuit board. A mounting method with improved mechanical connection strength and improved reliability can be provided.

図１は、電子部品が実装されたプリント回路基板を示す斜視図。FIG. 1 is a perspective view showing a printed circuit board on which electronic components are mounted. 図２は、図１の線Ａ−Ａに沿った電子部品実装部分の断面図。2 is a cross-sectional view of an electronic component mounting portion taken along line AA in FIG. 図３は、電子部品の実装部を概略的に示す平面図。FIG. 3 is a plan view schematically showing a mounting part of an electronic component. 図４は、この発明の第１の実施形態に係る電子部品の実装装置を概略的に示す斜視図。FIG. 4 is a perspective view schematically showing the electronic component mounting apparatus according to the first embodiment of the present invention. 図５は、前記実装装置における搬送機構のステージおよび支持機構を示す分解斜視図。FIG. 5 is an exploded perspective view showing a stage and a support mechanism of a transport mechanism in the mounting apparatus. 図６は、前記実装装置のステージおよび支持機構を示す斜視図。FIG. 6 is a perspective view showing a stage and a support mechanism of the mounting apparatus. 図７は、前記磁界印加装置の磁力線の流れを概略的に示す断面図。FIG. 7 is a cross-sectional view schematically showing the flow of magnetic lines of force in the magnetic field application device. 図８は、前記磁界印加装置および搬送機構により、プリント回路基板に磁力を印加する工程を示す断面図。FIG. 8 is a cross-sectional view showing a step of applying a magnetic force to the printed circuit board by the magnetic field applying device and the transport mechanism. 図９は、他の遮蔽部材を用いて、前記磁界印加装置および搬送機構により、プリント回路基板に磁力を印加する工程を示す断面図。FIG. 9 is a cross-sectional view showing a step of applying a magnetic force to the printed circuit board by the magnetic field applying device and the transport mechanism using another shielding member. 図１０は、前記他の遮蔽部材を用いて磁力を印加することにより形成された接合材の磁性体粉末の分散状態を概略的に示す平面図。FIG. 10 is a plan view schematically showing a dispersed state of magnetic powder of a bonding material formed by applying a magnetic force using the other shielding member. 図１１は、他の遮蔽部材を示す斜視図。FIG. 11 is a perspective view showing another shielding member. 図１２は、前記磁界印加装置により、磁力を異なる方向から印加する状態を示す磁界印加装置の断面図。FIG. 12 is a cross-sectional view of the magnetic field application device showing a state in which magnetic force is applied from different directions by the magnetic field application device. 図１３は、他の実施形態に係る遮蔽部材の支持機構を示す斜視図。FIG. 13 is a perspective view showing a support mechanism for a shielding member according to another embodiment. 図１４は、更に他の実施形態に遮蔽部材の支持機構を示す斜視図。FIG. 14 is a perspective view showing a support mechanism for a shielding member according to still another embodiment. 図１５は、他の実施形態に係る実装装置の加熱機構を示す側面図。FIG. 15 is a side view showing a heating mechanism of a mounting apparatus according to another embodiment. 図１６は、他の実施形態に係る実装装置の加熱機構を示す側面図。FIG. 16 is a side view showing a heating mechanism of a mounting apparatus according to another embodiment. 図１７は、この発明の第２の実施形態に係る実装装置を示す斜視図。FIG. 17 is a perspective view showing a mounting apparatus according to a second embodiment of the present invention. 図１８は、他の実施形態に係る実装装置の磁力印加装置を示す斜視図。FIG. 18 is a perspective view showing a magnetic force application device of a mounting device according to another embodiment.

以下、図面を参照しながら、この発明の実施形態について詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

初めに、実施形態に係る実装方法および実装装置により、プリント回路基板上に実装された電子部品について説明する。図１は、電子部品として、ＢＧＡ（ボールグリッドアレイ）実装されたシリコンベアチップを示す斜視図、図２は、図１の線Ａ−Ａに沿った実装部分の断面図である。   First, electronic components mounted on a printed circuit board by the mounting method and the mounting apparatus according to the embodiment will be described. FIG. 1 is a perspective view showing a silicon bare chip mounted with BGA (ball grid array) as an electronic component, and FIG. 2 is a cross-sectional view of a mounting portion taken along line AA in FIG.

図１および図２に示すように、プリント回路基板１０は実装面１０ａを有し、この実装面には、例えば銅箔からなる配線パターン１２およびその一部により複数の接続パッド１４が形成されている。プリント回路基板１０の実装面１０ａに電子部品、例えば、矩形状のベアチップ１６が実装されている。ベアチップ１６の下面に形成された複数の電極１７は、複数のはんだボール１８を介してプリント回路基板１０の接続パッド１４にハンダ接続され、ＢＧＡ実装されている。   As shown in FIGS. 1 and 2, the printed circuit board 10 has a mounting surface 10a, and a plurality of connection pads 14 are formed on the mounting surface by a wiring pattern 12 made of, for example, copper foil and a part thereof. Yes. An electronic component, for example, a rectangular bare chip 16 is mounted on the mounting surface 10 a of the printed circuit board 10. The plurality of electrodes 17 formed on the lower surface of the bare chip 16 are solder-connected to the connection pads 14 of the printed circuit board 10 via a plurality of solder balls 18 and mounted on the BGA.

熱硬化性樹脂および磁性体粉末２２を含む接合材２０が、プリント回路基板１０とベアチップ１６との間およびベアチップ１６の周囲に充填され、硬化することにより、ベアチップ１６をプリント回路基板１０の実装面１０ａに固定している。磁性体粉末２２は、図２および図３に示すように、接合材２０においてベアチップ１６の周囲に位置する部分に集まって局在している。   The bonding material 20 including the thermosetting resin and the magnetic powder 22 is filled between the printed circuit board 10 and the bare chip 16 and around the bare chip 16 and cured, whereby the bare chip 16 is mounted on the printed circuit board 10. 10a is fixed. As shown in FIGS. 2 and 3, the magnetic powder 22 is gathered and localized in a portion of the bonding material 20 located around the bare chip 16.

接合材２０を構成する熱硬化性樹脂は、例えばエポキシ樹脂を用いることができる。具体的なエポキシ樹脂は、熱硬化型一液性エポキシ樹脂を用いることができる。   For example, an epoxy resin can be used as the thermosetting resin constituting the bonding material 20. As a specific epoxy resin, a thermosetting one-component epoxy resin can be used.

接合材の熱硬化性樹脂に分散される磁性体粉末２２は、フェライト（Ｆｅ2Ｏ3）粉末、ネオジ系磁石粉末、コバルト系磁石粉末、アルコニア系磁石粉末、フェライト系磁石粉末、ケイ素鋼粉末、鉄粉末、パーマロイ粉末、磁性ステンレス鋼粉末を用いることができる。磁性体粉末の中で、特に絶縁性のフェライトが好ましい。 The magnetic substance powder 22 dispersed in the thermosetting resin of the bonding material includes ferrite (Fe 2 O 3 ) powder, neodymium magnet powder, cobalt magnet powder, arconia magnet powder, ferrite magnet powder, silicon steel powder, Iron powder, permalloy powder, and magnetic stainless steel powder can be used. Among the magnetic powders, insulative ferrite is particularly preferable.

磁性体粉末２２は、後述する磁力作用による熱硬化性樹脂内で容易に移動可能な球形であることが好ましい。磁性体粉末２２は、０．０１〜１０μｍの平均粒径を有することが好ましい。磁性体粉末２２は、接合材２０中に３０〜９０重量％で充填されていること好ましい。   The magnetic powder 22 is preferably in the form of a sphere that can be easily moved in a thermosetting resin by a magnetic action described later. The magnetic powder 22 preferably has an average particle diameter of 0.01 to 10 μm. It is preferable that the magnetic powder 22 is filled in the bonding material 20 at 30 to 90% by weight.

なお、「磁性体粉末２２がベアチップ１６の周囲部分に対応する接合材２０の箇所に局在している」とは、例えば、前記平均粒径を有する磁性体粉末２２がベアチップ１６の周囲部分に対応する接合材２０の箇所に６０〜９５重量％の密度で存在することを意味している。このような接合材２０において、ベアチップ１６の周囲に位置する領域以外の領域では、磁性体粉末２２は２０〜４０重量％の密度で存在する。   Note that “the magnetic powder 22 is localized at the location of the bonding material 20 corresponding to the peripheral portion of the bare chip 16” means, for example, that the magnetic powder 22 having the average particle diameter is present in the peripheral portion of the bare chip 16. It means that it is present at a density of 60 to 95% by weight at the location of the corresponding bonding material 20. In such a bonding material 20, the magnetic powder 22 is present at a density of 20 to 40% by weight in a region other than the region located around the bare chip 16.

次に、電子部品を上記のように実装するための、実施形態に係る電子部品の実装方法および実装装置について説明する。図４は、第１の実施形態に係る実装装置全体を概略的に示している。   Next, the electronic component mounting method and mounting apparatus according to the embodiment for mounting the electronic component as described above will be described. FIG. 4 schematically shows the entire mounting apparatus according to the first embodiment.

図４に示すように、実装装置は、電子部品が実装され熱硬化性樹脂および磁性体粉末を含む接合材が充填されたプリント回路基板１０を、支持しその面方向に沿って搬送する搬送機構３０と、接合材２０を所定温度に加熱して硬化させる加熱機構４０と、搬送機構３０により搬送されたプリント回路基板１０の接合材２０に磁力を印加する磁力印加装置５０と、接合材２０が硬化した後、接合材を消磁する消磁機７０と、を備えている。   As shown in FIG. 4, the mounting apparatus supports a printed circuit board 10 on which electronic components are mounted and filled with a bonding material containing a thermosetting resin and magnetic powder, and conveys the printed circuit board 10 along the surface direction. 30, a heating mechanism 40 that heats and cures the bonding material 20 to a predetermined temperature, a magnetic force applying device 50 that applies a magnetic force to the bonding material 20 of the printed circuit board 10 conveyed by the conveyance mechanism 30, and the bonding material 20 And a demagnetizer 70 for demagnetizing the bonding material after curing.

図４、図５、および図６に示すように、搬送機構３０は、プリント回路基板１０が載置される矩形板状の可動ステージ３２を有している。可動ステージ３２は非磁性材料で形成され、その上面の複数個所、例えば、４箇所には、位置決めリブ３３が突設されている。プリント回路基板１０は、４つの角をそれぞれ位置決めリブ３３によって位置決めした状態で、可動ステージ３２上に載置される。可動ステージ３２の両側面からガイドアーム３４が水平に突出している。これらのガイドアーム３４は、水平に伸びる２本のガイドレール３６上に移動自在に支持されている。そして、図示しない駆動機構により、可動ステージ３２は、水平な状態で、ガイドレール３６に沿って所望の位置に搬送される。   As shown in FIGS. 4, 5, and 6, the transport mechanism 30 has a rectangular plate-shaped movable stage 32 on which the printed circuit board 10 is placed. The movable stage 32 is made of a non-magnetic material, and positioning ribs 33 project from a plurality of positions, for example, four positions on the upper surface thereof. The printed circuit board 10 is placed on the movable stage 32 with the four corners positioned by the positioning ribs 33. Guide arms 34 project horizontally from both side surfaces of the movable stage 32. These guide arms 34 are movably supported on two guide rails 36 extending horizontally. Then, the movable stage 32 is conveyed to a desired position along the guide rail 36 in a horizontal state by a driving mechanism (not shown).

接合材２０を加熱する加熱機構４０は、可動ステージ３２の下面に固定された矩形板状のヒートパネル４２と、ヒートパネル４２の加熱温度を制御する制御部４４と、を有している。加熱機構４０は、接合材２０をキューリ点よりも低い、所望の温度、例えば、１２０〜１５０℃に加熱し、硬化させる。   The heating mechanism 40 that heats the bonding material 20 includes a rectangular plate-like heat panel 42 fixed to the lower surface of the movable stage 32, and a control unit 44 that controls the heating temperature of the heat panel 42. The heating mechanism 40 heats the bonding material 20 to a desired temperature lower than the Curie point, for example, 120 to 150 ° C., and cures the bonding material 20.

また、可動ステージ３２には、後述する遮蔽部材６１を支持する支持機構６０が設けられている。すなわち、可動ステージ３２の上面には、位置決めリブ３３の外側に４本の支持ポスト６２が立設されている。例えば、ガラス板からなる矩形状の透明な支持板６４が支持ポスト６２上に載置され、プリント回路基板１０と平行に、かつ、隙間を置いて対向している。支持板６４は、４つの固定ねじ６５により支持ポスト６２にねじ止めされている。   The movable stage 32 is provided with a support mechanism 60 that supports a shielding member 61 described later. That is, four support posts 62 are erected on the upper surface of the movable stage 32 on the outside of the positioning rib 33. For example, a rectangular transparent support plate 64 made of a glass plate is placed on the support post 62 and faces the printed circuit board 10 in parallel with a gap. The support plate 64 is screwed to the support post 62 by four fixing screws 65.

そして、この支持板６４上に、遮蔽部材６１が載置され、電子部品１６の上方に対向して配置されている。遮蔽部材６１は、パーマロイ、珪素鋼板等の磁界を通す磁性合金で形成されている。本実施形態において、遮蔽部材６１は、電子部品１６よりも僅かに大きな寸法を有する矩形枠状に形成されている。そして、遮蔽部材６１は、電子部品１６の外周部と重なる位置に配置されている。   A shielding member 61 is placed on the support plate 64 and is disposed above the electronic component 16. The shielding member 61 is made of a magnetic alloy that passes a magnetic field, such as permalloy or silicon steel plate. In the present embodiment, the shielding member 61 is formed in a rectangular frame shape having a size slightly larger than that of the electronic component 16. The shielding member 61 is disposed at a position overlapping the outer peripheral portion of the electronic component 16.

図７は、磁力印加装置の断面図である。図４および図７に示すように、磁力印加装置５０は、隙間を置いて対向配置された第１電磁石５２ａおよび第２電磁石５２ｂを有している。第１電磁石５２ａは、鉛直方向に延びるポールピース５４ａ、ポールピースの周囲に設けられたコイルボビン５５ａに、ポールピースを中心として捲回された励磁コイル５６ａと、ポールピースに固定され水平に延びるリターンヨーク（天板）５８ａと、を有している。励磁コイル５６ａは、電子部品１６および接合材２０の充填領域よりも広い面積に形成され、広範囲に亘って磁力線を印加可能となっている。   FIG. 7 is a cross-sectional view of the magnetic force application device. As shown in FIG. 4 and FIG. 7, the magnetic force application device 50 includes a first electromagnet 52 a and a second electromagnet 52 b that are arranged to face each other with a gap therebetween. The first electromagnet 52a includes a pole piece 54a extending in the vertical direction, an excitation coil 56a wound around the pole piece around a coil bobbin 55a provided around the pole piece, and a return yoke fixed to the pole piece and extending horizontally. (Top plate) 58a. The exciting coil 56a is formed in an area wider than the filling region of the electronic component 16 and the bonding material 20, and can apply magnetic field lines over a wide range.

同様に、第２電磁石５２ｂは、鉛直方向に延びるポールピース５４ｂ、ポールピースの周囲に設けられたコイルボビン５５ｂに、ポールピースを中心として捲回された励磁コイル５６ｂと、ポールピースに固定され水平に延びるリターンヨーク（底板）５８ｂと、を有している。励磁コイル５６ｂは、電子部品１６および接合材２０の充填領域よりも広い面積に形成され、広範囲に亘って磁力線を印加可能となっている。   Similarly, the second electromagnet 52b includes a pole piece 54b extending in the vertical direction, an excitation coil 56b wound around the pole piece on a coil bobbin 55b provided around the pole piece, and fixed to the pole piece horizontally. And a return yoke (bottom plate) 58b extending. The exciting coil 56b is formed in an area wider than the filling region of the electronic component 16 and the bonding material 20, and can apply magnetic field lines over a wide range.

第１電磁石５２ａおよび第２電磁石５２ｂは、可動ステージ３２の移動路を間に挟んで励磁コイル５６ａ、５６ｂが対向するように配置され、第１電磁石が移動路の上方に、第２電磁石が移動路の下方にそれぞれ位置している。第１電磁石５２ａのリターンヨーク５８ｂと第２電磁石５２ｂのリターンヨーク５８ｂとは、側壁を構成する一対のリターンヨーク５９ａ、５９ｂによって互いに連結され、閉磁路を形成している。   The first electromagnet 52a and the second electromagnet 52b are arranged so that the excitation coils 56a and 56b face each other with the moving path of the movable stage 32 therebetween, and the first electromagnet moves above the moving path. Located below the road. The return yoke 58b of the first electromagnet 52a and the return yoke 58b of the second electromagnet 52b are connected to each other by a pair of return yokes 59a and 59b constituting a side wall to form a closed magnetic circuit.

第１電磁石５２ａの励磁コイル５６ａは電源５７ａに接続され、また、第２電磁石５２ｂの励磁コイル５６ｂは電源５７ｂに接続されている。これらの電源５７ａ、５７ｂは制御部４４に接続されている。制御部４４は、励磁コイル５６ａ、５６ｂに供給する電圧、電流、あるいは駆動周波数を制御し、励磁コイル５６ａ、５６ｂから発生する磁力の向きおよび強度を調整する。   The exciting coil 56a of the first electromagnet 52a is connected to the power source 57a, and the exciting coil 56b of the second electromagnet 52b is connected to the power source 57b. These power sources 57 a and 57 b are connected to the control unit 44. The control unit 44 controls the voltage, current, or drive frequency supplied to the excitation coils 56a and 56b, and adjusts the direction and strength of the magnetic force generated from the excitation coils 56a and 56b.

電源５７ａ、５７ｂから励磁コイル５６ａ、５６ｂに通電されると、励磁コイルは磁力を発生する。発生した磁力は、ポールピース５４ａ、５４ｂによって強められる。また、リターンヨーク５８ａ、５８ｂ、５９ａ、５９ｂは、閉磁路を形成し、励磁コイル５６ａ、５６ｂから発生した磁力が外部に漏れないように規制する。   When the excitation coils 56a and 56b are energized from the power sources 57a and 57b, the excitation coils generate magnetic force. The generated magnetic force is strengthened by the pole pieces 54a and 54b. Further, the return yokes 58a, 58b, 59a, 59b form a closed magnetic circuit and restrict the magnetic force generated from the exciting coils 56a, 56b so as not to leak outside.

図４に示すように、消磁機７０は、磁力印加装置５０に対して、プリント回路基板１０の搬送方向、下流側に配置され、プリント回路基板１０の移動路と対向している。消磁機７０は、後述するように、接合材２０が硬化した後、磁化された接合材２０および電子部品１６を消磁処理する。   As shown in FIG. 4, the demagnetizer 70 is disposed on the downstream side in the transport direction of the printed circuit board 10 with respect to the magnetic force application device 50, and faces the moving path of the printed circuit board 10. As described later, the demagnetizer 70 demagnetizes the magnetized bonding material 20 and the electronic component 16 after the bonding material 20 is cured.

次に、上記のように構成された実装装置により電子部品をプリント回路基板１０上に実装する実装方法について説明する。
まず、図２で示したように、プリント回路基板１０の接続パッド１４上にハンダボール１８を介してベアチップ１６を位置決め載置した後、加熱によりハンダボール１８を溶融させることにより、ベアチップ１６をハンダによりＢＧＡ実装する。続いて、プリント回路基板１０とベアチップ１６との間およびベアチップ１６の周囲に、熱硬化性樹脂および磁性体粉末２２を含む接合材２０、例えば５０重量％の磁性体粉末２２を含む液相状態の熱硬化型一液性エポキシ樹脂溶液を充填し、磁性体粉末含有エポキシ樹脂の充填物を形成する。 Next, a mounting method for mounting electronic components on the printed circuit board 10 using the mounting apparatus configured as described above will be described.
First, as shown in FIG. 2, the bare chip 16 is positioned and placed on the connection pad 14 of the printed circuit board 10 via the solder ball 18, and then the solder ball 18 is melted by heating, whereby the bare chip 16 is soldered. To implement BGA. Subsequently, a bonding material 20 including a thermosetting resin and a magnetic powder 22 between the printed circuit board 10 and the bare chip 16 and around the bare chip 16, for example, a liquid phase state including 50 wt% of the magnetic powder 22. A thermosetting one-part epoxy resin solution is filled to form a magnetic powder-containing epoxy resin filling.

図５および図６に示すように、このプリント回路基板１０を搬送機構３０の可動ステージ３２上に載置し、角部を位置決めリブ３３に合わせることにより、所定位置に位置決めする。更に、可動ステージ３２の支持ポスト６２上に支持板６４を載置し、固定ねじ６５によって固定した後、支持板６４上に、遮蔽部材６１を載置する。この際、遮蔽部材６１は、充填された接合材２０の内、ベアチップ１６の周囲に位置する部分と対向するように位置決めする。   As shown in FIGS. 5 and 6, the printed circuit board 10 is placed on the movable stage 32 of the transport mechanism 30, and the corners are aligned with the positioning ribs 33 to be positioned at predetermined positions. Further, after the support plate 64 is placed on the support post 62 of the movable stage 32 and fixed by the fixing screw 65, the shielding member 61 is placed on the support plate 64. At this time, the shielding member 61 is positioned so as to face a portion located around the bare chip 16 in the filled bonding material 20.

次いで、加熱機構４０のヒートパネル４２に通電して加熱を開始し、プリント回路基板１０を通して接合材２０を加熱する。ここでは、制御部４４によりヒートパネル４２の加熱温度をキューリ点よりも低い１２０〜１５０℃に制御する。これにより、接合材２０は、加熱されて徐々に温度上昇し、６０〜８０℃に加熱された時点で軟化し始める。   Next, the heating panel 42 of the heating mechanism 40 is energized to start heating, and the bonding material 20 is heated through the printed circuit board 10. Here, the heating temperature of the heat panel 42 is controlled to 120 to 150 ° C. lower than the Curie point by the control unit 44. Thereby, the bonding material 20 is heated and gradually rises in temperature, and starts to soften when heated to 60 to 80 ° C.

接合材２０が軟化した時点で、搬送機構３０の駆動部を駆動して、可動ステージ３２を磁力印加装置５０の第１電磁石５２ａと第２電磁石５２ｂとの間に移動させ、停止保持する。この際、図８に示すように、ベアチップ１６の中心と第１電磁石５２ａの中心とがほぼ整列するように、可動ステージ３２を位置決めする。これにより、ベアチップ１６および接合材２０は、第１電磁石５２ａと第２電磁石５２ｂとの間に位置し、かつ、第１電磁石５２ａと対向する。また、遮蔽部材６１は、接合材２０と第１電磁石５２ａとの間に保持される。   When the bonding material 20 is softened, the driving unit of the transport mechanism 30 is driven, and the movable stage 32 is moved between the first electromagnet 52a and the second electromagnet 52b of the magnetic force application device 50 and stopped and held. At this time, as shown in FIG. 8, the movable stage 32 is positioned so that the center of the bare chip 16 and the center of the first electromagnet 52a are substantially aligned. Thereby, the bare chip 16 and the bonding material 20 are located between the first electromagnet 52a and the second electromagnet 52b and are opposed to the first electromagnet 52a. The shielding member 61 is held between the bonding material 20 and the first electromagnet 52a.

この状態で、電源５７ａから第１電磁石５２ａの励磁コイル５６ａに通電し、励磁コイル５６ａからプリント回路基板１０へ向かう磁力を発生させ、接合材２０に印加する。接合材２０中の磁性体粉末２２は、この磁力作用により吸引されて接合材内を移動する。この際、制御部４４によって電源５７ａから励磁コイル５６ａに供給する電流、電圧、あるいは駆動周波数を制御することにより、励磁コイル５６ａから発生する磁力の強度を調整し、プリント回路基板１０の実装面と直交する方向の磁性体粉末２２の分散状態を制御する。   In this state, power is supplied from the power source 57 a to the exciting coil 56 a of the first electromagnet 52 a to generate a magnetic force from the exciting coil 56 a toward the printed circuit board 10 and apply it to the bonding material 20. The magnetic powder 22 in the bonding material 20 is attracted by the magnetic force action and moves in the bonding material. At this time, the control unit 44 controls the current, voltage, or drive frequency supplied from the power source 57a to the exciting coil 56a, thereby adjusting the strength of the magnetic force generated from the exciting coil 56a. The dispersion state of the magnetic powder 22 in the orthogonal direction is controlled.

また、磁性合金で形成された枠状の遮蔽部材６１を第１電磁石５２ａと接合材２０との間に配置することにより、励磁コイル５６ａから発生した磁力は、遮蔽部材６１に引っ張られ、大部分が遮蔽部材６１を透過して接合材２０の周縁部、つまり、ベアチップ１６の周囲に位置する領域に印加される。これにより、接合材２０中の磁性体粉末２２は、この磁力作用により吸引されて接合材２０の外周領域、つまり、ベアチップ１６の周囲の領域に移動し集中する。このように、第１電磁石５２ａと接合材２０との間に、磁性合金で形成され磁界を流す遮蔽部材６１を介在させ、この遮蔽部材により磁力を部分的に遮断し、所望の領域に集約することにより、プリント回路基板１０の実装面の方向に沿った磁性体粉末２２の分散状態を制御する。   Further, by arranging the frame-shaped shielding member 61 formed of a magnetic alloy between the first electromagnet 52a and the bonding material 20, the magnetic force generated from the exciting coil 56a is pulled by the shielding member 61, and most of them. Is transmitted through the shielding member 61 and applied to the peripheral portion of the bonding material 20, that is, the region located around the bare chip 16. As a result, the magnetic powder 22 in the bonding material 20 is attracted by this magnetic force action and moves and concentrates in the outer peripheral region of the bonding material 20, that is, the region around the bare chip 16. As described above, the shielding member 61 formed of a magnetic alloy and flowing a magnetic field is interposed between the first electromagnet 52a and the bonding material 20, and the magnetic force is partially blocked by the shielding member and concentrated in a desired region. Thus, the dispersion state of the magnetic powder 22 along the direction of the mounting surface of the printed circuit board 10 is controlled.

上述した磁力を５〜３０分程度、接合材２０に印加することにより、接合材２０中の磁性体粉末２２は、接合材２０の外周領域、つまり、ベアチップ１６の周囲に、かつ、プリント回路基板１０の実装面とベアチップ１６の側面との間に分散して局在する。その後、ヒートパネル４２により、接合材２０を１２０〜１５０℃まで加熱し、３０〜６０程度この温度に保持することにより、接合材２０を硬化させる。これにより、ベアチップ１６は、接合材２０によりプリント回路基板１０に強固に接合される。   By applying the above-described magnetic force to the bonding material 20 for about 5 to 30 minutes, the magnetic powder 22 in the bonding material 20 is placed on the outer peripheral region of the bonding material 20, that is, around the bare chip 16 and on the printed circuit board. 10 are distributed and localized between the mounting surface and the side surface of the bare chip 16. Thereafter, the bonding material 20 is heated to 120 to 150 ° C. by the heat panel 42 and held at this temperature for about 30 to 60, thereby curing the bonding material 20. Thereby, the bare chip 16 is firmly bonded to the printed circuit board 10 by the bonding material 20.

なお、上記実施形態では、接合材２０を軟化温度まで加熱した後に、磁力印加装置５０に搬送し、磁力を印加する構成としたが、初めから、プリント回路基板１０を磁力印加装置５０内に搬送し、磁力印加装置内で、接合材を加熱しながら、磁力印加を同時に開始する構成としてもよい。   In the above-described embodiment, the bonding material 20 is heated to the softening temperature and then transported to the magnetic force application device 50 to apply the magnetic force. However, the printed circuit board 10 is transported into the magnetic force application device 50 from the beginning. And it is good also as a structure which starts a magnetic force application simultaneously, heating a joining material within a magnetic force application apparatus.

磁力を加えた後の接合材２０中の磁性体粉末２２は磁化され、この状態で製品として出荷すると、ベアチップ１６周辺の機器に磁気的な悪影響を及ぼすおそれがある。そのため、磁力印加装置５０により磁力印加した後、可動ステージ３２を消磁機７０の下方に移動し、消磁機７０により接合材２０に消磁処理を施し、磁化された磁性体粉末２２を消磁する。   The magnetic powder 22 in the bonding material 20 after the magnetic force is applied is magnetized, and if shipped as a product in this state, there is a risk of adversely affecting the devices around the bare chip 16. Therefore, after applying a magnetic force by the magnetic force application device 50, the movable stage 32 is moved below the demagnetizer 70, the demagnetizer 70 performs a demagnetization process, and the magnetized magnetic powder 22 is demagnetized.

以上の実装方法および実装装置により、ベアチップ１６が接合材２０によりプリント回路基板１０に強固に接合され、更に、接合材中の磁性体粉末２２が所望の領域、ここでは、ベアチップ１６の周囲の領域に局在した電子部品実装体が得られる。このように、磁性体粉末２２をベアチップ１６の周囲の領域に局在させることにより、接合材２０のベアチップ周囲でのヤング率および硬度を向上することができるとともに、ベアチップとプリント回路基板との熱膨張差を低減することができる。そのため、プリント回路基板１０に外力が作用した場合でも、ベアチップ１６の周囲部分で耐衝撃性を向上でき、接合材２０の亀裂、破損を防止することができる。また、プリント回路基板１０およびベアチップ１６が加熱された場合でも、これらの熱膨張差に起因する接合材２０の剥離、破損を防止することが可能となる。更に、磁性体粉末２２は、外部電磁波に対して、シールドとして作用するため、磁性体粉末２２をベアチップの周囲に集中させることにより、外部電磁波に対してベアチップを保護することができるとともに、あるいは、ベアチップ自体が発生する電磁波が外部に漏洩することを防止できる。   By the mounting method and the mounting apparatus described above, the bare chip 16 is firmly bonded to the printed circuit board 10 by the bonding material 20, and the magnetic powder 22 in the bonding material is a desired region, here, the region around the bare chip 16. An electronic component mounting body localized in the region can be obtained. Thus, by localizing the magnetic substance powder 22 in the region around the bare chip 16, the Young's modulus and hardness of the bonding material 20 around the bare chip can be improved, and the heat between the bare chip and the printed circuit board can be improved. The expansion difference can be reduced. Therefore, even when an external force is applied to the printed circuit board 10, the impact resistance can be improved around the bare chip 16, and the bonding material 20 can be prevented from being cracked or broken. Further, even when the printed circuit board 10 and the bare chip 16 are heated, it is possible to prevent peeling and breakage of the bonding material 20 due to the difference in thermal expansion between them. Further, since the magnetic powder 22 acts as a shield against external electromagnetic waves, by concentrating the magnetic powder 22 around the bare chip, it is possible to protect the bare chip against external electromagnetic waves, or It is possible to prevent electromagnetic waves generated by the bare chip itself from leaking to the outside.

前述したように、本実装方法および実装装置によれば、第１および第２電磁石５２ａ、５２ｂに供給する電流、電圧、駆動周波数を制御することにより、プリント回路基板１０の実装面と垂直な方向の磁性体粉末分布を制御することができるとともに、電磁石と接合材との間に遮蔽部材６１を配置することにより、プリント回路基板１０の面方向に沿った磁性体粉末分布を制御することができる。遮蔽部材６１の形状を種々変更することにより、接合材内の任意の領域へ磁性体粉末を集約することができる。   As described above, according to the mounting method and the mounting apparatus, the direction perpendicular to the mounting surface of the printed circuit board 10 is controlled by controlling the current, voltage, and driving frequency supplied to the first and second electromagnets 52a and 52b. The magnetic powder distribution along the surface direction of the printed circuit board 10 can be controlled by arranging the shielding member 61 between the electromagnet and the bonding material. . By changing the shape of the shielding member 61 in various ways, the magnetic powder can be concentrated in an arbitrary region in the bonding material.

図９および図１０に示す実施形態によれば、遮蔽部材６１は、ほぼＵ字形状に形成され、ベアチップ１６とプリント回路基板１０との間およびベアチップの周囲に充填された接合材２０の内、片側の外周の外側と対向するように配置されている。この状態で、第１電磁石５２ａから磁力を印加すると、ベアチップ１６の左側、すなわち、遮蔽部材６１が対向配置されている側では、磁力が遮蔽部材６１に引っ張られて接合材２０の外側に印加され、ベアチップ１６の右側においてのみ、接合材２０に磁力が印加される。これにより、接合材２０中の磁性体粉末２２は、磁力に吸引されてベアチップ１６の右側に移動し、図９および図１１に示すように、接合材２０においてベアチップ１６の右側の周囲に位置する領域に集中し局在する。   According to the embodiment shown in FIG. 9 and FIG. 10, the shielding member 61 is formed in a substantially U shape, and among the bonding material 20 filled between the bare chip 16 and the printed circuit board 10 and around the bare chip, It arrange | positions so that the outer side of the outer periphery of one side may be opposed. When a magnetic force is applied from the first electromagnet 52a in this state, the magnetic force is pulled by the shielding member 61 and applied to the outside of the bonding material 20 on the left side of the bare chip 16, that is, on the side where the shielding member 61 is opposed. The magnetic force is applied to the bonding material 20 only on the right side of the bare chip 16. As a result, the magnetic powder 22 in the bonding material 20 is attracted by the magnetic force and moves to the right side of the bare chip 16, and is positioned around the right side of the bare chip 16 in the bonding material 20 as shown in FIGS. 9 and 11. It is concentrated and localized in the area.

その後、接合材２０を加熱硬化することにより、ベアチップ１６は、プリント回路基板１０とベアチップ１６との間およびベアチップの周囲に充填された熱硬化性樹脂および磁性体粉末２２を含む接合材２０によって接合され、更に、磁性体粉末２２が、電磁波発生源の側、つまり、ベアチップの右側の領域に局在する接合材が得られる。このような構造の実装体とすることにより、電磁波発生源からの電磁波の干渉を接合材２０の右側面に局在させた磁性体粉末２２によりシールドすることができ、ベアチップ１６を電磁波から保護することができる。同時に、ベアチップとプリント回路基板との接続強度を高め、隔離、損傷を防止することができる。
その他、遮蔽部材は、磁性体粉末を集約する部位に合わせて、任意の形状とすることができる。 Thereafter, the bonding material 20 is cured by heating, whereby the bare chip 16 is bonded by the bonding material 20 including the thermosetting resin and the magnetic powder 22 filled between the printed circuit board 10 and the bare chip 16 and around the bare chip. Furthermore, a bonding material in which the magnetic powder 22 is localized in the region of the electromagnetic wave generation source, that is, the right side of the bare chip is obtained. By using the mounting body having such a structure, the interference of electromagnetic waves from the electromagnetic wave generation source can be shielded by the magnetic powder 22 localized on the right side surface of the bonding material 20, and the bare chip 16 is protected from the electromagnetic waves. be able to. At the same time, the connection strength between the bare chip and the printed circuit board can be increased, and isolation and damage can be prevented.
In addition, a shielding member can be made into arbitrary shapes according to the site | part which gathers magnetic body powder.

図１２に示す実施形態のように、磁力印加装置５０において、遮蔽部材を用いることなく、制御部４４の制御の下、第１電磁石５２ａおよび第２電磁石５２ｂを交互に所定の周期でオン、オフ制御することにより、接合材２０に対して、磁力を上方からおよび下方から交互に印加してもよい。この場合、磁力作用により、接合材２０中の磁性体粉末２２を移動させ、プリント回路基板１０の実装面１０ａに対して垂直な方向に沿って均一に分散させることができる。   As in the embodiment shown in FIG. 12, in the magnetic force application device 50, the first electromagnet 52a and the second electromagnet 52b are alternately turned on and off at predetermined intervals under the control of the control unit 44 without using a shielding member. By controlling, a magnetic force may be alternately applied to the bonding material 20 from above and from below. In this case, the magnetic powder 22 in the bonding material 20 can be moved and dispersed uniformly along the direction perpendicular to the mounting surface 10a of the printed circuit board 10 by the magnetic action.

図１３は、他の実施形態に係る実装装置の搬送機構および支持機構を示している。他の実施形態によれば、遮蔽部材６１を支持する支持機構６０は、可動ステージ３２上に載置されたモータ６６と、モータによって回動される回転子６７と、この回転子から可動ステージ３２と平行に延びる支持アーム６８とを有し、遮蔽部材６１は、支持アーム６８の延出端に固定されている。支持アーム６８は、樹脂、セラミック等の非磁性材料により形成されている。そして、モータ６６によって回転子６７および支持アーム６８を回動することにより、遮蔽部材６１はプリント回路基板１０上のベアチップ１６と対向する所定位置に移動および配置される。   FIG. 13 shows a transport mechanism and a support mechanism of a mounting apparatus according to another embodiment. According to another embodiment, the support mechanism 60 that supports the shielding member 61 includes a motor 66 placed on the movable stage 32, a rotor 67 rotated by the motor, and the movable stage 32 from the rotor. The shielding member 61 is fixed to the extended end of the support arm 68. The support arm 68 is made of a nonmagnetic material such as resin or ceramic. Then, by rotating the rotor 67 and the support arm 68 by the motor 66, the shielding member 61 is moved and arranged at a predetermined position facing the bare chip 16 on the printed circuit board 10.

図１４は、更に他の実施形態に係る実装装置の搬送機構および支持機構を示している。本実施形態によれば、遮蔽部材６１を支持する支持機構６０は、可動ステージ３２上に設けられたＸ−Ｙアーム７２を備えている。Ｘアーム７２ａは、可動ステージ３２に支持され、Ｘ方向、ここでは、可動ステージ３２の移動方向に延びている。Ｙアーム７２ｂは、Ｘアーム７２ａからＹ方向、ここでは、可動ステージ３２の移動方向と直交する方向に、延出しているとともに、Ｘアーム７２ａに沿って移動自在に支持されている。Ｘアーム７２ａおよびＹアーム７２ｂはそれぞれ樹脂、セラミック等の非磁性材料で形成されている。遮蔽部材６１は、Ｙアーム７２ｂに支持され、このＹアームに沿って移動可能に支持されている。   FIG. 14 shows a transport mechanism and a support mechanism of a mounting apparatus according to still another embodiment. According to the present embodiment, the support mechanism 60 that supports the shielding member 61 includes the XY arm 72 provided on the movable stage 32. The X arm 72 a is supported by the movable stage 32 and extends in the X direction, here, the moving direction of the movable stage 32. The Y arm 72b extends from the X arm 72a in the Y direction, here, in a direction orthogonal to the moving direction of the movable stage 32, and is supported so as to be movable along the X arm 72a. The X arm 72a and the Y arm 72b are each formed of a nonmagnetic material such as resin or ceramic. The shielding member 61 is supported by the Y arm 72b, and is supported so as to be movable along the Y arm.

図示しない駆動部により、Ｙアーム７２ｂをＸアーム７２ａに沿って移動させるとともに、遮蔽部材６１をＹアーム７２ｂに沿って移動させることにより、遮蔽部材６１はプリント回路基板１０上のベアチップ１６と対向する所定位置に移動および配置される。   The Y arm 72b is moved along the X arm 72a by a driving unit (not shown), and the shielding member 61 is moved along the Y arm 72b, so that the shielding member 61 faces the bare chip 16 on the printed circuit board 10. It is moved and arranged at a predetermined position.

実装装置の加熱機構は、ヒートパネルに限らず、他の加熱手段を用いても良い。図１５に示す実施形態によれば、実装装置の加熱機構４０は、可動ステージ３２上に設けられた複数の赤外線ランプ７６を備えている。これらの赤外線ランプ７６は、プリント回路基板１０上のベアチップ１６の周囲に充填された接合材２０の両側に配置され、接合材２０に向けて赤外線を放射する。
図１６に示す実施形態によれば、実装装置の加熱機構４０は、可動ステージ３２の下に設けられた電磁誘導加熱用の電磁コイル７８およびコア７９を備えている。 The heating mechanism of the mounting apparatus is not limited to the heat panel, and other heating means may be used. According to the embodiment shown in FIG. 15, the heating mechanism 40 of the mounting apparatus includes a plurality of infrared lamps 76 provided on the movable stage 32. These infrared lamps 76 are arranged on both sides of the bonding material 20 filled around the bare chip 16 on the printed circuit board 10, and emit infrared rays toward the bonding material 20.
According to the embodiment shown in FIG. 16, the heating mechanism 40 of the mounting apparatus includes an electromagnetic coil 78 and a core 79 for electromagnetic induction heating provided under the movable stage 32.

図１７に示す実施形態によれば、実装装置の加熱機構４０は、リフロー炉８０を備えている。リフロー炉８０内には、図示しない複数の電熱線等が配設され、図示しない制御部により、リフロー炉内は所定の温度に加熱されている。   According to the embodiment shown in FIG. 17, the heating mechanism 40 of the mounting apparatus includes the reflow furnace 80. A plurality of heating wires (not shown) are arranged in the reflow furnace 80, and the inside of the reflow furnace is heated to a predetermined temperature by a control unit (not shown).

磁力印加装置５０は、リフロー炉８０内に配置されている。搬送機構３０のガイドレール３６は、リフロー炉８０内を貫通して延びている。そして、ベアチップ１６が実装されたプリント回路基板１０を載置する可動ステージ３２は、ガイドレール３６に沿ってリフロー炉８０内へ移動され、リフロー炉内で加熱されながら、磁力印加装置５０へ搬送される。磁力印加装置により接合材２０へ磁力を印加した後、接合材２０は１２０〜１５０℃で所定時間加熱され、硬化する。その後、可動ステージ３２は、リフロー炉８０から出て、消磁機７０と対向する位置へ搬送され、この消磁機７０により接合材２０に対して消磁処理を行う。   The magnetic force application device 50 is disposed in the reflow furnace 80. The guide rail 36 of the transport mechanism 30 extends through the reflow furnace 80. Then, the movable stage 32 on which the printed circuit board 10 on which the bare chip 16 is mounted is moved into the reflow furnace 80 along the guide rail 36 and is conveyed to the magnetic force application device 50 while being heated in the reflow furnace. The After the magnetic force is applied to the bonding material 20 by the magnetic force application device, the bonding material 20 is heated at 120 to 150 ° C. for a predetermined time and cured. Thereafter, the movable stage 32 exits from the reflow furnace 80 and is transported to a position facing the demagnetizer 70, and the demagnetizer 70 demagnetizes the bonding material 20.

図１８に示す実施形態によれば、磁力印加装置５０は、ベアチップ１６の周囲に充填された接合材の所望領域に対向して配置された１つあるいは複数の永久磁石８２を有している。本実施形態によれば、プリント回路基板１０が載置された可動ステージ３２上に、プリント回路基板１０と隙間をおいて支持板８４が対向配置され、この支持板上に４つの棒磁石８２が載置されている。これらの棒磁石８２は、枠状に並べて配置され、接合材２０の外周部に対向して位置している。これらの棒磁石８２から接合材２０の外周部に磁力が印加され、接合材中の磁性体粉末２２が外周部に移動し、局在される。プリント回路基板１０および棒磁石８２が載置された可動ステージ３２は、加熱機構、例えば、リフロー炉８０内に搬送され、このリフロー炉内で所定の温度に加熱され、接合材２０が軟化した後に硬化される。   According to the embodiment shown in FIG. 18, the magnetic force application device 50 has one or a plurality of permanent magnets 82 arranged to face a desired region of the bonding material filled around the bare chip 16. According to the present embodiment, the support plate 84 is disposed on the movable stage 32 on which the printed circuit board 10 is placed so as to face the printed circuit board 10 with a gap, and the four bar magnets 82 are provided on the support plate. It is placed. These bar magnets 82 are arranged side by side in a frame shape, and are positioned to face the outer peripheral portion of the bonding material 20. Magnetic force is applied from these bar magnets 82 to the outer peripheral portion of the bonding material 20, and the magnetic powder 22 in the bonding material moves to the outer peripheral portion and is localized. The movable stage 32 on which the printed circuit board 10 and the bar magnet 82 are placed is conveyed into a heating mechanism, for example, a reflow furnace 80, heated to a predetermined temperature in the reflow furnace, and the bonding material 20 is softened. Cured.

上述した種々の他の実施形態において、実装装置の他の構成は前述した第１実施形態と同一であり、同一の部分には、同一の参照符号を付してその詳細な説明を省略した。そして、種々の他の実施形態においても、前述した第１の実施形態と同様の作用効果を得ることができる。   In the various other embodiments described above, other configurations of the mounting apparatus are the same as those of the first embodiment described above, and the same portions are denoted by the same reference numerals and detailed description thereof is omitted. In various other embodiments, the same effects as those of the first embodiment described above can be obtained.

本発明は上記実施形態そのままに限定されるものではなく、実施段階ではその要旨を逸脱しない範囲で構成要素を変形して具体化できる。また、上記実施形態に開示されている複数の構成要素の適宜な組み合わせにより、種々の発明を形成できる。例えば、実施形態に示される全構成要素から幾つかの構成要素を削除してもよい。さらに、異なる実施形態にわたる構成要素を適宜組み合わせてもよい。   The present invention is not limited to the above-described embodiments as they are, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

例えば、接合材は、電子部品とプリント回路基板との間、および電子部品の周囲のみに限らず、電子部品の上に被せて充填してもよい。この発明は、ＢＧＡベアチップに限らず、他の電子部品の実装にも適用可能である。   For example, the bonding material is not limited to between the electronic component and the printed circuit board and around the electronic component, and may be filled over the electronic component. The present invention is not limited to the BGA bare chip but can be applied to mounting of other electronic components.

１０…プリント回路基板、１２…配線パターン、１４…接続パッド、１６…ベアチップ、１８…ハンダボール、２０…接合材、２２…磁性体粉末、３０…搬送機構、３２…可動ステージ、３６…ガイドレール、４０…加熱機構、４２…ヒートパネル、４４…制御部、５０…磁力印加装置、５２ａ…第１電磁石、５２ｂ…第２電磁石、５６ａ、５６ｂ…励磁コイル、５７ａ、５７ｂ…電源、６０…支持機構、６１…遮蔽部材、６４…支持板、６８…支持アーム、８０…リフロー炉、８２…永久磁石   DESCRIPTION OF SYMBOLS 10 ... Printed circuit board, 12 ... Wiring pattern, 14 ... Connection pad, 16 ... Bare chip, 18 ... Solder ball, 20 ... Bonding material, 22 ... Magnetic powder, 30 ... Conveyance mechanism, 32 ... Movable stage, 36 ... Guide rail , 40 ... heating mechanism, 42 ... heat panel, 44 ... control unit, 50 ... magnetic force applying device, 52a ... first electromagnet, 52b ... second electromagnet, 56a, 56b ... excitation coil, 57a, 57b ... power supply, 60 ... support Mechanism 61 ... Shielding member 64 ... Support plate 68 ... Support arm 80 ... Reflow furnace 82 ... Permanent magnet

Claims (9)

プリント回路基板に電子部品を実装し、
前記プリント回路基板と前記電子部品との間および前記電子部品の周囲に、熱硬化性樹脂と磁性体粉末とを含む接合材を充填し、
電磁石からの磁力により前記接合材内の前記磁性体粉末が前記電子部品の周辺領域に集まるように該磁性体粉末の分散状態を制御するとともに、
前記接合材を加熱して前記電子部品を前記接合材により前記プリント回路基板に接合する、
電子部品の実装方法。 Mounting electronic components on a printed circuit board,
Around and between the electronic component and the printed circuit board and the electronic component, filled with a bonding material comprising a thermosetting resin and magnetic powder,
While controlling the dispersion state of the magnetic powder so that the magnetic powder in the bonding material gathers in the peripheral region of the electronic component by the magnetic force from the electromagnet,
Heating the bonding material to bond the electronic component to the printed circuit board by the bonding material;
Electronic component mounting method. 前記接合材の前記電子部品の周囲に位置する領域に磁力を集中して印加し、前記接合材内の前記磁性体粉末を前記電子部品の周辺領域に集める請求項１に記載の電子部品の実装方法。The electronic component mounting according to claim 1, wherein a magnetic force is concentrated and applied to a region of the bonding material located around the electronic component, and the magnetic powder in the bonding material is collected in a peripheral region of the electronic component. Method. 前記電磁石と前記接合材との間に、磁性合金で形成され磁界を流す遮蔽部材を介在させ、この遮蔽部材により前記磁力を部分的に遮断することにより、前記プリント回路基板の実装面の方向に沿った前記磁性体粉末の分散状態を制御する請求項１に記載の電子部品の実装方法。   Between the electromagnet and the bonding material, a shielding member that is formed of a magnetic alloy and flows a magnetic field is interposed, and by partially shielding the magnetic force by the shielding member, in the direction of the mounting surface of the printed circuit board. The electronic component mounting method according to claim 1, wherein a dispersion state of the magnetic substance powder along the magnetic material powder is controlled. プリント回路基板に電子部品を実装し、
前記プリント回路基板と前記電子部品との間および前記電子部品の周囲に、熱硬化性樹脂と磁性体粉末とを含む接合材を充填し、
電磁石からの磁力により前記接合材内の前記磁性体粉末が前記プリント回路基板の実装面に対して垂直な方向に沿って均一に分散するように該磁性体粉末の分散状態を制御するとともに、
前記接合材を加熱して前記電子部品を前記接合材により前記プリント回路基板に接合する、
電子部品の実装方法。 Mounting electronic components on a printed circuit board,
Around and between the electronic component and the printed circuit board and the electronic component, filled with a bonding material comprising a thermosetting resin and magnetic powder,
While controlling the dispersion state of the magnetic powder so that the magnetic powder in the bonding material is uniformly dispersed along the direction perpendicular to the mounting surface of the printed circuit board by the magnetic force from the electromagnet,
Heating the bonding material to bond the electronic component to the printed circuit board by the bonding material;
Electronic component mounting method. 前記プリント回路基板の実装面に対して垂直な方向に沿って、上方および下方から交互に磁力を前記接合材に印加し、前記接合材内における前記磁性体粉末を前記プリント回路基板の実装面に対して垂直な方向に沿って均一に分散させる請求項４に記載の電子部品の実装方法。A magnetic force is applied to the bonding material alternately from above and below along a direction perpendicular to the mounting surface of the printed circuit board, and the magnetic powder in the bonding material is applied to the mounting surface of the printed circuit board. The electronic component mounting method according to claim 4, wherein the electronic component is uniformly dispersed along a direction perpendicular to the vertical direction. 前記電磁石に供給する電流、電圧、あるいは、駆動周波数を調整して前記磁力を変化させ、前記プリント回路基板の実装面と直交する方向の前記磁性体粉末の分散状態を制御する請求項４に記載の電子部品の実装方法。 Current supplied to the electromagnet, a voltage or, by adjusting the driving frequency is changed the magnetic force, according to claim 4 for controlling the dispersion state of the magnetic powder in the direction perpendicular to the mounting surface of the printed circuit board Electronic component mounting method. 前記プリント回路基板を通して前記接合材をヒートパネル、赤外線ランプ、あるいは電磁誘導加熱により加熱する請求項１ないし６のいずれか１項に記載の電子部品の実装方法。 It said printed circuit heat panel the bonding material through the substrate, an infrared lamp or electronic part mounting method according to any one of claims 1 to 6 is heated by electromagnetic induction heating. 前記電子部品が実装され、前記接合材が充填されたプリント回路基板をリフロー炉を通して搬送し、前記リフロー炉により前記接合材を加熱する請求項１ないし６のいずれか１項に記載の電子部品の実装方法。 The electronic component according to any one of claims 1 to 6, wherein the electronic component is mounted, the printed circuit board filled with the bonding material is conveyed through a reflow furnace, and the bonding material is heated by the reflow furnace. Implementation method. 前記接合材が硬化した後、前記電子部品およびプリント回路基板を消磁する請求項１ないし６のいずれか１項に記載の電子部品の実装方法。 After the bonding material has cured, the mounting method of electronic components according to any one of claims 1 to 6, demagnetizing the electronic component and the printed circuit board.
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