JP4525568B2 - Connected device - Google Patents

Description

  The present invention relates to a connection device on which electronic components are mounted and connected to an external connector, and relates to a technique suitable for use in, for example, a lead frame.

The number of outer leads used increases or decreases with changes in electronic components to be mounted and changes in circuit configuration.
If the lead frame is manufactured according to the increasing or decreasing outer leads, the manufacturing cost of the lead frame is increased.
As a technique for solving this problem, Patent Document 1 and Patent Document 2 are known.

The technique of patent document 1 cuts the outer lead which is not used.
With this technique, the number of outer leads can be increased or decreased using the same lead frame.
However, just by cutting the outer leads that are not used, the outer leads are not adjacent to each other and are partially separated. For this reason, even when the number of outer leads is small, it is necessary to use an external connector when there are many outer leads.
Further, in the technique of Patent Document 1, when an outer lead to be used is to be adjacent, it is necessary to change the connection between the electronic component and the inner lead.
Furthermore, in the technique of Patent Document 1, two inner leads cannot be shared by one outer lead.

The technique of Patent Document 2 is provided with a large number of inner leads, and changes the cutting position of a tie bar (an example of a bridge) that connects the inner leads.
In this technique, the circuit pattern by the inner lead can be changed using the same lead frame.
However, when the circuit pattern by the inner lead is changed, it is necessary to change the connection between the electronic component and the inner lead.
Further, the technique of Patent Document 2 does not have the idea of increasing or decreasing the number of outer leads.
JP 2003-218309 A JP 2003-282810 A

The present invention has been made in view of the above problems, and its purpose is that a plurality of outer leads are arranged side by side, and the outer leads that are not used are not mounted, and only the outer leads that are used are all used. It is to provide connection devices that are adjacent to each other.

[Means of claim 1]
The connection device adopting the means of claim 1 changes the cutting position of the bridge as the number of outer leads used increases and decreases the outer leads which are not used by continuously changing all the outer leads used. The lead is cut.
As a result, there is no outer lead that is not used , and all the outer leads that are used are continuously adjacent. As a result, the external connector can be miniaturized according to the number of leads, and the external connector can always be minimized.
In addition, a plurality of inner leads can be shared by a single outer lead.

[Means of claim 2]
The connection device adopting the means of claim 2 is a lead frame in which a plurality of bridges, a plurality of inner leads and a plurality of outer leads are cut and formed from one metal plate.

[Means of claim 3]
A connection device adopting the means of claim 3 mounts two electronic components having the same function. By changing the cutting position of the bridge, the bridge can be changed to a first circuit when two electronic components are used simultaneously and a second circuit when two electronic components are used independently.
In this way, by changing the cutting position of the bridge, the circuit of the connection device is changed to the first circuit or the second circuit, so that it is not necessary to change the connection between the electronic component and the inner lead. For this reason, the cost increase accompanying the change of the connection process of an electronic component and an inner lead can be avoided.

[Means of claim 4]
The connection device adopting the means of claim 4 changes the cutting position of the bridge to the first circuit or the second circuit by changing the setting direction of the connection device with respect to the jig for cutting the bridge. It is what is done.
As a result, a device (such as a tie bar cutting machine) for cutting the bridge can be shared, and the cost of the connecting device can be reduced.

The best mode 1 is independently connected to each terminal of an electronic component (IC, active component such as a transistor), and has a plurality of inner leads electrically connected by a plurality of bridges (tie bars, etc.) And a plurality of outer leads connected to each of the inner leads and electrically connected to the external connector terminals.
As the number of outer leads used increases and decreases, the cutting position of the bridge is changed so that the used outer leads are adjacent to each other, and the unused outer leads are cut.

  A first embodiment in which the present invention is applied to a lead frame on which two Hall ICs are mounted will be described with reference to FIGS. In the first embodiment, the “background of the first embodiment” will be described first, and then the “features of the first embodiment” will be described.

(Background of Example 1)
There is known a rotation angle sensor on which two Hall ICs (first and second Hall ICs 1 and 2) are mounted.
The first and second Hall ICs 1 and 2 are mounted on a lead frame, then molded into resin, and mounted on a rotation angle sensor.
The lead frame includes a plurality of inner leads 3 and a plurality of outer leads 4 continuous to the inner leads 3. And after mounting in a rotation angle sensor, each outer lead 4 is connected and used for an external connector terminal.

The first and second Hall ICs 1 and 2 are examples of two electronic components that perform the same function. According to the specifications of the rotation angle sensor, the first and second Hall ICs 1 and 2 can be used simultaneously. 1 and 2nd Hall IC1 and 2 may be used independently.
Here, each of the first and second Hall ICs 1 and 2 includes three IC terminals including one power supply terminal ◯, one ground terminal □, and one output terminal ◎.

For this reason, when the first and second Hall ICs 1 and 2 are used simultaneously, four outer leads 4 are required for the lead frame.
That is, one common power supply outer lead Vc for supplying power to the power terminals ○ of the first and second Hall ICs 1 and 2 in common,
One common ground outer lead GND for grounding in common from the ground terminals □ of the first and second Hall ICs 1 and 2,
One first output outer lead Vout1 for taking out the output from the output terminal ◎ of the first Hall IC1,
One second output outer lead Vout2 for taking out the output from the output terminal ◎ of the second Hall IC2,
A total of four outer leads 4 are required.

Further, when the first and second Hall ICs 1 and 2 are used independently, six outer leads 4 are required for the lead frame.
That is, one first power supply outer lead Vc1 for supplying power to the power supply terminal ◯ of the first Hall IC 1 is provided.
One first grounding outer lead GND1 for grounding from the ground terminal □ of the first Hall IC1;
One first output outer lead Vout1 for taking out the output from the output terminal ◎ of the first Hall IC1,
One second power supply outer lead Vc2 for supplying power to the power supply terminal ○ of the second Hall IC 2;
One second grounding outer lead GND2 for grounding from the grounding terminal □ of the second Hall IC2,
One second output outer lead Vout2 for taking out the output from the output terminal ◎ of the second Hall IC2,
A total of six outer leads 4 are required.

Therefore, (1) when the first and second Hall ICs 1 and 2 are used at the same time, a 4P type lead frame having four outer leads 4 is required, and (2) the first and second Hall ICs 1, When 2 is used independently, a 6P type lead frame having six outer leads 4 is required.
In the conventional technology, a 4P type lead frame and a 6P type lead frame are independently manufactured. Therefore, every time the specification of the rotation angle sensor is changed, it is necessary to manufacture a mold for processing a 4P type lead frame and a mold for processing a 6P type lead frame. Will be expensive.

  Even when the first and second Hall ICs 1 and 2 are used at the same time, it is possible to use the 6P type lead frame by allocating the outer leads 4 to all the IC terminals. However, even if a 4P type external connector is originally required, it is necessary to use a 6P type external connector, which is disadvantageous in terms of cost and installation space of the connector. In particular, when the 4P type is desired due to installation space restrictions, it cannot be handled.

(Characteristics of Example 1)
Therefore, in the first embodiment, the following technique is adopted in order to make the 4P type lead frame and the 6P type lead frame common.
As shown in FIG. 1A, the lead frame of Example 1 includes a plurality of inner leads 3 (in the drawing, electrically connected to the respective IC terminals of the first and second Hall ICs 1 and 2). A portion indicated by a solid line), a plurality of outer leads 4 connected to each inner lead 3 and electrically connected to each external connector terminal (a portion indicated by a one-dot chain line in the figure), and a plurality of inner leads. And a plurality of tie bars (an example of a bridge: a portion indicated by a broken line in the figure) 5 that electrically connects 3.
Note that the plurality of inner leads 3, the plurality of outer leads 4, and the plurality of tie bars 5 are each continuous, and are formed by cutting a single metal plate by pressing or the like.

The plurality of outer leads 4 are arranged side by side, and as the number of outer leads 4 used increases or decreases, the cutting position of the tie bar 5 is changed so that all the outer leads 4 used are continuously provided. The outer leads 4 are provided so as to be adjacent to each other and to be cut.
Specifically, in the case of a 4P type lead frame, after the first and second Hall ICs 1 and 2 are mounted and molded with resin, the portion indicated by X4 in FIG. 1A (tie bar 5 and outer lead) Cut 4). Thereby, the first circuit shown in FIG. 1B is formed by the inner lead 3 and the uncut tie bar 5, and a 4P type lead frame in which all the four outer leads 4 used are continuously adjacent is manufactured. Is done.
In the case of a 6P type lead frame, after the first and second Hall ICs 1 and 2 are mounted and molded with resin, the portion (tie bar 5) indicated by X6 in FIG.
Thereby, the second circuit shown in FIG. 1C is formed by the inner lead 3 and the uncut tie bar 5, and a 6P type lead frame in which all the six outer leads 4 used are continuously adjacent is manufactured. Is done.
In addition, the part shown to X0 of Fig.1 (a) is the tie bar 5 always cut irrespective of 4P type and 6P type.

Specific structural examples of the lead frame are shown in FIGS.
FIG. 2A shows a lead frame before the tie bar 5 is cut.
Then, by cutting the portion indicated by X4 in FIG. 2B, 4 as shown in FIG.
A 4P type lead frame in which all the two outer leads 4 are adjacent to each other is manufactured.
Further, by cutting the portion indicated by X6 in FIG. 2B, a 6P type lead frame in which all the six outer leads 4 are continuously adjacent as shown in FIG. 3B is manufactured.

In the first embodiment, the cutting position of the tie bar 5 is changed by changing the lead frame setting direction with respect to the jig 6 (see FIG. 4) of the tie bar cutting machine for cutting the tie bar 5. The first circuit or the second circuit is changed.
Specifically, a plurality of positioning holes 7 are formed in the lead frame of the first embodiment so that the lead frame can be inverted 180 degrees about the Y axis in FIG.
On the other hand, the tie bar cutting machine is provided on the jig 6 so as to always cut the portions indicated by X4 and X6 in FIG. In addition, the code | symbol 8 shown to Fig.4 (a) is a positioning pin fitted in the positioning hole 7 of a lead frame.

Then, the lead frame is set on the jig 6 in the direction shown in FIG. 2, that is, in the direction indicated by the broken line in FIG. 4B, and the tie bar cutting machine is operated, so that the portion indicated by X4 is cut. A 4P type lead frame in which the four outer leads 4 shown in FIG.
Also, by setting the lead frame on the jig 6 in the direction reversed 180 degrees around the Y axis in FIG. 2B, that is, in the direction shown by the solid line in FIG. 4B, the tie bar cutting machine is operated. , X6 is cut, and a 6P type lead frame in which the six outer leads 4 shown in FIG. 3B are adjacent to each other is manufactured.

(Effect of Example 1)
The lead frame of Example 1 cuts a portion indicated by X4 when a 4P type lead frame is manufactured, and cuts a portion indicated by X6 when a 6P type lead frame is manufactured.
As a result, the 4P type lead frame and the 6P type lead frame can be shared, and the manufacturing cost of the lead frame used in the rotation angle sensor can be suppressed.

The lead frame of Example 1 does not have an outer lead 4 that is not used. That is, in the case of a 4P type lead frame, only four outer leads 4 used are adjacent to each other, and in the case of a 6P type lead frame, six outer leads 4 used are adjacent to each other.
In the case of a 4P type lead frame, the external connector can also be a 4P type, and in the case of a 6P type lead frame, the external connector is a 6P type. Thus, according to the number of outer leads 4 used, the number of external connectors can be minimized, and vehicle mountability can be improved.

In the 4P type lead frame of Example 1, the two inner leads 3 connected to the power terminal ○ of the first Hall IC 1 and the power terminal ○ of the second Hall IC 2 are shared by one power outer lead Vc. Is done.
Similarly, the two inner leads 3 connected to the ground terminal □ of the first Hall IC 1 and the ground terminal □ of the second Hall IC 2 are shared by one ground outer lead GND. Thus, in this embodiment, a plurality of inner leads 3 can be shared by one outer lead 4.

In the lead frame of the first embodiment, the circuit is changed to the first circuit or the second circuit by changing the cutting position of the tie bar 5. There is no need to change the connection. For this reason, the cost increase accompanying the change of the connection process of 1st, 2nd Hall IC1, 2 and the inner lead 3 can be avoided.
In the lead frame of the first embodiment, by changing the setting direction of the lead frame with respect to the jig 6 of the tie bar cutting machine, the cut portion is changed to X4 or X6, so that the first circuit or the second circuit is changed. Be changed.
As a result, a tie bar cutting machine can be used in common, and lead frame manufacturing costs can be reduced.

[Modification]
The 4P type and 6P type pin arrangements shown in the above embodiment and the circuit patterns of the first and second circuits are examples for explaining the embodiment. For example, FIG. 5A and FIG. As shown, other circuit patterns may be employed.
Specifically, as shown in FIGS. 6A and 6B, if the closed circuit in which the IC terminal is confined inside the lead frame is not configured, the number of used outer leads 4 is increased or decreased. Accordingly, the outer leads 4 to be used can be adjacent to each other.

  In the above embodiment, the 4P-type pin arrangement and the 6P-type pin arrangement have a 1: 1 relationship, but by increasing the number of tie bars 5, the 4P-type pin arrangement is changed to the 6P-type pin arrangement. Can be changed to multiple. As a specific example, as shown in FIGS. 7A and 7B, two 4P type pin arrangements may be provided for one 6P pattern.

In the above embodiment, an example is shown in which two Hall ICs having the same function are used, but other electronic components (IC, active components such as transistors) different from the Hall IC may be used. Further, the electronic components do not have to perform the same function. Furthermore, the number of electronic components to be mounted is not limited.
In the above embodiment, the example in which the present invention is applied to a lead frame formed by pressing a metal plate has been shown.

It is a schematic diagram of a lead frame. It is a top view of a lead frame. It is a top view of 4P type and 6P type lead frames. It is explanatory drawing of the tie bar cut part in a jig | tool, and explanatory drawing of the set direction of the lead frame with respect to a jig | tool. It is a schematic diagram of a lead frame. It is a schematic diagram in which the IC terminal is confined inside the lead frame. It is a schematic diagram of a lead frame.

Explanation of symbols

1 1st Hall IC (electronic parts)
2 Second Hall IC (electronic component)
3 Inner lead 4 Outer lead 5 Tie bar (bridge)
6 Jig

Claims (4)

A plurality of inner leads that are independently connected to each terminal of the electronic component, and are electrically conducted by a plurality of bridges;
Each inner lead is connected to each of the external connector terminals and includes a plurality of outer leads each electrically connected,
The plurality of outer leads are arranged side by side,
As the number of outer leads used increases and decreases, the cutting position of the bridge is changed, and all the outer leads used are continuously adjacent ,
A connecting device characterized in that an outer lead that is not used is cut. The connection device according to claim 1,
The connecting device, wherein the plurality of bridges, the plurality of inner leads, and the plurality of outer leads are lead frames cut and formed from a single metal plate. The connection device according to claim 1 or 2,
This connecting device is equipped with two electronic components that perform the same function,
By changing the cutting position of the bridge,
A first circuit when using the two electronic components simultaneously;
A connection device characterized in that it can be changed to a second circuit when the two electronic components are used independently. The connection device according to claim 3,
By changing the setting direction of the connecting device with respect to the jig for cutting the bridge, the cutting position of the bridge is changed to be changed to the first circuit or the second circuit. Connected device.

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