JP4511844B2 - 圧力センサ及び圧力センサの製造方法 - Google Patents
圧力センサ及び圧力センサの製造方法 Download PDFInfo
- Publication number
- JP4511844B2 JP4511844B2 JP2004028853A JP2004028853A JP4511844B2 JP 4511844 B2 JP4511844 B2 JP 4511844B2 JP 2004028853 A JP2004028853 A JP 2004028853A JP 2004028853 A JP2004028853 A JP 2004028853A JP 4511844 B2 JP4511844 B2 JP 4511844B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- sensor
- pressure
- strain
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/145—Housings with stress relieving means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Child & Adolescent Psychology (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Description
(1)圧力が印加される穴を有し、電気的且つ機械的な絶縁が施され厚さtglassを有しガラスで形成される板状の台座と、ダイアフラムと厚さtSiを有する前記ダイアフラムの周辺部とを有する板状のセンサであって、前記ダイアフラムの下面が前記穴に接続され、前記ダイアフラムの上面に前記圧力及び静圧によって前記ダイアフラムに発生する歪みを電気信号に変換する歪みゲージを設け、前記ダイアフラムの周辺部の下面が前記台座に接合し、シリコンで形成されるセンサとを備え、前記歪みゲージが圧力差に基づく電気信号と静圧に基づく電気信号とを生成する圧力センサにおいて、前記台座の弾性率Eglassと前記台座の厚さtglassとの積(Eglass・tglass)と、前記センサの弾性率ESiと前記ダイアフラムの周辺部の厚さtSiとの積(ESi・tSi)とが等しくなる(Eglass・tglass=ESi・tSi)ことを特徴とする圧力センサ。
(2)前記台座と前記センサとの間に形成する溝を備えることを特徴とする(1)記載の圧力センサ。
(3)前記穴を有し、前記台座に接合する金属台座と、前記台座と前記金属台座との間に形成する溝とを備えることを特徴とする(2)記載の圧力センサ。
本発明によれば、静圧特性が良好の圧力センサを提供できる。また、安価の圧力センサを提供できる。さらに、簡便な圧力センサを提供できる。
Eglass・tglass≒ESi・tSi (1)
第1に、図1の実施例とは別に、図1の実施例からガラス4を削除した構成を形成するステップを実行する。
2 ダイアフラム
3 歪みゲージ
4 ガラス(台座)
5 金属
6 穴
7,8 溝
tSi シリコンセンサの厚さ(センサの厚さ)
tglass ガラスの厚さ(台座の厚さ)
ESi シリコンセンサの弾性率(センサの弾性率)
Eglass ガラスの弾性率(台座の弾性率)
Claims (3)
- 圧力が印加される穴を有し、電気的且つ機械的な絶縁が施され厚さtglassを有しガラスで形成される板状の台座と、
ダイアフラムと厚さtSiを有する前記ダイアフラムの周辺部とを有する板状のセンサであって、前記ダイアフラムの下面が前記穴に接続され、前記ダイアフラムの上面に前記圧力及び静圧によって前記ダイアフラムに発生する歪みを電気信号に変換する歪みゲージを設け、前記ダイアフラムの周辺部の下面が前記台座に接合し、シリコンで形成されるセンサとを備え、
前記歪みゲージが圧力差に基づく電気信号と静圧に基づく電気信号とを生成する圧力センサにおいて、
前記台座の弾性率Eglassと前記台座の厚さtglassとの積(Eglass・tglass)と、前記センサの弾性率ESiと前記ダイアフラムの周辺部の厚さtSiとの積(ESi・tSi)とが等しくなる(Eglass・tglass=ESi・tSi)
ことを特徴とする圧力センサ。 - 前記台座と前記センサとの間に形成する溝を備える
ことを特徴とする請求項1記載の圧力センサ。 - 前記穴を有し、前記台座に接合する金属台座と、
前記台座と前記金属台座との間に形成する溝とを備える
ことを特徴とする請求項2記載の圧力センサ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004028853A JP4511844B2 (ja) | 2004-02-05 | 2004-02-05 | 圧力センサ及び圧力センサの製造方法 |
US10/988,506 US7131337B2 (en) | 2004-02-05 | 2004-11-16 | Pressure sensor and method for manufacturing pressure sensor |
CNB2004100965398A CN100462702C (zh) | 2004-02-05 | 2004-11-30 | 压力感应器及压力感应器的制造方法 |
DE102005004793A DE102005004793B4 (de) | 2004-02-05 | 2005-02-02 | Drucksensor und Verfahren zum Herstellen eines Drucksensors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004028853A JP4511844B2 (ja) | 2004-02-05 | 2004-02-05 | 圧力センサ及び圧力センサの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005221351A JP2005221351A (ja) | 2005-08-18 |
JP4511844B2 true JP4511844B2 (ja) | 2010-07-28 |
Family
ID=34805930
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004028853A Expired - Fee Related JP4511844B2 (ja) | 2004-02-05 | 2004-02-05 | 圧力センサ及び圧力センサの製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7131337B2 (ja) |
JP (1) | JP4511844B2 (ja) |
CN (1) | CN100462702C (ja) |
DE (1) | DE102005004793B4 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2993455A1 (en) | 2014-09-04 | 2016-03-09 | Yokogawa Electric Corporation | Sensor, strain sensor, and pressure sensor |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7691723B2 (en) * | 2005-01-07 | 2010-04-06 | Honeywell International Inc. | Bonding system having stress control |
CN101960276B (zh) * | 2007-10-30 | 2013-07-03 | 阿自倍尔株式会社 | 压力传感器及其制造方法 |
DE102007053859A1 (de) | 2007-11-09 | 2009-05-14 | Endress + Hauser Gmbh + Co. Kg | Druck-Messeinrichtung |
JP5286153B2 (ja) * | 2009-04-28 | 2013-09-11 | アズビル株式会社 | 圧力センサの製造方法 |
JP2011013178A (ja) * | 2009-07-06 | 2011-01-20 | Yamatake Corp | 圧力センサ及び製造方法 |
JP2011220927A (ja) * | 2010-04-13 | 2011-11-04 | Yamatake Corp | 圧力センサ |
JP5658477B2 (ja) | 2010-04-13 | 2015-01-28 | アズビル株式会社 | 圧力センサ |
JP2013044675A (ja) * | 2011-08-25 | 2013-03-04 | Yokogawa Electric Corp | 振動式差圧センサとその製造方法 |
US8833172B2 (en) | 2012-06-27 | 2014-09-16 | Continental Automotive Systems, Inc | Pressure sensing device with stepped cavity to minimize thermal noise |
JP6154488B2 (ja) * | 2013-12-25 | 2017-06-28 | 日立オートモティブシステムズ株式会社 | 圧力測定装置 |
AU2015229218B2 (en) | 2014-03-14 | 2017-12-07 | Rosemount Inc. | Corrosion rate measurement |
US10830689B2 (en) | 2014-09-30 | 2020-11-10 | Rosemount Inc. | Corrosion rate measurement using sacrificial probe |
US10190968B2 (en) | 2015-06-26 | 2019-01-29 | Rosemount Inc. | Corrosion rate measurement with multivariable sensor |
JP6293236B1 (ja) * | 2016-11-01 | 2018-03-14 | 三菱電機株式会社 | 半導体差圧センサおよびその製造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH595200A5 (ja) * | 1975-05-16 | 1978-02-15 | Kistler Instrumente Ag | |
JPS5723830A (en) * | 1980-07-18 | 1982-02-08 | Hitachi Ltd | Post material for pressure transducer of semiconductor and its preparation |
CA1186163A (en) * | 1982-01-04 | 1985-04-30 | James B. Starr | Semiconductor pressure transducer |
DE3436440A1 (de) * | 1984-10-04 | 1986-04-10 | Siemens AG, 1000 Berlin und 8000 München | Halbleiter-messeinrichtung |
CN88211370U (zh) * | 1988-01-22 | 1988-12-28 | 复旦大学 | 哑铃形梁膜结构的压阻型压力传感器 |
JP2656566B2 (ja) * | 1988-08-31 | 1997-09-24 | 株式会社日立製作所 | 半導体圧力変換装置 |
JP2595829B2 (ja) * | 1991-04-22 | 1997-04-02 | 株式会社日立製作所 | 差圧センサ、及び複合機能形差圧センサ |
US5186055A (en) * | 1991-06-03 | 1993-02-16 | Eaton Corporation | Hermetic mounting system for a pressure transducer |
JP2797766B2 (ja) | 1991-08-23 | 1998-09-17 | 松下電器産業株式会社 | フープ材送り装置 |
US5291788A (en) * | 1991-09-24 | 1994-03-08 | Kabushiki Kaisha Toshiba | Semiconductor pressure sensor |
JPH0550335U (ja) * | 1991-12-10 | 1993-07-02 | 横河電機株式会社 | 半導体圧力計 |
US5639972A (en) * | 1995-03-31 | 1997-06-17 | Caldon, Inc. | Apparatus for determining fluid flow |
JP2000121469A (ja) * | 1998-10-16 | 2000-04-28 | Mitsubishi Electric Corp | 圧力センサ |
WO2002004907A1 (en) * | 2000-07-06 | 2002-01-17 | California Institute Of Technology | Surface-micromachined pressure sensor and high pressure application |
JP3915715B2 (ja) * | 2003-03-07 | 2007-05-16 | 株式会社デンソー | 半導体圧力センサ |
-
2004
- 2004-02-05 JP JP2004028853A patent/JP4511844B2/ja not_active Expired - Fee Related
- 2004-11-16 US US10/988,506 patent/US7131337B2/en not_active Expired - Lifetime
- 2004-11-30 CN CNB2004100965398A patent/CN100462702C/zh active Active
-
2005
- 2005-02-02 DE DE102005004793A patent/DE102005004793B4/de not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2993455A1 (en) | 2014-09-04 | 2016-03-09 | Yokogawa Electric Corporation | Sensor, strain sensor, and pressure sensor |
US9891119B2 (en) | 2014-09-04 | 2018-02-13 | Yokogawa Electric Corporation | Sensor, strain sensor, and pressure sensor |
Also Published As
Publication number | Publication date |
---|---|
CN1651886A (zh) | 2005-08-10 |
JP2005221351A (ja) | 2005-08-18 |
DE102005004793B4 (de) | 2011-02-10 |
DE102005004793A1 (de) | 2005-08-25 |
US20050172723A1 (en) | 2005-08-11 |
US7131337B2 (en) | 2006-11-07 |
CN100462702C (zh) | 2009-02-18 |
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