JP4553630B2 - Film forming apparatus and film forming method - Google Patents

Description

  The present invention relates to a film forming method and a film forming apparatus for depositing a raw material composition material on a substrate by spraying the raw material powder onto the substrate.

  In recent years, in the field of micro electrical mechanical systems (MEMS), it has been considered that sensors and actuators using piezoelectric ceramics are further integrated and fabricated by film formation for practical use. Has been. As one of them, an aerosol deposition method, which is known as a film forming technique for ceramics and metals, has attracted attention. Aerosol deposition (hereinafter also referred to as AD method) is a method of forming an aerosol containing raw material powder (film-forming powder), spraying it from a nozzle and spraying it onto a substrate. Is the method. Here, the aerosol refers to solid or liquid fine particles suspended in a gas. The AD method is also called a jet deposition method or a gas deposition method.

  In the AD method, the raw material powder sprayed at a high speed collides with and crushes the lower layer such as the substrate or the previously formed deposit, and the crushed surface generated at that time adheres to the lower layer. Such a film formation mechanism is called a mechanochemical reaction, and this reaction makes it possible to form a dense and strong film that does not contain impurities. Therefore, new material development utilizing such a special film formation mechanism and application to various applications are expected.

  Incidentally, in order to form a desired film formation pattern on the substrate using the AD method, for example, it is conceivable to use a polymer resist or a hollow mask. That is, a resist or the like is placed on the pattern fabrication surface to form a film, and then post-processing including removal of the resist or the like is performed. However, such a method is cumbersome because the number of processes increases, and a mask cannot be formed by photolithography on a non-planar surface or a three-dimensional surface.

  Further, in order to perform film formation by the AD method without using a mask, it has been proposed to shield film forming powder using a mechanical mechanism. That is, a mechanical chopper is provided in the vicinity of a nozzle for injecting aerosol, and the sprayed film forming powder is shut in a portion where film forming is not required. For example, Patent Document 1 discloses an aerosol in a composite structure forming method in which an aerosol containing fine particles is jetted from a nozzle toward a base material to collide to form a structure made of a constituent material of fine particles on the surface of the base material. And a moving means for moving the blocking means, and when the nozzle or the substrate moves so that the sprayed aerosol collides with a position where the structure on the substrate is not formed, A composite structure forming method in which the blocking means is controlled to be moved to a position where the aerosol is blocked is disclosed. However, in order to mechanically control the film-forming powder sprayed at high speed, it is necessary to use a shutter with a robust mechanism that is difficult to break down in a dust environment and can withstand the collision of film-forming powder. Since it is difficult to control the shutter having such a mechanism at high speed, there is a possibility that a fine film pattern cannot be formed.

Alternatively, it is also conceivable to control the supply of the aerosol to the injection nozzle so that the film forming powder is not injected from the nozzle in a portion where film formation is unnecessary. However, as disclosed in Patent Document 2, immediately after restarting the aerosol injection, the concentration and flow rate of the aerosol are unstable. If the film-forming powder is sprayed on the substrate in such a state, it is not uniform. Deposits and fragile structures are formed. In addition, it takes time before the aerosol airflow conditions are met.
Japanese Unexamined Patent Publication No. 2003-117450 (second page, FIG. 1) JP 2003-119575 A (page 3)

In the conventional AD method, only one kind of raw material can be used at the same time. Therefore, in order to form a pattern including a plurality of types of films having different compositions, a series of film forming steps must be repeated a plurality of times while changing the type of raw material. However, as described above, if the aerosol injection from the nozzle is stopped when the raw material is changed, it takes time until the film can be formed again when it is restarted. ineffective. Therefore, it is difficult to give variations in composition to the formed film.
Therefore, in view of the above points, an object of the present invention is to provide a film forming apparatus and a film forming method capable of efficiently forming a film pattern including a plurality of types of compositions by the AD method.

In order to solve the above problems, a film forming apparatus according to one aspect of the present invention is a film forming apparatus that deposits a raw material composition material on a substrate by spraying the raw material powder onto the substrate. The film forming chamber, the movable stage disposed in the film forming chamber and holding the substrate on which the structure is formed, the exhaust means for discharging the gas in the film forming chamber to the outside, and the first container A first aerosol generating means for generating an aerosol containing a powder of the first raw material; a second aerosol generating means for generating an aerosol containing a powder of the second raw material housed in a second container; A first spray nozzle that is disposed in the film forming chamber and sprays the aerosol generated by the first aerosol generating unit toward the substrate, and an aerosol that is disposed in the film forming chamber and generated by the second aerosol generating unit. Second jetting toward the substrate An injection nozzle, a first side nozzle that injects or sucks gas into the aerosol injected from the first injection nozzle, and a gas is supplied to the first side nozzle, or a gas is supplied from the first side nozzle. A first pump for sucking gas, a second side nozzle for jetting or sucking gas to the aerosol jetted from the second jet nozzle, and supplying the gas to the second side nozzle, or second Injecting the aerosol generated by the first aerosol generating means toward the substrate from the first injection nozzle according to the pattern of the film to be formed and the second pump for sucking the gas from the side nozzles , By injecting or sucking gas to the aerosol generated by the second aerosol generation means and injected from the second injection nozzle, the aerosol is disturbed, The raw material is deposited on the substrate, and the aerosol generated by the second aerosol generating unit is sprayed from the second spray nozzle toward the substrate, and the first aerosol generating unit generates the first spray. Injecting or sucking gas from the nozzles to disturb the aerosol to inject the gas into the first and second side nozzles so that the second raw material is deposited on the substrate . on / off, and / or, and a control means for controlling the flow rate of the gas to be injected or aspirated.

A film forming method according to one aspect of the present invention is a film forming method in which a raw material composition material is deposited on a substrate by spraying the raw material powder onto the substrate. Step (a) for generating an aerosol containing a first raw material powder stored in a container, and an aerosol containing a second raw material powder stored in a second container and having a composition different from that of the first raw material (B), and the aerosol generated in the step (a) is injected from the injection nozzle toward the substrate, and the gas generated in the step (b) and injected from the injection nozzle is gas. The step (c) of depositing the first raw material on the substrate by spraying or sucking to disturb the aerosol, the aerosol generated in the step (b) being sprayed from the spray nozzle toward the substrate, and the step ( a) Odor Is generated, the gas jet or suction to by disturbance aerosol against injected aerosol from the injection nozzle, the second feedstock comprising a depositing on the substrate (d).

According to the present invention, the film forming conditions are broken by jetting or sucking the gas to the first aerosol beam and / or the second aerosol beam, so that the on / off of the film forming and the intermediate state thereof can be performed at high speed. Can be switched. Therefore, a pattern including a plurality of types of films having different compositions can be efficiently formed .

Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings. The same constituent elements are denoted by the same reference numerals, and the description thereof is omitted.
FIG. 1 is a schematic view showing a film forming apparatus according to an embodiment of the present invention. This film forming apparatus is a film forming apparatus using an aerosol deposition (AD) method in which a raw material is deposited by spraying an aerosol containing a raw material powder on a substrate.

The film formation apparatus shown in FIG. 1 includes a first aerosol generation chamber 1a and a second aerosol generation chamber 1b, a film formation chamber (film formation chamber) 3, a first compressor (compression pump) 4a, and a second a compressor 4b, and includes a first control valve 6 a and the second control valve 6 b, and a controller 7.
The aerosol generation chambers 1a and 1b are containers in which minute powders (film forming powders) of raw materials are placed. The aerosol generation chambers 1a and 1b are respectively connected with compressed air lines such as gas cylinders, from which nitrogen (N ₂ ), oxygen (O ₂ ), helium (He), argon (Ar), dry air, etc. Carrier gas is introduced. Thereby, in the aerosol production | generation chambers 1a and 1b, film-forming powder is blown up and an aerosol is produced | generated. The aerosol generated in the aerosol generation chamber 1a is introduced into the film formation chamber 3 through the aerosol transfer line 2a, and the aerosol generated in the aerosol generation chamber 1b is introduced into the film formation chamber 3 through the aerosol transfer line 2b. Is done.

In the film forming chamber 3, a substrate stage 11 on which a substrate 10 is disposed, a first injection nozzle 12a and a second injection nozzle 12b, a first side nozzle (auxiliary nozzle) 13a and a second side nozzle 13b. And are arranged. The injection nozzles 12 a and 12 b and the side nozzles 13 a and 13 b are held by a nozzle guide 14. Further, the inside of the film forming chamber 3 is maintained at a predetermined degree of vacuum by an exhaust pump 8.
The substrate stage 11 is a movable stage that holds the substrate 10 and moves three-dimensionally under the control of the control unit 7.

  The injection nozzle 12a forms an aerosol beam by injecting the aerosol supplied via the aerosol transport line 2a toward the substrate 10. Moreover, the injection nozzle 12b forms an aerosol beam by injecting the aerosol supplied through the aerosol transport line 2b toward the substrate 10. The directions of the openings of the injection nozzles 12 a and 12 b are adjusted so that the aerosol beams injected from these nozzles overlap on the film formation surface of the substrate 10. Hereinafter, a region where the aerosol beams ejected from the two ejection nozzles 12a and 12b overlap each other is referred to as an aerosol beam irradiation point.

  The side nozzle 13a is disposed in the vicinity of the opening of the injection nozzle 12a, and blows gas, for example, air toward the aerosol beam injected from the injection nozzle 12a. The injection nozzle 13b is disposed near the opening of the injection nozzle 12b, and blows air toward the aerosol beam injected from the injection nozzle 12b.

Here, the reason why air is blown onto the aerosol beam in the present embodiment will be described. FIG. 2 is a side view of the injection nozzle 12a to the nozzle guide 14 as viewed from the X direction.
In order to perform film formation by the AD method, there are four balances: the type of film formation powder, the pressure when spraying aerosol (film formation powder injection pressure), the substrate conditions such as the hardness of the substrate, and the film formation temperature. It needs to be well met. If even one of these conditions is missing, the performance of the formed film will change, the film forming speed will decrease, or the film itself will not be formed. Therefore, in areas where film formation is not required or areas where film formation is desired to be suppressed, the airflow of the aerosol is disturbed by blowing air onto the aerosol beam. As a result, among the above four conditions, the conditions relating to the film forming powder injection pressure collapse, so that the film forming powder cannot be deposited on the substrate, or the ratio of the film forming powder that can be deposited decreases. On the other hand, by stopping the air blowing or reducing the amount or speed of air ejection, the original film-forming powder injection pressure that meets the film-forming conditions is quickly recovered, so deposition of film-forming powder resumes. Alternatively, the proportion of film-forming powder that can be deposited increases.

  The direction of air ejected from the side nozzles 13a and 13b is preferably a direction having a direction cosine with respect to the traveling direction of the aerosol beam. That is, as shown in FIG. 2A, when the air has a negative velocity component with respect to the traveling direction of the aerosol beam, or as shown in FIG. When air has a positive velocity component with respect to the traveling direction, the velocity component in the substrate direction of the aerosol beam can be changed. Can be destroyed.

Referring again to FIG. 1, the compressor 4a pumps air to the side nozzle 13a via the air supply line 5a. The air supply line 5a is provided with a control valve 6a that operates under the control of the control unit 7, thereby adjusting the supply of air to the side nozzle 13a. Similarly, the compressor 4b pressure-feeds air to the side nozzle 13b via an air supply line 5b provided with a control valve 6b.
The control unit 7 controls the relative positions of the substrate stage 11 and the injection nozzles 12a and 12b according to the film pattern to be formed, and controls the opening and closing of the control valves 6a and 6b.

Next, a film forming method according to the first embodiment of the present invention will be described with reference to FIG. 1, FIG. 3, and FIG. As shown in FIG. 3, in this embodiment, a film pattern (film formation regions 21 to 24) in which material A and material B having different compositions are arranged on the substrate 10 is formed.
First, a substrate 10 formed of a material such as silicon (Si), glass, or ceramics is disposed on the substrate stage 11 of the film forming chamber 3 and maintained at a predetermined temperature, and an exhaust pump 8 is used to form the substrate 10. The inside of the membrane chamber 3 is evacuated to a predetermined vacuum level. Next, the film-forming powder of the material A is placed in the aerosol generation chamber 1a, and an aerosol is generated by introducing a carrier gas. Similarly, the deposition powder of the material B is placed in the aerosol generation chamber 1b, and the aerosol is generated by introducing the carrier gas.

  Next, the control valves 6a and 6b are opened to eject air from the side nozzles 13a and 13b, and the aerosol generated in the aerosol generation chambers 1a and 1b is introduced into the injection nozzles 12a and 12b, respectively, and injected. Thereby, as shown to (a) of FIG. 4, the aerosol beam 20a injected from the injection nozzle 12a and the aerosol beam 20b injected from the injection nozzle 12b are respectively by the air injected from the side nozzles 13a and 13b. Be disturbed.

  Next, the substrate stage 11 is moved so that the aerosol beam irradiation point overlaps the film formation region 21 shown in FIG. 3, and the control valve 6a is closed. Thereby, as shown in FIG. 4B, the ejection of air from the side nozzle 13a is stopped, and the spray pressure of the aerosol beam 20a is quickly recovered. As a result, only the aerosol beam 20 a is sprayed on the substrate 10, and the film-forming powder of the material A contained in the aerosol beam 20 a is deposited on the substrate 10. Further, the film having the composition of the raw material A is formed by scanning the film formation region 21 shown in FIG. 3 with the aerosol beam 20a.

  Next, the control valve 6a is opened and the control valve 6b is closed. As a result, as shown in FIG. 4C, air is ejected from the side nozzle 13a and the aerosol beam 20a is disturbed, and the ejection of air from the side nozzle 13b is stopped, and the injection pressure of the aerosol beam 20b is reduced. Recover quickly. As a result, only the aerosol beam 20 b is sprayed on the substrate 10, and the film-forming powder of the material B contained in the aerosol beam 20 b is deposited on the substrate 10. Further, the film having the composition of the material B is formed by scanning the film formation region 22 shown in FIG. 3 with the aerosol beam 20b.

  Next, switching of the control valves 6a and 6b is switched, and as shown in FIG. 4B, a film having the composition of the material A is formed in the film formation region 23 (FIG. 3) by the aerosol beam 20a. Further, the control valves 6a and 6b are switched between open and closed, and as shown in FIG. 4C, a film having the composition of the material B is formed in the film formation region 24 (FIG. 3) by the aerosol beam 20b. In this way, a film pattern in which the material A and the material B are alternately arranged can be formed. In the film pattern, when forming a region where neither the material A nor B is deposited, the control valves 6a and 6b may be opened and air may be ejected from both the side nozzles 13a and 13b.

  As described above, according to the present embodiment, the aerosol beam sprayed onto the substrate is switched by controlling the opening and closing of the two control valves, so that the film forming material sprayed onto the substrate can be changed easily and at high speed. Can do. Accordingly, it is possible to efficiently form a precise film pattern including two kinds of materials having different compositions.

  In the present embodiment, as shown in FIG. 3, a film pattern in which a film having the composition of the material A and a film having the composition of the material B are arranged in the film surface (XY plane) is formed. As shown, a structure in which a film 25 having the composition of the material A and a film 26 having the composition of the material B are stacked may be manufactured.

Next, a film forming method according to the second embodiment of the present invention will be described.
First, in the film forming apparatus shown in FIG. 1, as in the first embodiment, the substrate 10 is arranged, the degree of vacuum and temperature in the film forming chamber are adjusted, and the aerosol containing the material A is added in the aerosol generating chamber 1a. An aerosol containing the material B is generated in the aerosol generation chamber 1b. Next, the control valves 6a and 6b are controlled to adjust the ejection amount or ejection speed of the air ejected from the side nozzles 13a and 13b, and the aerosol beams are ejected from the ejection nozzles 12a and 12b, respectively. Thereby, the injection pressure of these aerosol beams changes according to the injection quantity or the jet speed of the air jetted from the side nozzles 13a and 13b, respectively. By simultaneously spraying two types of aerosol beams with the jetting pressure adjusted to the same region on the substrate 10, a film in which the material A and the material B are mixed can be formed. Here, the mixing ratio of the material A and the material B in the formed film changes according to the ratio of the injection pressures of the two aerosol beams. Therefore, a film having a desired composition including the material A and the material B can be easily formed by controlling the opening / closing amount of the control valves 6a and 6b to adjust the ejection amount or ejection speed of air.

Next, a film forming method according to the third embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 6, in this embodiment, a functionally gradient material is produced in which the composition of the film changes in a gradient depending on the position.
First, in the film forming apparatus shown in FIG. 1, as in the first embodiment, the substrate 10 is arranged, the degree of vacuum and temperature in the film forming chamber are adjusted, and the aerosol containing the material A is added in the aerosol generating chamber 1a. An aerosol containing the material B is generated in the aerosol generation chamber 1b.

Next, the control valves 6a and 6b are opened to eject air from the side nozzles 13a and 13b, and the aerosol generated in the aerosol generation chambers 1a and 1b is introduced into the injection nozzles 12a and 12b, respectively, and injected.
Next, the substrate stage 11 is moved so that the aerosol beam irradiation point overlaps the left end of the film formation region 30 on the substrate 10 shown in FIG. 6, and the control valve 6a is closed. Thereby, as shown to (a) of FIG. 7, film-forming is started by the aerosol beam 20a injected from the side nozzle 13a.

  Next, the control valve 6a is gradually opened and the control valve 6b is gradually closed while controlling the substrate stage 11 so that the substrate 10 moves leftward with respect to the irradiation point of the aerosol beam. Thereby, as shown in FIG. 7B, the injection pressure of the aerosol beam 20a is gradually suppressed, and conversely, the injection pressure of the aerosol beam 20b gradually recovers. As a result, the material A and the material B are mixed and deposited according to the ratio of the injection pressures of the aerosol beams 20a and 20b. Further, as shown in FIGS. 7C and 7D, by controlling the opening and closing of the control valve 6a and the control valve 6b while moving the substrate 10, the ratio of the injection pressures of the aerosol beams 20a and 20b is set. Change. At that time, by controlling the open / close amount and open / close speed of the control valves 6a and 6b, the mixing ratio of the material A and the material B contained in the formed film and the change rate of the mixing ratio (composition gradient) Can be adjusted. In this manner, a film pattern in which the mixing ratio of the material A and the material B changes in an inclined manner can be formed.

  In this embodiment, as shown in FIG. 6, a functionally gradient material whose composition changes in the film surface (XY plane) is produced, but as shown in FIG. 8, the composition in the film thickness direction (Z direction). A functionally gradient material 40 in which the angle changes may be produced. In that case, the film formation region may be repeatedly scanned with the aerosol beam 20a and the aerosol beam 20b while changing the ratio of the jetting pressure of the aerosol beam 20a and the aerosol beam 20b.

  The functionally gradient material shown in FIG. 8 can be used, for example, as an intermediate layer when different materials are stacked. Here, if two types of materials having different thermal expansion coefficients are directly bonded together, the bonded materials may be warped, peeled off or damaged due to temperature changes. However, by inserting a functionally graded material containing these two types of materials as an intermediate layer, the difference in thermal expansion coefficient between them can be alleviated, so that damage to the material is suppressed and production yield is improved. It becomes possible.

  Alternatively, the functionally gradient material shown in FIG. 8 may be used as an acoustic matching layer in an ultrasonic probe. The acoustic matching layer is used to match the acoustic impedance of the piezoelectric body that generates ultrasonic waves with the acoustic impedance of the living body that is the subject. Usually, the acoustic impedance of the piezoelectric body and the acoustic impedance of the living body It is configured by laminating a plurality of materials having an acoustic impedance between them. By using a functionally gradient material including a material close to the acoustic impedance of the piezoelectric body and a material close to the acoustic impedance of the living body as such an acoustic matching layer, the acoustic impedance can be efficiently matched in one layer.

  Furthermore, the film forming method according to the present embodiment can be used in a combinatorial method used when developing a new functional material. The combinatorial method is a method of searching for a composition having a desired function or characteristic by forming a thin film having a composition changed for each region on a substrate and evaluating physical properties of the thin film. When such a thin film is formed, for example, by using the functionally gradient material shown in FIG. 6, it is possible to efficiently create a new material in a short time.

  In the first to third embodiments of the present invention described above, two types of materials having different compositions are used, but three or more types of materials may be used. In that case, an aerosol generation chamber, an injection nozzle, a compressor and a control valve, and an auxiliary nozzle may be added to the film forming apparatus shown in FIG. 1 in accordance with the type of material used.

  In the first to third embodiments of the present invention, one of the film forming conditions in the AD method is controlled by blowing air to the aerosol beam. On the contrary, the aerosol is sucked from the side nozzle. By doing so, the same effect can be obtained. In that case, an exhaust pump may be provided in place of the compressors 4a and 4b shown in FIG. As shown in FIG. 1, the side nozzle does not necessarily have to be disposed in the immediate vicinity of the opening of the injection nozzle, and may be disposed, for example, immediately before the substrate or in the middle of the aerosol transport line.

  Furthermore, in the first to third embodiments of the present invention, the relative position between the substrate and the irradiation point of the aerosol beam is changed by moving the substrate stage. The side nozzle side may be moved, or both of them may be moved. Further, a desired film pattern may be formed on the substrate by manually adjusting the on / off of the side nozzle, the air flow rate, and the like.

  INDUSTRIAL APPLICABILITY The present invention can be used in a film forming method for depositing a raw material composition material on a substrate by injecting the raw material powder toward the substrate, and a film forming apparatus using the same.

It is a schematic diagram which shows the structure of the film-forming apparatus which concerns on one Embodiment of this invention. It is a side view which shows the injection nozzle, side nozzle, and nozzle guide which are shown in FIG. It is a top view which shows the film | membrane pattern produced with the film-forming method which concerns on the 1st Embodiment of this invention. It is a figure for demonstrating the film-forming method which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows another example of the film | membrane pattern produced with the film-forming method which concerns on the 1st Embodiment of this invention. It is a top view which shows the film | membrane pattern (gradient functional material) produced by the film-forming method which concerns on the 3rd Embodiment of this invention. It is a figure for demonstrating the film-forming method which concerns on the 3rd Embodiment of this invention. It is sectional drawing which shows another example of the film | membrane pattern (gradient functional material) produced by the film-forming method which concerns on the 3rd Embodiment of this invention.

Explanation of symbols

1a, 1b Aerosol production chamber 2a, 2b Aerosol transfer line 3 Deposition chamber 4a, 4b Compressor (compression pump)
5a, 5b Air supply lines 6a, 6b Control valve 7 Control unit 8 Exhaust pump 10 Substrate 11 Substrate stage 12a, 12b Injection nozzle 13a, 13b Side nozzle (auxiliary nozzle)
14 Nozzle guides 20a, 20b Aerosol beams 21-24, 30 Film formation region (film pattern)
25, 26 Film 40 Functionally graded material

Claims (2)

A film forming apparatus for depositing a raw material composition material on a substrate by spraying the raw material powder onto the substrate,
A deposition chamber;
A movable stage disposed in the film forming chamber and holding a substrate on which a structure is formed;
Exhaust means for exhausting the gas in the film forming chamber to the outside;
First aerosol generating means for generating an aerosol containing powder of the first raw material stored in the first container;
Second aerosol generating means for generating an aerosol containing the powder of the second raw material stored in the second container;
A first injection nozzle that is disposed in the film forming chamber and injects the aerosol generated by the first aerosol generation means toward the substrate;
A second spray nozzle that is disposed in the film forming chamber and sprays the aerosol generated by the second aerosol generating means toward the substrate;
A first side nozzle that injects or sucks gas to the aerosol injected from the first injection nozzle;
A first pump that supplies gas to the first side nozzle or sucks gas from the first side nozzle;
A second side nozzle for injecting or sucking gas to the aerosol injected from the second injection nozzle;
A second pump that supplies gas to the second side nozzle or sucks gas from the second side nozzle;
According to the pattern of the film to be formed, the aerosol generated by the first aerosol generating means is sprayed from the first spray nozzle toward the substrate, and is generated by the second aerosol generating means, The first raw material is deposited on the substrate by jetting or sucking gas to the aerosol jetted from the second jet nozzle to disturb the aerosol, and generated by the second aerosol generating means. The aerosol is sprayed from the second spray nozzle toward the substrate, and gas is sprayed or sucked on the aerosol generated by the first aerosol generating means and sprayed from the first spray nozzle. by disturbing the aerosol, the second raw material to deposit on the substrate, said first and second Saidonozu Gas injection or suction of the on / off of, and / or a control means for controlling the flow rate of the gas to be injected or aspirated,
A film forming apparatus comprising: A film forming method for depositing a raw material composition material on a substrate by spraying the raw material powder onto the substrate,
A step (a) of generating an aerosol containing powder of the first raw material stored in the first container;
A step (b) of generating an aerosol that is contained in a second container and includes a powder of a second raw material having a composition different from that of the first raw material;
The aerosol generated in the step (a) is injected from the injection nozzle toward the substrate, and the aerosol generated in the step (b) is injected or sucked into the aerosol injected from the injection nozzle to disturb the aerosol. A step (c) of depositing the first raw material on the substrate;
The aerosol generated in the step (b) is sprayed from the spray nozzle toward the substrate, and the aerosol generated in the step (a) is sprayed or sucked into the aerosol sprayed from the spray nozzle to disturb the aerosol. A step (d) of depositing the second raw material on the substrate;
A film forming method comprising:

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