JP4431363B2 - Manufacturing method of light emitting diode - Google Patents

Description

  The present invention relates to a method for manufacturing a light-emitting diode, and more specifically, manufacturing a light-emitting diode in which a jig used in a process of resin-sealing a large number of LED chips mounted on a substrate is composed of two jigs. Regarding the method.

  A conventional method of manufacturing a so-called surface-mount type LED (light emitting diode) is a double-sided through hole in which a large number of independent metal conductor patterns formed on both sides of an insulating substrate are electrically connected through a through-hole. A printed circuit board is formed. A large number of LED chips are placed on the metal conductor pattern on one side of the printed circuit board via a conductive adhesive, and the LED chip is fixed to the printed circuit board, and at the same time, the lower electrode of the LED chip and The metal conductor pattern is electrically connected. The upper electrode of the LED chip is electrically connected to a metal conductor pattern formed independently on the same surface of the printed board on which the LED chip is mounted via a bonding wire.

  The LED chip and the bonding wire are protected from external stresses such as mechanical vibration and impact and external environment such as moisture and dust, and at the same time have a lens effect for controlling the light distribution of the light emitted from the LED chip. Are collectively sealed with a light-transmitting resin. The LED chip multi-cavity assembly substrate formed in this way is diced at predetermined intervals in the vertical and horizontal directions and separated into individual LEDs.

The separated surface-mount type LED is soldered to the mounting board with the metal conductor pattern formed on the other side and the side connected to the metal conductor pattern on which the LED chip of the printed board is mounted through the through hole. By applying a forward voltage to the LED chip from the outside, electric energy is converted to light energy to generate light (see, for example, Patent Document 1).
JP 2000-200987 A

  In the conventional method for manufacturing a surface-mounted LED described above, a transfer molding method is generally used in the step of sealing the LED chip and the bonding wire with a light-transmitting resin. This molding method is formed by press-fitting a material plasticized in a heating chamber (in this case, a light-transmitting resin serving as a sealing resin) into a heated cavity from a narrow passage. In particular, when a double-sided through-hole printed circuit board on which a large number of LED chips are mounted is resin-sealed by transfer molding, two main functions are important for the transfer molding die. One is to form a cavity so as to correspond to the shape of the resin sealing of each surface-mount type LED, and the other is the through hole of the double-sided through-hole printed circuit board by the plasticized sealing resin by pressure In other words, the through hole is closed during molding so that the resin film is not formed on the conductor pattern provided on the back surface of the printed circuit board.

  However, for the purpose of closing the through-hole of the double-sided through-hole printed circuit board, even if the surfaces of the mold and the double-sided through-hole printed circuit board are brought into pressure contact with each other, it may be slightly due to the contact between the hard materials. A gap is formed, and the resin flows into the through hole to form a resin film on the conductor pattern provided on the back surface of the printed board. As a result, when mounting individually mounted surface-mount LEDs to the mounting board by soldering, they are provided on the back surface of the surface-mount LEDs to be fixed to the circuit pattern formed on the mounting board for electrical conduction Since the resin film is formed on the conductor pattern and the through hole, soldering cannot be performed, and the function as a semiconductor component cannot be performed due to poor electrical conduction due to defective solder.

  In addition, transfer molds are expensive to manufacture and have a high proportion of initial investment at the time of product launch and are not versatile. Therefore, the product cost is increased by the die cost passed to the product in order to recover the cost invested in the die. In addition, if the type of product to be produced is changed frequently, the time required for mold replacement may be hindered, so that an efficient production system corresponding to the production status cannot be secured and the delivery date of the delivery destination cannot be met. At the same time, it may lead to an increase in product cost due to a decrease in production efficiency. In addition, since it takes time to manufacture the mold, it is not possible to introduce new products in a timely manner as required by the market, and this may miss the opportunity to expand sales and market share.

  Therefore, the present invention was devised in view of the above problems, and the object of the present invention is to save the launch time of a new product in the resin sealing process of an LED chip, which is one of the manufacturing processes of a surface-mounted LED. The present invention provides a means that enables quick response and efficient exchange of resin sealing jigs according to production conditions, and enables reduction in product cost by reducing initial investment and improving yield.

In order to solve the above-mentioned problem, the invention described in claim 1 of the present invention is directed to one side of a double-sided through-hole printed circuit board in which a plurality of independent conductor patterns are connected to each other on both sides of the insulating board by a through-hole. A plurality of LED chips are arranged on a conductor pattern on the surface so as to be aligned in rows and columns maintaining predetermined intervals, and a conductor pattern independent of the electrode of each LED chip and the conductor pattern on which the LED chip is mounted Are connected via bonding wires to form an LED chip multi-chamfer assembly substrate, and the LED chips and bonding wires mounted on the LED chip multi-chamfer assembly substrate are collectively sealed with a light-transmitting resin. In the method of manufacturing a light emitting diode, which is cut vertically and horizontally at intervals and divided into individual pieces, a jig used in the batch sealing step is the LED chip multi-sided cutting. Standing substrate of the LED chip is constituted by an upper jig arranged above the lower jig and the lower jig arranged above the No設been surface said upper jig, linearly upper jig A plurality of resin injection holes and a plurality of air exhaust holes penetrating through the resin injection holes, the resin injection holes and the air exhaust holes are aligned on a substantially parallel straight line, and the resin injection holes and the air are opposed to each other. A pair with the exhaust hole is arranged in parallel at a predetermined interval .

In the invention described in claim 2 of the present invention , a plurality of independent conductor patterns are connected to the both surfaces of the insulating substrate in a one-to-one manner through the through holes on the conductor pattern on one surface of the double-sided through-hole printed circuit board. A plurality of LED chips are placed in alignment in vertical and horizontal rows each maintaining a predetermined interval, and the electrode of each LED chip and a conductor pattern independent of the conductor pattern on which the LED chip is placed are connected via bonding wires. Are connected to each other to form an LED chip multi-cavity assembly board, and the LED chips and bonding wires mounted on the LED chip multi-cavity assembly board are collectively sealed with a light-transmitting resin, and cut vertically and horizontally at predetermined intervals. In the manufacturing method of the light emitting diodes that are individually divided, the jig used in the batch sealing step is an LED chip of the LED chip multi-sided assembly board. The upper jig is disposed above the lower jig and the upper jig is disposed above the lower jig, and the upper jig includes a plurality of curved lines penetrating the upper jig. A resin injection hole and a plurality of air exhaust holes are provided, the resin injection hole and the air exhaust hole are aligned on a substantially parallel straight line, and a pair of the resin injection hole and the air exhaust hole facing each other Are arranged in parallel at a predetermined interval .

According to a third aspect of the present invention, in the first aspect, a lower jig is disposed above the surface of the LED chip multi-chip assembly board on which the LED chip is mounted, and the lower jig When the upper jig is arranged above the upper jig, each through groove provided in the lower jig surrounds each LED chip row placed on the LED chip multi-chip assembly board, and is provided in the upper jig. The opening on the lower jig side of the resin injection hole and the air exhaust hole is outside the LED chips located on both outermost sides of the LED chip array surrounded by the through grooves, and the through grooves of the through grooves It is located inside the both ends of the LED chip row | line | column direction enclosed by (3), It is characterized by the above-mentioned.

According to a fourth aspect of the present invention, in the second aspect, a lower jig is disposed above the surface of the LED chip multi-chip assembly board on which the LED chip is mounted, and the lower jig When the upper jig is arranged above the upper jig, each through groove provided in the lower jig surrounds each LED chip row placed on the LED chip multi-chip assembly board, and is provided in the upper jig. The opening on the lower jig side of the resin injection hole and the air exhaust hole is inside the LED chips located on both outermost sides of the LED chip array surrounded by the through grooves, and the through grooves of the through grooves It is located inside the both ends of the LED chip row | line | column direction enclosed by (3), It is characterized by the above-mentioned.

The invention described in claim 5 of the present invention is characterized in that, in any one of claims 1 to 4 , the lower jig is made of silicone rubber .

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to FIG. 1 to FIG. 6 (the same parts are given the same reference numerals). The embodiments described below are preferable specific examples of the present invention, and thus various technically preferable limitations are given. However, the scope of the present invention particularly limits the present invention in the following description. Unless stated to the effect, the present invention is not limited to these embodiments.

  FIG. 1 is an assembly diagram when an LED chip multi-surface assembly board according to an embodiment of the present invention relating to a method for manufacturing a light-emitting diode is set on a resin sealing jig, and FIG. 2 is a resin seal in which the LED chip multi-surface assembly board is set. It is a fragmentary sectional view which shows the method of inject | pouring liquid optically transparent resin to a fixing jig. In this embodiment, first, a plurality of independent first conductor patterns 2 and second conductor patterns 3 are formed on both surfaces of the insulating substrate 1, and a plurality of through holes 4 are provided in each conductor pattern at specific intervals. Each through hole 4 connects the first conductor pattern 2 and the second conductor pattern 3 formed on both surfaces of the insulating substrate 1 to achieve electrical conduction.

  The plurality of LED chips 6 are formed through the conductive adhesive at the same interval as the interval where the through holes 4 are provided on the first conductor pattern 2 on one side of the double-sided through-hole printed circuit board 5 configured in this way. Is placed, and electrical conduction between the lower electrode of the LED chip 6 and the first conductor pattern 2 on which the LED chip 6 is mounted is achieved. The upper electrode of each LED chip 6 is connected to another first conductor pattern 2 independent of the first conductor pattern 2 on which the LED chip 6 is mounted via a bonding wire 7 for electrical conduction. Plan. In this way, the LED chip multi-surface assembly board 10 is assembled.

  In the next step, the bonding wire 7 is peeled off from the electrode by the force applied by directly contacting the bonding wire 7 having the function as described above and the vibration or impact applied indirectly, the bonding wire 7 is cut, The electrical failure caused by short-circuiting due to deformation of the bonding wire 7 is prevented, and at the same time, the LED chip 6 is protected from the external environment such as moisture and dust, and the reliability is maintained for a long period of time. Therefore, resin sealing is performed with a light-transmitting resin.

  A specific method of resin sealing is a through-groove that collectively surrounds a plurality of LED chips 6 and the bonding wires 7 arranged and arranged on a substantially straight line substantially perpendicular to the direction in which the bonding wires 7 are stretched. 11 is arranged above the LED chip multi-surface assembly substrate 10, and a plurality of lower jigs 15 arranged in parallel at the same intervals as the LED chips 6 mounted in the direction in which the bonding wires 7 are stretched. An upper jig 20 provided with sealing resin injection holes 12 and air exhaust holes 13 which are linear through holes at positions corresponding to both end portions of the respective through grooves 11 provided on the lower jig 15 above the upper jig 20. The LED chip multi-surface assembly board 10 is set on the resin sealing jig 25 by being placed and pressed.

  At this time, the bottom surface of each through-groove 11 provided in the lower jig 15 is closed by the LED chip multi-surface assembly substrate 10, and the upper jig 20 except for the sealing resin injection hole and the air exhaust hole on the upper surface. A space (resin filling space 17) filled with sealing resin is formed.

  Next, a resin discharge nozzle 14 of a sealing resin supply device (not shown) is inserted into each sealing resin injection hole 12 of the upper jig 20 of the resin sealing jig 25 on which the LED chip multi-face assembly substrate 10 is set. Is inserted and fixed, and similarly, the intake nozzle 16 of an air suction device (not shown) is inserted into each air exhaust hole 13 of the upper jig 20. In this state, the sealing resin is injected through the resin discharge nozzle 14 while exhausting the air present in the resin filling space 17 through the intake nozzle 16, and each resin filling space 17 is filled with the sealing resin. Then, the injection of the sealing resin is stopped.

  Thereafter, the resin discharge nozzle 14 and the intake nozzle 16 are removed from the upper jig 20 and heated by a heating device such as a curing furnace to cure the liquid sealing resin. After cooling, the LED chip 6 and the bonding wire 7 are cured. The LED chip multi-surface assembly substrate 10 sealed with resin is removed from the set resin sealing jig 25.

  Finally, the LED chip multi-surface assembly substrate 10 with resin sealing is cut at predetermined intervals in the vertical and horizontal directions, and separated into individual LEDs to complete the surface-mounted LED.

  Note that the lower jig 15 used in the above-described resin sealing step in the manufacturing process of the surface mount LED has mainly two functions. One is to form the resin-filled space 17 with the through groove 11 provided in the lower jig 15, the LED chip multi-surface assembly substrate 10 disposed below and the upper jig 20 disposed above. The other one is that the resin injected into the resin filling space 17 flows out and flows into the through hole 4 of the LED chip multi-surface assembly board 10 and wraps around the back surface, and coats the second conductor pattern 3 formed on the back surface. In other words, the through hole 4 is closed when the sealing resin is injected so as not to form the gap.

  Accordingly, the lower jig 15 has good adhesion to the LED chip multi-face assembly substrate 10 when placed above the LED chip multi-face assembly board 10, and the resin injected into the resin filling space 17 is lower jig 15. It is necessary to be able to reliably prevent the flow into the through-hole 4 closed by the step, to withstand the heating temperature when the sealing resin is cured, and to have no adhesiveness with the sealing resin. For example, silicone rubber is suitable as a material satisfying such properties.

  By the way, most liquid resins shrink in volume when cured. This is a phenomenon that occurs because part of the volatile components contained in the resin evaporates and is released into the outside air when the resin is cured. Therefore, when the liquid resin is cured with the surface open, the volatile components are evaporated from the surface and the volume shrinks, and sink marks are generated over the entire surface. Therefore, in order not to cause such a problem, the LED chip 6 mounted on the LED chip multi-surface assembly substrate 10 and the through groove 11 provided in the lower jig 15 arranged above the LED chip 6 and further arranged above the through groove 11 are provided. The positional relationship between the sealing resin injection hole 12 and the air exhaust hole 13 provided in the upper jig 20 was set as follows.

  That is, when the LED chip multi-surface assembly substrate 10 shown in FIG. 3 is set in the resin sealing jig 25 and filled with the sealing resin, the LED chip multi-surface assembly substrate 10 is disposed above the LED chip multi-surface assembly substrate 10. Both outermost LED chips of the LED chip 6 placed in alignment with the both ends of the resin filling space 17 formed by the through grooves 11 provided in the lower jig 15 and the LED chip multi-surface assembly substrate 10 6 is provided as a sink space 21 between which a sealing resin injection hole 12 and an air exhaust hole 13 provided in the upper jig 20 are positioned above the sink space 21. .

  When the LED chip multi-surface assembly board 10 having such a relationship, the lower jig 15 and the upper jig 20 are set and each resin filling space 17 is filled with resin and cured by heating, each resin filling space Volatile components of the resin filled in 17 gather in the sink space 21 around the lower opening 19 of the sealing resin injection hole 12 and the air exhaust hole 13 provided in the upper jig 20, and the sealing resin injection hole 12 and It is discharged into the outside air through the air exhaust hole 13. Therefore, resin sink due to evaporation of the volatile component of the resin is generated in the inner space 22 of the sealing resin injection hole 12 and the air exhaust hole 13 and the sink space 21 around the opening 19 of the sealing resin injection hole 12 and the air exhaust hole 13. Although it occurs, the portion where the LED chip 6 is mounted is filled and no sink mark is generated in the resin. Therefore, the resin sealing formed on the LED chip multi-surface assembly substrate 10 removed from the resin sealing jig 25 after the resin is cured is sinked at both ends where the LED chip 6 is not mounted, but the LED is There is no sink in the part where it was placed. That is, by intentionally setting a part where sink marks are generated and collecting the sink marks into the part, control is performed so that sinks do not occur in a place where there is another sink. By setting a place where sink marks that cannot be avoided when curing the resin are set at a place that is irrelevant to the product, it is possible to prevent a decrease in yield due to sink marks and to crush one of the factors that increase the cost of the product.

  FIG. 4 shows a lower jig 15 of another structure. The lower jig 15 is formed by forming a large number of convex portions 23 having a thickness substantially the same as the diameter of the through hole 4 at a position corresponding to the through hole 4 on the surface in contact with the LED chip multi-face assembly substrate 10. When the lower jig 15 is arranged above the LED chip multi-surface assembly substrate 10, each convex portion 23 of the lower jig 15 is inserted into the corresponding through hole 4 and the through hole 4 is closed. The first conductor pattern 2 integrated with the through hole 4 is covered with a surface, and a double blocking means is applied so that the injected resin does not flow into the through hole 4 in the resin sealing step.

  The upper jig 20 is disposed above the lower jig 15 and a sealing resin is filled in a groove formed by the LED chip multi-surface assembly substrate 10 and the through groove 11 provided in the lower jig 15. It plays the role of the upper lid of the time and regulates the height of the sealing resin when it becomes a product. Therefore, it is required to withstand the heating temperature when the sealing resin is cured and to have no adhesiveness with the sealing resin. A metal or resin flat plate can be used as a member that satisfies such conditions. However, when a metal plate is used, for example, a fluorine resin coating may be applied to the surface in contact with the sealing resin to increase non-adhesiveness. is necessary.

  Further, as shown in the assembly diagram of FIG. 5, a lower jig 15 is arranged on the LED chip multi-face assembly substrate 10, and this is inserted into a hollow portion 24 having a C-shaped cross section formed on the upper jig 20 and fixed. A method of setting a resin sealing jig with the above-described configuration is also possible. In this case, when the LED chip multi-surface assembly substrate 10 shown in FIG. 6 is set in the resin sealing jig 25 and the filling of the sealing resin is completed, the sealing resin provided in the upper jig 20 is described. Each upper opening 26 on the side in contact with the outside of the injection hole 12 and the air exhaust hole 13 is provided at a position outside the lower opening 19 on the lower jig side, and sealing resin injection that penetrates the upper jig 20 is provided. The holes 12 and the air exhaust holes 13 are formed in a curved shape to increase the length of each hole. Also, the outermost LED chips of the LED chips 6 mounted on the LED chip multi-surface assembly substrate 10 with the lower opening 19 on the lower jig side of each sealing resin injection hole 12 and air exhaust hole 13 aligned. 6 is provided so as to be located above the inner side.

  When the LED chip multi-surface assembly board 10 having such a relationship, the lower jig 15 and the upper jig 20 are set and each resin filling space 17 is filled with resin and cured by heating, each resin filling space Volatile components of the resin filled in 17 gather around the sealing resin injection hole 12 and the lower opening 19 of the air exhaust hole 13 provided in the upper jig 20, and the sealing resin injection hole 12 and the air exhaust hole 13. Is released into the outside air. In this case, since the sealing resin injection hole 12 and the air exhaust hole 13 provided so as to penetrate the upper jig 20 are formed in a curved shape, sink due to evaporation of the volatile component of the resin is injected into the sealing resin. This occurs only in the inside 22 of the hole 12 and the air exhaust hole 13, and no sink mark is generated in the resin filling space 17. Therefore, by deliberately setting the part where sink marks occur by a method different from the method described above and consolidating the sink marks into that part, if there are other sinks, there will be no sink marks in the problem areas. Is controlled. By setting a place where sink marks that cannot be avoided when curing the resin are set at a place that is irrelevant to the product, it is possible to prevent a decrease in yield due to sink marks and to crush one of the factors that increase the cost of the product.

  The lower jig 15 constituting the resin sealing jig 25 has a plurality of through-grooves 11 arranged in parallel at the same interval as shown in FIG. 1, or the through-groove 11 as shown in FIG. Any one of a plurality of projections 23 arranged in parallel at the same interval and provided with a large number of convex portions 23 may be used.

  As described above, the method for manufacturing a light emitting diode according to the present invention is a process of resin-sealing a large number of LED chips and bonding wires mounted on a double-sided through-hole printed circuit board. A lower jig, which is composed of two jigs and is arranged above the LED chip multi-surface assembly substrate on which the LED chips are mounted, is formed of silicone rubber. As a result, since the adhesiveness with the LED chip multi-sided assembly substrate is good, it is possible to reliably prevent the sealing resin injected into the resin-filled space from flowing into the through-hole 4 and increase the product yield and the product cost. Can be lowered. In addition, since it can be manufactured at a lower price and faster delivery time than transfer molds, it can respond quickly to product launches without missing opportunities in response to market demands. The price can be reduced. When manufacturing different types of products, if the double-sided through-holes have the same external dimensions, the upper jig is shared and only the lower jig needs to be prepared. The initial investment in raising the product can be further reduced, and further cost reduction of the product can be realized. It has excellent effects such as.

It is an assembly drawing of the jig | tool for resin sealing in the manufacturing process of the light emitting diode concerning embodiment of this invention. It is a fragmentary sectional view which shows the sealing resin injection | pouring process in the manufacturing process of the light emitting diode concerning embodiment of this invention. It is a fragmentary sectional view which shows the state after filling with sealing resin in the manufacturing process of the light emitting diode concerning embodiment of this invention. It is a fragmentary sectional view which shows another lower jig | tool used at the manufacturing process of the light emitting diode concerning embodiment of this invention. It is an assembly drawing of another jig | tool for resin sealing in the manufacturing process of the light emitting diode concerning embodiment of this invention. It is a fragmentary sectional view which shows the state after filling with sealing resin by another resin sealing jig | tool in the manufacturing process of the light emitting diode concerning embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Insulation board | substrate 2 1st conductor pattern 3 2nd conductor pattern 4 Through hole 5 Double-sided through-hole printed board 6 LED chip 7 Bonding wire 10 LED chip multi-sided assembly board 11 Through groove 12 Sealing resin injection hole 13 Air exhaust hole DESCRIPTION OF SYMBOLS 14 Resin discharge nozzle 15 Lower jig | tool 16 Intake nozzle 17 Resin filling space 18 End part 19 Lower opening part 20 Upper jig | tool 21 Sink space 22 Inside 23 Convex part 24 Hollow part 25 Resin sealing jig 26 Upper opening part

Claims (5)

A plurality of LED chips are aligned in a vertical and horizontal row each maintaining a predetermined spacing on a conductor pattern on one side of a double-sided through-hole printed circuit board in which a plurality of independent conductor patterns are connected one-to-one on both sides of the insulating substrate by through-holes. The LED chip electrodes and a conductor pattern independent of the conductor pattern on which the LED chip is mounted are connected via bonding wires to form an LED chip multi-sided assembly substrate, In the method for manufacturing a light emitting diode, the LED chip and the bonding wire mounted on the LED chip multi-sided assembly substrate are collectively sealed with a light-transmitting resin, and are cut into vertical and horizontal at predetermined intervals to be individually divided. The jig used in the stopping process includes a lower jig disposed above the surface of the LED chip multi-chip assembly board on which the LED chip is mounted, and the jig Constituted by an upper jig arranged above the jig, the upper jig, a plurality of resin injection holes and a plurality of air exhaust holes through the upper jig in a straight line is provided, the resin injection hole And the air exhaust holes are aligned on a substantially parallel straight line, and a pair of the resin injection hole and the air exhaust hole facing each other is arranged in parallel at a predetermined interval. Diode manufacturing method. A plurality of LED chips are aligned in a vertical and horizontal row each maintaining a predetermined spacing on a conductor pattern on one side of a double-sided through-hole printed circuit board in which a plurality of independent conductor patterns are connected one-to-one on both sides of the insulating substrate by through-holes. The LED chip electrodes and a conductor pattern independent of the conductor pattern on which the LED chip is mounted are connected via bonding wires to form an LED chip multi-sided assembly substrate, In the method for manufacturing a light emitting diode, the LED chip and the bonding wire mounted on the LED chip multi-sided assembly substrate are collectively sealed with a light-transmitting resin, and are cut into vertical and horizontal at predetermined intervals to be individually divided. The jig used in the stopping process includes a lower jig disposed above the surface of the LED chip multi-chip assembly board on which the LED chip is mounted, and the jig The upper jig is disposed above the jig, and the upper jig is provided with a plurality of resin injection holes and a plurality of air exhaust holes penetrating the upper jig in a curved shape. And the air exhaust holes are aligned on a substantially parallel straight line, and a pair of the resin injection hole and the air exhaust hole facing each other is arranged in parallel at a predetermined interval. Diode manufacturing method. When the lower jig is arranged above the surface of the LED chip multi-chip assembly board on which the LED chip is mounted, and the upper jig is arranged above the lower jig, the lower jig is provided on the lower jig. Each through groove surrounds each LED chip row mounted on the LED chip multi-chip assembly board, and the opening on the lower jig side of the resin injection hole and the air exhaust hole provided in the upper jig is the through groove The LED chip array is located outside the LED chips located at the outermost both sides of the LED chip array and inside the both ends of the through groove in the LED chip array direction surrounded by the through groove. The manufacturing method of the light emitting diode of Claim 1 . When the lower jig is arranged above the surface of the LED chip multi-chip assembly board on which the LED chip is mounted, and the upper jig is arranged above the lower jig, the lower jig is provided on the lower jig. Each through groove surrounds each LED chip row mounted on the LED chip multi-chip assembly board, and the opening on the lower jig side of the resin injection hole and the air exhaust hole provided in the upper jig is the through groove The LED chip array is located on the inner side of the LED chips located on the outermost sides of the LED chip array and on the inner side of the both ends of the through groove in the LED chip array direction. The manufacturing method of the light emitting diode of Claim 2 . The light emitting diode manufacturing method according to claim 1, wherein the lower jig is made of silicone rubber .

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