JP2008288275A - Manufacturing method and structure of surface bonding type diode frame - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To ensure the more accurate size of a molded function area with design by which a molding bolt and a positioning bolt can be placed respectively in contact with a metal pin and to increase a yield in the manufacturing process by lowering a generation rate of burrs at a plastic base. <P>SOLUTION: In the manufacturing method and structure of the surface bonding type diode frame, the surface bonding type diode frame structure includes a plastic base and a plurality of metal pins. A concave function area is provided on the one end surface of the plastic base and a plurality of internally recessed reserve holes are formed on the other end surface opposing to the function area. The function area and reserve hole are molded by the molding bolt and positioning bolt provided within the mold. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a surface-adhesive diode frame and a structure thereof, and particularly to a surface-adhesive diode frame formed by a method in which positioning bolts and formed bolts are brought into contact with metal pins.

  Light emitting diodes (LEDs) are small and strong against vibration, and have advantages such as power saving, fast reaction speed, long life, etc., so their adaptability becomes more and more widespread. In recent years, the efficiency of light-emitting diodes has been increased, and therefore, the light-emitting diodes are widely used in general lighting devices and backlights of various products.

  Conventional surface-mounted light emitting diodes (SMDs) are generally surface-bonded light-emitting diodes, which are fixed in a surface-bonded diode frame and then subjected to subsequent processes such as wire bonding and packaging. A light emitting diode is formed. Here, the diode frame includes a plastic base having a concave functional area on one end surface, and two metal pins that are fixed to the plastic base and extend from the functional area to the outside of the plastic base.

  As shown in FIG. 1, the conventional diode frame is formed by first stamping a metal substrate (not shown) to form a metal pin 11 ′, and then placing it in a mold 20 ′ for further forming. The bolt 21 ′ is brought into contact with the metal pin 11 ′, and the polymer raw material 3 ′ is injected, and then solidified to form a plastic base 30 ′. The functional area is formed by the forming bolt 21 ′. However, since the metal pin 11 ′ is not properly sandwiched and fixed, the polymer raw material 3 ′ is further affected by the flow in the mold 20 ′, causing the metal pin 11 ′ to be displaced and the polymer raw material 3. A flash is generated at the contact point between the formed bolt 21 'and the metal pin 11', and not only does the size of the functional area formed by the formed bolt 21 'generate a deviation, but also a post process. Yield is also reduced, product quality is unstable, and manufacturing costs are increased.

  For this reason, the present inventor has paid attention to the fact that the above-mentioned drawbacks can be improved, and based on the experience accumulated in this area since many years, he has been observing and studying deliberately, and in addition to the operation of academic theory, finally rational design and the above-mentioned The present invention has been proposed in which the drawbacks can be effectively improved.

  The main object of the present invention is to eliminate the occurrence of displacement of the conventional surface-adhesive diode frame with respect to the frame due to the flow of the polymer raw material when the plastic base is molded. The present invention provides a method and a structure for manufacturing a surface-attached diode frame that can be more accurate, increase the yield of subsequent processes, efficiently reduce manufacturing costs, and improve product stability.

  In order to achieve the above object, the present invention includes a step of providing a metal substrate formed by stamping a metal substrate and forming a plurality of non-continuous metal pins that are spaced apart from each other, and a mold hole having a predetermined shape, And providing a mold having one forming bolt and a plurality of positioning bolts opposed to each other in the mold hole, and positioning the metal substrate in the mold so that the metal pin is positioned in the mold hole. And a step of abutting the forming bolt and the positioning bolt on opposite end faces of the metal pin, and injecting a polymer raw material into the mold hole, and the forming bolt, the positioning bolt and the metal pin. And a step of providing a polymer raw material that wraps, and when cooled and solidified, the solidified polymer raw material adheres the metal pin to form an insulating plastic base. Removing the forming bolt and the positioning bolt, taking out the metal substrate from the mold, forming an indented functional area on one end surface of the plastic base with the forming bolt, and The positioning bolts form a plurality of reserve holes on the opposite other end face of the plastic base, the metal pin extends from the functional area to the outside of the plastic base, and the reserve hole penetrates the end face of the metal pin. And a method of manufacturing a surface-adhesive diode frame.

  The present invention provides a plastic base having a concave functional area on one end face, a plurality of indented reserve holes on the other end face facing the functional area, and a plastic base fixed to the plastic base, respectively. The surface-adhesive diode frame structure includes a plurality of metal pins extending from the functional area to the outside of the plastic base and penetrating through the reserve holes and adjacent to each other at intervals.

  The present invention has the following effects. The positioning bolt and the forming bolt of the present invention can efficiently abut against the opposite end faces of the metal pin, the metal pin is fixed in the mold hole, and the size of the formed functional area is more accurate, The yield of subsequent processes is also increased, and the manufacturing cost can be reduced.

  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to more specifically describe the technology, means and effects adopted by the present invention to achieve a predetermined object, the following detailed description and accompanying drawings relating to the present invention will be referred to. It goes without saying that the drawings are used only for reference and explanation and do not narrowly limit the scope of the claims of the present invention.

  As shown in FIGS. 2 to 5, the present invention provides a “surface-adhesive diode frame manufacturing method and its structure”, and the manufacturing method includes the following steps.

  (S100) A metal substrate 10 is provided, and the metal substrate 10 is a thin plate member, and is subjected to metal stamping by a continuous supply method to obtain a plurality of metal pins 11 that are disposed at intervals in the frame region and are not continuous. The number of metal pins 11 is set according to actual requirements. In the drawing of the present invention, two metal pins are taken as an example. However, three or four metal pins are stamped and formed. Also good.

  (S101) A mold 20 including a convex mold and a concave mold facing each other is provided. The mold 20 has mold holes 21 corresponding to the number of the frame areas, and the mold holes 21 have a predetermined shape. The machining method may be a machining method such as an electric discharge machining method, and a forming bolt 22 and a plurality of positioning bolts 23 that are vertically movable are opposed to each other in the formed mold hole 21. The formed bolt 22 may be circular, square, rectangular, or polygonal. In the present invention, an elliptical shape is taken as an example.

  (S102) The metal substrate 10 is positioned in the mold 20 so that the metal pin 11 is positioned in the mold hole 21, and the two metal pins 11 are installed adjacent to each other with a gap between them, and The forming bolt 22 and the positioning bolt 23 are opposed to the opposite upper and lower end faces to stably hold and fix the metal pin 11 to avoid the occurrence of displacement in the subsequent process.

  (S103) The polymer raw material 3 is provided, and the polymer raw material 3 is melted and injected into the mold cavity 21 by a technical method such as injection molding (Molding) or casting (Casting). The molding bolt 22, the positioning bolt 23 and the metal pin 11 are covered and the mold hole 21 is filled, and the material of the polymer raw material 3 may be polyphthalamide (PPA) or any other known thermoplastic resin. .

  (S104) Subsequently, when the polymer raw material 3 is cooled and solidified and molded, the solidified polymer raw material 3 adheres the metal pin 11 and has an insulating plastic base due to the predetermined shape of the mold hole 21. 30 is formed.

  (S105) Finally, the forming bolt 22 and the positioning bolt 23 are removed, the metal substrate 10 is taken out of the mold 20 and the metal substrate 10 is taken out, for example, by a technique such as extrusion. At the same time, as shown in FIGS. 6 and 7, the outer shape of the formed bolt 22 causes the inner surface of the plastic base 30 to be formed obliquely with an indented functional area 31 facing inward. Corresponding to the outer shape of the forming bolt 22, a plurality of inwardly-reserved reserve holes 32 are formed by the positioning bolt 23 so as to oppose the other end surface of the plastic base 30 to form the functional area 31. The metal pin 11 extends from the functional area 31 to the outside of the plastic base 30.

  However, since the metal pin 11 has better light reflectivity, the metal substrate 10 and the metal pin 10 and the metal pin 10 are stamped before or after the stamping step of the metal pin 11 in the step (S100). The metal reflective layer is further electroplated so that each of the end surfaces (surfaces) of 11 has a metal reflective layer (not shown), and the metal reflective layer is a highly reflective metal such as silver.

  More specifically, the above-described steps enable the surface-adhesive diode frame structure of the present invention to be formed, the plastic base 30 and the plurality of metal pins 11 are formed, and an indented functional area 31 is formed on one end surface of the plastic base 30. The above-described reserve hole 32 is formed on the opposite other end surface, and the metal pins 11 are respectively extended from the functional area 31 to the outside of the plastic base 30. However, each of the reserve holes 32 is formed by the positioning bolts 23 installed in the mold 20 and is formed at one end surface of the plastic base 30 with an interval.

  Each metal pin 11 includes a base portion 111 and a pin portion 112. The base portion 111 is located in the functional area 31, and the pin portion 112 is integrally extended from one end of the base portion 111 to the outside of the plastic base 30 to be a subsequent welding point. These pin portions 112 are disposed on opposite side edge surfaces of the plastic base 30 and can be bent at the end surfaces of the reserve holes 32 of the plastic base 30 (as shown in FIG. 8), thereby forming a top-view type diode frame. (That is, forward light emission) can be configured. Alternatively, these pin portions 112 can be positioned on the side edge surface on the same side of the plastic base 30 (not shown), thereby forming a side-view type diode frame (that is, side light emission).

  As described above, according to the present invention, a diode frame having a more accurate size can be manufactured. Then, as shown in FIG. 9, after the post-process such as chip mounting, wire bonding, and packaging is performed in the plastic base 30, An adhesive light emitting diode is formed. In the chip mounting process, the light emitting diode chip 40 can be mounted on the base portion 111 of the metal pin 11 of the plastic base 30, and the light emitting diode chip 40 can be fixed by a technique such as adhesion, and then the wire bonding process is performed. Then, the light emitting diode chip 40 and the base portion 111 of the metal pin 11 in the functional area 31 are electrically connected to each other by a wire (for example, gold wire) 41, and finally, a packaging process is performed. In the functional region 31, a light-transmitting sealing layer (not shown), for example, covering an epoxy or a thermoplastic resin, packaging the light-emitting diode chip 40 and the wire 41, and forming a surface-bonded light-emitting diode, A current is applied to the pin portion 112 (soldered to the circuit board) of the metal pin 11 to light-emitting diode chip. To emit 40.

Therefore, according to the present invention, there are the following features and functions.
1: The forming bolt 22 and the positioning bolt 23 of the present invention can be efficiently abutted and fixed to the opposite end faces of the metal pin 11, respectively, and the metal pin 11 is placed in the mold hole 21 with the polymer raw material 3. It is not displaced by the flow of
2: The plastic base 30 of the present invention has a more accurate size, increases the yield of subsequent processes, reduces the manufacturing cost, and can be mass-produced.

  However, the foregoing description is merely a detailed description of the preferred specific embodiments and drawings of the present invention, and does not limit the scope of the claims of the present invention. Any expert who has ordinary knowledge in the field, who should be based on the scope of the claims, can make appropriate changes or modifications within the field of the present invention. It goes without saying that it should be delivered within the scope.

It is a figure which shows preparation of the conventional surface adhesion type diode frame. It is a flowchart of the manufacturing method of this invention. It is a perspective view which shows shaping | molding of the metal pin of the metal substrate of this invention. It is a figure which shows fixation of the metal pin of this invention. It is a figure which shows shaping | molding of the plastic base of this invention. It is a perspective view which shows the plastic base shaping | molding functional area | region of this invention. It is a perspective view which shows the plastic base molding reserve hole of this invention. It is a perspective view which shows the shaping | molding pin part of the metal pin of this invention. It is a perspective view which shows the chip mount and wire bonding of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 'Metal pin 20' Mold 21 'Forming bolt 3' Polymer raw material 30 'Plastic base 10 Metal substrate 11 Metal pin 111 Base part 112 Pin part 20 Mold 21 Mold hole 22 Forming bolt 23 Positioning bolt 3 Polymer raw material 30 Plastic base 31 Functional area 32 Reserve hole 40 Light emitting diode chip 41 Wire

Claims (12)

Providing a metal substrate having a plurality of metal pins formed by stamping the metal substrate at intervals and discontinuous;
Providing a mold having a mold hole of a predetermined shape and having a single molding bolt and a plurality of positioning bolts opposed to each other in the mold hole;
Positioning the metal substrate on the mold so that the metal pin is positioned in the mold cavity, and bringing the forming bolt and the positioning bolt into contact with opposite end faces of the metal pin, respectively.
Injecting into the mold cavity, and providing a polymer raw material that wraps the forming bolt, the positioning bolt and the metal pin;
When cooled and solidified, the solidified polymer raw material connects and fixes the metal pins, and molds an insulating plastic base;
The forming bolt and the positioning bolt are removed, the metal substrate is taken out of the mold, an indented functional area is formed on one end surface of the plastic base by the forming bolt, and the positioning bolt is used to Forming a plurality of reserve holes on opposite end surfaces of the plastic base, the metal pins extending from the functional area to the outside of the plastic base, and the reserve holes penetrating the end surfaces of the metal pins. A method for manufacturing a surface-attached diode frame.   2. The method of manufacturing a surface-adhesive diode frame according to claim 1, wherein the polymer raw material is injected by injection molding.   2. The method of manufacturing a surface-adhesive diode frame according to claim 1, wherein the polymer raw material is injected by casting.   2. The method of manufacturing a surface-adhesive diode frame according to claim 1, further comprising an electroplating step of providing a metal reflective layer on an end face of the metal pin before the stamping step of the metal substrate. .   2. The method of manufacturing a surface-bonded diode frame according to claim 1, further comprising an electroplating step of providing a metal reflective layer on an end face of the metal pin after the stamping step of the metal substrate. A plastic base having a concave functional area on one end surface, and a plurality of indented reserve holes on the other end facing the functional area;
Surface adhesion including a plurality of metal pins respectively fixed to the plastic base and extending out of the plastic base from the functional area of the plastic base, penetrating through the reserve holes and adjacent to each other at intervals Type diode frame structure.   7. The surface-adhesive diode frame structure according to claim 6, wherein each of the plastic-based reserve holes is formed by each positioning bolt provided in the mold.   The surface-adhesive diode frame structure according to claim 6, wherein the reserve hole is provided at a distance from the end surface of the plastic base.   7. The surface-adhesive diode frame structure according to claim 6, further comprising a metal reflective layer on a surface of the metal pin.   The surface bonding type according to claim 6, wherein each of the metal pins includes a base portion located in the functional area and a pin portion extended from one end of the base portion to the outside of the plastic base. Diode frame structure.   11. The surface-adhesive diode frame structure according to claim 10, wherein the pin portions are respectively disposed on opposite side edge surfaces of the plastic base.   11. The surface-bonded diode frame structure according to claim 10, wherein the pin portion is disposed on a side edge surface on the same side of the plastic base.

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