JP4419012B2 - 有機el素子用封止材及び有機el素子の封止方法 - Google Patents
有機el素子用封止材及び有機el素子の封止方法 Download PDFInfo
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- JP4419012B2 JP4419012B2 JP2003321315A JP2003321315A JP4419012B2 JP 4419012 B2 JP4419012 B2 JP 4419012B2 JP 2003321315 A JP2003321315 A JP 2003321315A JP 2003321315 A JP2003321315 A JP 2003321315A JP 4419012 B2 JP4419012 B2 JP 4419012B2
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- 239000004593 Epoxy Substances 0.000 claims description 4
- -1 polyethylene terephthalate Polymers 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 3
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 16
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 4
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- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical group C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Description
1. 光硬化性オリゴマー(EP−0021) ‥‥‥ 100重量部
(共栄社化学社製、ただし、EP−0021はその組成物中に、MEK(メチルエチルケトン)30重量%を含む。なお、このオリゴマーの平均分子量2000、分散度2.0である。
2. 光重合開始剤(KIP−150) ‥‥‥ 2重量部(Lamberti社製)
上記光硬化性オリゴマーと光重合開始剤とを均一混合し、この混合液をポリエチレンテレフタレートフィルム(厚み0.3mm)上にスクリーン印刷機を用いて厚さ50μmに塗工した。ついでこのフィルムを乾燥炉にて100℃で30分乾燥し常温に放置して、厚さ35μmの光硬化性樹脂層を持ったシート状の封止材を製造した(図1(イ)参照)。なお、このシート状の封止材を指触したが表面にタックが発現しているものの、光硬化性樹脂層の流動性は認められなかった。また、光硬化性樹脂層の厚みは封止する有機EL素子の大きさや形状により任意に決定されるが、5〜500μm程度に形成することが好適である。5μm未満であると有機EL素子を完全に封止することが困難になり、また、500μmを越えると光硬化性樹脂層が厚くなりすぎて、光照射による完全硬化が困難になるため、未硬化樹脂からのアウトガスが発生し易くなる。
2 ‥‥ 光硬化性樹脂層
3 ‥‥ 有機EL素子
4 ‥‥ ガラス基板
5 ‥‥ 圧着ロール
Claims (3)
- 25℃では非流動性を有し、かつ、50〜100℃の範囲では流動性を有する(A)成分と(B)成分を含有する光硬化性樹脂層、および光透過性フィルム層からなるシート状封止材により、有機EL素子を有する基板に該シート状封止材を保温された圧着ロールにて圧着して貼合せる工程と光照射により光硬化性樹脂層を硬化する工程による無機膜の下地になる一次被膜の形成方法。
(A)成分:平均分子量が1000〜10000かつ分散度Mw/Mnが1.5〜3.0で、ビスフェノール骨格を有するエポキシ樹脂の両末端及び/ 又は側鎖を(メタ)アクリル酸で(メタ)アクリル化したエポキシ(メタ)アクリレート
(B)成分:光重合開始剤 - 光透過性フィルム層がポリエーテルサルフォンからなる請求項1に記載の無機膜の下地になる一次被膜の形成方法。
- 光透過性フィルム層がポリエチレンテレフタレートフィルムからなり、光硬化性樹脂層を硬化する工程の後に、光透過性フィルムを取り除く工程を含む請求項1に記載の無機膜の下地になる一次被膜の形成方法。
Priority Applications (1)
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JP2003321315A JP4419012B2 (ja) | 2002-09-27 | 2003-09-12 | 有機el素子用封止材及び有機el素子の封止方法 |
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JP2002283041 | 2002-09-27 | ||
JP2003321315A JP4419012B2 (ja) | 2002-09-27 | 2003-09-12 | 有機el素子用封止材及び有機el素子の封止方法 |
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JP2004139977A JP2004139977A (ja) | 2004-05-13 |
JP4419012B2 true JP4419012B2 (ja) | 2010-02-24 |
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JP2003321315A Expired - Lifetime JP4419012B2 (ja) | 2002-09-27 | 2003-09-12 | 有機el素子用封止材及び有機el素子の封止方法 |
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Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006236626A (ja) * | 2005-02-22 | 2006-09-07 | Shinshu Univ | 電極層付き可撓性樹脂フィルムの製造方法 |
JP2007005107A (ja) * | 2005-06-23 | 2007-01-11 | Tohoku Pioneer Corp | 自発光パネルの製造方法、自発光パネル |
JP4796363B2 (ja) * | 2005-09-15 | 2011-10-19 | パイオニア株式会社 | 有機elパネル及びその製造方法 |
JP4963419B2 (ja) * | 2007-01-31 | 2012-06-27 | キヤノン株式会社 | フレキシブル表示装置 |
JP5259247B2 (ja) * | 2007-08-22 | 2013-08-07 | 富士フイルム株式会社 | 表示素子の封止方法およびガスバリアフィルムで封止された表示素子の製造方法 |
JP5185598B2 (ja) | 2007-11-06 | 2013-04-17 | 株式会社ジャパンディスプレイイースト | 有機el表示装置およびその製造方法 |
JP2009123645A (ja) | 2007-11-19 | 2009-06-04 | Hitachi Displays Ltd | 有機el表示装置およびその製造方法 |
JP5260029B2 (ja) | 2007-11-19 | 2013-08-14 | 株式会社ジャパンディスプレイ | 有機el表示装置の製造方法 |
JP5329147B2 (ja) | 2008-08-08 | 2013-10-30 | 株式会社ジャパンディスプレイ | 有機el表示装置の製造方法 |
JP5201347B2 (ja) | 2008-11-28 | 2013-06-05 | 株式会社スリーボンド | 有機el素子封止用光硬化性樹脂組成物 |
CN104221178B (zh) | 2010-11-02 | 2019-12-03 | Lg化学株式会社 | 粘合膜和使用其包封有机电子装置的方法 |
CN106134288B (zh) | 2014-03-19 | 2018-01-02 | 琳得科株式会社 | 电子元件封装用层叠片以及电子器件的制造方法 |
KR102126130B1 (ko) * | 2018-10-23 | 2020-06-23 | 에스케이씨 주식회사 | 면봉지층을 포함하는 디스플레이모듈과 이의 제조방법 |
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2003
- 2003-09-12 JP JP2003321315A patent/JP4419012B2/ja not_active Expired - Lifetime
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