JP4480134B2 - Coating film forming method and apparatus - Google Patents

Description

  The present invention relates to a coating film forming method and apparatus for forming a coating film by supplying a coating liquid such as a resist liquid to a substrate to be processed such as an LCD glass substrate.

  In general, in a semiconductor device manufacturing process, a resist film is formed by applying a resist solution to a glass substrate for LCD (hereinafter referred to as a substrate) as a substrate to be processed, and a circuit pattern is reduced using photolithography technology. The resist film is transferred to the resist film, developed, and then subjected to a series of processes for removing the resist film from the substrate.

  As a conventional coating film forming method, a method of forming a coating film by supplying a coating liquid while relatively moving a coating liquid supply nozzle and a substrate is widely known. Further, in recent years, a coating film forming method using an ink jet type coating liquid supply nozzle capable of strictly controlling the supply amount of the coating liquid and obtaining the advantage of reducing the consumption amount of the coating liquid is known ( For example, see Patent Document 1).

According to this method, the coating film can be formed on the surface of the substrate by moving the coating liquid supply nozzle in a substantially waveform shape with respect to the substrate.
JP2003-1112098 (Claims, FIG. 3)

  However, in the coating film forming method using the conventional inkjet coating liquid supply nozzle, since the long nozzle cannot be produced, the coating liquid is moved while moving the coating liquid supply nozzle in a substantially waveform shape with respect to the substrate. Since the coating film is formed by supplying, there is a problem in that the film thickness of the overlapped portion of the coating becomes thick and the coating film with a uniform film thickness cannot be formed. In particular, in a substrate that tends to increase in size in recent years, there are a large number of overlapping portions of coating, and accordingly, the uniformity of the film thickness is impaired, which may cause a product defect.

  The present invention has been made in view of the above circumstances, and it has been made possible to improve the uniformity of the film thickness and improve the quality by making the film thickness of the overlapping part of the coating almost the same as other parts. An object of the present invention is to provide a coating film forming method and an apparatus therefor.

In order to solve the above-described problem, the coating film forming method of the present invention is to be processed while relatively moving an inkjet type coating liquid supply nozzle in which a plurality of nozzle holes are arranged at an appropriate pitch and a substrate to be processed. On the premise of a coating film forming method for supplying a coating liquid to a substrate to form a coating film, the coating liquid supply nozzle in which ends of a plurality of nozzle bodies are overlapped from one end to the other end of the substrate to be processed In this case, the nozzle holes other than the overlapping portion of the nozzle body are arranged at an equal pitch, and the pitch of the nozzle holes of the overlapping portion of the nozzle body is set to the nozzle holes other than the overlapping portion. twice wider than the pitch of the amount of the coating solution supplied from the nozzle hole of the superposed section of the nozzle body, and a half than the amount supplied from other than the overlapping portions of the nozzle bore, Uniform coating film thickness (Claim 1).

In the coating film forming method of the present invention, the nozzle holes of the nozzle bodies are arranged at an equal pitch, and the coating liquid is supplied from one of the adjacent nozzle holes in the overlapping portion to overlap each nozzle body. The amount of the coating liquid supplied to the part may be halved compared to the amount supplied from the nozzle holes other than the overlapping part (claim 2). Further, nozzle holes other than the overlapping portion of the nozzle body are arranged at an equal pitch, and the pitch of the nozzle holes in the overlapping portion is twice as large as the pitch of the nozzle holes other than the overlapping portion, and in the overlapping portion. The pitch of the nozzle holes may be deviated by a half pitch, and the supply amount of the coating liquid in the overlapping portion of each nozzle body may be halved compared to the amount supplied from the nozzle holes other than the overlapping portion. 3) Alternatively, the nozzle holes of the nozzle bodies are arranged at an equal pitch, the supply timing of the coating liquid from one of the nozzle holes adjacent in the arrangement direction in the overlapping portion is delayed by 1/2 , and The coating liquid is alternately supplied from one of the adjacent nozzle holes in the overlapping portion, and the amount of the coating liquid supplied to the overlapping portion of each nozzle body is supplied from the nozzle holes other than the overlapping portion. That while 1/2 relative to the amount, and the liquid droplets of the coating solution supplied earlier in the overlapping portions, after may be so as to fuse the droplets of the supplied coating solution (claim 4 ).

The coating film forming apparatus of the present invention embodies the coating film forming method (the invention according to claim 1), wherein holding means for holding a substrate to be processed and nozzle holes on the center side are arranged at an equal pitch. a coating liquid supply nozzle of the inkjet pitch end side is twice wider plurality of nozzle holes than the pitch of the central portion by overlapping the ends of the plurality of nozzles bodies column set, the coating liquid supply nozzle And a moving mechanism for relatively moving the substrate to be processed from one end to the other end and a direction orthogonal thereto, and controlling the moving mechanism so that the coating film has a uniform thickness, and each nozzle The amount of the coating liquid supplied from the nozzle hole in the overlapping portion of the nozzle body having a pitch approximately twice the pitch of the nozzle holes other than the overlapping portion of the body is supplied from the nozzle holes other than the overlapping portion. To anda controllable control means to a half as compared with, characterized in that (claim 5).

According to a sixth aspect of the present invention, there is provided a coating film forming apparatus that embodies the second aspect of the invention, comprising: a holding unit that holds a substrate to be processed; and a plurality of nozzle bodies that are arranged with a plurality of nozzle holes having an equal pitch. An inkjet-type coating liquid supply nozzle in which ends are overlapped with each other; and a moving mechanism that relatively moves the coating liquid supply nozzle from one end of the substrate to be processed held by the holding unit to the other end and a direction orthogonal thereto. In addition to controlling the moving mechanism so as to make the coating film thickness uniform, the coating liquid is supplied from one of the adjacent nozzle holes in the overlapping portion of each nozzle body to superimpose the nozzle bodies. And a control means capable of controlling the supply amount of the coating liquid of the portion to ½ compared to the amount supplied from the nozzle holes other than the overlapping portion .

The coating film forming apparatus according to claim 7 embodies the invention according to claim 3, wherein the holding means for holding the substrate to be processed and the nozzle holes on the center side are arranged at an equal pitch, and the end side In the ink jet system, the end portions of a plurality of nozzle bodies in which a plurality of nozzle holes are arranged twice wider than the pitch on the center side are overlapped, and the pitch of the nozzle holes in the overlapping portion is biased by a half pitch A coating liquid supply nozzle, a moving mechanism for relatively moving the coating liquid supply nozzle from one end of the substrate to be processed held by the holding means to the other end and a direction orthogonal thereto, and a nozzle in an overlapping portion of each nozzle body And a control means capable of controlling the amount of the coating liquid supplied from the hole to ½ compared to the amount supplied from the nozzle hole other than the overlapping portion .

A coating film forming apparatus according to an eighth aspect of the invention embodies the invention according to the fourth aspect of the invention, comprising: a holding unit that holds a substrate to be processed; and a plurality of nozzle bodies that are provided with a plurality of nozzle holes having an equal pitch. An inkjet-type coating liquid supply nozzle in which ends are overlapped with each other; and a moving mechanism that relatively moves the coating liquid supply nozzle from one end of the substrate to be processed held by the holding unit to the other end and a direction orthogonal thereto. The moving mechanism is controlled to make the coating film uniform, the supply timing of the coating liquid from one of the nozzle holes adjacent in the arrangement direction in the overlapping portion of the nozzle body is delayed by 1/2, and each nozzle By alternately supplying the coating liquid from one of the adjacent nozzle holes in the overlapping part of the body, the supply amount of the coating liquid in the overlapping part of each nozzle body It can be controlled to fuse the droplets of the coating liquid supplied earlier and the liquid droplets of coating liquid supplied later in the overlapping part, in addition to halving the amount supplied from the nozzle hole. And a control means.

According to the first and fifth aspects of the invention, the coating liquid is supplied by moving the coating liquid supply nozzle in which the ends of the plurality of nozzle bodies are overlapped from one end to the other end of the substrate to be processed. when, arranged at equal pitches nozzle holes other than the superposed section of the nozzle body, and two times wider than the pitch of the nozzle holes other than the portion overlapped the pitch of nozzle holes of a superposed section of a nozzle body, the nozzle By making the supply amount of the coating liquid in the overlapping portion of the body ½ of the amount supplied from the nozzle holes other than the overlapping portion, the thickness of the coating film can be made uniform.

According to the second and sixth aspects of the invention, the coating liquid is supplied by moving the coating liquid supply nozzle in which the ends of the plurality of nozzle bodies are overlapped from one end to the other end of the substrate to be processed. In this case, the nozzle holes of the nozzle body are arranged at an equal pitch, the coating liquid is supplied from one of the adjacent nozzle holes in the overlapping part, and the supply amount of the coating liquid in the overlapping part is superposed on the nozzle body. The film thickness of the coating film can be made uniform by halving the amount supplied from the nozzle holes other than the part.

According to the third and seventh aspects of the invention, the coating liquid is supplied by moving the coating liquid supply nozzle in which the ends of the plurality of nozzle bodies are overlapped from one end to the other end of the substrate to be processed. In this case, the nozzle holes of the nozzle body other than the overlapping portion are arranged at an equal pitch, the pitch of the nozzle holes in the overlapping portion is made twice as large as the pitch of the nozzle holes other than the overlapping portion, and the nozzle holes in the overlapping portion The pitch of the coating film is deviated by a half pitch, and the supply amount of the coating liquid in the overlapping portion of each nozzle body is halved compared to the amount supplied from the nozzle holes other than the overlapping portion, thereby forming a coating film The thickness can be made uniform.

According to the fourth and eighth aspects of the invention, the coating liquid is supplied by moving the coating liquid supply nozzle in which the ends of the plurality of nozzle bodies are overlapped from one end to the other end of the substrate to be processed. In this case, the nozzle holes of the nozzle bodies are arranged at an equal pitch, the supply timing of the coating liquid from one of the nozzle holes adjacent in the arrangement direction in the overlapping portion is delayed by 1/2, and the nozzle portions are adjacent in the overlapping portion. By alternately supplying the coating liquid from one of the nozzle holes, the supply amount of the coating liquid in the overlapping portion of each nozzle body is halved compared to the amount supplied from the nozzle holes other than the overlapping portion. At the same time, the liquid droplets of the coating liquid supplied earlier in the overlapping portion and the liquid droplets of the coating liquid supplied later are fused, so that the moving direction of the coating liquid supply nozzle in the overlapping portion is orthogonal to this. Direction of It is possible to suppress the unevenness of square coating film.

  (1) According to the invention described in claims 1 to 3 and 5 to 7, the coating liquid supply nozzle in which the ends of the plurality of nozzle bodies are overlapped with each other is moved from one end of the substrate to be processed to the other end. In this case, the amount of the coating liquid supplied from the nozzle hole of the overlapping portion of the nozzle body is made smaller than the amount supplied from the nozzle hole other than the overlapping portion, so that the coating film Since the film thickness can be made uniform, the uniformity of the film thickness and the quality can be improved.

  (2) According to the fourth and eighth aspects of the invention, the coating liquid is supplied by moving the coating liquid supply nozzle in which the ends of the plurality of nozzle bodies are overlapped from one end to the other end of the substrate to be processed. At this time, the supply amount of the coating liquid in the overlapping portion of the nozzle body is made smaller than the amount supplied from the nozzle holes other than the overlapping portion, and is supplied first in the moving direction of the coating liquid supply nozzle. By fusing the applied coating liquid droplets and the coating liquid droplets to be supplied later, unevenness of the coating film in both the moving direction of the coating liquid supply nozzle and the direction orthogonal thereto is suppressed in the overlapping portion. Therefore, the thickness of the coating film can be made uniform.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the best embodiment of the present invention will be described in detail with reference to the accompanying drawings. Here, a case where the coating film forming apparatus according to the present invention is applied to a resist coating processing apparatus in a resist coating and developing processing apparatus for an LCD glass substrate will be described.

  The resist coating and developing apparatus is a plurality of substrates to be processed as shown in FIG. A loading / unloading unit 1 for placing a cassette C that accommodates an LCD glass substrate G (hereinafter referred to as a substrate G) and a plurality of processing units for performing a series of processes including resist coating and development on the substrate G are provided. An interface unit 3 for transferring the substrate G between the processing unit 2 and the exposure apparatus 4 is provided, and a loading / unloading unit 1 and an interface unit 3 are disposed at both ends of the processing unit 2, respectively. . In FIG. 1, the longitudinal direction of the resist coating and developing apparatus is the X direction, and the direction orthogonal to the X direction in plan view is the Y direction.

  The loading / unloading unit 1 includes a transport mechanism 5 for loading / unloading the substrate G between the cassette C and the processing unit 2, and the loading / unloading unit 1 loads / unloads the cassette C to / from the outside. . The transport mechanism 5 has a transport arm 5a and is in the direction in which the cassettes C are arranged. The substrate G can be moved on the transport path 6 provided along the Y direction, and the substrate G is loaded and unloaded between the cassette C and the processing unit 2 by the transport arm 5a.

  The processing unit 2 basically has two parallel rows of transport lines A and B for transporting the substrate G extending in the X direction. From the loading / unloading unit 1 side to the interface unit 3 along the transport line A. A scrub cleaning processing unit (SCR) 11, a first thermal processing unit section 16, a resist processing unit 13, and a second thermal processing unit section 17 are arranged. Further, a second thermal processing unit section 17, a development processing unit (DEV) 14, an i-ray UV irradiation unit (i-UV) 15, and the like from the interface unit 3 side toward the carry-in / out unit 1 along the transport line B A third thermal processing unit 18 is arranged. An excimer UV irradiation unit (e-UV) 12 is provided on a part of the scrub cleaning unit (SCR) 11. In this case, an excimer UV irradiation unit (e-UV) 12 is provided to remove organic substances on the substrate G prior to scrubber cleaning. An i-ray UV irradiation unit (i-UV) 15 is provided for performing a decoloring process for development.

  The first thermal processing unit section 16 has two thermal processing unit blocks (TB) 31 and 32 configured by stacking thermal processing units that perform thermal processing on the substrate G. The thermal processing unit block (TB) 31 is provided on the scrub cleaning processing unit (SCR) 11 side, and the thermal processing unit block (TB) 32 is provided on the resist processing unit 13 side. A first transport mechanism 33 is provided between the two thermal processing unit blocks (TB) 31 and 32.

  The second thermal processing unit section 17 has two thermal processing unit blocks (TB) 34 and 35 formed by stacking thermal processing units for performing thermal processing on the substrate G. The thermal processing unit block (TB) 34 is provided on the resist processing unit 13 side, and the thermal processing unit block (TB) 35 is provided on the development processing unit 14 side. A second transport mechanism 36 is provided between the two thermal processing unit blocks (TB) 34 and 35.

  The third thermal processing unit section 18 includes two thermal processing unit blocks (TB) 37 and 38 configured by stacking thermal processing units that perform thermal processing on the substrate G. The thermal processing unit block (TB) 37 is provided on the development processing unit (DEV) 14 side, and the thermal processing unit block (TB) 38 is provided on the cassette station 1 side. A third transport mechanism 39 is provided between the two thermal processing unit blocks (TB) 37 and 38.

  The interface unit 3 includes an extension / cooling mounting table (EXT / COL) 41, an external device block 42 in which a peripheral exposure device (EE) and a TITRA are stacked, and a buffer mounting table (BUF). 43 and a fourth transport mechanism 44 are provided.

  In the interface unit 3 configured as described above, the substrate G transported by the second transport mechanism 36 is transported to the extension / cooling mounting table (EXT / COL) 41, and the fourth transport mechanism 44 performs an external device block. 42 is transferred to the peripheral exposure apparatus (EE) to perform exposure for removing the peripheral resist, and then transferred to the exposure apparatus 4 by the fourth transfer mechanism 44 to expose the resist film on the substrate G. Thus, a predetermined pattern is formed. In some cases, the substrate G is accommodated in the buffer mounting table (BUF) 43 and then transferred to the exposure apparatus 4. After the exposure is completed, the substrate G is carried into the TITRA of the external device block 42 by the fourth transport mechanism 44 and predetermined information is written on the substrate G, and then the extension / cooling mounting table (EXT. COL) 41 and transported to the processing unit 2 again.

  The resist processing unit 13 includes a resist coating processing apparatus 20 to which the coating film forming apparatus according to the present invention is applied, and a resist film formed on the substrate G by the resist coating processing apparatus 20 in a decompression container (not shown). And a vacuum drying apparatus (VD) 21 for drying under reduced pressure.

  Next, a resist coating processing apparatus 20 to which the coating film forming apparatus according to the present invention is applied will be described.

<First Embodiment>
FIG. 2 is a schematic perspective view showing a main part of the first embodiment of the resist coating apparatus 20, and FIG. 3 is a schematic perspective view (a) showing a coating liquid supply nozzle and the coating liquid supply nozzle in the first embodiment. FIG. 4B is a schematic cross-sectional view of the coating liquid supply nozzle, and FIG. 5 is a schematic plan view illustrating the coating film forming method of the coating liquid supply nozzle.

  The resist coating apparatus 20 includes a mounting table 22 that is a holding unit that holds the substrate G, and an inkjet type coating liquid supply nozzle 23 in which a plurality of nozzle holes 24 having a wider end side pitch than the central side are arranged. The coating liquid supply nozzle 23 is moved relative to one end of the substrate G held by the mounting table 22 in the direction perpendicular to the other end, and the end portion side of the coating liquid supply nozzle 23 is overlapped and moved. And the movement mechanism 25 for controlling the movement of the coating film so that the film thickness of the coating film is uniform, and the amount of resist solution supplied from the nozzle hole 24 in the overlapping portion 26 of the coating solution supply nozzle 23 is overlapped. It is mainly composed of control means that can be controlled in a small amount compared to the amount supplied from the nozzle hole 24 other than the aligning portion 26, for example, a central processing unit 27 (hereinafter referred to as CPU 27). There.

  As shown in FIG. 4, the coating solution supply nozzle 23 is connected to a resist solution storage tank 29 for storing the resist solution R through a resist solution supply line 28 having an on-off valve V, a pump P, and a filter F. Has been. The coating liquid supply nozzle 23 has a storage unit 50 that temporarily stores the resist solution R from the resist solution storage tank 29, and a small diameter that communicates with the storage unit 50 to supply (discharge) the resist solution R, for example, about A large number of nozzle holes 24 of 50 μm and a piezo element 51 attached to the opposing inner surface of the reservoir 50 for pressurizing the resist solution R in the reservoir 50 are provided.

  In this case, the nozzle hole 24 has a pitch p1 (e.g., 200 to 600 [mu] m) on the end side of the coating liquid supply nozzle 23, i.e., the overlapping part 26, and a pitch p0 (e.g., 100 to 300 [mu] m) at the center other than the overlapping part. It is formed more widely (for example, p1 = 2p0) (see FIG. 3B). It has been confirmed that the resist solution R discharged from the nozzle hole 24 spreads about three times the diameter of the nozzle hole 24.

  The piezo element 51 is formed so as to expand and contract at a predetermined frequency according to the applied voltage, and the resist solution in the reservoir 50 is pushed out by the expansion and contraction of the piezo element 51 and is discharged from the nozzle hole 24. A predetermined amount of the extruded portion, for example, 30 to 80 ng (nanogram) of resist solution is supplied (discharged). In this way, in the piezo-type inkjet coating liquid supply nozzle 23, the discharge of the resist liquid R can be controlled in units of the expansion and contraction frequency of the piezo element 51, so that the discharge timing and discharge amount of the resist liquid R can be strictly controlled. The voltage applied to the piezo element 51 is controlled by a control signal from the CPU 27. Therefore, when the control signal from the CPU 27 is transmitted to the piezo element 51, the discharge timing and the number of discharges of the resist solution R are controlled in accordance with the moving speed and moving position of the coating solution supply nozzle 23, and the substrate G A predetermined amount, for example, a supply amount (discharge amount) from the nozzle hole 24 in the overlapping portion 26 on the end side of the coating liquid supply nozzle 23 is supplied (discharged) to a desired region on the surface from the nozzle holes 24 other than the overlapping portion 26. The resist solution R can be applied in a smaller amount than the supplied amount (discharge amount).

  In addition, on both sides of the mounting table 22, a pair of guide rails 52 are arranged in parallel with the mounting table 22 so as to extend to both ends of the mounting table 22. A first movable element 53 is slidably disposed on each of the guide rails 52, and the first movable element 53 and the guide rail 52 constitute a first moving mechanism. The linear motor 25A is formed. In addition, a nozzle rail 54 is installed between the first movable elements 53, and a second movable element 55 on which the coating liquid supply nozzle 23 is mounted is slidably disposed on the nozzle rail 54. The second mover 55 and the nozzle rail 54 form a second linear motor 25B that is a second moving mechanism. The first and second linear motors 25A and 25B form a moving mechanism 25. The first and second linear motors 25A and 25B are electrically connected to the CPU 27, and the CPU 27 The movement in the X and Y directions is controlled based on this control signal.

  By configuring as described above, the coating liquid supply nozzle 23 is formed so as to be movable from one end of the substrate G to the other end direction (X direction) and a direction orthogonal to the other direction (Y direction). Therefore, the coating liquid supply nozzle 23 moves in the X direction from one end to the other end of the substrate G, then moves in the Y direction orthogonal thereto, and moves again in the X direction, thereby overlapping the end side. The resist solution R can be supplied (discharged) by moving it a plurality of times. At this time, the amount of the resist solution R supplied from the nozzle hole 24 of the overlapping portion 26 is changed from the nozzle holes other than the overlapping portion 26. The film thickness of the resist film applied in an overlapping manner can be made uniform by making the amount small compared to the amount supplied.

  The moving mechanism 25 is not necessarily formed by the first and second linear motors 25A and 25B. For example, a ball screw mechanism, a bell composed of a motor and a timing belt, a driving mechanism, or the like may be used.

  Next, the operation | movement aspect of the resist coating processing apparatus 20 comprised as mentioned above is demonstrated with reference to FIG. First, when the substrate G that has been heat-treated by the thermal processing unit (TB) 31 is carried onto the mounting table 22 by a transfer arm (not shown), lift pins (not shown) penetrating the mounting table 22 rise and the substrate G Receive. Thereafter, the transfer arm is retracted outward from the mounting table 22. After receiving the substrate G, the lift pins are lowered and the substrate G is placed on the mounting table 22.

  Next, a first movement mechanism, for example, a first linear motor 25A of the movement mechanisms 25 is driven by a control signal from the CPU 27 to move the coating liquid supply nozzle 23 from one end in the X direction of the substrate G toward the other end. The resist solution R is supplied or discharged from the nozzle hole 24 while moving. At this time, one end side of the coating liquid supply nozzle 23 is located outside the substrate G, and the discharge of the resist solution R from the nozzle hole 24 is stopped, and from the nozzle hole 24 on the other end side. The resist solution R is applied by discharging a small amount, for example, 1/2 of the supply amount, that is, the discharge amount of the resist solution R from the nozzle hole 24 in the central portion of the coating solution supply nozzle 23 (see FIG. 5A). .

  When the coating liquid supply nozzle 23 reaches the other end of the substrate G, the driving of the first linear motor 25A is stopped, and the discharge of the resist liquid R from the coating liquid supply nozzle 23 is stopped or remains discharged. Then, the second linear motor 25B, which is the second moving mechanism, is driven to move the coating liquid supply nozzle 23 in the Y direction, and the other end portion where the one end side of the coating liquid supply nozzle 23 is applied first. Superimpose on the side position. In this state, the first linear motor 25A is driven again, and the resist solution R is discharged from the nozzle hole 24 while moving the coating solution supply nozzle 23 from the other end of the folded substrate G toward one end. At this time, in the overlapping portion 26, the amount of the resist solution R supplied from the nozzle hole 24 at the center of the coating solution supply nozzle 23 is smaller than the supply amount of the resist solution R, that is, the discharge amount, for example 1/2. Is applied and the resist solution R is applied, so that a substantially uniform resist film is formed which is substantially the same as the discharge amount of the resist solution R discharged from the nozzle hole 24 in the center (FIG. 5B). reference).

  After the coating liquid supply nozzle 23 reaches one end of the substrate G, the above operation is repeated again to discharge the resist liquid R over the entire surface of the substrate G, whereby a resist film having a uniform thickness can be formed. . In the final coating step, the end side of the coating liquid supply nozzle 23 is located outside the substrate G, and the discharge of the resist liquid R from the nozzle hole 24 is stopped.

  After the resist solution R is applied to the entire surface of the substrate G as described above, the lift pins are lifted to move the substrate G to the upper delivery position. In this state, a transfer arm (not shown) receives the substrate G and transfers the substrate G to the vacuum drying apparatus (VD) 21 in the next process.

<Second Embodiment>
FIG. 6 is a schematic plan view for explaining the coating film forming method of the second embodiment of the coating liquid supply nozzle according to the present invention.

  In the second embodiment, the coating liquid supply nozzle 23A arranges the nozzle holes 24 at an equal pitch, and alternately supplies the resist solution R from the adjacent nozzle holes 24 in the overlapping part 26, thereby This is a case where the supply amount (discharge amount) of the resist solution is reduced so that the thickness of the resist film can be made uniform.

  In the second embodiment, when a control signal from the CPU 27 is transmitted to the coating liquid supply nozzle 23A and the piezo element 51 is applied, adjacent nozzle holes in the end portion side of the coating liquid supply nozzle 23A, that is, in the overlapping portion 26. The resist solution R is supplied (discharged) alternately from 24. In addition, in 2nd Embodiment, since another part is the same as 1st Embodiment, description is abbreviate | omitted.

  In the second embodiment, when the resist solution R is supplied (discharged) from the nozzle hole 24 while moving the coating solution supply nozzle 23A from one end in the X direction of the substrate G toward the other end, the coating solution supply nozzle 23A One end side is located outside the substrate G, and the discharge of the resist solution R from the nozzle hole 24 is stopped. From one of the adjacent nozzle holes 24 on the other end side, the coating liquid supply nozzle 23 is stopped. The resist solution R is applied by discharging a small amount, for example 1/2, of the supply amount of the resist solution R from the nozzle hole 24 in the central portion thereof, that is, the discharge amount (see FIG. 6A).

  After the coating liquid supply nozzle 23A reaches the other end of the substrate G, the coating liquid supply nozzle 23A moves in the Y direction, and the other end side position where the one end side of the coating liquid supply nozzle 23A is applied first. Is superimposed. In this state, when the coating liquid supply nozzle 23 </ b> A again moves from the other end of the folded substrate G toward the one end and discharges the resist liquid R from the nozzle hole 24, the adjacent nozzle hole 24 in the overlapping portion 26. The discharge amount of the resist liquid R discharged from the nozzle hole 24 that has been stopped at the time of the previous coating process after the switching of the resist liquid R is the discharge amount of the resist liquid R from the nozzle hole 24 at the center of the coating liquid supply nozzle 23A. When a smaller amount, for example, 1/2 is discharged and the resist solution R is applied, the discharge amount of the resist solution R discharged from the nozzle hole 24 in the central portion is almost the same and a substantially uniform resist film is formed. (See FIG. 6 (b)).

  Thereafter, in the same manner as described above, the resist solution R is alternately discharged from one end and the other of the adjacent nozzle holes 24 in the end portion side of the coating solution supply nozzle 23A, that is, the overlapping portion 26, and the above operation is repeated to form the substrate. By discharging the resist solution R over the entire surface of G, a resist film having a uniform thickness can be formed. In the final coating step, the end side of the coating liquid supply nozzle 23A is positioned outside the substrate G, and the discharge of the resist liquid R from the nozzle hole 24 is stopped.

<Third Embodiment>
FIG. 7 shows a main part of the third embodiment of the coating liquid supply nozzle 23B according to the present invention, and is a schematic plan view showing an arrangement state of nozzle holes. FIG. 8 shows the coating liquid supply nozzle according to the third embodiment. It is a schematic sectional drawing which shows an application state.

  In the third embodiment, the coating liquid supply nozzle 23B arranges the nozzle holes 24 at an equal pitch, deviates the pitch (p) of the nozzle holes 24 by a half pitch (p / 2) in the overlapping portion 26, and overlaps them. This is a case where the supply amount (discharge amount) of the resist solution R in the portion 26 is substantially halved so that the uniformity of the resist film thickness can be achieved.

  In the third embodiment, when the coating liquid supply nozzle 23 is moved in the Y direction by transmitting a control signal from the CPU 27 to a second moving mechanism, for example, the second linear motor 25B, the nozzles of the overlapping portion 26 It is formed so as to be controllable so that 1/2 (p / 2) of the pitch (p) of the holes 24 is shifted. Further, a control signal from the CPU 27 is transmitted to the coating liquid supply nozzle 23B and the piezo element 51 is applied, whereby the resist liquid R from the nozzle hole 24 in the end portion side of the coating liquid supply nozzle 23B, that is, the overlapping portion 26, is applied. The supply amount (discharge amount) is controllable to approximately half, for example, 1/2 of the supply amount (discharge amount) from the nozzle hole 24 in the center. In addition, in 3rd Embodiment, since another part is the same as 1st Embodiment, description is abbreviate | omitted.

  In the third embodiment, when the resist solution R is supplied (discharged) from the nozzle hole 24 while moving the coating solution supply nozzle 23B from one end to the other end of the substrate G in the X direction, One end side is located outside the substrate G, and the discharge of the resist solution R from the nozzle hole 24 is stopped. From the nozzle hole 24 on the other end side, the central portion of the coating liquid supply nozzle 23 is stopped. A small amount, for example 1/2, is discharged from the supply amount (discharge amount) of the resist solution R from the nozzle hole 24 to apply the resist solution R (see FIG. 8A).

  After the coating liquid supply nozzle 23B reaches the other end of the substrate G, the coating liquid supply nozzle 23B moves in the Y direction, and the other end side position where the one end side of the coating liquid supply nozzle 23B is applied first. And the pitch (p) of the nozzle holes 24 is deviated by 1/2 (p / 2) (see FIG. 7). In this state, when the coating liquid supply nozzle 23B is again moved from the other end of the folded substrate G toward one end while discharging the resist liquid R from the nozzle hole 24, it is discharged from the nozzle hole 24 in the overlapping portion 26. The resist solution R is applied in such a manner that the amount of the resist solution R to be discharged is smaller than the amount of the resist solution R discharged from the nozzle hole 24 at the center of the coating solution supply nozzle 23B, for example, 1/2. Since the resist solution R is applied to the recesses between the pitches of the film of the resist solution R applied in the application step, the discharge amount of the resist solution R discharged from the nozzle hole 24 in the center is almost the same. A uniform resist film is formed (see FIG. 8B).

  In the same manner as described above, the pitch of the nozzle holes 24 in the end portion side of the coating liquid supply nozzle 23B, that is, the overlapping portion 26 is deviated by 1/2, and the discharge amount of the resist liquid R is adjusted from the nozzle hole 24 in the central portion. A resist film having a uniform thickness can be formed by discharging a small amount, for example 1/2, of the discharge amount of the liquid R and repeating the above operation to discharge the resist liquid R over the entire surface of the substrate G. In the final coating process, the end side of the coating liquid supply nozzle 23B is located outside the substrate G, and the discharge of the resist liquid R from the nozzle hole 24 is stopped.

<Fourth embodiment>
FIG. 9 is a schematic plan view showing a coating film forming method of the fourth embodiment of the coating liquid supply nozzle 23C in the present invention.

  In the fourth embodiment, the coating liquid supply nozzle 23C arranges the nozzle holes 24 at an equal pitch, and sets the supply (discharge) timing (T) of the resist liquid R from one of the adjacent nozzle holes 24 in the overlapping portion 26. In addition to delaying by 1/2 (T / 2), the supply (discharge) of the resist solution R from the nozzle hole 24 is alternately performed to reduce the supply amount (discharge amount) of the resist solution R in the overlapping portion 26 and the application This is a case where the resist film non-uniformity in the moving direction (X direction) of the liquid supply nozzle 23 is suppressed so that the uniformity of the resist film can be achieved.

  In the fourth embodiment, a control signal from the CPU 27 is transmitted to the first moving mechanism, for example, the first linear motor 25A and the coating liquid supply nozzle 23C, so that one of the adjacent nozzle holes 24 in the overlapping portion 26 is transmitted. The discharge timing of the resist solution R is delayed by 1/2, and the discharge of the resist solution R from the nozzle holes 24 can be alternately controlled. In addition, in 4th Embodiment, since another part is the same as 1st Embodiment, description is abbreviate | omitted.

  In the fourth embodiment, when the resist solution R is supplied (discharged) from the nozzle hole 24 while moving the coating solution supply nozzle 23C from one end to the other end in the X direction of the substrate G, the coating solution supply nozzle 23C One end side is located outside the substrate G, the discharge of the resist solution R from the nozzle hole 24 is stopped, and the discharge timing of the resist solution R from one of the adjacent nozzle holes 24 on the other end side Is delayed by 1/2 and the resist solution R is applied, and the resist solution R is alternately discharged from the nozzle holes 24 (see FIG. 9A). That is, as shown in FIG. 9A, the discharge timings of the central nozzle hole 24 and the two nozzle holes 24 on both sides of the three nozzle holes 24 on the end side are alternately delayed by 1/2. Resist solution R is discharged.

  After the coating liquid supply nozzle 23C reaches the other end of the substrate G, the coating liquid supply nozzle 23C moves in the Y direction, and the other end side position where the one end side of the coating liquid supply nozzle 23C is applied first. To overlay. Then, in this state, when the coating liquid supply nozzle 23C is again moved from the other end of the folded substrate G toward the one end and discharges the resist liquid R from the nozzle hole 24, the recess that has not been applied in the previous coating process. By applying the resist solution R to the nozzle portion 24, the resist solution R is applied with a delay of 1/2 of the discharge timing of the resist solution R from one of the adjacent nozzle holes 24 in the overlapping portion 26. The resist solution R is discharged alternately (see FIG. 9B). Accordingly, in the X direction, the resist solution droplets applied in the previous application step and the resist solution droplets applied in the subsequent application step are fused and integrated. The unevenness of the resist film in the direction can be suppressed, and a uniform resist film can be formed.

  In the same manner as described above, the discharge timing of the resist solution R from one of the adjacent nozzle holes 24 in the coating solution supply nozzle 23C, that is, the overlapping portion 26 is delayed by 1/2, and the resist solution from the nozzle holes 24 is delayed. By alternately discharging R and repeating the above operation to discharge the resist solution R over the entire surface of the substrate G, unevenness in the X and Y directions can be suppressed, and a resist film having a more uniform thickness Can be formed. In the final coating step, the end side of the coating liquid supply nozzle 23 is located outside the substrate G, and the discharge of the resist liquid R from the nozzle hole 24 is stopped.

<Fifth Embodiment>
FIG. 10 is a schematic perspective view showing an essential part of the fifth embodiment of the resist coating apparatus 20A according to the present invention, and FIG. 11 is a schematic plan view showing a coating film forming method of the coating liquid supply nozzle 23D in the fifth embodiment. FIG.

  In the resist coating apparatus 20A of the fifth embodiment, the end portions of a plurality of (for example, two) nozzle bodies 23d1, 23d2 in which a plurality of nozzle holes 24 having a wider pitch on the end portion side than the center portion side are arranged. Similar to the first to fourth embodiments, the superposed inkjet coating solution supply nozzle 23D is applied to the substrate G held on the mounting table 22 by the moving mechanism 25, for example, the first and second linear motors 25A and 25B. This is the case where the resist solution is supplied (discharged) while being folded back and moved in the direction from one end to the other end (X direction) and in the direction orthogonal to this (Y direction) to form the resist film uniformly.

In the fifth embodiment, the coating liquid supply nozzle 23D has a plurality of, for example, two nozzle bodies 23d1 and 23d2 formed in the same manner as in the first embodiment such that end portions thereof are overlapped in the X direction via the connecting member 56. The nozzle holes 24 in the end portions of the nozzle bodies 23d1 and 23d2, that is, the overlapping portion 26A of the nozzle itself and the overlapping portion 26 in the coating process, are arranged at the center of the nozzle bodies 23d1 and 23d2. The pitch is wider than, for example, twice . The coating liquid supply nozzle 23D formed in this way is the same as in the first to fourth embodiments, the first linear motor 25A as the first moving mechanism and the second linear motor as the second moving mechanism. The movement in the X and Y directions is controlled by 25B. In the fifth embodiment, the other parts are the same as those in the first embodiment, so the same parts are denoted by the same reference numerals and description thereof is omitted.

  Next, the operation | movement aspect of 5th Embodiment is demonstrated. First, when the substrate G that has been heat-treated by the thermal processing unit (TB) 31 is carried onto the mounting table 22 by a transfer arm (not shown), lift pins (not shown) penetrating the mounting table 22 rise and the substrate G Receive. Thereafter, the transfer arm is retracted outward from the mounting table 22. After receiving the substrate G, the lift pins are lowered and the substrate G is placed on the mounting table 22.

  Next, the first movement mechanism of the movement mechanism 25, for example, the first linear motor 25A, is driven by the control signal from the CPU 27 to move the coating liquid supply nozzle 23D from one end in the X direction of the substrate G toward the other end. The resist solution R is supplied or discharged from the nozzle hole 24 while moving. At this time, the end side of one nozzle body 23d1 of the coating liquid supply nozzle 23D is located outside the substrate G, and the discharge of the resist solution R from the nozzle hole 24 is stopped, and both the nozzle bodies 23d1, 23d2 are stopped. From the nozzle hole 24 on the end side of the overlapping portion 26A, a small amount, for example 1/2, is discharged from the supply amount, that is, the discharge amount of the resist solution R from the central nozzle hole 24 of each nozzle body 23d1, 23d2. A resist solution R is applied (see FIG. 11). Further, from the nozzle hole 24 on the end side of the other nozzle body 23d2, a small amount, for example 1/2, is discharged from the supply amount, that is, the discharge amount of the resist solution R from the central nozzle hole 24 of each nozzle body 23d1, 23d2. Then, the resist solution R is applied.

  When the coating liquid supply nozzle 23D reaches the other end of the substrate G, the driving of the first linear motor 25A is stopped, and the discharge of the resist liquid R from the coating liquid supply nozzle 23D is stopped or remains discharged. Then, the second linear motor 25B, which is the second moving mechanism, is driven to move the coating liquid supply nozzle 23D in the Y direction, and is positioned outside the substrate of one nozzle body 23d1 of the coating liquid supply nozzle 23D. The other end side is overlaid on the end side position of the other nozzle body 23d2 applied first. In this state, the first linear motor 25A is driven again to discharge the resist solution R from the nozzle hole 24 while moving the coating solution supply nozzle 23D from the other end of the folded substrate G toward one end. At this time, in the overlapping portion 26A of the coating liquid supply nozzle 23D itself and the overlapping portion 26 with the previous process, from the nozzle hole 24 of the nozzle bodies 23d1, 23d2, from the nozzle hole 24 at the center of the nozzle bodies 23d1, 23d2. The resist solution R is applied by discharging a small amount, for example, 1/2 of the supply amount of the resist solution R of the resist solution R, so that it is almost the same as the discharge amount of the resist solution R discharged from the central nozzle hole 24. A substantially uniform resist film is formed.

  After the coating liquid supply nozzle 23D reaches one end of the substrate G, the above operation is repeated again to discharge the resist solution R over the entire surface of the substrate G, thereby forming a resist film with a uniform film thickness. . In the final coating step, the end of the other nozzle body 23d2 of the coating liquid supply nozzle 23D is located outside the substrate G, and the discharge of the resist liquid R from the nozzle hole 24 is stopped.

  In the above description, the case where the coating liquid supply nozzle 23D is formed by superimposing the two nozzle bodies 23d1, 23d2 has been described, but the coating liquid is also superposed by superposing three or more nozzle bodies 23d1, 23d2,. It is also possible to form the supply nozzle 23D. If the number of nozzle bodies 23d1, 23d2,... Is increased in this way, the number of coating steps can be reduced, so that the coating process can be performed efficiently.

<Sixth Embodiment>
FIG. 12 is a schematic plan view showing a coating film forming method of the coating liquid supply nozzle 23E in the sixth embodiment of the present invention.

  In the sixth embodiment, in place of the nozzle bodies 23d1 and 23d2 of the fifth embodiment, a plurality of, for example, two nozzle bodies 23e1 and 23e2 in which a plurality of nozzle holes 24 having an equal pitch are arranged are overlapped in the X direction. A supply nozzle 23E is formed, and a resist is received from one of the end portions of the nozzle bodies 23e1 and 23e2, that is, the overlapping portion 26A of the nozzle itself and the adjacent nozzle hole 24 in the overlapping portion 26 in the coating process by a control signal from the CPU 27. This is a case where the uniformity of the resist film can be improved by supplying (discharging) the liquid and reducing the supply amount of the coating liquid of the overlapping portions 26 and 26A. Note that in the sixth embodiment, the other parts are the same as those in the first to fifth embodiments, so the same parts are denoted by the same reference numerals and description thereof is omitted.

  In the sixth embodiment, a first moving mechanism such as a first linear motor 25A is driven by a control signal from the CPU 27 to move the coating liquid supply nozzle 23E from one end to the other end of the substrate G in the X direction. When the resist solution R is supplied (discharged) from the nozzle hole 24, the end side of the one nozzle body 23e1 of the coating solution supply nozzle 23E is located outside the substrate G, and the resist solution R is discharged from the nozzle hole 24. Is stopped (indicated by black circles in the drawing), and the resist solution R is ejected in a substantially staggered manner (indicated by white circles in the drawing) from one of the adjacent nozzle holes 24 in the overlapping portion 26A of the nozzle bodies 23e1, 23e2. Then, a resist solution R is applied (see FIG. 12). Thereby, the resist film in the overlapping portion 26A is formed substantially uniformly with the film thickness of the resist film formed other than the overlapping portion 26A. Further, the resist solution R is discharged from one of the adjacent nozzle holes 24 on the end side of the other nozzle body 23e2, and the resist solution R is applied.

  When the coating liquid supply nozzle 23E reaches the other end of the substrate G, the driving of the first linear motor 25A is stopped, and the discharge of the resist liquid R from the coating liquid supply nozzle 23E is stopped or remains discharged. Then, the second linear motor 25B, which is the second moving mechanism, is driven to move the coating liquid supply nozzle 23E in the Y direction, and is located outside the substrate of one nozzle body 23e1 of the coating liquid supply nozzle 23E. The end side is overlapped with the end side position of the other nozzle body 23e2 previously applied. In this state, the first linear motor 25A is driven again to discharge the resist solution R from the nozzle hole 24 while moving the coating solution supply nozzle 23E from the other end of the folded substrate G toward one end. At this time, in the overlapping portion 26A of the coating liquid supply nozzle 23D itself and the overlapping portion 26 with the previous process, the resist liquid R is ejected from one of the adjacent nozzle holes 24 and the resist liquid R is applied. The discharge amount of the resist solution R discharged from the central nozzle hole 24 is almost the same, and a substantially uniform resist film is formed.

  After the coating liquid supply nozzle 23E reaches one end of the substrate G, the above operation is repeated again to discharge the resist liquid R over the entire surface of the substrate G, whereby a resist film having a uniform film thickness can be formed. . In the final coating process, the end of the other nozzle body 23e2 of the coating liquid supply nozzle 23E is located outside the substrate G, and the discharge of the resist liquid R from the nozzle hole 24 is stopped.

<Seventh embodiment>
FIG. 13 is a schematic plan view showing a coating film forming method of the coating liquid supply nozzle 23F in the seventh embodiment of the present invention.

In the seventh embodiment, instead of the nozzle bodies 23d1 and 23d2 of the fifth embodiment, a plurality of nozzle bodies 24, for example, two nozzle bodies 23f1 and 23f2 in which a plurality of nozzle holes 24 of equal pitch are arranged are overlapped in the X direction. The pitch of the nozzle holes 24 in the overlapping portion 26A is deviated by a half pitch, and the supply amount of the resist solution R is substantially halved, for example, halved. This is a case where the uniformity of the resist film can be improved by reducing the supply amount (discharge amount) of the resist solution R of the overlapping portion 26 in the coating process. In this case, the pitch of the nozzle holes 24 on the end side of the nozzle bodies 23f1, 23f2 is wider than the pitch of the nozzle holes 24 at the center of the nozzle bodies 23f1, 23f2, for example, twice , so that the overlapping portions 26, 26A The supply amount (discharge amount) of the resist solution R is reduced. In the seventh embodiment, the other parts are the same as those in the first to sixth embodiments. Therefore, the same parts are denoted by the same reference numerals and the description thereof is omitted.

  In the seventh embodiment, a first moving mechanism, for example, a first linear motor 25A is driven by a control signal from the CPU 27 to move the coating liquid supply nozzle 23F from one end to the other end in the X direction of the substrate G. When the resist solution R is supplied (discharged) from the nozzle hole 24, the end side of the one nozzle body 23f1 of the coating solution supply nozzle 23F is located outside the substrate G, and the resist solution R is discharged from the nozzle hole 24. Is stopped (indicated by black circles in the drawing), and from the nozzle holes 24 that are offset by half pitch in the overlapping portion 26A of the nozzle bodies 23f1 and 23f2, the nozzle holes 24 from the center of the nozzle bodies 23f1 and 23f2 A small amount, for example 1/2, of the supply amount of the resist solution R, that is, a discharge amount, is discharged in a staggered manner, and the resist solution R is applied (see FIG. 13). Thereby, the resist film in the overlapping portion 26A is formed substantially uniformly with the film thickness of the resist film formed other than the overlapping portion 26A. Further, from the nozzle hole 24 on the end side of the other nozzle body 23f2, a small amount, for example 1/2, is discharged from the supply amount, that is, the discharge amount of the resist solution R from the central nozzle hole 24 of each nozzle body 23f1, 23f2. Then, the resist solution R is applied.

  When the coating liquid supply nozzle 23F reaches the other end of the substrate G, the driving of the first linear motor 25A is stopped, and the discharge of the resist liquid R from the coating liquid supply nozzle 23F is stopped or remains discharged. Then, the second linear motor 25B, which is the second moving mechanism, is driven to move the coating liquid supply nozzle 23F in the Y direction, and is positioned on the substrate outer side of one nozzle body 23f1 of the coating liquid supply nozzle 23F. The end side is overlapped with the end side position of the other nozzle body 23f2 applied first. In this state, the first linear motor 25A is driven again to discharge the resist solution R from the nozzle hole 24 while moving the coating solution supply nozzle 23F from the other end of the folded substrate G toward one end. At this time, in the overlapping portion 26A of the coating liquid supply nozzle 23F itself and the overlapping portion 26 with the previous process, the resist liquid R is ejected from the nozzle holes 24 shifted by a half pitch, and the resist liquid R is applied. The discharge amount of the resist solution R discharged from the central nozzle hole 24 is almost the same, and a substantially uniform resist film is formed.

  After the coating liquid supply nozzle 23F reaches one end of the substrate G, the above operation is repeated again to discharge the resist liquid R over the entire surface of the substrate G, whereby a resist film with a uniform thickness can be formed. . In the final coating process, the end of the other nozzle body 23f2 of the coating liquid supply nozzle 23F is located outside the substrate G, and the discharge of the resist liquid R from the nozzle hole 24 is stopped.

<Eighth Embodiment>
FIG. 14 is a schematic plan view showing a coating film forming method for the coating liquid supply nozzle 23G in the eighth embodiment of the present invention.

  In the eighth embodiment, instead of the nozzle bodies 23d1 and 23d2 of the fifth embodiment, a plurality of nozzle bodies 24g, for example two nozzle bodies 23g1 and 23g2, in which a plurality of nozzle holes 24 of equal pitch are arranged are overlapped in the X direction, In the overlapping portion 26A, the supply (discharge) timing (T) of the resist solution R from one of the nozzle holes 24 adjacent in the arrangement direction is delayed by 1/2 (T / 2), and the nozzle bodies 23g1, 23g2 are overlapped. The resist solution R is alternately supplied from one of the adjacent nozzle holes 24 in the mating portion 26A to reduce the supply amount (discharge amount) of the coating solution at the overlapping portion of the nozzle bodies 23g1 and 23g2, and the coating solution. The liquid droplets of the resist solution R discharged later merge with the droplets of the resist solution R applied earlier in the moving direction (X direction) of the supply nozzle 23G. The uniformity of the resist film can be improved by suppressing unevenness of the coating film in both the moving direction (X direction) of the coating liquid supply nozzle 23G in the portions 26 and 26A and the direction orthogonal to the moving direction (Y direction). This is the case. In the eighth embodiment, the other parts are the same as those in the first to seventh embodiments, so the same parts are denoted by the same reference numerals and the description thereof is omitted.

  In the eighth embodiment, a first moving mechanism such as the first linear motor 25A is driven by a control signal from the CPU 27 to move the coating liquid supply nozzle 23G from one end to the other end of the substrate G in the X direction. The resist solution R is supplied (discharged) from the nozzle hole 24. At this time, one end of the nozzle body 23g1 of the coating liquid supply nozzle 23G is located outside the substrate G, and the discharge of the resist solution R from the nozzle hole 24 is stopped, and the nozzle bodies 23g1 and 23g2 are overlapped. The supply (discharge) timing of the resist solution R from one of the adjacent nozzle holes 24 in the portion 26A is delayed by 1/2, and the supply (discharge) of the resist solution R from one of the adjacent nozzle holes 24 is alternately performed. The resist solution supply amount (discharge amount) of the overlapping portion 26A of the nozzle bodies 23g1, 23g2 is made small. Thereby, the droplets of the resist solution R discharged later can be fused between the droplets of the resist solution R discharged earlier, so that the film thickness of the resist film other than the overlapping portion 26A is made substantially uniform. be able to. Accordingly, it is possible to suppress unevenness of the coating film in both the moving direction (X direction) of the coating liquid supply nozzle 23G in the overlapping portions 26 and 26A and the direction (Y direction) perpendicular thereto.

  That is, as shown in FIG. 14, the supply (discharge) timing of the resist solution R is discharged from one of the adjacent nozzle holes 24 in the overlapping portion 26A of both nozzle bodies 23g1, 23g2 by 1/2, and adjacent. The resist solution R is discharged from one of the nozzle holes 24 to be supplied, and the supply (discharge) of the resist solution R from the nozzle holes 24 in the overlapping portion 26A is alternately performed (see circles 1 and 2 in FIG. 14), The droplet of the resist solution R discharged earlier and the droplet of the resist solution R discharged later in the overlapping portion 26A are merged to move the coating solution supply nozzle 23G in the moving direction (X direction) and orthogonal thereto. Unevenness of the coating film in both directions (Y direction) can be suppressed.

  Note that also on the end side of the other nozzle body 23g2, the supply (discharge) timing of the resist solution R from one of the adjacent nozzle holes 24 is delayed by 1/2, and from one of the adjacent nozzle holes 24. Supply (discharge) of the resist solution R is performed.

  When the coating liquid supply nozzle 23G reaches the other end of the substrate G as described above, the driving of the first linear motor 25A is stopped, and the discharge of the resist liquid R from the coating liquid supply nozzle 23G is stopped, or The second linear motor 25B, which is the second moving mechanism, is driven in a state of being discharged, the coating liquid supply nozzle 23G is moved in the Y direction, and the substrate body of one nozzle body 23g1 of the coating liquid supply nozzle 23G is moved outward. The end side that was located on the side is superposed on the end side position of the other nozzle body 23g2 that has been applied first. In this state, the first linear motor 25A is driven again to discharge the resist solution R from the nozzle hole 24 while moving the coating solution supply nozzle 23G from the other end of the substrate G toward the one end. At this time, in the overlapping portion 26A of the coating liquid supply nozzle 23G itself and the overlapping portion 26 with the previous process, the supply (discharge) timing of the resist solution R from one of the adjacent nozzle holes 24 is 1 / as described above. The resist solution R is supplied (discharged) from one of the adjacent nozzle holes 24 and applied with the resist solution R, and the discharge amount of the resist solution R discharged from the central nozzle hole 24 is A substantially uniform resist film is formed which is substantially the same.

  After the coating liquid supply nozzle 23G reaches one end of the substrate G, the above operation is repeated again to discharge the resist solution R over the entire surface of the substrate G, whereby a resist film having a uniform thickness can be formed. . In the final coating process, the end of the other nozzle body 23g2 of the coating liquid supply nozzle 23G is positioned outside the substrate G, and the discharge of the resist liquid R from the nozzle hole 24 is stopped.

<Other embodiments>
In the above-described embodiment, the case where the coating film forming apparatus according to the present invention is applied to a resist coating processing apparatus has been described. However, the present invention can also be applied to apparatuses other than the resist coating processing apparatus, for example, development processing apparatuses.

1 is a schematic plan view showing a resist coating and developing apparatus for an LCD glass substrate to which a coating film forming apparatus according to the present invention is applied. It is a schematic perspective view which shows the principal part of 1st Embodiment of the resist coating processing apparatus to which the said coating film forming apparatus is applied. It is the schematic perspective view (a) which shows the coating liquid supply nozzle in 1st Embodiment, and explanatory drawing (b) which shows the arrangement | sequence of the nozzle hole of a coating liquid supply nozzle. It is a schematic sectional drawing of the coating liquid supply nozzle in this invention. It is a schematic plan view which shows the coating film formation method of the coating liquid supply nozzle of 1st Embodiment. It is a schematic plan view which shows the coating film formation method of the coating liquid supply nozzle in 2nd Embodiment of this invention. It is a schematic plan view which shows the coating film formation method of the coating liquid supply nozzle in 3rd Embodiment of this invention. It is a schematic sectional drawing which shows the application state by the coating liquid supply nozzle in 3rd Embodiment. It is a schematic plan view which shows the coating film formation method of the coating liquid supply nozzle in 4th Embodiment of this invention. It is a schematic perspective view which shows the principal part of 5th Embodiment of the resist coating processing apparatus to which the coating film forming apparatus which concerns on this invention is applied. It is a schematic plan view which shows the coating film formation method of the coating liquid supply nozzle in 5th Embodiment of this invention. It is a schematic plan view which shows the coating film formation method of the coating liquid supply nozzle in 6th Embodiment of this invention. It is a schematic plan view which shows the coating film formation method of the coating liquid supply nozzle in 7th Embodiment of this invention. It is a schematic plan view which shows the coating film formation method of the coating liquid supply nozzle in 8th Embodiment of this invention.

G Glass substrate for LCD (substrate to be processed)
22 Mounting table (holding means)
23, 23A to 23G Coating solution supply nozzle 23d1, 23d2 to 23g1, 23g2 Nozzle body 24 Nozzle hole 25 Moving mechanism 25A First linear motor (first moving mechanism)
25B Second linear motor (second moving mechanism)
26, 26A Superposition part 27 CPU (control means)

Claims (8)

A coating film forming method for forming a coating film by supplying a coating liquid to a substrate to be processed while relatively moving the substrate to be processed and an inkjet type coating liquid supply nozzle having a plurality of nozzle holes arranged at an appropriate pitch Because
Said supplying said coating solution coating liquid by moving the supply nozzle superposed ends of the plurality of nozzle element with respect to the other end from one end of the substrate to be processed, this time, other than the overlapped portion of the nozzle body arranging the nozzle holes at equal pitches, and 2 times wider than the pitch of nozzle holes other than the portion overlapped the pitch of overlapping portions of the nozzle hole of the nozzle body, it is supplied from the nozzle holes of the superposed section of the nozzle body The coating film forming method is characterized in that the amount of the coating liquid to be applied is halved compared to the amount supplied from the nozzle holes other than the overlapping portion so that the film thickness of the coating film is uniform. . A coating film forming method for forming a coating film by supplying a coating liquid to a substrate to be processed while relatively moving the substrate to be processed and an inkjet type coating liquid supply nozzle having a plurality of nozzle holes arranged at an appropriate pitch Because
The coating liquid supply nozzle in which the ends of the plurality of nozzle bodies are overlapped with each other from one end to the other end of the substrate to be processed is moved to supply the coating liquid. The coating liquid is supplied from one of the nozzle holes adjacent to each other in the overlapping portion, and the supply amount of the coating liquid in the overlapping portion of each nozzle body is determined from the nozzle holes other than the overlapping portion. A coating film forming method characterized in that the film thickness of the coating film is made uniform by halving the supplied amount. A coating film forming method for forming a coating film by supplying a coating liquid to a substrate to be processed while relatively moving the substrate to be processed and an inkjet type coating liquid supply nozzle having a plurality of nozzle holes arranged at an appropriate pitch Because
By moving the coating liquid supply nozzle superposed ends of the plurality of nozzle element with respect to the other end from one end of the substrate to be processed by supplying a coating solution, this time, other than the overlapping portions of the nozzle body The nozzle holes are arranged at an equal pitch, the pitch of the nozzle holes in the overlapping portion is twice as large as the pitch of the nozzle holes other than the overlapping portion, and the pitch of the nozzle holes in the overlapping portion is biased by a half pitch, The supply amount of the coating liquid in the overlapping portion of each nozzle body is halved compared to the amount supplied from the nozzle holes other than the overlapping portion, so that the coating film thickness is uniform. The coating film formation method characterized by these. A coating film forming method for forming a coating film by supplying a coating liquid to a substrate to be processed while relatively moving the substrate to be processed and an inkjet type coating liquid supply nozzle having a plurality of nozzle holes arranged at an appropriate pitch Because
The coating liquid supply nozzle in which the ends of the plurality of nozzle bodies are overlapped with each other from one end to the other end of the substrate to be processed is moved to supply the coating liquid. The supply timing of the coating liquid from one of the nozzle holes adjacent to the arrangement direction in the overlapping portion arranged in the pitch is delayed by 1/2 and the coating liquid from one of the adjacent nozzle holes in the overlapping portion of each nozzle body Are alternately supplied, the supply amount of the coating liquid in the overlapping portion of each nozzle body is halved compared to the amount supplied from the nozzle holes other than the overlapping portion, and the tip of the overlapping portion A coating film forming method characterized in that the coating liquid droplets supplied to the substrate and the coating liquid droplets supplied later are fused to make the coating film uniform. Holding means for holding the substrate to be processed;
Inkjet system in which the nozzle holes on the center side are arranged at equal pitches, and the end parts of a plurality of nozzle bodies in which the nozzle holes on the end side are arranged twice wider than the pitch on the center side are arranged side by side A coating liquid supply nozzle of
A moving mechanism for relatively moving the coating liquid supply nozzle from one end of the substrate to be processed held by the holding means to the other end and a direction orthogonal thereto;
The amount of coating liquid supplied from the nozzle holes in the overlapping portion of each nozzle body is controlled from the nozzle holes other than the overlapping portion while controlling the moving mechanism so as to make the coating film thickness uniform. And a control means that can be controlled to ½ compared to the above. Holding means for holding the substrate to be processed;
An inkjet-type coating liquid supply nozzle in which ends of a plurality of nozzle bodies arranged with a plurality of nozzle holes of equal pitch are overlapped;
A moving mechanism for relatively moving the coating liquid supply nozzle from one end of the substrate to be processed held by the holding means to the other end and a direction orthogonal thereto;
The moving mechanism is controlled to make the coating film thickness uniform, and the coating liquid is supplied from one of the adjacent nozzle holes in the overlapping portion of each nozzle body so that the overlapping portion of each nozzle body is And a control unit capable of controlling the supply amount of the coating liquid to be ½ compared to the amount supplied from the nozzle holes other than the overlapping portion . Holding means for holding the substrate to be processed;
The nozzle holes on the center side are arranged at an equal pitch, and the ends of the plurality of nozzle bodies in which the nozzle holes on the end side are two times wider than the pitch on the center side are overlapped and overlapped. An inkjet type coating liquid supply nozzle in which the pitch of the nozzle holes in the mating portion is biased by a half pitch ;
A moving mechanism for relatively moving the coating liquid supply nozzle from one end of the substrate to be processed held by the holding means to the other end and a direction orthogonal thereto;
Control means capable of controlling the amount of the coating liquid supplied from the nozzle hole in the overlapping portion of each nozzle body to ½ compared to the amount supplied from the nozzle hole other than the overlapping portion , A coating film forming apparatus. Holding means for holding the substrate to be processed;
An inkjet-type coating liquid supply nozzle in which ends of a plurality of nozzle bodies arranged with a plurality of nozzle holes of equal pitch are overlapped;
A moving mechanism for relatively moving the coating liquid supply nozzle from one end of the substrate to be processed held by the holding means to the other end and a direction orthogonal thereto;
The moving mechanism is controlled to make the coating film uniform, the supply timing of the coating liquid from one of the nozzle holes adjacent in the arrangement direction in the overlapping portion of the nozzle bodies is delayed by 1/2, and each nozzle body The application liquid is alternately supplied from one of the adjacent nozzle holes in the overlapping portion of each of the overlapping portions, and the supply amount of the coating liquid in the overlapping portion of each nozzle body is supplied from the nozzle holes other than the overlapping portion. And a control means that can be controlled so as to fuse the droplets of the coating liquid supplied earlier and the droplets of the coating liquid supplied later in the overlapping portion , The coating film forming apparatus characterized by the above-mentioned.

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