JP4334187B2 - Circuit device manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a circuit device, and more particularly to a method of manufacturing a thin circuit device that does not require a support substrate.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a circuit device set in an electronic device is used in a mobile phone, a portable computer, and the like.
[0003]
For example, a semiconductor device as an example of a circuit device will be described. As a general semiconductor device, there is a package type semiconductor device sealed by a conventional transfer mold. This semiconductor device is mounted on a printed circuit board PS as shown in FIG.
[0004]
In this package type semiconductor device, the periphery of the semiconductor chip 2 is covered with a resin layer 3, and lead terminals 4 for external connection are led out from the side of the resin layer 3.
[0005]
However, the package type semiconductor device 1 has lead terminals 4 protruding from the resin layer 3 and has a large overall size, which does not satisfy the miniaturization, thickness reduction, and weight reduction.
[0006]
Therefore, various companies have competed to develop various structures to achieve miniaturization, thinning, and weight reduction, and recently called CSP (chip size package), wafer scale CSP equivalent to chip size, or chip size A slightly larger CSP has been developed.
[0007]
FIG. 13 shows a CSP 6 that employs a glass epoxy substrate 5 as a support substrate and is slightly larger than the chip size. Here, description will be made assuming that the transistor chip T is mounted on the glass epoxy substrate 5.
[0008]
A first electrode 7, a second electrode 8 and a die pad 9 are formed on the surface of the glass epoxy substrate 5, and a first back electrode 10 and a second back electrode 11 are formed on the back surface. The first electrode 7 and the first back electrode 10 are electrically connected to the second electrode 8 and the second back electrode 11 through the through hole TH. Further, the bare transistor chip T is fixed to the die pad 9, the emitter electrode of the transistor and the first electrode 7 are connected via the fine metal wire 12, and the base electrode of the transistor and the second electrode 8 are connected to the fine metal wire 12. Connected through. Further, a resin layer 13 is provided on the glass epoxy substrate 5 so as to cover the transistor chip T.
[0009]
The CSP 6 employs the glass epoxy substrate 5, but unlike the wafer scale CSP, the extending structure from the chip T to the backside electrodes 10 and 11 for external connection is simple, and has an advantage that it can be manufactured at low cost.
[0010]
The CSP 6 is mounted on a printed circuit board PS as shown in FIG. The printed circuit board PS is provided with electrodes and wirings constituting an electric circuit, and the CSP 6, the package type semiconductor device 1, the chip resistor CR, the chip capacitor CC, and the like are electrically connected and fixed.
[0011]
And the circuit comprised with this printed circuit board is attached in various sets.
[0012]
Next, a method for manufacturing the CSP will be described with reference to FIGS.
[0013]
First, a glass epoxy substrate 5 is prepared as a base material (support substrate), and Cu foils 20 and 21 are pressure-bonded to both surfaces via an insulating adhesive. (See FIG. 14A above)
Subsequently, the Cu foils 20, 21 corresponding to the first electrode 7, the second electrode 8, the die pad 9, the first back electrode 10, and the second back electrode 11 are covered with an etching resistant resist 22, and Cu The foils 20 and 21 are patterned. Patterning may be performed separately for the front and back sides (see FIG. 14B above).
Subsequently, a hole for the through hole TH is formed in the glass epoxy substrate by using a drill or a laser, and the hole is plated to form the through hole TH. The first electrode 7 and the first back electrode 10, and the second electrode 8 and the second back electrode 10 are electrically connected through the through hole TH. (See FIG. 14C above)
Furthermore, although omitted in the drawings, the first electrode 7 and the second electrode 8 that become bonding posts are plated with Au, and the die pad 9 that becomes a die bonding post is plated with Au, and the transistor chip T is die bonded. To do.
[0014]
Finally, the emitter electrode of the transistor chip T and the first electrode 7, the base electrode of the transistor chip T and the second electrode 8 are connected via the metal thin wire 12 and covered with the resin layer 13. (See FIG. 14D above)
With the above manufacturing method, a CSP type electric element employing the support substrate 5 is completed. This manufacturing method is the same even if a flexible sheet is adopted as the support substrate.
[0015]
On the other hand, a manufacturing method employing a ceramic substrate is shown in the flow of FIG. After preparing the ceramic substrate as the support substrate, through holes are formed, and then the front and back electrodes are printed and sintered using a conductive paste. After that, it is the same as the manufacturing method of FIG. 14 until the resin layer of the pre-manufacturing method is coated. There is a problem that can not be molded. Therefore, the potting resin is potted and cured, and then polishing for flattening the sealing resin is performed, and finally, the dicing apparatus is used for individual separation.
[0016]
[Problems to be solved by the invention]
In FIG. 13, a transistor chip T, connecting means 7 to 12 and a resin layer 13 are necessary components for electrical connection with the outside and protection of the transistor. It has been difficult to provide a circuit element that can be made thinner, thinner and lighter.
[0017]
Moreover, the glass epoxy board | substrate 5 used as a support substrate is an essentially unnecessary thing as mentioned above. However, since the electrodes are bonded together in the manufacturing method, it is adopted as a support substrate, and the glass epoxy substrate 5 cannot be eliminated.
[0018]
For this reason, the use of the glass epoxy substrate 5 increases the cost. Further, since the glass epoxy substrate 5 is thick, it becomes thick as a circuit element, and there is a limit to miniaturization, thickness reduction, and weight reduction.
[0019]
Furthermore, a glass epoxy substrate or a ceramic substrate always requires a through-hole forming process for connecting electrodes on both sides, and the manufacturing process becomes long and is not suitable for mass production.
[0020]
Furthermore, there has been a problem that a method for manufacturing the above-described small circuit device without being separated into individual circuit devices until the end has not been established.
[0021]
[Means for Solving the Problems]
In the method for manufacturing a circuit device according to the present invention, the mounting portion composed of a plurality of conductive patterns in which circuit elements are arranged is arranged in a matrix and sealed together with an insulating resin, and the arrangement of the insulating resin is performed. A step of preparing a block in which an alignment mark is formed on the inner side of the region and in a peripheral portion; a step of affixing the block to the adhesive sheet by contacting the insulating resin; and affixing the block to the adhesive sheet And the step of dicing the block with the alignment mark as a reference to separate the mounting portion into individual circuit devices.

[0022]
In the present invention, the conductive foil forming the conductive pattern is a starting material, and the conductive foil has a supporting function until the insulating resin is molded, and after the molding, the insulating resin has a supporting function. A board | substrate can be made unnecessary and the conventional subject can be solved.
[0023]
In the present invention, each block is processed with a strip-shaped conductive foil in the back surface conductive foil treatment after molding, and a plurality of blocks can be affixed to the pressure-sensitive adhesive sheet in subsequent steps such as measurement and dicing. The circuit device can be mass-produced and the conventional problems can be solved.
[0024]
DETAILED DESCRIPTION OF THE INVENTION
First, a method for manufacturing a circuit device of the present invention will be described with reference to FIG.
[0025]
The present invention provides a conductive foil for each block by preparing a conductive foil and forming a separation groove shallower than the thickness of the conductive foil in the conductive foil in a region excluding the conductive pattern forming at least a large number of circuit element mounting portions. A step of fixing circuit elements to each mounting portion of the desired conductive pattern, and covering the circuit elements of each mounting portion in a lump so as to fill the separation groove. The step of common molding with resin, and the conductive foil serving as a connecting portion for connecting at least the conductive pattern by removing at least the region of the conductive foil in the thickness portion where the separation groove is not provided. A step of selectively leaving, a step of separating the block from the connecting portion of the conductive foil, a step of affixing the insulating resin to the adhesive sheet with a plurality of the blocks abutting, Measuring the characteristics of the circuit elements of the mounting portions of the block in a state of being attached to the adhesive sheet; and mounting portions of the insulating resin of the block in a state of being attached to the adhesive sheet. And a step of separating by dicing every time.
[0026]
Although the flow shown in FIG. 1 does not coincide with the above-described process, the conductive pattern is formed by three flows of Cu foil, Ag plating, and half etching. The circuit element is fixed to each mounting portion and the electrodes of the circuit element and the conductive pattern are connected in two flows of die bonding and wire bonding. In the transfer mold flow, a common mold using an insulating resin is performed. In the flow of removing the rear Cu foil, the conductive foil in the thickness portion without the separation groove is etched. In the back surface processing flow, electrode processing of the conductive pattern exposed on the back surface is performed. In the block separation flow, each block is mechanically separated from the connecting portion of the conductive foil. In the flow of the adhesive sheet, a plurality of blocks are attached to the adhesive sheet. In the measurement flow, non-defective product discrimination and characteristic rank classification of circuit elements incorporated in each mounting part are performed. In the dicing flow, the insulating resin is separated into individual circuit elements by dicing.
[0027]
Below, each process of this invention is demonstrated with reference to FIGS. 2 to 5 show a process of forming a conductive pattern constituting the mounting portion in each block and fixing a circuit element on the conductive pattern.
[0028]
In the first step of the present invention, as shown in FIGS. 2 to 4, a conductive foil 60 is prepared, and at least the conductive foil 60 in the region excluding the conductive pattern 51 that forms a large number of mounting portions of the circuit elements 52 is conductive. The purpose is to form the separation groove 61 shallower than the thickness of the foil 60 to form the conductive pattern 51 for each block.
[0029]
In this step, first, a sheet-like conductive foil 60 is prepared as shown in FIG. 2A. The conductive foil 60 is selected in consideration of the adhesiveness, bonding property, and plating property of the brazing material. As the material, a conductive foil mainly composed of Cu, a conductive foil mainly composed of Al, or Fe is used. A conductive foil made of an alloy such as Ni is employed.
[0030]
The thickness of the conductive foil is preferably about 10 μm to 300 μm in consideration of the later etching, and here, a copper foil of 70 μm (2 ounces) is employed. However, it is basically good if it is 300 μm or more and 10 μm or less. As will be described later, it is only necessary that the separation groove 61 shallower than the thickness of the conductive foil 60 can be formed.
[0031]
In addition, the sheet-like conductive foil 60 is prepared by being wound into a roll with a predetermined width, for example, 45 mm, which may be conveyed to each step described later, or a strip-shaped cut into a predetermined size. The conductive foil 60 may be prepared and conveyed to each process described later.
[0032]
Specifically, as shown in FIG. 2B, 4 to 5 blocks 62 in which a large number of mounting portions are formed are arranged on a strip-shaped conductive foil 60 so as to be spaced apart. A slit 63 is provided between each block 62 to absorb the stress of the conductive foil 60 generated by the heat treatment in the molding process or the like. In addition, index holes 64 are provided at regular intervals at the upper and lower peripheral ends of the conductive foil 60, and are used for positioning in each step.
[0033]
Subsequently, a conductive pattern 51 for each block is formed.
[0034]
First, as shown in FIG. 3, a photoresist (etching-resistant mask) PR is formed on the Cu foil 60, and the photoresist PR is patterned so that the conductive foil 60 excluding the region to be the conductive pattern 51 is exposed. Then, as shown in FIG. 4A, the conductive foil 60 is selectively etched through the photoresist PR.
[0035]
The depth of the separation groove 61 formed by etching is, for example, 50 μm, and its side surface is a rough surface, so that the adhesiveness with the insulating resin 50 is improved.
[0036]
The side wall of the separation groove 61 is schematically illustrated as a straight line, but has a different structure depending on the removal method. This removal process can employ wet etching, dry etching, laser evaporation, and dicing. In the case of wet etching, ferric chloride or cupric chloride is mainly used as the etchant, and the conductive foil is dipped in the etchant or showered with the etchant. Since wet etching is generally non-anisotropic, the side surface has a curved structure.
[0037]
In the case of dry etching, etching can be performed anisotropically or non-anisotropically. At present, it is said that Cu cannot be removed by reactive ion etching, but it can be removed by sputtering. Etching can be anisotropic or non-anisotropic depending on sputtering conditions.
[0038]
Further, in the laser, the separation groove 61 can be formed by direct laser light irradiation. In this case, the side surface of the separation groove 61 is formed straight.
[0039]
In FIG. 3, a conductive film (not shown) having corrosion resistance to the etching solution may be selectively coated instead of the photoresist. If the conductive film is selectively deposited on the conductive path, this conductive film becomes an etching protective film, and the separation groove can be etched without employing a resist. Possible materials for this conductive film are Ag, Ni, Au, Pt, Pd, and the like. In addition, these corrosion-resistant conductive films have the feature that they can be used as they are as die pads and bonding pads.
[0040]
For example, the Ag coating adheres to Au and also to the brazing material. Therefore, if the Au coating is coated on the back surface of the chip, the chip can be thermocompression bonded to the Ag coating on the conductive path 51 as it is, and the chip can be fixed via a brazing material such as solder. Further, since an Au fine wire can be adhered to the Ag conductive film, wire bonding is also possible. Accordingly, there is an advantage that these conductive films can be used as they are as die pads and bonding pads.
[0041]
FIG. 4B shows a specific conductive pattern 51. This figure corresponds to an enlarged view of one of the blocks 62 shown in FIG. 2B. One of the portions painted in black is one mounting portion 65, which constitutes the conductive pattern 51. A large number of mounting portions 65 are arranged in a matrix of 5 rows and 10 columns in one block 62. The same conductive pattern 51 is provided every 65. A frame-like pattern 66 is provided around each block, and an alignment mark 67 at the time of dicing is provided inside the pattern slightly apart from the frame-like pattern 66. The frame-like pattern 66 is used for fitting with a mold, and has a function of reinforcing the insulating resin 50 after the back surface etching of the conductive foil 60.
[0042]
In the second step of the present invention, as shown in FIG. 5, the circuit element 52 is fixed to each mounting portion 65 of the desired conductive pattern 51, and the electrode of the circuit element 52 of each mounting portion 65 and the desired conductive pattern 51. It is to form connection means for electrically connecting the two.
[0043]
The circuit element 52 is a semiconductor element such as a transistor, a diode or an IC chip, or a passive element such as a chip capacitor or a chip resistor. Although the thickness is increased, face-down semiconductor elements such as CSP and BGA can also be mounted.
[0044]
Here, a bare transistor chip 52A is die-bonded to a conductive pattern 51A, and an emitter electrode and a conductive pattern 51B, and a base electrode and a conductive pattern 51B are fixed by ball bonding by thermocompression bonding or wedge bonding by ultrasonic waves. It is connected via 55A. Reference numeral 52B denotes a chip capacitor or a passive element, which is fixed with a brazing material such as solder or a conductive paste 55B.
[0045]
In this step, since a large number of conductive patterns 51 are integrated in each block 62, there is an advantage that the circuit element 52 can be fixed and wire bonded extremely efficiently.
[0046]
As shown in FIG. 6, the third step of the present invention is to collectively cover the circuit elements 52 of the mounting portions 63 and to perform common molding with the insulating resin 50 so that the separation grooves 61 are filled. .
[0047]
In this step, as shown in FIG. 6A, the insulating resin 50 completely covers the circuit elements 52A, 52B and the plurality of conductive patterns 51A, 51B, 51C, and the insulating resin is formed in the separation grooves 61 between the conductive patterns 51. The conductive patterns 51A, 51B, 51C filled with 50 are fitted into the curved structures on the side surfaces and firmly bonded. The conductive pattern 51 is supported by the insulating resin 50.
[0048]
Further, this step can be realized by transfer molding, injection molding, or dipping. As the resin material, a thermosetting resin such as an epoxy resin can be realized by transfer molding, and a thermoplastic resin such as polyimide resin or polyphenylene sulfide can be realized by injection molding.
[0049]
Furthermore, when performing transfer molding or injection molding in this step, each block 62 has a mounting portion 63 placed in one common mold as shown in FIG. 6B, and one insulating resin 50 is common to each block. Mold. For this reason, compared with the method of molding each mounting part individually as in the case of a conventional transfer mold or the like, the amount of resin can be greatly reduced, and the mold can be shared.
[0050]
The thickness of the insulating resin 50 coated on the surface of the conductive foil 60 is adjusted so that about 100 μm is coated from the top of the bonding wire 55A of the circuit element 52. This thickness can be increased or decreased in consideration of strength.
[0051]
The feature of this step is that the conductive foil 60 that becomes the conductive pattern 51 becomes a support substrate until the insulating resin 50 is covered. Conventionally, as shown in FIG. 12, the conductive paths 7 to 11 are formed by using the support substrate 5 that is not originally required, but in the present invention, the conductive foil 60 that becomes the support substrate is necessary as an electrode material. Material. Therefore, there is a merit that the work can be performed with the constituent materials omitted as much as possible, and the cost can be reduced.
[0052]
Further, since the separation groove 61 is formed shallower than the thickness of the conductive foil, the conductive foil 60 is not individually separated as the conductive pattern 51. Therefore, the sheet-like conductive foil 60 can be handled as a unit, and when the insulating resin 50 is molded, it has a feature that the work of transporting to the mold and mounting to the mold becomes very easy.
[0053]
In the fourth step of the present invention, as shown in FIG. 7, at least the region provided with the conductive pattern 51 of the block 62 of the conductive foil 60 in the thickness portion where the separation groove 61 is not provided is removed, and the blocks 62 are connected. The purpose is to selectively leave the conductive foil 60 to be the connecting portion 90.
[0054]
In this step, as shown in FIG. 7A, at least the region 91 where the conductive pattern 51 of each block 62 is provided on the back surface of the conductive foil 60, and the peripheral end portion of the insulating resin 50 is overlaid. Thereafter, the exposed conductive foil 60 is showered with an etchant, and the region 91 provided with the conductive pattern 51 is selectively wet-etched to expose the conductive pattern 51.
[0055]
FIG. 7B shows a cross-sectional view after completion of the above-described wet etching. The upper and lower circumferential ends of the conductive foil 60 and the portions provided with the slits 63 of the respective blocks 62 remain as the connecting portions 90 without etching the conductive foil 60, Has the function of maintaining the state as it is. Each block 62 can be taken out of the etching apparatus together with the connecting portion 90 by the function of the connecting portion 90.
[0056]
In this step, the conductive foil 60 is selectively wet-etched in the region where the conductive pattern 51 is provided until the insulating resin 50 indicated by the dotted line in FIG. 6 is exposed. As a result, the conductive pattern 51 having a thickness of about 40 μm is separated and the back surface of the conductive pattern 51 is exposed to the insulating resin 50. That is, the surface of the insulating resin 50 filled in the separation groove 61 and the surface of the conductive pattern 51 are substantially coincident with each other. Accordingly, since the circuit device 53 of the present invention does not have a step as in the conventional backside electrodes 10 and 11 shown in FIG. 12, the circuit device 53 can be self-aligned by moving horizontally with the surface tension of solder or the like during mounting. Have.
[0057]
Further, the back surface treatment of the conductive pattern 51 is performed to obtain the final structure shown in FIG. That is, if necessary, a conductive material such as solder is applied to the exposed conductive pattern 51 to form the back electrodes 56A, 56B, and 56C, thereby completing the circuit device.
[0058]
The fifth step of the present invention is to separate the block 62 from the connecting portion 90 of the conductive foil 60 as shown in FIG. 7B.
[0059]
In this step, each block 62 connected by the connecting portion 90 is pressed so as to push up from the connecting portion 90 side as indicated by an arrow, and the adhesive surface between the connecting portion 90 and the insulating resin 50 is mechanically peeled off to block each block. 62 is separated. Therefore, a special cutting die is not necessary in this step, and there is an advantage that work can be performed by a very simple method.
[0060]
The sixth step of the present invention is to affix the plurality of blocks 62 to the adhesive sheet 80 with the insulating resin in contact with each other as shown in FIG.
[0061]
After etching the back surface of the conductive foil 60 in the previous step, each block 62 is separated from the conductive foil 60.
[0062]
In this process, the periphery of the pressure-sensitive adhesive sheet 80 is pasted on a stainless steel ring-shaped metal frame 81, and the central portion of the pressure-sensitive adhesive sheet 80 is provided with an interval so that the four blocks 62 do not hit the blade during dicing. The insulating resin 50 is abutted and attached. A UV sheet (manufactured by Lintec Corporation) is used as the adhesive sheet 80, but each block 62 is an insulating resin 50 and has mechanical strength, so that even an inexpensive dicing sheet can be used.
[0063]
In the seventh step of the present invention, as shown in FIG. 10, the characteristics of the circuit element 52 of each mounting portion 65 of each block 62 molded together with the insulating resin 50 in a state of being attached to the adhesive sheet 80. It is to measure.
[0064]
As shown in FIG. 10, the back surface of the conductive pattern 51 is exposed on the back surface of each block 62, and the mounting portions 65 are arranged in a matrix exactly the same as when the conductive pattern 51 is formed. A probe 68 is applied to the back surface electrode 56 exposed from the insulating resin 50 of the conductive pattern 51, and the characteristic parameters and the like of the circuit elements 52 of each mounting portion 65 are individually measured to determine whether the product is defective or not. Mark with magnetic ink.
[0065]
In this step, since the circuit devices 53 of the mounting portions 65 are integrally supported by the insulating resin 50 for each block 62, they are not individually separated. Accordingly, the plurality of blocks 62 attached to the adhesive sheet 80 are vacuum-adsorbed on the tester mounting table, and the pitch is fed in the vertical and horizontal directions as indicated by the arrows for each block 62 by the size of the mounting portion 65. By doing so, the circuit device 53 of each mounting part 65 of the block 62 can be measured very quickly and in large quantities. That is, it is possible to eliminate the need for the front and back of the circuit device and the recognition of the position of the electrodes, which were necessary in the past, and to process a plurality of blocks 62 simultaneously, so that the measurement time can be greatly shortened.
[0066]
As shown in FIG. 11, the eighth step of the present invention is to separate the insulating resin 50 of the block 62 by dicing for each mounting portion 65 in a state of being attached to the adhesive sheet 80.
[0067]
In this step, the plurality of blocks 62 attached to the pressure-sensitive adhesive sheet 80 are vacuum-adsorbed on the mounting table of the dicing apparatus, and the dicing blade 69 insulates the separation grooves 61 along the dicing lines 70 between the mounting portions 65. The functional resin 50 is diced and separated into individual circuit devices 53.
[0068]
In this step, the dicing blade 69 completely cuts the insulating resin 50 and performs dicing at a cutting depth reaching the surface of the adhesive sheet, and completely separates each mounting portion 65. At the time of dicing, the alignment mark 67 inside the frame-like pattern 66 around each block provided in the first step described above is recognized and dicing is performed based on this. As is well known, after dicing all dicing lines 70 in the vertical direction, the mounting table is rotated 90 degrees and dicing is performed according to the dicing lines 70 in the horizontal direction.
[0069]
Further, in this process, since only the insulating resin 50 filled in the separation groove 61 is present in the dicing line 70, the dicing blade 69 is less worn, and there is a feature that dicing can be performed to an extremely accurate outer shape without generating metal burrs. .
[0070]
Further, even after this step, even after dicing, the adhesive sheet 80 does not break apart into individual circuit devices, and the subsequent taping step can be efficiently performed. That is, the circuit device integrally supported by the pressure-sensitive adhesive sheet 80 can identify only non-defective products, and can be separated from the pressure-sensitive adhesive sheet 80 by the suction collet and stored in the storage hole of the carrier tape. For this reason, even a minute circuit device has a feature that it is not separated even once until taping.
[0071]
【The invention's effect】
In the present invention, the conductive foil itself, which is the material of the conductive pattern, functions as a support substrate, and the whole is supported by the conductive foil until the separation groove is formed or the circuit element is mounted and the insulating resin is applied. When separating the foil as each conductive pattern, the insulating resin is used as a support substrate to function. Therefore, the circuit element, conductive foil, and insulating resin can be manufactured with the minimum necessary. As described in the conventional example, a support substrate is not necessary in constructing a circuit device originally, and the cost can be reduced. In addition, because the support substrate is not required, the conductive pattern is embedded in the insulating resin, and the thickness of the insulating resin and conductive foil can be adjusted, it is possible to form a very thin circuit device. There is also.
[0072]
Further, by sticking a plurality of blocks to the adhesive sheet 80, it is possible to process a minute circuit device without breaking up to the end, and it is possible to realize a manufacturing method with extremely high mass production effect.
[0073]
Furthermore, by selectively performing the backside etching of the conductive foil on the portion provided with the conductive pattern, leaving the connecting portion, the blocks are connected at the connecting portion without dropping into the etching solution of the etching apparatus. Therefore, the etching process is very easy and suitable for mass production.
[0074]
Furthermore, there exists an advantage which can process by the several block affixed on the adhesive sheet at the subsequent measurement process and dicing process. Therefore, in the measurement process, the circuit devices on each mounting part of the block can be measured very quickly and in large quantities, making it unnecessary to discriminate the front and back of the circuit device and recognizing the position of the electrodes, which were necessary in the past. Since it can be processed in a batch, the measurement time can be greatly shortened. Further, the dicing process has an advantage that the recognition of the dicing line is performed quickly and reliably using the alignment mark. Furthermore, dicing may be performed by cutting only the insulating resin layer, and by not cutting the conductive foil, the life of the dicing blade can be extended, and no metal burrs are generated when the conductive foil is cut.
[0075]
Further, as apparent from FIG. 14, the through-hole formation process, conductor printing process (in the case of a ceramic substrate), etc. can be omitted, so that the manufacturing process can be greatly shortened compared to the prior art, and the entire process can be made in-house. Have Also, a frame mold is not required at all, and this is a manufacturing method with extremely short delivery time.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating a production flow of the present invention.
FIG. 2 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 3 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 4 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 5 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 6 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 7 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 8 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 9 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 10 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 11 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 12 is a diagram illustrating a mounting structure of a conventional circuit device.
FIG. 13 is a diagram illustrating a conventional circuit device.
FIG. 14 is a diagram illustrating a conventional method for manufacturing a circuit device.
FIG. 15 is a diagram illustrating a conventional method for manufacturing a circuit device.
[Explanation of symbols]
50 Insulating resin
51 Conductive pattern
52 Circuit elements
53 Circuit equipment
61 Separation groove
62 blocks
80 Adhesive sheet
90 connecting part

Claims (4)

  A mounting portion composed of a plurality of conductive patterns on which circuit elements are arranged is arranged in a matrix and sealed together with an insulating resin, and is aligned with the inside of the insulating resin arrangement region and on the periphery. Preparing a block on which a mark is formed;
  Attaching the block to the adhesive sheet by contacting the insulating resin;
  A step of separating the mounting portion into individual circuit devices by dicing the block with the alignment mark as a reference in a state of being attached to the adhesive sheet. Device manufacturing method.   The step of preparing the block is to prepare a plurality of the blocks,
  Forming the block by arranging the mounting portions in a matrix on a support substrate, and forming alignment marks on the periphery of the block;
  Placing a circuit element on each mounting part and connecting the circuit element and the conductive pattern;
  A step of collectively covering the conductive pattern and the circuit element of the mounting portion included in the block with the insulating resin;
  The method for manufacturing a circuit device according to claim 1, further comprising: separating the insulating resin of the block from the support substrate.   2. The method of manufacturing a circuit device according to claim 1, wherein the alignment mark is arranged along an extension line of a dicing line where the dicing is performed.   2. The method of manufacturing a circuit device according to claim 1, wherein the conductive pattern and the alignment mark are simultaneously formed by etching.

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