JP4323252B2 - レジスト除去装置 - Google Patents
レジスト除去装置 Download PDFInfo
- Publication number
- JP4323252B2 JP4323252B2 JP2003285719A JP2003285719A JP4323252B2 JP 4323252 B2 JP4323252 B2 JP 4323252B2 JP 2003285719 A JP2003285719 A JP 2003285719A JP 2003285719 A JP2003285719 A JP 2003285719A JP 4323252 B2 JP4323252 B2 JP 4323252B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- spray nozzles
- substrate transport
- resist
- large number
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Coating Apparatus (AREA)
Description
20 基板搬送機構
21 搬送ローラ
22 押さえローラ
30 シャワーユニット
31 ヘッダー管
32 スプレーノズル
33 ノズル揺動機構
34 スプレーパターン
Claims (1)
- 基板を支持して水平方向に搬送する基板搬送機構と、前記基板の表面に薬液を供給するために基板搬送面の上方に設けられたシャワーユニットとを備えており、該シャワーユニットは、薬液が基板搬送方向に沿って直線的に且つ並列的に吹き付けられるように複数列に配置された多数個のフラット型スプレーノズルと、多数個のフラット型スプレーノズルを基部側を中心にして両側へ同期揺動させるノズル揺動機構とを有しており、
多数個のフラット型スプレーノズルは、基板幅方向に所定間隔で配列されそれぞれが回転可能に支持された基板搬送方向の複数のヘッダー管に所定の間隔で取付けられると共に、ノズル揺動機構は、各ヘッダー管を両方向に所定角度で同期して回転させることにより、多数個のフラット型スプレーノズルを両側へ回転揺動させ、
各ヘッダー管において基板搬送方向に並ぶ複数のフラット型スプレーノズルは、隣接するスプレーノズルの間で噴射液の干渉が回避されるように、基板搬送方向のヘッダー管に対し30度以下の角度で同方向へ傾斜するレジスト除去装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003285719A JP4323252B2 (ja) | 2003-08-04 | 2003-08-04 | レジスト除去装置 |
TW93118285A TWI345260B (en) | 2003-08-04 | 2004-06-24 | Resist elimination device |
PCT/JP2004/010117 WO2005013342A1 (ja) | 2003-08-04 | 2004-07-15 | レジスト除去装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003285719A JP4323252B2 (ja) | 2003-08-04 | 2003-08-04 | レジスト除去装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005057032A JP2005057032A (ja) | 2005-03-03 |
JP4323252B2 true JP4323252B2 (ja) | 2009-09-02 |
Family
ID=34113894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003285719A Expired - Fee Related JP4323252B2 (ja) | 2003-08-04 | 2003-08-04 | レジスト除去装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4323252B2 (ja) |
TW (1) | TWI345260B (ja) |
WO (1) | WO2005013342A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG145580A1 (en) * | 2007-02-15 | 2008-09-29 | Epomid Chemical & Machinery Pt | Nozzle tip |
DE102007063202A1 (de) | 2007-12-19 | 2009-06-25 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zur Behandlung von Silizium-Wafern |
JP5139120B2 (ja) * | 2008-02-27 | 2013-02-06 | 新光電気工業株式会社 | 表面処理方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04342134A (ja) * | 1991-05-17 | 1992-11-27 | Nec Corp | エッチング装置 |
JP3866856B2 (ja) * | 1998-04-24 | 2007-01-10 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2001200379A (ja) * | 2000-01-20 | 2001-07-24 | Hitachi Chem Co Ltd | エッチング装置 |
JPWO2002049087A1 (ja) * | 2000-12-12 | 2004-04-15 | 住友精密工業株式会社 | 揺動シャワー型搬送式基板処理装置 |
JP2002359452A (ja) * | 2001-03-29 | 2002-12-13 | Sumitomo Bakelite Co Ltd | フレキシブル回路プリント配線板の製造方法 |
JP2003322976A (ja) * | 2002-05-07 | 2003-11-14 | Fuji Photo Film Co Ltd | 液噴霧方法及びこれを用いた基板現像処理方法及び装置 |
JP2004152987A (ja) * | 2002-10-30 | 2004-05-27 | Kemitoron:Kk | プリント配線基板のエッチング方法及びエッチング装置 |
JP2004174463A (ja) * | 2002-11-29 | 2004-06-24 | Mitsubishi Paper Mills Ltd | 基板の洗浄方法 |
-
2003
- 2003-08-04 JP JP2003285719A patent/JP4323252B2/ja not_active Expired - Fee Related
-
2004
- 2004-06-24 TW TW93118285A patent/TWI345260B/zh not_active IP Right Cessation
- 2004-07-15 WO PCT/JP2004/010117 patent/WO2005013342A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
TW200507033A (en) | 2005-02-16 |
JP2005057032A (ja) | 2005-03-03 |
TWI345260B (en) | 2011-07-11 |
WO2005013342A1 (ja) | 2005-02-10 |
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