JP4305329B2 - Parts transport jig - Google Patents

Description

  The present invention relates to a component conveying jig for handling a component after dicing held on a sheet such as an LED element.

  A semiconductor device is manufactured by mounting individual semiconductor elements cut out from a semiconductor wafer on a package forming substrate and then sealing with a resin. In the manufacturing process of this semiconductor device, plasma processing is used for the purpose of cleaning the electrodes for external connection formed on the semiconductor element. This plasma treatment removes an oxide film generated on the electrode surface due to exposure to the atmosphere and a contaminated film such as an organic substance adhering in each step, thereby improving the connectivity when the electrode is electrically connected to the outside.

  The application form of the plasma treatment differs depending on the type of the target semiconductor device. For example, in a semiconductor device in which the external connection electrode of the semiconductor device is connected by wire bonding, the semiconductor device divided into individual pieces by dicing is used. After bonding to a packaging substrate such as a lead frame, the substrate is accommodated in a plasma processing apparatus, and a plasma cleaning process is performed on the substrate surface under reduced pressure (see, for example, Patent Document 1).

Furthermore, when the semiconductor device after bump formation is individually subjected to plasma processing, atmospheric pressure plasma processing can be used (see, for example, Patent Document 2). This method irradiates the plasma by individually aligning the semiconductor device to be processed with respect to the plasma irradiation nozzle, and it is possible to perform plasma processing for only a necessary portion.
Japanese Patent No. 3473433 JP 2000-117213 A

  As a kind of semiconductor element, in the case of a semiconductor element that is mounted on a substrate without forming a bump on an external connection electrode such as an LED element, a contaminant attached by dicing after being cut out from a semiconductor wafer by dicing In order to remove the above, it is necessary to perform the above-described plasma treatment.

  However, the LED element after being cut into individual pieces is either a plasma treatment under reduced pressure as shown in Patent Document 1 or a plasma treatment under atmospheric pressure as shown in Patent Document 2, It is difficult to perform normal plasma processing. This is because the LED element is a micro component, and thus it is difficult to stably maintain the position and handle during plasma processing and to perform work efficiently. For this reason, there has been a demand for a measure that enables easy handling by stably holding components such as LED elements that are divided into pieces by dicing.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a component transporting jig that can be easily handled by stably holding a component that is divided into individual pieces and held on a sheet.

The component conveying jig of the present invention is a component conveying jig for conveying a component that is divided into individual pieces and that is held by an adhesive layer on a sheet in a posture in which an electrode faces upward, and is provided with a conveyance support surface. Provided on the lower surface side of the main body portion, and a sheet holding portion for holding the sheet by sticking a sticking surface of the lower surface to the adhesive layer, and provided on the main body portion. An opening that exposes a range in which the parts held by the sheet are present upward ,
The outer periphery of the sheet is reinforced by a ring-shaped reinforcing member, and the sheet holding portion is fitted to the reinforcing member to hold the sheet on the lower surface of the component conveying jig .

  According to the present invention, an adhesive surface is provided on the lower surface side of the main body portion provided with the conveyance support surface supported by the conveyance mechanism, and the sheet holding the component on the adhesion surface is adhered and held via the adhesive layer. By doing so, it is possible to stably hold and easily handle components in a state of being divided into individual pieces and held on a sheet.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory diagram of a dicing process in a component mounting method according to an embodiment of the present invention. FIG. 2 is an explanatory diagram of a wafer jig used in the component mounting method according to an embodiment of the present invention. 4, FIG. 5 and FIG. 6 are explanatory diagrams of the structure of a component conveying jig used in the component mounting method according to the embodiment of the present invention. FIG. 7 is used in the component mounting method according to the embodiment of the present invention. FIG. 8 is a perspective view of an electronic component mounting apparatus used in the component mounting method of one embodiment of the present invention, and FIG. 9 is a component in the component mounting method of one embodiment of the present invention. FIG. 10 is an explanatory diagram of the operation of taking out, FIG. 10 is an explanatory diagram of the operation of component mounting in the component mounting method of the embodiment of the present invention, and FIGS. 11, 12, 13, and 14 are diagrams of the embodiment of the present invention. Component handling used in component mounting methods It is a structural diagram of a use fixture.

  Hereinafter, a component mounting method for mounting an LED (light emitting diode) element as a component on a substrate will be described. In this component mounting method, an LED element in a wafer state is divided into individual pieces, and the divided LED elements are mounted on a substrate after plasma processing.

  First, a dicing process for dividing a wafer-like component into individual LED elements will be described. In FIG. 1A, on a wafer holding table 3, a circular sheet 1 holding a rectangular wafer-like component 2A is placed. A plurality of LED elements 2 made of an insulator are formed in a lattice-like arrangement on the wafer-like component 2A, and the wafer-like component 2A is adhered to the sheet 1 by an adhesive layer 1a formed on the upper surface of the sheet 1. Is retained.

  The wafer-like component 2A is cut along the dividing line by a dicing blade 4 having a cutting blade, whereby the wafer-like component 2A is separated into individual LED elements 2 on the sheet 1 as shown in FIG. It is divided every time. As shown in FIG. 1 (c), the LED element 2 has an electrode 2a, which is a flat electrode for external connection, formed on the surface, and is adhered and held on the sheet 1 with the electrode forming surface facing upward. Yes.

  Thereafter, a wafer ring 5 as a ring-shaped reinforcing member is mounted on the sheet 1 holding the LED element 2 after dicing. That is, as shown in FIG. 2A, the wafer ring 5 is attached to the adhesive layer 1 a on the upper surface of the sheet 1. Thus, as shown in FIGS. 2B and 2C, the plurality of LED elements 2 divided into individual pieces are held by the sheet 1 in a lattice-like regular arrangement, and the outer peripheral portion of the sheet 1 is held on the wafer ring 5. Thus, the wafer jig 6 reinforced by the above is completed. Dicing may be performed after the wafer ring 5 is mounted on the sheet 1 holding the wafer-like component 2A. This also completes the wafer jig having the above-described structure as shown in FIGS.

Next, the carrier 7 used for handling and transporting the LED element 2 held by the wafer jig 6 will be described with reference to FIGS. In FIG. 3, FIG. 3 (b) shows an AA arrow view of FIG. 3 (a). The carrier 7 is a component transporting jig that transports the LED element 2 held on the sheet 1 by the adhesive layer 1a in a posture in which the carrier 7 is divided into pieces and the electrode 2a faces upward.

  As shown in FIG. 3, the carrier 7 is provided with an opening 7b at the center of a main body 7a, which is a rectangular flat plate member, and a sheet having a circular outer peripheral shape along the periphery of the opening 7b on the lower surface of the main body 7a. The holding portion 7c has a shape projecting downward. Since the main body 7a conveys the sheet 1 while being held, the main body 7a has a shape having a planar outer shape larger than the outer shape of the sheet 1, and the opening 7b has a rectangular shape corresponding to the position of the LED element 2 on the sheet 1. It is open.

  The outer dimension d of the sheet holding portion 7c corresponds to the inner diameter D of the wafer ring 5 shown in FIG. As shown in FIG. 4A, when the carrier 7 is mounted on the wafer jig 6 from the upper surface side, the sheet holding portion 7c is fitted to the inner diameter portion of the wafer ring 5 (see FIG. 4B). . As a result, the carrier 7 is aligned with the wafer jig 6, the attaching surface 7 d provided on the lower surface of the sheet holding portion 7 c is attached to the adhesive layer 1 a, and the sheet 1 is held on the lower surface of the carrier 7. The In this state, the upper surface side of the LED elements 2 held in a rectangular array on the sheet 1 is exposed upward through the opening 7b.

  The lower surfaces of both end portions of the main body 7a are transport support surfaces 7f supported by the transport mechanism during transport, and the end surfaces of both ends are transport guide surfaces that guide the main body 7a in the horizontal direction during transport by the transport mechanism. 7e (conveyance guide portion). That is, as shown in FIG. 4B, when transporting by the rail-type or conveyor-type transport mechanism 8, the transport support surface 7f is supported on the lower surface side by the transport mechanism 8, and the transport guide surface 7e is guided in the horizontal direction. Is done.

  Here, the sticking surface 7d is positioned below the conveyance support surface 7f, and the wafer jig 6 is held by the carrier 7 without interfering with the wafer ring 5, as shown in FIG. In addition, the wafer jig 6 can be transported without protruding upward from the transport height of the conveyor-type transport mechanism 8.

  FIG. 5 is a plan view of the state in which the carrier 7 is mounted on the wafer jig 6 in this manner. In this state, the range opened by the opening 7 b, that is, the range where the LED element 2 exists on the upper surface of the sheet 1. Only the upper part is exposed. And the exposed part of the upper surface of the sheet 1, that is, the range where the LED element 2 is not present and the adhesive layer 1a on the upper surface side is exposed is covered by the bonding surface 7d of the carrier 7 being bonded, and the sheet 1 is covered. There is no direct exposure to the top. Therefore, the carrier 7 has a function of transporting the wafer jig 6 and a function as a cover member that covers the exposed portion of the upper surface of the sheet 1.

  As shown in FIG. 6A, by providing a notch 7g at the edge of one side of the main body 7a, part of the wafer ring 5 is exposed in the mounted state on the wafer jig 6. be able to. Thereby, at the time of peeling work for removing the carrier 7 from the wafer jig 6, the wafer ring 5 can be easily gripped directly with fingers or a work tool, and workability is improved.

  That is, in this example, the main body portion 7a is provided with a notch portion 7g for peeling the sheet 1 held on the sticking surface 7d. Instead of providing the notch portion 7g, as shown in FIG. 6 (b), the same effect can be obtained as a main body portion 7A having a shape in which one side of the main body portion 7a shown in FIG. 5 is cut out so that the wafer ring 5 is exposed. Get.

The carrier 7 configured as described above has the width of the sheet 1 when the width direction is a direction (horizontal direction in FIG. 4B) orthogonal to the conveyance direction of the carrier 7 (perpendicular to the paper surface in FIG. 4B). The main body 7a has a width (LC) larger than (LS) and is provided with a transport support surface 7f supported by the transport mechanism at both ends and a transport guide surface 7e for guiding the main body 7a in the horizontal direction.
And a sticking surface 7d for holding the sheet 1 by being stuck to the adhesive layer 1a of the sheet 1 provided on the lower surface side of the main body part 7a, and an LED element 2 provided to the main body part 7a and held by the sheet 1 It is the structure provided with the opening part 7b which exposes the upper surface side of this.

  In the above-described example, the sheet 1 is intended for a state in which the outer peripheral portion is reinforced by the wafer ring 5 which is a ring-shaped reinforcing member to form the wafer jig 6. In the plasma processing described below, the wafer 1 The jig 6 is handled while being held by the carrier 7. By using the carrier 7 having such a configuration, as in the case of the LED element 2 after dicing, the components that are divided into individual pieces and held on the sheet are stably held, and the general purpose such as the conveyor rail is used. Can be easily transported and handled by a simple transport mechanism.

  Next, the plasma processing apparatus will be described with reference to FIG. This plasma processing apparatus is used for plasma processing performed for the purpose of cleaning the electrode 2a of the LED element 2. In FIG. 7, the inside of the vacuum chamber 11 is a processing chamber for performing plasma processing, and a lower electrode 13 and an upper electrode 14 are arranged to face each other. A lower portion of the lower electrode 13 penetrates the bottom surface of the vacuum chamber 11 through the insulator 12 and protrudes to the outside, and an upper portion of the upper electrode 14 penetrates the upper surface of the vacuum chamber 11 and is connected to the ground portion 16. . A space between the lower electrode 13 and the upper electrode 14 is a plasma processing space 15, and a wafer jig 6 holding an LED element 2 to be plasma processed is held on a carrier 7 on the upper surface of the lower electrode 13. It is mounted in the state which was done.

  Two openings 11 a and 11 b are provided on the bottom surface of the vacuum chamber 11, and the openings 11 a and 11 b are connected to the vacuum exhaust part 22 and the gas supply part 24 through the exhaust valve 21 and the gas supply valve 23, respectively. It is connected to the. The interior of the vacuum chamber 11 is evacuated by opening the exhaust valve 21 and driving the vacuum exhaust unit 22. Further, by opening the gas supply valve 23 and driving the gas supply unit 24, plasma generating gas such as argon gas or oxygen gas is supplied into the vacuum chamber 11.

  A high frequency power supply unit 25 is connected to the lower electrode 13. By driving the high frequency power supply unit 25, a high frequency voltage (for example, 13.56 MHz) is applied between the upper electrode 14 and the lower electrode 13. By driving the high frequency power supply unit 25 with the plasma generating gas supplied after the vacuum chamber 11 is evacuated, plasma of a plasma generating gas such as argon gas or oxygen gas is generated in the plasma processing space 15. . The exhaust valve 21, the gas supply valve 23, the vacuum exhaust unit 22, the gas supply unit 24, and the high frequency power supply unit 25 are controlled by the control unit 26.

  In the plasma processing for cleaning the electrode 2a, the wafer jig 6 held by the carrier 7 is placed on the lower electrode 13 in the vacuum chamber 11 of the plasma processing apparatus. As a result, the LED element 2 held on the wafer jig 6 is exposed upward in the plasma processing space 15 through the opening 7 b of the carrier 7. Next, plasma is generated by generating plasma in the plasma processing space 15. By this plasma treatment, contaminants attached to the electrode 2a are removed, and the surface of the electrode 2a is cleaned.

In the plasma processing, the plasma processing is performed in a state where the LED element 2 which is a minute component in the individual state is held by the sheet 1, and the outer periphery of the sheet 1 is pressed against the lower electrode 13 by the wafer ring 5. At the same time, the carrier 7 presses a wide range of the sheet 1 against the lower electrode 13 through the bonding surface 7d, so that the mounting state of the sheet 1 on the lower electrode 13 is stabilized. The following problems in plasma processing in one state have been solved.

  That is, in the plasma processing apparatus, since the processing is performed in a reduced pressure atmosphere, the method using vacuum suction that is generally used for component holding cannot be applied, and furthermore, a component formed of an insulator like the LED element 2 In this case, the component holding method by electrostatic adsorption cannot be applied. Further, as a method of holding components independently of vacuum adsorption or electrostatic adsorption, a method of holding them individually on a component tray is generally used. However, as in the case of a plasma processing apparatus, during vacuum processing or vacuum break in a processing chamber during processing. In an apparatus in which an abrupt gas flow occurs, the components are likely to be displaced or scattered due to the gas flow, and there is a difficulty in practical use particularly when a minute component such as the LED element 2 is targeted.

On the other hand, as shown in the present embodiment, the LED element 2 is adhered and held by the sheet 1, and the sheet 1 is further pressed against the lower electrode 13 by the adhesion surface 7d of the wafer ring 5 and the carrier 7. By adopting it, it is possible to stably hold the components regardless of vacuum suction or electrostatic suction. The sheet 1 is spreadable the outer peripheral portion to the wafer ring 5 made of metal, and the exposed portion of the LED element 2 is not adhered by Tei Rukoto held by attaching surface 7d of the carrier 7, the seat 1 is lower It is mounted on the upper surface of the electrode 13 in a good contact state. Thereby, a gap due to warpage or wrinkles of the sheet 1 does not occur between the lower surface of the sheet 1 and the upper surface of the lower electrode 13. Therefore, abnormal discharge due to the gap does not occur in the plasma treatment, and problems such as damage to the LED element 2 and burning of the sheet 1 due to abnormal discharge are prevented.

  If the abnormal discharge does not occur, the transport mechanism 8 shown in FIG. 4B is provided on the lower electrode 13, and a gap of an appropriate value or less (for example, 2 mm or less) is provided between the sheet 1 and the lower electrode 13. A plasma treatment may be provided intentionally. In this case, heat from the lower electrode 13 can be prevented from being transmitted to the sheet 1.

  Further, in the plasma processing state, the sheet 1 is covered by the carrier 7 except for the opening range of the opening 7b provided in the carrier 7, so that the plasma acts on the LED element 2 located in the opening range, Problems caused by the plasma acting on the exposed portion of the upper surface of the sheet 1, that is, the gas component generated by heating the adhesive layer 1a of the sheet 1 by the thermal action of the plasma adheres to the LED element 2 and causes recontamination. Difficult to occur. In the carrier 7 shown in FIGS. 3 and 4, the bonding surface 7 d is configured to be bonded to the exposed portion of the upper surface of the sheet 1 over the entire range, so that the action of plasma on the exposed portion is almost complete. Therefore, a very good cover effect can be obtained.

  In the step of covering the exposed portion of the upper surface of the sheet 1 with the cover member, it is not always necessary to use the component conveying jig of the present invention as the cover member. For example, as the cover member, a simple plate material made of ceramic or aluminum, a thin sheet-like member, or the like may be employed. Further, it is not always necessary to attach the cover member to the exposed portion of the upper surface of the sheet. The cover member only needs to have a function of covering the exposed portion of the upper surface of the sheet 1 while exposing the components held on the sheet 1.

  Thereafter, the wafer jig 6 taken out from the plasma processing apparatus and with the carrier 7 removed is sent to the electronic component mounting apparatus shown in FIG. The electronic component mounting apparatus includes a component supply unit 30, a component pick-up / reverse mechanism 31, a mounting head 32, and a substrate holding unit 33. A wafer jig 6 holding the LED element 2 after plasma processing is placed on the component supply unit 30. A component take-out reversing mechanism 31 having a take-out nozzle 31a is disposed on the component supply unit 30, and the component take-out reversing mechanism 31 takes out the LED element 2 from the wafer jig 6 by the take-out nozzle 31a and turns it upside down. The LED element 2 in the state is moved to the delivery position to the mounting head 32.

  A peeling mechanism 34 shown in FIG. 9 is disposed below the component supply unit 30 and has a function of peeling the LED element 2 from the sheet 1 when the LED element 2 is taken out by the take-out nozzle 31a. The substrate holding unit 33 holds the substrate 20 on which the LED element 2 is mounted. The LED element 2 delivered from the component take-out reversing mechanism 31 by the mounting nozzle 32a of the mounting head 32 is held by the mounting head 32. It is mounted on the substrate 20 by moving onto the portion 33 and performing a mounting operation.

  FIG. 9 shows an operation of taking out the LED element 2. As shown in FIG. 9A, the take-out nozzle 31a is positioned above the LED element 2 to be taken out, and the peeling mechanism 34 is positioned below the LED element 2. The peeling mechanism 34 is provided with a cylindrical lower receiving portion 35 that is received by contacting the lower surface of the sheet 1. The lower receiving portion 35 adsorbs the sheet 1 through a sheet adsorbing hole 35 a provided at the top portion, and a pin. The LED element 2 is peeled from the sheet 1 by projecting and retracting the push-up pin 36a that moves up and down by the lift mechanism 36 from the pin hole 35b.

  When the LED element 2 is taken out, as shown in FIG. 9B, the take-out nozzle 31a is lowered and brought into contact with the upper surface of the LED element 2, and the push-up pin 36a is raised. When the LED element 2 is sucked and held by the take-out nozzle 31a, the take-out nozzle 31a is raised and the push-up pin 36a is pushed through the sheet 1 and raised. As a result, as shown in FIG. 9C, the LED element 2 is peeled from the sheet 1 in a state of being adsorbed on the top portion of the receiving portion 35. Then, as shown in FIG. 9D, the LED element 2 is taken out from the wafer jig 6 by raising the take-out nozzle 31 a holding the LED element 2.

  The LED element 2 thus taken out is received by the mounting head 32 and mounted on the substrate 20 on the substrate holding unit 33. The mounting operation at this time will be described with reference to FIG. As shown in FIG. 10 (a), the substrate 20 is provided with electrodes 20a corresponding to the positions of the electrodes 2a in the LED element 2, and bumps 27 as projection electrodes are formed in advance on the electrodes 20a. Yes.

  Then, the electrode 2a of the LED element 2 held by the mounting nozzle 32a is aligned with the bump 27, and the mounting nozzle 32a is lowered to contact the electrode 2a with the bump 27 as shown in FIG. And press with a predetermined pressing load. Then, heating or application of ultrasonic vibration is performed as necessary.

  As a result, the electrode 2a is metal-bonded to the bump 27, and then the mounting nozzle 32a is raised as shown in FIG. In this component mounting, since the electrode 2a of the LED element 2 is previously cleaned by plasma treatment, the bonding with the bump 27 is performed well, and good mounting quality can be ensured.

  Therefore, the component mounting method described above is a component mounting method in which the LED element 2 held on the sheet 1 is taken out and mounted on the substrate 20 with the electrode 2a facing upward, and a plurality of LED elements 2 are formed and the sheet 1 is mounted. A step of dividing the LED element 2 into individual pieces from the wafer-like component 2A held on the substrate, a step of holding the sheet 1 on the carrier 7 and covering the exposed portion of the upper surface of the sheet 1 with the carrier 7 as a cover member, The step of placing the sheet 1 holding the element 2 in the vacuum chamber 11 of the plasma processing apparatus, the step of cleaning the electrode 2a by plasma processing the LED element 2, and the LED element after plasma processing from the sheet 1 2, the LED element 2 is mounted on the substrate 20, and the electrode 2 a that is a flat plate electrode is in contact with the bump 27 that is a protruding electrode provided on the substrate 20. It has a form and a step of.

  By adopting the above method, contaminants attached by dicing can be removed by plasma treatment even when targeting parts of the type that are mounted on a substrate without forming bumps on external connection electrodes such as LED elements. Thus, a clean electrode surface can be secured, and the component can be bonded and mounted on the substrate with good bondability.

  In this plasma treatment, the sheet on which the LED element is stuck and held is held by the carrier and the exposed portion where the LED element is not stuck on the sheet is covered by the carrier, so that the position is held by the microparts. It is possible to hold a LED element that is difficult to handle in a stable posture, and to prevent problems caused by the action of plasma on the sheet, and to perform good plasma processing.

  In the component mounting method described above, in a series of processes from the dicing step of dividing the LED element into individual pieces, the plasma processing step after dicing, and the component removing step of taking out the LED elements after the plasma treatment for each piece. The LED elements are handled in a state where they are stuck and held on the same sheet. Then, by holding the sheet after the dicing process by the carrier having the above-described configuration, it is possible to stably hold the parts in a state of being divided into individual pieces and enable simple handling.

  In addition, as a component conveyance jig | tool of this invention, it is not limited to the carrier 7 of the above-mentioned structure, Various variations are possible. For example, a carrier 107 shown in FIG. 11A shows an example in which the shape of the sheet holding portion 7c of the carrier 7 is changed. In FIG. 11, a main body 107a, an opening 107b, a conveyance guide surface 107e, and a conveyance support surface 107f are the same as the main body 7a, the opening 7b, the conveyance guide surface 7e, and the conveyance support surface 7f in the carrier 7.

  A rectangular block-shaped sheet holding portion 107c having a lower surface provided with a sticking surface 107d is protruded from the lower surface of the main body portion 107a. As shown in FIG. 11B, in a state where the carrier 107 is mounted on the wafer jig 6, the sheet 1 is held by the carrier 107 by the bonding surface 107 d being bonded to the adhesive layer 1 a of the sheet 1. The At this time, unlike the carrier 7 provided with the sheet holding portion 7c having a shape fitted to the inner diameter portion of the wafer ring 5, the sheet holding portion 107 does not have a function of aligning the wafer jig 6 with respect to the carrier 107. The main body 107 a is provided with a positioning member 107 h that contacts the outer shape of the wafer ring 5 and positions the carrier 107 with respect to the wafer jig 6.

  The carrier 207 shown in FIG. 12 is used for the purpose of directly holding and transporting the sheet 1 that is not reinforced by the wafer ring 5. In FIG. 12, a main body 207a, an opening 207b, a conveyance guide surface 207e, and a conveyance support surface 207e are the same as the main body 7a, the opening 7b, the conveyance guide surface 7e, and the conveyance support surface 7f in the carrier 7.

  The sheet holding portion 207c provided on the lower surface of the main body portion 207a has a planar shape corresponding to the entire range where the LED element 2 is not attached to the sheet 1, that is, the outer periphery of the sheet holding portion 7c in the carrier 7 It has a shape with a portion corresponding to an annular shape. As shown in FIG. 12B, in a state where the carrier 207 is mounted on the sheet 1, the sheet 1 is held by the carrier 207 when the bonding surface 207 d is bonded to the adhesive layer 1 a of the sheet 1.

FIG. 13 shows the carrier 207 shown in FIG. 12 with the shape of the main body 207a changed so as to be compatible with a transport mode different from the conveyor-type transport mechanism 8. In FIG. 13, the main body 307a of the carrier 307 has a planar shape similar to that of the main body 207a of the carrier 207, and includes an opening 307b, a sheet holding portion 307c, and a bonding surface 307d.
Is the same as the opening 207b, the sheet holding portion 207c, and the sticking surface 207d in the carrier 207.

  The conveyance guide surface 307e and the conveyance support surface 307f are respectively provided on the side surface and the lower surface of the conveyance convex portion 307g in which both end portions of the main body portion 307a are extended downward. That is, in this example, the sticking surface 307d is positioned above the transport support surface 307f. By adopting such a configuration, as shown in FIG. 13B, the carrier 307 holding the sheet 1 is moved in the transport groove 9 provided on a horizontal plane such as a transport path for transporting the target workpiece in the plasma processing apparatus. Can be transported by a push-type transport mechanism (not shown).

  Further, FIG. 14 shows an example in which the sheet 1 is placed on the upper surface of the flat plate member and conveyed, unlike the above-described carriers 7, 107, 207, and 307 that hold the wafer jig 6 on the lower surface of the flat plate-shaped main body. Is shown. In FIG. 14, the transport plate 40 is provided with the same external shape as the main body portion 7 a of the carrier 7, and the lower surface 40 a and the end surface 40 b of both ends are respectively provided on the transport support surface 7 f and the transport guide surface 7 e of the carrier 7. Correspondingly, it is transported by a conveyor-type transport mechanism in the same manner as the carrier 7.

  The wafer jig 106 holds a plurality of LED elements 2 attached to the sheet 1 in a substantially circular arrangement, and the outer periphery of the sheet 1 is similarly reinforced by a wafer ring 105. The wafer jig 106 is aligned by a plurality of positioning members 41 provided on the transport plate 40 and placed on the transport plate 40. A cover member 42 is further mounted on the upper surface of the wafer jig 106. The cover member 42 is an annular member having a circular opening 42a having a size corresponding to the arrangement of the LED elements 2 in the sheet 1 at the center, and an annular portion 42b on the outer periphery of the opening 42a.

  The cross-section of the annular portion 42b is provided with an outer peripheral portion 42c that comes into contact with the upper surface of the wafer ring 105 when mounted on the wafer jig 106 and a bonding surface 42d that is bonded to the adhesive layer 1a of the sheet 1. It has a cut-off shape. By attaching the cover member 42 to the wafer jig 106, the exposed portion of the upper surface of the sheet 1 where the LED element 2 is not adhered is covered by the cover member 42, and the LED element 2 is directed upward via the opening 42a. Exposed.

  With such a configuration, similarly to the carrier 7 described above, the carrier having the function of a cover member that covers the exposed portion of the upper surface of the sheet 1 during the plasma processing and the conveyance of the sheet 1 holding the LED element 2 is provided. Realized. In this example, the two members of the transport plate 40 and the cover member 42 correspond to the main body portion 7 a in the carrier 7. In the configuration shown in FIG. 14, the wafer jig 106 is placed on the upper surface of the transport plate 40, unlike the carrier 7 that holds the weight of the wafer jig 6 by the adhesive force between the attaching surface 7 d and the adhesive layer 1 a. Therefore, the wafer ring 105 is suitable for use in a case where the weight is large.

  The jig for conveying parts according to the present invention has an effect that the parts in a state of being divided into individual pieces and held on a sheet can be stably held and easily handled, and is held on a sheet such as an LED element. This is useful for handling parts after dicing.

Explanatory drawing of the dicing process in the component mounting method of one embodiment of the present invention Explanatory drawing of the component holder used in the component mounting method of one embodiment of this invention Structure explanatory drawing of the component conveyance jig | tool used in the component mounting method of one embodiment of this invention Structure explanatory drawing of the component conveyance jig | tool used in the component mounting method of one embodiment of this invention Structure explanatory drawing of the component conveyance jig | tool used in the component mounting method of one embodiment of this invention Structure explanatory drawing of the component conveyance jig | tool used in the component mounting method of one embodiment of this invention Sectional drawing of the plasma processing apparatus used in the component mounting method of one embodiment of this invention The perspective view of the electronic component mounting apparatus used in the component mounting method of one embodiment of this invention Operation explanatory diagram of component extraction operation in component mounting method of one embodiment of the present invention Operation explanatory diagram of component mounting operation in component mounting method of one embodiment of the present invention Structure explanatory drawing of the component conveyance jig | tool used in the component mounting method of one embodiment of this invention Structure explanatory drawing of the component conveyance jig | tool used in the component mounting method of one embodiment of this invention Structure explanatory drawing of the component conveyance jig | tool used in the component mounting method of one embodiment of this invention Structure explanatory drawing of the component conveyance jig | tool used in the component mounting method of one embodiment of this invention

Explanation of symbols

1 Sheet 2 LED element 2a Electrode 5 Wafer ring 6 Wafer jig 7, 107, 207, 307 Carrier 7a, 107a, 207a, 307a Main part 7b, 107b, 207b, 307b Opening 7c, 107c, 207c, 307c Sheet holding part 7d, 107d, 207d, 307d Adhering surface 7e 107e, 207e, 307e Conveying guide surface 7f 107f, 207f, 307f Conveying support surface 8 Conveying mechanism 20 Substrate 27 Bump

Claims (5)

A component transporting jig for transporting a component that is divided into individual pieces and that is held by an adhesive layer on a sheet with the electrode facing upward, and a main body portion provided with a transport support surface; There is a sheet holding part that is provided on the lower surface side and holds the sheet by sticking the adhesive surface of the lower surface to the adhesive layer, and a component that is provided on the main body part and held on the sheet. With an opening that exposes the range upwards,
The sheet is reinforced by a ring-shaped reinforcing member at an outer peripheral portion, and the sheet holding portion is fitted to the reinforcing member to hold the sheet on a lower surface of the component conveying jig. that part goods transport jig. Component transferring jig according to claim 1, wherein the fitting the sheet holding portion to the inner diameter portion of the reinforcing member. The sheet holding unit component transferring jig according to any one of claims 1 to 2, characterized in that it is protruded downward. Wherein during conveyance by the conveying mechanism, parts conveying jig according to any one of claims 1 to 3, characterized in that the conveying guide portion for guiding said body portion in the horizontal direction is provided to the body portion. To the main body portion, the parts conveying jig according to any one of claims 1 to 4, characterized in that notch for stripping sheet in a state where the held in the wear surface bonded is provided .

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