JP4381998B2 - 液冷システム - Google Patents
液冷システム Download PDFInfo
- Publication number
- JP4381998B2 JP4381998B2 JP2005048293A JP2005048293A JP4381998B2 JP 4381998 B2 JP4381998 B2 JP 4381998B2 JP 2005048293 A JP2005048293 A JP 2005048293A JP 2005048293 A JP2005048293 A JP 2005048293A JP 4381998 B2 JP4381998 B2 JP 4381998B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- cooling system
- heat receiving
- liquid refrigerant
- receiving jacket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
100 受熱ジャケット
101 溝
102 仕切り板
103 金属管(液送管)
104 金属管(蒸気送管)
200 ラジエータ
201 入口
202 冷却フィン
300 液体駆動装置
301 第1のチェックバルブ(逆止弁)
302 第2のチェックバルブ(逆止弁)
303 液体駆動部(輸送チャンバ)
304、305 開口部
306 ヒータ
400 駆動回路
600 発熱素子
700 ペルチェ素子。
Claims (4)
- 筐体内に発熱素子を備えた電子機器の液冷システムであって:
当該発熱素子の発熱をその内部の液体冷媒に伝達して気化する受熱ジャケットと;
当該受熱ジャケットから供給される気化した液体冷媒を第1の配管を通して内部に導いて冷却して液化するラジエータと;
当該ラジエータと接続の第2の配管と通じる流入側開口部および前記受熱ジャケットと接続の第3の配管と通じる流出側開口部を備え且つ前記流入側開口部が前記流出側開口部より上側に位置する一つの輸送チャンバと、
当該第3の配管および第2の配管の各々に有する第1のチェックバルブおよび第2のチェックバルブと、
前記一つの輸送チャンバにおいて、前記流入側開口部から入る前記ラジエータからの液化した液体冷媒の一部に加熱と冷却とを繰り返すことにより、前記第1のチェックバルブおよび第2のチェックバルブの開閉を繰り返させ、前記一つの輸送チャンバの内部の液体冷媒を、前記流出側開口部から前記受熱ジャケットへ移動する駆動力を与える駆動手段とを備え、
もって、前記液体冷媒は前記受熱ジャケット、前記第1の配管、前記ラジエータ、前記第2の配管、前記一つの輸送チャンバ、及び、前記第3の配管から前記受熱ジャケットへの循環ループ内で循環することを特徴とする液冷システム。 - 前記請求項1に記載した液冷システムにおいて、前記一つの輸送チャンバは、その内部に前記ラジエータからの液化した液体冷媒の一部を貯留する部分を有しており、かつ、当該貯留部分の内部表面には液体冷媒の気化を促進するための処理が施されていることを特徴とする液冷システム。
- 前記請求項1に記載した液冷システムにおいて、前記一つの輸送チャンバは、前記ラジエータからの液化した液体冷媒の一部をその内部に貯留する部分に、電気ヒータを備えていることを特徴とする液冷システム。
- 前記請求項1に記載した液冷システムにおいて、前記受熱ジャケットの内部表面には、液体冷媒の気化を促進する処理が施されていることを特徴とする液冷システム。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005048293A JP4381998B2 (ja) | 2005-02-24 | 2005-02-24 | 液冷システム |
TW094135520A TWI307831B (en) | 2005-02-24 | 2005-10-12 | Liquid cooling system |
CNB2005101270297A CN100399230C (zh) | 2005-02-24 | 2005-11-29 | 液体冷却系统 |
US11/288,097 US7980294B2 (en) | 2005-02-24 | 2005-11-29 | Liquid cooling system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005048293A JP4381998B2 (ja) | 2005-02-24 | 2005-02-24 | 液冷システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006237188A JP2006237188A (ja) | 2006-09-07 |
JP4381998B2 true JP4381998B2 (ja) | 2009-12-09 |
Family
ID=36911414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005048293A Expired - Fee Related JP4381998B2 (ja) | 2005-02-24 | 2005-02-24 | 液冷システム |
Country Status (4)
Country | Link |
---|---|
US (1) | US7980294B2 (ja) |
JP (1) | JP4381998B2 (ja) |
CN (1) | CN100399230C (ja) |
TW (1) | TWI307831B (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0703995D0 (en) * | 2007-03-01 | 2007-04-11 | Stevens Jason | Data centers |
JP4899997B2 (ja) * | 2007-03-30 | 2012-03-21 | 日本電気株式会社 | サーマルサイフォン式沸騰冷却器 |
US7882890B2 (en) * | 2007-07-13 | 2011-02-08 | International Business Machines Corporation | Thermally pumped liquid/gas heat exchanger for cooling heat-generating devices |
US9238398B2 (en) * | 2008-09-25 | 2016-01-19 | B/E Aerospace, Inc. | Refrigeration systems and methods for connection with a vehicle's liquid cooling system |
TWM354785U (en) * | 2008-09-26 | 2009-04-11 | Wistron Corp | Heat dissipation module and electronic device having the same |
JP4997215B2 (ja) * | 2008-11-19 | 2012-08-08 | 株式会社日立製作所 | サーバ装置 |
FR2979982B1 (fr) * | 2011-09-14 | 2016-09-09 | Euro Heat Pipes | Dispositif de transport de chaleur a pompage capillaire |
FR2979981B1 (fr) | 2011-09-14 | 2016-09-09 | Euro Heat Pipes | Dispositif de transport de chaleur a pompage capillaire |
CN104040278A (zh) * | 2012-01-04 | 2014-09-10 | 日本电气株式会社 | 冷却装置和使用该冷却装置的电子装置 |
FR2985808B1 (fr) * | 2012-01-13 | 2018-06-15 | Airbus Defence And Space | Dispositif de refroidissement adapte a la regulation thermique d'une source de chaleur d'un satellite, procede de realisation du dispositif de refroidissement et satellite associes |
US20130206369A1 (en) * | 2012-02-13 | 2013-08-15 | Wei-I Lin | Heat dissipating device |
JP6237918B2 (ja) * | 2014-09-22 | 2017-11-29 | 富士電機株式会社 | 電子部品の冷却器 |
US11275136B2 (en) | 2016-10-06 | 2022-03-15 | Koninklijke Philips N.V. | Passive flow direction biasing of cryogenic thermosiphon |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1686887A (en) * | 1925-05-12 | 1928-10-09 | James V Baldwin | Fluid elevating and feeding means |
US2518621A (en) * | 1947-02-26 | 1950-08-15 | Engineering Controls Inc | Pump |
US3087438A (en) * | 1960-10-26 | 1963-04-30 | Mecislaus J Ciesielski | Heat pump |
US3898017A (en) * | 1973-04-16 | 1975-08-05 | Harold Mandroian | Pump |
US4120172A (en) * | 1977-05-05 | 1978-10-17 | The United States Of America As Represented By The United States Department Of Energy | Heat transport system |
CA1215582A (en) * | 1983-12-02 | 1986-12-23 | Benoit Jean | Vapor pressure pump |
JPH0718408B2 (ja) * | 1986-06-23 | 1995-03-06 | 謙治 岡安 | 熱駆動ポンプ |
JP2657809B2 (ja) * | 1987-12-22 | 1997-09-30 | 謙治 岡安 | 熱伝達装置 |
US5285347A (en) * | 1990-07-02 | 1994-02-08 | Digital Equipment Corporation | Hybird cooling system for electronic components |
JPH05240155A (ja) * | 1992-02-28 | 1993-09-17 | Seiko Instr Inc | 流体装置 |
US5816313A (en) * | 1994-02-25 | 1998-10-06 | Lockheed Martin Corporation | Pump, and earth-testable spacecraft capillary heat transport loop using augmentation pump and check valves |
JP3748984B2 (ja) * | 1997-05-29 | 2006-02-22 | 本田技研工業株式会社 | 熱駆動式液圧発生装置 |
US6123512A (en) * | 1997-08-08 | 2000-09-26 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Heat driven pulse pump |
US5975856A (en) * | 1997-10-06 | 1999-11-02 | The Aerospace Corporation | Method of pumping a fluid through a micromechanical valve having N-type and P-type thermoelectric elements for heating and cooling a fluid between an inlet and an outlet |
JP3607608B2 (ja) | 2000-12-19 | 2005-01-05 | 株式会社日立製作所 | ノート型パソコンの液冷システム |
JP2002188876A (ja) | 2000-12-20 | 2002-07-05 | Hitachi Ltd | 液冷システムおよびこれを用いたパーソナルコンピュータ |
JP2002189535A (ja) | 2000-12-20 | 2002-07-05 | Hitachi Ltd | 液冷システムおよびこれを用いたパーソナルコンピュータ |
JP2002189536A (ja) | 2000-12-20 | 2002-07-05 | Hitachi Ltd | 液冷システムおよび液冷システムを用いたパーソナルコンピュータ |
JP2003022148A (ja) | 2001-07-09 | 2003-01-24 | Hitachi Ltd | ノート型パソコンの液冷システム |
US6942018B2 (en) * | 2001-09-28 | 2005-09-13 | The Board Of Trustees Of The Leland Stanford Junior University | Electroosmotic microchannel cooling system |
JP2003304086A (ja) | 2002-04-10 | 2003-10-24 | Hitachi Ltd | 電子装置 |
US6834515B2 (en) * | 2002-09-13 | 2004-12-28 | Air Products And Chemicals, Inc. | Plate-fin exchangers with textured surfaces |
JP4034173B2 (ja) * | 2002-11-28 | 2008-01-16 | 株式会社日立製作所 | 半導体集積回路装置及びその半導体集積回路チップ |
CN100359999C (zh) * | 2003-04-11 | 2008-01-02 | 乐金电子(天津)电器有限公司 | 芯片冷却装置 |
US20060065386A1 (en) * | 2004-08-31 | 2006-03-30 | Mohammed Alam | Self-actuating and regulating heat exchange system |
-
2005
- 2005-02-24 JP JP2005048293A patent/JP4381998B2/ja not_active Expired - Fee Related
- 2005-10-12 TW TW094135520A patent/TWI307831B/zh not_active IP Right Cessation
- 2005-11-29 US US11/288,097 patent/US7980294B2/en not_active Expired - Fee Related
- 2005-11-29 CN CNB2005101270297A patent/CN100399230C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20060185826A1 (en) | 2006-08-24 |
JP2006237188A (ja) | 2006-09-07 |
CN100399230C (zh) | 2008-07-02 |
US7980294B2 (en) | 2011-07-19 |
TW200630782A (en) | 2006-09-01 |
TWI307831B (en) | 2009-03-21 |
CN1825247A (zh) | 2006-08-30 |
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