JP4363727B2 - Plastic molding method - Google Patents
Plastic molding method Download PDFInfo
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- JP4363727B2 JP4363727B2 JP34331699A JP34331699A JP4363727B2 JP 4363727 B2 JP4363727 B2 JP 4363727B2 JP 34331699 A JP34331699 A JP 34331699A JP 34331699 A JP34331699 A JP 34331699A JP 4363727 B2 JP4363727 B2 JP 4363727B2
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- Prior art keywords
- stamper
- plastic material
- base material
- transfer surface
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
Landscapes
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Toxicology (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Manufacturing Optical Record Carriers (AREA)
Description
【0001】
【産業上の利用分野】
この発明はプラスチック成形加工方法に関するものであり、さらに詳しくは精密機器用部品、電子機器用記憶媒体および光学機器用レンズなどのプラスチック材料からなる成形品の製造技術の改良に関するものである。
【0002】
この明細書において「転写面」とは所期の成形加工を施されるべき基材上の面部分を言い、例えば電子機器用記憶媒体であるCD−ROMの製造に用いる基材のピットが形成されるべき面などを言うものである。
【0003】
この明細書において「賦形面」とは所期の成形加工を施すべきスタンパー上の面部分を言い、例えばCD−ROM基材加工用スタンパーのピット対応凸部を具えた面を言うものである。
【0004】
【従来技術】
プラスチック成形においては、プラスチック材料を溶融可塑化させて高温状態で成形金型のキャビティ(予めスタンパーを内装してある)内に射出成形機により高速高圧で充填した後、冷却固化させて目的とする形状の成形品を得ている。プレス成形に比べて生産性が高い故に当業界において広く採用されている技術である。
【0005】
ところがこの射出成形に際しては、プラスチック材料が粘弾性物質であること、プラスチック材料の流動と冷却とが同時並行して起きること、およびプラスチック材料の熱伝導率が低くて冷却が不均一になることなどが原因となって、成形品中には不可避的に応力と歪みとが残留する。この結果成形品にはワープやシンクなどの外部構造的な欠陥が発生し易い。
【0006】
外部構造的な不都合としてはその他にも、上記の諸欠陥が原因でショートショット(射出不充分)やウエルドライン(融合不充分)などの欠陥が発生する。
【0007】
またキャビティ中の反注入口側の型壁付近においては、高温のプラスチック材料が低温の型壁に急激に接触する故にその粘性が高くなり、転写性(型形状に対する追従性)が低下する。したがって成形品が例えば多数の細い溝や突起が並設されている部分を有する電子機器用記憶媒体などである場合には、所期の溝や突起構造が精密に得られないという問題もある。
【0008】
さらに型壁付近では同様の高低温接触が原因で、プラスチック材料中に粘性の異なる層が生じるので剪断力が発生して、プラスチック材料の高分子が高度に配向(オリエンテーション)層が形成される。この結果複屈折や屈折率の局部変化が発生して、光学的特性に偏綺が出る。このため成形品が光学機器用レンズなどに用いられる場合には内部構造的な問題がある。
【0009】
以上のような射出成形に特有な外部および内部構造上の不都合を回避するには、冷却速度を低下させる、プラスチック材料温度を上昇させる、および成形圧力を増大させて射出速度を高くするなどの解決策が一応考えられる。
【0010】
【発明が解決しようとする課題】
冷却速度を低下させる具体的な方法としては、プラスチック材料を徐冷するとか成形金型を昇温させるなどの方法がある。しかしこれらの方法によった場合には、プレス加工に比べて短時間に多数の成形品を生産できるという射出成形技術の最大のメリットである高生産性を損ねるという、基本的な難点がある。
【0011】
またプラスチック材料温度を上昇させるという方法では、本発明者らの研究結果によれば、全んど実質的な効果が期待できないことが、明らかになった。
【0012】
さらに成形圧力を増大させる方法でも、本発明者らの研究結果よれば、やはり全んど実質的な効果が期待できないことが、明らかになった。
【0013】
さらに基本的な問題は、射出成形の場合にはかなりの高圧状態(ときには数トンに及ぶこともある)となるので、それに耐えるために装置を大型化せざるを得ない、という点である。この故に通常そのような大型装置を具えていない成形品の流通末端、例えばCD販売店においての応需(カストマイズ)製造が困難である。
【0014】
かかる従来技術の現状に鑑みてこの発明の基本的な目的は、射出成形のような高生産性を維持するとともに、プラスチック材料の転写性を向上させ、併せて均一な物理的特性(例えば光学的特性)を具えた成形品を提供することにある。
【0015】
この発明の他の目的は、装置を小型化して成形品の流通末端における応需製造を可能とすることにある。
【0016】
【課題を解決するための手段】
このためこの発明においては、転写面を具えてかつプラスチック材料からなる基材を用意し、転写面を露出した状態で基材を固定し、少なくとも一部が赤外線透過材料からなるスタンパーの賦形面を基材の転写面と密着状態に保持し、スタンパーに対して基材を指向する方向に赤外線を照射することを要旨とするものである。
【0017】
【作用】
赤外線照射によるエネルギーを吸収する結果、転写面近傍のプラスチック材料が昇温してその粘性が低下する。一方スタンパーの方は赤外線透過性なのでエネルギーを吸収せず、全んど昇温しない。
【0018】
【実施例】
図1〜4に示すのはこの発明の成形加工方法の一実施例である。まず図1に示すようにプラスチック材料からなり、かつ転写面11を具えた基材1を用意する。この基材としては例えば成形品がCD−ROMの場合には薄い円盤などが用いられる。プラスチック材料としては熱可塑性のものならば、例えばポリスチレンなど用途に応じて適宜これを選択する。
【0019】
ついで図2に示すように、この基材1をその転写面11を上にして、支持枠3に固定する。
【0020】
つぎに図3に示すように、賦形面51を具えたスタンパー5を用意する。このスタンパー5は赤外線透過材料から形成する。赤外線透過材料としてはセレン亜鉛(ZnSe)、サファイアおよび赤外線用ガラスなどが用いられる。図示の場合にはスタンパー5全体を赤外線透過材料から形成するが、その賦形面部分を赤外線透過材料以外の材料で形成してもよい。賦形面51は例えばCD−ROM基材加工用スタンパーなら、そのピット対応凸部を具えた面である。
【0021】
さらに図4に示すように、賦形面51と転写面11とが密着状態になるようにスタンパー5と基材1とを保持する。この状態で基材1を指向する方向にスタンパー5に対して赤外線を照射する。
【0022】
赤外線の光源としては例えば炭酸ガスレーザー、YAGレーザーなどが用いられるが、赤外線ランプなどを用いることもできる。照射する赤外線の周波数は照射対象であるプラスチック材料を構成する高分子が吸収し得る範囲において、実施条件に合わせて適宜選択する。
【0023】
【発明の効果】
特に精密な賦形面付近においてプラスチック材料の粘性が低下するので、賦形面の複雑かつ精密な形状であっても転写性が向上し、成形品の形状精度が大幅に向上する。また賦形面付近においてプラスチック材料の粘性が低下するので、粘性の異なる層が形成されずに高分子の配向が緩和され、物理的特性が均一となる。
【0024】
高温にしないので冷却も必要なく、したがって生産性が阻害されない。
【0025】
工程的に基材の製造と、赤外線照射成形との2段階に分離できる。加えて圧力を掛けないので装置が大型化しないから、流通末端にも装置を具えることができる。したがってスタンパーさえ種々のものを用意しておけば、流通の末端(例えば成形品の販売店)において自由に応需製造することができる。
【図面の簡単な説明】
【図1】この発明の加工方法の一実施例における第1ステップを示す側面図である。
【図2】この発明の加工方法の一実施例における第2ステップを示す側面図である。
【図3】この発明の加工方法の一実施例における第3ステップを示す側面図である。
【図4】この発明の加工方法の一実施例における第4ステップを示す側面図である。
【符号の説明】
1 プラスチック材料基材
11 転写面
3 支持枠
5 スタンパー
51 賦形面[0001]
[Industrial application fields]
The present invention relates to a plastic molding method, and more particularly, to an improvement in manufacturing technology of a molded product made of a plastic material such as a precision instrument part, a storage medium for an electronic instrument, and a lens for an optical instrument.
[0002]
In this specification, the “transfer surface” refers to a surface portion on a base material to be subjected to a desired molding process, and for example, pits of the base material used for manufacturing a CD-ROM which is a storage medium for electronic equipment are formed. It says the surface that should be done.
[0003]
In this specification, the “shaped surface” refers to a surface portion on a stamper to be subjected to a desired molding process, for example, a surface having a pit-corresponding convex portion of a CD-ROM base material processing stamper. .
[0004]
[Prior art]
In plastic molding, a plastic material is melt-plasticized, filled in a mold cavity (with a stamper in advance) at a high temperature by an injection molding machine at high speed and high pressure, and then cooled and solidified. A shaped molded product is obtained. This technology is widely used in the industry because of its higher productivity than press molding.
[0005]
However, in this injection molding, the plastic material is a viscoelastic material, the flow and cooling of the plastic material occur in parallel, and the plastic material has a low thermal conductivity, resulting in uneven cooling. For this reason, stress and strain remain inevitable in the molded product. As a result, external structural defects such as warp and sink are likely to occur in the molded product.
[0006]
Other external structural inconveniences include short shots (insufficient injection) and weld lines (insufficient fusion) due to the above-mentioned defects.
[0007]
Also, in the vicinity of the mold wall on the side opposite to the injection port in the cavity, the viscosity of the high-temperature plastic material suddenly comes into contact with the low-temperature mold wall, so that the viscosity increases and the transferability (followability to the mold shape) decreases. Therefore, when the molded product is, for example, a storage medium for electronic devices having a portion where a large number of thin grooves and protrusions are arranged side by side, there is also a problem that the desired groove and protrusion structures cannot be obtained accurately.
[0008]
Further, in the vicinity of the mold wall, due to the same high and low temperature contact, layers having different viscosities are generated in the plastic material, so that a shearing force is generated, and the polymer of the plastic material is highly oriented (orientation) layer. As a result, birefringence and a local change in refractive index occur, resulting in uneven optical characteristics. For this reason, when the molded product is used for a lens for an optical device or the like, there is an internal structural problem.
[0009]
To avoid the external and internal structural inconveniences inherent to injection molding, such solutions as lowering the cooling rate, increasing the plastic material temperature, and increasing the injection pressure by increasing the molding pressure A measure is conceivable.
[0010]
[Problems to be solved by the invention]
Specific methods for reducing the cooling rate include methods such as slow cooling of the plastic material and raising the temperature of the molding die. However, according to these methods, there is a basic problem that high productivity, which is the greatest merit of the injection molding technology that can produce a large number of molded articles in a short time compared to press working, is impaired.
[0011]
Further, according to the research results of the present inventors, it has been clarified that the method of increasing the temperature of the plastic material can hardly be expected to have a substantial effect.
[0012]
Furthermore, it has been clarified that even if the molding pressure is increased, according to the research results of the present inventors, a substantial effect cannot be expected.
[0013]
A further basic problem is that in the case of injection molding, the pressure is very high (sometimes up to several tons) and the equipment must be enlarged to withstand it. For this reason, it is difficult to produce customized products at the end of distribution of molded products that do not normally have such a large-sized device, for example, at CD stores.
[0014]
In view of the current state of the prior art, the basic object of the present invention is to maintain high productivity such as injection molding, improve the transferability of plastic materials, and at the same time have uniform physical characteristics (for example, optical properties). It is to provide a molded article having characteristics.
[0015]
Another object of the present invention is to reduce the size of the apparatus so that it can be manufactured on demand at the end of distribution of the molded product.
[0016]
[Means for Solving the Problems]
For this reason, in this invention, a base material made of a plastic material having a transfer surface is prepared, the base material is fixed in a state where the transfer surface is exposed, and the shaping surface of the stamper at least partly made of an infrared transmitting material Is kept in close contact with the transfer surface of the substrate, and the gist is to irradiate infrared rays in the direction of the substrate toward the stamper.
[0017]
[Action]
As a result of absorbing energy by infrared irradiation, the plastic material in the vicinity of the transfer surface is heated and its viscosity is lowered. On the other hand, the stamper does not absorb energy because it is transparent to infrared rays, and does not raise the temperature at all.
[0018]
【Example】
1 to 4 show an embodiment of the molding method of the present invention. First, as shown in FIG. 1, a substrate 1 made of a plastic material and provided with a
[0019]
Next, as shown in FIG. 2, the substrate 1 is fixed to the
[0020]
Next, as shown in FIG. 3, a
[0021]
Further, as shown in FIG. 4, the
[0022]
As the infrared light source, for example, a carbon dioxide gas laser or a YAG laser is used, but an infrared lamp or the like can also be used. The frequency of the infrared rays to be irradiated is appropriately selected according to the implementation conditions within a range that can be absorbed by the polymer constituting the plastic material to be irradiated.
[0023]
【The invention's effect】
In particular, since the viscosity of the plastic material is reduced in the vicinity of a precise shaping surface, the transferability is improved even with a complicated and precise shape of the shaping surface, and the shape accuracy of the molded product is greatly improved. Further, since the viscosity of the plastic material is reduced in the vicinity of the shaping surface, the orientation of the polymer is relaxed without forming layers having different viscosities, and the physical characteristics become uniform.
[0024]
Since the temperature is not increased, cooling is not required, and thus productivity is not hindered.
[0025]
The process can be separated into two stages, that is, production of the substrate and infrared irradiation molding. In addition, since no apparatus is enlarged because no pressure is applied, the apparatus can be provided at the end of the flow. Therefore, if various types of stampers are prepared, they can be produced on demand at the end of distribution (for example, a store of molded products).
[Brief description of the drawings]
FIG. 1 is a side view showing a first step in an embodiment of a processing method of the present invention.
FIG. 2 is a side view showing a second step in an embodiment of the processing method of the present invention.
FIG. 3 is a side view showing a third step in one embodiment of the processing method of the present invention.
FIG. 4 is a side view showing a fourth step in one embodiment of the processing method of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Plastic
Claims (1)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34331699A JP4363727B2 (en) | 1999-12-02 | 1999-12-02 | Plastic molding method |
PCT/JP2000/008216 WO2001039960A1 (en) | 1999-12-02 | 2000-11-21 | Plastic molding and stamper used therefor |
AU14191/01A AU1419101A (en) | 1999-12-02 | 2000-11-21 | Plastic molding and stamper used therefor |
KR1020027006999A KR100719399B1 (en) | 1999-12-02 | 2000-11-21 | Plastic Molding Method |
CN00816468A CN1402666A (en) | 1999-12-02 | 2000-11-21 | Plastic molding and stamper used therefor |
DE10085261T DE10085261B4 (en) | 1999-12-02 | 2000-11-21 | Plastic molds and a stamp used for this purpose |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34331699A JP4363727B2 (en) | 1999-12-02 | 1999-12-02 | Plastic molding method |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001158044A JP2001158044A (en) | 2001-06-12 |
JP4363727B2 true JP4363727B2 (en) | 2009-11-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP34331699A Expired - Fee Related JP4363727B2 (en) | 1999-12-02 | 1999-12-02 | Plastic molding method |
Country Status (1)
Country | Link |
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JP (1) | JP4363727B2 (en) |
Cited By (1)
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WO2013008410A1 (en) | 2011-07-08 | 2013-01-17 | 東洋製罐株式会社 | Method for molding thermoplastic resin product and molding apparatus therefor |
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ATE261350T1 (en) * | 2002-01-25 | 2004-03-15 | Leister Process Tech | METHOD FOR MOLDING MICRO- AND NANOSTRUCTURES |
US7143496B2 (en) * | 2003-05-08 | 2006-12-05 | Mold-Masters Limited | Hot runner nozzle with removable tip and tip retainer |
JP4862885B2 (en) * | 2003-09-17 | 2012-01-25 | 大日本印刷株式会社 | Method for forming fine uneven pattern |
US7245406B2 (en) | 2003-09-17 | 2007-07-17 | Dai Nippon Printing Co., Ltd. | Method for forming fine concavo-convex patterns, method for producing optical diffraction structure, and method for copying optical diffraction structure |
WO2005097470A1 (en) * | 2004-03-30 | 2005-10-20 | Pioneer Corporation | Pattern transfer device and pattern transfer method |
JP2007157962A (en) * | 2005-12-05 | 2007-06-21 | Sumitomo Electric Ind Ltd | Die forming tool |
JP2008188953A (en) * | 2007-02-07 | 2008-08-21 | Univ Of Electro-Communications | Manufacturing method of plastic-made stamper, plastic-made stamper and manufacturing method of plastic-made substrate |
JP5416420B2 (en) * | 2009-01-22 | 2014-02-12 | 株式会社日立ハイテクノロジーズ | Microstructure transfer device |
JP5906037B2 (en) | 2010-09-09 | 2016-04-20 | キヤノン株式会社 | Manufacturing method of optical components |
CN104245279B (en) | 2012-03-22 | 2016-11-16 | 东洋制罐集团控股株式会社 | The manufacturing process of thermoplastic articles and forming device thereof |
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1999
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Cited By (2)
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WO2013008410A1 (en) | 2011-07-08 | 2013-01-17 | 東洋製罐株式会社 | Method for molding thermoplastic resin product and molding apparatus therefor |
US9211672B2 (en) | 2011-07-08 | 2015-12-15 | Toyo Seikan Group Holdings, Ltd. | Method for molding thermoplastic resin product and molding apparatus therefor |
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